
技术领域technical field
本发明涉及一种储热模组,特别是指一种热相变储热模组。The invention relates to a heat storage module, in particular to a thermal phase change heat storage module.
背景技术Background technique
现今电子装置的运作功能日益复杂,因而需要设置众多高性能的零组件以实现其装置功能。然而,高性能零组件通常是在高功率状态下运作,如此会伴随大量的热能产生,而导致电子装置的温度提高。此外,电子装置的轻薄化发展趋势,也使得电子装置特定部位产生的热能不易散逸。因此,在电子装置内部的特定零组件如处理芯片、电源模组、电池模组处常会发生局部过热问题,而影响装置效能,严重的甚至可能会导致零组件毁损、起燃的问题发生。The operational functions of today's electronic devices are becoming more and more complex, so many high-performance components need to be provided to realize the device functions. However, high-performance components usually operate in a high-power state, which results in a large amount of thermal energy being generated, resulting in an increase in the temperature of the electronic device. In addition, the trend of thinning and lightening of electronic devices also makes it difficult for the heat energy generated in specific parts of the electronic device to dissipate. Therefore, local overheating problems often occur in specific components inside electronic devices, such as processing chips, power modules, and battery modules, which affect device performance, and may even lead to component damage and ignition problems.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于提供一种能解决前述问题的热相变储热模组。The purpose of the present invention is to provide a thermal phase change heat storage module capable of solving the aforementioned problems.
本发明热相变储热模组在一些实施态样中,包含导热外层及储热结构。所述导热外层适用于接触至少一热源。所述储热结构设置于所述导热外层中,并包括纤维基材及热相变材。所述纤维基材设置于所述导热外层中,并让所述热相变材附着于上。所述热相变材能在相变过程中维持于特定温度下吸收热量。In some embodiments, the thermal phase change heat storage module of the present invention includes a thermally conductive outer layer and a heat storage structure. The thermally conductive outer layer is adapted to contact at least one heat source. The heat storage structure is arranged in the thermally conductive outer layer, and includes a fiber base material and a thermal phase change material. The fiber base material is arranged in the thermally conductive outer layer, and the thermal phase change material is attached thereon. The thermal phase change material can absorb heat at a specific temperature during the phase change process.
在一些实施态样中,所述纤维基材的材质包含不织布、聚酯纤维、玻璃纤维、金属纤维、碳纤维的其中一者。In some embodiments, the material of the fiber substrate includes one of non-woven fabric, polyester fiber, glass fiber, metal fiber, and carbon fiber.
在一些实施态样中,所述纤维基材的厚度介于0.01毫米至0.5毫米。In some embodiments, the thickness of the fibrous substrate is between 0.01 mm and 0.5 mm.
在一些实施态样中,所述导热外层的材质包含铜、铝、聚对苯二甲酸乙二酯、聚酰亚胺的其中一者。In some embodiments, the material of the thermally conductive outer layer includes one of copper, aluminum, polyethylene terephthalate, and polyimide.
在一些实施态样中,所述导热外层包括一适用于接触所述热源的围壁,所述围壁的厚度不大于0.5毫米。In some embodiments, the thermally conductive outer layer includes a surrounding wall suitable for contacting the heat source, and the thickness of the surrounding wall is not greater than 0.5 mm.
在一些实施态样中,所述热相变材的材质包含石蜡及具辐射导热性的纳米碳材。In some embodiments, the material of the thermal phase change material includes paraffin wax and carbon nanomaterials with radiation thermal conductivity.
在一些实施态样中,所述热相变材的厚度不小于0.3毫米。In some embodiments, the thickness of the thermal phase change material is not less than 0.3 mm.
本发明的有益的效果在于:所述热相变储热模组通过所述热相变材的设置,在一定程度之内能够作为用于吸纳或释放热能的热库,因此所述热相变储热模组接触温度较高的热源后,能够吸收热源的热能以产生相变反应,且在相变反应过程中会维持在特定温度不致升高,因此能抑制热源温度过高或局部过热的问题。此外,由于所述热相变材在不同状态下可能具备流动性,通过所述纤维基材的设置,能够确保所述热相变材在所述导热外层改变为不同的摆设方位或角度后,仍位于所述导热外层内的预定位置,藉以让所述导热外层的特定部位接触热源后均能将热能顺利传导至所述热相变材处,因而能实现稳定的吸热或放热效果。The beneficial effect of the present invention is that: the thermal phase change heat storage module can be used as a thermal reservoir for absorbing or releasing thermal energy to a certain extent through the setting of the thermal phase change material. After the heat storage module contacts a heat source with a higher temperature, it can absorb the heat energy of the heat source to generate a phase change reaction, and during the phase change reaction process, it will maintain a specific temperature without increasing, so it can prevent the heat source temperature from being too high or local overheating. question. In addition, since the thermal phase change material may have fluidity in different states, the arrangement of the fiber base material can ensure that the thermal phase change material is arranged in different orientations or angles after the thermally conductive outer layer is changed to different orientations or angles. , is still located at a predetermined position in the thermally conductive outer layer, so that after a specific part of the thermally conductive outer layer contacts the heat source, the thermal energy can be smoothly conducted to the thermal phase change material, so that stable heat absorption or release can be achieved. thermal effect.
附图说明Description of drawings
图1是一侧剖视示意图,说明本发明热相变储热模组的一实施例。FIG. 1 is a schematic cross-sectional side view illustrating an embodiment of the thermal phase change heat storage module of the present invention.
具体实施方式Detailed ways
下面结合附图及实施例对本发明进行详细说明。The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
参阅图1,为本发明热相变储热模组100的一实施例,所述热相变储热模组100适用于接触一或多个热源200,于本实施例是以多个热源200为例说明,但不以多个热源200的实施方式为限。所述热源200例如分别为一电池模组中的电芯,所述热相变储热模组100是以夹设于所述热源200之间为例说明。然而,视实际需要,所述热相变储热模组100能够运用于各式不同的热源200的温度控管,不以电池模组的实施方式为限。Referring to FIG. 1 , it is an embodiment of the thermal phase change
所述热相变储热模组100包含一导热外层1及一设置于所述导热外层1中的储热结构2。所述导热外层1包括一适用于接触所述热源200的围壁11,所述围壁11的两端经密封,其材质包含铜、铝等金属材质或聚对苯二甲酸乙二酯(PET)、聚酰亚胺(PI)等材质。在所述导热外层1以铜、铝等材质制作的实施态样中,通过此种高导热材质的选用,能让所述导热外层1具备良好的导热特性。而在所述导热外层1通过聚对苯二甲酸乙二酯、聚酰亚胺等材质制作的实施态样中,则方便形塑形状,且具有成本低廉的优点。以本实施例中,所述导热外层1借由围壁11围绕形成内部空间而构成为扁平中空状的结构,而且所述围壁11的较佳厚度B为不大于0.5毫米,因此所述导热外层1整体为一极薄的结构,适用于夹设在所述热源200之间,而不会过度增加设置所述热相变储热模组100所占用的空间。然而,根据实际需要,所述导热外层1能够实现为任意形状的中空结构,并且能够视需要调整所述围壁11的厚度,不以特定实施方式为限。另,在一实施态样中,所述导热外层1的表面还能够设置图中未绘制的黏胶层及离型层,以便于将所述热相变储热模组100固定于所述热源200上。The thermal phase change
所述储热结构2包括一设置于所述导热外层1围壁11围绕形成的内部空间中的纤维基材21,以及一能附着于所述纤维基材21上的热相变材22,所述热相变材22亦设置于所述导热外层1围壁11围绕形成的内部空间中。所述纤维基材21的材质包含不织布、聚酯纤维(Terylene)、玻璃纤维、金属纤维、碳纤维的其中一者,且较佳厚度介于0.01毫米至0.5毫米,因而让所述热相变储热模组100适合实现为薄型化的结构。由于所述热相变材22有可能在固态、胶态等不同状态间变换,并在处于胶态的情况下产生流动性,通过所述纤维基材21的设置,能让所述热相变材22附着于所述纤维基材21上,即使所述热相变材22在相变后转为胶态也不致因产生流动性而大幅改变其在所述导热外层1中的位置,因此在所述导热外层1改变不同的摆设方位或角度后,所述热相变材22仍能根据其附着于所述纤维基材21的特性,而大致能维持在所述导热外层1内的预定位置,藉以让所述导热外层1的各部位接触所述热源200后,均能将热能顺利传导至所述热相变材22处,不会因为特定部位的所述热相变材22流动至所述导热外层1内的其他位置后,让所述导热外层1内存在局部区域缺少所述热相变材22的状况,因而让所述热相变储热模组100能够实现稳定的吸热或放热效果。所述热相变材22的材质于本实施例中是包含石蜡及具辐射导热性的纳米碳材,石蜡是在相变过程中具有高潜热储能密度的材料,且温度变化小热化学稳定性佳,适合用作储热材料,而加入纳米碳材则能增进所述热相变材22整体的导热性,因而让所述热相变材22能在相变过程中维持于特定温度下有效吸收热量或释放热量,并在一定程度内能作为用于吸纳或释放热能的热库。此外,本实施例中所述热相变材22的较佳厚度不小于0.3毫米,让所述热相变材22具备足够的体积充当热库。据此,所述热相变储热模组100接触温度较高的所述热源200后,能由所述热相变材22吸收所述热源200的热能以产生相变反应,且所述热相变材22在相变反应过程中会维持在特定温度不致升高,因此能抑制所述热源200温度过高或局部过热的问题。当所述热源200为电池模组的电芯时,所述热相变储热模组100的设置有助于维持电芯在特定温度下运作,以提升其效能,并能避免电芯温度过高时所造成的爆炸等危险。当然,所述热相变储热模组100的相关应用不以电池模组为限,上述说明仅为本实施例的示例,不应以此限制本实施例的实施范围。The
综合上述,本发明热相变储热模组100通过所述热相变材22的设置,在一定程度内能作为用于吸纳或释放热能的热库,因此所述热相变储热模组100接触温度较高的热源200后,能够吸收热源200的热能产生相变反应,且在相变反应过程中大致会维持在特定温度不致升高,因此能抑制热源200温度过高或局部过热的问题,确保热源200的安定性。此外,由于所述热相变材22在不同状态下可能会产生流动性,通过所述纤维基材21的设置,能够确保所述热相变材22在所述导热外层1改变为不同的摆设方位或角度后,仍位于所述导热外层1内的预定位置,藉以让所述导热外层1的各部位接触热源200后均能将热能顺利传导至所述热相变材22处,因而能实现稳定的吸热或放热效果。所以,本发明热相变储热模组100确实能达成本发明的目的。To sum up the above, the thermal phase change
| Application Number | Priority Date | Filing Date | Title |
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| CN201910298123.0ACN111836505A (en) | 2019-04-15 | 2019-04-15 | Thermal Phase Change Heat Storage Module |
| Application Number | Priority Date | Filing Date | Title |
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| CN201910298123.0ACN111836505A (en) | 2019-04-15 | 2019-04-15 | Thermal Phase Change Heat Storage Module |
| Publication Number | Publication Date |
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| CN111836505Atrue CN111836505A (en) | 2020-10-27 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910298123.0APendingCN111836505A (en) | 2019-04-15 | 2019-04-15 | Thermal Phase Change Heat Storage Module |
| Country | Link |
|---|---|
| CN (1) | CN111836505A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030039825A1 (en)* | 1999-07-08 | 2003-02-27 | Duvall James H. | Method of forming a phase change thermal interface |
| US20040009353A1 (en)* | 1999-06-14 | 2004-01-15 | Knowles Timothy R. | PCM/aligned fiber composite thermal interface |
| JP2004146799A (en)* | 2002-09-03 | 2004-05-20 | Thermagon Inc | Thermal interface structure effective to dispose between microelectronic part package and heat sink |
| US20050077618A1 (en)* | 2002-12-19 | 2005-04-14 | 3M Innovative Properties Company | Flexible heat sink |
| CN201285762Y (en)* | 2008-11-06 | 2009-08-05 | 同济大学 | Electronic heat radiation apparatus based on phase change energy accumulation nano capsule |
| CN103344147A (en)* | 2013-07-12 | 2013-10-09 | 北京依米康科技发展有限公司 | Phase change energy storage device |
| US20140030575A1 (en)* | 2012-07-27 | 2014-01-30 | Gerald Ho Kim | Thermal Reservoir Using Phase-Change Material For Portable Applications |
| CN105296898A (en)* | 2015-09-23 | 2016-02-03 | 华南理工大学 | Composite phase change material heat sink of metal fiber porous skeleton and manufacturing method thereof |
| CN105431003A (en)* | 2015-11-16 | 2016-03-23 | 中国电子科技集团公司第十研究所 | Continuous Phase Change Heat Sink Thermal Control Unit |
| CN105744807A (en)* | 2016-04-18 | 2016-07-06 | 上海创功通讯技术有限公司 | Electronic equipment and heat dissipation method thereof |
| CN105792618A (en)* | 2016-04-29 | 2016-07-20 | 广东欧珀移动通信有限公司 | A hardware bracket and mobile terminal |
| CN106817880A (en)* | 2015-11-27 | 2017-06-09 | 小米科技有限责任公司 | Can heat accumulation radiating device and electronic equipment, heat accumulation radiating implementation method |
| CN107872944A (en)* | 2017-11-29 | 2018-04-03 | 东莞市鸿艺电子有限公司 | A heat storage type temperature control method for a mobile device |
| CN207250498U (en)* | 2017-08-08 | 2018-04-17 | 深圳市飞荣达科技股份有限公司 | The equal backing of phase-change accumulation energy |
| CN207443316U (en)* | 2017-10-11 | 2018-06-01 | 上海阿莱德实业股份有限公司 | A kind of heat conduction heat accumulation composite materials suitable for mobile phone temperature control |
| CN108728046A (en)* | 2018-05-18 | 2018-11-02 | 苏州矽美科导热科技有限公司 | A kind of heat conduction heat accumulation composite material and preparation method, heat conduction heat accumulation radiator |
| CN108777927A (en)* | 2018-06-26 | 2018-11-09 | 联想(北京)有限公司 | A kind of radiator, method and electronic equipment |
| CN109413932A (en)* | 2017-08-18 | 2019-03-01 | 鹏鼎控股(深圳)股份有限公司 | Radiator structure and preparation method thereof |
| CN209914384U (en)* | 2019-04-15 | 2020-01-07 | 辰展股份有限公司 | Thermal phase change heat storage module |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040009353A1 (en)* | 1999-06-14 | 2004-01-15 | Knowles Timothy R. | PCM/aligned fiber composite thermal interface |
| US20030039825A1 (en)* | 1999-07-08 | 2003-02-27 | Duvall James H. | Method of forming a phase change thermal interface |
| JP2004146799A (en)* | 2002-09-03 | 2004-05-20 | Thermagon Inc | Thermal interface structure effective to dispose between microelectronic part package and heat sink |
| US20050077618A1 (en)* | 2002-12-19 | 2005-04-14 | 3M Innovative Properties Company | Flexible heat sink |
| CN201285762Y (en)* | 2008-11-06 | 2009-08-05 | 同济大学 | Electronic heat radiation apparatus based on phase change energy accumulation nano capsule |
| US20140030575A1 (en)* | 2012-07-27 | 2014-01-30 | Gerald Ho Kim | Thermal Reservoir Using Phase-Change Material For Portable Applications |
| CN103344147A (en)* | 2013-07-12 | 2013-10-09 | 北京依米康科技发展有限公司 | Phase change energy storage device |
| CN105296898A (en)* | 2015-09-23 | 2016-02-03 | 华南理工大学 | Composite phase change material heat sink of metal fiber porous skeleton and manufacturing method thereof |
| CN105431003A (en)* | 2015-11-16 | 2016-03-23 | 中国电子科技集团公司第十研究所 | Continuous Phase Change Heat Sink Thermal Control Unit |
| CN106817880A (en)* | 2015-11-27 | 2017-06-09 | 小米科技有限责任公司 | Can heat accumulation radiating device and electronic equipment, heat accumulation radiating implementation method |
| CN105744807A (en)* | 2016-04-18 | 2016-07-06 | 上海创功通讯技术有限公司 | Electronic equipment and heat dissipation method thereof |
| CN105792618A (en)* | 2016-04-29 | 2016-07-20 | 广东欧珀移动通信有限公司 | A hardware bracket and mobile terminal |
| CN207250498U (en)* | 2017-08-08 | 2018-04-17 | 深圳市飞荣达科技股份有限公司 | The equal backing of phase-change accumulation energy |
| CN109413932A (en)* | 2017-08-18 | 2019-03-01 | 鹏鼎控股(深圳)股份有限公司 | Radiator structure and preparation method thereof |
| CN207443316U (en)* | 2017-10-11 | 2018-06-01 | 上海阿莱德实业股份有限公司 | A kind of heat conduction heat accumulation composite materials suitable for mobile phone temperature control |
| CN107872944A (en)* | 2017-11-29 | 2018-04-03 | 东莞市鸿艺电子有限公司 | A heat storage type temperature control method for a mobile device |
| CN108728046A (en)* | 2018-05-18 | 2018-11-02 | 苏州矽美科导热科技有限公司 | A kind of heat conduction heat accumulation composite material and preparation method, heat conduction heat accumulation radiator |
| CN108777927A (en)* | 2018-06-26 | 2018-11-09 | 联想(北京)有限公司 | A kind of radiator, method and electronic equipment |
| CN209914384U (en)* | 2019-04-15 | 2020-01-07 | 辰展股份有限公司 | Thermal phase change heat storage module |
| Publication | Publication Date | Title |
|---|---|---|
| TWI241473B (en) | Thermal module with temporary heat storage | |
| TWI703921B (en) | Dissipating heat device | |
| WO2015173999A1 (en) | Battery pack and electronic device | |
| CN204669802U (en) | Electronic equipment | |
| TWM366286U (en) | Heat dissipation structure of communication case | |
| CN110365815A (en) | Thermal Components and Terminals | |
| CN103476222B (en) | Electronic installation | |
| US20160021786A1 (en) | Electronic apparatus | |
| CN209914384U (en) | Thermal phase change heat storage module | |
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| CN211019739U (en) | heat sink | |
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| CN211376630U (en) | Heat dissipation device and electronic equipment | |
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| CN111836505A (en) | Thermal Phase Change Heat Storage Module | |
| TWI701325B (en) | Thermal phase change heat storage module | |
| CN210130059U (en) | Heat sinks and electronic equipment | |
| CN112687975A (en) | Electronic equipment and heat dissipation method | |
| CN107249284B (en) | A kind of mobile terminal | |
| JP3152577U (en) | Heat dissipation structure for communication equipment case | |
| CN116249325A (en) | Radiating assembly, display module and display device | |
| Jomde et al. | Battery Thermal Management System for EVs: A Review | |
| CN108833646B (en) | a protective cover |
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|---|---|---|---|
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | Application publication date:20201027 | |
| WD01 | Invention patent application deemed withdrawn after publication |