CN111650703B - QSFP single-fiber bidirectional optical coupling assembly and optical module - Google Patents

Abstract

The invention discloses a QSFP single-fiber bidirectional optical coupling component, which comprises: a base on which a main optical axis is provided; a light transmitting surface system comprising: a first light splitting interface, a first reflective interface, a second reflective interface, a third reflective interface, a fourth reflective interface, and a second light splitting interface; an optoelectronic device system, comprising: the device comprises a photodetector, a transimpedance amplifier chip, a laser emitter driving chip, a laser emitter and a monitoring photodetector; the optical detector and the laser emitter are respectively arranged on two sides of the main optical axis, and in the direction of the main optical axis, the optical detector and the laser emitter are respectively arranged at two ends of the base, so that the light transmission surface system and the photoelectric device system are packaged in the base. The optical coupling assembly solves the problem that how to arrange an independent laser emitter driving chip in the optical coupling assembly on the basis of limiting the volume of the optical coupling assembly. The invention also provides an optical module comprising the optical coupling assembly.

Description

QSFP single-fiber bidirectional optical coupling assembly and optical module

Technical Field

The invention relates to the technical field of optical communication. More particularly, the invention relates to a QSFP single-fiber bidirectional optical coupling assembly and an optical module.

Background

An optical module is an optical device for realizing electric-optical and optical-electric signal conversion, and has wide application in various fields, especially in the field of communication. The optical module mainly comprises an optical coupling component, and as the name suggests, one main function of the optical coupling component is to realize optical coupling, and the optical coupling component generally comprises a light emitting component (including a semiconductor laser), a light receiving component (including a light detector), a driving circuit, an optical interface, an electrical interface and the like.

The optical coupling assembly operates on the principle of: at a sending end, an electric signal with a certain speed is processed by a driving chip and then drives a laser to emit a modulated optical signal with a corresponding speed, and an optical signal with stable power is output through an optical power automatic control circuit; at the receiving end, the optical signal with a certain speed is input into the module and then converted into an electric signal by the optical detector, and the electric signal with the corresponding speed is output after passing through the preamplifier.

From the development history of optical modules, the optical coupling module probably has several main signal transmission modes, namely single-mode single-channel, multi-mode multi-channel and multi-mode single-channel.

With the rapid development of the scientific and technological industry in recent years, the social requirements for miniaturization and compatibility of scientific and technological products are higher and higher. This makes it necessary to consider how to implement a comprehensive development of the light module in terms of the compatible qualities of the size of the product volume and the product performance. Unfortunately, the optical coupling component of the multi-mode single-channel type, especially QSFP (Quad Small Form-factor plug, Quad SFP interface) optical coupling component, has more functional modules and more complex structure, so that it is difficult to achieve good compatibility while limiting the product volume.

Disclosure of Invention

An object of the present invention is to solve at least the above problems and to provide at least the advantages described later.

In summary, it is still another object of the present invention to provide at least a QSFP single-fiber bidirectional optical coupling assembly, which solves the problem of how to embed a separate laser emitter driver chip (not designed to be integrated with other chips) in the optical coupling assembly on the basis of limiting the volume of the optical coupling assembly. On the basis of the above, the invention also provides an optical module comprising the QSFP single-fiber bidirectional optical coupling assembly.

Specifically, the invention is realized by the following technical scheme:

first aspect of the invention

A first aspect provides a QSFP single-fiber bidirectional optical coupling assembly, comprising:

the optical fiber connector comprises a base, a first optical fiber and a second optical fiber, wherein the base is provided with an optical fiber interface, and a main optical axis is arranged along the optical fiber interface towards a preset direction;

a light transmitting surface system comprising: a first light splitting interface, a first reflective interface, a second reflective interface, a third reflective interface, a fourth reflective interface, and a second light splitting interface;

an optoelectronic device system, comprising: the device comprises a photodetector, a transimpedance amplifier chip, a laser emitter driving chip, a laser emitter and a monitoring photodetector; wherein,

in the light receiving path of the optical coupling assembly, the received light sequentially enters the first light splitting interface and the first reflecting interface from the optical fiber interface and is emitted to the optical detector by the first reflecting interface,

in the light emitting path of the optical coupling assembly, the emitted light enters the fourth reflecting interface after being emitted from the laser emitter, is emitted to the second light splitting interface and is split into two parts of light, wherein one part of light enters the monitoring photoelectric detector, the other part of light is emitted to the first light splitting interface by the third reflecting interface and the second reflecting interface in sequence and is emitted to the optical fiber interface by the first light splitting interface,

the optical detector and the laser emitter are respectively arranged on two sides of the main optical axis, and in the direction of the main optical axis, the optical detector and the laser emitter are respectively arranged on two ends of the base, so that the light transmission surface system and the photoelectric device system are packaged in the base.

In some aspects, the light emission path and the light transmitted in the light emission path have different wavelengths.

In some embodiments, an angle between the first light splitting interface and the main optical axis is 45 degrees.

In some embodiments, the first reflective interface is disposed obliquely to the bottom of the base toward the first light splitting interface.

In some aspects, the second reflective interface is disposed parallel to the third reflective interface.

In some embodiments, the third reflective interface and the second light splitting interface are disposed obliquely relative to each other.

In some embodiments, the third reflective interface and the second light splitting interface are respectively disposed to be inclined toward the bottom of the base.

In some embodiments, the first light splitting interface is provided by a wavelength light splitting device, the wavelength light splitting device includes a filter and a wavelength splitting film covering the filter, the first light splitting interface is formed on the wavelength splitting film, and the wavelength splitting film is configured to allow a first predetermined light to transmit therethrough and to emit a second predetermined light onto the first reflective interface.

In some embodiments, the second light splitting interface is provided by a light intensity splitting device, the light intensity splitting device includes glass and a light intensity splitting film covering the glass, the first light splitting interface is formed on the light intensity splitting film, and the light intensity splitting film is configured to allow a third predetermined light to transmit therethrough and to emit a fourth predetermined light onto the third reflective interface.

Second aspect of the invention

A second aspect provides a light module comprising:

the QSFP single-fiber bidirectional optical coupling component in the technical schemes of the first aspect.

The technical effects of the embodiment of the invention at least comprise:

in some embodiments, the QSFP single-fiber bidirectional optical coupling assembly of the present application staggers the optical detector and the laser emitter to be disposed on two sides of the main optical axis, and increases the arrangement space in the base, so that the transimpedance amplifier chip and the laser emitter driving chip may be disposed in the base without increasing the volume of the optical coupling assembly, thereby improving the space utilization rate of the internal structure of the optical coupling assembly, and facilitating the development of the optical coupling assembly toward the miniaturization direction. Repeatedly, each photoelectric device in the optical coupling assembly can be arranged in the base in a mutually staggered mode, and the arrangement of lines is facilitated. Moreover, the receiving end (namely the optical detector) and the transmitting end (namely the laser transmitter) of the optical signal in the optical coupling assembly are arranged on two sides of the main optical axis in a staggered mode, so that mutual influence between optical strings can be avoided. In addition to the above, the optical coupling assembly of the present application can achieve the following technical effects: because the transimpedance amplifier chip and the laser emitter driving chip are separately (i.e. non-integrated) arranged in the base (in the prior art, the transimpedance amplifier chip and the laser emitter driving chip are integrally designed into one chip in order to improve the space utilization rate), the replacement is convenient, namely, the optical coupling component can be structurally matched with the transimpedance amplifier chips and the laser emitter driving chips of different manufacturers or models, so that the compatibility is improved.

Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.

Drawings

FIG. 1 is a schematic diagram of a base according to some embodiments of the present invention;

FIG. 2 is another schematic view of the base of FIG. 1;

FIG. 3 is a schematic view of a light delivery system in accordance with some embodiments of the present invention;

FIG. 4 is a schematic diagram of a QSFP single fiber bi-directional optical coupling assembly in some embodiments of the present invention;

FIG. 5 is a schematic diagram of a QSFP single fiber bi-directional optical coupling assembly in further embodiments of the present invention;

FIG. 6 is a schematic diagram of a QSFP single fiber bi-directional optical coupling assembly in accordance with still further embodiments of the present invention;

FIG. 7 is a partially enlarged structural schematic view of the M-site of the QSFP single-fiber bi-directional optical coupling assembly of FIG. 6;

FIG. 8 is another schematic view of the QSFP single fiber bi-directional optical coupling assembly of FIG. 6;

FIG. 9 is a partially enlarged schematic structural view of the N-site of the QSFP single-fiber bi-directional optical coupling assembly of FIG. 8;

FIG. 10 is a schematic representation of a QSFP single fiber bi-directional optical coupling assembly according to yet other embodiments of the present invention taken along section line A-A;

FIG. 11 is a schematic view of a QSFP single fiber bi-directional optical coupling assembly according to yet other embodiments of the present invention taken along section lines F-F;

FIG. 12 is a schematic representation of a QSFP single fiber bi-directional optical coupling assembly according to yet other embodiments of the present invention taken along section line B-B;

FIG. 13 is a schematic representation of a QSFP single fiber bi-directional optical coupling assembly according to yet other embodiments of the present invention taken along section line C-A;

FIG. 14 is a schematic diagram of a QSFP single fiber bi-directional optical coupling assembly after connection to a circuit board in accordance with still further embodiments of the present invention;

reference numerals:

10. optical coupling assembly

100. A base;

110. a first groove;

111. a first light splitting groove;

112. a second light splitting groove;

113. a first reflective groove;

114. a second reflective groove;

115. a third reflective groove;

116. a fourth reflective groove;

120. a second groove;

121. a first lens;

122. a second lens;

130. an optical fiber interface;

131. an optical fiber interface face;

200. a light transmitting surface system;

210. a first light splitting element;

211. a first light splitting interface;

220. a second light splitting element;

221. a second light splitting interface;

230. a first reflective element;

231. a first reflective interface;

240. a second reflective element;

241. a second reflective interface;

250. a third reflective element;

251. a third reflective interface;

260. a fourth reflective element;

261. a fourth reflective interface;

300. a system of optoelectronic devices;

310. a light detector;

320. a laser transmitter;

330. monitoring the photodetector;

340. a transimpedance amplifier chip;

350. a laser emitter driving chip;

20. a circuit board.

Detailed Description

The present invention is further described in detail below with reference to the attached drawings so that those skilled in the art can implement the invention by referring to the description text.

The terms "first", "second", "third", "fourth" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," "third," or "fourth" may explicitly or implicitly include at least one of the feature. It is also noted that, in the present application, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. Further, the orientations and positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like are based on the orientations and positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or apparatus referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "include" and "provided," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

In addition to the foregoing, it should be emphasized that reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

< QSFP Single-fiber bidirectional optical coupling Assembly >

As shown in fig. 1 to 14, a first aspect of the present application provides a QSFP single-fiber bidirectionaloptical coupling assembly 10, including abase 100, a lighttransmission surface system 200, and anoptoelectronic device system 300, in this application, the lighttransmission surface system 200 and theoptoelectronic device system 300 are packaged in thebase 100, so as to implement a miniaturized design of theoptical coupling assembly 10, and simultaneously ensure compatibility, facilitating replacement of atransimpedance amplifier chip 340 and alaser emitter 320 driving chip in theoptoelectronic device system 300, and the structure and the operation principle of theoptical coupling assembly 10 are specifically described as follows:

abase 100, wherein the base 100 may be made of a resin material, thebase 100 is provided with anoptical fiber interface 130, and a main optical axis is arranged along theoptical fiber interface 130 in a predetermined direction; in some embodiments, as shown in fig. 1 and 2, thebase 100 may be configured to have a rectangular parallelepiped shape, and the predetermined direction may be determined by a person skilled in the art according to actual needs, in fig. 1 and 2, the predetermined direction is configured to be parallel to a length direction of thebase 100, i.e., a left-right direction in the drawing, and theoptical fiber interface 130 is configured to have a cylindrical shape and is located at one end of thebase 100, e.g., a left end in the drawing.

A light transmittingsurface system 200, comprising: the firstlight splitting interface 211, the secondlight splitting interface 221, the firstreflective interface 231, the secondreflective interface 241, the thirdreflective interface 251, and the fourthreflective interface 261, which may be specifically shown in fig. 3; wherein the firstlight splitting interface 211 is configured to allow transmission of a first predetermined light, and emits a second predetermined light onto the firstreflective interface 231; the second light-splittinginterface 221 is arranged to allow transmission of some third predetermined light, and the other fourth predetermined light rays are emitted to the third reflectinginterface 251, the first reflectinginterface 231 is used for emitting the received light rays towards a specified direction, the second reflectinginterface 241 is used for emitting the received light to the firstlight splitting interface 211, the thirdreflective interface 251 is used for emitting the received light to the secondreflective interface 241, the fourthreflective interface 261 is used for emitting the received light to the secondlight splitting interface 221. Accordingly, in some embodiments, grooves for accommodating the aforementioned interfaces are provided in thebase 100, specifically, as shown in fig. 1, the top of thebase 100 is recessed inward to form afirst groove 110, and the bottom of thefirst groove 110 is recessed inward to form afirst splitting groove 111 for accommodating thefirst splitting interface 211, asecond splitting groove 112 for accommodating thesecond splitting interface 221, afirst reflection groove 113 for accommodating thefirst reflection interface 231, asecond reflection groove 114 for accommodating thesecond reflection interface 241, athird reflection groove 115 for accommodating thethird reflection interface 251, and afourth reflection groove 116 for accommodating thefourth reflection interface 261; more specifically, on the light transmission path, thefirst reflection groove 113, the firstlight splitting groove 111, thesecond reflection groove 114, thethird reflection groove 115, the secondlight splitting groove 112, and thefourth reflection groove 116 are sequentially communicated with each other, so that light can be transmitted on each interface.

Anoptoelectronic device system 300, comprising: theoptical detector 310, thetransimpedance amplifier chip 340, the laseremitter driving chip 350, thelaser emitter 320, and themonitoring photodetector 330 may be specifically as shown in fig. 4, wherein theoptical detector 310 may be implemented by a photodiode, themonitoring photodetector 330 may be implemented by a monitoring photodiode, and thelaser emitter 320 may be implemented by a semiconductor laser diode; in some embodiments, with continued reference to fig. 4, theoptoelectronic device system 300 is located at the bottom of the light transmittingsurface system 200, specifically, the bottom of thebase 100 is recessed inwardly to form asecond recess 120, and theoptoelectronic device system 300 is disposed in thesecond recess 120.

Wherein,

in the light receiving path of theoptical coupling assembly 10, the received light sequentially enters the firstlight splitting interface 211 and the first reflectinginterface 231 from theoptical fiber interface 130, and is emitted to theoptical detector 310 by the first reflectinginterface 231, which may be specifically shown in fig. 3, where it is to be noted that the received light may be set as the aforementioned second predetermined light, that is, the transmission process of the received light emitted from the firstlight splitting interface 211 to the first reflectinginterface 231 may be realized; how the light is received by thelight detector 310 can be implemented by the prior art; the first lens 121 communicating with the first reflectinggroove 113 is disposed in thesecond groove 120, and thelight detector 310 is disposed at the first lens 121, as shown in fig. 2, so that the light emitted from the first reflectinginterface 231 can be converged into thelight detector 310 through the first reflectinggroove 113;

in the light emitting path of theoptical coupling assembly 10, the emitted light enters the fourth reflectinginterface 261 after being emitted from thelaser emitter 320, is emitted into the secondlight splitting interface 221 and is split into two light portions, wherein one light portion (such as the aforementioned fourth predetermined light) enters themonitoring photodetector 330, and the other light portion (such as the aforementioned third predetermined light) is sequentially emitted into the firstlight splitting interface 211 by the third reflectinginterface 251 and the second reflectinginterface 241, and is emitted into theoptical fiber interface 130 by the firstlight splitting interface 211, which may be specifically shown in fig. 3; how to emit the light from thelaser emitter 320 to the fourthreflective interface 261 can be implemented by the prior art, and can also be implemented as follows: asecond lens 122 is disposed in thesecond groove 120 and is communicated with the fourth reflectinggroove 116, and thelaser emitter 320 is disposed at thesecond lens 122, so that the light emitted from the fourth reflectinginterface 261 can be converged into thelight detector 310 through the fourth reflectinggroove 116; similarly to the above, how the light is received by themonitor photodetector 330 can also be realized by the prior art;

theoptical detector 310 and thelaser emitter 320 are respectively disposed at two sides of the main optical axis, and in the main optical axis direction, theoptical detector 310 and thelaser emitter 320 are respectively disposed at two ends of thebase 100, so that the lighttransmission surface system 200 and theoptoelectronic device system 300 are packaged in thebase 100; specifically, as shown in fig. 4, thelight detector 310 is disposed at the left end of thebase 100 and located at the rear side of the main optical axis, and thelaser emitters 320 are respectively disposed at the right end of thebase 100 and located at the front side of the main optical axis.

In addition, it should be noted that thephotodetector 310, thetransimpedance amplifier chip 340, the laseremitter driving chip 350, thelaser emitter 320, and themonitor photodetector 330 are electrically connected to acircuit board 20, respectively.

In the present application, thetransimpedance amplifier chip 340 and the laseremitter driver chip 350 are disposed in the base in at least two ways:

in some embodiments, as shown in fig. 4 in particular, themonitor photodetector 330 is located at a substantially middle region of the base, and thetransimpedance amplifier chip 340 and the laseremitter driving chip 350 are respectively disposed at two sides of the main optical axis, that is, at the front and rear ends of thebase 100. In other embodiments, as shown in fig. 5 in particular, themonitor photodetector 330 is located at a position substantially in the middle of thebase 100 along the main optical axis direction, and thetransimpedance amplifier chip 340 and the laseremitter driver chip 350 are respectively disposed at the left and right ends of thebase 100.

In the QSFP single-fiber bidirectionaloptical coupling assembly 10 in each embodiment, since theoptical detector 310 and thelaser emitter 320 are staggered on two sides of the main optical axis, and the arrangement space in the base is increased, thetransimpedance amplifier chip 340 and the laseremitter driver chip 350 can be arranged in the base without increasing the volume of theoptical coupling assembly 10, so that the space utilization rate of the internal structure of theoptical coupling assembly 10 is improved, and theoptical coupling assembly 10 is favorably developed toward miniaturization. Again, the optoelectronic devices in theoptical coupling assembly 10 can be arranged in the base 100 in a staggered manner to facilitate the routing of the lines. Moreover, the receiving end (i.e., the optical detector 310) and the transmitting end (i.e., the laser emitter 320) of the optical signal in theoptical coupling assembly 10 are disposed at two sides of the main optical axis in a staggered manner, so that the mutual influence between the optical strings can be avoided. In addition to the above, theoptical coupling assembly 10 of the present application can achieve the following technical effects: since thetransimpedance amplifier chip 340 and the laseremitter driver chip 350 are separately (i.e., non-integrated) disposed in the base 100 (in the prior art, thetransimpedance amplifier chip 340 and the laseremitter driver chip 350 are integrated into one chip to improve space utilization), replacement is facilitated, that is, theoptical coupling assembly 10 of the present application can structurally match thetransimpedance amplifier chip 340 and the laseremitter driver chip 350 of different manufacturers or models, thereby improving compatibility.

In some embodiments, the reflections of the light rays in the firstlight splitting interface 211, the secondlight splitting interface 221, the firstreflective interface 231, the secondreflective interface 241, the thirdreflective interface 251, and the fourthreflective interface 261 are all total reflections.

In some embodiments, the light emission path is different in wavelength from light transmitted in the light emission path.

In some embodiments, the firstreflective interface 231 is disposed obliquely to the bottom of the base 100 toward the firstlight splitting interface 211.

In some embodiments, the angle between the firstlight splitting interface 211 and the main optical axis is 45 degrees.

In some embodiments, the secondreflective interface 241 is disposed parallel to the thirdreflective interface 251, as shown in fig. 3.

In some embodiments, the thirdreflective interface 251 is disposed obliquely with respect to the secondlight splitting interface 221.

In some embodiments, the thirdreflective interface 251 and the secondlight splitting interface 221 are respectively disposed to be inclined toward the bottom of thebase 100.

Continuing as shown in fig. 6-13:

in some embodiments, the firstlight splitting interface 211 and the secondlight splitting interface 221 can be implemented by light splitting films, and as for the firstreflective interface 231, the secondreflective interface 241, the thirdreflective interface 251, the fourthreflective interface 261, this can be achieved by providing respective first 230, second 240, third 250 and fourth 260 reflective elements made of resin material in thebase 100, for example, the firstreflective interface 231, the secondreflective interface 241, the thirdreflective interface 251 and the fourthreflective interface 261 are respectively disposed on the firstreflective element 230, the secondreflective element 240, the thirdreflective element 250 and the fourthreflective element 260, and specifically, in some embodiments, the firstreflective element 230, the secondreflective element 240, the thirdreflective element 250, and the fourthreflective element 260 are integrally formed with thebase 100. Of course, in some other embodiments, the firstreflective interface 231, the secondreflective interface 241, the thirdreflective interface 251, and the fourthreflective interface 261 may be implemented by reflective films.

In some embodiments, the firstlight splitting interface 211 is provided by a wavelength splitting device including a filter and a wavelength splitting film (also called a dichroic splitting film) covering the filter, the firstlight splitting interface 211 is formed on the wavelength splitting film, and the wavelength splitting film is configured to allow the first predetermined light to transmit and emit the second predetermined light onto the first reflectinginterface 231.

In some embodiments, the optical filter and the firstlight splitting groove 111 are adhered by glue, and the refractive index of the glue is substantially equal to that of thebase 100.

In some embodiments, the secondlight splitting interface 221 is provided by a light splitting device, which includes a glass and a light splitting film covering the glass, wherein the light splitting film is a thin film that splits light into two parts according to a certain light intensity ratio, and may be implemented by a single-color light splitting film or a broadband light splitting film. The firstlight splitting interface 221 is formed on the light intensity splitting film, which is configured to allow the third predetermined light to transmit and to emit the fourth predetermined light onto the third reflectinginterface 251.

In some embodiments, as shown in fig. 14, the bottom surface of thebase 100 is horizontally disposed to facilitate a snug fit with thecircuit board 20 to enclose theoptoelectronic device system 300 in thesecond recess 120.

In some embodiments, the firstlight splitting interface 211 is disposed perpendicular to the bottom surface of thebase 100.

< optical Module >

A second aspect provides an optical module comprising the QSFP uni-directionaloptical coupling assembly 10 described in embodiments of the first aspect.

While embodiments of the invention have been described above, it is not limited to the applications set forth in the description and the embodiments, which are fully applicable in various fields of endeavor to which the invention pertains, and further modifications may readily be made by those skilled in the art, it being understood that the invention is not limited to the details shown and described herein without departing from the general concept defined by the appended claims and their equivalents.

Claims (10)

1. A QSFP single-fiber bi-directional optical coupling assembly, comprising:

   the optical fiber connector comprises a base, a first optical fiber and a second optical fiber, wherein the base is provided with an optical fiber interface, and a main optical axis is arranged along the optical fiber interface towards a preset direction;

   a light transmitting surface system comprising: a first light splitting interface, a first reflective interface, a second reflective interface, a third reflective interface, a fourth reflective interface, and a second light splitting interface;

   an optoelectronic device system, comprising: the device comprises a photodetector, a transimpedance amplifier chip, a laser emitter driving chip, a laser emitter and a monitoring photodetector; wherein,

   the photoelectric device system is positioned at the bottom of the light transmission surface system;

   in the light receiving path of the optical coupling assembly, the received light sequentially enters the first light splitting interface and the first reflecting interface from the optical fiber interface and is emitted to the optical detector by the first reflecting interface,

   in the light emitting path of the optical coupling assembly, the emitted light enters the fourth reflecting interface after being emitted from the laser emitter, is emitted to the second light splitting interface and is split into two parts of light, wherein one part of light enters the monitoring photoelectric detector, the other part of light is emitted to the first light splitting interface by the third reflecting interface and the second reflecting interface in sequence and is emitted to the optical fiber interface by the first light splitting interface,

   the optical detector and the laser emitter are respectively arranged on two sides of the main optical axis, and in the direction of the main optical axis, the optical detector and the laser emitter are respectively arranged on two ends of the base, so that the light transmission surface system and the photoelectric device system are packaged in the base;

   the top of the base is inwards recessed to form a first groove, and the bottom of the first groove is inwards recessed continuously to form a first light splitting groove for accommodating the first light splitting interface, a second light splitting groove for accommodating the second light splitting interface, a first reflection groove for accommodating the first reflection interface, a second reflection groove for accommodating the second reflection interface, a third reflection groove for accommodating the third reflection interface and a fourth reflection groove for accommodating the fourth reflection interface;

   the bottom of the base is inwards recessed to form a second groove, and the photoelectric device system is arranged in the second groove;

   a first lens communicated with the first reflection groove is arranged in the second groove, and the light detector is arranged at the first lens; a second lens communicated with the fourth reflection groove is arranged in the second groove, and the laser emitter is arranged at the second lens;

   a separate laser emitter driver chip is built into the optical coupling assembly.
2. 2. The light coupling assembly of claim 1, wherein the light emission path is different in wavelength from light traveling in the light emission path.
3. 3. The light coupling assembly of claim 1, wherein the angle between the first light splitting interface and the primary optical axis is 45 degrees.
4. 4. The light coupling assembly of claim 1, wherein the first reflective interface is disposed obliquely to the bottom of the base toward the first light splitting interface.
5. 5. The light coupling assembly of claim 1, wherein the second reflective interface is disposed parallel to the third reflective interface.
6. 6. The light coupling assembly of claim 1, wherein the third reflective interface is disposed obliquely relative to the second light splitting interface.
7. 7. The light coupling assembly of claim 1, wherein the third reflective interface and the second light splitting interface are each disposed obliquely toward the bottom of the base.
8. 8. The light coupling assembly of claim 1, wherein the first light splitting interface is provided by a wavelength splitting device including a filter and a wavelength splitting film disposed over the filter, the first light splitting interface being formed on the wavelength splitting film, the wavelength splitting film being configured to allow a first predetermined light to transmit and to emit a second predetermined light onto the first reflective interface.
9. 9. The light coupling assembly of claim 1, wherein the second light splitting interface is provided by a light intensity splitting device comprising glass and a light intensity splitting film disposed over the glass, the second light splitting interface being formed on the light intensity splitting film, the light intensity splitting film being configured to allow a third predetermined light to be transmitted and to emit a fourth predetermined light onto the third reflective interface.
10. 10. An optical module, comprising:

    the QSFP single-fiber bi-directional optical coupling assembly of any of claims 1-9.

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