CN111818241A - Camera module and molded photosensitive component, manufacturing method thereof, and electronic device - Google Patents

Abstract

Translated fromChinese

一种摄像模组和模塑感光组件及其制造方法以及电子设备。该模塑感光组件用于与至少一光学镜头组装成摄像模组。该模塑感光组件包括成像组件、模塑基座以及滤光构件。该模塑基座包括第一模塑部和第二模塑部。该第一模塑部包覆该成像组件的一部分。该第二模塑部一体地形成于该第一模塑部的第一上表面，其中该第二模塑部具有一第二上表面和一第二外侧面。该滤光构件被贴附于该第二模塑部的该第二上表面，并且该滤光构件对应于该成像组件的感光路径。其中该第二模塑部的该第二上表面高于该第一模塑部的该第一上表面，以通过该第二模塑部的该第二外侧面与该第一模塑部的该第一上表面定义形成一外空间。

A camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device. The molded photosensitive component is used for assembling with at least one optical lens to form a camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molding base includes a first molding portion and a second molding portion. The first molding portion encapsulates a portion of the imaging assembly. The second molding portion is integrally formed on the first upper surface of the first molding portion, wherein the second molding portion has a second upper surface and a second outer side surface. The filter member is attached to the second upper surface of the second molding part, and the filter member corresponds to a photosensitive path of the imaging assembly. Wherein the second upper surface of the second molding part is higher than the first upper surface of the first molding part, so as to pass through the second outer side surface of the second molding part and the first molding part The first upper surface defines an outer space.

Description

Translated fromChinese

摄像模组和模塑感光组件及其制造方法以及电子设备Camera module and molded photosensitive component, manufacturing method thereof, and electronic device

技术领域technical field

本发明涉及光学成像技术领域，特别是涉及一种摄像模组和模塑感光组件及其制造方法以及电子设备。The invention relates to the technical field of optical imaging, in particular to a camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device.

背景技术Background technique

近年来，电子产品、智能设备等越来越多地朝向轻薄化、小型化的方向发展，电子产品、智能设备这种发展趋势对作为电子产品、智能设备的标准配置之一的摄像模组的尺寸提出了更加苛刻的要求。在此要求下，模塑工艺和IOM(IR on Molding，滤光片在模塑上)工艺逐渐被应用于摄像模组的封装工艺中，首先通过模塑工艺封装成像组件以形成模塑基座，之后再将滤光片直接贴附于模塑基座上，以组装成模塑感光组件，从而大幅地减少感光组件的厚度，进而缩小摄像模组的整体尺寸。In recent years, electronic products, smart devices, etc. have been increasingly developed in the direction of thinning and miniaturization. The development trend of electronic products and smart devices has a great impact on the camera module, which is one of the standard configurations of electronic products and smart devices. Dimensions impose more stringent requirements. Under this requirement, the molding process and the IOM (IR on Molding, filter on molding) process are gradually applied to the packaging process of the camera module. First, the imaging component is packaged through the molding process to form a molding base. , and then directly attach the filter to the molding base to assemble a molded photosensitive component, thereby greatly reducing the thickness of the photosensitive component, thereby reducing the overall size of the camera module.

例如，如图1所示，现有的摄像模组1P通常包括一光学镜头2P和一模塑感光组件3P，其中该模塑感光组件3P包括一成像组件31P、一模塑基座32P以及一滤光片33P，其中该模塑基座32P在模塑成型后包覆该成像组件31P的一部分，并且该模塑基座32P的内部向下凹陷以形成一凹槽35P，其中该滤光片33P通过胶水被直接贴附至该模塑基座32P的该凹槽35P内，并在胶水固化后形成将该滤光片33P与该模塑基座32P粘接的胶层34P，以组装成该模塑感光组件3P。这样现有的摄像模组1P在不需要镜座的基础上，只需将该光学镜头2P直接安装至该模塑基座32P的顶表面就能够完成模组组装，以便降低摄像模组的整体尺寸。与此同时，由于该滤光片33P被贴附于该模塑基座32P的凹槽35P内，因此该滤光片33P与该成像组件31P的感光芯片311P之间的距离得以进一步减小，有助于进一步降低摄像模组的高度。For example, as shown in FIG. 1 , an existingcamera module 1P generally includes anoptical lens 2P and a moldedphotosensitive component 3P, wherein the moldedphotosensitive component 3P includes animaging component 31P, a moldedbase 32P, and aFilter 33P, wherein themolding base 32P encloses a portion of theimaging assembly 31P after molding, and the interior of themolding base 32P is recessed downward to form agroove 35P, wherein thefilter 33P is directly attached to thegroove 35P of themolding base 32P through glue, and after the glue is cured, anadhesive layer 34P for bonding theoptical filter 33P to themolding base 32P is formed to be assembled into a The moldedphotosensitive member 3P. In this way, theexisting camera module 1P can complete the module assembly by directly installing theoptical lens 2P on the top surface of themolding base 32P without the need for a mirror base, so as to reduce the overall size of the camera module. size. At the same time, since thefilter 33P is attached to thegroove 35P of themolding base 32P, the distance between thefilter 33P and thephotosensitive chip 311P of theimaging assembly 31P is further reduced, Helps to further reduce the height of the camera module.

然而，如图1所示，受限于模塑工艺中的覆膜(film)，该模塑基座32P中该凹槽35P的拐角处(即该模塑基座32P上贴附该滤光片33P的部位与安装该光学镜头2P的部分之间的连接处)并非直角，而是存在一定的过渡弧面351P，导致该模塑基座32P难以为该滤光片33P提供一平整的贴附面。因此，在贴附该滤光片33P时不得不避让该模塑基座32P中该凹槽35P的该过渡弧面351P，以确保该滤光片33P被贴附在平整的平面上。但这样就会导致该滤光片33P与该模塑基座32P之间的贴附面积变小，即该模塑基座32P为该滤光片33P提供的底部支撑面积变小，容易降低该滤光片33P与该模塑基座32P之间的连接强度，进而影响摄像模组的可靠性。However, as shown in FIG. 1 , limited by the film in the molding process, the corners of thegroove 35P in themolding base 32P (ie, the filter is attached to themolding base 32P) The junction between the part of thefilter 33P and the part where theoptical lens 2P is installed) is not a right angle, but there is a certaintransition arc surface 351P, which makes it difficult for themolding base 32P to provide a flat sticker for thefilter 33P. side. Therefore, when attaching thefilter 33P, thetransition arc surface 351P of thegroove 35P in themolding base 32P has to be avoided to ensure that thefilter 33P is attached on a flat surface. However, this will cause the attachment area between thefilter 33P and themolding base 32P to become smaller, that is, the bottom support area provided by themolding base 32P for thefilter 33P becomes smaller, which is easy to reduce the The connection strength between thefilter 33P and themolding base 32P further affects the reliability of the camera module.

发明内容SUMMARY OF THE INVENTION

本发明的一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其能够通过垫高模塑基座上贴附滤光构件的部位，以消除所述模塑基座上的过渡弧面对所述贴附滤光构件产生的不利影响。One object of the present invention is to provide a camera module and a molded photosensitive assembly, a manufacturing method thereof, and an electronic device, which can eliminate the molding base by elevating the part where the filter member is attached on the molding base. The transition arc on the seat has an adverse effect on the attached filter member.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其能够在贴附所述滤光构件时无需避让所述模塑基座上的过渡弧面，以便增大所述滤光构件与所述模塑基座之间的贴附面积，有助于提高所述摄像模组的可靠性。Another object of the present invention is to provide a camera module and a molded photosensitive assembly, a manufacturing method thereof, and an electronic device, which can avoid the transition arc surface on the molding base when attaching the filter member. , so as to increase the attachment area between the filter member and the molding base, and help improve the reliability of the camera module.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其中，在本发明的一实施例中，通过对成型模具的上模具进行设计，以在第二模塑部和第三模塑部之间形成间隙，使得所述滤光构件无需避让所述模塑基座上的过渡弧面。Another object of the present invention is to provide a camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device, wherein, in an embodiment of the present invention, the upper mold of the molding mold is designed to A gap is formed between the second molding part and the third molding part, so that the filter member does not need to avoid the transition arc surface on the molding base.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其中，在本发明的一实施例中，所述模塑感光组件的所述模塑基座的第二模塑部一体地形成于所述模塑基座的第一模塑部，以通过所述第二模塑部的第二上表面为所述滤光构件提供一平整贴附面，便于确保所述滤光构件的贴附平整度。Another object of the present invention is to provide a camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device, wherein, in an embodiment of the present invention, the molding base of the molded photosensitive component The second molding portion is integrally formed on the first molding portion of the molding base, so as to provide a flat attachment surface for the filter member through the second upper surface of the second molding portion, It is convenient to ensure the flatness of attachment of the filter member.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其中，在本发明的一实施例中，所述模塑感光组件的所述模塑基座的第三模塑部一体地形成于所述第一模塑部，以包覆所述模塑感光组件的线路板上的电子元器件，有助于降低所述第一模塑部的厚度，进而降低所述摄像模组的高度。Another object of the present invention is to provide a camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device, wherein, in an embodiment of the present invention, the molding base of the molded photosensitive component The third molding part is integrally formed on the first molding part to cover the electronic components on the circuit board of the molding photosensitive component, which helps to reduce the thickness of the first molding part, Further, the height of the camera module is reduced.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其中，在本发明的一实施例中，所述模塑感光组件的所述模组基座的所述第二模塑部与第三模塑部间隔设置，以在所述第二模塑部和所述第三模塑部之间预留一外空间，使得所述滤光元件的边缘尽可能靠近所述第三模塑部，而不需要避让所述第三模塑部与所述第一模塑部之间的过渡弧面，有助于增大所述滤光元件的底部支撑面积，从而增强所述滤光元件的贴附可靠性。Another object of the present invention is to provide a camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device, wherein, in an embodiment of the present invention, the module base of the molded photosensitive component The second molding part and the third molding part are spaced apart to reserve an outer space between the second molding part and the third molding part, so that the edge of the filter element As close as possible to the third molding part without avoiding the transition arc between the third molding part and the first molding part, it helps to increase the bottom support of the filter element area, thereby enhancing the attachment reliability of the filter element.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其中，在本发明的一实施例中，所述模塑感光组件的所述模组基座的所述第二模塑部能够确保所述滤光元件被贴附在平整的平面上，而不需要避让所述第三模塑部与所述第一模塑部之间的过渡弧面，有助于提高所述摄像模组的组装质量。Another object of the present invention is to provide a camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device, wherein, in an embodiment of the present invention, the module base of the molded photosensitive component The second molding part can ensure that the filter element is attached to a flat plane without avoiding the transition arc between the third molding part and the first molding part, This helps to improve the assembly quality of the camera module.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其中，在本发明的一实施例中，所述模塑基座的所述第二模塑部易于设置缺口，以在贴附所述滤光构件的过程中形成逃气孔，有效地避免所述滤光元件因所述模塑基座的内部空间中的气体受热膨胀而发生偏移或翘起。Another object of the present invention is to provide a camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device, wherein, in an embodiment of the present invention, the second molding of the molding base is It is easy to set a notch in the part to form an air escape hole in the process of attaching the filter member, which can effectively prevent the filter element from shifting or warping due to the thermal expansion of the gas in the inner space of the molding base. rise.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其中，在本发明的一实施例中，所述模塑感光组件的所述模塑基座的所述缺口横向地贯穿所述第二模塑部，以在贴附滤光元件之后形成横向的所述逃气孔，以增加外界灰尘经由所述逃气孔进入所述模塑基座的内部空间的难度，有助于保障感光芯片不受污染。Another object of the present invention is to provide a camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device, wherein, in an embodiment of the present invention, the molding base of the molded photosensitive component The notch penetrates through the second molding portion laterally to form the lateral air escape hole after the filter element is attached, so as to increase the entry of external dust into the inner space of the molding base through the air escape hole The difficulty is to help protect the photosensitive chip from contamination.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其中，在本发明的一实施例中，所述模塑感光组件的所述模塑基座在所述缺口处设有模塑加强部，其中所述模塑加强部自所述第二模塑部向外延伸，以便在贴附所述滤光元件之后在所述缺口处进行补胶，有助于加强所述滤光元件在所述缺口处的贴附强度，以增强所述摄像模组的可靠性。Another object of the present invention is to provide a camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device, wherein, in an embodiment of the present invention, the molding base of the molded photosensitive component A molding reinforcement portion is provided at the notch, wherein the molding reinforcement portion extends outward from the second molding portion, so as to perform glue filling at the notch after attaching the filter element, It is helpful to strengthen the adhesion strength of the filter element at the notch, so as to enhance the reliability of the camera module.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其中，在本发明的一实施例中，所述模塑感光组件的所述模组基座的所述模塑加强部能够加强所述第二模塑部与所述第一模塑部之间在所述缺口处的连接强度，进一步增强所述摄像模组的可靠性。Another object of the present invention is to provide a camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device, wherein, in an embodiment of the present invention, the module base of the molded photosensitive component The molding reinforcing part can strengthen the connection strength between the second molding part and the first molding part at the notch, and further enhance the reliability of the camera module.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其中，在本发明的一实施例中，所述模塑基座的所述第二模塑部的所述第二上表面高于所述第一模塑部的第一上表面，以在所述第二模塑部的周围形成外空间，允许固化前的粘接剂向外溢胶，便于保障所述摄像模组的成像质量。Another object of the present invention is to provide a camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device, wherein, in an embodiment of the present invention, the second molding of the molding base is The second upper surface of the first molding part is higher than the first upper surface of the first molding part, so as to form an outer space around the second molding part, allowing the adhesive before curing to overflow the glue, which is convenient for The imaging quality of the camera module is guaranteed.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其中，在本发明的一实施例中，所述模塑感光组件的模塑基座预留有外空间，有助于引导固化前的粘接剂向外溢胶，以缓解固化前的粘接剂向内溢流，进而降低粘接剂对摄像模组的成像质量产生的不利影响。Another object of the present invention is to provide a camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device, wherein, in an embodiment of the present invention, the molding base of the molded photosensitive component is reserved There is an outer space, which helps to guide the adhesive before curing to overflow the glue, so as to relieve the inward overflow of the adhesive before curing, thereby reducing the adverse effect of the adhesive on the imaging quality of the camera module.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其中，在本发明的一实施例中，所述模塑感光组件的所述模塑基座的所述第三模塑部与所述第二模塑部间隔设置，以使所述第三模塑部与所述第二模塑部之间的所述避让空间被实施为所述外空间，从而避免所述第三模塑部阻挡胶水外溢。Another object of the present invention is to provide a camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device, wherein, in an embodiment of the present invention, the molding base of the molded photosensitive component The third molding part and the second molding part are spaced apart, so that the escape space between the third molding part and the second molding part is implemented as the outer space , so as to prevent the third molding part from blocking the overflow of glue.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其中，在本发明的一实施例中，所述模塑感光组件的所述模塑基座的所述第三模塑部的第三上表面高于所述滤光元件的上表面，以便通过所述第三模塑部阻挡光学镜头撞击所述滤光元件，有助于降低所述滤光元件破裂的风险。Another object of the present invention is to provide a camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device, wherein, in an embodiment of the present invention, the molding base of the molded photosensitive component The third upper surface of the third molding part is higher than the upper surface of the filter element, so that the optical lens can be blocked from hitting the filter element by the third molding part, which helps to reduce the filter element. Risk of breakage of optical components.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其中，在本发明的一实施例中，所述模塑感光组件的所述模塑基座的第四模塑部根据光学镜头的安装高度进行设计，以满足所述摄像模组的所述光学镜头的安装要求。Another object of the present invention is to provide a camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device, wherein, in an embodiment of the present invention, the molding base of the molded photosensitive component The fourth molding part is designed according to the installation height of the optical lens to meet the installation requirements of the optical lens of the camera module.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其中，在本发明的一实施例中，所述模塑感光组件的所述模塑基座的所述第四模塑部自所述第一模塑部向下凹陷，以降低所述摄像模组的光学镜头的安装高度，有助于进一步降低所述摄像模组的高度。Another object of the present invention is to provide a camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device, wherein, in an embodiment of the present invention, the molding base of the molded photosensitive component The fourth molding portion is recessed downward from the first molding portion to reduce the installation height of the optical lens of the camera module, which is helpful to further reduce the height of the camera module.

本发明的另一目的在于提供一种摄像模组和模塑感光组件及其制造方法以及电子设备，其中，为了达到上述目的，在本发明中不需要采用昂贵的材料或复杂的结构。因此，本发明成功和有效地提供一解决方案，不只提供简单的摄像模组和模塑感光组件及其制造方法和电子设备，同时还增加了所述摄像模组和模塑感光组件及其制造方法和电子设备的实用性和可靠性。Another object of the present invention is to provide a camera module and a molded photosensitive assembly, a manufacturing method thereof, and an electronic device, wherein, in order to achieve the above-mentioned objects, the present invention does not need to use expensive materials or complicated structures. Therefore, the present invention successfully and effectively provides a solution, which not only provides a simple camera module and a molded photosensitive component and its manufacturing method and electronic equipment, but also increases the camera module and molded photosensitive component and its manufacturing. Practicality and reliability of methods and electronic devices.

为了实现上述至少一发明目的或其他目的和优点，本发明提供了一种模塑感光组件，用于与至少一光学镜头组装成一摄像模组，其中所述模塑感光组件包括：In order to achieve the above-mentioned at least one object of the invention or other objects and advantages, the present invention provides a molded photosensitive component for assembling a camera module with at least one optical lens, wherein the molded photosensitive component includes:

一成像组件；an imaging component;

一模塑基座，其中所述模塑基座包括：A molded base, wherein the molded base includes:

一第一模塑部，其中所述第一模塑部包覆所述成像组件的一部分，其中所述第一模塑部具有一第一上表面；和a first molding portion, wherein the first molding portion encapsulates a portion of the imaging assembly, wherein the first molding portion has a first upper surface; and

一第二模塑部，其中所述第二模塑部一体地形成于所述第一模塑部的所述第一上表面，其中所述第二模塑部具有一第二上表面和一第二外侧面；以及a second molding part, wherein the second molding part is integrally formed on the first upper surface of the first molding part, wherein the second molding part has a second upper surface and a the second outer side; and

一滤光构件，其中所述滤光构件被对应地设置于所述第二模塑部的所述第二上表面；a filter member, wherein the filter member is correspondingly disposed on the second upper surface of the second molding part;

其中所述第二模塑部的所述第二上表面高于所述第一模塑部的所述第一上表面，以通过所述第二模塑部的所述第二外侧面与所述第一模塑部的所述第一上表面定义形成一外空间。The second upper surface of the second molding part is higher than the first upper surface of the first molding part, so as to pass through the second outer side surface of the second molding part and the The first upper surface of the first molding part defines an outer space.

在本发明的一实施例中，所述模塑基座还包括一第三模塑部，其中所述第三模塑部一体地形成于所述第一模塑部的所述第一上表面，其中所述第三模塑部位于所述第二模塑部的外侧，并且所述第三模塑部与所述第二模塑部间隔设置。In an embodiment of the present invention, the molding base further includes a third molding portion, wherein the third molding portion is integrally formed on the first upper surface of the first molding portion , wherein the third molding part is located outside the second molding part, and the third molding part and the second molding part are spaced apart.

在本发明的一实施例中，所述第二模塑部的所述第二上表面为一平整面。In an embodiment of the present invention, the second upper surface of the second molding portion is a flat surface.

在本发明的一实施例中，所述第三模塑部的第三内侧面与所述第二模塑部的所述第二外侧面之间的距离不小于0.01毫米。In an embodiment of the present invention, the distance between the third inner side surface of the third molding part and the second outer side surface of the second molding part is not less than 0.01 mm.

在本发明的一实施例中，所述第二模塑部的所述第二上表面与所述第一模塑部的所述第一上表面之间的高度差在0.03毫米至0.2毫米之间。In an embodiment of the present invention, the height difference between the second upper surface of the second molding part and the first upper surface of the first molding part is between 0.03 mm and 0.2 mm between.

在本发明的一实施例中，所述的模塑感光组件，还包括一粘接层，其中所述粘接层由粘接剂固化之后形成，其中所述粘接层位于所述滤光构件的下表面与所述第二模塑部的所述第二上表面之间，以将所述滤光构件贴附于所述第二模塑部的所述第二上表面。In an embodiment of the present invention, the molded photosensitive component further includes an adhesive layer, wherein the adhesive layer is formed after curing an adhesive, wherein the adhesive layer is located on the filter member between the lower surface of the second molding part and the second upper surface of the second molding part, so as to attach the filter member to the second upper surface of the second molding part.

在本发明的一实施例中，所述第二模塑部的第二内侧面位于所述第一模塑部的第一内侧面的外侧，以在所述第二模塑部的内部形成一内空间。In an embodiment of the present invention, the second inner side of the second molding part is located outside the first inner side of the first molding part, so as to form a inner space.

在本发明的一实施例中，所述成像组件包括一线路板、一可导通地贴附于所述线路板的感光元件以及一组可导通地连接于所述线路板的电子元器件，其中所述第三模塑部对应于所述电子元器件，并且所述第三模塑部的第三上表面高于所述电子元器件的顶表面。In an embodiment of the present invention, the imaging assembly includes a circuit board, a photosensitive element conductively attached to the circuit board, and a set of electronic components conductively connected to the circuit board , wherein the third molding part corresponds to the electronic component, and the third upper surface of the third molding part is higher than the top surface of the electronic component.

在本发明的一实施例中，所述模塑基座的所述第一模塑部的所述第一上表面低于所述电子元器件的所述顶表面。In an embodiment of the present invention, the first upper surface of the first molding portion of the molding base is lower than the top surface of the electronic component.

在本发明的一实施例中，所述模塑基座的所述第三模塑部的第三外侧面位于所述第一模塑部的所述第一外侧面的内侧，使得所述第一模塑部的所述第一上表面上位于所述第三模塑部之外的部分用于安装该光学镜头。In an embodiment of the present invention, the third outer side of the third molding part of the molding base is located inside the first outer side of the first molding part, so that the first The part of the first upper surface of a molding part outside the third molding part is used for installing the optical lens.

在本发明的一实施例中，所述模塑基座还包括一第四模塑部，其中所述第四模塑部自所述第一模塑部的所述第一上表面向下凹陷，以在所述第一模塑部的外周缘形成一周缘槽，其中所述第四模塑部的第四上表面用于提供安装该光学镜头的安装面。In an embodiment of the present invention, the molding base further includes a fourth molding portion, wherein the fourth molding portion is recessed downward from the first upper surface of the first molding portion , so as to form a peripheral groove on the outer periphery of the first molding part, wherein the fourth upper surface of the fourth molding part is used to provide a mounting surface for mounting the optical lens.

在本发明的一实施例中，所述模塑基座还包括一第四模塑部，其中所述第四模塑部自所述第一模塑部的所述第一上表面向上延伸，以在所述第一模塑部的外周缘形成一周缘凸起，其中所述第四模塑部的第四上表面用于提供安装该光学镜头的安装面。In an embodiment of the present invention, the molding base further includes a fourth molding portion, wherein the fourth molding portion extends upward from the first upper surface of the first molding portion, A peripheral protrusion is formed on the outer periphery of the first molding part, wherein the fourth upper surface of the fourth molding part is used to provide a mounting surface for mounting the optical lens.

在本发明的一实施例中，所述模塑基座的所述第三模塑部的所述第三上表面高于所述第二模塑部的所述第二上表面。In an embodiment of the present invention, the third upper surface of the third molding part of the molding base is higher than the second upper surface of the second molding part.

在本发明的一实施例中，所述第三模塑部的所述第三上表面高于所述滤光构件的上表面，并且所述第三模塑部的所述第三上表面适于对应于该光学镜头。In an embodiment of the present invention, the third upper surface of the third molding part is higher than the upper surface of the filter member, and the third upper surface of the third molding part is suitable for corresponds to the optical lens.

在本发明的一实施例中，所述第三模塑部根据所述电子元器件的尺寸和位置进行设计。In an embodiment of the present invention, the third molding part is designed according to the size and position of the electronic component.

在本发明的一实施例中，所述粘接层由光固化胶或热固化胶固化而成。In an embodiment of the present invention, the adhesive layer is formed by curing light-curing glue or heat-curing glue.

在本发明的一实施例中，所述模塑基座的所述第二模塑部设有至少一缺口，以在所述滤光构件被贴附于所述第二模塑部的所述第二上表面时，在所述第二模塑部的所述缺口处形成逃气孔，以通过所述逃气孔将所述模塑感光组件的内部空间与所述模塑感光组件的外部连通。In an embodiment of the present invention, the second molding portion of the molding base is provided with at least one notch, so that the filter member is attached to the second molding portion of the molding base. On the second upper surface, an air escape hole is formed at the notch of the second molding part, so as to communicate the inner space of the molded photosensitive element with the outside of the molded photosensitive element through the air escape hole.

在本发明的一实施例中，所述模塑基座的所述第二模塑部设有至少一缺口，以当所述滤光构件通过所述粘接层被粘接于所述第二模塑部的所述第二上表面时，在所述第二模塑部的所述缺口处形成逃气孔，以通过所述逃气孔将所述模塑感光组件的内部空间与所述模塑感光组件的外部连通。In an embodiment of the present invention, the second molding portion of the molding base is provided with at least one notch, so that when the filter member is bonded to the second mold through the bonding layer When the second upper surface of the molding part is formed, an air escape hole is formed at the notch of the second molding part, so as to connect the inner space of the molded photosensitive element with the molded part through the air escape hole External communication of the photosensitive assembly.

在本发明的一实施例中，所述第二模塑部的所述缺口自所述第二模塑部的第二内侧面横向地延伸至所述第二模塑部的第二外侧面，以便形成横向布置的所述逃气孔。In an embodiment of the present invention, the notch of the second molding portion laterally extends from the second inner side surface of the second molding portion to the second outer side surface of the second molding portion, so as to form the vent holes arranged laterally.

在本发明的一实施例中，所述的模塑感光组件，其中，所述模塑基座还包括一模塑加强部，其中所述模塑加强部在所述第二模塑部的所述缺口处自所述第二模塑部一体地向外延伸而成。In an embodiment of the present invention, the molding photosensitive component, wherein the molding base further includes a molding reinforcing portion, wherein the molding reinforcing portion is located at the position of the second molding portion. The notch is integrally formed by extending outward from the second molding part.

在本发明的一实施例中，所述的模塑感光组件，其中，所述模塑加强部与所述第一模塑部一体地连接，以在所述第二模塑部的所述第二外侧面与所述第一模塑部的所述第一上表面之间形成加强肋。In an embodiment of the present invention, in the molded photosensitive component, wherein the molding reinforcing portion is integrally connected with the first molding portion, so that the first molding portion of the second molding portion is connected to the first molding portion. A reinforcing rib is formed between the two outer side surfaces and the first upper surface of the first molding part.

在本发明的一实施例中，所述的模塑感光组件，还包括一加强粘接块，其中所述加强粘接块由在所述第二所述模塑部的所述缺口处施涂的粘接剂固化而成。In an embodiment of the present invention, the molded photosensitive component further includes a reinforcing adhesive block, wherein the reinforcing adhesive block is applied at the notch of the second molding part adhesive cured.

根据本发明的另一方面，本发明进一步提供了一种摄像模组，至少一光学镜头；和According to another aspect of the present invention, the present invention further provides a camera module, at least one optical lens; and

上述任一所述的模塑感光组件，其中每所述光学镜头被对应地设置于所述模塑感光组件，并且所述光学镜头对应于所述模塑感光组件的所述成像组件的感光路径。Any one of the above-mentioned molded photosensitive components, wherein each of the optical lenses is correspondingly disposed on the molded photosensitive components, and the optical lenses correspond to the photosensitive paths of the imaging components of the molded photosensitive components .

在本发明的一实施例中，所述的摄像模组，还包括至少一驱动器，其中每所述驱动器被组装于所述模塑感光组件的所述模塑基座，并且每所述光学镜头分别被组装于所述驱动器，以组装成变焦摄像模组。In an embodiment of the present invention, the camera module further includes at least one driver, wherein each of the drivers is assembled on the molded base of the molded photosensitive component, and each of the optical lenses are assembled to the driver respectively to form a zoom camera module.

在本发明的一实施例中，每所述光学镜头包括一镜筒和一镜片组，其中所述镜筒被设置于所述模塑感光组件的所述模塑基座，并且每所述光学镜头分别被组装于所述镜筒，以组装成定焦摄像模组。In an embodiment of the present invention, each of the optical lenses includes a lens barrel and a lens group, wherein the lens barrel is arranged on the molding base of the molded photosensitive component, and each of the optical lenses includes a lens barrel and a lens group. The lenses are respectively assembled in the lens barrel to form a fixed-focus camera module.

根据本发明的另一方面，本发明进一步提供了一种电子设备，包括：According to another aspect of the present invention, the present invention further provides an electronic device, comprising:

一电子设备本体；和an electronic device body; and

至少一上述任一所述的摄像模组，其中每所述摄像模组被设置于所述电子设备本体，用于获取图像。At least one camera module described above, wherein each camera module is disposed on the electronic device body for capturing images.

根据本发明的另一方面，本发明进一步提供了一种摄像模组的制造方法，包括步骤：According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module, comprising the steps of:

可导通地贴装一感光元件于一线路板，以形成一成像组件；A photosensitive element is conductively mounted on a circuit board to form an imaging assembly;

藉由成型模具，在所述成像组件上模塑形成一模塑基座，其中所述模组基座包括一第一模塑部和一第二模塑部，其中所述第一模塑部包覆所述成像组件的一部分，其中所述第二模塑部一体地形成于所述第一模塑部的第一上表面，并且所述第二模塑部的第二上表面高于所述第一模塑部的第一上表面，以通过所述第二模塑部的第二外侧面与所述第一模塑部的所述第一上表面定义形成一外空间；A molding base is formed on the imaging component by molding a mold, wherein the mold base includes a first molding part and a second molding part, wherein the first molding part A part of the imaging assembly is covered, wherein the second molding part is integrally formed on the first upper surface of the first molding part, and the second upper surface of the second molding part is higher than the the first upper surface of the first molding part defines an outer space by the second outer side surface of the second molding part and the first upper surface of the first molding part;

贴附所述滤光构件于所述第二模塑部的所述第二上表面，并且所述滤光构件对应于所述成像组件的所述感光路径，以组装成所述模塑感光组件；以及The filter member is attached to the second upper surface of the second molding part, and the filter member corresponds to the photosensitive path of the imaging assembly, so as to be assembled into the molded photosensitive assembly ;as well as

对应地设置至少一光学镜头于所述模塑感光组件。Correspondingly, at least one optical lens is disposed on the molded photosensitive component.

在本发明的一实施例中，在所述藉由成型模具，在所述成像组件上模塑形成一模塑基座的步骤之前，还包括步骤：In an embodiment of the present invention, before the step of molding a molding base on the imaging component by using a molding die, it further includes the steps of:

相互间隔地安装一组电子元器件于所述线路板，其中每所述电子元器件分别与所述线路板可导通地连接。A group of electronic components are installed on the circuit board at a distance from each other, wherein each of the electronic components is respectively connected with the circuit board in a conductive manner.

在本发明的一实施例中，在所述藉由成型模具，在所述成像组件上模塑形成一模塑基座的步骤中：In an embodiment of the present invention, in the step of molding a molding base on the imaging component by using a molding die:

所述模塑基座还包括一第三模塑部，其中所述第三模塑部一体地形成于所述第一模塑部的所述第一上表面，其中所述第三模塑部位于所述第二模塑部的外侧，并且所述第三模塑部与所述第二模塑部间隔设置。The molding base further includes a third molding portion, wherein the third molding portion is integrally formed on the first upper surface of the first molding portion, wherein the third molding portion The third molding portion is located outside the second molding portion, and the third molding portion is spaced apart from the second molding portion.

在本发明的一实施例中，在所述藉由成型模具，在所述成像组件上模塑形成一模塑基座的步骤中：In an embodiment of the present invention, in the step of molding a molding base on the imaging component by using a molding die:

所述模塑基座的所述第二模塑部设有至少一缺口，其中所述缺口自所述第二模塑部的第二内侧面延伸至所述第二模塑部的第二外侧面。The second molding portion of the molding base is provided with at least one notch, wherein the notch extends from the second inner side of the second molding portion to the second outer side of the second molding portion side.

在本发明的一实施例中，所述贴附所述滤光构件于所述第二模塑部的所述第二上表面，以组装成所述模塑感光组件的步骤，包括步骤：In an embodiment of the present invention, the step of attaching the filter member to the second upper surface of the second molding portion to assemble the molded photosensitive component includes the steps of:

施涂粘接剂于所述第二模塑部的所述第二上表面；applying adhesive to the second upper surface of the second molding part;

对应地设置所述滤光构件于所述第二模塑部，并通过所述第二模塑部的所述缺口形成连通所述第二模塑部的所述外溢空间与所述第一模塑部的内部空间的逃气孔；以及Correspondingly, the filter member is arranged on the second molding part, and the overflow space of the second molding part and the first mold are formed through the gap of the second molding part. vent holes in the inner space of the plastic part; and

加热或光照所述粘接剂，以在所述滤光构件的所述下表面和所述第二模塑部的所述第二上表面之间形成所述粘接层。The adhesive is heated or irradiated to form the adhesive layer between the lower surface of the filter member and the second upper surface of the second molding part.

在本发明的一实施例中，所述贴附所述滤光构件于所述第二模塑部的所述第二上表面，以组装成所述模塑感光组件的步骤，包括步骤：In an embodiment of the present invention, the step of attaching the filter member to the second upper surface of the second molding portion to assemble the molded photosensitive component includes the steps of:

施涂粘接剂于所述滤光构件的所述下表面；applying an adhesive to the lower surface of the filter member;

对应地设置所述滤光构件于所述第二模塑部，并通过所述第二模塑部的所述缺口形成连通所述第二模塑部的所述外溢空间与所述第一模塑部的内部空间的逃气孔；以及Correspondingly, the filter member is arranged on the second molding part, and the overflow space of the second molding part and the first mold are formed through the gap of the second molding part. vent holes in the inner space of the plastic part; and

加热或光照所述粘接剂，以在所述滤光构件的所述下表面和所述第二模塑部的所述第二上表面之间形成所述粘接层。The adhesive is heated or irradiated to form the adhesive layer between the lower surface of the filter member and the second upper surface of the second molding part.

在本发明的一实施例中，所述对应地设置至少一光学镜头于所述模塑感光组件的步骤，包括步骤：In an embodiment of the present invention, the step of correspondingly disposing at least one optical lens on the molding photosensitive component includes the steps of:

组装所述光学镜头至一驱动器；和assembling the optical lens to a driver; and

对应地组装所述驱动器至所述模塑感光组件的所述模塑基座，以组装成变焦摄像模组。Correspondingly assemble the driver to the molding base of the molding photosensitive component to assemble a zoom camera module.

在本发明的一实施例中，所述对应地设置至少一光学镜头于所述模塑感光组件的步骤，包括步骤：In an embodiment of the present invention, the step of correspondingly disposing at least one optical lens on the molding photosensitive component includes the steps of:

组装所述光学镜头的一镜筒于所述模塑感光组件的所述模塑基座，并且所述光学镜头的一镜片组对应于所述成像组件的感光路径，以组装成定焦摄像模组。A lens barrel of the optical lens is assembled on the mold base of the molded photosensitive component, and a lens group of the optical lens corresponds to the photosensitive path of the imaging component, so as to be assembled into a fixed-focus camera module Group.

通过对随后的描述和附图的理解，本发明进一步的目的和优势将得以充分体现。Further objects and advantages of the present invention will be fully realized by an understanding of the ensuing description and drawings.

本发明的这些和其它目的、特点和优势，通过下述的详细说明，附图和权利要求得以充分体现。These and other objects, features and advantages of the present invention are fully embodied by the following detailed description, drawings and claims.

附图说明Description of drawings

图1示出了现有的摄像模组的剖视示意图。FIG. 1 shows a schematic cross-sectional view of a conventional camera module.

图2是根据本发明的一第一实施例的一种摄像模组的立体示意图。2 is a schematic perspective view of a camera module according to a first embodiment of the present invention.

图3示出了根据本发明的上述第一实施例的所述摄像模组的剖视示意图。FIG. 3 shows a schematic cross-sectional view of the camera module according to the first embodiment of the present invention.

图4示出了根据本发明的上述第一实施例的所述摄像模组的模塑感光组件的立体爆炸示意图。FIG. 4 shows a schematic exploded perspective view of the molded photosensitive component of the camera module according to the first embodiment of the present invention.

图5A和5B示出了根据本发明的上述第一实施例的所述摄像模组的第一变形实施方式。5A and 5B illustrate a first variant embodiment of the camera module according to the above-described first embodiment of the present invention.

图6示出了根据本发明的上述第一实施例的所述摄像模组的第二变形实施方式。FIG. 6 shows a second variant embodiment of the camera module according to the above-mentioned first embodiment of the present invention.

图7示出了根据本发明的上述第一实施例的所述摄像模组的第三变形实施方式。FIG. 7 shows a third variant embodiment of the camera module according to the above-mentioned first embodiment of the present invention.

图8示出了根据本发明的上述第一实施例的所述摄像模组的第四变形实施方式。FIG. 8 shows a fourth variant embodiment of the camera module according to the above-mentioned first embodiment of the present invention.

图9示出了根据本发明的上述第一实施例的所述摄像模组的第五变形实施方式。FIG. 9 shows a fifth variant embodiment of the camera module according to the above-mentioned first embodiment of the present invention.

图10A是根据本发明的一第二实施例的一种摄像模组的剖视示意图。10A is a schematic cross-sectional view of a camera module according to a second embodiment of the present invention.

图10B示出了根据本发明的上述第二实施例的所述摄像模组的模塑摄像模组的立体爆炸示意图。FIG. 10B shows a schematic exploded perspective view of the molded camera module of the camera module according to the second embodiment of the present invention.

图11A和11B示出了根据本发明的上述第二实施例的所述摄像模组的一个变形实施方式。11A and 11B illustrate a modified implementation of the camera module according to the above-mentioned second embodiment of the present invention.

图12示出了根据本发明的一第三实施例的摄像模组的制造步骤之一的示意图。FIG. 12 is a schematic diagram illustrating one of the manufacturing steps of the camera module according to a third embodiment of the present invention.

图13A示出了根据本发明的上述第三实施例的所述摄像模组的制造步骤之二的示意图。FIG. 13A shows a schematic diagram of the second manufacturing step of the camera module according to the third embodiment of the present invention.

图13B示出了根据本发明的上述第三实施例的所述摄像模组的所述制造步骤之二的一个变形实施方式。FIG. 13B shows a modified embodiment of the second manufacturing step of the camera module according to the third embodiment of the present invention.

图14示出了根据本发明的上述第三实施例的所述摄像模组的制造步骤之三的示意图。FIG. 14 shows a schematic diagram of the third manufacturing step of the camera module according to the third embodiment of the present invention.

图15是根据本发明的一实施例的一种摄像模组的制造方法的流程示意图。FIG. 15 is a schematic flowchart of a method for manufacturing a camera module according to an embodiment of the present invention.

图16示出了根据本发明的所述摄像模组的制造方法中粘接滤光构件的流程示意图。FIG. 16 shows a schematic flow chart of bonding the filter member in the manufacturing method of the camera module according to the present invention.

图17示出了根据本发明的所述摄像模组的制造方法中组装光学镜头的流程示意图。FIG. 17 shows a schematic flow chart of assembling an optical lens in the manufacturing method of the camera module according to the present invention.

图18是一种配置有根据本发明的所述摄像模组的电子设备的一个示例。FIG. 18 is an example of an electronic device equipped with the camera module according to the present invention.

具体实施方式Detailed ways

以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例，本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。The following description serves to disclose the invention to enable those skilled in the art to practice the invention. The preferred embodiments described below are given by way of example only, and other obvious modifications will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, improvements, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

本领域技术人员应理解的是，在本发明的揭露中，术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系，其仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此上述术语不能理解为对本发明的限制。It should be understood by those skilled in the art that in the disclosure of the present invention, the terms "portrait", "horizontal", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by vertical, horizontal, top, bottom, inner, outer, etc. is based on the orientation or positional relationship shown in the accompanying drawings, which are only for the convenience of describing the present invention and The description is simplified rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and thus the above terms should not be construed as limiting the invention.

在本发明中，权利要求和说明书中术语“一”应理解为“一个或多个”，即在一个实施例，一个元件的数量可以为一个，而在另外的实施例中，该元件的数量可以为多个。除非在本发明的揭露中明确示意该元件的数量只有一个，否则术语“一”并不能理解为唯一或单一，术语“一”不能理解为对数量的限制。In the present invention, the term "a" in the claims and the description should be understood as "one or more", that is, in one embodiment, the number of an element may be one, and in another embodiment, the number of the element may be one Can be multiple. Unless it is clearly indicated in the disclosure of the present invention that the number of the element is only one, the term "a" should not be construed as unique or single, and the term "a" should not be construed as a limitation on the number.

在本发明的描述中，需要理解的是，属于“第一”、“第二”等仅用于描述目的，而不能理解为指示或者暗示相对重要性。本发明的描述中，需要说明的是，除非另有明确的规定和限定，属于“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接或者一体地连接；可以是机械连接，也可以是电连接；可以是直接连接，也可以是通过媒介间接连结。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be understood that references to "first", "second", etc. are only for descriptive purposes, and should not be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise expressly specified and limited, “connected” and “connected” should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection or an integral connection ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through a medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。In the description of this specification, description with reference to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples", etc., mean specific features described in connection with the embodiment or example , structure, material or feature is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine the different embodiments or examples described in this specification, as well as the features of the different embodiments or examples, without conflicting each other.

随着模塑工艺的日益成熟，IOM(IR on Molding，滤光元件在模塑上)技术也逐渐被应用于摄像模组的封装过程中，以追逐小型化、轻薄化的发展潮流。特别地，如图1所示，现有的摄像模组1P为了进一步降低摄像模组的高度，通常会将所述模塑基座32P上贴附所述滤光片33P的部位向下凹陷以形成所述凹槽35P，使得所述模塑基座32P上贴附所述滤光片33P的部位低于安装所述光学镜头2P的部位，以使所述模塑基座32P形成内凹式阶梯结构，以便最大限度地缩小所述滤光片33P与所述成像组件31P的感光芯片311P之间的距离。As the molding process becomes more and more mature, the IOM (IR on Molding, filter element on molding) technology is also gradually applied to the packaging process of the camera module to pursue the development trend of miniaturization and thinning. In particular, as shown in FIG. 1 , in order to further reduce the height of thecamera module 1P, the portion of themold base 32P where thefilter 33P is attached is usually recessed downward to Thegroove 35P is formed so that the part where thefilter 33P is attached on themolding base 32P is lower than the part where theoptical lens 2P is installed, so that themolding base 32P is formed in a concave shape A stepped structure is used to minimize the distance between theoptical filter 33P and thephotosensitive chip 311P of theimaging assembly 31P.

然而，由于所述模塑基座32P的所述凹槽35P的拐角处并非直角，而会因模塑过程中覆膜工艺在所述凹槽35P的拐角处形成一过渡弧面351P，使得所述过渡弧面351P不可避免地会影响所述模塑基座32P提供平整的贴附面，因此在贴附所述滤光片33P时，所述滤光片33P不得不避让所述模塑基座32P上的所述过渡弧面351P，以确保所述滤光片33P被平整地贴附在所述模塑基座32P上。但为了避让所述凹槽35P的所述过渡弧面351P，所述滤光片22P的边缘将不得不远离所述凹槽35P的外侧壁，使得所述滤光片33P与所述模塑基座32P之间的接触面积不得不减小，即所述滤光片33P的底部支撑面积不得不变小，导致所述滤光片33P与所述模塑基座32P之间的连接强度大幅降低，进而影响摄像模组的可靠性。However, since the corners of thegrooves 35P of themolding base 32P are not right angles, atransition arc surface 351P is formed at the corners of thegrooves 35P due to the coating process during the molding process, so that the Thetransition arc surface 351P will inevitably affect themolding base 32P to provide a flat attachment surface, so when attaching thefilter 33P, thefilter 33P has to avoid the molding base Thetransition arc surface 351P on theseat 32P ensures that thefilter 33P is evenly attached to themolding base 32P. However, in order to avoid thetransition arc surface 351P of thegroove 35P, the edge of the filter 22P will have to be away from the outer sidewall of thegroove 35P, so that thefilter 33P and the molding base The contact area between thebases 32P has to be reduced, that is, the bottom support area of theoptical filter 33P has to be reduced, resulting in a significant reduction in the connection strength between theoptical filter 33P and themolding base 32P , thereby affecting the reliability of the camera module.

因此，为了解决上述问题，本发明提供了一种摄像模组和模塑感光组件及其制造方法，以便消除在模塑工艺中覆膜产生的过渡弧面对滤光构件产生的不利影响。具体地，如图2至图4所示，根据本发明的一第一实施例的一种摄像模组1被阐明，其中所述摄像模组1包括一模塑感光组件10和至少一光学镜头20，其中所述模塑感光组件10包括一成像组件11、一模塑基座12以及一滤光构件13，其中所述模塑基座12被模塑成型于所述成像组件11，并且所述滤光构件13被贴附于所述模塑基座12；其中所述光学镜头20被对应地设置于所述模组感光组件10，并且所述光学镜头20对应于所述成像组件11的感光路径110，以组装成所述摄像模组1。Therefore, in order to solve the above problems, the present invention provides a camera module, a molded photosensitive assembly and a manufacturing method thereof, so as to eliminate the adverse effect on the filter member caused by the transition arc generated by the coating during the molding process. Specifically, as shown in FIGS. 2 to 4 , a camera module 1 according to a first embodiment of the present invention is illustrated, wherein the camera module 1 includes a moldedphotosensitive component 10 and at least oneoptical lens 20, wherein the moldedphotosensitive component 10 includes animaging component 11, amolding base 12, and afilter member 13, wherein themolding base 12 is molded on theimaging component 11, and all the Thefilter member 13 is attached to themolding base 12 ; wherein theoptical lens 20 is correspondingly disposed on thephotosensitive assembly 10 of the module, and theoptical lens 20 corresponds to theimage forming assembly 11 . Thephotosensitive path 110 is assembled into the camera module 1 .

值得一提的是，尽管在附图2至图4和接下来的描述中以所述摄像模组仅包括一个所述光学镜头20为例，阐述本发明的所述摄像模组的特征和优势，本领域的技术人员可以理解的是，附图2至图4以及接下来的描述中揭露的所述摄像模组仅为举例，其并不构成对本发明的内容和范围的限制，例如，在所述摄像模组的其他示例中，所述光学镜头20的数量也可以超过一个，以形成阵列摄像模组。It is worth mentioning that, although the camera module includes only oneoptical lens 20 as an example in FIGS. 2 to 4 and the following description, the features and advantages of the camera module of the present invention are described. , those skilled in the art can understand that the camera modules disclosed in the accompanying drawings 2 to 4 and the following description are only examples, which do not constitute limitations on the content and scope of the present invention. In other examples of the camera module, the number of theoptical lenses 20 may be more than one to form an array camera module.

特别地，如图3所示，所述模塑感光组件10的所述模塑基座12包括一第一模塑部121、一第二模塑部122以及一第三模塑部123。所述第一模塑部121包覆所述成像组件11的一部分。所述第二模塑部122一体地形成于所述第一模塑部121的第一上表面1211，其中所述第二模塑部122具有一第二上表面1221，并且所述第二模塑部122的第二上表面1221高于所述第一模塑部121的所述第一上表面1211，以通过所述第二模塑部122的第二外侧面1222与所述第一模塑部121的所述第一上表面1211定义形成一外空间1201，也就是说，所述模塑基座12通过所述第二模塑部122的第二上表面1221为所述滤光构件13提供一高于所述第一上表面1211的贴附面，便于将所述滤光构件13贴附于所述模塑基座12的所述第二模塑部122。所述第三模塑部123一体地形成于所述第一模塑部121的所述第一上表面1211，其中所述第三模塑部123位于所述第二模塑部122的外侧，并且所述第三模塑部123与所述第二模塑部122间隔地设置，以在所述第三模塑部123与所述第二模塑部122之间形成所述外空间1201。Particularly, as shown in FIG. 3 , themolding base 12 of the moldingphotosensitive component 10 includes afirst molding part 121 , asecond molding part 122 and athird molding part 123 . Thefirst molding part 121 covers a part of theimaging assembly 11 . Thesecond molding portion 122 is integrally formed on the firstupper surface 1211 of thefirst molding portion 121, wherein thesecond molding portion 122 has a secondupper surface 1221, and thesecond molding portion 122 has a secondupper surface 1221. The secondupper surface 1221 of themolding part 122 is higher than the firstupper surface 1211 of thefirst molding part 121 , so as to pass through the secondouter side surface 1222 of thesecond molding part 122 and thefirst molding part 122 . The firstupper surface 1211 of themolding portion 121 defines anouter space 1201 , that is, themolding base 12 is the filter member through the secondupper surface 1221 of thesecond molding portion 122 13 provides an attaching surface higher than the firstupper surface 1211 , so as to facilitate attaching thefilter member 13 to thesecond molding portion 122 of themolding base 12 . Thethird molding portion 123 is integrally formed on the firstupper surface 1211 of thefirst molding portion 121 , wherein thethird molding portion 123 is located outside thesecond molding portion 122 , And thethird molding portion 123 and thesecond molding portion 122 are spaced apart to form theouter space 1201 between thethird molding portion 123 and thesecond molding portion 122 .

换言之，在本发明的这个实施例中，所述第二模塑部122和所述第三模塑部123均自所述第一模塑部121的所述第一上表面1211一体地向上延伸，以形成具有一体式结构的所述模塑基座12。也就是说，所述第二模塑部122和所述第三模塑部123均能够通过模塑工艺一体成型于所述第一模塑部121的所述第一上表面1211，使得整个所述模塑基座12具有一体式结构。可以理解的是，所述第一模塑部121的内部上下贯穿，以形成所述模塑基座12的光窗120，其中所述第二模塑部122围绕所述模塑基座12的所述光窗120，并且所述模塑基座12的所述光窗120对应于所述成像组件11的所述感光路径110。In other words, in this embodiment of the present invention, both thesecond molding portion 122 and thethird molding portion 123 integrally extend upward from the firstupper surface 1211 of thefirst molding portion 121 , to form the moldedbase 12 having a one-piece structure. That is, both thesecond molding part 122 and thethird molding part 123 can be integrally formed on the firstupper surface 1211 of thefirst molding part 121 through a molding process, so that the entire The moldedbase 12 has a one-piece structure. It can be understood that the interior of thefirst molding part 121 penetrates up and down to form thelight window 120 of themolding base 12 , wherein thesecond molding part 122 surrounds themolding base 12 . Thelight window 120 and thelight window 120 of themolding base 12 correspond to thephotosensitive path 110 of theimaging assembly 11 .

这样尽管在模塑过程中仍会因覆膜而在所述第三模塑部123的第三内侧面1233与所述第一模塑部121的所述第一上表面1211之间的连接处形成过渡弧面，但是由于所述第二模塑部122的所述第二上表面1221高于所述模塑基座12上的所述过渡弧面，即所述滤光构件13的贴附面高于所述模塑基座12上的所述过渡弧面，因此在将所述滤光构件13贴附至所述模塑基座12的所述贴附面时，所述滤光构件13的边缘能够处于所述外空间1201之内，而无需避让所述模塑基座12上的所述过渡弧面，使得所述滤光构件13的边缘能够尽可能地靠近所述第三模塑部123的所述第三内侧面1233，有助于增大所述滤光构件13的贴附面积，即所述滤光构件13的底部支撑面积得以变大，有助于增强所述滤光构件13与所述模塑基座12之间的连接强度，进而提高所述摄像模组1的可靠性。In this way, even in the molding process, the connection between the thirdinner side surface 1233 of thethird molding part 123 and the firstupper surface 1211 of thefirst molding part 121 will still be caused by the film coating. A transition arc surface is formed, but because the secondupper surface 1221 of thesecond molding part 122 is higher than the transition arc surface on themolding base 12 , that is, the attachment of thefilter member 13 The surface is higher than the transition arc surface on themolding base 12, so when thefilter member 13 is attached to the attachment surface of themolding base 12, the filter member The edge of thefilter member 13 can be located within theouter space 1201 without avoiding the transition arc surface on themolding base 12, so that the edge of thefilter member 13 can be as close to the third mold as possible. The thirdinner side surface 1233 of theplastic portion 123 helps to increase the attachment area of thefilter member 13, that is, the bottom support area of thefilter member 13 is enlarged, which helps to enhance thefilter member 13. The connection strength between theoptical member 13 and themolding base 12 further improves the reliability of the camera module 1 .

进一步地，如图3所示，由于所述模塑基座12的所述第二模塑部122的所述第二上表面1221高于所述第一模塑部121的所述第一上表面1211，并且所述第二模塑部122的所述第二上表面1221与所述模塑基座12上的所述过渡弧面之间没有接壤，因此所述模塑基座12能够通过所述第二模塑部122的所述第二上表面1221为所述滤光构件13提供一平整的贴附面。Further, as shown in FIG. 3 , because the secondupper surface 1221 of thesecond molding portion 122 of themolding base 12 is higher than the firstupper surface 1221 of thefirst molding portion 121surface 1211, and there is no border between the secondupper surface 1221 of thesecond molding part 122 and the transition arc surface on themolding base 12, so themolding base 12 can pass through The secondupper surface 1221 of thesecond molding portion 122 provides a flat attachment surface for thefilter member 13 .

优选地，所述第二模塑部122的所述第二上表面1221为一平整面，以便将所述滤光构件13平整地贴附于所述模塑基座12，保证所述滤光构件13具有良好的贴附质量。值得注意的是，受限于模塑工艺的模具压头尺寸，以及所述摄像模组1自身高度的考量，所述第二模塑部122的所述第二上表面1221相对于所述第一模塑部121的所述第一上表面1211的高度范围优选地被实施为0.03毫米至0.2毫米，即所述第二模塑部122的所述第二上表面1221与所述第一模塑部121的所述第一上表面1211之间的高度差h在0.03毫米至0.2毫米之间(如图3所示)。这样既能够满足模塑工艺的模具压头尺寸的需要，又能够避免因所述第二模塑部122的所述第二上表面1221过高而导致所述滤光构件13的安装高度较大，进而造成所述摄像模组1的自身高度变大。Preferably, the secondupper surface 1221 of thesecond molding part 122 is a flat surface, so that thefilter member 13 can be flatly attached to themolding base 12 to ensure the filter Themember 13 has a good quality of attachment. It is worth noting that, limited by the size of the mold indenter in the molding process and the height of the camera module 1 itself, the secondupper surface 1221 of thesecond molding portion 122 is relatively The height range of the firstupper surface 1211 of amolding part 121 is preferably implemented as 0.03 mm to 0.2 mm, that is, the secondupper surface 1221 of thesecond molding part 122 and the first mold The height difference h between the firstupper surfaces 1211 of theplastic part 121 is between 0.03 mm and 0.2 mm (as shown in FIG. 3 ). In this way, it can not only meet the requirements of the size of the mold indenter in the molding process, but also avoid that the secondupper surface 1221 of thesecond molding part 122 is too high and the installation height of thefilter member 13 is relatively large. , thereby causing the height of the camera module 1 to increase.

此外，如图3和图4所示，所述模塑基座12的所述第三模塑部123位于所述第二模塑部122的外侧，并且所述第三模塑部123与所述第二模塑部122间隔设置，以在所述第三模塑部123和所述第二模塑部122之间预留出所述模塑基座12的所述外空间1201。换言之，所述第三模塑部123的第三内侧面1233位于所述第二模塑部122的所述第二外侧面1222的外侧，也就是说，所述第三模塑部123的所述第三内侧面1233与所述成像组件11的所述感光路径110之间的最小距离r₃大于所述第二模塑部122的所述第二外侧面1222与所述成像组件11的所述感光路径110之间的最大距离R₂，即r₃＞R₂，以通过所述第一模塑部121的所述第一上表面1211与所述第二模塑部122的所述第二上表面1221和所述第三模塑部123的所述第三上表面1231之间高度差，在所述模塑基座12上形成凹槽，即在所述第三模塑部123的所述第三内侧面1233与所述第二模塑部122的所述第二外侧面1222之间形成所述模塑基座12的所述外空间1201，以便在贴附所述滤光构件13时，所述滤光构件13的边缘能够伸入所述外空间1201以靠近所述第三模塑部123的所述第三内侧面1233，而不会受到所述第三模塑部123的所述第三内侧面1233与所述第一模塑部121的所述第一上表面1211之间的过渡弧面的影响。In addition, as shown in FIGS. 3 and 4 , thethird molding portion 123 of themolding base 12 is located outside thesecond molding portion 122 , and thethird molding portion 123 is connected to the Thesecond molding parts 122 are arranged at intervals to reserve theouter space 1201 of themolding base 12 between thethird molding part 123 and thesecond molding part 122 . In other words, the thirdinner side surface 1233 of thethird molding part 123 is located outside the secondouter side surface 1222 of thesecond molding part 122 , that is, all thethird molding part 123 is The minimum distance r₃ between the thirdinner side 1233 and thephotosensitive path 110 of theimaging assembly 11 is greater than the distance r 3 between the secondouter side 1222 of thesecond molding part 122 and theimaging element 11 . The maximum distance R₂ between thephotosensitive paths 110 , that is, r₃ >R₂ , so as to pass through the firstupper surface 1211 of thefirst molding part 121 and thesecond molding part 122 . The height difference between the secondupper surfaces 1221 and the thirdupper surface 1231 of thethird molding part 123 forms a groove on themolding base 12 , that is, on thethird molding part 123 . Theouter space 1201 of themolding base 12 is formed between the thirdinner side surface 1233 and the secondouter side surface 1222 of thesecond molding portion 122 so that the filter member can be attached 13, the edge of thefilter member 13 can protrude into theouter space 1201 to be close to the thirdinner side surface 1233 of thethird molding part 123 without being affected by thethird molding part 123 The influence of the transition arc surface between the thirdinner side surface 1233 and the firstupper surface 1211 of thefirst molding part 121.

优选地，受限于模塑工艺的最小模具压头尺寸，所述第三模塑部123的第三内侧面1233与所述第二模塑部122的所述第二外侧面1222之间的距离d不小于0.01毫米(如图3所示)，也就是说，所述模塑基座12的所述外空间1201的宽度不小于0.01毫米。Preferably, limited by the minimum die indenter size of the molding process, the distance between the thirdinner side 1233 of thethird molding part 123 and the secondouter side 1222 of thesecond molding part 122 The distance d is not less than 0.01 mm (as shown in FIG. 3 ), that is, the width of theouter space 1201 of themolding base 12 is not less than 0.01 mm.

当然，在本发明的这个实施例中，由于所述第一模塑部121的内部上下贯穿，即所述第一模塑部121的第一内侧面1213定义出所述模塑基座12的所述光窗120。因此，如图3所示，所述第二模塑部122的第二内侧面1223与所述成像组件11的所述感光路径110之间的最小距离r₂不小于所述第一模塑部121的所述第一内侧面1213与所述成像组件11的所述感光路径110之间的最大距离r₁，即r₂≥r₁，以防所述第二模塑部122遮挡所述成像组件11的所述感光路径110。Of course, in this embodiment of the present invention, since the interior of thefirst molding part 121 penetrates up and down, that is, the firstinner side surface 1213 of thefirst molding part 121 defines the surface of themolding base 12 . thelight window 120 . Therefore, as shown in FIG. 3 , the minimum distance r₂ between the secondinner side surface 1223 of thesecond molding part 122 and thephotosensitive path 110 of theimaging assembly 11 is not less than the first molding part The maximum distance r₁ between the firstinner side surface 1213 of the 121 and thephotosensitive path 110 of theimaging assembly 11 , that is, r₂ ≥ r₁ , in order to prevent thesecond molding part 122 from blocking the imaging Thephotosensitive path 110 of theassembly 11 .

值得一提的是，在本发明的所述第一实施例中，如图3和图4所示，所述成像组件11包括一线路板111和至少一感光元件112，其中每个所述感光元件112分别被可导通地贴装于所述线路板111的不同位置，并且每个所述感光元件112的感光区域对应于相应的所述光学镜头20。此外，当所述滤光构件13被对应地贴附于所述模塑基座12的所述第二模塑部122时，所述滤光构件13对应于所述感光元件112，并在所述滤光构件13和所述感光元件112之间形成所述模塑感光组件10的一内部空间100。It is worth mentioning that, in the first embodiment of the present invention, as shown in FIG. 3 and FIG. 4 , theimaging assembly 11 includes acircuit board 111 and at least onephotosensitive element 112 , wherein eachphotosensitive element 112 Theelements 112 are respectively mounted on different positions of thecircuit board 111 in a conductive manner, and the photosensitive area of each of thephotosensitive elements 112 corresponds to the correspondingoptical lens 20 . In addition, when thefilter member 13 is correspondingly attached to thesecond molding portion 122 of themolding base 12 , thefilter member 13 corresponds to thephotosensitive element 112 Aninner space 100 of the moldedphotosensitive component 10 is formed between thefilter member 13 and thephotosensitive element 112 .

进一步地，如图3和图4所示，所述模塑感光组件10还可以包括一粘接层14，其中所述粘接层14由粘接剂固化之后形成，并且所述粘接层14位于所述滤光构件13的下表面131和所述第二模塑部122的所述第二上表面1221之间，以将所述滤光构件13牢靠地贴附于所述模塑部基座12，使得所述滤光构件13对应于所述成像组件11的所述感光路径110。更具体地，当所述滤光构件13被贴附于所述模塑基座12的所述第二模塑部122时，所述滤光构件13的所述下表面131朝下以面向所述成像组件11，并且所述滤光构件13的上表面132相应地朝上以面向所述光学镜头20。Further, as shown in FIG. 3 and FIG. 4 , the moldedphotosensitive assembly 10 may further include anadhesive layer 14 , wherein theadhesive layer 14 is formed after the adhesive is cured, and theadhesive layer 14 between thelower surface 131 of thefilter member 13 and the secondupper surface 1221 of thesecond molding part 122, so as to firmly attach thefilter member 13 to the base of the molding part Theseat 12 is placed so that thefilter member 13 corresponds to thephotosensitive path 110 of theimaging assembly 11 . More specifically, when thefilter member 13 is attached to thesecond molding portion 122 of themolding base 12, thelower surface 131 of thefilter member 13 faces downward to face the theimaging assembly 11 , and theupper surface 132 of thefilter member 13 faces upwards to face theoptical lens 20 accordingly.

而由于形成所述粘接层14的粘接剂在固化之前具有一定的流动性，特别是在贴附所述滤光构件13时，所述滤光构件13将对固化前的粘接剂施压，导致固化前的粘接剂必然会发生溢流，因此所述外空间1201的存在还可以引导所述粘接剂向外溢流，便于在一定程度上减少所述粘接剂向内溢流，以免所述粘接剂向内流至所述第一模塑部121的所述第一内侧面1213和所述成像组件11的所述感光元件112，有助于降低所述粘接剂影响所述摄像模组1的成像质量的风险。Since the adhesive forming theadhesive layer 14 has a certain fluidity before curing, especially when thefilter member 13 is attached, thefilter member 13 will apply the adhesive to the adhesive before curing. Therefore, the presence of theouter space 1201 can also guide the adhesive to overflow outward, so as to reduce the inward overflow of the adhesive to a certain extent. , so as to prevent the adhesive from flowing inward to the firstinner side surface 1213 of thefirst molding part 121 and thephotosensitive element 112 of theimaging assembly 11, which helps to reduce the influence of the adhesive The risk of the imaging quality of the camera module 1 .

换言之，正是由于所述模塑基座12的所述第二模塑部122的所述第二上表面1221高于所述第一模塑部121的所述第一上表面1211，使得所述模塑基座12的所述外空间1201位于所述第二模塑部122的周围，并作为所述模塑基座12上用于容纳粘接剂的外溢空间，因此当所述滤光构件13通过粘接剂被贴附于所述第二模塑部122的所述第二上表面1221时，所述第二模塑部122的外周缘能够位于所述模塑基座12的所述外空间1201，使得固化前的粘接剂能够向外溢流至所述模塑基座12的所述外空间1201(即所述模塑基座12的所述外空间1201可以作为所述模塑基座12的外溢胶空间)，以减小所述粘接剂向内溢流的量，有助于降低因所述粘接剂向内溢流至所述感光元件112而影响所述摄像模组1的成像质量的风险。In other words, it is precisely because the secondupper surface 1221 of thesecond molding part 122 of themolding base 12 is higher than the firstupper surface 1211 of thefirst molding part 121 that the Theouter space 1201 of themolding base 12 is located around thesecond molding portion 122, and serves as an overflow space for accommodating the adhesive on themolding base 12, so when the filter When themember 13 is attached to the secondupper surface 1221 of thesecond molding part 122 by an adhesive, the outer peripheral edge of thesecond molding part 122 can be located on any part of themolding base 12 . theouter space 1201, so that the adhesive before curing can overflow to theouter space 1201 of the molding base 12 (that is, theouter space 1201 of themolding base 12 can serve as the mold base 12). The overflow space of the plastic base 12 ) to reduce the amount of the adhesive overflowing inward, which is helpful to reduce the influence of the camera due to the inward overflow of the adhesive to thephotosensitive element 112 . Risk to Image Quality for Module 1.

可以理解的是，对于现有的摄像模组1P而言,如图1所示，虽然在所述模塑基座32P上设置凹槽35P能够进一步减小所述滤光片33P与所述感光芯片311P之间的距离，以最大限度地缩小所述感光组件30P的厚度，但是在所述滤光片33P被贴附于所述模塑基座32P的所述凹槽35P之后，所述滤光片33P的周围不仅没有溢胶空间，而且所述模塑基座32P的所述凹槽35P的所述过渡弧面351P还会不可避免地阻挡用于粘接所述滤光片33P的胶水向外溢胶，导致更多的胶水将会向内溢胶，极易造成胶水向内溢流至所述成像组件31P的所述感光芯片311P，对所述感光芯片311P造成污染，进而影响摄像模组的成像质量。而在本发明的上述第一实施例的所述摄像模组1中，所述模塑感光组件10的所述模塑基座12不仅能够提供足够大且平整的贴附面，用于在无需避让过渡弧面的情况下牢靠地且平整地贴附所述滤光构件13；而且还能够提供粘接剂向外溢流的外溢空间，以缓解固化前的粘接剂向内溢流而影响摄像模组的成像质量。It can be understood that, for the existingcamera module 1P, as shown in FIG. 1, although thegrooves 35P are arranged on themolding base 32P, thefilter 33P and the photosensitive material can be further reduced. The distance between thechips 311P to minimize the thickness of the photosensitive element 30P, but after thefilter 33P is attached to thegroove 35P of themold base 32P, the filter Not only there is no glue overflowing space around thelight sheet 33P, but also thetransition arc surface 351P of thegroove 35P of themolding base 32P will inevitably block the glue used for bonding thelight filter 33P. If the glue overflows, more glue will overflow into the inside, which will easily cause the glue to overflow to thephotosensitive chip 311P of theimaging unit 31P, causing pollution to thephotosensitive chip 311P, which in turn affects the camera module. group imaging quality. In the camera module 1 of the first embodiment of the present invention, themolding base 12 of the moldingphotosensitive component 10 can not only provide a sufficiently large and flat attachment surface for Thefilter member 13 is firmly and evenly attached to thefilter member 13 under the condition of avoiding the transition arc surface; and an overflow space for the adhesive to overflow to the outside can also be provided, so as to alleviate the inward overflow of the adhesive before curing and affect the camera. Image quality of the module.

值得注意的是，在本发明的上述第一实施例中，所述模塑感光组件10的所述粘接层14可以但不限于由诸如热固化胶等等之类的胶水固化而成，换言之，形成所述粘接层14的所述粘接剂可以但不限于被实施为诸如热固化胶等等之类的胶水。当然，在本发明的其他示例中，形成所述粘接层14的所述粘接剂还可以被实施为诸如光固化胶其他类型的粘性材料，只要能够形成所述粘接层14以将所述滤光构件13牢靠地贴附于所述第二模塑部122的所述第二上表面1221即可，本发明对此不再赘述。It is worth noting that in the above-mentioned first embodiment of the present invention, theadhesive layer 14 of the moldedphotosensitive component 10 can be, but is not limited to, cured by glue such as heat-curable glue, etc., in other words , the adhesive forming theadhesive layer 14 may be, but not limited to, be implemented as a glue such as a heat-curable glue or the like. Of course, in other examples of the present invention, the adhesive for forming theadhesive layer 14 may also be implemented as other types of adhesive materials such as photocurable glue, as long as theadhesive layer 14 can be formed to Thefilter member 13 only needs to be firmly attached to the secondupper surface 1221 of thesecond molding portion 122 , which will not be repeated in the present invention.

根据本发明的上述第一实施例，如图3所示，本发明的所述模塑感光组件10的所述成像组件11通常还会包括一组电子元器件113，其中每个所述电子元器件113可以通过诸如SMT(Surface Mount Technology，表面安装技术)工艺被相互间隔地安装于所述线路板111的边缘区域，并且每所述电子元器件113分别与所述线路板111可导通地连接。可以理解的是每个所述电子元器件113可以分别位于所述感光元件112的四周，也可以位于所述感光元件112的同一侧或相对两侧，例如在一个具体示例中，所有的所述电子元器件113可以分为两列，并且被对称地设置于所述感光元件112的两侧。According to the above-mentioned first embodiment of the present invention, as shown in FIG. 3 , theimaging component 11 of the moldedphotosensitive component 10 of the present invention generally further includes a set ofelectronic components 113 , wherein each electronic component Thedevices 113 may be mounted on the edge area of thecircuit board 111 at a distance from each other through processes such as SMT (Surface Mount Technology), and each of theelectronic components 113 is conductively connected to thecircuit board 111 . connect. It can be understood that each of theelectronic components 113 may be respectively located around thephotosensitive element 112, or may be located on the same side or opposite sides of thephotosensitive element 112, for example, in a specific example, all the Theelectronic components 113 can be divided into two columns, and are symmetrically arranged on both sides of thephotosensitive element 112 .

然而，由于模塑工艺存在最小厚度，模塑厚度太小会导致模塑成像困难，因此为了确保所述模塑基座12能够完整地包覆所述电子元器件113，所述模塑基座12的所述第三模塑部123优选地对应于所述成像组件11的所述电子元器件113，并且所述第三模塑部123的所述第三上表面1231高于所述电子元器件113的顶表面，对应于所述成像组件11的所述电子元器件113，以通过所述第三模塑部123来保证所述电子元器件113上方具有足够的模塑成型厚度。However, due to the minimum thickness in the molding process, too small molding thickness will lead to difficulty in molding and imaging. Therefore, in order to ensure that themolding base 12 can completely cover theelectronic components 113, the molding base Thethird molding portion 123 of 12 preferably corresponds to theelectronic component 113 of theimaging assembly 11, and the thirdupper surface 1231 of thethird molding portion 123 is higher than the electronic component. The top surface of thedevice 113 corresponds to theelectronic component 113 of theimaging assembly 11 , so as to ensure a sufficient molding thickness above theelectronic component 113 through thethird molding portion 123 .

换句话说，如图3和图4所示，所述第三模塑部123被一体地成型于所述第一模塑部121的所述第一上表面1211，以使所述第三模塑部123的所述第三上表面1231高于所述第一模塑部121的所述第一上表面1211。此外，由于所述第三模塑部123对应于所述成像组件11的所述电子元器件113，因此所述第一模塑部121的所述第一上表面1211可以不必高于所述电子元器件113的顶表面，以通过所述第三模塑部123和所述第一模塑部121来完整地包覆所述电子元器件113。可以理解的是，所述模塑基座12在成型后包覆每个所述电子元器件113，以藉由所述模塑基座12隔离相邻所述电子元器件113和隔离所述电子元器件113与所述感光元件112，使得相邻所述电子元器件113之间不会出现相互干扰的不良现象，即便是相邻所述电子元器件113的距离较近时也能够保证所述摄像模组1的成像品质。这样可以在小面积的所述线路板111上贴装更多数量的所述电子元器件113，从而使所述模塑感光组件10的结构更加的紧凑，以有利于在控制所述摄像模组1的尺寸的基础上提高所述摄像模组1的成像品质。In other words, as shown in FIGS. 3 and 4 , thethird molding part 123 is integrally molded on the firstupper surface 1211 of thefirst molding part 121 so that thethird molding part 123 The thirdupper surface 1231 of themolding part 123 is higher than the firstupper surface 1211 of thefirst molding part 121 . In addition, since thethird molding part 123 corresponds to theelectronic component 113 of theimaging assembly 11 , the firstupper surface 1211 of thefirst molding part 121 may not necessarily be higher than theelectronic component 113 . The top surface of thecomponent 113 can completely cover theelectronic component 113 through thethird molding part 123 and thefirst molding part 121 . It can be understood that themolding base 12 covers each of theelectronic components 113 after molding, so as to isolate the adjacentelectronic components 113 and theelectronic components 113 by themolding base 12 . Thecomponents 113 and thephotosensitive elements 112 can prevent the bad phenomenon of mutual interference between the adjacentelectronic components 113. Even when the distance between the adjacentelectronic components 113 is short, the The imaging quality of the camera module 1. In this way, a larger number of theelectronic components 113 can be mounted on thecircuit board 111 with a small area, so that the structure of the moldedphotosensitive assembly 10 is more compact, which is beneficial to control the camera module On the basis of the size of 1, the imaging quality of the camera module 1 is improved.

值得注意的是，正是由于所述第一模塑部121的所述第一上表面1211可以低于所述电子元器件113的顶表面，使得所述第二模塑部122的所述第二上表面1221可以不受所述电子元器件113的尺寸影响，即所述第二模塑部122的所述第二上表面1221也可以低于所述电子元器件113的顶表面，因此所述第二模塑部122的所述第二上表面1221也可以降低，使得所述滤光构件13的贴附高度得以降低，有助于缩短所述滤光构件13与所述成像组件11的所述感光元件112之间的距离，以便缩小所述摄像模组1的后焦，有利于缩减所述摄像模组1的高度。It is worth noting that because the firstupper surface 1211 of thefirst molding part 121 may be lower than the top surface of theelectronic component 113 , the firstupper surface 1211 of thesecond molding part 122 is The secondupper surface 1221 may not be affected by the size of theelectronic component 113, that is, the secondupper surface 1221 of thesecond molding part 122 may also be lower than the top surface of theelectronic component 113, so the The secondupper surface 1221 of thesecond molding part 122 can also be lowered, so that the attachment height of thefilter member 13 can be reduced, which helps to shorten the distance between thefilter member 13 and theimaging assembly 11 . The distance between thephotosensitive elements 112 can reduce the back focus of the camera module 1 , which is beneficial to reduce the height of the camera module 1 .

值得一提的是，在本发明的这个第一实施例中，所述滤光构件13包括至少一滤光元件，其中每个所述滤光元件分别对应地设置于所述成像组件11的所述感光元件112，以在每个所述滤光元件和所述感光元件112之间分别形成每个所述内部空间100。此外，所述滤光元件位于所述光学镜头20和所述感光元件112之间，以使自所述光学镜头20进入所述摄像模组1的内部的光线在穿过所述滤光元件的过滤后，才能够被所述感光元件112的所述感光区域接收和进行光电转化，从而改善所述摄像模组的成像品质，例如所述滤光元件可以过滤自所述光学镜头20进入所述摄像模组1的内部的光线中的红外线部分。当然，在本发明的其他示例中，所述滤光构件13还可以包括一贴附框架(图中未示出)，其中所述贴附框架位于所述滤光元件的边缘，以通过所述贴附框架避免所述滤光元件与所述粘接层14直接接触，以避免所述滤光元件被所述粘接层14污染或腐蚀，有效地延长所述滤光元件的使用寿命。可以理解的是，在所述摄像模组1的不同示例中，所述滤光元件能够被实施为不同的类型，例如所述滤光元件能够被实施为红外截止滤光片、全透光谱滤光片以及其他的滤光片或者多个滤光片的组合。It is worth mentioning that, in the first embodiment of the present invention, thefilter member 13 includes at least one filter element, wherein each filter element is correspondingly disposed on all theimaging components 11 . Thephotosensitive elements 112 are respectively formed to form each of theinner spaces 100 between each of the filter elements and thephotosensitive elements 112 . In addition, the filter element is located between theoptical lens 20 and thephotosensitive element 112, so that the light entering the camera module 1 from theoptical lens 20 passes through the filter element. After filtering, it can be received by the photosensitive area of thephotosensitive element 112 and photoelectrically converted, so as to improve the imaging quality of the camera module. The infrared part of the light inside the camera module 1 . Of course, in other examples of the present invention, thefilter member 13 may further include an attaching frame (not shown in the figure), wherein the attaching frame is located at the edge of the filter element so as to pass the filter element. The attachment frame prevents the filter element from directly contacting theadhesive layer 14 , so as to prevent the filter element from being polluted or corroded by theadhesive layer 14 , and effectively prolong the service life of the filter element. It can be understood that, in different examples of the camera module 1, the filter element can be implemented as different types, for example, the filter element can be implemented as an infrared cut filter, a fully transparent spectral filter Optical filters and other filters or combinations of filters.

此外，根据本发明的上述第一实施例，参考附图2和图3，所述摄像模组1还可以包括至少一驱动器30，其中每个所述光学镜头20分别被组装于每个所述驱动器30，每个所述驱动器30分别被组装于所述模塑基座12的所述第三模塑部123的所述第三上表面1231，以使每个所述光学镜头10分别被保持在所述模塑感光组件10的所述成像组件11的所述感光路径110，以组装成变焦摄像模组。另外，在使用所述摄像模组1时，所述驱动器30能够驱动所述光学镜头20沿着所述成像组件11的所述感光路径110来回移动，以通过调整所述光学镜头20和所述感光元件112的距离的方式调整所述摄像模组1的焦距。本发明的所述摄像模组的所述驱动器30的类型不受限制，所述驱动器30可以被实施为音圈马达，其能够被电连接于所述线路板111，以在接收电能和控制信号后处于工作状态，而驱动所述光学镜头20沿着所述成像组件11的所述感光路径110来回移动。尽管如此，本领域的技术人员可以理解的是，所述驱动器30的类型不受限制，其只要能够驱动所述光学镜头20沿着所述成像组件11的所述感光路径110来回移动即可。In addition, according to the above-mentioned first embodiment of the present invention, referring to FIGS. 2 and 3 , the camera module 1 may further include at least onedriver 30 , wherein each of theoptical lenses 20 is assembled to each of theDrivers 30 , each of which is assembled to the thirdupper surface 1231 of thethird molding portion 123 of themolding base 12 , so that each of theoptical lenses 10 is respectively held Thephotosensitive path 110 of theimaging assembly 11 of the moldedphotosensitive assembly 10 is assembled into a zoom camera module. In addition, when using the camera module 1, thedriver 30 can drive theoptical lens 20 to move back and forth along thephotosensitive path 110 of theimaging assembly 11, so as to adjust theoptical lens 20 and the The focal length of the camera module 1 is adjusted by the distance of thephotosensitive element 112 . The type of thedriver 30 of the camera module of the present invention is not limited, thedriver 30 can be implemented as a voice coil motor, which can be electrically connected to thecircuit board 111 to receive power and control signals when After that, theoptical lens 20 is driven to move back and forth along thephotosensitive path 110 of theimaging assembly 11 . However, those skilled in the art can understand that the type of thedriver 30 is not limited, as long as it can drive theoptical lens 20 to move back and forth along thephotosensitive path 110 of theimaging assembly 11 .

具体地说，如图2和图3所示，所述摄像模组1的所述光学镜头20包括一镜筒21和一镜片组22，其中所述镜筒21被组装于所述驱动器30，并且所述镜片组22被组装于所述镜筒21，其中所述驱动器30被安装于所述模塑基座12的所述第三模塑部123的所述第三上表面1231，以藉由所述驱动器30使所述光学镜头20的所述镜片组22被保持在所述模塑感光组件10的所述成像组件11的所述感光路径110。Specifically, as shown in FIGS. 2 and 3 , theoptical lens 20 of the camera module 1 includes alens barrel 21 and alens group 22 , wherein thelens barrel 21 is assembled to thedriver 30 , And thelens group 22 is assembled to thelens barrel 21 , wherein thedriver 30 is mounted on the thirdupper surface 1231 of thethird molding portion 123 of themolding base 12 , so as to Thelens group 22 of theoptical lens 20 is held in thephotosensitive path 110 of theimaging component 11 of the moldedphotosensitive component 10 by thedriver 30 .

可以理解的是，在本发明的其他示例中，所述摄像模组1也可以不包括任何驱动器30，换言之，所述光学镜头20的所述镜筒21直接被组装于所述模塑基座12的所述第三模塑部123的所述第三上表面1231，其中所述镜片组22被组装于所述镜筒21，以藉由所述镜筒21使所述光学镜头20的所述镜片组22被保持在所述模塑感光组件10的所述成像组件11的所述感光路径110。当然，在本发明的另一示例中，所述光学镜头20的所述镜筒21也可以与所述模塑基座12的所述第三模塑部123通过模塑工艺藉由成型材料一体地固化成型，从而增强所述摄像模组1的稳定性和可靠性，本发明对此不再赘述。It can be understood that, in other examples of the present invention, the camera module 1 may not include anydriver 30, in other words, thelens barrel 21 of theoptical lens 20 is directly assembled on the molding base The thirdupper surface 1231 of thethird molding portion 123 of 12, wherein thelens group 22 is assembled to thelens barrel 21, so that all the Thelens group 22 is held in thephotosensitive path 110 of theimaging assembly 11 of the moldedphotosensitive assembly 10 . Of course, in another example of the present invention, thelens barrel 21 of theoptical lens 20 may also be integrated with thethird molding portion 123 of themolding base 12 through a molding process and a molding material. So as to enhance the stability and reliability of the camera module 1, the present invention will not repeat it.

附图5A和5B示出了根据本发明上述第一实施例的所述摄像模组1的第一变形实施方式。具体地，相比于根据本发明的上述第一实施例，根据本发明的所述第一变形实施方式的所述摄像模组1的区别在于：所述模塑基座12的所述第三模塑部123的第三外侧面1232位于所述第一模塑部121的所述第一外侧面1221的内侧，也就是说，所述第三模塑部123的所述第三外侧面1232与所述成像组件11的所述感光路径110之间的最大距离R₃小于所述第一模塑部121的所述第一外侧面1221与所述成像组件11的所述感光路径110之间的最小距离R₁，即R₃＜R₁，以在所述第一模塑部121的所述第一上表面1211上且所述第三模塑部123的外侧为所述驱动器30预留安装空间，以便将所述驱动器30对应地安装至所述第一模塑部121的所述第一上表面1211，有助于降低所述摄像模组1的整体高度。5A and 5B show a first variant embodiment of the camera module 1 according to the above-mentioned first embodiment of the present invention. Specifically, compared with the above-mentioned first embodiment of the present invention, the camera module 1 according to the first modified embodiment of the present invention is different in that the third The thirdouter side 1232 of themolding part 123 is located inside the firstouter side 1221 of thefirst molding part 121 , that is, the thirdouter side 1232 of thethird molding part 123 The maximum distance R₃ from thephotosensitive path 110 of theimaging assembly 11 is smaller than that between the firstouter side surface 1221 of thefirst molding part 121 and thephotosensitive path 110 of theimaging assembly 11 The minimum distance R₁ , that is, R₃ <R₁ , is reserved for thedriver 30 on the firstupper surface 1211 of thefirst molding part 121 and outside thethird molding part 123 There is an installation space for correspondingly installing thedriver 30 on the firstupper surface 1211 of thefirst molding part 121 , which helps to reduce the overall height of the camera module 1 .

换句话说，如图5A所示，所述模塑基座12的所述第三模塑部123的第三外侧面1232位于所述第一模塑部121的所述第一外侧面1221的内侧，使得所述驱动器30能够直接被安装至所述模塑基座12的所述第一模塑部121的所述第一上表面1211。而由于所述第一模塑部121的所述第一上表面1211低于所述第三模塑部123的所述第三上表面1231，使得所述驱动器30的安装高度得以降低，有助于降低所述摄像模组1的整体高度。In other words, as shown in FIG. 5A , the thirdouter side surface 1232 of thethird molding portion 123 of themolding base 12 is located on the side of the firstouter side surface 1221 of thefirst molding portion 121 . inside, so that thedriver 30 can be directly mounted to the firstupper surface 1211 of thefirst molding part 121 of themolding base 12 . Since the firstupper surface 1211 of thefirst molding part 121 is lower than the thirdupper surface 1231 of thethird molding part 123 , the installation height of thedriver 30 is reduced, which is beneficial to In order to reduce the overall height of the camera module 1 .

值得一提的是，在本发明的这个变形实施方式中，由于所述第三模塑部123只需包覆所述电子元器件113的顶部即可，即所述第三模塑部123的位置仅对应于所述成像组件11的所述电子元器件113即可，因此所述第三模塑部123不需要具有环形结构，而可以根据所述电子元器件113的位置和尺寸来设计所述第三模塑部123的位置和尺寸。例如，如图5B所示，当所有的所述电子元器件113仅位于所述滤光构件13的长边之外时，所述第三模塑部123可以被实施为位于所述滤光构件13的长边之外的两个条状凸起，以通过所述条状凸起来包覆所有的所述电子元器件113，而所述滤光元件13的短边之外则不设置所述第三模塑部123，以降低所述模塑基座12的重量。It is worth mentioning that, in this modified embodiment of the present invention, since thethird molding portion 123 only needs to cover the top of theelectronic component 113 , that is, thethird molding portion 123 is The position only corresponds to theelectronic component 113 of theimaging assembly 11 , so thethird molding portion 123 does not need to have a ring structure, and can be designed according to the position and size of theelectronic component 113 . The position and size of thethird molding portion 123 are described. For example, as shown in FIG. 5B , when all theelectronic components 113 are located only outside the long sides of thefilter member 13 , thethird molding portion 123 may be implemented to be located on the filter member The two strip-shaped protrusions outside the long side of thefilter element 13 are used to cover all theelectronic components 113 through the strip-shaped protrusions, and thefilter element 13 is not provided outside the short side. Thethird molding part 123 reduces the weight of themolding base 12 .

优选地，如图5A所示，所述第三模塑部123的高度大于所述第二模塑部122，也就是说，所述第三模塑部123的所述第三上表面1231高于所述第二模塑部122的所述第二上表面1221，使得所述第三模塑部123更容易成型。特别地，相比于如图1所示的现有的摄像模组，尽管所述第三模塑部123的所述第三内侧面1233与所述第一模塑部121的所述第一上表面1211的连接处仍存在过渡弧面，但由于所述第二模塑部122的所述第二上表面1221高于所述第一模塑部121的所述第一上表面1211(即所述第二模塑部122的所述第二上表面1221位于所述过渡弧面之上)。这样在将所述滤光构件13贴附于所述第二模塑部122的所述第二上表面1221时，所述滤光构件13的边缘无需避让所述过渡弧面，使得所述滤光构件13的边缘能够更靠近所述第三模塑部123，以最大限度地增大所述滤光构件13的底部支撑面积，有助于提高所述摄像模组1的可靠性。Preferably, as shown in FIG. 5A , the height of thethird molding part 123 is greater than that of thesecond molding part 122 , that is, the thirdupper surface 1231 of thethird molding part 123 is higher On the secondupper surface 1221 of thesecond molding portion 122 , thethird molding portion 123 is easier to mold. In particular, compared to the existing camera module shown in FIG. 1 , although the thirdinner side surface 1233 of thethird molding part 123 and thefirst molding part 121 There is still a transition arc surface at the connection of theupper surface 1211 , but because the secondupper surface 1221 of thesecond molding part 122 is higher than the firstupper surface 1211 of the first molding part 121 (ie The secondupper surface 1221 of thesecond molding portion 122 is located above the transition arc). In this way, when thefilter member 13 is attached to the secondupper surface 1221 of thesecond molding part 122, the edge of thefilter member 13 does not need to avoid the transition arc surface, so that thefilter member 13 does not need to avoid the transition arc surface. The edge of theoptical member 13 can be closer to thethird molding portion 123 to maximize the bottom support area of theoptical filter member 13 , which helps to improve the reliability of the camera module 1 .

更优选地，如图5A所示，所述第三模塑部123的所述第三上表面1231高于所述滤光构件13的上表面132，并且所述第三模塑部123的所述第三上表面1231对应于所述光学镜头20，以使所述第三模塑部123的所述第三上表面1231与所述光学镜头20之间的最小距离小于所述滤光构件13的所述上表面132与所述光学镜头20之间的最小距离。这样在所述摄像模组1的调焦或对焦的过程中，当所述光学镜头20被所述驱动器30驱动以靠近所述成像组件11的所述感光元件112时，所述第三模塑部123还能够阻挡所述光学镜头20接触所述滤光构件13，以防所述光学镜头20与所述滤光构件13发生碰撞，从而有效地保护所述滤光构件13和所述光学镜头20不受损坏。More preferably, as shown in FIG. 5A , the thirdupper surface 1231 of thethird molding part 123 is higher than theupper surface 132 of thefilter member 13 , and all thethird molding part 123 has a higher surface. The thirdupper surface 1231 corresponds to theoptical lens 20 , so that the minimum distance between the thirdupper surface 1231 of thethird molding part 123 and theoptical lens 20 is smaller than thefilter member 13 The minimum distance between theupper surface 132 and theoptical lens 20. In this way, during the focusing or focusing process of the camera module 1, when theoptical lens 20 is driven by thedriver 30 to approach thephotosensitive element 112 of theimaging assembly 11, the third molding Theportion 123 can also block theoptical lens 20 from contacting thefilter member 13 to prevent theoptical lens 20 from colliding with thefilter member 13, thereby effectively protecting thefilter member 13 and theoptical lens 20 is not damaged.

最优选地，如图5A所示，所述第三模塑部123的所述第三上表面1231仅对应于所述光学镜头20的所述镜筒22，以在所述光学镜头20被所述驱动器30驱动以靠近所述成像组件11的所述感光元件112时，所述第三模塑部123仅能够与所述光学镜头20的所述镜筒22接触以阻挡所述光学镜头20接触所述滤光构件13，进而避免所述第三模塑部123与所述光学镜头20的所述镜片组21发生碰撞，有助于保护所述光学镜头20的所述镜片组21。Most preferably, as shown in FIG. 5A , the thirdupper surface 1231 of thethird molding part 123 only corresponds to thelens barrel 22 of theoptical lens 20 , so that theoptical lens 20 is When thedriver 30 is driven to be close to thephotosensitive element 112 of theimaging assembly 11 , thethird molding portion 123 can only be in contact with thelens barrel 22 of theoptical lens 20 to prevent theoptical lens 20 from contacting Thefilter member 13 further prevents thethird molding portion 123 from colliding with thelens group 21 of theoptical lens 20 , thereby helping to protect thelens group 21 of theoptical lens 20 .

附图6示出了根据本发明的上述第一实施例的所述摄像模组1的第二个变形实施方式。具体地，相比于根据本发明的上述第一变形实施方式，根据本发明的所述第二变形实施方式的所述摄像模组1的区别在于：所述模塑感光组件10的所述模塑基座12还可以包括一第四模塑部124，其中所述第四模塑部124自所述第一模塑部121的所述第一上表面1211向下凹陷，并且所述第四模塑部124位于所述第三模塑部123的外侧，以在所述第一模塑部121的外周缘形成一周缘槽，使得所述周缘槽的底面作为所述第四模塑部124的第四上表面1241，以通过所述第四模塑部124的所述第四上表面1241提供所述驱动器30(或所述光学镜头20)的安装面，使得所述驱动器30(或所述光学镜头20)能够被安装于所述第四模塑部124的所述第四上表面1241。FIG. 6 shows a second variant embodiment of the camera module 1 according to the above-mentioned first embodiment of the present invention. Specifically, compared with the above-mentioned first modified embodiment of the present invention, the camera module 1 according to the second modified embodiment of the present invention is different in that: the mold for molding thephotosensitive assembly 10 Theplastic base 12 may further include afourth molding portion 124, wherein thefourth molding portion 124 is recessed downward from the firstupper surface 1211 of thefirst molding portion 121, and thefourth molding portion 124 is recessed downward from the firstupper surface 1211 of thefirst molding portion 121. Themolding portion 124 is located outside thethird molding portion 123 to form a peripheral groove on the outer periphery of thefirst molding portion 121 , so that the bottom surface of the peripheral groove serves as thefourth molding portion 124 the fourthupper surface 1241 of thefourth molding part 124 to provide a mounting surface of the driver 30 (or the optical lens 20 ), so that the driver 30 (or the optical lens 20 ) The optical lens 20 ) can be mounted on the fourthupper surface 1241 of thefourth molding part 124 .

换言之，所述第四模塑部124的所述第四上表面1241低于所述第一模塑部121的所述第一上表面1211，有助于进一步降低了所述驱动器30的安装高度，从而进一步降低所述摄像模组1的整体高度。特别地，在本发明的这个第二变形实施方式中，所述第四模塑部124位于所述第一模塑部121的外周缘，使得所述第四模塑部124的所述第四上表面1241可以大幅地低于所述电子元器件113的顶表面，有助于最大限度地降低了所述驱动器30的安装高度，使得所述摄像模组1的高度得以最小。In other words, the fourthupper surface 1241 of thefourth molding part 124 is lower than the firstupper surface 1211 of thefirst molding part 121 , which helps to further reduce the installation height of thedriver 30 , thereby further reducing the overall height of the camera module 1 . In particular, in this second modified embodiment of the present invention, thefourth molding portion 124 is located at the outer peripheral edge of thefirst molding portion 121 , so that thefourth molding portion 124 has a Theupper surface 1241 can be substantially lower than the top surface of theelectronic component 113 , which helps to minimize the installation height of thedriver 30 and minimize the height of the camera module 1 .

优选地，如图6所示，所述第四模塑部124的所述第四上表面1241与所述驱动器30的端面相匹配，以在所述驱动器30被安装至所述第四模塑部124的所述第四上表面1241时，所述驱动器30的外周表面与所述模塑基座12的所述第一模塑部121的所述第一外侧面1221齐平，有助于最大限度地减小所述摄像模组1的尺寸，同时也有利于美化所述摄像模组1的外观。Preferably, as shown in FIG. 6 , the fourthupper surface 1241 of thefourth molding part 124 is matched with the end surface of thedriver 30 so that thedriver 30 is mounted to the fourth molding When the fourthupper surface 1241 of thepart 124 is installed, the outer peripheral surface of thedriver 30 is flush with the firstouter side surface 1221 of thefirst molding part 121 of themolding base 12, which helps Minimizing the size of the camera module 1 is also beneficial to beautify the appearance of the camera module 1 .

附图7示出了根据本发明的上述第一实施例的所述摄像模组1的第三个变形实施方式。具体地，相比于根据本发明的上述第一变形实施方式，根据本发明的所述第三变形实施方式的所述摄像模组1的区别在于：所述模塑感光组件10的所述模塑基座12还可以包括一第四模塑部124’，其中所述第四模塑部124自所述第一模塑部121的所述第一上表面1211向上延伸，并且所述第四模塑部124’位于所述第三模塑部123的外侧，以在所述第一模塑部121的外周缘形成一周缘凸起，以通过所述第四模塑部124’的第四上表面1241’提供所述驱动器30(或所述光学镜头20)的安装面，以便满足所述驱动器30的安装需要。换言之，受限于所述驱动器30和所述光学镜头20的安装要求，所述第四模塑部124’的所述第四上表面1241’的高度需要根据所述驱动器30的安装需求进行设计，，以便将所述驱动器30适配地安装于所述第四模塑部124’的所述第四上表面1241’。例如，所述第四模塑部124’的所述第四上表面1241’可以高于所述第一模塑部121的所述第一上表面1211，并且低于所述第三模塑部123的所述第三上表面1231。当然，在本发明的其他示例中，所述第四模塑部124’的所述第四上表面1241’也可以高于所述第三模塑部123的所述第三上表面1231，以满足所述驱动器30的安装需求。FIG. 7 shows a third variant embodiment of the camera module 1 according to the above-mentioned first embodiment of the present invention. Specifically, compared with the above-mentioned first modified embodiment of the present invention, the camera module 1 according to the third modified embodiment of the present invention is different in that: the mold for molding thephotosensitive assembly 10 Theplastic base 12 may further include afourth molding portion 124 ′, wherein thefourth molding portion 124 extends upward from the firstupper surface 1211 of thefirst molding portion 121 , and thefourth molding portion 124 extends upward from the firstupper surface 1211 of thefirst molding portion 121 . Themolding portion 124 ′ is located outside thethird molding portion 123 to form a peripheral protrusion on the outer periphery of thefirst molding portion 121 to pass through thefourth molding portion 124 ′. Theupper surface 1241 ′ provides a mounting surface of the driver 30 (or the optical lens 20 ) so as to meet the installation requirements of thedriver 30 . In other words, limited by the installation requirements of thedriver 30 and theoptical lens 20 , the height of the fourthupper surface 1241 ′ of thefourth molding part 124 ′ needs to be designed according to the installation requirements of thedriver 30 . , so as to fit thedriver 30 on the fourthupper surface 1241 ′ of thefourth molding part 124 ′. For example, the fourthupper surface 1241 ′ of thefourth molding part 124 ′ may be higher than the firstupper surface 1211 of thefirst molding part 121 and lower than the third molding part The thirdupper surface 1231 of 123 . Of course, in other examples of the present invention, the fourthupper surface 1241 ′ of thefourth molding part 124 ′ may also be higher than the thirdupper surface 1231 of thethird molding part 123 , so as to The installation requirements of thedriver 30 are met.

附图8示出了根据本发明的上述第一实施例的所述摄像模组1的第四个变形实施方式。具体地，相比于根据本发明的上述第一实施例，根据本发明的所述第四变形实施方式的所述摄像模组1的区别在于：所述模塑感光组件10的所述模塑基座12不包括所述第三模塑部123，其中所述模塑基座12的所述第一模塑部121的所述第一上表面1211高于所述成像组件11的所述电子元器件113的顶表面，以通过所述第一模塑部121完整地包覆所述电子元器件113，其中所述驱动器30直接被安装至所述第一模塑部121的所述第一上表面1211。FIG. 8 shows a fourth variant embodiment of the camera module 1 according to the above-mentioned first embodiment of the present invention. Specifically, compared with the above-mentioned first embodiment of the present invention, the camera module 1 according to the fourth modified embodiment of the present invention is different in that: the molding of the moldedphotosensitive component 10 Thebase 12 does not include thethird molding part 123 , wherein the firstupper surface 1211 of thefirst molding part 121 of themolding base 12 is higher than the electronics of theimaging assembly 11 The top surface of thecomponent 113 to completely cover theelectronic component 113 through thefirst molding part 121 , wherein thedriver 30 is directly mounted to thefirst molding part 121Top surface 1211.

此外，如图8所示，所述第二模塑部122的所述第二外侧面1222位于所述第一模塑部121的所述第一外侧面1221之内，也就是说，所述第二模塑部122的所述第二外侧面1222与所述成像组件11的所述感光路径110之间的最大距离R₂小于所述第一模塑部121的所述第一外侧面1221与所述成像组件11的所述感光路径110之间的最小距离R₁，即R₂＜R₁，以通过所述第一模塑部121和所述第二模塑部122在所述模塑基座12上形成外阶梯结构。这样所述模塑基座12的外阶梯结构处将形成所述模塑基座12的所述外空间1201，即所述第二模塑部122的所述外侧面1222与所述第一模塑部121的所述第一上表面1211将定义形成所述模塑基座12的所述外空间1201，使得在贴附所述滤光构件13至所述第二模塑部122的所述第二上表面1221时，固化前的粘接剂能够向外溢流至所述模塑基座12的所述外空间1201(作为所述模塑基座12的外溢胶空间)，以降低因粘接剂向内溢流至所述感光元件112而对所述摄像模组1成像质量产生影响的风险。In addition, as shown in FIG. 8 , the secondouter side surface 1222 of thesecond molding part 122 is located within the firstouter side surface 1221 of thefirst molding part 121 , that is, the The maximum distance R₂ between the secondouter side surface 1222 of thesecond molding part 122 and thephotosensitive path 110 of theimaging assembly 11 is smaller than the firstouter side surface 1221 of thefirst molding part 121 The minimum distance R₁ from thephotosensitive path 110 of theimaging assembly 11 , that is, R₂ <R₁ , in order to pass thefirst molding part 121 and thesecond molding part 122 in the mold An outer stepped structure is formed on theplastic base 12 . In this way, theouter space 1201 of themolding base 12 will be formed at the outer stepped structure of themolding base 12 , that is, theouter side surface 1222 of thesecond molding part 122 and the first mold The firstupper surface 1211 of themolding part 121 will define theouter space 1201 forming themolding base 12 , so that thefilter member 13 is attached to thesecond molding part 122 . When the secondupper surface 1221 is used, the adhesive before curing can overflow to theouter space 1201 of the molding base 12 (as the overflowing glue space of the molding base 12 ), so as to reduce the adhesive There is a risk that the adhesive overflows to thephotosensitive element 112 and affects the imaging quality of the camera module 1 .

附图9示出了根据本发明的上述第一实施例的所述摄像模组1的第五个变形实施方式。具体地，相比于根据本发明的上述第四变形实施方式，根据本发明的所述第五变形实施方式的所述摄像模组1的区别在于：所述模塑感光组件10的所述模塑基座12的所述第二模塑部122的所述第二内侧面1223位于所述第一模塑部121的所述第一内侧面1213之外，也就是说，所述第二模塑部122的所述第二内侧面1223与所述成像组件11的所述感光路径110之间的最小距离r₂大于所述第一模塑部121的所述第一内侧面1213与所述成像组件11的所述感光路径110之间的最大距离r₁，即r₂＞r₁，以通过所述第二模塑部122的所述第二内侧面1223与所述第一模塑部121的所述第一上表面1211形成所述模塑基座12的内空间1202，其中所述内空间1202位于所述第二模塑部122的内侧(以作为所述模塑基座12的内溢胶空间)，用于储放自所述第二模塑部122的所述第二上表面1221向内溢流的粘接剂，以防粘接剂向内溢流至所述感光元件112的感光区域，有助于保证所述摄像模组1的成像质量。FIG. 9 shows a fifth variant embodiment of the camera module 1 according to the above-mentioned first embodiment of the present invention. Specifically, compared with the above-mentioned fourth variant embodiment of the present invention, the camera module 1 according to the fifth variant embodiment of the present invention is different in that: the mold for molding thephotosensitive assembly 10 The secondinner side surface 1223 of thesecond molding part 122 of themold base 12 is located outside the firstinner side surface 1213 of thefirst molding part 121 , that is, the second molding The minimum distance r₂ between the secondinner side surface 1223 of themolding part 122 and thephotosensitive path 110 of theimaging component 11 is greater than the distance r 2 between the firstinner side surface 1213 of thefirst molding part 121 and thephotosensitive path 110 of theimaging assembly 11 . The maximum distance r₁ between thephotosensitive paths 110 of theimaging assembly 11 , that is, r₂ >r₁ , so as to pass through the secondinner side surface 1223 of thesecond molding part 122 and the first molding part The firstupper surface 1211 of themolding base 121 forms an inner space 1202 of themolding base 12, wherein the inner space 1202 is located inside the second molding part 122 (as the inner space 1202 of the molding base 12). Internal overflow space) for storing the adhesive overflowing from the secondupper surface 1221 of thesecond molding part 122 to prevent the adhesive from overflowing to the photosensitive element The photosensitive area of 112 helps to ensure the imaging quality of the camera module 1 .

值得一提的是，由于所述滤光构件13通过所述粘接层14被粘接地贴附于所述第二模塑部122的所述第二上表面1221之后，所述滤光构件13将密封所述模塑基座12的所述光窗120，因此在所述滤光构件13和所述成像组件11的所述感光元件112之间的所述内部空间100将形成一封闭空间。而当形成所述粘接层14的所述粘接剂为热固化胶时，在所述滤光构件13和所述模塑基座12的所述第二模塑部122的所述第二上表面1221之间施涂一圈所述热固化胶之后，需要对所述热固化胶加热或者烘烤，才能够使得所述热固化胶完全固化而形成具有环形结构的所述粘接层14。这样在对所述热固化胶加热时，位于所述滤光构件13和所述成像组件11之间的所述封闭空间内的气体将会受热膨胀，给所述滤光构件13施加向外的作用力，可能会造成所述滤光构件13的偏移或起翘，严重时还会造成所述滤光构件13的破裂。与此同时，所述封闭空间内的气体膨胀还将对所述感光元件112施加压力，也有可能造成所述感光元件112的损坏，对所述摄像模组1的组装造成难度，并且极大地降低了所述摄像模组1的可靠性。It is worth mentioning that, after thefilter member 13 is adhered to the secondupper surface 1221 of thesecond molding part 122 through theadhesive layer 14, thefilter member 13 will seal thelight window 120 of themolding base 12, so theinner space 100 between thefilter member 13 and thephotosensitive element 112 of theimaging assembly 11 will form a closed space . And when the adhesive forming theadhesive layer 14 is a heat-curable adhesive, thefilter member 13 and thesecond molding portion 122 of themolding base 12 can After a circle of the heat-curable adhesive is applied between theupper surfaces 1221, the heat-curable adhesive needs to be heated or baked, so that the heat-curable adhesive can be completely cured to form theadhesive layer 14 having a ring structure . In this way, when the heat-curable glue is heated, the gas in the closed space between thefilter member 13 and theimaging assembly 11 will be heated and expanded, and thefilter member 13 will be applied with an outward pressure. The force may cause thefilter member 13 to shift or warp, and even cause thefilter member 13 to crack in severe cases. At the same time, the expansion of the gas in the closed space will also exert pressure on thephotosensitive element 112, which may also cause damage to thephotosensitive element 112, causing difficulty in assembling the camera module 1 and greatly reducing the The reliability of the camera module 1 is improved.

因此为了解决上述问题，本发明的一第二实施例提供了一种摄像模组和模塑感光组件。具体地，如图10A和图10B所示，相比于根据本发明的上述第一实施例，本发明的所述第二实施例的所述摄像模组1的区别在于：所述模塑感光组件10的所述模塑基座12的所述第二模塑部122设有至少一缺口1224，以当所述滤光元件13被贴附于所述第二模塑部122的所述第二上表面1221时，在所述第二模塑部122的所述缺口1224处形成所述模组基座12的一逃气孔1203，以通过所述逃气孔1203将所述模塑感光组件10的所述内部空间100与所述模塑感光组件10的外部连通，使得所述模塑感光组件10的所述内部空间100形成一非封闭空间。Therefore, in order to solve the above problems, a second embodiment of the present invention provides a camera module and a molded photosensitive component. Specifically, as shown in FIG. 10A and FIG. 10B , compared with the above-mentioned first embodiment of the present invention, the difference between the camera module 1 of the second embodiment of the present invention is that the molded photosensitive Thesecond molding portion 122 of themolding base 12 of theassembly 10 is provided with at least onenotch 1224 for when thefilter element 13 is attached to the first portion of thesecond molding portion 122 . On the secondupper surface 1221 , anair escape hole 1203 of themodule base 12 is formed at thenotch 1224 of thesecond molding part 122 , so that the moldedphotosensitive element 10 can be removed from the moldedphotosensitive element 10 through theair escape hole 1203 . Theinner space 100 is communicated with the outside of the moldedphotosensitive component 10, so that theinner space 100 of the moldedphotosensitive component 10 forms a non-closed space.

这样当所述粘接剂被加热以固化时，所述模塑感光组件10的所述内部空间100内的气体能够经由所述逃气孔1203逃出，以使所述模塑感光组件10的所述内部空间100内的气压保持恒定(等于大气压)，避免对所述滤光元件13和所述感光元件112施加作用力，有助于保护所述滤光元件13和所述感光元件112不会因气体膨胀而被损坏。当然，在所述粘接剂被加热固化之后，所述模塑感光组件10的所述内部空间100内的气体将因冷却而缩小体积，此时所述模塑感光组件10外部的气体能够经由所述逃气孔1203进入所述模塑感光组件10的所述内部空间100，以保持所述内部空间100内的气压恒定，避免所述滤光元件13和所述感光元件112因加热或冷却而被损坏。In this way, when the adhesive is heated to be cured, the gas in theinner space 100 of the moldedphotosensitive element 10 can escape through theair escape hole 1203 , so that all parts of the moldedphotosensitive element 10 can escape. The air pressure in theinner space 100 is kept constant (equal to atmospheric pressure), so as to avoid exerting force on thefilter element 13 and thephotosensitive element 112, which helps to protect thefilter element 13 and thephotosensitive element 112 from Damaged by gas expansion. Of course, after the adhesive is heated and solidified, the gas in theinner space 100 of the moldedphotosensitive component 10 will be reduced in volume due to cooling, and the gas outside the moldedphotosensitive component 10 can pass through Theair escape hole 1203 enters theinner space 100 of the moldedphotosensitive component 10 to keep the air pressure in theinner space 100 constant and avoid thefilter element 13 and thephotosensitive element 112 from being damaged by heating or cooling. be damaged.

可以理解的是，在如图1所示的现有的摄像模组1P中，由于所述滤光片33P直接被贴附于所述模塑基座32P的所述凹槽35P内，因此所述模塑基座32P上极难设置缺口以形成逃气孔，导致所述模塑感光组件3P的内部空间难以形成非封闭空间。而在本发明的所述摄像模组1中，正是由于所述第二模塑部122自所述第一模塑部121向上延伸以在所述第一模塑部121的所述第一上表面1211上形成凸起，使得所述第二模塑部122易于设置缺口，因此所述第二模塑部122不仅能够为所述滤光构件13提供平整的贴附面，而且还能够为所述模塑基座12上形成所述逃气孔1203提供便利条件。It can be understood that, in the existingcamera module 1P shown in FIG. 1 , since thefilter 33P is directly attached to thegroove 35P of themolding base 32P, the It is extremely difficult to provide a notch on themolding base 32P to form an air escape hole, so that it is difficult to form a non-closed space in the inner space of the moldingphotosensitive component 3P. In the camera module 1 of the present invention, it is precisely because thesecond molding portion 122 extends upward from thefirst molding portion 121 to Protrusions are formed on theupper surface 1211, so that thesecond molding part 122 can be easily provided with a notch, so thesecond molding part 122 can not only provide a flat attachment surface for thefilter member 13, but also provide a Thevent hole 1203 formed on themolding base 12 provides convenience.

进一步地，如图10A和图10B所示，所述第二模塑部122的所述缺口1224自所述第二模塑部122的所述第二内侧面1223横向地延伸至所述第二模塑部122的所述第二外侧面1222，以在所述第二模塑部122形成横向缺口。这样当所述滤光构件13通过所述粘接层14被粘接于所述第二模塑部122的所述第二上表面1221时，所述第二模塑部122的所述缺口1224将形成横向布置的逃气孔1203，以增大灰尘经由所述逃气孔1203进入所述模塑感光组件10的所述内部空间100的难度，有助于保障所述摄像模组1的工作性能。Further, as shown in FIGS. 10A and 10B , thenotch 1224 of thesecond molding part 122 laterally extends from the secondinner side surface 1223 of thesecond molding part 122 to the second The secondouter side surface 1222 of themolding part 122 forms a transverse notch in thesecond molding part 122 . In this way, when thefilter member 13 is adhered to the secondupper surface 1221 of thesecond molding part 122 through theadhesive layer 14 , thenotches 1224 of thesecond molding part 122 The laterally arranged air escape holes 1203 will be formed to increase the difficulty of dust entering theinner space 100 of the moldedphotosensitive assembly 10 through the air escape holes 1203 , and help to ensure the working performance of the camera module 1 .

优选地，如图10A所示，所述第二模塑部122的所述缺口1224对应于所述滤光构件13的长边，这样所述缺口1224的两侧具有较长的所述粘接层14来粘接所述滤光构件13，以增强所述滤光构件13与所述第二模塑部122之间的粘接强度。当然，在本发明的其他示例中，所述第二模塑部122的所述缺口1224也可以位于所述对应于所述滤光构件13的其他部位，只要能够形成将所述模塑感光组件10的所述内部空间100与所述模塑感光组件10的外部连通的所述逃气孔1203即可，本发明对此不再赘述。Preferably, as shown in FIG. 10A , thenotch 1224 of thesecond molding part 122 corresponds to the long side of thefilter member 13 , so that both sides of thenotch 1224 have thelonger bonding layer 14 to bond thefilter member 13 to enhance the bonding strength between thefilter member 13 and thesecond molding part 122 . Of course, in other examples of the present invention, thenotch 1224 of thesecond molding part 122 may also be located at the other position corresponding to thefilter member 13, as long as the molding photosensitive assembly can be formed. Theinner space 100 of 10 and theair escape hole 1203 communicated with the outside of the moldedphotosensitive component 10 may be sufficient, which will not be described in detail in the present invention.

更优选地，如图10A所示，在所述粘接剂固化以形成所述粘接层14之后，还可以在所述第二模塑部122的所述缺口1224处再次施涂粘接剂，以在粘接剂固化后形成一加强粘接块15，以通过所述加强粘接块15增强所述滤光构件13与所述第二模塑部122在所述缺口1224处的粘接强度，以确保所述滤光构件13被牢固地贴附于所述第二模塑部122。换句话说，还可以在所述模塑基座12的所述逃气孔1203处施涂粘接剂，以形成用于增强所述滤光构件13与所述第二模塑部122之间的粘接强度的所述加强粘接块15。此外，所述加强粘接块15也可以封堵所述逃气孔1203，以避免外部灰尘经由所述逃气孔1203进入所述模塑感光组件10的所述内部空间100，有助于确保所述摄像模组1的成像质量。可以理解的是，虽然所述加强粘接块15将会封堵所述逃气孔1203，但所述滤光构件13已被所述粘接层14牢靠地贴附于所述模塑基座12，并且在后续的组装和使用过程中温度变化较小，使得所述模塑感光组件10的所述内部空间100内的气压变化也较小，因此温度的变化不足以对所述滤光构件13造成实质性影响。More preferably, as shown in FIG. 10A , after the adhesive is cured to form theadhesive layer 14 , adhesive may be applied again at thenotch 1224 of thesecond molding part 122 , to form a reinforcingbonding block 15 after the adhesive is cured, so as to enhance the bonding between thefilter member 13 and thesecond molding part 122 at thegap 1224 through the reinforcingbonding block 15 strength to ensure that thefilter member 13 is firmly attached to thesecond molding portion 122 . In other words, adhesive may also be applied at theair escape hole 1203 of themolding base 12 to form a gap between thefilter member 13 and thesecond molding part 122 for strengthening. The bonding strength of thebonding block 15 is enhanced. In addition, the reinforcingadhesive block 15 can also block theair escape hole 1203 to prevent external dust from entering theinner space 100 of the moldedphotosensitive component 10 through theair escape hole 1203, which helps to ensure the Image quality of camera module 1. It can be understood that although the reinforcedadhesive block 15 will block theair escape hole 1203 , thefilter member 13 has been firmly attached to themolding base 12 by theadhesive layer 14 . , and the temperature change is small in the subsequent assembly and use process, so that the air pressure change in theinner space 100 of the moldedphotosensitive assembly 10 is also small, so the temperature change is not enough to affect thefilter member 13 cause substantial impact.

附图11A和图11B示出了根据本发明的上述第二实施例的所述摄像模组1的一个变形实施方式，其中所述模塑感光组件10的所述模塑基座12还可以包括一模塑加强部125，其中所述模塑加强部125在所述第二模塑部122的所述缺口1224处自所述第二模塑部122的所述第二外侧面1222一体地向外延伸，使得所述粘接层14在所述缺口1224处的粘接面积变大，有助于增大所述滤光构件13与所述第二模塑部122在所述缺口1224处的粘接强度，以防所述滤光构件13在所述第二模塑部122的所述缺口1224处因所述粘接层14的粘接强度不足而发生开裂。11A and FIG. 11B show a modified implementation of the camera module 1 according to the above-mentioned second embodiment of the present invention, wherein themolding base 12 of the moldingphotosensitive assembly 10 may further include Amolding reinforcement portion 125 , wherein themolding reinforcement portion 125 is integrally directed toward the secondouter side surface 1222 of thesecond molding portion 122 at thenotch 1224 of thesecond molding portion 122 . extending outward, so that the bonding area of theadhesive layer 14 at thenotch 1224 becomes larger, which helps to increase the bond between thefilter member 13 and thesecond molding part 122 at thenotch 1224 Adhesive strength, to prevent thefilter member 13 from cracking at thenotch 1224 of thesecond molding part 122 due to insufficient adhesive strength of theadhesive layer 14 .

优选地，如图11A所示，所述模塑加强部125与所述第一模塑部121一体地连接，以在所述第二模塑部122的所述第二外侧面1222与所述第一模塑部121的所述第一上表面1211之间形成加强肋，有助于增强所述第二模塑部122与所述第一模塑部121在所述缺口1224处的连接强度。Preferably, as shown in FIG. 11A , themolding reinforcing part 125 is integrally connected with thefirst molding part 121 , so that the secondouter side surface 1222 of thesecond molding part 122 is connected to the Reinforcing ribs are formed between the firstupper surface 1211 of thefirst molding part 121 to help enhance the connection strength between thesecond molding part 122 and thefirst molding part 121 at thegap 1224 .

值得一提的是，在本发明的其他示例中，所述模塑加强部125可以自所述第二模塑部122一体地延伸至所述第三模塑部123，使得所述模塑加强部125的一端与所述第二模塑部122一体地连接，并且所述模塑加强部125的另一端与所述第三模塑部123一体地连接，有助于进一步增强所述第二模塑部122在所述缺口1224处的连接强度。It is worth mentioning that, in other examples of the present invention, themolding reinforcement portion 125 may integrally extend from thesecond molding portion 122 to thethird molding portion 123, so that the molding reinforcement One end of thepart 125 is integrally connected with thesecond molding part 122, and the other end of themolding reinforcing part 125 is integrally connected with thethird molding part 123, which helps to further strengthen thesecond molding part 123. The connection strength of the moldedpart 122 at thenotch 1224 .

此外，在本发明的这个变形实施方式中，所述模塑加强部123将延长所述第二模塑部122的所述缺口1224的长度，使得所述模塑基座12的所述逃气孔1203的长度也随之变长，有助于进一步增大外部灰尘经由所述逃气孔1203进入所述模塑感光组件10的所述内部空间100的难度。可以理解的是，如图11B所示，由于所述模塑加强部123凸出于所述第二模塑部122的所述第二外侧面1222，有助于引导工人或机器在所述模塑加强部123处施涂粘接剂(如补胶)，以形成所述加强粘接块15。另外，所述模塑加强部123还能够防止固化前的粘接剂随意流动，以便完整地封堵所述逃气孔1203，最大限度地增强所述滤光构件13与所述第二模塑部122在所述缺口1224处的粘接强度。值得注意的是，在本发明的所述第二实施例中，除了上述结构不同之外，所述摄像模组1的其他结构与根据本发明的所述第一实施例的所述摄像模组1的结构相同，并且所述摄像模组1也具有与所述第一实施例的所述摄像模组1的各种变形实施方式相似或相同的变形实施方式，在此不再赘述。In addition, in this variant embodiment of the present invention, themolding reinforcement portion 123 will extend the length of thenotch 1224 of thesecond molding portion 122 so that the air escape hole of themolding base 12 The length of 1203 also becomes longer, which helps to further increase the difficulty for external dust to enter theinner space 100 of the moldedphotosensitive component 10 through theair escape hole 1203 . It can be understood that, as shown in FIG. 11B , since themolding reinforcement portion 123 protrudes from the secondouter side surface 1222 of thesecond molding portion 122 , it helps to guide workers or machines in the mold. An adhesive (eg, glue) is applied to theplastic reinforcing portion 123 to form the reinforcingbonding block 15 . In addition, themolding reinforcement part 123 can also prevent the adhesive before curing from flowing freely, so as to completely block theair escape hole 1203 and maximize the reinforcement of thefilter member 13 and thesecond molding part 122 the bond strength at thenotch 1224. It should be noted that, in the second embodiment of the present invention, except for the above-mentioned structures, other structures of the camera module 1 are the same as those of the camera module according to the first embodiment of the present invention The structure of the camera module 1 is the same, and the camera module 1 also has various modified implementations similar to or the same as the various modified implementations of the camera module 1 of the first embodiment, which will not be repeated here.

值得一提的是，参考附图12至图14所示，是本发明的一第三实施例的模组感光组件10的制造过程和摄像模组1的制造过程的示意图，本领域的技术人员应当理解，在附图12至图14中示出的所述模塑感光组件10的制造过程和所述摄像模组1的制造过程仅为示例来阐述本发明的特征和优势，其并不构成对本发明的内容和范围的限制。It is worth mentioning that, referring to FIG. 12 to FIG. 14 , it is a schematic diagram of the manufacturing process of thephotosensitive module 10 and the manufacturing process of the camera module 1 according to a third embodiment of the present invention. Those skilled in the art It should be understood that the manufacturing process of the moldedphotosensitive assembly 10 and the manufacturing process of the camera module 1 shown in FIGS. 12 to 14 are only examples to illustrate the features and advantages of the present invention, and do not constitute a Limitations on the content and scope of the invention.

具体地说，在附图12中，首先将所述感光元件112可导通地贴装于所述线路板111，以组装成所述成像组件11；之后再藉由成型模具，在所述成像组件11上模塑形成所述模塑基座12的所述第一模塑部121、具有所述缺口1224的所述第二模塑部122以及位于所述第二模塑部122外侧的第三模塑部123，其中所述第一模塑部121的所述第一上表面1211在高度方向上低于所述第二模塑部122的所述第二上表面1211，并且所述第三模塑部123与所述第二模塑部122间隔设置，以在所述第三模塑部123与所述第二模塑部122之间形成一外空间1201。可以理解的是，本发明可以通过对所述成形模具的上模具(如所述上模具中突出部的位置分布和尺寸大小等等)进行设计，以在模塑形成所述模塑基座12时，在所述第二模塑部122与所述第三模塑部123之间形成间隙或凹槽(即所述外空间1201)，使得所述滤光构件13的边缘能够被容纳于所述外空间1201处，而无需避让所述模塑基座12上的过渡弧面，能够有效地消除模塑基座12上的过渡弧面对贴附滤光构件13产生的不利影响。Specifically, in FIG. 12, firstly, thephotosensitive element 112 is conductively attached to thecircuit board 111 to assemble theimaging component 11; Thecomponent 11 is molded to form thefirst molding portion 121 of themolding base 12 , thesecond molding portion 122 having thenotch 1224 , and thefirst molding portion 122 located outside thesecond molding portion 122 . Threemolding parts 123, wherein the firstupper surface 1211 of thefirst molding part 121 is lower than the secondupper surface 1211 of thesecond molding part 122 in the height direction, and the firstupper surface 1211 of thesecond molding part 122 The threemolding parts 123 are spaced apart from thesecond molding part 122 to form anouter space 1201 between thethird molding part 123 and thesecond molding part 122 . It can be understood that, in the present invention, the upper mold of the forming mold (such as the positional distribution and size of the protrusions in the upper mold, etc.) can be designed to form themolding base 12 during molding. , a gap or groove (ie, the outer space 1201 ) is formed between thesecond molding part 122 and thethird molding part 123 , so that the edge of thefilter member 13 can be accommodated in the Theouter space 1201 does not need to avoid the transition arc surface on themolding base 12 , which can effectively eliminate the adverse effect of the transition arc surface on themolding base 12 on the attachment of thefilter member 13 .

在附图13A中，先在所述模塑基座12的所述第二模塑部122的所述第二上表面1211上施涂粘接剂，以在将所述滤光构件13对应地设置于所述模塑基座12的所述光窗120之后，由所述粘接剂固化以形成位于所述滤光构件13的所述下表面131和所述第二模塑部122的所述第二上表面1211之间的粘接层14，以通过所述粘接层14将所述滤光构件13牢固地粘接于所述模塑基座12的所述第二模塑部122，以组装成所述模塑感光组件10。与此同时，在所述第二模塑部122的所述缺口1224处形成所述模塑基座12的所述逃气孔1203，以通过所述逃气孔1203将所述模塑感光组件10的所述内部空间100与所述模塑感光组件10的外部连通，使得所述模塑感光组件10的所述内部空间100被实施为一非封闭空间。In FIG. 13A , adhesive is first applied on the secondupper surface 1211 of thesecond molding portion 122 of themolding base 12 , so that thefilter member 13 is correspondingly After thelight window 120 is disposed on themolding base 12 , the adhesive is cured to form all thelower surface 131 of thefilter member 13 and thesecond molding portion 122 . Theadhesive layer 14 between the secondupper surfaces 1211 , so that thefilter member 13 can be firmly adhered to thesecond molding portion 122 of themolding base 12 through theadhesive layer 14 , to assemble the moldedphotosensitive assembly 10 . At the same time, theair escape hole 1203 of themolding base 12 is formed at thecutout 1224 of thesecond molding part 122 , so that theair escape hole 1203 of the moldedphotosensitive component 10 Theinner space 100 communicates with the outside of the moldedphotosensitive member 10, so that theinner space 100 of the moldedphotosensitive member 10 is implemented as a non-closed space.

在附图13B示出的一个变形实施方式中，也可以先在所述滤光构件13的所述下表面131对应地施涂粘接剂，以在将所述滤光构件13对应地设置于所述模塑基座12的所述光窗120之后，由所述粘接剂固化以形成位于所述滤光构件13的所述下表面131和所述第二模塑部122的所述第二上表面1211之间的粘接层14，以通过所述粘接层14将所述滤光构件13牢固地粘接于所述模塑基座12的所述第二模塑部122，以组装成所述模塑感光组件10。与此同时，在所述第二模塑部122的所述缺口1224处形成所述模塑基座12的所述逃气孔1203，以通过所述逃气孔1203将所述模塑感光组件10的所述内部空间100与所述模塑感光组件10的外部连通，使得所述模塑感光组件10的所述内部空间100被实施为一非封闭空间。In a variant embodiment shown in FIG. 13B , an adhesive may also be correspondingly applied to thelower surface 131 of thefilter member 13 first, so that thefilter member 13 is correspondingly disposed on thefilter member 13 . After molding thelight window 120 of thebase 12 , the adhesive is cured to form the first portion located on thelower surface 131 of thefilter member 13 and thesecond molding portion 122 . Theadhesive layer 14 between the twoupper surfaces 1211 , so that thefilter member 13 can be firmly adhered to thesecond molding portion 122 of themolding base 12 through theadhesive layer 14 , so as to The moldedphotosensitive assembly 10 is assembled. At the same time, theair escape hole 1203 of themolding base 12 is formed at thecutout 1224 of thesecond molding part 122 , so that theair escape hole 1203 of the moldedphotosensitive component 10 Theinner space 100 communicates with the outside of the moldedphotosensitive member 10, so that theinner space 100 of the moldedphotosensitive member 10 is implemented as a non-closed space.

值得注意的是，在本发明的这个实施例中，在所述第二模塑部22或所述滤光构件13上可以但不限于被连续地施涂一整圈粘接剂，以在粘接剂固化后形成具有环形结构的所述粘接层14。当然，在本发明的其他示例中，在所述第二模塑部22或所述滤光构件13上也可以间断地施涂粘接剂，以在粘接剂固化后形成具有非环形结构的所述粘接层14，这样在所述粘接层14的间断处也将形成逃气孔。It is worth noting that, in this embodiment of the present invention, on thesecond molding part 22 or thefilter member 13, a whole circle of adhesive may be continuously applied, but not limited to. Theadhesive layer 14 having an annular structure is formed after the adhesive is cured. Of course, in other examples of the present invention, adhesive may also be applied intermittently on thesecond molding part 22 or thefilter member 13, so as to form a non-annular structure after the adhesive is cured. In theadhesive layer 14 , air escape holes will also be formed at the discontinuities of theadhesive layer 14 .

在附图14中，先在所述模塑基座12的所述逃气孔1203处再次施涂粘接剂，以在所述粘接剂固化之后形成封堵所述逃气孔1203的所述加强粘接块15，以通过所述加强粘接块15增强所述粘接层14在所述第二模塑部122的所述缺口1224处的粘接强度；之后再将所述光学镜头20组装于所述驱动器30，和将所述驱动器30组装于所述模塑基座12的所述第三模塑部123的所述第三上表面1231，以使所述光学镜头20被保持在所述成像组件11的所述感光路径110，从而组装成所述摄像模组1。In FIG. 14 , adhesive is first applied again at thevent hole 1203 of themolding base 12 to form the reinforcement for blocking thevent hole 1203 after the adhesive is cured Thebonding block 15 is used to enhance the bonding strength of thebonding layer 14 at thenotch 1224 of thesecond molding part 122 through the reinforcingbonding block 15; after that, theoptical lens 20 is assembled on thedriver 30, and assemble thedriver 30 on the thirdupper surface 1231 of thethird molding portion 123 of themolding base 12, so that theoptical lens 20 is held in the desired position. Thephotosensitive path 110 of theimaging assembly 11 is assembled to form the camera module 1 .

根据本发明的另一方面，参考附图15至图17所示，本发明的一实施例进一步提供了一种摄像模组的制造方法。具体地，如图15所示，所述摄像模组1的制造方法包括步骤：According to another aspect of the present invention, referring to FIGS. 15 to 17 , an embodiment of the present invention further provides a method for manufacturing a camera module. Specifically, as shown in FIG. 15 , the manufacturing method of the camera module 1 includes the steps:

S410：可导通地贴装一感光元件112于一线路板111，以形成一成像组件11；S410 : mounting aphotosensitive element 112 on acircuit board 111 in a conductive manner to form animaging assembly 11 ;

S420:藉由成型模具，在所述成像组件11上模塑形成一模塑基座12，其中所述模组基座12包括一第一模塑部121和一第二模塑部122，其中所述第一模塑部121包覆所述成像组件11的一部分，其中所述第二模塑部122一体地形成于所述第一模塑部121的第一上表面1211，并且所述第二模塑部122的第二上表面1221高于所述第一模塑部121的所述第一上表面1211，以通过所述第二模塑部122的第二外侧面1222与所述第一模塑部121的所述第一上表面1211定义形成一外空间1201；S420: By molding a mold, amolding base 12 is formed on theimaging component 11, wherein themodule base 12 includes afirst molding part 121 and asecond molding part 122, wherein Thefirst molding part 121 covers a part of theimaging assembly 11 , wherein thesecond molding part 122 is integrally formed on the firstupper surface 1211 of thefirst molding part 121 , and thefirst molding part 122 is The secondupper surface 1221 of thesecond molding part 122 is higher than the firstupper surface 1211 of thefirst molding part 121 so as to pass through the secondouter side surface 1222 of thesecond molding part 122 and the firstupper surface 1211 of thefirst molding part 122 . The firstupper surface 1211 of amolding portion 121 defines anouter space 1201;

S430:贴附所述滤光构件13于所述第二模塑部122的所述第二上表面1221，以组装成所述模塑感光组件10；以及S430: attaching thefilter member 13 to the secondupper surface 1221 of thesecond molding portion 122 to assemble the moldedphotosensitive element 10; and

S440:对应地设置至少一光学镜头20于所述模塑感光组件10。S440: Correspondingly dispose at least oneoptical lens 20 on the moldedphotosensitive component 10.

值得注意的是，在本发明的这个示例中，如图15所示，在所述步骤S420之前，所述所述摄像模组1的制造方法还可以包括步骤：It is worth noting that, in this example of the present invention, as shown in FIG. 15, before the step S420, the manufacturing method of the camera module 1 may further include the steps:

S400：相互间隔地安装一组电子元器件113于所述线路板111，其中每所述电子元器件113分别与所述线路板111可导通地连接。S400 : Install a group ofelectronic components 113 on thecircuit board 111 at a distance from each other, wherein each of theelectronic components 113 is respectively connected to thecircuit board 111 in a conductive manner.

进一步地，在本发明一示例中，所述模塑基座12还包括一第三模塑部123，其中所述第三模塑部123一体地形成于所述第一模塑部121的所述第一上表面1211，其中所述第三模塑部123位于所述第二模塑部122的外侧，并且所述第三模塑部123与所述第二模塑部122间隔设置，以在所述第三模塑部123的第三内侧面1233和所述第二模塑部122的第二外侧面1222之间形成所述外空间1201。Further, in an example of the present invention, themolding base 12 further includes athird molding part 123 , wherein thethird molding part 123 is integrally formed on all parts of thefirst molding part 121 . The firstupper surface 1211, wherein thethird molding part 123 is located outside thesecond molding part 122, and thethird molding part 123 and thesecond molding part 122 are spaced apart, so as to Theouter space 1201 is formed between the thirdinner side surface 1233 of thethird molding part 123 and the secondouter side surface 1222 of thesecond molding part 122 .

在本发明的一示例中，所述模塑基座12的所述第二模塑部122设有至少一缺口1224，其中所述缺口1224自所述第二模塑部122的第二内侧面1223延伸至所述第二模塑部122的第二外侧面1222。In an example of the present invention, thesecond molding portion 122 of themolding base 12 is provided with at least onenotch 1224 , wherein thenotch 1224 is formed from the second inner side of thesecond molding portion 122 1223 extends to the secondouter side surface 1222 of thesecond molding part 122 .

值得一提的是，在本发明的一示例中，如图16所示，所述摄像模组1的制造方法的所述步骤S430可以包括步骤：It is worth mentioning that, in an example of the present invention, as shown in FIG. 16 , the step S430 of the manufacturing method of the camera module 1 may include the steps:

S431：施涂粘接剂于所述第二模塑部122的所述第二上表面1221；S431 : applying an adhesive to the secondupper surface 1221 of thesecond molding portion 122 ;

S432：对应地设置所述滤光构件13于所述第二模塑部122，并通过所述第二模塑部122的所述缺口1224形成连通所述模塑感光组件10的内部空间100与所述模塑感光组件10外部的逃气孔1203；以及S432 : correspondingly disposing thefilter member 13 on thesecond molding portion 122 , and forming a communication between theinner space 100 of the moldedphotosensitive assembly 10 and theinner space 100 of the moldedphotosensitive assembly 10 through thegap 1224 of thesecond molding portion 122 anair escape hole 1203 outside the moldedphotosensitive element 10; and

S433：加热或光照所述粘接剂，以在所述滤光构件13的所述下表面131和所述第二模塑部122的所述第二上表面1221之间形成所述粘接层14。S433 : heating or illuminating the adhesive to form the adhesive layer between thelower surface 131 of thefilter member 13 and the secondupper surface 1221 of thesecond molding part 122 14.

此外，在本发明的另一示例中，如图16所示，所述摄像模组1的制造方法的所述步骤S430也可以包括步骤：In addition, in another example of the present invention, as shown in FIG. 16 , the step S430 of the manufacturing method of the camera module 1 may also include the steps of:

S431’：施涂粘接剂于所述滤光构件13的所述下表面131；S431': applying adhesive to thelower surface 131 of thefilter member 13;

S432’：对应地设置所述滤光构件13于所述第二模塑部122，并通过所述第二模塑部122的所述缺口1224形成连通所述模塑感光组件10的内部空间100与所述模塑感光组件10外部的逃气孔1203；以及S432 ′: correspondingly disposing thefilter member 13 on thesecond molding part 122 , and forming theinner space 100 communicating with the moldingphotosensitive assembly 10 through thegap 1224 of thesecond molding part 122 and thevent hole 1203 outside the moldedphotosensitive assembly 10; and

S433’：加热或光照所述粘接剂，以在所述滤光构件13的所述下表面131和所述第二模塑部122的所述第二上表面1221之间形成所述粘接层14。S433 ′: heating or illuminating the adhesive to form the adhesive between thelower surface 131 of thefilter member 13 and the secondupper surface 1221 of thesecond molding part 122Layer 14.

值得注意的是，在本发明的一示例，如图17所示，所述摄像模组1的制造方法的所述步骤S440可以包括步骤：It is worth noting that, in an example of the present invention, as shown in FIG. 17 , the step S440 of the manufacturing method of the camera module 1 may include the steps of:

S441：组装所述光学镜头20至一驱动器30；和S441: Assemble theoptical lens 20 into adriver 30; and

S442：对应地组装所述驱动器30至所述模塑基座12，以组装成变焦摄像模组。S442: Assemble thedriver 30 to themolding base 12 correspondingly to assemble a zoom camera module.

另外，在本发明的另一示例中，如图17所示，所述摄像模组1的制造方法的所述步骤S440也可以包括步骤：In addition, in another example of the present invention, as shown in FIG. 17 , the step S440 of the manufacturing method of the camera module 1 may also include the steps of:

S441’：组装所述光学镜头20的一镜筒21于所述模塑基座12，并且所述光学镜头20的一镜片组22对应于所述成像组件11的感光路径110，以组装成定焦摄像模组。S441 ′: Assemble alens barrel 21 of theoptical lens 20 on themolding base 12 , and alens group 22 of theoptical lens 20 corresponds to thephotosensitive path 110 of theimaging component 11 , so as to be assembled into a fixed Focus camera module.

参考附图18，依本发明的另一个方面，本发明进一步提供一电子设备，其中所述电子设备包括一电子设备本体500和至少一所述摄像模组1，其中每个所述摄像模组1分别被设置于所述电子设备本体500，以用于获取图像。值得一提的是，所述电子设备本体500的类型不受限制，例如所述电子设备本体500可以是智能手机、平板电脑、笔记本电脑、电子书、个人数字助理、相机等任何能够被配置所述摄像模组1的电子设备。本领域的技术人员可以理解的是，尽管附图18中以所述电子设备本体500被实施为智能手机为例，但其并不构成对本发明的内容和范围的限制。Referring to FIG. 18, according to another aspect of the present invention, the present invention further provides an electronic device, wherein the electronic device includes anelectronic device body 500 and at least one camera module 1, wherein each of the camera modules 1 are respectively provided on theelectronic device body 500 for capturing images. It is worth mentioning that the type of theelectronic device body 500 is not limited, for example, theelectronic device body 500 can be any device that can be configured such as a smart phone, a tablet computer, a notebook computer, an e-book, a personal digital assistant, a camera, etc. The electronic equipment of the camera module 1 is described. Those skilled in the art can understand that although FIG. 18 takes theelectronic device body 500 implemented as a smart phone as an example, it does not limit the content and scope of the present invention.

值得注意的是，本发明中所提及的“上”、“下”、“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系，其仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作。例如，所述第一模塑部121上远离所述成像组件11的表面为所述第一模塑部121的第一上表面1211，并且所述第一模塑部121上接触所述成像组件11的表面为所述第一模塑部121的下表面(如图3所示)；又如，所述第一模塑部121上邻近所述光窗120的侧面为所述第一模塑部121的第一内侧面1213，并且所述第一模塑部121上远离所述光窗120的侧面为所述第一模塑部121的第一外侧面1221(如图3所示)。It should be noted that the orientation or positional relationship indicated by "upper", "lower", "inner", "outer", etc. mentioned in the present invention is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the purpose of It is convenient to describe the invention and to simplify the description without indicating or implying that the referred device or element must have a particular orientation, be constructed and operate in a particular orientation. For example, the surface of thefirst molding part 121 away from theimaging component 11 is the firstupper surface 1211 of thefirst molding part 121 , and thefirst molding part 121 contacts the imaging component The surface of 11 is the lower surface of the first molding part 121 (as shown in FIG. 3 ); for another example, the side of thefirst molding part 121 adjacent to thelight window 120 is the first molding The firstinner side 1213 of thefirst molding portion 121, and the side of thefirst molding portion 121 away from thelight window 120 is the firstouter side 1221 of the first molding portion 121 (as shown in FIG. 3).

本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。It should be understood by those skilled in the art that the embodiments of the present invention shown in the above description and the accompanying drawings are only examples and do not limit the present invention. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the embodiments, and the embodiments of the present invention may be modified or modified in any way without departing from the principles.

Claims (34)

Translated fromChinese

1.一种模塑感光组件，其特征在于，其中所述模塑感光组件包括：1. A molded photosensitive component, wherein the molded photosensitive component comprises:一成像组件；an imaging component;一模塑基座，其中所述模塑基座包括：A molded base, wherein the molded base includes:一第一模塑部，其中所述第一模塑部包覆所述成像组件的一部分，其中所述第一模塑部具有一第一上表面；和a first molding portion, wherein the first molding portion encapsulates a portion of the imaging assembly, wherein the first molding portion has a first upper surface; and一第二模塑部，其中所述第二模塑部一体地形成于所述第一模塑部的所述第一上表面，其中所述第二模塑部具有一第二上表面和一第二外侧面；以及a second molding part, wherein the second molding part is integrally formed on the first upper surface of the first molding part, wherein the second molding part has a second upper surface and a the second outer side; and一滤光构件，其中所述滤光构件被对应地设置于所述第二模塑部的所述第二上表面；a filter member, wherein the filter member is correspondingly disposed on the second upper surface of the second molding part;其中所述第二模塑部的所述第二上表面高于所述第一模塑部的所述第一上表面，以通过所述第二模塑部的所述第二外侧面与所述第一模塑部的所述第一上表面定义形成一外空间。The second upper surface of the second molding part is higher than the first upper surface of the first molding part, so as to pass through the second outer side surface of the second molding part and the The first upper surface of the first molding part defines an outer space.2.如权利要求1所述的模塑感光组件，其中，所述第二模塑部的所述第二上表面为一平整面。2 . The molded photosensitive component of claim 1 , wherein the second upper surface of the second molding portion is a flat surface. 3 .3.如权利要求1所述的模塑感光组件，其中，所述模塑基座还包括一第三模塑部，其中所述第三模塑部自所述第一模塑部的所述第一上表面一体地向上延伸，其中所述第三模塑部位于所述第二模塑部的外侧，并且所述第三模塑部与所述第二模塑部间隔设置。3. The molded photosensitive component of claim 1, wherein the molding base further comprises a third molding portion, wherein the third molding portion is formed from the first molding portion of the first molding portion. The first upper surface integrally extends upward, wherein the third molding portion is located outside the second molding portion, and the third molding portion is spaced apart from the second molding portion.4.如权利要求3所述的模塑感光组件，其中，所述第三模塑部的第三内侧面与所述第二模塑部的所述第二外侧面之间的距离不小于0.01毫米。4. The molded photosensitive assembly of claim 3, wherein a distance between the third inner side surface of the third molding portion and the second outer side surface of the second molding portion is not less than 0.01 mm.5.如权利要求1所述的模塑感光组件，其中，所述第二模塑部的所述第二上表面与所述第一模塑部的所述第一上表面之间的高度差在0.03毫米至0.2毫米之间。5. The molded photosensitive assembly of claim 1, wherein a height difference between the second upper surface of the second molding part and the first upper surface of the first molding part between 0.03mm and 0.2mm.6.如权利要求1所述的模塑感光组件，还包括一粘接层，其中所述粘接层由粘接剂固化之后形成，其中所述粘接层位于所述滤光构件的下表面与所述第二模塑部的所述第二上表面之间，以将所述滤光构件贴附于所述第二模塑部的所述第二上表面。6. The molded photosensitive assembly of claim 1, further comprising an adhesive layer, wherein the adhesive layer is formed after curing an adhesive, wherein the adhesive layer is located on a lower surface of the filter member and the second upper surface of the second molding part to attach the filter member to the second upper surface of the second molding part.7.如权利要求6所述的模塑感光组件，其中，所述第二模塑部的第二内侧面位于所述第一模塑部的第一内侧面的外侧，以在所述第二模塑部的内部形成一内空间。7 . The molded photosensitive assembly of claim 6 , wherein the second inner side of the second molding part is located outside the first inner side of the first molding part so as to be in the second The inside of the molding part forms an inner space.8.如权利要求3所述的模塑感光组件，其中，所述成像组件包括一线路板、一可导通地贴附于所述线路板的感光元件以及一组可导通地连接于所述线路板的电子元器件，其中所述第三模塑部对应于所述电子元器件，并且所述第三模塑部的第三上表面高于所述电子元器件的顶表面。8. The molded photosensitive assembly of claim 3, wherein the imaging assembly comprises a circuit board, a photosensitive element conductively attached to the circuit board, and a set of conductively connected to the circuit board. The electronic component of the circuit board, wherein the third molding part corresponds to the electronic component, and the third upper surface of the third molding part is higher than the top surface of the electronic component.9.如权利要求8所述的模塑感光组件，其中，所述模塑基座的所述第一模塑部的所述第一上表面低于所述电子元器件的所述顶表面。9. The molded photosensitive assembly of claim 8, wherein the first upper surface of the first molding portion of the molding base is lower than the top surface of the electronic component.10.如权利要求8所述的模塑感光组件，其中，所述模塑基座的所述第三模塑部的第三外侧面位于所述第一模塑部的所述第一外侧面的内侧，使得所述第一模塑部的所述第一上表面上位于所述第三模塑部之外的部分用于安装至少一光学镜头。10. The molded photosensitive assembly of claim 8, wherein a third outer side of the third molding portion of the molding base is located on the first outer side of the first molding portion the inner side of the first molding part, so that the part of the first upper surface of the first molding part outside the third molding part is used to install at least one optical lens.11.如权利要求10所述的模塑感光组件，其中，所述模塑基座还包括一第四模塑部，其中所述第四模塑部自所述第一模塑部的所述第一上表面向下凹陷，以在所述第一模塑部的外周缘形成一周缘槽，其中所述第四模塑部的第四上表面用于提供安装该光学镜头的安装面。11. The molded photosensitive assembly of claim 10, wherein the molding base further comprises a fourth molding portion, wherein the fourth molding portion is formed from the first molding portion of the first molding portion. The first upper surface is recessed downward to form a peripheral groove on the outer periphery of the first molding part, wherein the fourth upper surface of the fourth molding part is used to provide a mounting surface for mounting the optical lens.12.如权利要求10所述的模塑感光组件，其中，所述模塑基座还包括一第四模塑部，其中所述第四模塑部自所述第一模塑部的所述第一上表面向上延伸，以在所述第一模塑部的外周缘形成一周缘凸起，其中所述第四模塑部的第四上表面用于提供安装该光学镜头的安装面。12. The molded photosensitive component of claim 10, wherein the molding base further comprises a fourth molding portion, wherein the fourth molding portion is formed from the first molding portion of the first molding portion. The first upper surface extends upward to form a peripheral protrusion on the outer periphery of the first molding part, wherein the fourth upper surface of the fourth molding part is used to provide a mounting surface for mounting the optical lens.13.如权利要求8所述的模塑感光组件，其中，所述模塑基座的所述第三模塑部的所述第三上表面高于所述第二模塑部的所述第二上表面。13. The molded photosensitive assembly of claim 8, wherein the third upper surface of the third molding portion of the molding base is higher than the third upper surface of the second molding portion Second upper surface.14.如权利要求13所述的模塑感光组件，其中，所述第三模塑部的所述第三上表面高于所述滤光构件的上表面，并且所述第三模塑部的所述第三上表面适于对应于至少一光学镜头。14. The molded photosensitive assembly of claim 13, wherein the third upper surface of the third molding part is higher than the upper surface of the filter member, and the third molding part has a higher surface. The third upper surface is adapted to correspond to at least one optical lens.15.如权利要求8所述的模塑感光组件，其中，所述第三模塑部根据所述电子元器件的尺寸和位置进行设计。15. The molded photosensitive assembly of claim 8, wherein the third molding portion is designed according to the size and position of the electronic component.16.如权利要求6或7所述的模塑感光组件，其中，所述粘接层由光固化胶或热固化胶固化而成。16. The molded photosensitive component according to claim 6 or 7, wherein the adhesive layer is cured by light-curing glue or heat-curing glue.17.如权利要求1至15中任一所述的模塑感光组件，其中，所述模塑基座的所述第二模塑部设有至少一缺口，以在所述滤光构件被贴附于所述第二模塑部的所述第二上表面时，在所述第二模塑部的所述缺口处形成逃气孔，以通过所述逃气孔将所述模塑感光组件的内部空间与所述模塑感光组件的外部连通。17. The molded photosensitive assembly according to any one of claims 1 to 15, wherein the second molding portion of the molding base is provided with at least one notch, so that the filter member is attached When attached to the second upper surface of the second molding part, an air escape hole is formed at the notch of the second mold part, so that the inside of the molded photosensitive component can be removed from the air escape hole through the air escape hole. The space communicates with the outside of the molded photosensitive member.18.如权利要求16所述的模塑感光组件，其中，所述模塑基座的所述第二模塑部设有至少一缺口，以当所述滤光构件通过所述粘接层被粘接于所述第二模塑部的所述第二上表面时，在所述第二模塑部的所述缺口处形成逃气孔，以通过所述逃气孔将所述模塑感光组件的内部空间与所述模塑感光组件的外部连通。18. The molded photosensitive assembly of claim 16, wherein the second molding portion of the molding base is provided with at least one notch, so that when the filter member is passed through the adhesive layer, it is When adhering to the second upper surface of the second molding part, an air escape hole is formed at the notch of the second molding part, so that the air escape hole is used to remove the molded photosensitive component from the air escape hole. The inner space communicates with the outside of the molded photosensitive member.19.如权利要求18所述的模塑感光组件，其中，所述第二模塑部的所述缺口自所述第二模塑部的第二内侧面横向地延伸至所述第二模塑部的第二外侧面，以便形成横向布置的所述逃气孔。19. The molded photosensitive assembly of claim 18, wherein the notch of the second molding portion laterally extends from a second inner side surface of the second molding portion to the second molding portion the second outer side of the part so as to form the vent holes arranged laterally.20.如权利要求19所述的模塑感光组件，其中，所述模塑基座还包括一模塑加强部，其中所述模塑加强部在所述第二模塑部的所述缺口处自所述第二模塑部一体地向外延伸而成。20. The molded photosensitive assembly of claim 19, wherein the molded base further comprises a molded reinforcement portion, wherein the molded reinforcement portion is at the notch of the second molded portion It is integrally formed from the second molding portion and extends outward.21.如权利要求20所述的模塑感光组件，其中，所述模塑加强部与所述第一模塑部一体地连接，以在所述第二模塑部的所述第二外侧面与所述第一模塑部的所述第一上表面之间形成加强肋。21. The molded photosensitive assembly of claim 20, wherein the molded reinforcing portion is integrally connected with the first molded portion so as to be on the second outer side of the second molded portion A reinforcing rib is formed between it and the first upper surface of the first molding part.22.如权利要求18所述的模塑感光组件，还包括一加强粘接块，其中所述加强粘接块由在所述第二所述模塑部的所述缺口处施涂的粘接剂固化而成。22. The molded photosensitive assembly of claim 18, further comprising a reinforcing bond block, wherein the reinforcing bond block is comprised of a bond applied at the indentation of the second said molded portion agent cured.23.一种摄像模组，其特征在于，包括：23. A camera module, characterized in that, comprising:至少一光学镜头；和at least one optical lens; and如权利要求1至22中任一所述的模塑感光组件，其中每所述光学镜头被对应地设置于所述模塑感光组件，并且所述光学镜头对应于所述模塑感光组件的所述成像组件的感光路径。The molded photosensitive assembly according to any one of claims 1 to 22, wherein each of the optical lenses is correspondingly disposed on the molded photosensitive assembly, and the optical lenses correspond to all of the molded photosensitive assemblies. Describe the photosensitive path of the imaging element.24.如权利要求23所述的摄像模组，还包括至少一驱动器，其中每所述驱动器被组装于所述模塑感光组件的所述模塑基座，并且每所述光学镜头分别被组装于所述驱动器，以组装成变焦摄像模组。24. The camera module of claim 23, further comprising at least one driver, wherein each of the drivers is assembled to the molded base of the molded photosensitive component, and each of the optical lenses is assembled separately on the driver to assemble a zoom camera module.25.如权利要求23所述的摄像模组，其中，每所述光学镜头包括一镜筒和一镜片组，其中所述镜筒被设置于所述模塑感光组件的所述模塑基座，并且每所述光学镜头分别被组装于所述镜筒，以组装成定焦摄像模组。25. The camera module of claim 23, wherein each optical lens comprises a lens barrel and a lens group, wherein the lens barrel is disposed on the molding base of the molding photosensitive component , and each of the optical lenses is assembled in the lens barrel to form a fixed-focus camera module.26.一种电子设备，其特征在于，包括：26. An electronic device, characterized in that it comprises:一电子设备本体；和an electronic device body; and至少一如权利要求23至25中任一所述的摄像模组，其中每所述摄像模组被设置于所述电子设备本体，用于获取图像。At least one camera module according to any one of claims 23 to 25, wherein each camera module is disposed on the electronic device body for capturing images.27.一种摄像模组的制造方法，其特征在于，包括步骤：27. A method for manufacturing a camera module, comprising the steps of:可导通地贴装一感光元件于一线路板，以形成一成像组件；A photosensitive element is conductively mounted on a circuit board to form an imaging assembly;藉由成型模具，在所述成像组件上模塑形成一模塑基座，其中所述模组基座包括一第一模塑部和一第二模塑部，其中所述第一模塑部包覆所述成像组件的一部分，其中所述第二模塑部一体地形成于所述第一模塑部的第一上表面，并且所述第二模塑部的第二上表面高于所述第一模塑部的第一上表面，以通过所述第二模塑部的第二外侧面与所述第一模塑部的所述第一上表面定义形成一外空间；A molding base is formed on the imaging component by molding a mold, wherein the mold base includes a first molding part and a second molding part, wherein the first molding part A part of the imaging assembly is covered, wherein the second molding part is integrally formed on the first upper surface of the first molding part, and the second upper surface of the second molding part is higher than the the first upper surface of the first molding part defines an outer space by the second outer side surface of the second molding part and the first upper surface of the first molding part;贴附所述滤光构件于所述第二模塑部的所述第二上表面，以组装成所述模塑感光组件；以及attaching the filter member to the second upper surface of the second molding part to assemble the molding photosensitive component; and对应地设置至少一光学镜头于所述模塑感光组件。Correspondingly, at least one optical lens is disposed on the molded photosensitive component.28.如权利要求27所述的摄像模组的制造方法，其中，在所述藉由成型模具，在所述成像组件上模塑形成一模塑基座的步骤之前，还包括步骤：28. The method for manufacturing a camera module according to claim 27, wherein before the step of molding a molding base on the imaging component by a molding die, it further comprises the step of:相互间隔地安装一组电子元器件于所述线路板，其中每所述电子元器件分别与所述线路板可导通地连接。A group of electronic components are installed on the circuit board at a distance from each other, wherein each of the electronic components is respectively connected with the circuit board in a conductive manner.29.如权利要求28所述的摄像模组的制造方法，其中，在所述藉由成型模具，在所述成像组件上模塑形成一模塑基座的步骤中：29. The method for manufacturing a camera module according to claim 28, wherein, in the step of molding a molding base on the imaging component by using a molding die:所述模塑基座还包括一第三模塑部，其中所述第三模塑部一体地形成于所述第一模塑部的所述第一上表面，其中所述第三模塑部位于所述第二模塑部的外侧，并且所述第三模塑部与所述第二模塑部间隔设置。The molding base further includes a third molding portion, wherein the third molding portion is integrally formed on the first upper surface of the first molding portion, wherein the third molding portion The third molding portion is located outside the second molding portion, and the third molding portion is spaced apart from the second molding portion.30.如权利要求29所述的摄像模组的制造方法，其中，在所述藉由成型模具，在所述成像组件上模塑形成一模塑基座的步骤中：30. The method for manufacturing a camera module according to claim 29, wherein, in the step of molding a molding base on the imaging component by using a molding die:所述模塑基座的所述第二模塑部设有至少一缺口，其中所述缺口自所述第二模塑部的第二内侧面延伸至所述第二模塑部的第二外侧面。The second molding portion of the molding base is provided with at least one notch, wherein the notch extends from the second inner side of the second molding portion to the second outer side of the second molding portion side.31.如权利要求30所述的摄像模组的制造方法，其中，所述贴附所述滤光构件于所述第二模塑部的所述第二上表面，以组装成所述模塑感光组件的步骤，包括步骤：31. The method of manufacturing a camera module according to claim 30, wherein the filter member is attached to the second upper surface of the second molding part to be assembled into the molding The steps of the photosensitive assembly, including the steps:施涂粘接剂于所述第二模塑部的所述第二上表面；applying adhesive to the second upper surface of the second molding part;对应地设置所述滤光构件于所述第二模塑部，并通过所述第二模塑部的所述缺口形成连通所述模塑感光组件的内部空间与所述模塑感光组件的外部的逃气孔；以及Correspondingly set the filter member on the second molding part, and form a connection between the inner space of the molding photosensitive component and the outside of the molding photosensitive component through the gap of the second molding part the escape holes; and加热或光照所述粘接剂，以在所述滤光构件的所述下表面和所述第二模塑部的所述第二上表面之间形成所述粘接层。The adhesive is heated or irradiated to form the adhesive layer between the lower surface of the filter member and the second upper surface of the second molding part.32.如权利要求30所述的摄像模组的制造方法，其中，所述贴附所述滤光构件于所述第二模塑部的所述第二上表面，以组装成所述模塑感光组件的步骤，包括步骤：32. The method of manufacturing a camera module according to claim 30, wherein the filter member is attached to the second upper surface of the second molding part to be assembled into the molding The steps of the photosensitive assembly, including the steps:施涂粘接剂于所述滤光构件的所述下表面；applying an adhesive to the lower surface of the filter member;对应地设置所述滤光构件于所述第二模塑部，并通过所述第二模塑部的所述缺口形成连通所述模塑感光组件的内部空间与所述模塑感光组件的外部的逃气孔；以及Correspondingly set the filter member on the second molding part, and form a connection between the inner space of the molding photosensitive component and the outside of the molding photosensitive component through the gap of the second molding part the escape holes; and加热或光照所述粘接剂，以在所述滤光构件的所述下表面和所述第二模塑部的所述第二上表面之间形成所述粘接层。The adhesive is heated or irradiated to form the adhesive layer between the lower surface of the filter member and the second upper surface of the second molding part.33.如权利要求27至32中任一所述的摄像模组的制造方法，其中，所述对应地设置至少一光学镜头于所述模塑感光组件的步骤，包括步骤：33. The method for manufacturing a camera module according to any one of claims 27 to 32, wherein the step of correspondingly disposing at least one optical lens on the molded photosensitive component comprises the steps of:组装所述光学镜头至一驱动器；和assembling the optical lens to a driver; and对应地组装所述驱动器至所述模塑感光组件的所述模塑基座，以组装成变焦摄像模组。Correspondingly assemble the driver to the molding base of the molding photosensitive component to assemble a zoom camera module.34.如权利要求27至32中任一所述的摄像模组的制造方法，其中，所述对应地设置至少一光学镜头于所述模塑感光组件的步骤，包括步骤：34. The method for manufacturing a camera module according to any one of claims 27 to 32, wherein the step of correspondingly disposing at least one optical lens on the molded photosensitive component comprises the steps of:组装所述光学镜头的一镜筒于所述模塑感光组件的所述模塑基座，并且所述光学镜头的一镜片组对应于所述成像组件的感光路径，以组装成定焦摄像模组。A lens barrel of the optical lens is assembled on the mold base of the molded photosensitive component, and a lens group of the optical lens corresponds to the photosensitive path of the imaging component, so as to be assembled into a fixed-focus camera module Group.

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