CN111856247B - Device for simulating memory current test - Google Patents
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- CN111856247B CN111856247BCN202010669479.3ACN202010669479ACN111856247BCN 111856247 BCN111856247 BCN 111856247BCN 202010669479 ACN202010669479 ACN 202010669479ACN 111856247 BCN111856247 BCN 111856247B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
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Abstract
Translated fromChinese
Description
Translated fromChinese技术领域technical field
本发明涉及测试领域，更具体地，特别是指一种模拟内存电流测试的装置。The invention relates to the field of testing, and more specifically, to a device for simulating memory current testing.
背景技术Background technique
随着人工智能的深入，对服务器的功率，性能要求也越来越高，越来越多的服务器对内存供电的要求也越来越高。服务器主板已经由之前的2路过渡到4路和8路。对内存的要求也越来越高，模拟内存满载工作电流也越来越大，基本都达到100A以上。With the deepening of artificial intelligence, the power and performance requirements of servers are getting higher and higher, and more and more servers have higher and higher requirements for memory power supply. The mainboard of the server has been transitioned from the previous 2-way to 4-way and 8-way. The requirements for memory are also getting higher and higher, and the operating current of the analog memory is also increasing at full load, basically reaching more than 100A.
服务器主板和其他板卡在开发阶段需要针对内存VR（Voltage Regulation，电压规范）的电源测试。在测试过程中，需要电子负载对内存VR负载端拉载大电流，以验证内存VR的各项设计指标是否符合行业设计标准，用来评判内存VR的输出电压、电流等参数是否满足规定的SPEC要求。同时，需要进行针对内存VR的各种保护类验证测试等。通常情况下，在服务器主板上满配最大规格的内存条，做压力测试时，内存VR的供电电流并不能通过压力测试达到最大负载电流、最严苛的工作条件。Server motherboards and other boards need power supply tests for memory VR (Voltage Regulation, voltage specification) during the development stage. During the test process, the electronic load needs to pull a large current on the load side of the memory VR to verify whether the design indicators of the memory VR meet the industry design standards, and to judge whether the output voltage, current and other parameters of the memory VR meet the specified SPEC Require. At the same time, various protection verification tests for memory VR need to be carried out. Usually, when the server motherboard is fully equipped with memory modules of the largest specification, the power supply current of the memory VR cannot pass the stress test to reach the maximum load current and the most severe working conditions during the stress test.
现有技术中，当加载电流很大时，需要在VR输出端焊接多根负载线，连接至电子负载，使用电子负载等设备，进行相关验证，验证工作也越来越繁琐。同时，由于主板端内存VR通过焊接负载线连接到电子负载，负载线缆较长时，在进行短路保护测试时，由于回路较长，容易发生烧板的风险。In the prior art, when the loading current is large, it is necessary to weld multiple load wires at the output end of the VR, connect to the electronic load, use electronic load and other equipment, and carry out relevant verification, and the verification work is becoming more and more cumbersome. At the same time, since the motherboard-side memory VR is connected to the electronic load by soldering the load cable, when the load cable is long, the risk of board burn-in is likely to occur due to the long circuit during the short-circuit protection test.
发明内容Contents of the invention
有鉴于此，本发明实施例的目的在于提出一种模拟内存电流测试的装置，通过采用模拟内存拉载板来模拟主板内存条的工作的最严苛负载条件，对内存电压规范的设计指标进行验证，成本低且操作简便，减少人力工时，提高工作效率及测试精确度。In view of this, the purpose of the embodiment of the present invention is to propose a device for simulating memory current testing, by using the simulated memory load board to simulate the most severe load conditions of the mainboard memory bar, and to carry out the design index of the memory voltage specification Verification, low cost and easy operation, reducing manpower hours, improving work efficiency and test accuracy.
基于上述目的，本发明实施例的一方面提供了一种模拟内存电流测试的装置，包括如下部件：多个模拟内存拉载板，所述多个模拟内存拉载板并排设置在内存条插槽上，每个模拟内存拉载板上设置有多组连接条；连接板，所述连接板上并排设置有多组连接孔，每组所述连接孔与每组所述连接条形状配合以将所述连接板可拆卸地固定在所述模拟内存拉载板上；以及闸刀，所述闸刀设置在所述连接板上，所述闸刀上设置有多个突出部，所述突出部与所述连接孔对应设置以通过将所述突出部插入所述连接孔使多个模拟内存拉载板形成短路。Based on the above purpose, an aspect of the embodiment of the present invention provides a device for simulating memory current testing, including the following components: a plurality of simulating memory load boards, and the multiple simulating memory load boards are arranged side by side in the memory slot On each analog memory loading board, there are multiple sets of connecting strips; on the connecting plate, multiple sets of connecting holes are arranged side by side on the connecting plate, and each set of connecting holes matches the shape of each set of connecting strips so that the The connection plate is detachably fixed on the analog memory loading board; and the switch knife is arranged on the connection plate, and a plurality of protrusions are arranged on the knife knife, and the protrusions Corresponding to the connection hole, the plurality of analog memory load boards can be short-circuited by inserting the protruding part into the connection hole.
在一些实施方式中，还包括：拉载线，所述连接板每两组连接孔之间设置有可拆卸的拉载线。In some embodiments, it further includes: a pull wire, and a detachable pull wire is arranged between every two groups of connection holes on the connecting plate.
在一些实施方式中，所述模拟内存拉载板的每组连接条均包括电源连接条和地连接条，每组的电源连接条和地连接条之间的距离相同。In some embodiments, each group of connecting bars of the analog memory load board includes a power connecting bar and a ground connecting bar, and the distance between the power connecting bars and the ground connecting bars of each group is the same.
在一些实施方式中，同一个模拟内存拉载板上的不同组连接条中的电源连接条对应的电源类型不同。In some implementations, the power connection bars in different groups of connection bars on the same analog memory loading board correspond to different power types.
在一些实施方式中，所述多个模拟内存拉载板中相同电源类型的电源连接条设置的位置相同。In some embodiments, the positions of the power connection bars of the same power type in the plurality of analog memory load boards are set at the same position.
在一些实施方式中，所述连接板包括第一金属板和第二金属板，所述第一金属板和所述第二金属板并排设置，所述第一金属板和所述第二金属板中间使用绝缘材料连接。In some embodiments, the connecting plate includes a first metal plate and a second metal plate, the first metal plate and the second metal plate are arranged side by side, and the first metal plate and the second metal plate Connect with insulating material in the middle.
在一些实施方式中，所述连接板上的每组连接孔包括第一子连接孔和第二子连接孔，所述第一子连接孔和所述第二子连接孔分别设置在所述第一金属板和所述第二金属板，所述第一子连接孔和所述第二子连接孔关于所述绝缘材料对称。In some embodiments, each group of connection holes on the connection plate includes a first sub-connection hole and a second sub-connection hole, and the first sub-connection hole and the second sub-connection hole are respectively arranged on the second sub-connection hole. A metal plate and the second metal plate, the first sub-connection hole and the second sub-connection hole are symmetrical with respect to the insulating material.
在一些实施方式中，所述第一子连接孔和所述第二子连接孔的距离与对应的一组所述连接条中两个子连接条的距离相同。In some embodiments, the distance between the first sub-connection hole and the second sub-connection hole is the same as the distance between two sub-connection bars in a corresponding set of the connection bars.
在一些实施方式中，所述闸刀上与多组连接孔对应设置有多个子连接部，所述多个子连接部平行设置。In some embodiments, a plurality of sub-connection parts are provided on the knife blade corresponding to a plurality of groups of connection holes, and the plurality of sub-connection parts are arranged in parallel.
在一些实施方式中，每个所述子连接部上设置有第一突出部和第二突出部，所述第一突出部与所述第一子连接孔对应设置，所述第二突出部与所述第二子连接孔对应设置。In some embodiments, each of the sub-connecting parts is provided with a first protruding part and a second protruding part, the first protruding part is arranged corresponding to the first sub-connecting hole, and the second protruding part and the second protruding part are arranged correspondingly to the first sub-connecting hole. The second sub-connection holes are provided correspondingly.
本发明具有以下有益技术效果：通过采用模拟内存拉载板来模拟主板内存条的工作的最严苛负载条件，对内存电压规范的设计指标进行验证，成本低且操作简便，减少人力工时，提高工作效率及测试精确度。The present invention has the following beneficial technical effects: by using the simulated memory load board to simulate the most severe load condition of the motherboard memory bar, the design index of the memory voltage specification is verified, the cost is low and the operation is simple, the manpower is reduced, and the Work efficiency and test accuracy.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的实施例。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and those skilled in the art can obtain other embodiments according to these drawings without any creative effort.
图1为本发明提供的模拟内存电流测试的装置的实施例的示意图；Fig. 1 is the schematic diagram of the embodiment of the device of the simulated memory current test provided by the present invention;
图2为本发明提供的连接板的示意图；Fig. 2 is the schematic diagram of connecting plate provided by the present invention;
图3为本发明提供的模拟内存拉载板的示意图；Fig. 3 is the schematic diagram of the analog memory load board provided by the present invention;
图4为本发明提供的闸刀的示意图。Fig. 4 is a schematic diagram of the switch knife provided by the present invention.
具体实施方式detailed description
为使本发明的目的、技术方案和优点更加清楚明白，以下结合具体实施例，并参照附图，对本发明实施例进一步详细说明。In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.
需要说明的是，本发明实施例中所有使用“第一”和“第二”的表述均是为了区分两个相同名称非相同的实体或者非相同的参量，可见“第一”“第二”仅为了表述的方便，不应理解为对本发明实施例的限定，后续实施例对此不再一一说明。It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are to distinguish two entities with the same name but different parameters or parameters that are not the same, see "first" and "second" It is only for the convenience of expression, and should not be construed as a limitation on the embodiments of the present invention, which will not be described one by one in the subsequent embodiments.
基于上述目的，本发明实施例的第一个方面，提出了一种防止反接的保护电路的实施例。图1示出的是本发明提供的模拟内存电流测试的装置的实施例的示意图。如图1所示，本发明实施例包括如下部件：Based on the above purpose, the first aspect of the embodiments of the present invention proposes an embodiment of a protection circuit for preventing reverse connection. FIG. 1 shows a schematic diagram of an embodiment of a device for simulating a memory current test provided by the present invention. As shown in Figure 1, the embodiment of the present invention includes the following components:
多个模拟内存拉载板1，所述多个模拟内存拉载板1并排设置在主板0的内存条插槽上，每个模拟内存拉载板1上设置有多组连接条11；A plurality of analog
连接板2，所述连接板2上并排设置有多组连接孔21，每组所述连接孔21与每组所述连接条11形状配合以将所述连接板2可拆卸地固定在所述模拟内存拉载板1上；以及Connecting
闸刀3，所述闸刀3设置在所述连接板2上，所述闸刀3上设置有多个突出部31，所述突出部31与所述连接孔21对应设置以通过将所述突出部31插入所述连接孔21使多个模拟内存拉载板1形成短路。The
图2示出的是本发明提供的连接板的示意图。如图2所示，连接板2包括多组连接孔21。在一些实施方式中，所述连接板包括第一金属板和第二金属板，所述第一金属板和所述第二金属板并排设置，所述第一金属板和所述第二金属板中间使用绝缘材料连接。如图2所示，连接板2包括第一金属板22a和第二金属板22b，第一金属板22a和第二金属板22b并排设置，第一金属板22a和第二金属板22b中间使用绝缘材料连接。Fig. 2 shows a schematic diagram of the connection board provided by the present invention. As shown in FIG. 2 , the connecting
在一些实施方式中，还包括：拉载线，所述连接板每两组连接孔之间设置有可拆卸的拉载线。继续参见图2，连接板2每两组连接孔21之间设置有可拆卸的拉载线23。In some embodiments, it further includes: a pull wire, and a detachable pull wire is arranged between every two groups of connection holes on the connecting plate. Continuing to refer to FIG. 2 , a
在一些实施方式中，所述连接板上的每组连接孔包括第一子连接孔和第二子连接孔，所述第一子连接孔和所述第二子连接孔分别设置在所述第一金属板和所述第二金属板，所述第一子连接孔和所述第二子连接孔关于所述绝缘材料对称。继续参见图2，连接板2上的每组连接孔21包括第一子连接孔21a和第二子连接孔21b，第一子连接孔21a和第二子连接孔21b分别设置在第一金属板22a和第二金属板22b，第一子连接孔21a和第二子连接孔21b关于绝缘材料对称。In some embodiments, each group of connection holes on the connection plate includes a first sub-connection hole and a second sub-connection hole, and the first sub-connection hole and the second sub-connection hole are respectively arranged on the second sub-connection hole. A metal plate and the second metal plate, the first sub-connection hole and the second sub-connection hole are symmetrical with respect to the insulating material. Continuing to refer to FIG. 2, each group of
图3示出的是本发明提供的模拟内存拉载板的示意图。如图3所示，模拟内存拉载板1的一端包括多组连接条11，另一端由于与内存条插槽连接，可以将PIN脚与主板的内存条插槽的PIN脚定义一致，设计时可以采用金手指设计。在一些实施方式中，所述模拟内存拉载板的每组连接条均包括电源连接条和地连接条，每组的电源连接条和地连接条之间的距离相同。如图3所示，模拟内存拉载板1包括三组连接条，但这只是示例性的，在其他实施例中可以采用其他数量的连接条，每组连接条均包括一个电源连接条和一个地连接条。在一些实施方式中，同一个模拟内存拉载板上的不同组连接条中的电源连接条对应的电源类型不同。本实施例中的电源连接条分别为VDD、VTT和VPP，分别在图中以13a、13b和13c表示，地连接条以14表示。FIG. 3 is a schematic diagram of a simulated memory loading board provided by the present invention. As shown in Figure 3, one end of the analog
在一些实施方式中，所述多个模拟内存拉载板中相同电源类型的电源连接条设置的位置相同。为了便于进行测试，可以将多个模拟内存拉载板设计成完全相同，当然也包括每个模拟内存拉载板上不同电源类型的电源连接条的位置固定。例如，在模拟内存拉载板a1中，VDD、VTT和VPP电源连接条的排列方式为13a、13b和13c，那么在模拟内存拉载板a2中，VDD、VTT和VPP电源连接条的排列方式也可以为13a、13b和13c。In some embodiments, the positions of the power connection bars of the same power type in the plurality of analog memory load boards are set at the same position. In order to facilitate testing, multiple analog memory load boards can be designed to be exactly the same, and of course the positions of the power connection strips of different power types on each analog memory load board are fixed. For example, in the analog memory load board a1, the arrangement of the VDD, VTT and VPP power supply connection bars is 13a, 13b and 13c, then in the analog memory load board a2, the arrangement of the VDD, VTT and VPP power
在一些实施方式中，所述第一子连接孔和所述第二子连接孔的距离与对应的一组所述连接条中两个子连接条的距离相同。子连接条即是不同类型的电源连接条和地连接条，连接孔和连接条是配合使用的，因此，每组连接孔中的两个子连接孔之间的距离与对应组连接条中的两个子连接条之间的距离相同。In some embodiments, the distance between the first sub-connection hole and the second sub-connection hole is the same as the distance between two sub-connection bars in a corresponding set of the connection bars. The sub-connection strips are different types of power supply connection strips and ground connection strips. The connection holes and the connection strips are used in conjunction. Therefore, the distance between the two sub-connection holes in each group of connection holes is the same as the distance between the two connection The distance between the two connecting bars is the same.
在一些实施方式中，所述闸刀上与多组连接孔对应设置有多个子连接部，所述多个子连接部平行设置。图4示出的是本发明提供的闸刀的示意图。如图4所示，闸刀3上与多组连接孔21对应设置有多个子连接部32，多个子连接部32平行设置，并汇聚于连接部33，连接部33与把手34连接，从而使得通过把手34可以同时控制多个子连接部32的运动。In some embodiments, a plurality of sub-connection parts are provided on the knife blade corresponding to a plurality of groups of connection holes, and the plurality of sub-connection parts are arranged in parallel. Fig. 4 shows a schematic diagram of the switch knife provided by the present invention. As shown in Figure 4, a plurality of
在一些实施方式中，每个所述子连接部上设置有第一突出部和第二突出部，所述第一突出部与所述第一子连接孔对应设置，所述第二突出部与所述第二子连接孔对应设置。继续参见图4，子连接部32上设置有第一突出部31a和第二突出部31b，第一突出部31a与第一子连接孔21a对应设置，第二突出部31b与第二子连接孔21b对应设置。当闸刀抬起时（VDD\VTT\VPP）同GND是断开的，需要进行输出短路测试时，将闸刀闭合，（VDD\VTT\VPP）同GND快速连接。由于回路短，可以快速实现保护测试。In some embodiments, each of the sub-connecting parts is provided with a first protruding part and a second protruding part, the first protruding part is arranged corresponding to the first sub-connecting hole, and the second protruding part and the second protruding part are arranged correspondingly to the first sub-connecting hole. The second sub-connection holes are provided correspondingly. Continuing to refer to FIG. 4 , the
在进行需要使用电子负载拉载测试项目测试时，将拉载线连接至电子负载，设置电子负载；待测主板上电，进行相应的拉载测试即可；待测主板断电，在进行需要内存电压短路保护测试项目时，先将闸刀断开，主板上电后，将闸刀快速闭合，短路保护完成。When carrying out tests that require the use of electronic load load test items, connect the load line to the electronic load and set the electronic load; power on the main board to be tested and perform the corresponding load test; power off the main board to be tested, and perform the required When testing the memory voltage short-circuit protection, first disconnect the switch blade, and then quickly close the switch blade after the motherboard is powered on, and the short-circuit protection is completed.
以上是本发明公开的示例性实施例，但是应当注意，在不背离权利要求限定的本发明实施例公开的范围的前提下，可以进行多种改变和修改。根据这里描述的公开实施例的方法权利要求的功能、步骤和/或动作不需以任何特定顺序执行。此外，尽管本发明实施例公开的元素可以以个体形式描述或要求，但除非明确限制为单数，也可以理解为多个。The above are the exemplary embodiments disclosed in the present invention, but it should be noted that various changes and modifications can be made without departing from the scope of the disclosed embodiments of the present invention defined in the claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. In addition, although the elements disclosed in the embodiments of the present invention may be described or required in an individual form, they may also be understood as a plurality unless explicitly limited to a singular number.
应当理解的是，在本文中使用的，除非上下文清楚地支持例外情况，单数形式“一个”旨在也包括复数形式。还应当理解的是，在本文中使用的“和/或”是指包括一个或者一个以上相关联地列出的项目的任意和所有可能组合。It should be understood that as used herein, the singular form "a" and "an" are intended to include the plural forms as well, unless the context clearly supports an exception. It should also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items.
上述本发明实施例公开实施例序号仅仅为了描述，不代表实施例的优劣。The serial numbers of the embodiments disclosed in the above-mentioned embodiments of the present invention are only for description, and do not represent the advantages and disadvantages of the embodiments.
本领域普通技术人员可以理解实现上述实施例的全部或部分步骤可以通过硬件来完成，也可以通过程序来指令相关的硬件完成，程序可以存储于一种计算机可读存储介质中，上述提到的存储介质可以是只读存储器，磁盘或光盘等。Those of ordinary skill in the art can understand that all or part of the steps for implementing the above-mentioned embodiments can be completed by hardware, or can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium. The above-mentioned The storage medium may be a read-only memory, a magnetic disk or an optical disk, and the like.
所属领域的普通技术人员应当理解：以上任何实施例的讨论仅为示例性的，并非旨在暗示本发明实施例公开的范围（包括权利要求）被限于这些例子；在本发明实施例的思路下，以上实施例或者不同实施例中的技术特征之间也可以进行组合，并存在如上的本发明实施例的不同方面的许多其它变化，为了简明它们没有在细节中提供。因此，凡在本发明实施例的精神和原则之内，所做的任何省略、修改、等同替换、改进等，均应包含在本发明实施例的保护范围之内。Those of ordinary skill in the art should understand that: the discussion of any of the above embodiments is exemplary only, and is not intended to imply that the disclosed scope (including claims) of the embodiments of the present invention is limited to these examples; under the idea of the embodiments of the present invention , the technical features in the above embodiments or different embodiments can also be combined, and there are many other changes in different aspects of the above embodiments of the present invention, which are not provided in details for the sake of brevity. Therefore, within the spirit and principle of the embodiments of the present invention, any omissions, modifications, equivalent replacements, improvements, etc., shall be included in the protection scope of the embodiments of the present invention.
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