CN111627343A

Movatterモバイル変換

Info

Publication number: CN111627343A
Application number: CN201910262247.3A
Authority: CN
Inventors: 崔原泽; 梁洲雄
Original assignee: Huiyuan Co ltd
Current assignee: Huiyuan Co ltd
Priority date: 2019-02-27
Filing date: 2019-04-02
Publication date: 2020-09-04
Also published as: KR102116393B1

Abstract

The invention relates to a transparent light-emitting diode display panel with a metal mesh electrode pattern, wherein a front metal mesh electrode and a rear metal mesh electrode are respectively formed on two sides of a transparent substrate in a patterning mode and are connected through a conductive through hole to reduce resistance, and the line width of the rear metal mesh electrode is smaller than that of the front metal mesh electrode to improve transparency and visibility, so that the resistance of the metal mesh electrode is reduced, meanwhile, the brightness is increased, and the transparent light-emitting diode display panel with high performance and high reliability can be realized.

Description

Transparent LED display with double-sided electrodes

Technical Field

The present invention relates to an electrode of a transparent light emitting diode display panel, and more particularly, to a transparent light emitting diode display panel having electrode patterns formed on both surfaces of a transparent substrate.

Background

In recent years, Light Emitting Diodes (LEDs) having high energy efficiency have been used as lighting fixtures. Light Emitting Diodes (LEDs) are used not only in the field of lighting but also in advertising boards (panels), and are used as high-visibility electro-optical panels in various places such as department stores, baseball stadiums, and shopping malls. In order to apply the light emitting diode to a transparent electro-optic panel, it is important to increase brightness by reducing the resistance of a circuit and improving heat dissipation. At the same time, it is important to achieve high transparency and visibility.

In recent years, a technique of forming a circuit wiring using a Metal mesh (Metal mesh) has been developed in order to fasten a light emitting diode chip to a circuit pattern. The metal mesh electrode pattern is formed by patterning a conductive material such as nickel, copper, silver, or tin on a transparent substrate.

In order to improve the transparency and visibility of the light emitting diode display panel, it is necessary to reduce the visibility of the metal mesh pattern, and for this reason, it is necessary to reduce the width of the circuit wiring to the maximum, but there arises a problem that the resistance increases as the width of the circuit wiring decreases. Therefore, a technique for reducing the visibility of the metal mesh pattern while minimizing the resistance of the metal mesh line is urgently required.

Korean patent laid-open publication (kokai: 10-20190013564, transparent light emitting device display) discloses a technique of reducing the visibility of a circuit pattern by using a metal mesh pattern having the same line width, line height, and pitch in a first common electrode wiring portion, a second common electrode wiring portion, and a signal electrode wiring portion, and disposing the metal mesh pattern in the entire effective screen portion area on a transparent substrate except for the area having a light emitting device, thereby maximizing the width of the common electrode wiring portion to reduce the resistance, but does not disclose a technique of reducing the resistance by forming a double-sided electrode and minimizing the visibility of the metal mesh electrode by changing the size or arrangement of the electrode.

Disclosure of Invention

Technical problem

The present invention is directed to maximizing the transparency and visibility of a panel while minimizing the resistance of a metal mesh line suitable for a transparent light emitting diode display to achieve high performance and high reliability.

Means for solving the problems

ADVANTAGEOUS EFFECTS OF INVENTION

The invention forms the front metal net electrode and the back metal net electrode on the two sides of the transparent substrate respectively in a lattice pattern, thereby reducing the resistance of wiring to realize high-performance and high-efficiency light emission, improving the transparency and visibility by changing the line width or the configuration of the front metal net electrode and the back metal net electrode, and preventing Moire phenomenon. Moreover, the heat dissipation effect can be maximized through the double-sided electrode, and the total weight of the display panel can be reduced through the narrower line width.

Drawings

Fig. 1 is a diagram illustrating a transparent light emitting diode display having a metal mesh electrode formed on a transparent substrate according to an embodiment.

Fig. 2 is a diagram illustrating a transparent light emitting diode display having metal mesh electrodes and light emitting diode chips formed on a transparent substrate according to an embodiment.

Fig. 3 is a diagram illustrating an embodiment of a transparent led display with front and rear metal mesh electrodes having the same line width and problems thereof.

FIG. 4 is a diagram illustrating a cross-section of a transparent LED display with enhanced visibility according to one embodiment.

Fig. 5 is a diagram illustrating the rear of a transparent light emitting diode display with improved visibility by varying the pitch of the front expanded metal electrodes and the pitch of the rear expanded metal electrodes according to an embodiment.

Fig. 6 is a diagram illustrating the rear of a transparent led display with front and rear expanded metal electrodes arranged in an interleaved manner to improve visibility according to one embodiment.

Description of reference numerals

100: transparent light emitting diode display

110: transparent substrate

120: front metal mesh electrode

130: rear metal net electrode

140: conductive via

150: a light emitting diode chip.

Detailed Description

Hereinafter, the present invention will be described in detail by preferred embodiments with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains can easily understand and reproduce the same. In describing the present invention, a detailed description of related well-known functions or constructions will be omitted when it is judged that the detailed description may unnecessarily obscure the gist of the present invention. Terms used throughout the specification of the present invention are terms defined in consideration of functions in the present invention, which may be sufficiently changed according to intentions or conventions of a user, an operator, and the like, and thus, such terms should be defined based on the entire contents of the present specification.

The embodiments of the invention described above and added thereto will be clearly understood from the examples described below. Even if the structures of the embodiments selectively described in the present specification or the embodiments selectively described in the present specification are illustrated as a single combined structure in the drawings, it should be understood that the embodiments may be freely combined with each other as long as there is no different description and no contradiction is clearly indicated by a person having ordinary skill in the art of the present invention.

Therefore, the embodiments described in the present specification and the configurations shown in the drawings are only the most preferable embodiments of the present invention and do not represent the entire technical idea of the present invention, and therefore, it is to be understood that various equivalent technical solutions and modified embodiments that can replace these may exist from the viewpoint of the present application.

Fig. 1 is a diagram illustrating a transparent light emitting diode display having a metal mesh electrode formed on a transparent substrate according to an embodiment. As shown, thetransparent led display 100 may include atransparent substrate 110 and ametal mesh electrode 120. Themetal mesh electrode 120 may be a front metal mesh electrode (frontmesh electrode) formed in front of the transparent lightemitting diode display 100. The frontmetal Mesh electrode 120 may be patterned in a Mesh shape on thetransparent substrate 110 and formed in a plurality of Segment units to be insulated (Insulation) respectively. Thefront mesh electrode 120 may be formed in a mesh pattern structure having a predetermined line width L, thickness D, and pitch P to provide a path for signals and power. The reason why thefront mesh electrode 120 is formed is that the bonding force can be increased by widening the bonding area of the front mesh electrode and the Pad (Pad), so that the light emitting diode can be stably fixed even if external impact in the horizontal direction is applied. Also, since the metal mesh electrode performs a function of a heat sink (Heatsink), a heat dissipation effect can also be expected.

Pads (Pad) are bonded to the front expandedmetal electrodes 120 by Soldering (Soldering), and a plurality of light emitting diode chips (LED chips) (not shown) are mounted, so that various colors and letters can be expressed. Further, a Rear metal mesh electrode (not shown) may be provided on the Rear surface of the transparent substrate corresponding to the front metal mesh electrode and formed in a mesh pattern structure having a predetermined line width l, thickness d, and pitch p. Thetransparent substrate 110 may be a film of Polyethylene terephthalate (PET) composition. As shown in the drawing, the mesh pattern may be formed in a lattice shape by arranging electric wires (Electrical lines) in x-axis and y-axis, but is not limited thereto, and may be formed in various meshes.

Fig. 2 is a diagram illustrating a transparent light emitting diode display having metal mesh electrodes and light emitting diode chips formed on a transparent substrate according to an embodiment. As shown, thetransparent led display 100 may include atransparent substrate 110, a frontmetal mesh electrode 120, a rearmetal mesh electrode 130, a Conductive via (Conductive via)140, and ledchips 150.

As described above, the resistance RF of the front expanded metal electrode and the resistance R of the rear expanded metal electrode are connected in Parallel (Parallel), and the total resistance R in the entire Equivalent Circuit (Equivalent Circuit) becomes smaller than the case where only the resistance RF of the front expanded metal electrode exists, and thus a high-performance and high-efficiency display panel can be realized. In other words, the center line of the line width of the circuit formed at the rear side is identical to the center line of the line width of the circuit formed at the front side, and the circuit pattern formed at the rear side is connected in parallel with the circuit pattern formed at the front side through the Via (Via)140, thereby reducing the Resistance (Resistance) of the metal mesh electrode as a whole.

The through-hole 140 is formed by a method of forming a through-hole using a jig such as a pin (pin) for punching or a method of punching with a laser, and the front expanded metal electrode and the rear expanded metal electrode are electrically connected by filling the inside of the through-hole with a conductive material.

Fig. 3 is a diagram illustrating an embodiment of a transparent led display with front and rear metal mesh electrodes having the same line width and problems thereof. As shown, the viewing angle or Full Width Half Maximum (FWHM) range of theled chip 150 is typically 120 °, so that the top-bottom angle or the left-right angle at which thetransparent led display 100 is viewed by a person is within a similar range. However, as shown in the drawing, if the line widths L of the front expandedmetal electrode 120 and the rear expandedmetal electrode 130 are the same, a Moire (Moire) phenomenon is caused in a portion of the rear expandedmetal electrode 130 corresponding to a length obtained by multiplying the thickness d of the rear expandedmetal electrode 130 by √ 3(tan60), which may be a factor of reducing visibility. The moire phenomenon refers to a phenomenon that a human eye viewing a display is recognized as being thicker than an actual line width and looks like a moire shape or a spot due to a misalignment occurring when circuits of front and rear electrodes formed at a transparent display panel are misaligned or a scattered light or reflection effect occurring from a protruding portion of the rear electrode. Therefore, in order to prevent the moire phenomenon, it is necessary to etch (Etching) the length corresponding to the thickness D of the rear expandedmetal electrode 130 multiplied by tan60 ° or to use a Thin (Thin) electrode. This is based on trigonometric functions or Pythagoreantheorem. In addition to the moire phenomenon, in the case where the front and rear mesh electrodes are not exactly located at corresponding positions through the transparent substrate but are misaligned due to accumulated tolerance, the visibility of the transparent display is deteriorated, and the phenomenon that the transparency is deteriorated due to such misalignment (misalignment) is more likely to occur as the line width is relatively narrow and the interval between lines is narrower. That is, in the structure to which the rear expanded metal electrode is applied, the line width added with the portion not overlapping with the front expanded metal electrode is recognized as the bus line width, and thus transparency and visibility are reduced. Therefore, if the line width is changed as in the present invention, the problem of the visibility being lowered due to such misalignment can be solved.

The thickness d of the rear expandedmetal electrode 130 may be less than or equal to the thickness d of the front expandedmetal electrode 120.

FIG. 4 is a diagram illustrating a cross-section of a transparent LED display with enhanced visibility according to one embodiment. As shown, the transparent leddisplay 100 may include atransparent substrate 110, a frontmetal mesh electrode 120, a rearmetal mesh electrode 130, and a Conductive via (Conductive via) 140.

Thetransparent substrate 110 may be a film of Polyethylene terephthalate (PET) composition. Thetransparent substrate 110 may have a prescribed thickness (e.g., 1 mm). The frontmetal mesh electrode 120 is formed on the front surface of the transparent substrate in a mesh pattern structure having a predetermined line width L, thickness D, and pitch P, and provides a path for signals and power. For example, the line width L may be 50 μm and the thickness D may be 9 μm. A light emitting diode chip (not shown) may be mounted on the front metal mesh electrode.

The rearmetal mesh electrode 130 is disposed on the rear surface of the transparent substrate corresponding to the front metal mesh electrode, and may be formed in a mesh pattern structure having a predetermined line width l, thickness d, and pitch p.

The conductive via 140 may electrically connect the frontmetal mesh electrode 120 and the rearmetal mesh electrode 130 by penetrating the transparent substrate, preferably, at the shortest distance. As shown, the conductive via 140 may electrically connect the center portion of the front expandedmetal electrode 120 with the center portion of the rear expandedmetal electrode 130. The conductive via 140 may be plural.

The pitch P of the rear metal mesh electrode is the same as the pitch P of the front metal mesh electrode, and the line width L of the rear metal mesh electrode can be smaller than the line width L (L > L) of the front metal mesh electrode. Preferably, the line width L of the rear metal mesh electrode may be 90% or less of the line width L of the front metal mesh electrode. For example, L ═ 30 μm and L ═ 50 μm may be used. Thus, even if misalignment occurs between thepattern 120 of the front expanded metal electrode and thepattern 130 of the rear expanded metal electrode, the influence thereof is significantly reduced, and transparency above a predetermined level can be secured. Also, the recognizability of the rear metal mesh electrode and the Moire (Moire) phenomenon are removed, so that the visibility of the transparent light emitting diode display can be improved.

Therefore, as shown in fig. 2, the transparency can be further improved compared to a display formed symmetrically at the same Pitch (Pitch) and Line width (Line width) on the front and rear surfaces of the transparent substrate. Also, since the wiring width at the rear is narrowed, the total weight of the display panel can be reduced.

In a transparent LED display with metal mesh electrodes according to yet another embodiment, the line width L of themetal mesh electrodes 130 at the back can be substantially less than or equal to L-2 xd × √ 3. V 3 is equal to tan60 (or tan60 degrees). For example, if the line width L of the front expandedmetal electrode 120 is 50 μm and the thickness d of the rear expandedmetal electrode 130 is 9 μm, the rear expandedmetal electrode 130 is etched up and down by 15.5 μm, respectively, and thus may have a line width 1 of 19 μm.

Fig. 5 is a diagram illustrating the rear side of the transparent light emitting diode display in which the visibility is improved by changing the Pitch of the front expanded metal electrodes and the Pitch (Pitch) of the rear expanded metal electrodes according to the embodiment. As shown, the transparent leddisplay panel 100 may include atransparent substrate 110, a frontmetal mesh electrode 120, a rearmetal mesh electrode 130, and a Conductive via (Conductive via) 140.

The transparent light emitting diode display having the metal mesh electrode of an embodiment may include: a Transparent substrate (Transparent substrate); a Front metal mesh electrode (Front metal mesh electrode) formed on the Front surface of the transparent substrate in a mesh pattern structure having a predetermined line width L, thickness D, and pitch P, for providing a path of a signal and power; a Rear metal mesh electrode (real metal mesh electrode) disposed on a Rear surface of the transparent substrate corresponding to the front metal mesh electrode and formed in a mesh pattern structure having a prescribed line width l, thickness d and pitch p; a plurality of Conductive vias (Conductive vias) that electrically connect the front metal mesh electrode and the rear metal mesh electrode by penetrating the transparent substrate; and a plurality of light emitting diode chips (LED chips) mounted on the front metal mesh electrode, a pitch P of the rearmetal mesh electrode 130 is greater than a pitch P of the frontmetal mesh electrode 120, and a line width L of the rear metal mesh electrode is smaller than a line width L of the front metal mesh electrode.

Fig. 5 (a) is a diagram illustrating the transparent leddisplay 100 on the x-y axis, and fig. 5 (b) is a diagram illustrating the electrode pattern arranged on the x-z axis in the a-a' line cross section of fig. 5 (a).

Thetransparent substrate 110 may be a film of Polyethylene terephthalate (PET) composition. Thetransparent substrate 110 may have a prescribed thickness (e.g., 1 mm). The frontmetal mesh electrode 120 is formed on the front surface of the transparent substrate in a mesh pattern structure having a predetermined line width L, thickness D, and pitch P to provide a path for signals and power. For example, the line width L may be 50 μm and the thickness D may be 9 μm. The pads and led chips are mounted on the front metal mesh electrode (not shown) by solder (Soldering) bonding.

The rearmetal mesh electrode 130 is disposed on the rear surface of the transparent substrate corresponding to the frontmetal mesh electrode 120, and may be formed in a mesh pattern structure having a predetermined line width l, thickness d, and pitch p.

The conductive via 140 may electrically connect the frontmetal mesh electrode 120 and the rearmetal mesh electrode 130 by penetrating the transparent substrate, preferably, at the shortest distance. As shown, theconductive vias 140 may electrically connect the center portion of the front metal mesh electrode with the center portion of the rear metal mesh electrode.

The pitch P of the rearmetal mesh electrode 130 is the same as the pitch P of the frontmetal mesh electrode 120, and the line width L of the rear metal mesh electrode may be smaller than the line width L of the front metal mesh electrode (L > L).

In another embodiment of the transparent led display panel with metal mesh electrodes, as in fig. 4, the line width L of the rearmetal mesh electrode 130 may be substantially less than or equal to L-2 xd × √ 3. For example, if the line width L of the front expandedmetal electrode 120 is 50 μm and the thickness d of the rear expandedmetal electrode 130 is 9 μm, the rear expandedmetal electrode 130 is etched up and down by 15.5 μm, respectively, and thus may have a line width L of 19 μm. This is based on trigonometric functions or Pythagorean theorem. Thereby, the recognizability and Moire (Moire) phenomenon of the rearmetal mesh electrode 130 are removed, so that the visibility of the transparent light emittingdiode display 100 can be improved. In addition, the resistance of the metal mesh electrode is reduced, so that a high-performance and high-efficiency transparent light emitting diode display can be realized. As shown, the front expandedmetal electrode 120 may be exposed at an edge region of the rear expandedmetal electrode 130.

In another embodiment of the transparent light emitting diode display having the metal mesh electrodes, the pitch P of the rearmetal mesh electrodes 130 may satisfy an integral multiple of the pitch P of the frontmetal mesh electrodes 120. As shown in fig. 5, P may be 2P, and P may be 3P.

Fig. 6 is a diagram illustrating the rear of a transparent led display with front and rear expanded metal electrodes arranged in an interleaved manner to improve visibility according to one embodiment. As shown, the transparent leddisplay 100 may include atransparent substrate 110, a frontmetal mesh electrode 120, a rearmetal mesh electrode 130, and a Conductive via (Conductive via) 140.

The conductive via 140 may be plural, but need not be provided in all the regions where the front expanded metal electrode overlaps the rear expanded metal electrode.

The rear expandedmetal electrodes 130 are disposed on the rear surface of the transparent substrate so as to be shifted by 1/2 pitches corresponding to the pitches of the front expandedmetal electrodes 120, thereby improving transparency and visibility.

The rearmetal mesh electrode 130 and the frontmetal mesh electrode 120 may have the same line width l, thickness d, and pitch p.

The pads and led chips can be mounted on the front mesh electrode (not shown) by solder (Soldering) bonding.

Claims

1. A transparent LED display with metal mesh electrodes is characterized in that,

the method comprises the following steps:

a transparent substrate;

a front metal mesh electrode formed on the front surface of the transparent substrate in a mesh pattern structure having a predetermined line width (L), thickness (D) and pitch (P) for providing a path for a signal and power;

a rear metal mesh electrode disposed on a rear surface of the transparent substrate corresponding to the front metal mesh electrode and formed in a mesh pattern structure having a predetermined line width (l), thickness (d), and pitch (p);

a plurality of conductive through holes which penetrate through the transparent substrate to electrically connect the front metal mesh electrode and the rear metal mesh electrode; and

a plurality of light emitting diode chips mounted on the front metal mesh electrode,

the distance (P) between the rear metal mesh electrodes is the same as that (P) between the front metal mesh electrodes, and the line width (L) of the rear metal mesh electrodes is smaller than that (L) of the front metal mesh electrodes.

2. The transparent light-emitting diode display defined in claim 1 wherein a plurality of conductive vias electrically connect the central portions of the front and rear metal mesh electrodes.

3. The transparent light-emitting diode display defined in claim 1, wherein the line width (L) of the rear metal mesh electrode is less than or equal to L-2 xd × √ 3.

4. A transparent LED display with metal mesh electrodes is characterized in that,

the method comprises the following steps:

a transparent substrate;

the distance (P) between the rear metal mesh electrodes is larger than the distance (P) between the front metal mesh electrodes, and the line width (L) between the rear metal mesh electrodes is smaller than the line width (L) between the front metal mesh electrodes.

5. The transparent light-emitting diode display defined in claim 4 wherein the pitch (P) of the rear expanded metal electrodes satisfies an integer multiple of the pitch (P) of the front expanded metal electrodes.

6. The transparent light-emitting diode display defined in claim 5 wherein the plurality of conductive vias electrically connect the central portions of the front and rear metal mesh electrodes.

7. The transparent light-emitting diode display defined in claim 4, wherein the line width (L) of the rear metal mesh electrode is less than or equal to L-2 xd × √ 3.

8. A transparent LED display with metal mesh electrodes is characterized in that,

the method comprises the following steps:

a transparent substrate;

a rear metal mesh electrode disposed on the rear surface of the transparent substrate in a staggered manner at an 1/2 pitch corresponding to the pitch of the front metal mesh electrode, and formed in a mesh pattern structure having the same line width (l), the same thickness (d), and the same pitch (p) as the front metal mesh electrode;

and the plurality of light emitting diode chips are arranged on the front metal mesh electrode.