CN111554009B - Fingerprint head structure - Google Patents

Abstract

The invention discloses a fingerprint head structure which sequentially comprises a light guide ring with a positioning column, a metal ring, a fingerprint IC (integrated circuit) board, a top layer PCB (printed circuit board) and a bottom layer PCB with a positioning hole from top to bottom, wherein both the light guide ring and the metal ring are provided with edge pressing structures, the lower surface of the fingerprint IC board is in adhesive connection with the upper surface of the top layer PCB, the upper surface of the bottom layer PCB is fixedly connected with the lower surface of the top layer PCB, the light guide ring and the bottom layer PCB are fixedly connected through the positioning column and the positioning hole, threaded holes are uniformly arranged on the light guide ring at intervals, mounting holes corresponding to the threaded holes are arranged on the bottom layer PCB, and the stable light guide ring and the bottom layer PCB which are connected are further fixedly connected through the threaded holes and the mounting holes through screws. The invention uses the top layer PCB with the pad height and the design of the edge pressing type light guide ring, and solves the problem that the tolerance of a connector (BTB) patch in SMT directly influences the deviation of an assembled screw hole, so that the functional adverse effect is caused after the screw is screwed.

Description

Fingerprint head structure

Technical Field

The invention relates to the technical field of intelligent door locks, in particular to the field of fingerprint head structures.

Background

Along with the continuous development of security protection trade, intelligent lock uses also more and more extensively, and the fingerprint lock also receives the attention to, and wherein the fingerprint head is as a most important part in the fingerprint lock, and there is following problem in current fingerprint head structure:

the tolerance of a SMT connector (BTB) patch directly influences the deviation of an assembled screw hole, so that the functionality is poor after the screw is screwed;

2. the glue dispensing area between the PCB and the light guide ring on the top layer is too small, so that the PCB is easy to fall off, and the PCB is forcibly closed after being assembled on a door, so that the falling risk is caused;

3. the PCB at the bottom layer and the light guide ring are not fixed by glue, only are fixed by screws, the screws are easy to loosen, and the PCB is forcibly closed after being assembled on a door, so that the falling risk is caused;

4. the metal ring is fixed by only dispensing, is easy to fall off, and has a falling risk when being forcibly closed after being assembled on a door;

5. the light guide ring and the PCB are not accurately positioned by using a single concave-convex point, so that the positioning is not accurate, the production is difficult, and the production efficiency is influenced;

6. the metal ring is arranged on the front side, the metal ring impedance test point is arranged on the back side, and a special jig is required to be arranged for testing, so that the efficiency is extremely low;

7. the assembly between the PCB of bottom and the leaded light ring needs the manual work to come counterpoint screw hole, seriously influences efficiency.

Disclosure of Invention

In order to solve the technical problems, the invention provides the following technical scheme:

the invention provides a fingerprint head structure, which sequentially comprises a light guide ring, a metal ring, a fingerprint IC plate, a top layer PCB plate and a bottom layer PCB plate from top to bottom, wherein the light guide ring and the metal ring are respectively provided with a blank pressing structure, the blank pressing structure comprises a first convex ring and a second convex ring, the first convex ring is arranged on the upper surface of the light guide ring, the second convex ring is arranged on the upper surface of the metal ring, the inner side of the bottom end of the first convex ring and the outer side of the bottom end of the second convex ring are matched and fixedly connected with the light guide ring and the metal ring through the first convex ring and the second convex ring through a first step and a second step, the inner side of the second convex ring and the upper surface of the metal ring form a third step, the fingerprint IC plate is matched and fixedly connected with the third step, and the lower surface of the fingerprint IC plate is connected with the upper surface of the top layer PCB plate through glue, the upper surface of bottom PCB board and the lower fixed surface of top layer PCB board are connected, it is provided with the reference column along its vertical axis symmetry to lead light ring lower extreme both sides, be provided with the locating hole corresponding with the reference column on the bottom PCB board, lead light ring, bottom PCB board through reference column, locating hole fixed connection, it is provided with the screw hole still to lead even interval on the light ring, be provided with on the bottom PCB board with the corresponding mounting hole of screw hole, for the stability of increase connection lead the light ring with bottom PCB board passes through screw further fixed connection through screw hole, mounting hole, the even interval of bottom PCB board upper surface is provided with the LED lamp.

Preferably, a metal ring test point is reserved on the upper surface of the bottom PCB for testing the impedance of the metal ring, and the upper surface of the bottom PCB and the lower surface of the top PCB are fixedly welded.

Preferably, the lower surface of bottom PCB board is provided with singlechip, components and parts, singlechip, components and parts all electricity connect the lower surface that sets up at bottom PCB board.

Preferably, the metal ring and the light guide ring are both of hollow structures, and the cross sections of the positioning hole, the threaded hole and the mounting hole are all one or more combinations of circular and/or rectangular structures.

Preferably, the surface of the fingerprint IC board is provided with a coating, and the coating is made of paint.

Preferably, the bottom end of the metal ring is provided with a filling rubber groove for avoiding the metal ring from floating.

Preferably, the surfaces of the top layer PCB and the bottom layer PCB are provided with heat conduction layers.

The invention has the beneficial effects

(1) The light guide ring and the bottom PCB are fixedly connected through the positioning column and the positioning hole, and the direction does not need to be distinguished when the light guide ring with the positioning column is assembled with the bottom PCB with the positioning hole, so that the positioning is more accurate and the assembly is easy.

(2) The top layer PCB board adopts a convex structure, and the top layer PCB adopts a convex design, so that the bottom filling of the fingerprint IC board with surface points can be realized, and the light transmission of the LED lamp can be maximized, so that the light is transmitted through the light guide ring without a shadow part, the tolerance of SMT (surface mount technology) chip mounting of the board-to-board connector is solved, and the problem of poor functionality after the screw is screwed due to deviation of a screw hole in subsequent assembly is finally solved.

(3) The edge pressing type design of the light guide ring can press the metal ring, the reliability of the whole internal structure is reinforced, the metal ring can press a fingerprint IC board by adopting the edge pressing type structural design, the reliability of the whole internal structure is further reinforced, the edge pressing type design of the metal ring can be matched with the edge pressing type design of the light guide ring, and meanwhile, the consistent angles of highlight inclined planes between the light guide ring and the metal ring are realized and are on the same horizontal line, and the hand scraping phenomenon is avoided.

(4) According to the invention, the heat conduction layers are arranged on the surfaces of the top layer PCB and the bottom layer PCB, the heat conduction layers are the heat conduction polyester coating layers, the heat conduction layers can improve the heat dissipation performance of the top layer PCB and the bottom layer PCB, the heat conduction layers can play a role of auxiliary heat dissipation when the top layer PCB and the bottom layer PCB work, the circuit board is prevented from overheating, the fault rate of the circuit board is reduced, and the safety performance of the circuit board in use is improved at the same time, the heat conduction polyester coating layers are formed by uniformly coating the heat conduction polyester coating, the heat conduction polyurethane has very excellent adhesive force, heat conductivity and curing performance, the heat conduction coefficient reaches 2.2W/(m.K), and the heat conduction polyurethane is the heat conduction coating with very excellent performance known at present and can play a very good heat conduction effect.

Drawings

Fig. 1 is a perspective exploded front view of the present invention.

Fig. 2 is a perspective exploded bottom view of the present invention.

Fig. 3 is an exploded front view of the structure of the present invention.

FIG. 4 is a front view of the edge pressing structure of the light guiding ring and the metal ring of the present invention.

Description of reference numerals: 1-light guide ring, 11-first convex ring, 12-second convex ring, 13-first step, 14-second step, 15-third step, 2-metal ring, 3-fingerprint IC board, 4-top layer PCB board, 5-bottom layer PCB board, 6-metal ring test point, 7-positioning column, 8-positioning hole, 9-threaded hole and 10-screw.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

As shown in fig. 1-4, the present invention provides a fingerprint head structure, which sequentially comprises alight guide ring 1, ametal ring 2, afingerprint IC board 3, a toplayer PCB board 4, and a bottomlayer PCB board 5 from top to bottom, wherein themetal ring 2 and thelight guide ring 1 are both hollow structures, thelight guide ring 1 and themetal ring 2 are both provided with a blank holder type structure, the blank holder type structure comprises afirst convex ring 11 and asecond convex ring 12, thefirst convex ring 11 is arranged on the upper surface of thelight guide ring 1, thesecond convex ring 12 is arranged on the upper surface of themetal ring 2, the inner side of the bottom end of thefirst convex ring 11, the outer side of the bottom end of thesecond convex ring 12, thelight guide ring 1 and themetal ring 2 form afirst step 13 and asecond step 14, themetal ring 2 and thelight guide ring 1 are fixedly connected by thefirst convex ring 11 and thesecond convex ring 12 through thefirst step 13 and thesecond step 14 in a matching manner, so as to prevent themetal ring 2 from being higher than the bottom end of themetal ring 2 is provided with a filling groove, the inner side of thesecond convex ring 12 and the upper surface of themetal ring 2 form athird step 15, thefingerprint IC board 3 is matched and fixedly connected with thethird step 15, the surface of thefingerprint IC board 3 is provided with a coating, the coating is made of paint, themetal ring 2 can be pressed by the edge pressing type design of thelight guide ring 1, the reliability of the whole internal structure is reinforced, thefingerprint IC board 3 can be pressed by themetal ring 2 by adopting the edge pressing type structural design, the reliability of the whole internal structure is further reinforced, the edge pressing type design of themetal ring 2 can be matched with the edge pressing type design of thelight guide ring 1, and meanwhile, the consistent angles of highlight slopes between thelight guide ring 1 and themetal ring 2 and the same horizontal line are realized, and the phenomenon of scratching is avoided; thetop layer PCB 4 is of a convex structure, and the top layer PCB adopts a convex design, so that on one hand, the bottom filling of the surface pointfingerprint IC board 3 can be realized, and on the other hand, the light transmission of the LED lamp can be maximized, so that the lighttransmission light ring 1 has no shadow part, and the tolerance of a board-to-board connector SMT paster is solved, and finally, the problem of poor functionality after the screw is screwed due to the deviation of a subsequent assembly screw hole is solved;

the lower surface of thefingerprint IC board 3 is in adhesive bonding connection with the upper surface of the toplayer PCB board 4, the upper surface of the bottomlayer PCB board 5 is fixedly connected with the lower surface of the toplayer PCB board 4, the upper surface of the bottomlayer PCB board 5 is fixedly welded with the lower surface of the toplayer PCB board 4, positioning columns 7 are symmetrically arranged on two sides of the lower end of thelight guide ring 1 along the vertical axis of the light guide ring, positioningholes 8 corresponding to the positioning columns 7 are formed in the bottomlayer PCB board 5, thelight guide ring 1 and the bottomlayer PCB board 5 are fixedly connected through the positioning columns 7 and thepositioning holes 8, the direction does not need to be distinguished when thelight guide ring 1 with the positioning columns 7 is assembled with the bottomlayer PCB board 5 with thepositioning holes 8, and the positioning is more accurate and easy to assemble; threaded holes 9 are further uniformly arranged on thelight guide ring 1 at intervals, mounting holes corresponding to the threaded holes 9 are formed in thebottom layer PCB 5, thelight guide ring 1 and thebottom layer PCB 5 are further fixedly connected through the threaded holes 9 and the mounting holes by screws in order to increase the connection stability, LED lamps are uniformly arranged on the upper surface of thebottom layer PCB 5 at intervals, and the cross sections of thepositioning holes 8, the threaded holes 9 and the mounting holes are all of circular structures; the lower surface ofbottom PCB board 5 is provided with singlechip, components and parts, singlechip, components and parts all electricity connect the lower surface that sets up atbottom PCB board 5, for surveying the impedance ofbecket 2 thebecket test point 6 has been reserved tobottom PCB board 5 upper surface, can openly test the impedance betweenbecket 2 andbottom PCB board 5 afterbecket test point 6 has been reserved tobottom PCB board 5, has solved "becket 2 is openly, and becket impedance test point is but the back, and the test needs to open special tool and efficiency extremely low.

Example 2

As shown in fig. 1 to 4, the present embodiment is further optimized based onembodiment 1, specifically, the surfaces of thetop PCB 4 and thebottom PCB 5 are both provided with heat conducting layers.

This embodiment is provided with the heat-conducting layer through the surface at toplayer PCB board 4,bottom PCB board 5, the heat-conducting layer is heat conduction polyester dope layer, the heat-conducting layer can improve toplayer PCB board 4,bottom PCB board 5's heat dispersion, at toplayer PCB board 4,bottom PCB board 5 during operation, can play supplementary radiating function, avoid the circuit board overheat phenomenon to appear, the fault rate of circuit board has been reduced, the security performance of circuit board when using has been improved simultaneously, heat polyester dope layer is formed by the even coating of heat conduction polyester dope, heat conduction polyurethane has very excellent adhesive force, heat conductivity and curing properties, coefficient of heat conductivity reaches 2.2W/(m.K), be the heat conduction dope that the performance known at present is very excellent, can play very good heat conduction effect.

Principle of operation

The invention provides a fingerprint head structure, each part is distributed as shown in figures 1-4, when in use, ametal ring 2 and alight guide ring 1 are fixedly connected through afirst convex ring 11 and asecond convex ring 12 by matching with afirst step 13 and asecond step 14 through gluing, afingerprint IC plate 3 is fixedly connected with athird step 15 by matching with gluing, themetal ring 2 can be pressed by the edge pressing type design of thelight guide ring 1, the reliability of the whole internal structure is strengthened, thefingerprint IC plate 3 can be pressed by themetal ring 2 by adopting the edge pressing type structural design, the reliability of the whole internal structure is further strengthened, the edge pressing type design of themetal ring 2 can be matched with the edge pressing type design of thelight guide ring 1, and the consistent angles of high light inclined planes between thelight guide ring 1 and themetal ring 2 and on the same horizontal line are realized at the same time, and no hand scraping phenomenon exists; the lower surface of thefingerprint IC board 3 is adhered to the upper surface of thetop PCB 4, the upper surface of thebottom PCB 5 is fixedly welded to the lower surface of thetop PCB 4, thetop PCB 4 and thebottom PCB 5 are directly subjected to SMT welding, a board-to-board connector is omitted, the operation process is simplified, and the production efficiency of an enterprise is improved; thelight guide ring 1 and thebottom layer PCB 5 are fixedly connected through the positioning column 7 and thepositioning hole 8, and the direction does not need to be distinguished when thelight guide ring 1 with the positioning column 7 is assembled with thebottom layer PCB 5 with thepositioning hole 8, so that the positioning is more accurate and the assembly is easy; after the assembly is completed, the single chip machine and the components are electrically connected to thebottom PCB 5.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims (7)

1. The utility model provides a fingerprint head structure, its characterized in that includes from last to down in proper order and leads light ring (1), becket (2), fingerprint IC board (3), top layer PCB board (4), bottom PCB board (5), it all is provided with blank pressing formula structure on leading light ring (1), becket (2), blank pressing formula structure includes first bulge loop (11), second bulge loop (12), first bulge loop (11) set up at lead light ring (1) upper surface, second bulge loop (12) set up at becket (2) upper surface, first bulge loop (11) bottom inboard, second bulge loop (12) bottom outside with lead light ring (1), becket (2) and form first ladder (13), second ladder (14), becket (2) with lead light ring (1) through first ladder (13), second bulge loop (12), The second ladder (14) is matched and fixedly connected, the inner side of the second convex ring (12) and the upper surface of the metal ring (2) form a third ladder (15), the fingerprint IC board (3) and the third ladder (15) are matched and fixedly connected, the lower surface of the fingerprint IC board (3) is in adhesive bonding connection with the upper surface of the top layer PCB board (4), the top layer PCB board (4) adopts a convex structure, the upper surface of the bottom layer PCB board (5) is fixedly connected with the lower surface of the top layer PCB board (4), positioning columns (7) are symmetrically arranged on the two sides of the lower end of the light guide ring (1) along the vertical axis of the light guide ring, positioning holes (8) corresponding to the positioning columns (7) are arranged on the bottom layer PCB board (5), the light guide ring (1) and the bottom layer PCB board (5) are fixedly connected through the positioning columns (7) and the positioning holes (8), and threaded holes (9) are further uniformly arranged on the light guide ring (1) at intervals, the LED lamp is characterized in that mounting holes corresponding to the threaded holes (9) are formed in the bottom PCB (5), the light guide rings (1) are fixedly connected with the bottom PCB (5) through the threaded holes (9) and the mounting holes through screws, and the LED lamps are arranged on the upper surface of the bottom PCB (5) at uniform intervals.

2. The fingerprint head structure of claim 1, characterized in that, a metal ring test point (6) is reserved on the upper surface of the bottom PCB (5) for measuring the impedance of the metal ring (2), and the upper surface of the bottom PCB (5) and the lower surface of the top PCB (4) are fixedly welded.

3. The fingerprint head structure of claim 1, wherein the lower surface of the bottom layer PCB (5) is provided with a single chip microcomputer and a component, and the single chip microcomputer and the component are both electrically connected to the lower surface of the bottom layer PCB (5).

4. The fingerprint head structure of claim 1, wherein the metal ring (2) and the light guide ring (1) are both hollow structures, and the cross sections of the positioning hole (8), the threaded hole (9) and the mounting hole are all one or more combinations of circular and/or rectangular structures.

5. The fingerprint head structure of any one of claims 1-4, characterized in that the surface of the fingerprint IC board (3) is provided with a coating layer, and the coating layer is made of paint.

6. The fingerprint head structure of claim 5, wherein the bottom end of the metal ring (2) is provided with a filling rubber groove for preventing the metal ring (2) from floating.

7. The fingerprint head structure of claim 6, wherein the top PCB (4) and the bottom PCB (5) are provided with heat conducting layers on their surfaces.

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