CN111973167A

Movatterモバイル変換

Info

Publication number: CN111973167A
Application number: CN202010841503.7A
Authority: CN
Inventors: 汪奎; 王德信
Original assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Current assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Priority date: 2020-08-19
Filing date: 2020-08-19
Publication date: 2020-11-24

Abstract

Translated fromChinese

本发明公开一种可穿戴设备、光学装置、光学模组及其封装方法，该封装方法包括步骤：提供一装载有元器件的基板；采用双色注塑、二次注塑或包胶工艺成型出具有透光区的盖板；将所述盖板安装在所述基板上，所述盖板朝背离所述基板的一侧凸出，且所述盖板与所述基板之间形成收容空间，所述元器件收容于所述收容空间内，形成所述光学模组。本发明盖板的成型形状可以灵活变化，盖板的外表面可以成型出平面或曲面或其他复杂曲面，进而根据设备外壳的形状来适应性调整，减少设备内部空间的浪费，有利于实现设备的小型化。并且，盖板的形状可以灵活多变，透光区设置在盖板上，透光区的形状也可以灵活多变，从而提高光路设计的灵活性，且工艺成本低。

The invention discloses a wearable device, an optical device, an optical module and an encapsulation method thereof. The encapsulation method comprises the steps of: providing a substrate loaded with components; using two-color injection molding, secondary injection molding or encapsulation process to form a transparent The cover plate of the optical zone; the cover plate is installed on the base plate, the cover plate protrudes toward the side away from the base plate, and a receiving space is formed between the cover plate and the base plate, and the The components are accommodated in the accommodating space to form the optical module. The molding shape of the cover plate of the present invention can be flexibly changed, and the outer surface of the cover plate can be formed into a plane or a curved surface or other complex curved surfaces, and then can be adaptively adjusted according to the shape of the equipment shell, thereby reducing the waste of the internal space of the equipment, which is conducive to realizing the miniaturization. In addition, the shape of the cover plate can be flexibly changed, the light-transmitting area is arranged on the cover plate, and the shape of the light-transmitting area can also be flexibly changed, thereby improving the flexibility of optical path design, and the process cost is low.

Description

Translated fromChinese

可穿戴设备、光学装置、光学模组及其封装方法Wearable device, optical device, optical module and packaging method thereof

技术领域technical field

本发明涉及电子设备技术领域，特别涉及一种可穿戴设备、光学装置、光学模组及其封装方法。The present invention relates to the technical field of electronic devices, in particular to a wearable device, an optical device, an optical module and a packaging method thereof.

背景技术Background technique

随着人们健康意识的不断增强，越来越多的智能电子设备，比如手环、手表选择在集成光学装置，比如心率传感器，心率传感器依据PPG原理测量用户的心率和血氧浓度。业内一般是通过灌封胶或贴装玻璃盖板的方式对光学模组进行封装，在应用到整机中时，往往还需要在设备的外壳上再进行开窗设计。但灌封胶或贴装玻璃盖板的方式存在以下问题：(1)光学模组的上表面一般为平面，不能很好地适应设备外壳为曲面时的情况，会造成设备内部空间的浪费；(2)光学模组上的透光体形状单一、光路设计的灵活度较小，复杂形状的透光体结构设计则工艺成本极高；(3)由于装配时无法完全消除光学模组与外壳窗口之间的距离，LED发射的光有一部分会被窗口的下表面反射回PD上，形成光串扰，影响测量信号的准确性。With the continuous enhancement of people's health awareness, more and more smart electronic devices, such as wristbands and watches, choose to integrate optical devices, such as heart rate sensors, which measure the user's heart rate and blood oxygen concentration according to the PPG principle. In the industry, the optical module is generally packaged by potting glue or mounting glass cover. When it is applied to the whole machine, it is often necessary to open the window design on the shell of the device. However, there are the following problems in the way of potting glue or mounting glass cover: (1) The upper surface of the optical module is generally flat, which cannot well adapt to the situation when the equipment shell is curved, which will cause a waste of the internal space of the equipment; (2) The shape of the light-transmitting body on the optical module is single, and the flexibility of the optical path design is small, and the structure design of the light-transmitting body with complex shape is very expensive; (3) Since the optical module and the shell cannot be completely eliminated during assembly Due to the distance between the windows, part of the light emitted by the LED will be reflected back to the PD by the lower surface of the window, resulting in optical crosstalk and affecting the accuracy of the measurement signal.

发明内容SUMMARY OF THE INVENTION

本发明的主要目的是提出一种可穿戴设备、光学装置、光学模组及其封装方法，旨在解决在光学模组浪费设备空间以及光路设计灵活度小的技术问题。The main purpose of the present invention is to propose a wearable device, an optical device, an optical module and a packaging method thereof, aiming to solve the technical problems of wasting equipment space and low flexibility in optical path design in the optical module.

为实现上述目的，本发明提出一种光学模组的封装方法，所述光学模组的封装方法包括如下步骤：In order to achieve the above object, the present invention provides a packaging method for an optical module, and the packaging method for the optical module includes the following steps:

提供一装载有元器件的基板；providing a substrate loaded with components;

采用双色注塑、二次注塑或包胶工艺成型出具有透光区的盖板；A cover plate with a light-transmitting area is formed by two-color injection molding, secondary injection molding or overmolding process;

将所述盖板安装在所述基板上，所述盖板朝背离所述基板的一侧凸出，且所述盖板与所述基板之间形成收容空间，所述元器件收容于所述收容空间内，形成所述光学模组。The cover plate is installed on the base plate, the cover plate protrudes toward the side away from the base plate, and a receiving space is formed between the cover plate and the base plate, and the components are accommodated in the base plate In the accommodating space, the optical module is formed.

优选地，所述盖板包括遮光板和透光块，所述采用双色注塑、二次注塑或包胶工艺成型出具有透光区的盖板的步骤包括：Preferably, the cover plate includes a light-shielding plate and a light-transmitting block, and the step of forming a cover plate with a light-transmitting area by two-color injection molding, secondary injection molding or overmolding process includes:

采用双色注塑、二次注塑或包胶工艺一体成型出所述遮光板和所述透光块；The light-shielding plate and the light-transmitting block are integrally formed by two-color injection molding, secondary injection molding or overmolding process;

所述将所述盖板安装在所述基板上，所述盖板朝背离所述基板的一侧凸出，且所述盖板与所述基板之间形成收容空间，所述元器件收容于所述收容空间内，形成所述光学模组的步骤包括：The cover plate is installed on the base plate, the cover plate protrudes toward the side away from the base plate, and a receiving space is formed between the cover plate and the base plate, and the components are accommodated in the base plate. In the accommodating space, the steps of forming the optical module include:

将所述遮光板的一端安装在所述基板上，所述遮光板的另一端朝背离所述基板的一侧凸出，所述遮光板围设成所述收容空间，所述收容空间背离所述基板的一侧具有开口，所述透光块安装在所述开口处并将所述开口封堵，所述透光块形成所述透光区。One end of the light-shielding plate is installed on the base plate, the other end of the light-shielding plate protrudes toward the side away from the base plate, and the light-shielding plate surrounds the accommodation space, and the accommodation space is away from the base plate. One side of the substrate has an opening, the light-transmitting block is installed at the opening and blocks the opening, and the light-transmitting block forms the light-transmitting area.

优选地，所述基板对应所述收容空间的位置开设有与所述收容空间连通的通气孔；Preferably, the base plate is provided with a ventilation hole communicating with the accommodating space at a position corresponding to the accommodating space;

所述将所述遮光板的一端安装在所述基板上，所述遮光板的另一端朝背离所述基板的一侧凸出，所述遮光板围设成所述收容空间，所述收容空间背离所述基板的一侧具有开口，所述透光块安装在所述开口处并将所述开口封堵，所述透光块形成所述透光区的步骤包括：One end of the light-shielding plate is installed on the base plate, and the other end of the light-shielding plate protrudes toward the side away from the base plate. The side away from the substrate has an opening, the light-transmitting block is installed at the opening and blocks the opening, and the step of forming the light-transmitting area by the light-transmitting block includes:

将所述遮光板的一端通过粘接剂粘接在所述基板上，所述通气孔将所述收容空间与所述空腔连通；One end of the shading plate is bonded to the base plate through an adhesive, and the ventilation hole communicates the accommodation space with the cavity;

对所述粘接剂进行烘烤固化处理。The adhesive is subjected to a baking curing process.

优选地，所述对所述光学模组进行烘烤，以使所述粘接剂固化的步骤之后，还包括：Preferably, after the step of baking the optical module to cure the adhesive, the method further includes:

向所述通气孔内填充粘胶；filling the vent hole with adhesive;

对所述粘胶进行照射固化处理，以使所述粘胶将所述通气孔密封。The adhesive is subjected to irradiation curing treatment, so that the adhesive seals the vent hole.

优选地，所述透光块面向所述收容空间的一面呈凹面、凸面或平面。Preferably, a side of the light-transmitting block facing the accommodating space is concave, convex or flat.

优选地，所述光学模组具有多个间隔布置的所述收容空间，任意相邻的两个所述收容空间之间通过所述遮光板隔开，各所述收容空间对应设置有一个所述透光块；所述元器件包括发光元件和收光元件，所述发光元件和所述收光元件分设于不同的所述收容空间内。Preferably, the optical module has a plurality of the accommodation spaces arranged at intervals, any two adjacent accommodation spaces are separated by the shading plate, and each accommodation space is provided with one of the accommodation spaces correspondingly. A light-transmitting block; the component includes a light-emitting element and a light-receiving element, and the light-emitting element and the light-receiving element are respectively arranged in different receiving spaces.

优选地，所述盖板呈矩形结构或圆形结构；Preferably, the cover plate has a rectangular structure or a circular structure;

当所述盖板呈矩形结构时，多个所述收容空间沿所述盖板的长度方向间隔布置，任意相邻的两个所述收容空间中，其中一个所述收容空间内收容有发光元件，另一个所述收容空间内收容有收光元件；When the cover plate has a rectangular structure, a plurality of the receiving spaces are arranged at intervals along the length direction of the cover plate, and in any two adjacent receiving spaces, one of the receiving spaces houses a light-emitting element , and another said receiving space accommodates a light-receiving element;

当所述盖板呈圆形结构时，多个所述收容空间中，其中一个所述收容空间收容有所述发光元件且处于所述盖板中心位置，其余所述收容空间均收容有所述收光元件且围绕处于所述盖板中心位置的所述收容空间间隔布置。When the cover plate has a circular structure, among a plurality of the receiving spaces, one of the receiving spaces accommodates the light-emitting element and is located at the center of the cover plate, and the rest of the receiving spaces all contain the light-emitting element. The light receiving elements are arranged at intervals around the receiving space at the center of the cover plate.

本发明还提出一种光学模组，所述光学模组采用如上所述的光学模组的封装方法制得。The present invention also provides an optical module. The optical module is prepared by using the above-mentioned encapsulation method of the optical module.

本发明还提出一种光学装置，所述光学装置包括外壳和如上所述的光学模组；The present invention also provides an optical device, the optical device includes a housing and the above-mentioned optical module;

所述外壳内具有空腔，所述外壳开设有与所述空腔连通的窗口；The casing has a cavity, and the casing is provided with a window communicating with the cavity;

所述光学模组收容于所述空腔内，且所述盖板背离所述基板的一侧嵌设于所述窗口处，以将所述窗口封堵，所述透光区位于对应所述窗口的位置。The optical module is accommodated in the cavity, and a side of the cover plate away from the substrate is embedded at the window to block the window, and the light-transmitting area is located corresponding to the position of the window.

优选地，所述外壳的外表面与所述盖板上背离所述空腔的表面平滑过渡连接成一体的表面。Preferably, the outer surface of the casing and the surface of the cover plate facing away from the cavity are smoothly transitioned into an integral surface.

本发明还提出一种可穿戴设备，所述可穿戴设备包括如上所述的光学装置。The present invention also provides a wearable device, the wearable device includes the above-mentioned optical device.

本发明光学模组的封装方法中，通过提供一装载有元器件的基板，采用双色注塑、二次注塑或包胶工艺成型出具有透光区的盖板，并将盖板安装在基板上，盖板朝背离基板的一侧凸出，且盖板与基板之间形成收容空间，元器件收容于收容空间内，形成光学模组。由于光学模组的盖板采用双色注塑、二次注塑或包胶工艺成型，其成型形状可以灵活变化，盖板的外表面可以成型出平面或曲面或其他复杂曲面，即，盖板的外表面可以根据设备外壳的形状来适应性调整，减少设备内部空间的浪费，有利于实现设备的小型化，尤其对于可穿戴设备为TWS耳机而言，小型化优势更为明显。并且，盖板的形状可以灵活多变，透光区设置在盖板上，透光区的形状也可以灵活多变，从而提高光路设计的灵活性，且工艺成本低。In the packaging method of the optical module of the present invention, by providing a substrate loaded with components, a cover plate with a light-transmitting area is formed by two-color injection molding, secondary injection molding or overmolding process, and the cover plate is installed on the substrate, The cover plate protrudes toward the side away from the base plate, and an accommodation space is formed between the cover plate and the base plate, and the components are accommodated in the accommodation space to form an optical module. Since the cover plate of the optical module is formed by two-color injection molding, secondary injection molding or overmolding process, its molding shape can be flexibly changed, and the outer surface of the cover plate can be formed into a plane or curved surface or other complex curved surfaces, that is, the outer surface of the cover plate It can be adaptively adjusted according to the shape of the device shell, reducing the waste of the internal space of the device, which is conducive to realizing the miniaturization of the device, especially for the wearable device which is a TWS earphone, the miniaturization advantage is more obvious. In addition, the shape of the cover plate can be flexibly changed, the light-transmitting area is arranged on the cover plate, and the shape of the light-transmitting area can also be flexibly changed, thereby improving the flexibility of the optical path design, and the process cost is low.

附图说明Description of drawings

为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained according to the structures shown in these drawings without creative efforts.

图1为本发明光学模组的封装方法第一实施例的流程示意图；1 is a schematic flowchart of a first embodiment of a packaging method for an optical module of the present invention;

图2为本发明光学模组的封装方法第二实施例的流程示意图；2 is a schematic flowchart of a second embodiment of a packaging method for an optical module of the present invention;

图3为本发明光学模组的封装方法中步骤S300的细化流程示意图；FIG. 3 is a schematic flow chart of the refinement of step S300 in the packaging method of the optical module of the present invention;

图4为本发明一实施例光学模组的立体示意图；4 is a three-dimensional schematic diagram of an optical module according to an embodiment of the present invention;

图5为本发明一实施例光学模组中省略基板的立体示意图；5 is a three-dimensional schematic diagram of an optical module without a substrate according to an embodiment of the present invention;

图6为本发明一实施例光学模组的截面示意图；6 is a schematic cross-sectional view of an optical module according to an embodiment of the present invention;

图7为本发明另一实施例光学模组的截面示意图；7 is a schematic cross-sectional view of an optical module according to another embodiment of the present invention;

图8为本发明又一实施例光学模组的截面示意图；8 is a schematic cross-sectional view of an optical module according to another embodiment of the present invention;

图9为本发明另一实施例光学模组的俯视示意图；9 is a schematic top view of an optical module according to another embodiment of the present invention;

图10为本发明一实施例光学模组中功能芯片位于收容空间外的截面示意图；10 is a schematic cross-sectional view of a functional chip in an optical module located outside the accommodation space according to an embodiment of the present invention;

图11为本发明一实施例光学模组中功能芯片位于收容空间内的截面示意图；11 is a schematic cross-sectional view of a functional chip in an optical module located in an accommodation space according to an embodiment of the present invention;

图12为本发明一实施例光学模组另一截面示意图；12 is another cross-sectional schematic diagram of an optical module according to an embodiment of the present invention;

图13为本发明一实施例光学装置的截面示意图；13 is a schematic cross-sectional view of an optical device according to an embodiment of the present invention;

图14为本发明一实施例光学装置设置防刮层的截面示意图；14 is a schematic cross-sectional view of an optical device provided with a scratch-resistant layer according to an embodiment of the present invention;

图15为本发明一实施例光学装置中光学模组与外壳的装配立体图。15 is an assembly perspective view of an optical module and a housing in an optical device according to an embodiment of the present invention.

附图标号说明：Description of reference numbers:

本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。The realization, functional characteristics and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments.

具体实施方式Detailed ways

下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

需要说明，若本发明实施例中有涉及方向性指示(诸如上、下、左、右、前、后……)，则该方向性指示仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。It should be noted that if there are directional indications (such as up, down, left, right, front, back, etc.) involved in the embodiments of the present invention, the directional indications are only used to explain a certain posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly.

另外，若本发明实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围之内。In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for the purpose of description, and should not be construed as indicating or implying Its relative importance or implicitly indicates the number of technical features indicated. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of such technical solutions does not exist. , is not within the scope of protection required by the present invention.

本发明中对“上”、“下”、“左”、“右”等方位的描述以图6和图13所示的方位为基准，仅用于解释在图6和图13所示姿态下各部件之间的相对位置关系，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。The descriptions of orientations such as "up", "down", "left" and "right" in the present invention are based on the orientations shown in FIG. 6 and FIG. 13 , and are only used to explain the orientations shown in FIGS. 6 and 13 The relative positional relationship between the components, if the specific posture changes, the directional indication also changes accordingly.

本发明提出一种光学模组的封装方法。The present invention provides a packaging method for an optical module.

参照图1，为本发明光学模组的封装方法第一实施例的流程示意图，该方法包括以下步骤：Referring to FIG. 1, it is a schematic flowchart of a first embodiment of a packaging method for an optical module according to the present invention, and the method includes the following steps:

步骤S100，提供一装载有元器件的基板；Step S100, providing a substrate loaded with components;

参照图4至图8，基板21的下表面装载有元器件22，可以理解地，元器件22可用于收发光线。本实施例的基板21可为强度较高的有机基板21或陶瓷基板21，也可为PCB板。元器件22经过研磨、划切后贴片到基板21上，并与基板21打线键合。4 to 8 ,components 22 are mounted on the lower surface of thesubstrate 21 , and it is understood that thecomponents 22 can be used to transmit and receive light. Thesubstrate 21 in this embodiment can be anorganic substrate 21 or aceramic substrate 21 with high strength, and can also be a PCB board. After grinding and dicing, thecomponents 22 are mounted on thesubstrate 21 and bonded with thesubstrate 21 by wire bonding.

步骤S200，采用双色注塑、二次注塑或包胶工艺成型出具有透光区的盖板；Step S200, adopting two-color injection molding, secondary injection molding or overmolding process to form a cover plate with a light-transmitting area;

具体地，本实施例可以采用PA(Polyamide，尼龙)、ABS(Acrylonitrile ButadieneStyrene，丙烯腈-丁二烯-苯乙烯共聚物)、PMMC(polymethyl methacrylate，聚甲基丙烯酸甲酯)、PC(Polycarbonate，聚碳酸酯)等材料，通过双色注塑、二次注塑或包胶工艺成型出盖板23，盖板23上具有透光区，可以理解地，透光区的材质为PMMC或PC等，光线可穿过透光区。盖板23采用双色注塑、二次注塑或包胶工艺一体成型，不仅省略了装配步骤，易于制作，提高了生产效率，且避免了装配误差，提高成品的一致性，有利于提高测量算法的精准度。Specifically, in this embodiment, PA (Polyamide, nylon), ABS (Acrylonitrile Butadiene Styrene, acrylonitrile-butadiene-styrene copolymer), PMMC (polymethyl methacrylate, polymethyl methacrylate), PC (Polycarbonate, Polycarbonate) and other materials, thecover plate 23 is formed by two-color injection molding, secondary injection molding or overmolding process, and thecover plate 23 has a light-transmitting area. through the light-transmitting area. Thecover plate 23 is integrally formed by two-color injection molding, secondary injection molding or overmolding process, which not only omits assembly steps, is easy to manufacture, improves production efficiency, but also avoids assembly errors, improves the consistency of finished products, and is conducive to improving the accuracy of measurement algorithms Spend.

并且，盖板23采用双色注塑、二次注塑或包胶工艺成型，其成型形状可以灵活变化，如图4至图8所示，盖板23的外表面可以成型出平面，如图12和图15所示，盖板23的外表面可以成型出曲面，在其他实施例中，盖板23的外表面还可以成型出其他复杂形状，使得盖板23的外表面可以根据设备外壳10的形状来适应性调整，减少设备内部空间的浪费，有利于实现设备的小型化，尤其对于可穿戴设备为TWS耳机而言，小型化优势更为明显。并且，盖板23的形状可以灵活多变，透光区设置在盖板23上，透光区的形状也可以灵活多变，从而提高光路设计的灵活性，且工艺成本低。In addition, thecover plate 23 is formed by two-color injection molding, secondary injection molding or overmolding process, and its molding shape can be flexibly changed. As shown in FIGS. 4 to 8 , the outer surface of thecover plate 23 can be formed into a flat surface, as shown in FIGS. 12 and 12 As shown in 15, the outer surface of thecover plate 23 can be formed into a curved surface. In other embodiments, the outer surface of thecover plate 23 can also be formed into other complex shapes, so that the outer surface of thecover plate 23 can be shaped according to the shape of thedevice housing 10. The adaptive adjustment reduces the waste of the internal space of the device, which is conducive to the miniaturization of the device, especially for the wearable device that is a TWS headset, the miniaturization advantage is more obvious. In addition, the shape of thecover plate 23 can be flexibly changed, the light-transmitting area is arranged on thecover plate 23, and the shape of the light-transmitting area can also be flexibly changed, thereby improving the flexibility of the optical path design, and the process cost is low.

步骤S300，将所述盖板安装在所述基板上，所述盖板朝背离所述基板的一侧凸出，且所述盖板与所述基板之间形成收容空间，所述元器件收容于所述收容空间内，形成所述光学模组。Step S300, the cover plate is installed on the base plate, the cover plate protrudes toward the side away from the base plate, and a receiving space is formed between the cover plate and the base plate, and the components are accommodated In the receiving space, the optical module is formed.

如图4至图14所示，将盖板23盖设在基板21的底部，且盖板23的下侧向下凸出，盖板23与基板21之间形成收容空间24，元器件22收容于收容空间24内，形成光学模组20。As shown in FIG. 4 to FIG. 14 , thecover plate 23 is placed on the bottom of thebase plate 21 , and the lower side of thecover plate 23 protrudes downward. A receivingspace 24 is formed between thecover plate 23 and thebase plate 21 , and thecomponents 22 are accommodated In the receivingspace 24, theoptical module 20 is formed.

本实施例的光学模组20可应用在可穿戴设备上，比如应用在手环、手表或耳机上，当手环或手表佩戴在人体手腕上后，盖板23的底部位于可穿戴设备的内侧，即面向人体皮肤侧一侧。可以理解地，光学模组20通过光电投射测量法对人体心率进行监测的，即通过元器件22，比如LED灯发出光线来照射皮肤，由于血液对特定波长的光有吸收作用，每次心脏泵血时，该波长都会被大量吸收，以此就可以确定心跳，实现对人体心率的监测。对人体血氧的监测与心率监测相似，在此不再赘述。本实施例的盖板23具有透光区，元器件22发出的光线通过透光区照射人体皮肤，经过人体皮肤反射的光线通过透光区并被元器件22接收，从而实现光学模组20对人体心率、血氧的监测。Theoptical module 20 of this embodiment can be applied to a wearable device, such as a wristband, a watch or an earphone. When the wristband or watch is worn on the human wrist, the bottom of thecover plate 23 is located inside the wearable device. , that is, the side facing the human skin. Understandably, theoptical module 20 monitors the human heart rate through photoelectric projection measurement, that is, thecomponents 22, such as LED lights, emit light to illuminate the skin. Since blood absorbs light of a specific wavelength, each time the heart pump When blood is absorbed, this wavelength will be absorbed in large quantities, so that the heartbeat can be determined and the heart rate of the human body can be monitored. The monitoring of human blood oxygen is similar to the monitoring of heart rate, and will not be repeated here. Thecover plate 23 of this embodiment has a light-transmitting area, the light emitted by thecomponents 22 passes through the light-transmitting area to illuminate the human skin, and the light reflected by the human skin passes through the light-transmitting area and is received by thecomponents 22 , so that theoptical module 20 can pair the Monitoring of human heart rate and blood oxygen.

本实施例光学模组20的封装方法中，通过提供一装载有元器件22的基板21，采用双色注塑、二次注塑或包胶工艺成型出具有透光区的盖板23，并将盖板23安装在基板21上，盖板23朝背离基板21的一侧凸出，且盖板23与基板21之间形成收容空间24，元器件22收容于收容空间24内，形成光学模组20。由于光学模组20的盖板23采用双色注塑、二次注塑或包胶工艺成型，其成型形状可以灵活变化，盖板23的外表面可以成型出平面或曲面或其他复杂曲面，即，盖板23的外表面可以根据设备外壳10的形状来适应性调整，减少设备内部空间的浪费，有利于实现设备的小型化，尤其对于可穿戴设备为TWS耳机而言，小型化优势更为明显。并且，盖板23的形状可以灵活多变，透光区设置在盖板23上，透光区的形状也可以灵活多变，从而提高光路设计的灵活性，且工艺成本低。In the packaging method of theoptical module 20 in this embodiment, by providing asubstrate 21 loaded withcomponents 22, acover plate 23 having a light-transmitting area is formed by two-color injection molding, secondary injection molding or overmolding process, and the cover plate is 23 is mounted on thebase plate 21 , thecover plate 23 protrudes toward the side away from thebase plate 21 , and anaccommodation space 24 is formed between thecover plate 23 and thebase plate 21 , and thecomponents 22 are accommodated in theaccommodation space 24 to form theoptical module 20 . Since thecover plate 23 of theoptical module 20 is formed by two-color injection molding, secondary injection molding or overmolding process, its molding shape can be flexibly changed, and the outer surface of thecover plate 23 can be formed into a plane or curved surface or other complex curved surfaces, that is, the cover plate The outer surface of 23 can be adaptively adjusted according to the shape of thedevice casing 10, which reduces the waste of the internal space of the device and is conducive to realizing the miniaturization of the device, especially for the wearable device being a TWS earphone, the miniaturization advantage is more obvious. In addition, the shape of thecover plate 23 can be flexibly changed, the light-transmitting area is arranged on thecover plate 23, and the shape of the light-transmitting area can also be flexibly changed, thereby improving the flexibility of the optical path design, and the process cost is low.

进一步的，参照图2，为本发明光学模组的封装方法第二实施例的流程示意图，基于上述第一实施例，所述步骤S200包括：Further, referring to FIG. 2 , it is a schematic flowchart of the second embodiment of the packaging method of the optical module according to the present invention. Based on the above-mentioned first embodiment, the step S200 includes:

步骤S201，采用双色注塑、二次注塑或包胶工艺一体成型出所述遮光板和所述透光块；Step S201, adopting two-color injection molding, secondary injection molding, or overmolding process to integrally form the light-shielding plate and the light-transmitting block;

具体地，本实施例的遮光板231可以采用PA、ABS等材料，透光块232可以采用PMMC、PC等材料，盖板23的遮光板231与透光块232采用双色注塑、二次注塑或包胶工艺一体成型，不仅省略了装配步骤，易于制作，提高了生产效率，且避免了装配误差，提高成品的一致性，有利于提高测量算法的精准度。Specifically, the light-shieldingplate 231 of this embodiment can be made of materials such as PA, ABS, the light-transmittingblock 232 can be made of materials such as PMMC, PC, and the like. The encapsulation process is integrally formed, which not only omits assembly steps, is easy to manufacture, improves production efficiency, but also avoids assembly errors, improves the consistency of finished products, and is conducive to improving the accuracy of measurement algorithms.

所述步骤S300包括：The step S300 includes:

步骤S301，将所述遮光板的一端安装在所述基板上，所述遮光板的另一端朝背离所述基板的一侧凸出，所述遮光板围设成所述收容空间，所述收容空间背离所述基板的一侧具有开口，所述透光块安装在所述开口处并将所述开口封堵，所述透光块形成所述透光区。Step S301, one end of the light shielding plate is installed on the base plate, the other end of the light shielding plate protrudes toward the side away from the base plate, and the light shielding plate is enclosed to form the receiving space, and the receiving space is formed by the light shielding plate. A side of the space away from the substrate has an opening, the light-transmitting block is installed at the opening and blocks the opening, and the light-transmitting block forms the light-transmitting area.

遮光板231与透光块232采用双色注塑、二次注塑或包胶工艺一体成型，使得盖板23为一体成型制件。盖板23与基板21装配过程中，通过将盖板23的遮光板231安装在基板21上即可。具体地，将盖板23的上端安装在基板21上，遮光板231的下端向下凸出，遮光板231围成收容空间24，收容空间24的底部具有开口241。并将透光块232安装在开口241处，通过透光块232将开口241封堵，且透光块232形成透光区，方便透光，实现收容空间24内光线收发。The light-shieldingplate 231 and the light-transmittingblock 232 are integrally formed by two-color injection molding, secondary injection molding or plastic wrapping process, so that thecover plate 23 is integrally formed. In the process of assembling thecover plate 23 and thebase plate 21 , thelight shielding plate 231 of thecover plate 23 can be installed on thebase plate 21 . Specifically, the upper end of thecover plate 23 is mounted on thebase plate 21 , the lower end of theshading plate 231 protrudes downward, theshading plate 231 encloses a receivingspace 24 , and the bottom of the receivingspace 24 has anopening 241 . The light-transmittingblock 232 is installed at theopening 241 , theopening 241 is blocked by the light-transmittingblock 232 , and the light-transmittingblock 232 forms a light-transmitting area, which facilitates light transmission and realizes light transmission and reception in the receivingspace 24 .

进一步的，基板21对应收容空间24的位置开设有通气孔211，通气孔211与收容空间24连通；所述步骤S301包括：Further, thebase plate 21 is provided with aventilation hole 211 at a position corresponding to theaccommodating space 24, and theventilation hole 211 is communicated with theaccommodating space 24; the step S301 includes:

步骤S3011，将所述遮光板的一端通过粘接剂粘接在所述基板上，所述通气孔将所述收容空间与所述空腔连通；In step S3011, one end of the light shielding plate is bonded to the substrate through an adhesive, and the ventilation hole communicates the accommodation space with the cavity;

步骤S3012，对所述粘接剂进行烘烤固化处理。Step S3012, baking and curing the adhesive is performed.

本实施例中，遮光板231的上端通过粘接剂30粘接在基板21底部，基板21对应收容空间24的位置开设有通气孔211，通气孔211与收容空间24连通。具体地，一体成型的盖板23，依靠划胶及SMT工艺贴装到基板21上，并经过高温烘烤固化处理，将盖板23的遮光板231与基板21之间的粘接剂30固化，提高盖板23与基板21的装配稳定性。而为了在高温固化处理过程中平衡收容空间24与设备空腔11内的气压，防止出现因气体膨胀导致盖板23脱离基板21情况，本实施例在基板21上与收容空间24对应的位置开设通气孔211，通气孔211连通收容空间24，具体地，通气孔211连通收容空间24与设备空腔11，可在高温固化处理过程中实现收容空间24与设备空腔11内的气压的平衡。In this embodiment, the upper end of thelight shielding plate 231 is bonded to the bottom of thebase plate 21 by the adhesive 30 . Specifically, the integrally formedcover plate 23 is mounted on thesubstrate 21 by means of scribing and SMT processes, and is subjected to high temperature baking and curing treatment to cure the adhesive 30 between thelight shielding plate 231 of thecover plate 23 and thesubstrate 21 , to improve the assembly stability of thecover plate 23 and thebase plate 21 . In order to balance the air pressure in theaccommodating space 24 and theequipment cavity 11 during the high-temperature curing process, and prevent thecover plate 23 from being separated from thesubstrate 21 due to gas expansion, in this embodiment, a position on thesubstrate 21 corresponding to theaccommodating space 24 is provided. Theventilation hole 211 communicates with theaccommodating space 24 . Specifically, theventilation hole 211 communicates with theaccommodating space 24 and theequipment cavity 11 , which can realize the air pressure balance between theaccommodating space 24 and theequipment cavity 11 during the high temperature curing process.

进一步的，在所述步骤S3012之后，还包括：Further, after the step S3012, it also includes:

步骤S3013，向所述通气孔内填充粘胶；Step S3013, filling the vent hole with adhesive;

步骤S3014，对所述粘胶进行照射固化处理，以使所述粘胶将所述通气孔密封。Step S3014, performing irradiation curing treatment on the adhesive, so that the adhesive seals the vent hole.

在高温烘烤固化处理完成后，从基板21外侧向通气孔211内注入粘胶，粘胶可选用UV胶，UV胶将通气孔211密封，保证盖板23与基板21的装配密封性，防止出现漏光现象。可以理解地，粘胶选用UV胶，在将UV胶填充进通气孔211后进行UV照射固化处理，使得粘胶将通风孔完全密封，优化密封效果。After the high-temperature baking and curing process is completed, the adhesive is injected into thevent hole 211 from the outside of thesubstrate 21. The adhesive can be UV adhesive. Light leakage occurs. It can be understood that UV glue is selected for the adhesive, and UV curing treatment is performed after filling the UV glue into the vent holes 211 , so that the adhesive can completely seal the vent holes and optimize the sealing effect.

本实施例中，由于遮光板231与透光块232采用双色注塑、二次注塑或包胶工艺一体成型，使得透光块232可以成型出复杂的结构，透光块232的形状灵活多变，透明块面向收容空间24的一面呈凹面、凸面或平面。如图4至图6所示，本一实施例中，透光块232面向收容空间24的一面呈平面，即，透光块232的上表面呈平面，使得透光块232的厚度均匀一致，收发光线可以垂直入射或出射；如图7所示，在另一实施例中，透光块232的上表面呈凹面，使得透光块232的中间区域较薄，两端区域较厚，对收发光线产生发散的作用；如图8所示，在又一实施例中，透光块232的上表面呈凸面，使得透光块232的中间区域较厚，两端区域较薄，对收发光线产生汇聚的作用，以通过透光块232形状的多变，提高光路设计的灵活性。In this embodiment, since the light-shieldingplate 231 and the light-transmittingblock 232 are integrally formed by two-color injection molding, secondary injection molding or overmolding process, the light-transmittingblock 232 can be formed into a complex structure, and the shape of the light-transmittingblock 232 is flexible and changeable. The side of the transparent block facing the receivingspace 24 is concave, convex or flat. As shown in FIGS. 4 to 6 , in this embodiment, the side of the light-transmittingblock 232 facing the receivingspace 24 is flat, that is, the upper surface of the light-transmittingblock 232 is flat, so that the thickness of the light-transmittingblock 232 is uniform. Transmitting and receiving light can be incident or exiting vertically; as shown in FIG. 7 , in another embodiment, the upper surface of the light-transmittingblock 232 is concave, so that the middle area of the light-transmittingblock 232 is thin, and the two end areas are thicker, which is not suitable for transmitting and receiving light. As shown in FIG. 8 , in another embodiment, the upper surface of the light-transmittingblock 232 is convex, so that the middle area of the light-transmittingblock 232 is thicker, and the two end areas are thinner, which has a negative impact on the transmission and reception of light. The function of convergence is to improve the flexibility of the optical path design through the change of the shape of the light-transmittingblock 232 .

本实施例中，光学模组20具有多个间隔布置的收容空间24，任意相邻的两个收容空间24之间通过遮光板231隔开，各收容空间24对应设置有一个透光块232；元器件22包括发光元件221和收光元件222，发光元件221和收光元件222分设于不同的收容空间24内。本实施例的发光元件221为LED灯，收光元件222为PD，LED等和收光元件222分设于不同的收容空间24内。In this embodiment, theoptical module 20 has a plurality ofaccommodating spaces 24 arranged at intervals, any two adjacentaccommodating spaces 24 are separated by ashading plate 231, and eachaccommodating space 24 is correspondingly provided with a light-transmittingblock 232; Thecomponent 22 includes a light-emittingelement 221 and a light-receivingelement 222 , and the light-emittingelement 221 and the light-receivingelement 222 are respectively disposed indifferent receiving spaces 24 . The light-emittingelement 221 of the present embodiment is an LED lamp, and the light-receivingelement 222 is a PD. The LED and the light-receivingelement 222 are respectively disposed indifferent receiving spaces 24 .

如图4至图8所示，收容空间24的数量为四个，四个收容空间24沿左右方向间隔布置，从左到右分别为第一、第二、第三、第四个收容空间24，其中，第二个收容空间24和第四个收容空间24内均设置有发光元件221，比如LED灯，第一个收容空间24和第三个收容空间24内均设置有收光元件222，比如PD，从LED灯射出的光线照射人体皮肤，经反射后被与该LED灯相邻的PD接收。As shown in FIG. 4 to FIG. 8 , the number of the receivingspaces 24 is four, and the four receivingspaces 24 are arranged at intervals along the left-right direction, and from left to right are the first, second, third and fourth receivingspaces 24 respectively. , wherein the secondaccommodating space 24 and the fourthaccommodating space 24 are provided with light-emittingelements 221, such as LED lights, and the firstaccommodating space 24 and the thirdaccommodating space 24 are both provided with light-receivingelements 222, For example, a PD, the light emitted from the LED lamp irradiates the human skin, and is received by the PD adjacent to the LED lamp after reflection.

另外，透光块232将收容空间24的开口241封堵，任意相邻的两个收容空间24之间通过遮光板231隔开，使得透光块232的外周被遮光板231包围，遮光板231被透光块232完全分割，两者不会发生光串扰情况，提高了信噪比，提高测量信号的准确性。In addition, the light-transmittingblock 232 blocks theopening 241 of the receivingspace 24, and any twoadjacent receiving spaces 24 are separated by the light-shieldingplate 231, so that the outer periphery of the light-transmittingblock 232 is surrounded by the light-shieldingplate 231, and the light-shieldingplate 231 Completely divided by the light-transmittingblock 232, the optical crosstalk will not occur between the two, which improves the signal-to-noise ratio and improves the accuracy of the measurement signal.

进一步地，盖板23呈矩形结构或圆形结构；当盖板23呈矩形结构时，多个收容空间24沿盖板23的长度方向间隔布置，任意相邻的两个收容空间24中，其中一个收容空间24内收容有发光元件221，另一个收容空间24内收容有收光元件222；当盖板23呈圆形结构时，多个收容空间24中，其中一个收容空间24收容有发光元件221且处于盖板23中心位置，其余收容空间24均收容有收光元件222且围绕处于盖板23中心位置的收容空间24间隔布置。Further, thecover plate 23 is in a rectangular structure or a circular structure; when thecover plate 23 is in a rectangular structure, a plurality ofaccommodating spaces 24 are arranged at intervals along the length direction of thecover plate 23, and in any two adjacentaccommodating spaces 24, wherein Oneaccommodating space 24 accommodates the light-emittingelement 221 , and the otheraccommodating space 24 accommodates the light-receivingelement 222 ; when thecover plate 23 has a circular structure, one of the plurality ofaccommodating spaces 24 accommodates the light-emittingelement 24 . 221 and is located at the center of thecover plate 23 , and the remainingaccommodation spaces 24 accommodate light-receivingelements 222 and are arranged at intervals around theaccommodation space 24 at the center position of thecover plate 23 .

如图4至图8所示，在一实施例中，盖板23呈矩形结构，盖板23的长度方向为左右方向，多个收容空间24沿左右方向间隔布置，任意相邻的两个收容空间24中，其中一个收容空间24收容有LED灯，另外一个收容空间24收容有PD，从LED灯射出的光线照射人体皮肤，经反射后被与该LED灯相邻的PD接收。As shown in FIG. 4 to FIG. 8 , in one embodiment, thecover plate 23 has a rectangular structure, the length direction of thecover plate 23 is the left-right direction, the plurality ofaccommodation spaces 24 are arranged at intervals along the left-right direction, and any twoadjacent storage spaces 24 are arranged in the left-right direction. Among thespaces 24, one of theaccommodating spaces 24 accommodates an LED lamp, and the otheraccommodating space 24 accommodates a PD. The light emitted from the LED lamp irradiates the human skin and is received by the PD adjacent to the LED lamp after reflection.

如图9所示，在另一实施例中，盖板23呈圆形结构，多个收容空间24中，其中一个收容空间24处于盖板23中心位置，且该收容空间24内收容有LED灯，其余收容空间24依次排列呈圆环形结构，围绕处于盖板23中心位置的收容空间24间隔均匀布置，且其余收容空间24内均收容有PD，从LED灯射出的光线照射人体皮肤，经反射后被与该LED灯周围的多个PD同时接收。As shown in FIG. 9 , in another embodiment, thecover plate 23 has a circular structure. Among the plurality ofaccommodation spaces 24 , one of theaccommodation spaces 24 is located at the center of thecover plate 23 , and theaccommodation space 24 accommodates an LED lamp. , the rest of theaccommodation spaces 24 are arranged in a circular structure, and are evenly spaced around theaccommodation spaces 24 at the center of thecover plate 23, and PDs are accommodated in the rest of theaccommodation spaces 24, and the light emitted from the LED lamp illuminates the human skin and passes through After reflection, it is received simultaneously with multiple PDs around the LED lamp.

可以理解地，在其他实施例中，盖板23可以为制作为其他形状的结构，结构灵活多变，以灵活适应设备外壳10，满足不同的使用需求。It can be understood that, in other embodiments, thecover plate 23 can be made of other shapes, and the structure is flexible and changeable, so as to flexibly adapt to thedevice casing 10 and meet different usage requirements.

本实施例中，光学模组20还包括连接器25，连接器25安装在基板21背离收容空间24的一侧。如图10至图15所示，连接器25贴装在基板21的上侧，处于收容空间24外，光学模组20可以利用连接器25与可穿戴设备的主板之间形成稳定的电连接，形成通信与供电，且光学模组20无需贴装到FPC或PCB上，其位置可根据实际情况灵活设置。In this embodiment, theoptical module 20 further includes aconnector 25 , and theconnector 25 is installed on the side of thesubstrate 21 away from the receivingspace 24 . As shown in FIG. 10 to FIG. 15 , theconnector 25 is mounted on the upper side of thesubstrate 21, outside theaccommodation space 24. Theoptical module 20 can use theconnector 25 to form a stable electrical connection with the main board of the wearable device. Communication and power supply are formed, and theoptical module 20 does not need to be mounted on the FPC or PCB, and its position can be flexibly set according to the actual situation.

本实施例的光学模组20的基板21还可以贴装多个功能芯片26，多个功能芯片26可以分别为PPG的AFE芯片、加速度芯片、ECG芯片、温度传感器芯片以及电阻、电容、电感等，使光学模组20可以对接收到的信号进行放大、滤波、模数转换等操作，或使光学模组20集成其他功能。如图10所示，功能芯片26可以贴装在基板21的上表面，也可以贴装在基板21的下表面并位于收容空间24外，如图11所示，功能芯片26还可以贴装在基板21的下表面并位于收容空间24内，与发光元件221或收光元件222沿上下方向层叠设置。功能芯片26的类型以及安装位置可根据实际情况灵活选取。本实施例光学模组20的盖板23、发光元件221、收光元件222、连接器25以及多个功能芯片26均为未经封装的裸片。Thesubstrate 21 of theoptical module 20 in this embodiment can also be mounted with a plurality offunctional chips 26, and the plurality offunctional chips 26 can be PPG AFE chips, acceleration chips, ECG chips, temperature sensor chips, resistors, capacitors, inductors, etc. , so that theoptical module 20 can perform operations such as amplifying, filtering, and analog-to-digital conversion on the received signal, or theoptical module 20 can integrate other functions. As shown in FIG. 10 , thefunctional chip 26 can be mounted on the upper surface of thesubstrate 21, or can be mounted on the lower surface of thesubstrate 21 outside theaccommodation space 24. As shown in FIG. 11, thefunctional chip 26 can also be mounted on the The lower surface of thesubstrate 21 is located in theaccommodating space 24, and is stacked with the light-emittingelement 221 or the light-receivingelement 222 in the vertical direction. The type and installation position of thefunction chip 26 can be flexibly selected according to the actual situation. Thecover plate 23 , the light-emittingelement 221 , the light-receivingelement 222 , theconnector 25 and the plurality offunctional chips 26 of theoptical module 20 in this embodiment are all unpackaged bare chips.

本发明还提出一种光学模组20，光学模组20采用如上所述的光学模组20的封装方法制得。由于本光学模组20采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。The present invention also provides anoptical module 20 , and theoptical module 20 is manufactured by using the packaging method of theoptical module 20 as described above. Since theoptical module 20 adopts all the technical solutions of the above-mentioned embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

如图13至图15所示，本发明还提出一种光学装置100，光学装置100包括外壳10和如上所述的光学模组20；所述外壳10内具有空腔11，所述外壳10开设有与所述空腔11连通的窗口12；所述光学模组20收容于所述空腔11内，且所述盖板23背离所述基板21的一侧嵌设于所述窗口12处，以将所述窗口12封堵，所述透光区位于对应所述窗口12的位置。As shown in FIG. 13 to FIG. 15 , the present invention further provides anoptical device 100 . Theoptical device 100 includes ahousing 10 and theoptical module 20 as described above; thehousing 10 has acavity 11 inside, and thehousing 10 opens There is awindow 12 communicating with thecavity 11 ; theoptical module 20 is accommodated in thecavity 11 , and thecover plate 23 is embedded in thewindow 12 on the side away from thesubstrate 21 , In order to block thewindow 12 , the light-transmitting area is located at a position corresponding to thewindow 12 .

本实施例的光学装置100可应用在可穿戴设备上，比如应用在手环、手表或耳机上，当手环或手表佩戴在人体手腕上后，窗口12位于可穿戴设备的内侧，即窗口12面向人体皮肤侧一侧。如图13至图15所示，外壳10的底部开设有与空腔11连通的窗口12，光学模组20收容于空腔11内，且光学模组20中盖板23的下侧向下凸出并嵌设于窗口12处，从而将窗口12封堵，实现光学模组20与外壳10之间的装配。光学模组20与外壳10装配后，光学模组20的透光区对应窗口12的位置，元器件22发出的光线通过透光区照射人体皮肤，经过人体皮肤反射的光线通过透光区并被元器件22接收，从而实现光学模组20对人体心率、血氧的监测。Theoptical device 100 in this embodiment can be applied to a wearable device, such as a wristband, a watch or an earphone. When the wristband or watch is worn on the human wrist, thewindow 12 is located inside the wearable device, that is, thewindow 12 The side facing the human skin. As shown in FIGS. 13 to 15 , the bottom of thehousing 10 is provided with awindow 12 that communicates with thecavity 11 , theoptical module 20 is accommodated in thecavity 11 , and the lower side of thecover plate 23 in theoptical module 20 protrudes downward. and embedded in thewindow 12 , so as to block thewindow 12 and realize the assembly between theoptical module 20 and thehousing 10 . After theoptical module 20 is assembled with thehousing 10, the light-transmitting area of theoptical module 20 corresponds to the position of thewindow 12, the light emitted by thecomponents 22 irradiates the human skin through the light-transmitting area, and the light reflected by the human skin passes through the light-transmitting area and is absorbed by the human body. Thecomponent 22 receives, so as to realize the monitoring of the human heart rate and blood oxygen by theoptical module 20 .

本实施例光学装置100中，光学模组20的盖板23凸出并嵌设于窗口12处将窗口12封堵，盖板23可直接作为可穿戴设备的光学开窗，外壳10的窗口12位置处无需额外设置一层透明介质，减少了零件数量，结构紧凑，且嵌入式结构大大缩小了光学模组20在可穿戴设备中所占用的空间，减少设备内部空间浪费的情况，有利于实现设备的小型化，尤其对于可穿戴设备为TWS耳机而言，小型化优势更为明显。并且，光学模组20收发光线只需穿过盖板23的透光区即可，而无需额外穿过外壳10的透明介质，光效损失小，光学模组20的出光效率更高，光学模组20可以用更小的元器件22驱动电流获得更强的光信号，降低了功耗。In theoptical device 100 of the present embodiment, thecover plate 23 of theoptical module 20 protrudes and is embedded at thewindow 12 to block thewindow 12 . Thecover plate 23 can be directly used as an optical window for the wearable device. There is no need to provide an additional layer of transparent medium at the position, the number of parts is reduced, the structure is compact, and the embedded structure greatly reduces the space occupied by theoptical module 20 in the wearable device, reduces the waste of internal space of the device, and is conducive to the realization of The miniaturization of the device, especially for the wearable device is the TWS earphone, the miniaturization advantage is more obvious. In addition, theoptical module 20 only needs to pass through the light-transmitting area of thecover plate 23 to send and receive light without additionally passing through the transparent medium of thehousing 10 , the light effect loss is small, the light output efficiency of theoptical module 20 is higher, and the optical module Thegroup 20 can use asmaller component 22 to drive the current to obtain a stronger optical signal, thereby reducing power consumption.

具体地，盖板23的遮光板231嵌设在外壳10的窗口12处，以将窗口12封堵。透光块232安装在遮光板231围成的收容空间24的开口241处，且透光块232形成透光区，方便透光，实现收容空间24内元器件22的光线收发。Specifically, thelight shielding plate 231 of thecover plate 23 is embedded at thewindow 12 of thehousing 10 to block thewindow 12 . The light-transmittingblock 232 is installed at theopening 241 of the receivingspace 24 enclosed by theshading plate 231 , and the light-transmittingblock 232 forms a light-transmitting area, which facilitates light transmission and realizes light transmission and reception of thecomponents 22 in the receivingspace 24 .

进一步的，外壳10的外表面与盖板23上背离空腔11的表面平滑过渡连接成一体的表面，更进一步的，在一体的表面设置有防刮层40。盖板23中，遮光板231与透光块232采用双色注塑、二次注塑或包胶工艺一体成型，可成型出与外壳10形状匹配的复杂结构，比如，盖板23嵌设在窗口12处后，盖板23的外表面与外壳10的外表面契合，可平滑过渡连接成一体的表面，具体地，盖板23背离空腔11的表面为盖板23的外表面，盖板23的外表面与外壳10的外表面平滑过渡连接成一体的表面。Further, the outer surface of thehousing 10 and the surface of thecover plate 23 facing away from thecavity 11 are smoothly connected to form an integral surface, and further, a scratch-resistant layer 40 is provided on the integral surface. In thecover plate 23, theshading plate 231 and the light-transmittingblock 232 are integrally formed by two-color injection molding, secondary injection molding or overmolding process, which can form a complex structure matching the shape of thecasing 10. For example, thecover plate 23 is embedded in thewindow 12. After that, the outer surface of thecover plate 23 fits with the outer surface of thehousing 10, and can be smoothly transitioned to form an integral surface. Specifically, the surface of thecover plate 23 facing away from thecavity 11 is the outer surface of thecover plate 23. The surface and the outer surface of thehousing 10 are smoothly transitioned into an integral surface.

盖板23的外表面可灵活适应外壳10的外表面，外壳10的外表面为平面时，盖板23的外表面也为与外壳10的外表面平齐的平面，外壳10的外表面为曲面时，盖板23的外表面也为与外壳10的外表面平滑过渡连接的曲面，以使光学装置100具有一体式的外表面。可以理解地，外壳10的外表面为其他异形面时，盖板23的外表面可始终与外壳10的外表面平滑过渡连接成一体的表面，灵活多变，满足不同的使用需求。The outer surface of thecover plate 23 can be flexibly adapted to the outer surface of thecasing 10. When the outer surface of thecasing 10 is a plane, the outer surface of thecover plate 23 is also a plane flush with the outer surface of thecasing 10, and the outer surface of thecasing 10 is a curved surface. At the same time, the outer surface of thecover plate 23 is also a curved surface that is smoothly connected with the outer surface of thehousing 10 , so that theoptical device 100 has an integral outer surface. Understandably, when the outer surface of thehousing 10 is other special-shaped surfaces, the outer surface of thecover plate 23 can always be smoothly connected with the outer surface of thehousing 10 to form an integral surface, which is flexible and changeable to meet different usage requirements.

光学模组20与外壳10装配后，盖板23的外表面直接耦合到外壳10窗口12处，盖板23可作为外壳10的一部分，提高光学装置100的结构紧凑性，并且，光学模组20的收光元件222和发光元件221距离外壳10的外表面更近，进而距离人体皮肤更近，也有利于提高测量准确性。After theoptical module 20 is assembled with thecasing 10, the outer surface of thecover plate 23 is directly coupled to thewindow 12 of thecasing 10, and thecover plate 23 can be used as a part of thecasing 10 to improve the compactness of theoptical device 100. In addition, theoptical module 20 The light-receivingelement 222 and the light-emittingelement 221 are closer to the outer surface of thehousing 10, and thus closer to the human skin, which is also conducive to improving the measurement accuracy.

在光学模组20与外壳10装配完成后，可以利用胶覆盖光学装置100的表面，即盖板23的外表面以及外壳10的外表面涂覆一层邵氏硬度在D以上的透明光学UV胶，厚度在30um左右，以形成防刮层40，在提高光学装置100防刮性能的同时提高其密封性能，并提高光学装置100的外观美观性。另外，由于防刮层40的厚度很小，对光学模组20的收放光线情况不造成影响。After theoptical module 20 and thecasing 10 are assembled, the surface of theoptical device 100 can be covered with glue, that is, the outer surface of thecover plate 23 and the outer surface of thecasing 10 are coated with a layer of transparent optical UV glue with Shore hardness above D , the thickness is about 30um, so as to form theanti-scratch layer 40 , which improves the anti-scratch performance of theoptical device 100 while improving its sealing performance, and improves the appearance of theoptical device 100 . In addition, since the thickness of theanti-scratch layer 40 is very small, it does not affect the light receiving and releasing conditions of theoptical module 20 .

本发明还提出一种可穿戴设备，可穿戴设备包括上述的光学装置100。可以理解的是，该可穿戴设备可以为智能手表、手环以及耳机类等电子产品。由于本可穿戴设备采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。The present invention also provides a wearable device, and the wearable device includes the above-mentionedoptical device 100 . It can be understood that the wearable device may be electronic products such as smart watches, wristbands, and earphones. Since the wearable device adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

以上仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是在本发明的发明构思下，利用本发明说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Under the inventive concept of the present invention, the equivalent structure transformation made by the contents of the description and drawings of the present invention, or directly/indirectly applied to other All relevant technical fields are included in the scope of patent protection of the present invention.

Claims

Translated fromChinese

1.一种光学模组的封装方法，其特征在于，所述光学模组的封装方法包括如下步骤：1. the encapsulation method of an optical module, is characterized in that, the encapsulation method of described optical module comprises the steps:

2.如权利要求1所述的光学模组的封装方法，其特征在于，所述盖板包括遮光板和透光块，所述采用双色注塑、二次注塑或包胶工艺成型出具有透光区的盖板的步骤包括：2 . The packaging method of an optical module according to claim 1 , wherein the cover plate comprises a shading plate and a light-transmitting block, and the two-color injection molding, secondary injection molding or overmolding process is used to form a light-transmitting block. 3 . The steps to cover the area include:

3.如权利要求2所述的光学模组的封装方法，其特征在于，所述基板对应所述收容空间的位置开设有与所述收容空间连通的通气孔；3 . The packaging method of an optical module according to claim 2 , wherein the substrate is provided with a ventilation hole communicating with the receiving space at a position corresponding to the receiving space; 3 .

4.如权利要求3所述的光学模组的封装方法，其特征在于，所述对所述光学模组进行烘烤，以使所述粘接剂固化的步骤之后，还包括：4 . The method for packaging an optical module according to claim 3 , wherein after the step of baking the optical module to cure the adhesive, the method further comprises: 5 .

向所述通气孔内填充粘胶；filling the vent hole with adhesive;

5.如权利要求2所述的光学模组的封装方法，其特征在于，所述透光块面向所述收容空间的一面呈凹面、凸面或平面。5 . The packaging method of an optical module according to claim 2 , wherein a side of the light-transmitting block facing the receiving space is concave, convex or flat. 6 .

6.如权利要求2所述的光学模组的封装方法，其特征在于，所述光学模组具有多个间隔布置的所述收容空间，任意相邻的两个所述收容空间之间通过所述遮光板隔开，各所述收容空间对应设置有一个所述透光块；所述元器件包括发光元件和收光元件，所述发光元件和所述收光元件分设于不同的所述收容空间内。6 . The packaging method of an optical module according to claim 2 , wherein the optical module has a plurality of the accommodation spaces arranged at intervals, and any two adjacent accommodation spaces pass through each other. 7 . The light-shielding plates are separated, and each of the receiving spaces is provided with one of the light-transmitting blocks; the components include a light-emitting element and a light-receiving element, and the light-emitting element and the light-receiving element are respectively arranged in different housings. within the space.

7.如权利要求6所述的光学模组的封装方法，其特征在于，所述盖板呈矩形结构或圆形结构；7. The packaging method of an optical module according to claim 6, wherein the cover plate is in a rectangular structure or a circular structure;

8.一种光学模组，其特征在于，所述光学模组采用如权利要求1-7中任一项所述的光学模组的封装方法制得。8 . An optical module, characterized in that, the optical module is prepared by the encapsulation method of the optical module according to any one of claims 1 to 7 .

9.一种光学装置，其特征在于，所述光学装置包括外壳和如权利要求8所述的光学模组；9. An optical device, characterized in that, the optical device comprises a housing and an optical module as claimed in claim 8;

所述光学模组收容于所述空腔内，且所述盖板背离所述基板的一侧嵌设于所述窗口处，以将所述窗口封堵，所述透光区位于对应所述窗口的位置。The optical module is accommodated in the cavity, and a side of the cover plate away from the substrate is embedded in the window to block the window, and the light-transmitting area is located corresponding to the position of the window.

10.如权利要求9所述的光学装置，其特征在于，所述外壳的外表面与所述盖板上背离所述空腔的表面平滑过渡连接成一体的表面。10 . The optical device according to claim 9 , wherein the outer surface of the housing and the surface of the cover plate facing away from the cavity are smoothly transitionally connected to form an integral surface. 11 .

11.一种可穿戴设备，其特征在于，所述可穿戴设备包括如权利要求9或10所述的光学装置。11. A wearable device, wherein the wearable device comprises the optical device according to claim 9 or 10.