Disclosure of Invention
The invention provides a touch panel and electronic equipment, and aims to solve the problem that a metal grid for shielding interference signals generated by a binding area is easy to break due to width reduction.
A touch panel, comprising: the substrate is provided with a touch area, a first binding area and a second binding area, wherein the first binding area and the second binding area are positioned outside the touch area and are arranged at intervals with the touch area; the first touch layer is arranged on the substrate and extends from the touch area to the first binding area; the second touch layer is arranged on the substrate and extends from the touch area to the second binding area; the first touch layer and the second touch layer are electrically isolated, and a capacitive contact is formed in the touch area to detect touch information of a user; the first conductive grid is arranged on the surface of the substrate, which is away from the second touch layer, and the projection of the first conductive grid on the surface of the substrate, which is used for arranging the second touch layer, is positioned between the touch area and the second binding area; the first conductive grid is electrically isolated from the first touch layer, and the first conductive grid is used for being connected with a driving device so as to receive the driving of the driving device and shield an interference signal generated by the second binding area to the touch area; the first auxiliary lead is arranged on the substrate and is electrically connected with the first conductive grid, at least two first electric connection points are arranged between the first auxiliary lead and the first conductive grid, and the part of the first auxiliary lead between the two first electric connection points is electrically conducted.
When the touch panel is used, when the grid lines between the two first connecting points are broken, the current can pass through the first auxiliary lead, so that the first conductive grid can be prevented from being broken, and the risk of breaking the first conductive grid due to breakage of the grid lines can be reduced through the arrangement of the first auxiliary lead.
Furthermore, in the length direction of the first conductive grid, the first auxiliary lead penetrates through the first conductive grid, and grid lines intersecting with the first auxiliary lines in the first conductive grid are electrically connected with the first auxiliary lines; the length direction of the first conductive grid is perpendicular to the width direction of the first conductive grid, and the width direction of the first conductive grid is from the second binding area to the touch area, so that the anti-disconnection performance of the first conductive grid can be further improved; and/or the line width of the first auxiliary line is 2um-30 um; and/or the first auxiliary line is a straight line, a curve, a wavy line or an irregular line; and/or the number of the first auxiliary lines is more than or equal to 1; and/or the first conductive grid is a metal grid; and/or the material of the first auxiliary line is the same as that of the first conductive grid; and/or the first auxiliary line is integrally formed with the first conductive grid.
Further, the meshes of the first conductive grid are parallelogram and have a first diagonal and a second diagonal, wherein the first diagonal is parallel to the width direction of the first conductive grid, and the second diagonal is parallel to the length direction of the first conductive grid.
Further, the relation between the width D of the first conductive grid and the width D of the meshes of the first conductive grid is that D is less than or equal to 1.5D, wherein the width of the meshes of the first conductive grid refers to the maximum size of the meshes of the first conductive grid in the width direction of the first conductive grid; and/or the meshes of the first conductive grid are rhombic.
Further, the width of the first conductive grid is 1mm-2 mm.
Further, the substrate has a first surface and a second surface which are opposite to each other; the first touch layer, the first conductive mesh, and the first auxiliary lead are all disposed on the first surface, and the second touch layer is disposed on the second surface.
Further, the first touch layer, the first conductive grid and the first auxiliary lines are simultaneously formed on the first surface.
Further, the substrate has a first surface and a second surface which are opposite to each other; the first touch layer, the second touch layer, the first conductive grid and the first auxiliary lead are all arranged on the first surface, wherein the first touch layer is electrically isolated from the second touch layer, and the first conductive layer is electrically isolated from the second touch layer.
Further, the touch panel further includes: the second conductive grid is arranged on the surface, away from the first touch layer, of the substrate, and the projection of the second conductive grid on the surface, used for arranging the first touch layer, of the substrate is located between the touch area and the first binding area; the second conductive grid is electrically isolated from the second touch layer, and the second conductive grid is used for being connected with a driving device so as to receive the driving of the driving device and shield an interference signal generated by the first binding area to the touch area; and the second auxiliary lead is arranged on the substrate and is electrically connected with the second conductive grid, at least two second electric connection points are arranged between the second auxiliary lead and the second conductive grid, and the part of the second auxiliary lead between the two second electric connection points is electrically conducted.
An electronic device comprising the touch panel as described above.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As shown in fig. 1, in the present embodiment, theelectronic device 100 includes adisplay panel 10 and atouch panel 20, wherein thetouch panel 20 is connected to thedisplay panel 10 for performing a corresponding touch operation according to the display content of thedisplay panel 10. Specifically, in the present embodiment, thetouch panel 20 is disposed on thedisplay surface 101 of thedisplay panel 10.
As shown in fig. 2 and fig. 3, in the present embodiment, thetouch panel 20 includes asubstrate 1, afirst touch layer 2, asecond touch layer 3, a firstconductive grid 4, a secondconductive grid 5, a firstauxiliary lead 6, and a secondauxiliary lead 7.
As shown in fig. 2, thesubstrate 1 may be made of COP, PET, or the like, and has afirst surface 11 and asecond surface 12 opposite to each other, thefirst touch layer 2 is disposed on thefirst surface 11, and thesecond touch layer 3 is disposed on thesecond surface 12. In addition, thesubstrate 1 is further divided into atouch area 13 and arouting area 14 located outside thetouch area 13, wherein therouting area 14 further includes afirst bonding area 15 and asecond bonding area 16. In the present embodiment, thefirst touch layer 2 extends from thetouch area 13 to thefirst bonding area 15, and thesecond touch layer 3 extends from thetouch area 13 to thesecond bonding area 16, wherein thefirst touch layer 2 and thesecond touch layer 3 form a capacitive touch point in thetouch area 13 to detect the touch information of the user. In this embodiment, the number of the firstbinding regions 15 is two, the number of the secondbinding regions 16 is 1, and the secondbinding regions 16 are located between the two firstbinding regions 15.
As shown in fig. 2, in the present embodiment, thefirst touch layer 2 includes afirst touch lead 21 and afirst trace 22, and thesecond touch layer 3 includes asecond touch lead 31 and asecond trace 32. Thefirst touch lead 21 and thesecond touch lead 31 are disposed in thetouch area 13, and a capacitive contact is formed between the first touch lead and the second touch lead, and when a user touches the touch area, the capacitive contact generates a corresponding electrical signal. Thefirst trace 22 is disposed in thetrace area 14, and one end of the first trace is electrically connected to thefirst touch lead 21, and the other end of the first trace extends to thefirst bonding area 15 so as to be bonded to thecircuit board 30. Thesecond trace 32 is disposed in thetrace area 14, and one end of the second trace is electrically connected to thesecond touch lead 31, and the other end of the second trace extends to thesecond bonding area 16 so as to be bonded to thecircuit board 30.
In addition, in an actual product, thefirst touch lead 21 and thesecond touch lead 31 may be ITO leads or metal leads, and thefirst trace 22 and thesecond trace 32 are both metal wires.
In the present embodiment, thecircuit board 30 is a flexible circuit board, and as shown in fig. 2, thecircuit board 30 has afirst connection end 301 and asecond connection end 302 arranged at an interval. Thefirst connection end 301 is bound in the firstbinding area 15, so that the pin on thefirst connection end 301 is electrically connected to thefirst trace 22; the second connectingterminal 302 is bonded in thesecond bonding region 16, so that the pin on the second connectingterminal 302 is electrically connected to thesecond trace 32. It is understood that, in other embodiments, the number of thecircuit boards 30 may also be two, and the twocircuit boards 30 are respectively bound to the firstbinding region 15 and the secondbinding region 16.
As shown in fig. 4, in the present embodiment, the firstconductive mesh 4 is disposed on the surface of thesubstrate 1 facing away from thesecond touch layer 3, that is, the firstconductive mesh 4 is disposed on thefirst surface 11. In the present embodiment, the firstconductive mesh 4 is electrically isolated from thefirst touch layer 2, and a projection of the firstconductive mesh 4 on thesecond surface 12 is located between thetouch area 13 and thesecond bonding area 16. The firstconductive grid 4 is used for being connected with a driving device so as to receive the driving of the driving device, and further shielding an interference signal generated by the secondbinding area 16 to thetouch area 13. In the present embodiment, the operation principle of the firstconductive grid 4 is to apply a corresponding voltage to the firstconductive grid 4 by the driving device, so that the firstconductive grid 4 generates a corresponding shielding magnetic field to shield the interference signal generated by the secondbinding region 16.
As shown in fig. 3, in the present embodiment, two ends of the firstconductive grid 4 in the length direction are electrically connected to the correspondingconductive leads 8, respectively, and the conductive leads 8 extend to the firstbinding region 15 and are electrically connected to thecircuit board 30 at the firstbinding region 15, so as to electrically connect the firstconductive grid 4 and thecircuit board 30. Meanwhile, thecircuit board 30 is electrically connected to the driving device to realize the electrical connection between the firstconductive grid 4 and the driving device. In the present embodiment, the width direction of the firstconductive grid 4 is the direction from the secondbinding region 16 to thetouch region 13, and the length direction of the firstconductive grid 4 is perpendicular to the width direction of the firstconductive grid 4. In this embodiment, the driving device may be a controller of theelectronic apparatus 100.
As shown in fig. 5, in the present embodiment, the meshes 41 of the firstconductive mesh 4 are parallelograms, and the firstconductive mesh 4 is a metal mesh, which may be made of copper, silver, or the like. One full mesh 41 has two diagonal lines defined as a firstdiagonal line 42 and a seconddiagonal line 43, wherein the firstdiagonal line 42 is parallel to the width direction of the firstconductive mesh 4, and the seconddiagonal line 43 is parallel to the length direction of the firstconductive mesh 4. The area of the firstconductive grid 4 can be increased on the premise that the size and the number of the meshes 41 are not changed, and then the shielding effect of the firstconductive grid 4 on interference signals is improved.
In actual production, to achieve a narrow bezel design, the width of therouting region 14 is typically reduced, so that the firstconductive mesh 4 is more likely to be broken due to the fracture of the mesh lines 44. In the embodiment, fourgrid lines 44 are arranged around one mesh 41, thegrid unit 4a is in a parallelogram structure, and the first diagonal line and the second diagonal line of the mesh 41 can also be regarded as two diagonals of thegrid unit 4 a.
In order to solve the problem that the firstconductive grid 4 is easily broken, as shown in fig. 3, in the present embodiment, the firstauxiliary lead 6 is disposed on thefirst surface 11 and electrically connected to the firstconductive grid 4, wherein at least two first electrical connection points 61 are disposed between the firstauxiliary lead 6 and the firstconductive grid 4, and a portion of the firstauxiliary lead 6 between the two first electrical connection points 61 is electrically connected. It can be understood that the firstelectrical connection point 61 is an intersection point between the firstauxiliary lead 6 and thegrid lines 44 of the firstconductive grid 4, and when thegrid lines 44 between two first connection points 61 are broken, current can pass through the firstauxiliary lead 6, so that the firstconductive grid 4 can be prevented from being broken, and therefore, the risk of the firstconductive grid 4 being broken due to thebroken grid lines 44 can be reduced by the arrangement of the firstauxiliary lead 6. In addition, in the present embodiment, the firstauxiliary lead 6 is electrically isolated from thefirst touch layer 2, so as to avoid adverse effects on the touch effect of thetouch panel 20.
As shown in fig. 3, in the present embodiment, the firstauxiliary lead 6 penetrates through the firstconductive mesh 4 in the length direction of the firstconductive mesh 4, and meanwhile, themesh lines 44 intersecting with the firstauxiliary lead 6 in the firstconductive mesh 4 are electrically connected to the firstauxiliary lead 6, so that the anti-disconnection performance of the firstconductive mesh 4 can be further improved. In addition, in this embodiment, the line width of the firstauxiliary lead 6 is 2um to 30um, and in actual production, the firstauxiliary lead 6 may be set to be a straight line, a curved line, a wavy line or an irregular line, meanwhile, the number of the first auxiliary leads 6 is 1, 2 or more, and the first auxiliary leads 6 may intersect or may not intersect.
In this embodiment, the firstauxiliary lead 6 and the firstconductive grid 4 may be made of the same material, and they may be integrally formed on thesubstrate 1. In addition, in actual production, the firstconductive grid 4, the firstauxiliary lead 6 and thefirst touch layer 2 may also be formed on thesubstrate 1 at the same time. For example, during production, a corresponding metal layer is disposed on thefirst surface 11, and then the firstconductive grid 4, the firstauxiliary lead 6 and thefirst touch layer 2 are simultaneously prepared through a yellow light process.
In an actual product, for example, taking Wacom G14 IC as an example, in order to realize a narrow frame design of thetouch panel 20, a relationship between a width D of the firstconductive mesh 4 and a width D of the mesh 41 of the firstconductive mesh 4 is usually D ≦ 1.5D, that is, as shown in fig. 3 and 5, at this time, there is only one complete mesh 41 in a width direction of the firstconductive mesh 4, and in a length direction of the firstconductive mesh 4, only oneintersection 45 can be used to electrically connect twoadjacent mesh units 4a, and when theintersection 45 is broken, the firstconductive mesh 4 is broken.
As shown in fig. 3 and 5, in the present embodiment, the firstauxiliary lead 6 is straight and arranged in parallel with the seconddiagonal line 43 of the mesh 41. Meanwhile, the firstauxiliary lead 6 is arranged at an interval with the second diagonal 43, that is, the firstauxiliary lead 6 does not pass through theintersection point 45 of twoadjacent grid cells 4a, so that the anti-disconnection performance of the firstconductive grid 4 can be further improved.
As shown in fig. 2 and 6, in the present embodiment, the secondconductive mesh 5 is disposed on the surface of thesubstrate 1 facing away from thefirst touch layer 2, i.e. the secondconductive mesh 5 is disposed on thesecond surface 12. In the present embodiment, the secondconductive mesh 5 is electrically isolated from thesecond touch layer 3, and a projection of the secondconductive mesh 5 on thefirst surface 11 is located between thetouch area 13 and thefirst bonding area 15. The secondconductive grid 5 is used for being connected with a driving device so as to receive the driving of the driving device, and further shielding an interference signal generated by the first bindingarea 15 to thetouch area 13. In this embodiment, the secondconductive mesh 5 operates on the same principle as the firstconductive mesh 4, and the driving device applies a connected voltage to the secondconductive mesh 5, so that the secondconductive mesh 5 generates a shielding magnetic field to shield the interference signal generated by thefirst bonding region 15.
Similarly, in order to realize a narrow bezel design of thetouch panel 20, the width of the secondconductive grid 5 is also reduced, wherein the width of the secondconductive grid 5 refers to the dimension of the secondconductive grid 5 in the direction from thefirst bonding area 15 to thetouch area 13. For the same reason, the secondconductive mesh 5 also runs the risk of being vulnerable to breakage.
To address this problem, in the present embodiment, the secondauxiliary lead 7 is disposed on thesecond surface 12 of thesubstrate 1 and electrically connected to the secondconductive grid 5, wherein at least two second electrical connection points are disposed between the secondauxiliary lead 7 and the secondconductive grid 5, and a portion of the secondauxiliary lead 7 located between the two second electrical connection points is electrically connected. It can be understood that the second electrical connection point is an intersection point between the secondauxiliary lead 7 and thegrid line 42 of the secondconductive grid 5, and when thegrid line 42 between the two second connection points is broken, current can pass through the secondauxiliary lead 7, so that the secondconductive grid 5 can be prevented from being broken, and the risk of the secondconductive grid 5 being broken due to thebroken grid line 42 can be reduced by the arrangement of the secondauxiliary lead 7. In addition, in the present embodiment, the secondauxiliary lead 7 is electrically isolated from thesecond touch layer 3, so as to avoid adverse effects on the touch effect of thetouch panel 20.
In this embodiment, the principle of shielding the interference signal generated by thefirst bonding region 15 by the secondconductive mesh 5 is the same as the principle of shielding the interference signal generated by thesecond bonding region 16 by the firstconductive mesh 4, while the principle of reducing the risk of breaking the secondconductive mesh 5 by the secondauxiliary lines 7 is the same as the principle of reducing the risk of breaking the firstconductive mesh 4 by the firstauxiliary lines 6. The secondconductive mesh 5, the secondauxiliary lines 7 may be provided in the same manner except that the positions of the secondconductive mesh 4, the firstauxiliary lines 6 are different from those of the firstconductive mesh 5 on thesubstrate 1. Therefore, the detailed arrangement of the secondconductive grid 5 and the secondauxiliary lines 7 is not described herein again.
In the above embodiments, thetouch panel 20 is actually equivalent to a DITO touch panel, and it is understood that in some embodiments, thetouch panel 20 may also be similar to theSITO touch panel 20, for example, as shown in fig. 7, in which thefirst touch layer 2 is disposed on thefirst surface 11 and extends from thetouch area 13 to thefirst bonding area 15; thesecond touch layer 3 is disposed on thefirst surface 11 and extends from thetouch area 13 to the secondbinding area 16. Thefirst touch layer 2 and thesecond touch layer 3 are electrically isolated, and a capacitive contact is formed in thetouch area 13. The crossing of thefirst touch lead 21 and thesecond touch lead 31 is bridged, so as to electrically isolate the two. At this time, the firstconductive mesh 4, the firstauxiliary lead 6, the secondconductive mesh 5, and the secondauxiliary lead 7 are all disposed on thesecond surface 12, wherein the structural arrangement manner of the firstconductive mesh 4, the firstauxiliary lead 6, the secondconductive mesh 5, and the secondauxiliary lead 7 is the same as that of the above-mentioned embodiment, and the description of this embodiment is omitted.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.