CN112046931A - Temperature and humidity control method and device, storage medium and maintenance storage device - Google Patents

Abstract

The application relates to a temperature and humidity control method, a temperature and humidity control device and a storage medium, which are applied to a maintenance storage device comprising a maintenance box. The temperature and humidity control method comprises the following steps: acquiring the relative humidity and the temperature in the curing box; when the relative humidity and the temperature in the curing box do not accord with the preset range, controlling a temperature adjusting mechanism to adjust the temperature in the curing box to reach the preset temperature range; the temperature adjusting mechanism is arranged on the side wall of the curing box; when the temperature in the curing box reaches the preset temperature range, controlling a humidity adjusting mechanism to adjust the relative humidity in the curing box to a preset humidity range; the humidity adjusting mechanism is arranged on the inner wall of the curing box. The temperature and humidity control method can improve the storage and maintenance effects of the maintenance and storage device for storing the cigars on the cigars.

Description

Temperature and humidity control method and device, storage medium and maintenance storage device

Technical Field

The present disclosure relates to storage devices, and particularly to a temperature and humidity control method and device for a storage device, a storage medium, and a storage device.

Background

Along with the improvement of living standard of people, the number of people who take tobacco products is more and more. Examples of tobacco products are cigars, cigarettes and the like, and cigars are used as examples herein. Generally, after the cigar is produced, the cigar needs to be maintained and cured for a period of time under the environment with proper temperature (16-20 ℃) and proper relative humidity (60-70%), and the cigar has mellow taste and is suitable for being smoked by people. And thus the demand for devices for storing cigars is increasing.

Although the traditional cigar maintenance and storage device comprises the storage cabinet and the temperature and humidity adjusting mechanism arranged in the storage cabinet, the temperature and the humidity in the storage cabinet can be adjusted, because the two parameters of the temperature and the humidity in the storage cabinet are correlated, the traditional cigar maintenance and storage device cannot finely control the temperature and the humidity in the storage cabinet, and the traditional cigar maintenance and storage device has poor effect on the storage and the maintenance of cigars.

Disclosure of Invention

In view of the above, it is desirable to provide a temperature and humidity control method and device, a storage medium, and a curing and storing device that can improve the effect of storing and curing cigars by the cigar curing and storing device.

A temperature and humidity control method is applied to a maintenance storage device comprising a maintenance box, and comprises the following steps:

acquiring the relative humidity and the temperature in the curing box;

when the relative humidity and the temperature in the curing box do not accord with the preset range, controlling a temperature adjusting mechanism to adjust the temperature in the curing box to reach the preset temperature range; the temperature adjusting mechanism is arranged on the side wall of the curing box;

when the temperature in the curing box reaches the preset temperature range, controlling a humidity adjusting mechanism to adjust the relative humidity in the curing box to a preset humidity range; the humidity adjusting mechanism is arranged on the inner wall of the curing box.

The utility model provides a temperature and humidity control device, is applied to the maintenance storage device including the maintenance case, includes:

the acquisition module is used for acquiring the relative humidity and the temperature in the curing box;

the temperature control module is used for controlling the temperature adjusting mechanism to adjust the temperature in the curing box to reach a preset temperature range when the relative humidity and the temperature in the curing box do not accord with the preset range; the temperature adjusting mechanism is arranged on the side wall of the curing box;

the humidity control module is used for controlling the humidity adjusting mechanism to adjust the relative humidity in the curing box to a preset humidity range after the temperature in the curing box reaches the preset temperature range; the humidity adjusting mechanism is arranged on the inner wall of the curing box.

A maintenance storage device, the maintenance storage device comprising:

a curing box;

the temperature adjusting mechanism is arranged on the side wall of the curing box and is used for adjusting the temperature in the curing box;

the humidity adjusting mechanism is arranged on the inner wall of the curing box and is used for adjusting the relative humidity in the curing box;

the controller is electrically connected with the temperature adjusting mechanism and the humidity adjusting mechanism and comprises a memory and a processor, wherein the memory stores a computer program, and the processor realizes the steps of the method when executing the computer program.

A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the steps of the above-mentioned method.

According to the temperature and humidity control method, the temperature and humidity control device and the storage medium, when the relative humidity and the temperature in the curing box are detected not to accord with the preset range, the temperature adjusting mechanism arranged on the side wall of the curing box is controlled to adjust the temperature in the curing box to reach the preset temperature range, and then the humidity adjusting mechanism is controlled to adjust the relative humidity in the curing box to the preset humidity range, so that the mutual correlation between the temperature and the relative humidity is considered in the process of controlling the relative humidity and the temperature in the curing box, namely the temperature adjustment can influence the humidity change preferentially, therefore, the temperature adjustment and humidity control are completed firstly, the temperature adjustment is completed, the temperature in the curing box is controlled in the required temperature range and then the humidity control is completed, and the humidity adjustment adopts a non-refrigeration physical or chemical mode, so that the humidity adjustment does not influence or has the minimum influence on the temperature in the curing box, the realization is to the humiture in the curing box carry out meticulous control, has improved the maintenance effect of the maintenance storage device that is used for depositing the cigar to the storage of cigar.

A maintenance storage device, the maintenance storage device comprising: a curing box; the temperature adjusting mechanism is arranged on the side wall of the curing box and comprises a semiconductor refrigeration piece, a first radiating piece, a second radiating piece, a first radiating fan and a second radiating fan, one end face of the semiconductor refrigeration piece is connected with the first radiating piece, the other end face of the semiconductor refrigeration piece is connected with the second radiating piece, the first radiating fan and the first radiating piece are located on the outer wall of the curing box, the first radiating fan is used for blowing wind to the first radiating piece, the second radiating piece and the second radiating fan are located on the inner wall of the curing box, and the second radiating fan is used for blowing wind to the second radiating piece; and the humidity adjusting mechanism is arranged on the inner wall of the curing box and used for adjusting the relative humidity in the curing box.

Foretell maintenance storage device, temperature regulation mechanism can adjust the temperature in the curing box, and humidity control mechanism can adjust the humidity in the curing box to can realize that the environment in the curing box is in the state of constant temperature and humidity, guarantee better maintenance effect. In addition, the temperature adjusting mechanism and the humidity adjusting mechanism are arranged on the side wall of the curing box, so that the position arrangement is reasonable, the occupied space size is small, and the size reduction of the curing and storing device can be facilitated; in addition, the temperature adjusting mechanism adopts the semiconductor refrigerating element, on one hand, the semiconductor refrigerating element can realize refrigeration, the cold energy is transmitted to the second radiating element, the cold energy on the second radiating element is brought into the curing box by the second radiating fan to reduce the temperature of the curing box, after the polarity of the semiconductor refrigerating element is switched, the semiconductor refrigerating element can realize heating, the heat is transmitted to the second radiating element, and the heat on the second radiating element is brought into the curing box by the second radiating fan to improve the temperature of the curing box; on the other hand, the semiconductor refrigerating piece is small in size, the size of the temperature adjusting mechanism is reduced to a certain extent, and therefore the size of the maintenance storage device can be reduced, and the semiconductor refrigerating piece is convenient to carry.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention.

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic view showing the construction of a maintenance storage device according to an embodiment;

fig. 2 is a schematic structural view of the maintenance storage device according to an embodiment when the cover is opened;

FIG. 3 is an exploded view of a maintenance storage device according to an embodiment;

FIG. 4 is a view showing a configuration of one of the view points of the curing box of the curing storage device after being hidden in one embodiment;

FIG. 5 is a view showing another perspective of the maintenance box of the maintenance storage device in one embodiment after it is hidden;

FIG. 6 is a view showing a maintenance box of the maintenance storage device in a hidden state in one embodiment;

FIG. 7 is a schematic structural view of a temperature adjusting mechanism of the curing storing device in one embodiment;

FIG. 8 is a schematic structural diagram illustrating the temperature adjustment mechanism of one embodiment with the first and second fans removed;

FIG. 9 is an exploded view of the temperature adjustment mechanism of one embodiment with the first and second fans removed;

FIG. 10 is a schematic view of the humidifying adjustment assembly and humidifying system cover of the maintenance storage device according to one embodiment;

fig. 11 is a schematic structural view illustrating a humidifying adjustment assembly of a maintenance storage device according to an embodiment mounted on a humidifying system cover;

FIG. 12 is a schematic view of an embodiment of the dehumidifying regulation module and the dehumidifying system casing of the curing storage device;

FIG. 13 is a schematic view of a dehumidifying regulation unit of a curing storage device installed in a dehumidifying system cover according to an embodiment;

FIG. 14 is a schematic view of another perspective view of the dehumidifying regulation module of the curing storage device installed in the dehumidifying system cover according to an embodiment;

fig. 15 is a schematic structural view of a cigar rack in the maintenance storage device according to an embodiment;

fig. 16 is a sectional view of a maintenance storage device according to an embodiment;

fig. 17 is a sectional view of a maintenance storage device according to an embodiment;

fig. 18 is a schematic flow chart of a temperature and humidity control method in an embodiment;

FIG. 19 is a view showing an example of U in the first control mode when the maintenance storage device needs to be raised in temperature_TECGraph with time t;

FIG. 20 is a graph of T versus time T for a first control mode when the maintenance reservoir requires an elevated temperature according to one embodiment;

FIG. 21 shows an example of a maintenance storage device in a second control mode when the temperature of the maintenance storage device needs to be raised_TECGraph with time t;

FIG. 22 is a graph showing T vs. time T for a second control mode when the maintenance storage device needs to be raised in temperature according to one embodiment;

FIG. 23 shows a U-shape of a maintenance storage device in an embodiment when the temperature of the maintenance storage device needs to be lowered_TECControl plot against T;

fig. 24 is a schematic flow chart of a temperature and humidity control method in another embodiment;

fig. 25 is a block diagram of a temperature and humidity control apparatus according to an embodiment;

FIG. 26 is a block diagram of a temperature adjustment process in one embodiment;

FIG. 27 is a diagram showing an internal structure of a computer device in one embodiment.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Spatial relational terms, such as "under," "below," "under," "over," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "under" can encompass both an orientation of above and below. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. Further, "connection" in the following embodiments is understood to mean "electrical connection", "communication connection", or the like, if there is a transfer of electrical signals or data between the connected objects.

As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Because the relative humidity in the curing box is smaller in the adjusting process, the smaller the diameter of the atomized water molecular group is, the more balanced the relative humidity of the environment at each part in the curing box is adjusted, and the curing box inner cavity environment with uniformly distributed humidity is more beneficial to the cigar storage and curing process.

Based on this, referring to fig. 1 and fig. 2, fig. 1 shows a schematic structural diagram of a maintenance storage device in an embodiment of the present invention, and fig. 2 shows a schematic structural diagram of the maintenance storage device in an embodiment of the present invention when a cover is opened. According to an embodiment of the present invention, the maintenance storage device includes amaintenance box 10, atemperature adjustment mechanism 20, and a humidity adjustment mechanism.

Referring to fig. 3 and 7 in combination, fig. 3 illustrates an exploded view of a maintenance storage device according to an embodiment of the present invention; fig. 7 is a schematic structural view showing a temperature adjusting mechanism in the maintenance storage device according to an embodiment of the present invention. Thetemperature adjustment mechanism 20 is provided on a side wall of thecuring box 10. Thetemperature adjustment mechanism 20 includes a semiconductor cooling element 21 (shown in fig. 9), a firstheat dissipation element 22, a secondheat dissipation element 23, a firstheat dissipation fan 24, and a secondheat dissipation fan 25. One end surface of thesemiconductor cooling element 21 is connected to the firstheat dissipation element 22, and the other end surface of thesemiconductor cooling element 21 is connected to the secondheat dissipation element 23. Thefirst radiator fan 24 and thefirst radiator member 22 are located on the outer wall of thecuring box 10. The firstheat dissipation fan 24 serves to blow wind toward the firstheat dissipation member 22. Thesecond heat sink 23 and the secondheat sink fan 25 are located on the inner wall of thecuring box 10, and the secondheat sink fan 25 is used for blowing wind to thesecond heat sink 23. The humidity adjusting mechanism is disposed on an inner wall of thecuring box 10, and the humidity adjusting mechanism is used for adjusting the relative humidity in thecuring box 10.

In the maintenance storage device, thetemperature adjusting mechanism 20 can adjust the temperature in themaintenance box 10, and the humidity adjusting mechanism can adjust the humidity in themaintenance box 10, so that the environment in themaintenance box 10 is in a constant temperature and humidity state, and a good maintenance effect is ensured. In addition, because the temperature adjusting mechanism 20 and the humidity adjusting mechanism are both arranged on the side wall of the curing box 10, the positions are reasonably arranged, the occupied space size is small, and the size reduction of the curing and storing device can be facilitated; in addition, because the temperature adjusting mechanism 20 adopts the semiconductor refrigerating element 21, on one hand, the semiconductor refrigerating element 21 can realize refrigeration, the cold energy is transferred to the second heat radiating element 23, the cold energy on the second heat radiating element 23 is brought into the curing box 10 by the second heat radiating fan 25 to reduce the temperature of the curing box 10, after the semiconductor refrigerating element 21 switches and inputs positive and negative polarities, the semiconductor refrigerating element 21 can realize heating, the heat is transferred to the second heat radiating element 23, and the heat on the second heat radiating element 23 is brought into the curing box 10 by the second heat radiating fan 25 to improve the temperature of the curing box 10; on the other hand, the semiconductor refrigerating element 21 is small in size, so that the size of the temperature adjusting mechanism 20 is reduced to a certain extent, and the size of the maintenance storage device can be reduced, and the maintenance storage device is convenient to carry.

It should be noted that, by using the Peltier effect of the semiconductor refrigeration material, direct current is applied to the TEC (thermal Electric Cooler, semiconductor refrigeration element 21), so that the refrigeration function of thebox body 11 can be realized. By changing the polarity of the TEC input voltage, that is, changing the current direction of the TEC, the heating function of thecase 11 can be realized without changing the structure.

Certainly, in another embodiment, the switching between the cooling function and the heating function of thetemperature adjustment mechanism 20 is not implemented by switching the polarity of the TEC input voltage, but thetemperature adjustment mechanism 20 may also be implemented by a composite structure of TEC cooling and PTC (PTC is a positive temperature coefficient thermistor, and its material property should belong to a semiconductor) heating, that is, the PTC is connected to a cold-end cooler of the TEC, and only the TEC is powered on during cooling, the PTC is powered off, and the PTC is powered on during heating, and the TEC is powered off.

Referring to fig. 1 to 3, the maintenance storage device further includes a first sensor 30 (shown in fig. 13), acontroller 41 and adisplay 42. Thefirst sensor 30 is used for acquiring temperature and humidity information in thecuring box 10, and thefirst sensor 30 is electrically connected with thecontroller 41. Thecontroller 41 is electrically connected to thedisplay 42, and thedisplay 42 is used for displaying temperature and humidity information in thecuring box 10. Thecontroller 41 is also electrically connected to thetemperature adjustment mechanism 20 and the humidity adjustment mechanism. On one hand, the temperature and humidity information in thecuring box 10 is timely displayed through thedisplay 42, so that the environmental information in thecuring box 10 can be conveniently mastered; on the other hand, if the temperature and humidity in thecuring box 10 do not meet the requirements, thecontroller 41 controls thetemperature adjustment mechanism 20 and the humidity adjustment mechanism to adjust in time so that the temperature and humidity in thecuring box 10 meet the requirements.

Referring to fig. 1 and 2, in one embodiment, thecuring box 10 includes abox body 11 and acover 12 rotatably opened on thebox body 11. Thebox 11 includes abottom plate 111 and afirst side plate 112 connected to thebottom plate 111.

Referring to fig. 2 and fig. 3, specifically, a supportingplate 113 is connected to a side of thefirst side plate 112 away from thebottom plate 111. One side of thecover 12 is rotatably connected to the supportingplate 113, and one side of thecover 12 is provided with anotch 121 corresponding to thedisplay 42. Thedisplay 42 is disposed on the supportingplate 113, and when thecover 12 covers thebox 11, thedisplay 42 is located at thegap 121. In this way, regardless of whether thelid 12 is in the state of being pivoted open or pivoted closed on thebox 11, the temperature/humidity information in thecuring box 10 can be observed and grasped by thedisplay 42. In particular, the shape of theindentation 121 is adapted to the shape of thedisplay 42. In addition, thedisplay 42 is not only used for displaying temperature and humidity information, but also provided with keys through which the temperature and humidity information can be set. Optionally, thedisplay 42 is a touch display screen.

Alternatively, a hinge is used between thecover 12 and thehousing 11.Lid 12 andbox 11 adopt damping hinged joint for example specifically to can realizelid 12's closure and multi-angle and open convenient to use.

Referring to fig. 3 and 7, further, thetemperature adjustment mechanism 20 is disposed on thefirst side plate 112. Thus, thefirst radiator fan 24 and thefirst radiator fan 22 are located on the outer wall of thefirst side plate 112, thesecond radiator fan 23 and thesecond radiator fan 25 are located on the inner wall of thefirst side plate 112, and thesupport plate 113 connected to thefirst side plate 112 can be designed to be wide enough to some extent, so that the support plate can be used for mounting thedisplay 42 on one hand, and on the other hand, the support plate is equivalent to a protection device on the top surfaces of thefirst radiator fan 24 and thefirst radiator fan 22, so that the size of the whole maintenance storage device is small.

Referring to fig. 3 and 7, further, the maintenance storage device further includes a firstprotective cover 60. The firstprotective cover 60 is disposed outside thecuring box 10 and covers thefirst side plate 112, the firstheat dissipation fan 24 and the firstheat dissipation member 22 are disposed in the firstprotective cover 60, and the firstprotective cover 60 is provided with afirst ventilation opening 61. Specifically, the number of thefirst ventilation openings 61 on thefirst protection cover 60 is at least two, wherein onefirst ventilation opening 61 is used for air inlet, and the otherfirst ventilation opening 61 is used for air outlet. Thus, the firstprotective cover 60 can prevent the firstheat dissipation fan 24 and the firstheat dissipation member 22 from being exposed, and protect the firstheat dissipation fan 24 and the firstheat dissipation member 22; in addition, when the firstheat dissipation fan 24 operates, the firstheat dissipation fan 24 sucks the airflow outside thefirst protection cover 60 into thefirst protection cover 60 through one of thefirst ventilation openings 61, and discharges the airflow through the otherfirst ventilation opening 61 on thefirst protection cover 60 after dissipating heat or cooling the firstheat dissipation member 22.

Referring to fig. 4 to 7, fig. 4 to 6 respectively illustrate different view structure diagrams of the curing storage device with the curing box hidden according to an embodiment. Likewise, the maintenance storage device also includes a secondprotective cover 70. The secondprotective cover 70 is disposed inside thecuring box 10 and covers thefirst side plate 112, the secondheat dissipation fan 25 and the secondheat dissipation member 23 are disposed inside the secondprotective cover 70, and the secondprotective cover 70 is provided with asecond ventilation opening 71. Specifically, the number of thesecond ventilation openings 71 on thesecond protection cover 70 is at least two, wherein one second ventilation opening 71 is used for air intake, and the other second ventilation opening 71 is used for air outtake. Thus, the secondprotective cover 70 can prevent thesecond cooling fan 25 and thesecond cooling element 23 from being exposed, and protect thesecond cooling fan 25 and thesecond cooling element 23; in addition, when the secondheat dissipation fan 25 operates, the secondheat dissipation fan 25 sucks the air flow outside thesecond protection cover 70 into thesecond protection cover 70 through one of thesecond ventilation openings 71, dissipates heat or cool the secondheat dissipation member 23, and then discharges the air flow through the other second ventilation opening 71 of thesecond protection cover 70.

Specifically, thefirst radiator fan 24 and thefirst radiator element 22 are located on the outer wall of thecuring box 10, which means that thefirst radiator fan 24 and thefirst radiator element 22 are located on a side of thefirst side plate 112 facing the firstprotective cover 60.

Referring to fig. 3, 8 and 9, fig. 8 is a schematic structural diagram illustrating atemperature adjustment mechanism 20 according to an embodiment after removing afirst cooling fan 24 and asecond cooling fan 25; fig. 9 is an exploded view illustrating the temperature adjustment mechanism according to an embodiment after the first cooling fan and the second cooling fan are removed. Further, the curing and storing device further comprises a cold conductingmember 26 and an insulatingsleeve 27. Thefirst side plate 112 is provided with a throughhole 114, theheat insulating sleeve 27 is disposed at the throughhole 114, the coolingguide 26 is disposed in theheat insulating sleeve 27, and thecooling guide 26 is disposed between thesemiconductor cooler 21 and thesecond heat sink 23. In this way, thecold conducting element 26 and the insulatingsleeve 27 can facilitate the heat or cold transfer from thesemiconductor cooling element 21 to the secondheat dissipating element 23, while avoiding the heat or cold transfer to the side walls of thebox 11.

Referring to fig. 8 and 9, in addition, theheat insulation sleeve 27 is mainly used for heat insulation between the cold and hot parts of thetemperature adjustment mechanism 20 to reduce heat loss. In order to reduce the thickness of the body of thetemperature adjustment mechanism 20, thefirst cooling fan 24 and thesecond cooling fan 25 are preferably selected from a centrifugal fan enhanced heat exchange manner, and an axial fan enhanced heat exchange manner may also be adopted.

Referring to fig. 8 and 9, in particular, theheat insulation sleeve 27 includes aframe sleeve 271 covering thecooling guide 26, and aheat insulation sleeve 272 covering theframe sleeve 271. Theframe sleeve 271 is not limited to a plastic sleeve, a rubber sleeve, a wooden sleeve, or an iron sleeve. The specific example of theheat insulating cover 272 is protective cotton, and is not limited as long as it can perform a heat insulating function.

Referring to fig. 3 and 7 again, in one embodiment, the firstheat dissipation element 22 is an aluminum heat dissipation element or a copper heat dissipation element. Thesecond heat sink 23 is an aluminum heat sink or a copper heat sink. Thecontroller 41 includes a control circuit board disposed on thefirst side plate 112 and located at the air outlet side of the firstheat dissipation fan 24. In this way, the firstheat dissipation fan 24 not only dissipates heat from the firstheat dissipation member 22, but also dissipates heat from the control circuit board to take away heat generated on the control circuit board. In addition, the firstheat dissipation element 22 and the secondheat dissipation element 23 are aluminum heat dissipation elements or copper heat dissipation elements, which can conduct heat rapidly and perform good heat dissipation or cold dissipation. Specifically, the firstheat dissipation element 22 and the control circuit board are sequentially disposed on the air outlet path of the firstheat dissipation fan 24, that is, the air blown by the firstheat dissipation fan 24 sequentially passes through the firstheat dissipation element 22 and the control circuit board and is then discharged to the outside, so as to sequentially dissipate heat from the firstheat dissipation element 22 and the control circuit board. In addition, the maintenance storage device includes apower source 28. Apower supply 28 is provided within thefirst shield 60, thepower supply 28 providing power to all of the electrical components within the servicing storage device.

Referring to fig. 2 and 3, in one embodiment, thebox 11 further includes asecond side plate 115, athird side plate 116 and afourth side plate 117 connected to thebottom plate 111. Thefirst side plate 112 is disposed opposite to thefourth side plate 117, and thesecond side plate 115 is disposed opposite to thethird side plate 116. Thefirst side plate 112 is connected to thesecond side plate 115 and thethird side plate 116 at two ends thereof, and thefourth side plate 117 is connected to thesecond side plate 115 and thethird side plate 116 at two ends thereof. That is, thecase 11 has a rectangular parallelepiped shape or a square shape. Of course, thecase 11 may have other shapes, and is not limited thereto.

Referring to fig. 2 and fig. 3, the humidity adjusting mechanism further includes ahumidification adjusting element 80 and adehumidification adjusting element 90. It should be noted that thehumidification adjusting element 80 and thedehumidification adjusting element 90 may be provided independently or integrated into a whole. The following description will be made in detail by taking the mutually independent arrangement structure as an example. Further, thehumidification adjusting assembly 80 is disposed on thesecond side plate 115, and thedehumidification adjusting assembly 90 is disposed on thethird side plate 116. In this way, since thehumidification control unit 80 and thedehumidification control unit 90 are provided on thesecond side plate 115 and thethird side plate 116, the mutual influence therebetween can be reduced, and the overall size of the maintenance storage device can be reduced.

Referring to fig. 2, 10 and 11, fig. 10 is a schematic structural view illustrating a humidifying adjusting assembly and a humidifying system cover of a maintenance storage device according to an embodiment; fig. 11 is a schematic structural view illustrating a humidifying adjustment assembly of a maintenance storage device according to an embodiment, which is mounted on a humidifying system cover. In one embodiment,humidification adjustment assembly 80 includes anatomizing humidification assembly 81, anevaporation assembly 82, and ahumidification fan 83. Theatomizing humidification module 81 is provided with a humidified gas flow output. Theevaporation assembly 82 includes anevaporation housing 821 and a water molecule attachment disposed in theevaporation housing 821, theevaporation housing 821 is provided with twofirst air inlets 822 and a first air outlet (not shown), and one of thefirst air inlets 822 is communicated with the humidified air output end. An air outlet of the humidifyingfan 83 is abutted against anotherfirst air inlet 822, and the humidifyingfan 83 is used for discharging the evaporation air flow in theevaporation housing 821 into thecuring box 10 through the first air outlet.

When it is determined that the relative humidity in thecuring box 10 is low (specifically, for example, lower than 60%) and humidification is required, the atomizing and humidifyingassembly 81 is turned on, the atomizing and humidifyingassembly 81 sends the humidified atomized water molecule airflow into theevaporation housing 821 through the humidified airflow output end, and attaches the atomized water molecules to the water molecule attachment, which is used for absorbing the atomized water molecules and blocking the atomized water molecules from directly entering the inner cavity of thecuring box 10. After theatomization humidification component 81 stops working, thehumidification fan 83 is started again, air flow generated by thehumidification fan 83 is used for carrying out secondary evaporation on water molecules adsorbed on the water molecule attachment body, and the air flow generated by thehumidification fan 83 flows into the box, so that the humidity in the box is improved. In addition, the diameter of molecular clusters in the air flow is effectively reduced while the humidity of the air flow in thecuring box 10 is improved, the diameter of the molecular clusters in the air in thecuring box 10 is smaller, and the molecular clusters are easy to uniformly diffuse into thecuring box 10, so that the humidity in thecuring box 10 is more balanced, and the curing effect can be improved.

Referring to fig. 10 and 11, the atomizing and humidifyingassembly 81 further includes awater box 811, a humidifier and anozzle 813. The humidifier comprises a humidifyingmachine shell 812 communicated with awater box 811, and an atomizing sheet arranged in thehumidifying machine shell 812.Humidification housing 812 is coupled toshowerhead 813. Thenozzle 813 is in communication with afirst air inlet 822. Specifically, the humidifier is an ultrasonic humidifier, and the ultrasonic humidifier further includes an ultrasonic generator, and the ultrasonic generator is, for example, integrally provided in the controller, but may be separately provided. The atomizing plate generates high-frequency oscillation by using the ultrasonic generator, water guided into the atomizing plate from thewater box 811 is thrown away from the water surface in the high-frequency oscillation process of the atomizing plate to generate elegant water mist, and the water mist is sprayed into theevaporation shell 821 through thespray head 813.

In one embodiment, the water molecule attachment is a silver ion or a nanomaterial. The silver ion substance and the nano material body have better functions of adsorbing atomized water molecules and realizing secondary evaporation. In this embodiment, the water molecule attachment is silver ion, which not only can effectively adsorb atomized water molecules, but also has the function of sterilization.

Further, the water molecule attachment is silver ion particles or nanoparticles. Thus, when the silver ion particles or nanoparticles are installed in theevaporation shell 821, airflow gaps are formed between the particles, and after humidified airflow of atomized water molecules enters theevaporation shell 821, on one hand, the atomized water molecules can be favorably contacted with and adsorbed by the outer surfaces of the particles; on the other hand, although the water molecule attachment installed in theevaporation housing 821 has a certain blocking effect on the atomized water molecule airflow, the water molecule attachment can be discharged to the inside of thecuring box 10 through the first air outlet of theevaporation housing 821 by the humidifyingfan 83.

In one embodiment, theevaporation housing 821 is a silver ion cartridge or a nano-material cartridge. In this way, atomized water molecules are adsorbed not only by the water molecule attachment but also by the inner wall of theevaporation case 821 after entering theevaporation case 821. In this embodiment, theevaporation housing 821 is a silver ion cartridge.

Referring to fig. 2, 10 and 11, the humidity adjustment mechanism further includes asecond sensor 51 and a humidification system cover 52. The controller includes a reminder. The humidification system cover 52 has asecond air outlet 521 and asecond air inlet 522, thehumidification adjusting assembly 80 is disposed in the humidification system cover 52, and the air inlet of the humidification fan is disposed corresponding to thesecond air inlet 522. The first air outlet and thesecond air outlet 521 are correspondingly arranged, and the humidified gas is directly discharged outwards through thesecond air outlet 521 by the first air outlet. In one embodiment, theatomizing humidification module 81, theevaporation module 82 and thehumidification fan 83 are housed inside thehumidification system housing 52. Specifically, the silver ion cartridge of theevaporation assembly 82 is detachably mounted inside the humidification system cover 52, which facilitates the removal of the silver ion cartridge for replacement of silver ion particles. Of course, the silver ion box may be integrated with the humidification system cover 52, or may be separately designed and placed inside the humidification system cover 52, which is not limited herein.

Referring to fig. 2, 10 and 11, in addition, thewater box 811 may be designed independently, for example, fastened to the humidification system cover 52 by a snap-fit manner, or integrated with the humidification system cover 52 directly. In this embodiment,water box 811 can independent design, convenient dismantlement, removal and water injection. The upper portion ofwater box 811 is provided with the water filling port for add water forwater box 811, hasshutoff piece 814 on the water filling port, like the plug forwater box 811's sealed after the water injection is accomplished, satisfies the humidification mechanism who adds maintenance storage device and at portable removal in-process water seal requirement. In order to improve the water atomization effect and prolong the service life of the atomization sheet, the water in thewater box 811 is preferably purified water or distilled water.

Referring to fig. 2, 10 and 11, further, thesecond sensor 51 is disposed at thesecond air outlet 521, and thesecond sensor 51 is used for acquiring the relative humidity at thesecond air outlet 521. The prompter is used for performing a prompting action when the difference value of the relative humidity acquired by thesecond sensor 51 is smaller than a preset value. Further, the prompter is specifically an alarm or a display, and the alarm is used for performing an alarm action when the difference value of the relative humidity acquired by thesecond sensor 51 is smaller than a preset value. The display is used for displaying when the difference value of the relative humidity acquired by thesecond sensor 51 is smaller than a preset value.

Thesecond sensor 51 may be disposed at thesecond outlet 521, or may be disposed at a position adjacent to thesecond outlet 521, in order to obtain the relative humidity of the gas discharged from thesecond outlet 521.

Referring to fig. 12 to 14, fig. 12 is a schematic structural view illustrating a dehumidifying regulation assembly and a dehumidifying system cover of a maintenance storage device according to an embodiment; FIG. 13 is a schematic view of a dehumidifying regulation module of a curing and storing device installed in a dehumidifying system cover according to an embodiment; fig. 14 is a schematic view of another perspective view of the dehumidifying regulation module of the curing storage device installed in the dehumidifying system cover according to an embodiment. In one embodiment, thedehumidification regulation assembly 90 includes adehumidification box 91 and adehumidification fan 92. Thedehumidifying box 91 is provided with a dehumidifying object therein, thedehumidifying box 91 is provided with a third air inlet and a third air outlet, the air outlet of the dehumidifyingfan 92 is connected to the third air inlet, and the dehumidifyingfan 92 is used for drawing the air flow in the curing box 10 (as shown in fig. 2) into thedehumidifying box 91. Specifically, the dehumidifyingfan 92 is electrically connected to thecontroller 41.

Referring to fig. 12-14, in one embodiment, the humidity adjustment mechanism further includes a dehumidification system cover 53 and athird sensor 56. The dehumidification system cover 53 has afourth air inlet 531 and afourth air outlet 532. Thedehumidification regulation assembly 90 is disposed within thedehumidification system housing 53. Thethird sensor 56 is disposed at thefourth wind outlet 532 for obtaining the relative humidity at thefourth wind outlet 532. Specifically, the alarm is also used for performing an alarm action when the difference value of the relative humidity acquired by thethird sensor 56 is smaller than a preset value.

Thethird sensor 56 can sense the humidity of the air processed by thedehumidifying box 91, and is mainly used for determining whether the adsorption capacity of the dehumidified substances in thedehumidifying box 91 is invalid. One specific judgment method is as follows: judging the change of the two humidity sensing values in the preset time interval (for example, 60s), namely the difference value of the two humidity values, and when the change is smaller than a certain value (for example, 10%, the value depends on the precision of the humidity sensor), determining that the water absorption characteristic of the dehumidified substance in thedehumidification box 91 is invalid, controlling the action of an alarm by thecontroller 41, and alarming to replace the dehumidified substance in thedehumidification box 91. Alternatively, in order to facilitate replacement of the dehumidified contents in thedehumidifying box 91, thedehumidifying box 91 is detachably fixed to the dehumidifying system cover 53 using, for example, a snap-fit structure.

It should be noted that thethird sensor 56 may also be disposed at other positions, for example, at the side adjacent to thecirculation fan 54 as illustrated in fig. 14, and after thecirculation fan 54 sucks the dehumidified air into thedehumidification system cover 53, thethird sensor 56 senses the humidity of the air processed by thedehumidification box 91, so as to determine whether the adsorption capacity of the dehumidified object in thedehumidification box 91 is disabled.

Referring to fig. 2, 16 and 17, fig. 16 is a sectional view of one embodiment of a maintenance storage device at one position; fig. 17 shows a cross-sectional view of another position of the maintenance storage device according to an embodiment. In one embodiment, thecuring box 10 includes aninner wall panel 13, anouter wall panel 14, and aninsulation layer 15 disposed between theinner wall panel 13 and theouter wall panel 14. Thus, the heat preservation effect of thecuring box 10 is good.

In order to reduce the thickness between theinner wall plate 13 and theouter wall plate 14, increase the effective volume of the inner cavity and ensure the heat preservation performance, a VIP (Vacuum Insulation Panel) plate, a polyurethane foam plate or a composite structure plate of the VIP and polyurethane can be added to theheat preservation layer 15 to play a role in strengthening heat preservation and heat Insulation.

Further, the bottom of theinner wall plate 13, the bottom of the insulatinglayer 15, and the bottom of theouter wall plate 14 constitute abottom plate 111, and four side portions of theinner wall plate 13, four side portions of the insulatinglayer 15, and four side portions of theouter wall plate 14 are provided in one-to-one correspondence, and constitute afirst side plate 112, asecond side plate 115, athird side plate 116, and afourth side plate 117, respectively.

Referring to fig. 1 and 2, ahandle assembly 16 is further disposed on thecuring box 10, and thehandle assembly 16 is mainly used for lifting thecuring box 10 during the moving process. In addition, aswitch lock 17 for opening and closing and locking thebox body 11 and thecover body 12 is provided on thehandle assembly 16. In order to ensure privacy, theswitch lock 17 is specifically a coded lock, and the specificity of thecuring box 10 in use is ensured through code setting.

Referring to fig. 2, 4 and 15, fig. 15 is a schematic structural view illustrating a cigar rack in a maintenance storage device according to an embodiment. Further, in order to facilitate the fixation and storage of the cigars and to avoid the displacement of the cigars during the movement of thecuring box 10, acigar placement rack 18 is provided in thecuring box 10. In order to better maintain and alcoholize the cigars, thecigar placing rack 18 is preferably made of cedar wood. Thecigar holder 18 is fixed to the bottom of the inner cavity of thecuring box 10 by a fastener such as a tapping screw. In order to improve the space utilization rate, thecigar placing rack 18 can be divided into an upper layer and a lower layer, and the two layers of cigar placing racks 18 are connected by using supportingcolumns 19 with self-locking elastic buckle functions. Specifically, four corner portions of thecigar placement frame 18 are respectively provided with four spring buckle holes 181, foursupport columns 19 are provided, and two cigar placement frames 18 are detachably connected through the foursupport columns 19. In addition, a plurality ofinsertion holes 182 are formed in thecigar placement frame 18, and cigars are inserted into the insertion holes 182 and are taken out as required.

In one embodiment, thecigar holders 18 are at least two layers, and at least two layers ofcigar holders 18 are arranged one above the other from top to bottom.

When the space of the inner cavity of thecuring box 10 is large, the flow of the air flow on each inner wall and space is enhanced in order to ensure the uniformity of the temperature and humidity distribution inside thewhole curing box 10. In one embodiment, the maintenance storage device further includes acirculation fan 54. The circulatingfan 54 is disposed in thecuring box 10, and the circulatingfan 54 is electrically connected to thecontroller 41. In this way, thecontroller 41 controls thecirculation fan 54 to operate, so that the airflow in thecuring box 10 circularly flows to fill thewhole curing box 10, which is beneficial to realizing a relatively uniform relative humidity in thecuring box 10.

Specifically, thesecond sensor 51 and the alarm are both electrically connected to thecontroller 41, thecontroller 41 receives the relative humidity sensed by thesecond sensor 51 at thesecond air outlet 521, and if it is determined that the relative humidity change value at the preset time interval (for example, 60S) is smaller than a preset value (for example, 10%), it is prompted that thewater box 811 lacks water or the atomizing and humidifyingassembly 81 fails, at this time, the atomizing and humidifyingassembly 81 is controlled to stop working, so as to replenish the water source or maintain the atomizing and humidifyingassembly 81, thereby timely reminding the worker. If it is determined that the value of the change in relative humidity is greater than the predetermined value for the predetermined time interval (e.g., 60S), the humidifyingfan 83 is turned on, and the humidified air is circulated into theentire curing box 10 by the humidifyingfan 83 to lower the relative humidity in theentire curing box 10.

It should be noted that the relative humidity change value at the preset time interval (for example, 60S) is a difference between the relative humidity acquired by thesecond sensor 51 at thesecond air outlet 521 at, for example, 0S and the relative humidity acquired at thesecond air outlet 521 at, for example, 60S.

Specifically, thefirst sensor 30 is a temperature/humidity probe.

Specifically, thesecond sensor 51 is a temperature and humidity probe, and thesecond sensor 51 can not only acquire the relative humidity at thesecond air outlet 521, but also be used to acquire the ambient temperature at thesecond air outlet 521.

Specifically, thethird sensor 56 is a temperature and humidity probe, and thethird sensor 56 can not only acquire the relative humidity at thefourth air outlet 532, but also can be used to acquire the ambient temperature at thefourth air outlet 532.

Referring to fig. 2 to 4, when thecontroller 41 determines that the relative humidity in thecuring box 10 is relatively high (for example, the relative humidity is greater than 80%), the dehumidifyingfan 92 is correspondingly controlled to operate, and the dehumidifyingfan 92 draws the air with higher humidity in thecuring box 10 into thedehumidifying box 91, and discharges the air into thecuring box 10 after the dehumidifying process is performed by thedehumidifying box 91, so as to reduce the relative humidity in thecuring box 10. Specifically, the dehumidification material is dry particles, dry powder, or the like, and may also be hydrophilic particles such as activated alumina spheres, molecular sieves, or the like.

Referring to fig. 2 to 4, further, the circulatingfan 54 has an independent air inlet and an independent air outlet. Thecirculation fan 54 may be disposed at a front end or a rear end of thedehumidification system cover 53, which is not limited herein. Thecirculation fan 54 is not controlled by the relative humidity parameters in thecuring box 10, and is always kept in a constant pressure working state, and functions to enhance the flow of air in the inner cavity of thecuring box 10. In the non-dehumidification mode, since thedehumidification fan 92 does not operate, the air flow in thecuring box 10 does not pass through the dehumidifiers of thedehumidification box 91, and the humidity of the air flow in thecuring box 10 is not changed; when the dehumidification mode is activated, thedehumidification fan 92 is operated, and the air flow passes through thedehumidification box 91, so that the relative humidity of the air flow is reduced, and the purpose of changing the humidity is achieved. Furthermore, the humidification system cover 52 and the dehumidification system cover 53 are plastic covers, and are fixed on the inner wall of thebox body 11 by using tapping screws or a snap structure, and the humidification system cover 52 and the dehumidification system cover 53 may be made of other materials, or may be fixed on the inner wall of thecuring box 10 by other methods.

Referring to fig. 2, 12 and 13, further, anair partition plate 55 is disposed in thedehumidification system cover 53, theair partition plate 55 divides the dehumidification system cover 53 into two spaces, thedehumidification box 91 and thedehumidification fan 92 are disposed in one of the two spaces, and thefourth air inlet 531 and thefourth air outlet 532 on the dehumidification system cover 53 are communicated with the one space. The circulatingfan 54 is disposed in the other space, the dehumidifying system cover 53 is further provided with afifth air inlet 533 and afifth air outlet 534 communicated with the other space, when the circulatingfan 54 works, the air flow in thecuring box 10 enters through thefifth air inlet 533 and is discharged from thefifth air outlet 534, so that the air flow in thecuring box 10 can be driven to circularly flow.

In one embodiment, as shown in fig. 18, there is provided a temperature and humidity control method applied to a maintenance storage device including a maintenance box, the method including:

step S1810, the relative humidity and the temperature in the curing box are obtained.

Wherein, the relative humidity can be the percentage of the water vapor pressure in the air and the saturated water vapor pressure at the same temperature.

In a specific implementation, in the process that thecontroller 41 controls the temperature and humidity in thecuring box 20, thecontroller 41 obtains the relative humidity and the temperature in thecuring box 20 in real time through the sensor.

Step S1820, when the relative humidity and the temperature in the curing box do not accord with the preset range, controlling the temperature adjusting mechanism to adjust the temperature in the curing box to reach the preset temperature range; the temperature adjusting mechanism is arranged on the side wall of the curing box.

In practical applications, the preset range may include a preset temperature range and a preset humidity range. For example, the predetermined humidity range may refer to a relative humidity of 60% to 70%. The predetermined temperature range may be 16 ℃ to 20 ℃.

In a specific implementation, after thecontroller 41 obtains the relative humidity and the temperature inside thecuring box 20, thecontroller 41 determines whether the relative humidity inside the curing box meets a preset humidity range and determines whether the temperature inside the curing box meets a preset temperature range.

When thecontroller 41 determines that the relative humidity in thecuring box 20 does not conform to the predetermined humidity range but the temperature in the curing box conforms to the predetermined temperature range, thecontroller 41 controls the humidity adjusting mechanism disposed on the inner wall of the curing box to adjust the relative humidity in the curing box to the predetermined humidity range.

When thecontroller 41 determines that the relative humidity in thecuring box 20 is within the predetermined humidity range but the temperature in the curing box is not within the predetermined temperature range, thecontroller 41 controls the temperature adjusting mechanism disposed on the sidewall of the curing box to adjust the temperature in the curing box to reach the predetermined temperature range.

When thecontroller 41 determines that the relative humidity and the temperature in thecuring box 20 do not meet the preset range, thecontroller 41 preferentially controls the temperature adjusting mechanism disposed on the sidewall of the curing box to adjust the temperature in the curing box to reach the preset temperature range.

Step S1830, after the temperature in the curing box reaches a preset temperature range, controlling a humidity adjusting mechanism to adjust the relative humidity in the curing box to a preset humidity range; the humidity control mechanism is arranged on the inner wall of the curing box.

In a specific implementation, after thecontroller 41 controls the temperature adjusting mechanism disposed on the sidewall of the curing box to adjust the temperature in the curing box to reach the preset temperature range, thecontroller 41 then adjusts the relative humidity in the curing box to reach the preset humidity range by controlling the humidity adjusting mechanism.

In the temperature and humidity control method, when the relative humidity and the temperature in the curing box are detected to be not in accordance with the preset range, the temperature regulating mechanism arranged on the side wall of the curing box is controlled to regulate the temperature in the curing box to reach the preset temperature range, and then the humidity regulating mechanism is controlled to regulate the relative humidity in the curing box to the preset humidity range, so that the temperature regulation is finished before the humidity control in the process of controlling the relative humidity and the temperature in the curing box by considering the correlation of the two parameters of the temperature and the relative humidity, namely the temperature regulation can influence the humidity change, so that the temperature regulation is finished firstly, the temperature in the curing box is controlled in the required temperature range, and then the humidity control is finished, and the humidity regulation adopts a non-refrigeration physical or chemical mode, so that the humidity regulation does not influence or has minimum influence on the temperature in the curing box, the realization is to the humiture in the curing box carry out meticulous control, has improved the maintenance effect of the maintenance storage device that is used for depositing the cigar to the storage of cigar.

In another embodiment, controlling the temperature adjustment mechanism to adjust the temperature within the curing box to reach a preset temperature range includes: when the temperature in the curing box is judged to be lower than a first temperature set value, controlling a temperature adjusting mechanism to execute heating action; and when the temperature in the curing box is judged to be higher than the second temperature set value, controlling the temperature adjusting mechanism to execute the refrigeration action.

In practice, the first temperature setting may be 16 ℃. The second temperature setting may be 20 ℃.

In a specific implementation, thecontroller 41 may specifically include, in the process of controlling the temperature adjusting mechanism to adjust the temperature in the curing box to reach the preset temperature range: when thecontroller 41 judges that the temperature in the curing box is lower than the first temperature set value, the temperature adjusting mechanism is controlled to execute heating action so as to enable the temperature in the curing box to reach a preset temperature range; when thecontroller 41 determines that the temperature in the curing box is higher than the second temperature set value, the temperature adjusting mechanism is controlled to perform a cooling operation so that the temperature in the curing box reaches a preset temperature range.

According to the technical scheme of the embodiment, when the temperature in the curing box is judged to be lower than a first temperature set value, the temperature adjusting mechanism is controlled to execute heating action; when the temperature in the curing box is judged to be higher than the second temperature set value, the temperature adjusting mechanism is controlled to perform a refrigerating action, the temperature in the curing box is controlled, and the storage and curing effects of the curing and storing device for storing cigars on cigars are improved.

In another embodiment, when the temperature in the curing box is judged to be lower than the first temperature set value, the controlling the temperature adjusting mechanism to perform the heating action comprises the following steps: acquiring initial heating power of the temperature adjusting mechanism; the initial heating power is less than the maximum heating power of the temperature adjusting mechanism; controlling the temperature adjusting mechanism to execute heating action with initial heating power, and increasing the heating power of the temperature adjusting mechanism; when the temperature in the curing box reaches a first temperature set value, stopping increasing the heating power of the temperature adjusting mechanism, and determining the current heating power of the temperature adjusting mechanism; and controlling the temperature adjusting mechanism to execute heating action at the current heating power.

Wherein the initial heating power is less than the maximum heating power of the temperature adjusting mechanism.

In concrete implementation, when thecontroller 41 determines that the temperature in the curing box is lower than the first temperature set value, the process of controlling the temperature adjusting mechanism to perform the heating action specifically includes: thecontroller 41 obtains the initial heating power of the temperature adjustment mechanism, controls the temperature adjustment mechanism to perform a heating action at the initial heating power, and linearly increases the heating power of the temperature adjustment mechanism step by step at a preset increase rate. When thecontroller 41 detects that the temperature in the curing box reaches a first temperature set value, thecontroller 41 stops increasing the heating power of the temperature adjusting mechanism and determines the current heating power of the temperature adjusting mechanism; finally, thecontroller 41 controls the temperature adjustment mechanism to perform the heating action at the current heating power.

Specifically, thecontroller 41 may control the temperature adjustment by controlling an operating voltage of the temperature adjustment mechanism when performing the heating actionHeating power of the mechanism. For example, assume that the first temperature setting is denoted as T_setThecontroller 41 sets the initial operating voltage U of the temperature adjustment mechanism during the heating operation_tecThen, thecontroller 41 linearly increases the operating voltage of the temperature adjusting mechanism at the time of performing the heating operation in steps at a preset increasing rate until the maximum operating voltage U of the temperature adjusting mechanism at the time of performing the heating operation is reached_TECmaxWhen thecontroller 41 detects that the temperature T in the curing box reaches the first temperature setting value T_setIn the meantime, thecontroller 41 stops increasing the heating power of the temperature adjusting mechanism and determines the current heating power U of the temperature adjusting mechanism_tec1(ii) a Finally, thecontroller 41 controls the temperature adjustment mechanism to the current heating power U_tec1Heating is carried out until the first temperature set value T_setAnd (6) changing.

Based on this, the above control method is named as a first control method, and for the convenience of understanding of those skilled in the art, fig. 19 provides a graph of the temperature T versus time T when the temperature of the maintenance storage device needs to be raised and in the first control method; fig. 20 provides a graph of voltage U versus time t for a first control mode when the temperature of the care reservoir needs to be raised.

According to the technical scheme of the embodiment, the initial heating power of the temperature adjusting mechanism is obtained, the temperature adjusting mechanism is controlled to execute heating action according to the initial heating power, and the heating power of the temperature adjusting mechanism is increased; when the temperature in the curing box reaches the first temperature set value, the heating power of the temperature adjusting mechanism is stopped to be increased, and the temperature adjusting mechanism is controlled to execute heating action with the current heating power, so that the temperature adjusting mechanism can adjust the temperature in the curing box with a proper heating power instead of always adopting the maximum heating power, and further the electric energy consumption is saved.

In another embodiment, after the step of controlling the temperature adjustment mechanism to perform the heating action at the initial heating power and increasing the heating power of the temperature adjustment mechanism, the method further comprises: when the heating power of the temperature adjusting mechanism reaches the maximum heating power and the temperature in the curing box does not reach the first temperature set value, controlling the temperature adjusting mechanism to execute heating action at the maximum heating power until the temperature in the curing box reaches a third temperature set value; and when the temperature in the curing box reaches a third temperature set value, a PID control mode is adopted, and the heating power of the temperature adjusting mechanism is dynamically adjusted, so that the temperature in the curing box reaches a preset temperature range.

Wherein the third temperature setting is greater than the first temperature setting; the difference between the first temperature set point and the third temperature set point meets a preset difference threshold. For example, assume that the first temperature setting is denoted as T_setIf the preset difference threshold is Δ T, the third temperature setting value can be T_set+ Δ T. In practical application, the delta T can be 1-2 ℃.

In a specific implementation, after the step of controlling the temperature adjustment mechanism to perform the heating operation with the initial heating power and increasing the heating power of the temperature adjustment mechanism by thecontroller 41, when thecontroller 41 detects that the heating power of the temperature adjustment mechanism reaches the maximum heating power and the temperature in the curing box does not reach the first temperature setting value yet, thecontroller 41 controls the temperature adjustment mechanism to perform the heating operation with the maximum heating power until the temperature in the curing box reaches the third temperature setting value. When thecontroller 41 determines that the temperature in the curing box reaches the third temperature setting value, thecontroller 41 dynamically adjusts the heating power of the temperature adjusting mechanism in a PID control mode so that the temperature in the curing box reaches a preset temperature range.

Thecontroller 41 may control the heating power of the temperature adjustment mechanism by controlling the operating voltage of the temperature adjustment mechanism when performing the heating action. For example, assume that the first temperature setting is denoted as T_setThecontroller 41 sets the initial operating voltage U of the temperature adjustment mechanism during the heating operation_TEC0Thecontroller 41 linearly increases the operating voltage of the temperature adjusting mechanism at the time of performing the heating action stepwise until the maximum operating voltage U of the temperature adjusting mechanism at the time of performing the heating action is reached_TECmaxAnd thecontroller 41 detects that the temperature T in the curing box has not yet reached the first temperature setting value T_setWhile thecontroller 41 controls the temperatureRegulating mechanism with maximum working voltage U_TECmaxHeating is carried out until the temperature in the curing box reaches or is approximately equal to a third temperature set value T_setAt + Δ T, thecontroller 41 dynamically adjusts the heating power of the temperature adjustment mechanism in a PID control mode to achieve dynamic balance of the temperature in the curing box within a preset temperature range.

Based on this, the above control method is named as a second control method, and for the convenience of understanding of those skilled in the art, fig. 21 provides a graph of the temperature T versus time T when the temperature of the maintenance storage device needs to be raised and in the second control method; fig. 22 provides a graph of voltage U versus time t for a second control mode when the temperature of the care reservoir needs to be raised.

According to the technical scheme of the embodiment, when the heating power of the temperature adjusting mechanism reaches the maximum heating power and the temperature in the curing box does not reach the first temperature set value, the temperature adjusting mechanism is controlled to execute heating action at the maximum heating power; when the temperature in the curing box reaches a third temperature set value, adopting a PID control mode to dynamically adjust the heating power of the temperature adjusting mechanism so as to enable the temperature in the curing box to reach a preset temperature range, wherein the third temperature set value is larger than the first temperature set value; the difference between the first temperature set value and the third temperature set value meets a preset difference threshold value; therefore, the temperature in the curing box can be accurately and finely adjusted to be within the preset temperature range.

In another embodiment, when the temperature in the curing box is judged to be higher than the second temperature set value, the controlling the temperature adjusting mechanism to perform the cooling action comprises: according to the second temperature set value, determining a temperature control interval when the temperature adjusting mechanism executes the refrigeration action; and a PID control mode is adopted, and the refrigerating power of the temperature adjusting mechanism is dynamically adjusted, so that the temperature in the curing box is in a temperature control interval.

In practical application, when the second temperature setting value is denoted as T_setIn time, the temperature control interval can be recorded as T_set-ΔT～T_set+ΔT。

In specific implementation, when thecontroller 41 determines that the temperature in the curing box is higher than the second temperature set value, thecontroller 41 controls the temperature adjusting mechanism to perform a cooling operation, which may specifically include: thecontroller 41 determines a temperature control section when the temperature adjustment mechanism performs the cooling operation, based on the second temperature set value. Then, the controller adopts a PID control mode to dynamically adjust the refrigerating power of the temperature adjusting mechanism so as to enable the temperature in the curing box to be in a temperature control interval.

Specifically, the controller may control the cooling power of the temperature adjustment mechanism by controlling the operating voltage of the temperature adjustment mechanism when performing the cooling action. Specifically, the controller can control the working voltage U of the temperature adjusting mechanism when the temperature adjusting mechanism executes the refrigeration action_TECAt U_TECmin(minimum refrigeration operating Voltage) -U_TECmax(minimum refrigeration working voltage), i.e. a value U between the minimum and maximum refrigeration capacity of the temperature regulating mechanism_TEC1When the cold production quantity and the heat leakage quantity of the corresponding TEC are equal, the dynamic balance of the cold production quantity and the heat quantity is realized, and at the moment, the temperature in the box can be stabilized at T_set-ΔT～T_set+ delta T, in practical application, delta T can be 0.5-1 ℃, namely the temperature in the box is correspondingly controlled at the set temperature T_set±0.5～T_set±1℃。

To facilitate understanding by those skilled in the art, FIG. 23 provides a U for maintaining a reservoir at a desired reduced temperature_TECControl plot against T.

According to the technical scheme of the embodiment, when the temperature in the curing box is judged to be higher than a second temperature set value, a temperature control interval for the temperature adjusting mechanism to perform a refrigerating action is determined according to the second temperature set value; the refrigeration power of the temperature adjusting mechanism is dynamically adjusted by adopting a PID control mode, so that the temperature in the curing box is within a temperature control interval, the temperature in the curing box can be finely controlled, and the storage and curing effects of the curing and storing device for storing cigars on cigars are improved.

In another embodiment, when the temperature adjusting mechanism is performing the heating action and the temperature in the curing box is higher than the second temperature set value, the method further comprises: controlling the temperature adjusting mechanism to stop executing the heating action and executing the refrigerating action at a preset initial refrigerating power; wherein the initial refrigeration power is less than the maximum refrigeration power of the temperature adjusting mechanism; when the duration of the refrigeration action executed by the temperature adjusting mechanism at the initial refrigeration power reaches the preset refrigeration duration, the temperature adjusting mechanism is controlled to execute the refrigeration action at the maximum refrigeration power so as to adjust the temperature in the curing box to the preset temperature range.

Wherein the initial refrigeration power is less than the maximum refrigeration power of the temperature adjustment mechanism. More specifically, the initial cooling power may be 50% of the maximum cooling power of the temperature adjustment mechanism.

In a specific implementation, when the temperature adjusting mechanism performs the heating operation and the temperature inside the curing box is higher than the second temperature setting value, thecontroller 41 controls the temperature adjusting mechanism to stop performing the heating operation, and performs the cooling operation at a preset initial cooling power. When the duration of the refrigeration action executed by the temperature adjusting mechanism at the initial refrigeration power reaches the preset refrigeration duration, the temperature adjusting mechanism is controlled to execute the refrigeration action at the maximum refrigeration power so as to adjust the temperature in the curing box to the preset temperature range.

Specifically, for a particular class of service conditions, for example, the first initial set temperature is 18 ℃, and the tank is stabilized at 18 ℃ by the heating mode. At this time, the second temperature setting value is suddenly adjusted from 18 ℃ to 17 ℃ (that is, the temperature adjusting mechanism is in the process of executing the heating action and the temperature in the curing box is higher than the second temperature setting value), the temperature adjusting system usually switches the working mode from heating to cooling at this time, and the heating is changed into the cooling mode by changing the polarity of positive and negative voltages of the TEC; however, the difference between 17 ℃ and 18 ℃ is small, which often causes temperature overshoot, that is, after the 18 ℃ full power refrigeration process starts, the temperature in the tank is lower than 17 ℃ due to the thermal inertia of the temperature in the tank, the induced temperature lags behind the actual temperature in the tank, and the tank always works in the full power refrigeration state, and the temperature in the tank is finally lower than 17 ℃, and if the control program is used, the switching is started to be the heating mode, so that the TEC is continuously and repeatedly switched between the heating and refrigeration working modes, and temperature fluctuation in the tank is caused at first; secondly, due to the fact that the cold and hot of the TEC are switched constantly, the service life and the stability of the TEC can be reduced due to the fact that internal stress changes constantly. Therefore, in order to avoid the working condition, when the heating mode is switched to the cooling mode, a buffering control program is added.

Specifically, the controller controls the temperature adjustment mechanism to stop executing the heating action and execute the cooling action with a preset initial cooling power, and if the controller controls the TEC of the temperature adjustment mechanism to switch the positive polarity and the negative polarity, the controller sets the initial working voltage of the TEC after the positive polarity and the negative polarity are switched to be a part of the full working voltage, such as 50% U_TECmaxE.g. U_TECmax12V, then U_{TEC initialization}Stabilizing for a period of time (30S-60S) at 6V, providing a buffer change balance process for the temperature field in the box, and then adjusting the TEC working voltage to the maximum refrigeration state (full working voltage state U)_TECmaxTherefore, the problem of continuous and repeated switching of the heating-refrigerating modes is effectively solved, and the service life, the working reliability and the stability of the TEC of the temperature adjusting mechanism are improved.

In another embodiment, controlling the humidity adjustment mechanism to adjust the relative humidity within the curing box to a preset humidity range includes: when the relative humidity in the curing box is judged to be lower than a first humidity set value, controlling a humidity adjusting mechanism to perform a humidifying action; and when the relative humidity in the curing box is judged to be higher than the second humidity set value, controlling the humidity adjusting mechanism to execute a dehumidifying action.

In practice, the first humidity set point is less than the second humidity set point. For example, the first humidity set point may be 60%. The second humidity set point may refer to 70%.

In a specific implementation, the controller may specifically include the following steps in a process of controlling the humidity adjustment mechanism to perform the humidity adjustment action: when the controller judges that the relative humidity in the curing box is smaller than the first humidity set value, the humidity adjusting mechanism is controlled to execute the humidifying action. And when the controller judges that the relative humidity in the curing box is greater than the second humidity set value, controlling the humidity adjusting mechanism to execute dehumidification action.

According to the technical scheme of the embodiment, in the process of controlling the humidity adjusting mechanism to adjust the relative humidity in the curing box to the preset humidity range, when the relative humidity in the curing box is judged to be lower than a first humidity set value, the humidity adjusting mechanism is controlled to perform a humidifying action; when the relative humidity in the curing box is judged to be higher than the second humidity set value, the humidity adjusting mechanism is controlled to execute the dehumidifying action, so that the relative humidity in the curing box can be finely controlled, and the storage and curing effects of the curing and storing device for storing cigars on cigars are improved.

In another embodiment, the humidity adjusting mechanism comprises an atomizing and humidifying component and a humidifying fan, and the humidity adjusting mechanism is controlled to perform humidifying actions, which comprise: when the relative humidity in the curing box is smaller than the humidification starting limit value, controlling the atomization humidification assembly to operate to generate atomized water molecules, and controlling the humidification fan to be in a stop state; wherein the humidification starting limit value is smaller than the first humidity set value; the difference value between the humidification starting limit value and the first humidity set value meets a preset first difference value threshold value; judging whether the relative humidity in the curing box is greater than a third humidity set value or not; wherein the third humidity set value is greater than the first humidity set value; if so, controlling the atomization humidification assembly to stop running and controlling the humidification fan to be in a running state again. And after a preset first waiting time, executing a step of judging whether the relative humidity in the curing box is smaller than a humidification starting limit value or not. In practical applications, the first waiting time may be 30S.

Wherein, humidity control mechanism includes atomizing humidification subassembly and humidification fan.

Wherein the humidification starting limit value is smaller than the first humidity set value; the difference between the humidification starting limit value and the first humidity set value meets a preset first difference threshold value. For example, assuming that the first humidity set point is RHset and the first difference threshold is Δ RH, the humidification start limit may be expressed as RHset- Δ RH.

It should be noted that, a person skilled in the art may adaptively adjust the magnitude of the first difference threshold according to the actual control accuracy, and the magnitude of the first difference threshold is not specifically limited herein.

Wherein the third humidity set point is greater than the first humidity set point. And the difference value between the third humidity set value and the first humidity set value meets a preset second difference value threshold value. In practice, the third humidity set point may be 80% rh.

In a specific implementation, when the controller controls the humidity adjustment mechanism to perform the humidification action, the method may specifically include: the controller may determine whether the relative humidity within the curing box is less than a humidification start limit. When the relative humidity in the curing box is judged to be smaller than the humidification starting limit value, the controller controls the atomization and humidification component to operate to generate atomized water molecules, and meanwhile, the atomization and humidification component and the humidification fan are in an alternative working state; therefore, when the controller controls the atomization humidification component to operate to generate atomized water molecules, the controller simultaneously controls the humidification fan to be in a stop state.

Meanwhile, the controller judges whether the relative humidity in the curing box is greater than a third humidity set value. When the controller detects that the relative humidity in the curing box is greater than the third humidity set value, the controller controls theatomization humidification assembly 22 to stop running, after theatomization humidification assembly 11 stops running, because the atomization humidification assembly and the humidification fan are in alternative working states, therefore, after the controller controls the atomization humidification assembly to stop running, the controller simultaneously controls the humidification fan to be in a running state again, air flow generated by the humidification fan is used for carrying out secondary evaporation on water molecules adsorbed on a water molecule attachment body, and air flow generated along with the humidification fan flows into the box, so that the humidity in the box is improved. In addition, the diameter of molecular groups in the air flow is effectively reduced while the humidity of the air flow in the curing box is improved, the diameter of water molecules in the air in the curing box is smaller, the water molecules are easy to uniformly diffuse into the curing box, the humidity in the curing box is more balanced, and the curing effect can be improved. After delaying for 30 seconds, the controller re-executes the step of determining whether the relative humidity in the curing box is less than the humidification start limit.

According to the technical scheme of the embodiment, when the relative humidity in the curing box is smaller than the humidification starting limit value, the atomization and humidification component is controlled to operate to generate atomized water molecules, and the humidification fan is controlled to be in a stop state; judging whether the relative humidity in the curing box is greater than a third humidity set value or not; if so, controlling the atomization humidification assembly to stop running and controlling the humidification fan to be in a running state again. So, can accurately carry out the adjustment that becomes more meticulous to the relative humidity in the curing box, improve the maintenance storage device that is used for depositing the cigar and to the storage maintenance effect of cigar.

Meanwhile, whether the relative humidity in the maintenance box is smaller than a humidification starting limit value or not is judged, whether the operation of the atomization and humidification component is controlled to generate atomized water molecules or not is determined, the humidity lower limit value for triggering the humidity adjusting mechanism to execute humidification action is further improved, humidity adjustment overshoot is avoided when the humidity adjusting mechanism is close to a set humidity value, dehumidification and humidification work alternately is caused, the humidification and the dehumidification form vicious circle in the inner cavity of the box body, and finally the conditions that water in the humidification water box is exhausted and dehumidification adsorbing substances are invalid are caused.

In another embodiment, after the steps of controlling the atomizing humidification assembly to operate to generate atomized water molecules and controlling the humidification fan to be in a stop state, the method further comprises: and when the relative humidity in the curing box is smaller than or equal to the third humidity set value, determining the first humidity variation in the curing box when the atomization and humidification assembly is in the working state.

And when the first humidity change value is larger than or equal to a preset first change value threshold value, controlling the atomization humidification assembly to stop running, controlling the humidification fan to be in a running state, returning to the step of controlling the atomization humidification assembly to run to generate atomized water molecules after preset second waiting time, and controlling the humidification fan to be in a stop running state.

When the first humidity change value is smaller than the first change value threshold value, generating a humidification component abnormity alarm; the humidifying component abnormity warning is used for prompting a user to carry out water adding operation on the atomizing and humidifying component.

In a specific implementation, the controller may further include, after the step of controlling the operation of the atomizing and humidifying assembly to generate atomized water molecules and controlling the humidifying fan to be in a stall state: when the controller judges that the relative humidity in the curing box is smaller than or equal to the third humidity set value, the controller determines the first humidity variation in the curing box when the atomizing and humidifying assembly is in the working state.

Specifically, the controller may record the adjusted relative humidity in the curing box before the atomizing and humidifying component is in the working state, and then record the adjusted relative humidity in the curing box after delaying for a preset time period, for example, 30S; then, the controller determines a first humidity variation in the curing box when the atomization humidification assembly is in the working state according to the adjusted relative humidity and the adjusted relative humidity.

When the controller judges that the first humidity change value is larger than or equal to the preset first change value threshold value, the controller controls the atomization humidification component to stop running, and after the atomization humidification component stops running, the atomization humidification component and the humidification fan are in an alternative working state, so that after the controller controls the atomization humidification component to stop running, the controller simultaneously controls the humidification fan to be in a running state again. Then, the controller returns to the step of controlling the atomization humidification component to operate to generate atomized water molecules and controlling the humidification fan to be in a stop state after the preset second waiting time.

When the controller judges that the first humidity change value is smaller than the first change value threshold value, the controller generates an abnormal alarm of the humidifying assembly; the humidifying component abnormity warning is used for prompting a user to carry out water adding operation on the atomizing and humidifying component.

According to the technical scheme of the embodiment, when the relative humidity in the curing box is smaller than or equal to a third humidity set value, the first humidity variation in the curing box when the atomizing and humidifying component is in the working state is determined; when the first humidity change value is larger than or equal to the preset first change value threshold value, the atomization humidification component is controlled to stop running, and the humidification fan is controlled to be in a running state, so that the diameter of water molecules in air is smaller, the water molecules can be easily and uniformly diffused into the box, and the humidity adjustment in the box is more balanced. Meanwhile, when the first humidity change value is smaller than the first change value threshold value, a humidification component abnormity warning for prompting a user to add water to the atomization humidification component is generated in time, and the situation that the humidification adjustment cannot be performed on the maintenance box due to water shortage of the atomization humidification component is avoided.

In another embodiment, the method further comprises: judging whether the relative humidity in the curing box is smaller than a first humidity set value or not; if not, judging whether the relative humidity in the curing box is smaller than a second humidity set value or not; when the relative humidity in the curing box is judged to be not less than the second humidity set value, returning to the step of controlling the atomization and humidification component to stop running and controlling the humidification fan to be in a running state again; and when the relative humidity in the curing box is judged to be smaller than the second humidity set value, executing the step of judging whether the relative humidity in the curing box is smaller than the humidification starting limit value.

In the concrete implementation, the controller judges whether the relative humidity in the curing box is smaller than a first humidity set value or not; when the controller judges that the relative humidity in the curing box is greater than or equal to the first humidity set value, the controller judges whether the relative humidity in the curing box is smaller than the second humidity set value or not; when the controller judges that the relative humidity in the curing box is greater than or equal to the second humidity set value, the controller controls the atomizing and humidifying assembly to stop running and controls the humidifying fan to be in a normal rotation state again. When the controller judges that the relative humidity in the curing box is smaller than the second humidity set value, the controller executes the step of judging whether the relative humidity in the curing box is smaller than the humidification starting limit value again.

According to the technical scheme of the embodiment, when the relative humidity in the curing box is equal to or equal to a first humidity set value, whether the relative humidity in the curing box is smaller than a second humidity set value is judged; if not, returning to the step of controlling the atomization and humidification component to stop running and controlling the humidification fan to be in a normal rotation state again; if so, returning to the step of judging whether the relative humidity in the curing box is smaller than a first humidity set value; so, can in time control atomizing humidification subassembly bring to rest when the relative humidity in the curing box surpassed the second humidity set value to control the humidification fan and be in the normal state of changeing again, avoid making the relative humidity in the curing box too high.

In another embodiment, the humidity adjusting mechanism comprises a dehumidifying fan and a dehumidifying box, the dehumidifying fan is used for drawing the air flow in the curing box into the dehumidifying box, and the humidity adjusting mechanism is controlled to execute dehumidifying action, which comprises: when the relative humidity in the curing box is greater than the dehumidification starting limit value, controlling the dehumidification fan to be in a running state; wherein the dehumidification start limit is greater than the second humidity set value; the difference value between the dehumidification starting limit value and the second humidity set value meets a preset third difference value threshold value; when the operation time of the dehumidifying fan is longer than a preset operation time threshold, judging whether the relative humidity in the curing box is smaller than a second humidity set value; if so, controlling the dehumidifying fan to be in a stop state, and returning to the step of judging whether the relative humidity in the curing box is greater than the dehumidifying start limit value.

The humidity adjusting mechanism comprises a dehumidifying fan and a dehumidifying box, and the dehumidifying fan is used for pumping the air flow in the curing box into the dehumidifying box.

Wherein the dehumidification start limit is greater than the second humidity set value; the difference between the dehumidification start limit and the second humidity set value meets a preset second difference threshold. For example, assuming that the second humidity set point is RHSet and the third difference threshold is Δ RH, the dehumidification initiation limit may be represented as RHSet + Δ RH.

It should be noted that, a person skilled in the art may adaptively adjust the magnitude of the third difference threshold according to the actual control accuracy, and the magnitude of the third difference threshold is not specifically limited herein.

In practical applications, the operation duration threshold may be 60S.

In a specific implementation, the controlling the humidity adjusting mechanism to execute the dehumidifying action by the controller may specifically include: the controller judges whether the relative humidity in the curing box is larger than a dehumidification starting limit value or not. When the relative humidity in the curing box is greater than the dehumidification starting limit value, controlling the dehumidification fan to be in a running state; when the operation time of the dehumidifying fan is longer than a preset operation time threshold, judging whether the relative humidity in the curing box is smaller than a second humidity set value; if so, controlling the dehumidifying fan to be in a stop state, and returning to the step of judging whether the relative humidity in the curing box is greater than the dehumidifying start limit value.

In another embodiment, in the process of the humidity adjusting mechanism executing the humidifying action, when the humidity adjusting mechanism is judged to be required to be controlled to execute the dehumidifying action, the humidity adjusting mechanism is controlled to stop executing the humidifying action, and after a preset first delay time, the humidity adjusting mechanism is controlled to execute the dehumidifying action; and in the process of executing the dehumidification action by the humidity adjusting mechanism, when judging that the humidity adjusting mechanism needs to be controlled to execute the humidification action, controlling the humidity adjusting mechanism to stop executing the dehumidification action, and controlling the humidity adjusting mechanism to execute the humidification action after a preset second delay time.

Furthermore, the controller can also increase time delay when the humidity adjusting mechanism is switched between the dehumidification mode and the humidification mode, namely, the humidification mode or the dehumidification mode is switched to the other mode, firstly, the mode is stopped to work for a period of time (for example, 5min), and then whether the mode is switched is determined according to humidity parameters in the box, so that the humidity in the curing box is fully ensured to be in a stable state, and the vicious cycle problem of the dehumidification and the humidification is effectively solved.

Specifically, in the process of the humidity adjusting mechanism performing the humidifying action, when the controller determines that the humidity adjusting mechanism needs to be controlled to perform the dehumidifying action, the controller controls the humidity adjusting mechanism to stop performing the humidifying action, and after a preset first delay time (for example, 5min), the controller controls the humidity adjusting mechanism to perform the dehumidifying action. In the process that the humidity adjusting mechanism executes the dehumidifying action, when the controller judges that the humidity adjusting mechanism needs to be controlled to execute the humidifying action, the controller controls the humidity adjusting mechanism to stop executing the dehumidifying action, and after a preset second delay time (such as 5min), the controller controls the humidity adjusting mechanism to execute the humidifying action.

According to the technical scheme of the embodiment, when the relative humidity in the curing box is greater than the dehumidification starting limit value, the dehumidification fan is controlled to be in the running state, and when the running time of the dehumidification fan is greater than the preset running time threshold value, whether the relative humidity in the curing box is smaller than a second humidity set value is judged; if so, controlling the dehumidifying fan to be in a stop state, and returning to the step of judging whether the relative humidity in the curing box is greater than the dehumidifying start limit value, so that the relative humidity in the curing box is accurately and finely adjusted, and the effect of storing and curing the cigars by the curing and storing device for storing the cigars can be improved.

Meanwhile, whether the relative humidity in the maintenance box is larger than a dehumidification starting limit value or not is judged, whether the dehumidification fan is controlled to be in the running state or not is determined, the humidity upper limit value for triggering the humidity adjusting mechanism to execute the dehumidification action is further improved, the phenomenon of overshoot humidity adjustment when the humidity adjusting mechanism is close to the set humidity value is avoided, dehumidification and humidification work alternately is caused, the humidification and the dehumidification form vicious circle in the inner cavity of the box body, and finally the conditions that the water in the humidification water box is exhausted and the dehumidification adsorbing substances are invalid are caused.

In another embodiment, when the operation time of the dehumidifying fan is greater than the preset operation time threshold, the method further includes: acquiring a second humidity variable quantity in the curing box when the dehumidifying fan is in a running state; when the second humidity variation is smaller than a preset second variation threshold, generating a dehumidification box abnormity alarm; the dehumidification box abnormity warning is used for prompting a user to replace the dehumidification box.

In practical applications, the second variation threshold may be 10%.

In specific implementation, when the controller detects that the operation time of the dehumidifying fan is greater than a preset operation time threshold, the controller acquires a second humidity variable quantity in the curing box when the dehumidifying fan is in an operation state; the controller judges whether the second humidity variation is smaller than a preset second variation threshold value so as to judge whether the adsorption capacity of the dehumidified substances in the dehumidifying box is invalid.

Specifically, the controller may record the pre-adjustment relative humidity in the curing box before the dehumidifying fan is in an operating state, and then record the post-adjustment relative humidity in the curing box after delaying for a preset time period, for example, 30S; then, the controller determines a second humidity variation amount in the curing box when the dehumidifying fan is in the operating state according to the adjusted relative humidity and the adjusted relative humidity.

When the controller judges that the second humidity variation is smaller than a preset second variation threshold, the adsorption capacity of the dehumidified substances in the dehumidifying box is in failure; and generating a dehumidification box abnormity alarm for prompting a user to replace the dehumidification box. Specifically, the controller can control the action of the alarm to alarm the replacement of the dehumidification objects in the dehumidification box. Optionally, to facilitate replacement of dehumidified items within the dehumidification cassette, the dehumidification cassette may be removably secured to the dehumidification system housing, such as by a snap-fit arrangement.

According to the technical scheme, the second humidity change amount in the maintenance box when the dehumidifying fan is in the running state is obtained, whether the second humidity change amount is smaller than the preset second change amount threshold value is judged, whether the adsorption capacity of the dehumidifying object in the dehumidifying box is invalid is accurately judged, and therefore the dehumidifying box abnormity warning for prompting a user to replace the dehumidifying box is timely generated.

In another embodiment, as shown in fig. 24, there is provided a temperature and humidity control method applied to a maintenance storage device including a maintenance box, including the steps of: step S2410, acquiring the relative humidity and temperature in the curing box. Step S2420, when the relative humidity and the temperature in the curing box do not accord with a preset range, acquiring the initial heating power of the temperature adjusting mechanism; the initial heating power is less than the maximum heating power of the temperature adjustment mechanism. And step S2430, controlling the temperature adjusting mechanism to execute heating action with the initial heating power, and increasing the heating power of the temperature adjusting mechanism. And step S2440, when the temperature in the curing box reaches the first temperature set value, stopping increasing the heating power of the temperature adjusting mechanism, and determining the current heating power of the temperature adjusting mechanism. Step S2450, controlling the temperature adjusting mechanism to execute heating action with the current heating power until the temperature in the curing box reaches a preset temperature range; the temperature adjusting mechanism is arranged on the side wall of the curing box. Step S2460, when the temperature in the curing box reaches the preset temperature range, controlling a humidity adjusting mechanism to adjust the relative humidity in the curing box to a preset humidity range; the humidity adjusting mechanism is arranged on the inner wall of the curing box. The specific limitations of the above steps may refer to the above specific limitations of a temperature and humidity control method, which are not described herein again.

It should be understood that, although the steps in the flowcharts of fig. 18 and 24 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least some of the steps in fig. 18 and 24 may include multiple steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed in sequence, but may be performed alternately or alternately with other steps or at least some of the other steps.

In one embodiment, as shown in fig. 25, there is provided a temperature and humidity control apparatus for a maintenance storage apparatus including a maintenance box, wherein:

an obtainingmodule 2510, configured to obtain relative humidity and temperature in the curing box;

thetemperature control module 2520 is used for controlling the temperature adjusting mechanism to adjust the temperature in the curing box to reach a preset temperature range when the relative humidity and the temperature in the curing box do not accord with the preset range; the temperature adjusting mechanism is arranged on the side wall of the curing box;

thehumidity control module 2530 is configured to control the humidity adjusting mechanism to adjust the relative humidity in the curing box to a preset humidity range after the temperature in the curing box reaches the preset temperature range; the humidity adjusting mechanism is arranged on the inner wall of the curing box.

In one embodiment, thetemperature control module 2520 is specifically configured to control the temperature adjustment mechanism to perform a heating operation when it is determined that the temperature inside the curing box is lower than a first temperature set value; and when the temperature in the curing box is judged to be higher than a second temperature set value, controlling the temperature adjusting mechanism to execute a refrigerating action.

In one embodiment, thetemperature control module 2520 is specifically configured to control the temperature adjustment mechanism to perform a heating operation when the temperature inside the curing box is determined to be lower than a first temperature set value, and includes: acquiring initial heating power of the temperature adjusting mechanism; the initial heating power is less than the maximum heating power of the temperature adjusting mechanism; controlling the temperature adjusting mechanism to execute heating action with the initial heating power, and increasing the heating power of the temperature adjusting mechanism; when the temperature in the curing box reaches the first temperature set value, stopping increasing the heating power of the temperature adjusting mechanism, and determining the current heating power of the temperature adjusting mechanism; and controlling the temperature adjusting mechanism to execute heating action at the current heating power.

In one embodiment, thetemperature control module 2520, specifically configured to, after the step of controlling the temperature adjustment mechanism to perform the heating action at the initial heating power and increasing the heating power of the temperature adjustment mechanism, further include: when the heating power of the temperature adjusting mechanism reaches the maximum heating power and the temperature in the curing box does not reach the first temperature set value, controlling the temperature adjusting mechanism to execute heating action at the maximum heating power until the temperature in the curing box reaches the third temperature set value; wherein the third temperature setting is greater than the first temperature setting; the difference between the first temperature set value and the third temperature set value meets a preset difference threshold; and when the temperature in the curing box reaches the third temperature set value, dynamically adjusting the heating power of the temperature adjusting mechanism by adopting a PID control mode so as to enable the temperature in the curing box to reach the preset temperature range.

In one embodiment, thetemperature control module 2520 is specifically configured to control the temperature adjustment mechanism to perform a cooling operation when the temperature inside the curing box is determined to be higher than a second temperature set value, and includes: according to the second temperature set value, determining a temperature control interval when the temperature adjusting mechanism executes a refrigeration action; and dynamically adjusting the refrigerating power of the temperature adjusting mechanism by adopting a PID control mode so as to enable the temperature in the curing box to be in the temperature control interval.

In one embodiment, thetemperature control module 2520, specifically configured to when the temperature adjustment mechanism is performing the heating action and the temperature inside the curing box is higher than the second temperature set value, further includes: controlling the temperature adjusting mechanism to stop executing heating action and executing refrigerating action with preset initial refrigerating power; wherein the initial refrigeration power is less than the maximum refrigeration power of the temperature adjustment mechanism; and when the duration of the refrigeration action executed by the temperature adjusting mechanism at the initial refrigeration power reaches a preset refrigeration duration, controlling the temperature adjusting mechanism to execute the refrigeration action at the maximum refrigeration power so as to adjust the temperature in the curing box to a preset temperature range.

In one embodiment, thehumidity control module 2530, specifically configured to control the humidity adjustment mechanism to adjust the relative humidity in the curing box to a preset humidity range, includes: when the relative humidity in the curing box is judged to be lower than a first humidity set value, controlling the humidity adjusting mechanism to execute a humidifying action; and when the relative humidity in the curing box is judged to be higher than a second humidity set value, controlling the humidity adjusting mechanism to execute a dehumidifying action.

For specific limitations of the temperature and humidity control device, reference may be made to the above limitations of the temperature and humidity control method, which is not described herein again. All or part of the modules in the temperature and humidity control device can be realized by software, hardware and a combination thereof. The modules can be embedded in a hardware form or independent from a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules. It should be noted that, in the embodiment of the present application, the division of the module is schematic, and is only one logic function division, and there may be another division manner in actual implementation.

To facilitate understanding by those skilled in the art, fig. 26 also provides a temperature adjustment flow diagram.

In one embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as shown in fig. 27. The computer device includes a processor, a memory, and a network interface connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement a temperature and humidity control method.

Those skilled in the art will appreciate that the architecture shown in fig. 27 is merely a block diagram of some of the structures associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.

In one embodiment, a computer device is provided, which includes a memory and a processor, the memory storing a computer program, and the computer program, when executed by the processor, causes the processor to execute the steps of the temperature and humidity control method. Here, the steps of the temperature and humidity control method may be steps of the temperature and humidity control method in each of the above embodiments.

In one embodiment, a computer-readable storage medium is provided, which stores a computer program, and when the computer program is executed by a processor, the computer program causes the processor to execute the steps of the temperature and humidity control method. Here, the steps of the temperature and humidity control method may be steps of the temperature and humidity control method in each of the above embodiments.

It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database or other medium used in the embodiments provided herein can include at least one of non-volatile and volatile memory. Non-volatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical storage, or the like. Volatile Memory can include Random Access Memory (RAM) or external cache Memory. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM), among others.

In the description herein, references to the description of "some embodiments," "other embodiments," "desired embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic description of the above terminology may not necessarily refer to the same embodiment or example.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A temperature and humidity control method is characterized by being applied to a maintenance storage device comprising a maintenance box, and the method comprises the following steps:

acquiring the relative humidity and the temperature in the curing box;

when the relative humidity and the temperature in the curing box do not accord with the preset range, controlling a temperature adjusting mechanism to adjust the temperature in the curing box to reach the preset temperature range; the temperature adjusting mechanism is arranged on the side wall of the curing box;

when the temperature in the curing box reaches the preset temperature range, controlling a humidity adjusting mechanism to adjust the relative humidity in the curing box to a preset humidity range; the humidity adjusting mechanism is arranged on the inner wall of the curing box.

2. The temperature and humidity control method according to claim 1, wherein the controlling the temperature adjusting mechanism to adjust the temperature inside the curing box to reach a preset temperature range includes:

when the temperature in the curing box is judged to be lower than a first temperature set value, controlling the temperature adjusting mechanism to execute heating action;

and when the temperature in the curing box is judged to be higher than a second temperature set value, controlling the temperature adjusting mechanism to execute a refrigerating action.

3. The temperature and humidity control method according to claim 2, wherein when it is determined that the temperature in the curing box is lower than a first temperature set value, controlling the temperature adjustment mechanism to perform a heating operation includes:

acquiring initial heating power of the temperature adjusting mechanism; the initial heating power is less than the maximum heating power of the temperature adjusting mechanism;

controlling the temperature adjusting mechanism to execute heating action with the initial heating power, and increasing the heating power of the temperature adjusting mechanism;

when the temperature in the curing box reaches the first temperature set value, stopping increasing the heating power of the temperature adjusting mechanism, and determining the current heating power of the temperature adjusting mechanism;

and controlling the temperature adjusting mechanism to execute heating action at the current heating power.

4. The temperature/humidity control method according to claim 3, wherein after the step of controlling the temperature adjustment mechanism to perform the heating operation at the initial heating power and increasing the heating power of the temperature adjustment mechanism, the method further comprises:

when the heating power of the temperature adjusting mechanism reaches the maximum heating power and the temperature in the curing box does not reach the first temperature set value, controlling the temperature adjusting mechanism to execute heating action at the maximum heating power until the temperature in the curing box reaches the third temperature set value; wherein the third temperature setting is greater than the first temperature setting; the difference between the first temperature set value and the third temperature set value meets a preset difference threshold;

and when the temperature in the curing box reaches the third temperature set value, dynamically adjusting the heating power of the temperature adjusting mechanism by adopting a PID control mode so as to enable the temperature in the curing box to reach the preset temperature range.

5. The temperature and humidity control method according to claim 2, wherein when it is determined that the temperature in the curing box is higher than a second temperature set value, controlling the temperature adjustment mechanism to perform a cooling operation includes:

according to the second temperature set value, determining a temperature control interval when the temperature adjusting mechanism executes a refrigeration action;

and dynamically adjusting the refrigerating power of the temperature adjusting mechanism by adopting a PID control mode so as to enable the temperature in the curing box to be in the temperature control interval.

6. The temperature/humidity control method according to claim 1, further comprising, when the temperature adjustment mechanism performs the heating operation and the temperature in the curing box is higher than the second temperature set value:

controlling the temperature adjusting mechanism to stop executing heating action and executing refrigerating action with preset initial refrigerating power; wherein the initial refrigeration power is less than the maximum refrigeration power of the temperature adjustment mechanism;

and when the duration of the refrigeration action executed by the temperature adjusting mechanism at the initial refrigeration power reaches a preset refrigeration duration, controlling the temperature adjusting mechanism to execute the refrigeration action at the maximum refrigeration power so as to adjust the temperature in the curing box to a preset temperature range.

7. The temperature and humidity control method according to claim 1, wherein the controlling the humidity adjusting mechanism to adjust the relative humidity in the curing box to a preset humidity range includes:

when the relative humidity in the curing box is judged to be lower than a first humidity set value, controlling the humidity adjusting mechanism to execute a humidifying action;

and when the relative humidity in the curing box is judged to be higher than a second humidity set value, controlling the humidity adjusting mechanism to execute a dehumidifying action.

8. The utility model provides a temperature and humidity control device which characterized in that is applied to the maintenance storage device including the curing box, includes:

the acquisition module is used for acquiring the relative humidity and the temperature in the curing box;

the temperature control module is used for controlling the temperature adjusting mechanism to adjust the temperature in the curing box to reach a preset temperature range when the relative humidity and the temperature in the curing box do not accord with the preset range; the temperature adjusting mechanism is arranged on the side wall of the curing box;

the humidity control module is used for controlling the humidity adjusting mechanism to adjust the relative humidity in the curing box to a preset humidity range after the temperature in the curing box reaches the preset temperature range; the humidity adjusting mechanism is arranged on the inner wall of the curing box.

9. A maintenance storage device, characterized in that said maintenance storage device comprises:

a curing box;

the temperature adjusting mechanism is arranged on the side wall of the curing box and is used for adjusting the temperature in the curing box;

the humidity adjusting mechanism is arranged on the inner wall of the curing box and is used for adjusting the relative humidity in the curing box;

a controller electrically connected to the temperature adjustment mechanism and the humidity adjustment mechanism, the controller comprising a memory and a processor, the memory storing a computer program, the processor implementing the steps of the method of any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 1 to 7.

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