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CN111509088B - Preparation method of thin film battery and thin film battery - Google Patents

Preparation method of thin film battery and thin film battery
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CN111509088B
CN111509088BCN202010315721.7ACN202010315721ACN111509088BCN 111509088 BCN111509088 BCN 111509088BCN 202010315721 ACN202010315721 ACN 202010315721ACN 111509088 BCN111509088 BCN 111509088B
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刘卓
陆鹏
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Suzhou Teng Teng Intellectual Property Advisory Co ltd
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Anhui Huateng Agricultural Technology Co ltd
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Abstract

Translated fromChinese

公开了一种薄膜电池的制备方法及薄膜电池,方法包括干式蚀刻硅晶片形成多个微电池图案阵列,局部化硼掺杂和磷掺杂所述微电池图案阵列,转移层无间隙接触所述微电池阵列以从硅晶片分离所述微电池阵列,转移层将微电池阵列转移到聚酰胺层,然后剥离所述转移层,在聚酰胺层上喷墨印刷高度与微电池高度一致的导电层使得所述导电层邻接所述微电池阵列且形成电互联,层压形成柔性背板,在导电层上以微电池为中心套准印刷预定间距和预定高度的支承层,在微电池和两侧的支承层上间隙涂布透明的硅树脂粘合剂,球形透镜经由所述硅树脂粘合剂相对于微电池对准固定,涂布甲基丙烯酸甲酯层以覆盖所述球形透镜、支承层和导电层。

Figure 202010315721

A method for preparing a thin film battery and a thin film battery are disclosed. The method includes dry etching a silicon wafer to form a plurality of microbattery pattern arrays, localizing boron doping and phosphorus doping on the microbattery pattern arrays, and a transfer layer contacts all the microbattery patterns without gaps. The microbattery array is separated from the silicon wafer, the transfer layer transfers the microbattery array to the polyamide layer, the transfer layer is then peeled off, and the polyamide layer is inkjet printed with a conductive height consistent with the height of the microbattery. layer so that the conductive layer is adjacent to the micro-battery array and form electrical interconnection, lamination to form a flexible backplane, a supporting layer with a predetermined spacing and a predetermined height is printed on the conductive layer with the micro-battery as the center, and the micro-battery and the two A transparent silicone adhesive is applied to the gap on the supporting layer on the side, the spherical lens is aligned and fixed relative to the microbattery through the silicone adhesive, and a methyl methacrylate layer is applied to cover the spherical lens, the supporting layer layer and conductive layer.

Figure 202010315721

Description

Translated fromChinese
薄膜电池的制备方法及薄膜电池Preparation method of thin film battery and thin film battery

技术领域technical field

本发明涉及薄膜电池设备技术领域,特别是一种薄膜电池的制备方法及薄膜电池。The invention relates to the technical field of thin-film battery equipment, in particular to a preparation method of a thin-film battery and a thin-film battery.

背景技术Background technique

本申请是申请号201811361755.9,发明名称为薄膜电池的制备方法及薄膜电池的分案申请,其母案公开的内容全部引入。This application is the application number 201811361755.9, the title of the invention is the preparation method of thin-film battery and the divisional application of thin-film battery, and the contents disclosed in the parent case are all incorporated.

传统晶体硅太阳电池由硅组成,电池主要部分易碎,易产生隐形裂纹,大多有一层钢化玻璃作为防护,造成重量大,携带不便,抗震能力差,造价高,效率或多或少降低,薄膜电池克服了上述缺点,其主要优点在于质量小、厚度极薄、可弯曲。Traditional crystalline silicon solar cells are composed of silicon. The main part of the cell is fragile and prone to invisible cracks. Most of them have a layer of tempered glass as protection, which results in heavy weight, inconvenience to carry, poor shock resistance, high cost, more or less reduced efficiency, and thin film. The battery overcomes the above disadvantages, and its main advantages are small mass, extremely thin thickness, and flexibility.

现有技术中,薄膜阳电池的光电转化效率并没有传统晶体硅电池转化效率高,其光致衰减性大,薄膜材料的生长机制决定薄膜太阳电池易潮解,因此,提高转化效率,避免光致衰减以及潮解存在着强烈的发展需求。In the prior art, the photoelectric conversion efficiency of thin-film solar cells is not as high as that of traditional crystalline silicon cells, and its photo-induced attenuation is large. The growth mechanism of thin-film materials determines that thin-film solar cells are prone to deliquescence. Attenuation and deliquescence have strong development needs.

在背景技术部分中公开的上述信息仅仅用于增强对本发明背景的理解,因此可能包含不构成在本国中本领域普通技术人员公知的现有技术的信息。The above information disclosed in this Background section is only for enhancement of understanding of the background of the invention and therefore it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art.

发明内容SUMMARY OF THE INVENTION

鉴于上述问题,本发明提供一种薄膜电池的制备方法及薄膜电池,本发明的制备方法能够提高制备效率且降低材料成本,能够避免转移过程中的变形导致的精度误差,避免了薄膜电池的性能退化,显著提高了光和微电池的对准精度,能够最优化地将太阳光聚集在微电池上,避免光致衰减,提高了总体转化效率。本发明制备方法加工的薄膜电池的性能和精度得到了显著提升且降低了加工成本。In view of the above problems, the present invention provides a preparation method of a thin film battery and a thin film battery. The preparation method of the present invention can improve the preparation efficiency and reduce the material cost, can avoid the precision error caused by the deformation during the transfer process, and avoid the performance of the thin film battery. Degradation, which significantly improves the alignment accuracy of the light and the microbattery, can optimally concentrate sunlight on the microbattery, avoid light-induced attenuation, and improve the overall conversion efficiency. The performance and precision of the thin film battery processed by the preparation method of the present invention are significantly improved and the processing cost is reduced.

本发明的目的是通过以下技术方案予以实现。The purpose of the present invention is to be achieved through the following technical solutions.

一种薄膜电池的制备方法包括如下步骤:A preparation method of a thin film battery comprises the following steps:

干式蚀刻硅晶片形成多个微电池图案阵列,局部化硼掺杂和磷掺杂所述微电池图案阵列,光刻所述硅晶片以形成多个预定长度和宽度的微电池阵列,钝化微电池侧壁以及各向异性蚀刻微电池侧壁和底部使得微电池的厚度小于预定厚度,dry etching a silicon wafer to form a plurality of microbattery pattern arrays, localized boron doping and phosphorous doping of the microbattery pattern arrays, photolithography of the silicon wafer to form a plurality of microbattery arrays of predetermined length and width, passivation the sidewalls of the microbattery and the anisotropic etching of the sidewalls and bottom of the microbattery so that the thickness of the microbattery is less than a predetermined thickness,

转移层无间隙接触所述微电池阵列以从硅晶片分离所述微电池阵列,转移层将微电池阵列转移到聚酰胺层,然后剥离所述转移层,其中,所述转移层包括接触所述微电池阵列的聚二甲基硅氧烷膜和玻璃纤维膜,所述聚酰胺层经由含有银颗粒的粘合层固定所述微电池阵列,微电池直接集成聚酰胺层的预先设置的凹槽中,the transfer layer contacts the microbattery array without gaps to separate the microbattery array from the silicon wafer, the transfer layer transfers the microbattery array to the polyamide layer, and then peels the transfer layer, wherein the transfer layer includes contacting the microbattery array Polydimethylsiloxane film and glass fiber film of a microbattery array, the polyamide layer fixes the microbattery array via an adhesive layer containing silver particles, the microbattery is directly integrated into the pre-set grooves of the polyamide layer middle,

在聚酰胺层上喷墨印刷高度与微电池高度一致的导电层使得所述导电层邻接所述微电池阵列且形成电互联,层压形成柔性背板,丝网印刷金属线于柔性背板上,然后在柔性背板上沉积图案化电介质层,聚酰胺层设置在在所述柔性背板上,微电池和导电层形成具有一个具备平坦的几何形态的暴露表面的表面结构,The conductive layer with the same height as the microbattery is inkjet printed on the polyamide layer so that the conductive layer is adjacent to the microbattery array and forms an electrical interconnection, laminated to form a flexible backplane, and screen-printed metal lines on the flexible backplane , a patterned dielectric layer is then deposited on the flexible backplane, the polyamide layer is disposed on the flexible backplane, the microbattery and the conductive layer form a surface structure with an exposed surface having a flat geometry,

在导电层上以微电池为中心套准印刷预定间距和预定高度的支承层,在微电池和两侧的支承层上间隙涂布透明的硅树脂粘合剂,球形透镜经由所述硅树脂粘合剂相对于微电池对准固定,涂布甲基丙烯酸甲酯层以覆盖所述球形透镜、支承层和导电层。On the conductive layer, a supporting layer with a predetermined pitch and a predetermined height is printed in register with the micro-battery as the center, and a transparent silicone resin adhesive is applied between the micro-battery and the supporting layers on both sides, and the spherical lens is glued through the silicone resin. The mixture is aligned and fixed relative to the microbattery, and a methyl methacrylate layer is applied to cover the spherical lens, the support layer and the conductive layer.

在所述的方法中,经由粘合层将柔性背板真空层压到壳体的刚性下表面,在壳体的刚性上表面模制与所述球形透镜对准的微透镜阵列,使得微透镜阵列、球形透镜和微电池阵列相互对准。In the method described, a flexible backsheet is vacuum laminated to a rigid lower surface of a housing via an adhesive layer, and a microlens array aligned with the spherical lenses is molded on the rigid upper surface of the housing such that the microlenses are The array, spherical lens, and microbattery array are aligned with each other.

在所述的方法中,所述预定厚度为6-8微米,所述预定间距为微电池的宽度的1-2倍,所述预定高度与所述球形透镜的焦距正相关。In the method, the predetermined thickness is 6-8 microns, the predetermined spacing is 1-2 times the width of the micro-battery, and the predetermined height is positively related to the focal length of the spherical lens.

在所述的方法中,刚性下表面设有与柔性背板导电连接的连接端子和用于散热的散热单元。In the method, the rigid lower surface is provided with connection terminals conductively connected with the flexible backplane and a heat dissipation unit for heat dissipation.

在所述的方法中,导电层和微电池阵列部分层叠。In the described method, the conductive layer and the microbattery array are partially laminated.

在所述的方法中,微透镜阵列、球形透镜和微电池阵列之间的间隔使得太阳光穿透微透镜阵列分别聚焦在对应的球形透镜上,来自球形透镜的太阳光分别聚焦在对应的微电池上。In the described method, the spacing between the microlens array, the spherical lens and the microbattery array is such that sunlight penetrates through the microlens array and is focused on the corresponding spherical lenses, respectively, and sunlight from the spherical lenses is focused on the corresponding microlens, respectively. on the battery.

在所述的方法中,导电层电连接所述柔性背板,导电层包括多个导电电极,导电电极连接微电池以形成互联导电网络。In the method, a conductive layer is electrically connected to the flexible backplane, the conductive layer includes a plurality of conductive electrodes, and the conductive electrodes are connected to the microbatteries to form an interconnected conductive network.

在所述的方法中,在第一和第二覆铜层压件之间热辊层压印刷布线板形成柔性背板。In the described method, a printed wiring board is heat roll laminated between first and second copper clad laminates to form a flexible backplane.

在所述的方法中,所述微透镜阵列为柱状微透镜阵列。In the method, the microlens array is a cylindrical microlens array.

根据本发明的另一方面,一种薄膜电池通过所述的方法制备。According to another aspect of the present invention, a thin film battery is prepared by the method.

本发明的有益效果The beneficial effects of the present invention

本发明制备方法中,光刻所述硅晶片以形成多个预定长度和宽度的微电池阵列,钝化微电池侧壁以及各向异性蚀刻微电池侧壁和底部使得微电池的厚度小于预定厚度能够提高微电池尺寸精度且不降低微电池的光电转换效率,转移层无间隙接触所述微电池阵列以从硅晶片分离所述微电池阵列,转移层将微电池阵列转移到聚酰胺层,然后剥离所述转移层,通过转印实现了高效率制备且低材料成本形成微电池阵列,避免了现有技术中容易破裂的风险,接触所述微电池阵列的聚二甲基硅氧烷膜能够以高保真度转印和玻璃纤维膜能够避免转移过程中的变形导致的精度误差,在聚酰胺层上喷墨印刷高度与微电池高度一致的导电层使得所述导电层邻接所述微电池阵列且形成电互联,高度一致避免了薄膜电池的性能退化,在导电层上以微电池为中心套准印刷预定间距和预定高度的支承层,在微电池和两侧的支承层上间隙涂布透明的硅树脂粘合剂,球形透镜经由所述硅树脂粘合剂相对于微电池对准固定,这显著提高了太阳光和微电池的对准精度,能够最优化地将太阳光聚集在微电池上,避免光致衰减,提高了总体转化效率。本发明制备方法加工的薄膜电池的性能和精度得到了显著提升且降低了加工成本。In the preparation method of the present invention, the silicon wafer is photoetched to form a plurality of microbattery arrays of predetermined length and width, the sidewalls of the microbattery are passivated, and the sidewalls and bottom of the microbattery are anisotropically etched so that the thickness of the microbattery is less than the predetermined thickness The dimensional accuracy of the microbattery can be improved without reducing the photoelectric conversion efficiency of the microbattery, the transfer layer contacts the microbattery array without gaps to separate the microbattery array from the silicon wafer, the transfer layer transfers the microbattery array to the polyamide layer, and then By peeling off the transfer layer, high-efficiency preparation and low material cost are achieved by transfer printing to form a micro-battery array, which avoids the risk of easy rupture in the prior art, and the polydimethylsiloxane film contacting the micro-battery array can be Transfer with high fidelity and glass fiber film to avoid precision errors caused by deformation during transfer, inkjet printing a conductive layer on the polyamide layer with a height consistent with the height of the microbattery so that the conductive layer is adjacent to the microbattery array And form an electrical interconnection, the height is consistent to avoid the performance degradation of the thin-film battery, on the conductive layer, the micro-battery as the center is registered to print the supporting layer with a predetermined spacing and a predetermined height, and the micro-battery and the supporting layers on both sides are coated with transparent The silicone adhesive, the spherical lens is aligned and fixed relative to the microcell via the silicone adhesive, which significantly improves the alignment accuracy of the sunlight and the microcell, and can optimally concentrate the sunlight on the microcell On the other hand, light-induced attenuation is avoided, and the overall conversion efficiency is improved. The performance and precision of the thin film battery processed by the preparation method of the present invention are significantly improved and the processing cost is reduced.

上述说明仅是本发明技术方案的概述,为了能够使得本发明的技术手段更加清楚明白,达到本领域技术人员可依照说明书的内容予以实施的程度,并且为了能够让本发明的上述和其它目的、特征和优点能够更明显易懂,下面以本发明的具体实施方式进行举例说明。The above description is only an overview of the technical solution of the present invention, in order to make the technical means of the present invention clearer, to the extent that those skilled in the art can implement it according to the content of the description, and in order to make the above and other purposes of the present invention, The features and advantages can be more clearly understood, and are exemplified by specific embodiments of the present invention below.

附图说明Description of drawings

通过阅读下文优选的具体实施方式中的详细描述,本发明各种其他的优点和益处对于本领域普通技术人员将变得清楚明了。说明书附图仅用于示出优选实施方式的目的,而并不认为是对本发明的限制。显而易见地,下面描述的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。而且在整个附图中,用相同的附图标记表示相同的部件。Various other advantages and benefits of the present invention will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings in the description are for the purpose of illustrating the preferred embodiments only, and are not to be considered as limiting the present invention. Obviously, the drawings described below are only some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort. Also, the same components are denoted by the same reference numerals throughout the drawings.

在附图中:In the attached image:

图1是根据本发明一个实施例的薄膜电池的制备方法的步骤示意图。FIG. 1 is a schematic diagram of steps of a method for preparing a thin film battery according to an embodiment of the present invention.

图2是根据本发明一个实施例的薄膜电池的制备方法制备的薄膜电池的部分单元示意图。FIG. 2 is a partial unit schematic diagram of a thin-film battery prepared by a method for preparing a thin-film battery according to an embodiment of the present invention.

以下结合附图和实施例对本发明作进一步的解释。The present invention will be further explained below in conjunction with the accompanying drawings and embodiments.

具体实施方式Detailed ways

下面将参照附图更详细地描述本发明的具体实施例。虽然附图中显示了本发明的具体实施例,然而应当理解,可以以各种形式实现本发明而不应被这里阐述的实施例所限制。相反,提供这些实施例是为了能够更透彻地理解本发明,并且能够将本发明的范围完整的传达给本领域的技术人员。Specific embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While specific embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be more thoroughly understood, and will fully convey the scope of the present invention to those skilled in the art.

需要说明的是,在说明书及权利要求当中使用了某些词汇来指称特定组件。本领域技术人员应可以理解,技术人员可能会用不同名词来称呼同一个组件。本说明书及权利要求并不以名词的差异来作为区分组件的方式,而是以组件在功能上的差异来作为区分的准则。如在通篇说明书及权利要求当中所提及的“包含”或“包括”为一开放式用语,故应解释成“包含但不限定于”。说明书后续描述为实施本发明的较佳实施方式,然所述描述乃以说明书的一般原则为目的,并非用以限定本发明的范围。本发明的保护范围当视所附权利要求所界定者为准。It should be noted that certain terms are used in the description and claims to refer to specific components. It should be understood by those skilled in the art that the same component may be referred to by different nouns. The description and the claims do not use the difference in terms as a way to distinguish components, but use the difference in function of the components as a criterion for distinguishing. As referred to throughout the specification and claims, "comprising" or "including" is an open-ended term and should be interpreted as "including but not limited to". Subsequent descriptions in the specification are preferred embodiments for implementing the present invention, however, the descriptions are for the purpose of general principles of the specification and are not intended to limit the scope of the present invention. The scope of protection of the present invention should be determined by the appended claims.

为便于对本发明实施例的理解,下面将结合附图以具体实施例为例做进一步的解释说明,且各个附图并不构成对本发明实施例的限定。To facilitate the understanding of the embodiments of the present invention, the following will take specific embodiments as examples for further explanation and description in conjunction with the accompanying drawings, and each accompanying drawing does not constitute a limitation to the embodiments of the present invention.

为了更好地理解,图1为根据本发明一个实施例的薄膜电池的制备方法的步骤示意图,如图1所示,一种薄膜电池的制备方法包括如下步骤:For better understanding, FIG. 1 is a schematic diagram of the steps of a method for preparing a thin-film battery according to an embodiment of the present invention. As shown in FIG. 1 , a method for preparing a thin-film battery includes the following steps:

一种薄膜电池的制备方法包括如下步骤:A preparation method of a thin film battery comprises the following steps:

干式蚀刻硅晶片形成多个微电池图案阵列,局部化硼掺杂和磷掺杂所述微电池图案阵列,光刻所述硅晶片以形成多个预定长度和宽度的微电池阵列1,钝化微电池侧壁以及各向异性蚀刻微电池侧壁和底部使得微电池的厚度小于预定厚度,Dry etching a silicon wafer to form a plurality of microbattery pattern arrays, localized boron doping and phosphorus doping of the microbattery pattern arrays, photolithography of the silicon wafer to form a plurality of microbattery arrays 1 of predetermined length and width, passivation etching the sidewalls of the microbattery and anisotropically etching the sidewalls and bottom of the microbattery so that the thickness of the microbattery is less than a predetermined thickness,

转移层无间隙接触所述微电池阵列1以从硅晶片分离所述微电池阵列1,转移层将微电池阵列1转移到聚酰胺层2,然后剥离所述转移层,其中,所述转移层包括接触所述微电池阵列1的聚二甲基硅氧烷膜和玻璃纤维膜,所述聚酰胺层2经由含有银颗粒的粘合层固定所述微电池阵列1,微电池直接集成聚酰胺层2的预先设置的凹槽中,The transfer layer contacts the microbattery array 1 without gaps to separate the microbattery array 1 from the silicon wafer, the transfer layer transfers the microbattery array 1 to the polyamide layer 2, and then peels the transfer layer, wherein the transfer layer Including a polydimethylsiloxane film and a glass fiber film in contact with the microbattery array 1, the polyamide layer 2 fixes the microbattery array 1 via an adhesive layer containing silver particles, and the microbattery is directly integrated with polyamide The pre-set grooves of layer 2,

在聚酰胺层2上喷墨印刷高度与微电池高度一致的导电层3使得所述导电层3邻接所述微电池阵列1且形成电互联,层压形成柔性背板4,丝网印刷金属线于柔性背板4上,然后在柔性背板4上沉积图案化电介质层,聚酰胺层2设置在在所述柔性背板4上,微电池和导电层3形成具有一个具备平坦的几何形态的暴露表面的表面结构,On the polyamide layer 2, a conductive layer 3 whose height is consistent with the height of the micro-battery is ink-jet printed so that the conductive layer 3 is adjacent to the micro-battery array 1 and forms an electrical interconnection, laminated to form a flexible backplane 4, and screen-printed metal wires On the flexible backsheet 4, and then deposit a patterned dielectric layer on the flexible backsheet 4, the polyamide layer 2 is arranged on the flexible backsheet 4, the microbattery and the conductive layer 3 are formed to have a flat geometry. surface structure of exposed surfaces,

在导电层3上以微电池为中心套准印刷预定间距和预定高度的支承层5,在微电池和两侧的支承层5上间隙涂布透明的硅树脂粘合剂,球形透镜6经由所述硅树脂粘合剂相对于微电池对准固定,涂布甲基丙烯酸甲酯层以覆盖所述球形透镜6、支承层5和导电层3。参见图2。On the conductive layer 3, a supporting layer 5 with a predetermined pitch and a predetermined height is printed in register with the micro-battery as the center, and a transparent silicone resin adhesive is applied between the micro-battery and the supporting layers 5 on both sides. The silicone adhesive is aligned and fixed relative to the microbattery, and a methyl methacrylate layer is applied to cover the spherical lens 6 , the support layer 5 and the conductive layer 3 . See Figure 2.

在所述的方法中,经由粘合层将柔性背板4真空层压到壳体的刚性下表面,在壳体的刚性上表面模制与所述球形透镜6对准的微透镜阵列,使得微透镜阵列、球形透镜6和微电池阵列1相互对准。In the described method, the flexible backsheet 4 is vacuum laminated to the rigid lower surface of the housing via an adhesive layer, and the microlens array aligned with the spherical lenses 6 is molded on the rigid upper surface of the housing, such that The microlens array, spherical lens 6 and microbattery array 1 are aligned with each other.

为了进一步理解本发明,在一个实施例中,薄膜电池将阳光直接转换成电的转换。目前,由于晶体硅材料的相对低效的使用,薄膜电池具有高材料成本。在现有技术中,晶体硅被锯成晶片,这些晶片继而被处理成电池,并被焊在一起以构成最终模块。典型的多晶效率是大约15%且电池是刚性的和重量大。干式蚀刻硅晶片形成多个微电池图案阵列,局部化硼掺杂和磷掺杂所述微电池图案阵列。在一个实施例中,本发明的转移层无间隙接触所述微电池阵列1以从硅晶片分离所述微电池阵列1,转移层将微电池阵列1转移到聚酰胺层2,然后剥离所述转移层以达到低重量和柔性的能力,实现兼具高效率和低材料成本的轻质柔性薄膜电池。To further understand the present invention, in one embodiment, a thin film cell converts sunlight directly into electricity. Currently, thin film batteries have high material costs due to the relatively inefficient use of crystalline silicon materials. In the prior art, crystalline silicon is sawn into wafers, which are then processed into cells and soldered together to form the final module. Typical polycrystalline efficiencies are around 15% and the cells are rigid and heavy. A silicon wafer is dry-etched to form a plurality of microbattery pattern arrays that are locally doped with boron and phosphorus. In one embodiment, the transfer layer of the present invention contacts the microbattery array 1 without gaps to separate the microbattery array 1 from the silicon wafer, the transfer layer transfers the microbattery array 1 to the polyamide layer 2, and then peels off the microbattery array 1 The ability to transfer layers to achieve low weight and flexibility enables lightweight flexible thin-film batteries with high efficiency and low material cost.

在一个实施例中,转移层接触印刷处理,其避免了现有技术中转移相对大片的硅而形成的破裂和缺陷。本发明的转移层接触印刷处理还降低了薄膜电池组装成本,因为数千个微电池可以被平行地转移印刷。In one embodiment, the transfer layer contacts the printing process, which avoids the cracks and defects created by transferring relatively large pieces of silicon in the prior art. The transfer layer contact printing process of the present invention also reduces thin-film battery assembly costs because thousands of microbatteries can be transfer printed in parallel.

在一个实施例中,微电池阵列1厚度对电池性能的首要影响是对所聚集的电流的影响,对于更薄的电池,吸收更少的光子,因而产生更小的电流。在本发明的某些实施方案中将要求硅厚度在大约6-8微米,以达到所需的效率。In one embodiment, the primary effect of the thickness of the microbattery array 1 on cell performance is the effect on the current collected, for thinner cells, fewer photons are absorbed and thus less current is generated. Silicon thicknesses of about 6-8 microns will be required in certain embodiments of the present invention to achieve the desired efficiency.

在一个实施例中,转移处理包括将微电池阵列1从硅晶片揭到转移层上,然后是这些元件从转移层表面转移到聚酰胺层2。通过适当地设计底切蚀刻和将这些元件从它们的聚酰胺层2揭去,有可能以高产率执行揭去步骤。转移是通过聚酰胺层2和微电池阵列1之间强粘附层来实现的。在这两种情形下,聚酰胺层2和微电池阵列1之间的接触面积必须足够大,以实现有效的转移。聚酰胺层2和微电池阵列1之间的表面足够光滑以实现大接触面积。In one embodiment, the transfer process involves lifting the microbattery array 1 from the silicon wafer onto the transfer layer, and then transferring the elements from the surface of the transfer layer to the polyamide layer 2 . By appropriately designing the undercut etch and stripping these elements from their polyamide layer 2, it is possible to perform the stripping step with high yield. The transfer is achieved through a strong adhesion layer between the polyamide layer 2 and the microbattery array 1 . In both cases, the contact area between the polyamide layer 2 and the microbattery array 1 must be large enough to achieve efficient transfer. The surface between the polyamide layer 2 and the microbattery array 1 is smooth enough to achieve a large contact area.

在一个实施例中,用于转移层的安装夹具以亚微米精度移动,通过传感器测量作用力和位移,基于视觉测量以高精度对准,在一个实施例中,该对准是用显微镜和CCD相机实现的,CCD相机允许转移层表面上的校准标记被校正到硅晶片和聚酰胺层2。其精度为十分之一微米级。In one embodiment, the mounting jig for the transfer layer is moved with sub-micron precision, the force and displacement are measured by sensors, and aligned with high precision based on vision measurements, in one embodiment, the alignment is performed with a microscope and a CCD Camera-implemented, a CCD camera allows alignment marks on the surface of the transfer layer to be corrected to the silicon wafer and polyamide layer 2 . Its accuracy is in the order of tenths of a micron.

在一个实施例中,所述预定厚度为6-8微米,所述预定间距为微电池的宽度的1-2倍,所述预定高度与所述球形透镜6的焦距正相关。In one embodiment, the predetermined thickness is 6-8 microns, the predetermined spacing is 1-2 times the width of the micro-battery, and the predetermined height is positively related to the focal length of the spherical lens 6 .

在一个实施例中,刚性下表面设有与柔性背板4导电连接的连接端子和用于散热的散热单元。In one embodiment, the rigid lower surface is provided with connection terminals conductively connected to the flexible backplane 4 and a heat dissipation unit for heat dissipation.

在一个实施例中,在聚酰胺层2上喷墨印刷高度与微电池高度一致的导电层3使得所述导电层3邻接所述微电池阵列1且形成电互联,本发明最小化或完全避免了微电池电互联的电子性能的退化,微电池和导电层3形成具有一个具备平坦的几何形态的暴露表面的表面结构。在一个实施例中,具有平坦的几何形态的暴露表面可以借助于光学刻蚀和沉积技术以电互联。暴露表面上的所有点都在同一个平面上。In one embodiment, inkjet printing a conductive layer 3 on the polyamide layer 2 with a height consistent with the height of the microbattery allows the conductive layer 3 to abut the microbattery array 1 and form electrical interconnections, which the present invention minimizes or completely avoids In order to degrade the electronic properties of the electrical interconnection of the microbattery, the microbattery and the conductive layer 3 form a surface structure with an exposed surface having a flat geometry. In one embodiment, exposed surfaces with flat geometries can be electrically interconnected by means of optical etching and deposition techniques. All points on the exposed surface are in the same plane.

在一个实施例中,相邻的微电池之间的空隙被导电层3或聚酰胺层2填充。In one embodiment, the spaces between adjacent microbatteries are filled with conductive layers 3 or polyamide layers 2 .

在一个实施例中,将微电池直接集成聚酰胺层2的预先设置的凹槽中。In one embodiment, the microbattery is directly integrated into the pre-set grooves of the polyamide layer 2 .

在一个实施例中,微电池阵列1设在聚酰胺层2的接收表面上的聚合物层。聚合物层被聚酰胺层2支撑以使微电池阵列1被嵌入或植入聚合物层。聚合物层包含能够物理移位或重整以容纳微电池阵列1的材料,诸如低粘性流体。可选地,本发明的聚合物层在接收可印刷半导体元件之后能够发生化学或物理转化,以硬化、凝固、或发生相变或粘性变化,以使得所嵌入的微电池阵列1保持到位。在一个实施例中,本发明的聚合物层可以包含多种材料,聚合物层优选地包含一种或多种低粘性材料,其能够进行物理移位或重整以容纳和镶嵌微电池阵列1。例如,在一个实施例中,聚合物层包含具有选自200至500厘泊范围的粘性的材料。In one embodiment, the microbattery array 1 is provided as a polymer layer on the receiving surface of the polyamide layer 2 . The polymer layer is supported by the polyamide layer 2 so that the microbattery array 1 is embedded or implanted in the polymer layer. The polymer layer contains a material that can be physically displaced or reformed to accommodate the microbattery array 1, such as a low viscosity fluid. Optionally, the polymer layer of the present invention can undergo chemical or physical transformation after receiving the printable semiconductor element to harden, solidify, or undergo a phase or viscosity change to hold the embedded microbattery array 1 in place. In one embodiment, the polymer layer of the present invention may comprise a variety of materials, preferably the polymer layer comprises one or more low viscosity materials capable of being physically displaced or reformed to accommodate and embed the microbattery array 1 . For example, in one embodiment, the polymer layer comprises a material having a viscosity selected from the range of 200 to 500 centipoise.

在一个实施例中,微透镜阵列、球形透镜6和微电池阵列1之间的间隔使得太阳光穿透微透镜阵列分别聚焦在对应的球形透镜6上,来自球形透镜6的太阳光分别聚焦在对应的微电池上。In one embodiment, the spacing between the microlens array, the spherical lenses 6 and the microbattery array 1 is such that sunlight penetrates the microlens array and is focused on the corresponding spherical lenses 6, respectively, and sunlight from the spherical lenses 6 is focused on the corresponding spherical lenses 6 respectively. on the corresponding microbattery.

在一个实施例中,微电池阵列1被表面安装到柔性背板4上,该柔性背板4被层压到壳体的刚性下表面,将其用微透镜阵列和防水膜封闭。In one embodiment, the microbattery array 1 is surface mounted to a flexible backsheet 4 that is laminated to the rigid lower surface of the housing, which is enclosed with a microlens array and a waterproof membrane.

在一个实施例中,微电池阵列1可以被转移层微转印到聚酰胺层2表面上;沉积在聚酰胺层2表面上的导电层3电互连建立到微电池的电连接。In one embodiment, the microbattery array 1 can be microtransferred onto the surface of the polyamide layer 2 by a transfer layer; the electrical interconnection of the conductive layer 3 deposited on the surface of the polyamide layer 2 establishes an electrical connection to the microbattery.

在一个实施例中,导电结构在导电层3互连与位于聚酰胺层2下表面上的金属固定件之间建立电连接;支承层5提供对球形透镜6进行对准和支承。In one embodiment, the conductive structure establishes an electrical connection between the interconnection of the conductive layer 3 and the metal fixture on the lower surface of the polyamide layer 2; the support layer 5 provides alignment and support for the spherical lens 6.

在一个实施例中,柔性背板4包括印刷布线板,其可由被夹在第一和第二覆铜层压件之间的纤维加强预浸渍玻璃纤维复合电介质层组成。在向金属线表面上沉积电介质层并将其图案化,丝网印刷电介质层。In one embodiment, the flexible backsheet 4 comprises a printed wiring board, which may consist of a fiber-reinforced pre-impregnated fiberglass composite dielectric layer sandwiched between first and second copper clad laminates. A dielectric layer is deposited and patterned on the surface of the metal lines, and the dielectric layer is screen printed.

柔性背板4的背面内通过粘合剂层压在壳体的刚性下表面,粘合剂包括双组分环氧树脂、聚氨酯、丙烯酸或硅树脂基粘合剂。The backside of the flexible backsheet 4 is laminated to the rigid lower surface of the housing by an adhesive including a two-component epoxy, urethane, acrylic or silicone based adhesive.

在一个实施例中,平压印刷机的真空层压或用热辊层压实现背板的层压。In one embodiment, the lamination of the backsheet is accomplished by vacuum lamination of a flatbed press or lamination with a heated roll.

在一个实施例中,使用液体沉积方法将透明硅树脂粘合剂分配到微电池阵列1的上表面上,球形透镜6的最后位置由支承层5的位置限定,确保球形透镜6到每个微电池的非常准确的对准。光学透明粘合剂部分地或完全固化。In one embodiment, a liquid deposition method is used to dispense a transparent silicone adhesive onto the upper surface of the microcell array 1, the final position of the spherical lens 6 is defined by the position of the support layer 5, ensuring that the spherical lens 6 is Very accurate alignment of the battery. Optically clear adhesives are partially or fully cured.

在一个实施例中,导电层3对微电池进行电互联。导电层3可以被有效地图案化在大面积上,允许了在经由转移印刷的微电池阵列1放置准确度方面有较大容限。这个处理和设计优点导致放宽了与微电池阵列1的基于转移印刷的处理约束和器件几何形态容限。例如,导电电极和微电池阵列1的使用显著放宽了通过转移印刷的微电池阵列1的校准和定位方面的设计和放置约束。另外,导电电极的使用允许了大量微电池有效地电互联。In one embodiment, the conductive layer 3 electrically interconnects the microbatteries. The conductive layer 3 can be efficiently patterned over a large area, allowing greater tolerance in the placement accuracy of the microbattery array 1 via transfer printing. This processing and design advantage results in a relaxation of transfer printing-based processing constraints and device geometry tolerances with the microbattery array 1 . For example, the use of conductive electrodes and microbattery arrays 1 significantly relaxes design and placement constraints in the alignment and positioning of microbattery arrays 1 by transfer printing. In addition, the use of conductive electrodes allows a large number of microbatteries to be effectively electrically interconnected.

在一个实施例中,提供了一个或多个电极或电互联结构。In one embodiment, one or more electrodes or electrical interconnect structures are provided.

在一个实施例中,导电层3具有用于制造电连接的接触垫,其被设在微电池阵列1的单侧。In one embodiment, the conductive layer 3 has contact pads for making electrical connections, which are provided on one side of the microbattery array 1 .

在一个实施例中,薄膜电池被组装在诸如透镜、透镜阵列、波导或波导阵列的曲面上。In one embodiment, thin film cells are assembled on curved surfaces such as lenses, lens arrays, waveguides or waveguide arrays.

在一个实施例中,导电层3和微电池阵列1部分层叠。In one embodiment, the conductive layer 3 and the microbattery array 1 are partially stacked.

在一个实施例中,导电层3电连接所述柔性背板4,导电层3包括多个导电电极,导电电极连接微电池以形成互联导电网络。In one embodiment, the conductive layer 3 is electrically connected to the flexible backplane 4, the conductive layer 3 includes a plurality of conductive electrodes, and the conductive electrodes are connected to the microbatteries to form an interconnected conductive network.

在一个实施例中,在第一和第二覆铜层压件之间热辊层压印刷布线板形成柔性背板4。In one embodiment, the flexible backsheet 4 is formed by thermal roll lamination of a printed wiring board between the first and second copper clad laminates.

在一个实施例中,所述微透镜阵列为柱状微透镜阵列。In one embodiment, the microlens array is a cylindrical microlens array.

根据本发明的另一方面,薄膜电池经所述的方法制备。According to another aspect of the present invention, a thin film battery is produced by the method described.

工业实用性Industrial Applicability

本发明的薄膜电池制备方法及其薄膜电池可以在存储设备领域制造并使用。The thin film battery preparation method and the thin film battery of the present invention can be manufactured and used in the field of storage devices.

以上结合具体实施例描述了本申请的基本原理,但是,需要指出的是,在本申请中提及的优点、优势、效果等仅是示例而非限制,不能认为这些优点、优势、效果等是本申请的各个实施例必须具备的。另外,上述公开的具体细节仅是为了示例的作用和便于理解的作用,而非限制,上述细节并不限制本申请为必须采用上述具体的细节来实现。The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be pointed out that the advantages, advantages, effects, etc. mentioned in the present application are only examples rather than limitations, and these advantages, advantages, effects, etc., are not considered to be Required for each embodiment of this application. In addition, the specific details disclosed above are only for the purpose of example and easy understanding, rather than limiting, and the above-mentioned details do not limit the application to be implemented by using the above-mentioned specific details.

如本领域技术人员将认识到的,可以按任意方式连接、布置、配置这些器件、装置、设备、系统。诸如“包括”、“包含”、“具有”等等的词语是开放性词汇,指“包括但不限于”,且可与其互换使用。这里所使用的词汇“或”和“和”指词汇“和/或”,且可与其互换使用,除非上下文明确指示不是如此。这里所使用的词汇“诸如”指词组“诸如但不限于”,且可与其互换使用。As those skilled in the art will appreciate, these means, apparatuses, apparatuses, systems may be connected, arranged, configured in any manner. Words such as "including", "including", "having" and the like are open-ended words meaning "including but not limited to" and are used interchangeably therewith. As used herein, the words "or" and "and" refer to and are used interchangeably with the word "and/or" unless the context clearly dictates otherwise. As used herein, the word "such as" refers to and is used interchangeably with the phrase "such as but not limited to".

还需要指出的是,在本申请的方法中,各部件或各步骤是可以分解和/或重新组合的。这些分解和/或重新组合应视为本申请的等效方案。It should also be noted that, in the method of the present application, each component or each step can be decomposed and/or recombined. These disaggregations and/or recombinations should be considered as equivalents of the present application.

提供所公开的方面的以上描述以使本领域的任何技术人员能够做出或者使用本申请。对这些方面的各种修改对于本领域技术人员而言是非常显而易见的,并且在此定义的一般原理可以应用于其他方面而不脱离本申请的范围。因此,本申请不意图被限制到在此示出的方面,而是按照与在此公开的原理和新颖的特征一致的最宽范围。The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Therefore, this application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

为了例示和描述的目的已经给出了以上描述。此外,此描述不意图将本申请的实施例限制到在此公开的形式。尽管以上已经讨论了多个示例方面和实施例,但是本领域技术人员将认识到其某些变型、修改、改变、添加和子组合。The foregoing description has been presented for the purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of the application to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims (6)

Translated fromChinese
1.一种薄膜电池的制备方法,其包括如下步骤:1. a preparation method of thin film battery, it comprises the steps:干式蚀刻硅晶片形成多个微电池图案阵列,局部化硼掺杂和磷掺杂所述微电池图案阵列,光刻所述硅晶片以形成多个预定长度和宽度的微电池阵列,钝化微电池侧壁以及各向异性蚀刻微电池侧壁和底部使得微电池的厚度小于预定厚度,dry etching a silicon wafer to form a plurality of microbattery pattern arrays, localized boron doping and phosphorous doping of the microbattery pattern arrays, photolithography of the silicon wafer to form a plurality of microbattery arrays of predetermined length and width, passivation the sidewalls of the microbattery and the anisotropic etching of the sidewalls and bottom of the microbattery so that the thickness of the microbattery is less than a predetermined thickness,转移层无间隙接触所述微电池阵列以从硅晶片分离所述微电池阵列,转移层将微电池阵列转移到聚酰胺层,然后剥离所述转移层,其中,所述转移层包括接触所述微电池阵列的聚二甲基硅氧烷膜和玻璃纤维膜,所述聚酰胺层经由含有银颗粒的粘合层固定所述微电池阵列,通过设计底切蚀刻将这些元件从聚酰胺层2揭去,微电池直接集成聚酰胺层的预先设置的凹槽中,the transfer layer contacts the microbattery array without gaps to separate the microbattery array from the silicon wafer, the transfer layer transfers the microbattery array to the polyamide layer, and then peels the transfer layer, wherein the transfer layer includes contacting the microbattery array Polydimethylsiloxane film and glass fiber film of a microbattery array, the polyamide layer immobilizing the microbattery array via an adhesive layer containing silver particles, these elements are removed from the polyamide layer by design undercut etching 2 peeled off, the microbattery is directly integrated into the pre-set grooves of the polyamide layer,在聚酰胺层上喷墨印刷高度与微电池高度一致的导电层使得所述导电层邻接所述微电池阵列且形成电互联,相邻的微电池之间的空隙被导电层填充,层压形成柔性背板,丝网印刷金属线于柔性背板上,然后在柔性背板上沉积图案化电介质层,聚酰胺层设置在所述柔性背板上,微电池和导电层形成具有一个具备平坦的几何形态的暴露表面的表面结构,The conductive layer with the same height as the microbattery is inkjet printed on the polyamide layer, so that the conductive layer is adjacent to the microbattery array and forms electrical interconnection, the gaps between adjacent microbatteries are filled with the conductive layer, and the lamination is formed. A flexible backplane, screen-printed metal lines on the flexible backplane, and then depositing a patterned dielectric layer on the flexible backplane, the polyamide layer is disposed on the flexible backplane, and the microbattery and the conductive layer are formed to have a flat surface. the surface structure of the exposed surface of the geometric form,在导电层上以微电池为中心套准印刷预定间距和预定高度的支承层,在微电池和两侧的支承层上间隙涂布透明的硅树脂粘合剂,球形透镜经由所述硅树脂粘合剂相对于微电池对准固定,涂布甲基丙烯酸甲酯层以覆盖所述球形透镜、支承层和导电层,经由粘合剂层将柔性背板真空层压到壳体的刚性下表面,在壳体的刚性上表面模制与所述球形透镜对准的微透镜阵列,使得微透镜阵列、球形透镜和微电池阵列相互对准,微透镜阵列、球形透镜和微电池阵列之间的间隔使得太阳光穿透微透镜阵列分别聚焦在对应的球形透镜上,来自球形透镜的太阳光分别聚焦在对应的微电池上,所述预定厚度为6-8微米,所述预定间距为微电池的宽度的1-2倍,所述预定高度与所述球形透镜的焦距正相关,粘合剂选自双组分环氧树脂、聚氨酯、丙烯酸或硅树脂基粘合剂,具有平坦的几何形态的暴露表面可以借助于光学刻蚀和沉积技术以电互联,暴露表面上的所有点都在同一个平面上,使用液体沉积方法将透明硅树脂粘合剂分配到微电池阵列的上表面上。On the conductive layer, a supporting layer with a predetermined pitch and a predetermined height is printed in register with the micro-battery as the center, and a transparent silicone resin adhesive is applied between the micro-battery and the supporting layers on both sides, and the spherical lens is glued through the silicone resin. The mixture is aligned and fixed relative to the microbattery, a methyl methacrylate layer is applied to cover the spherical lens, the support layer and the conductive layer, and the flexible backsheet is vacuum laminated to the rigid lower surface of the housing via the adhesive layer , mold a microlens array aligned with the spherical lens on the rigid upper surface of the housing, so that the microlens array, the spherical lens and the microbattery array are aligned with each other, and the microlens array, the spherical lens and the microbattery array The spacing is such that the sunlight penetrates the microlens array and is focused on the corresponding spherical lenses respectively, and the sunlight from the spherical lenses is focused on the corresponding microcells respectively, the predetermined thickness is 6-8 microns, and the predetermined spacing is the microcells. The predetermined height is positively related to the focal length of the spherical lens, and the adhesive is selected from two-component epoxy, polyurethane, acrylic or silicone based adhesives with a flat geometry The exposed surfaces of the can be electrically interconnected by means of optical etching and deposition techniques, all points on the exposed surface are in the same plane, and a liquid deposition method is used to dispense a transparent silicone adhesive onto the upper surface of the microbattery array.2.根据权利要求1所述的方法,其中,刚性下表面设有与柔性背板导电连接的连接端子和用于散热的散热单元。2 . The method of claim 1 , wherein the rigid lower surface is provided with connection terminals conductively connected with the flexible backplane and a heat dissipation unit for heat dissipation. 3 .3.根据权利要求1所述的方法,其中,导电层电连接所述柔性背板,导电层包括多个导电电极,导电电极连接微电池以形成互联导电网络。3. The method of claim 1, wherein a conductive layer is electrically connected to the flexible backsheet, the conductive layer comprising a plurality of conductive electrodes, the conductive electrodes being connected to the microbatteries to form an interconnected conductive network.4.根据权利要求1所述的方法,其中,在第一和第二覆铜层压件之间热辊层压印刷布线板形成柔性背板。4. The method of claim 1, wherein the flexible backplane is formed by heat roll laminating the printed wiring board between the first and second copper clad laminates.5.根据权利要求1所述的方法,其中,所述微透镜阵列为柱状微透镜阵列。5. The method of claim 1, wherein the microlens array is a cylindrical microlens array.6.一种薄膜电池,其特征在于,所述薄膜电池通过权利要求1-5 中任一项所述的方法制备。6. A thin-film battery, characterized in that, the thin-film battery is prepared by the method of any one of claims 1-5.
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