CN111487321A - Full-focusing imaging method for improving focusing energy based on ultrasonic reflection - Google Patents
Full-focusing imaging method for improving focusing energy based on ultrasonic reflectionDownload PDFInfo
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Abstract
Description
Technical Field
The invention belongs to the technical field of ultrasonic nondestructive testing, and particularly relates to a full-focus imaging method for improving focus energy based on ultrasonic reflection.
Background
For ultrasonic detection of long and thin workpieces such as bolts and the like, point-by-point scanning detection technology, ultrasonic phased array detection technology and ultrasonic full-focus imaging technology are mainly adopted at present by adopting a single crystal straight probe or a small-angle longitudinal wave inclined probe on the end face and the cylindrical surface of the bolt.
The ultrasonic phased array detection technology is a common method in the field of industrial nondestructive detection, and the phased array technology has the advantages of rapidness, accuracy, strong adaptability and the like, so that the ultrasonic phased array detection technology is widely applied to actual ultrasonic detection. Because the ultrasonic phased array can only carry out single-point real-time focusing, the imaging resolution and accuracy are limited, and the ultrasonic phased array is gradually replaced by an ultrasonic full-focusing imaging technology in recent years. The ultrasonic full-focus imaging technology can overcome the defects of the phased array technology by acquiring full-matrix echo data of any point in a detected area and performing virtual focusing. By comparing the synthetic aperture focused ultrasound imaging method, the imaging effect of the ultrasonic full-focus imaging technology is better.
The ultrasonic phased array detection technology cannot provide 3D body imaging inside the slender workpiece, and defects of inspectors cannot be identified and judged intuitively and easily; although the existing ultrasonic full-focusing imaging technology can provide internal body imaging of a slender workpiece, the penetrating power of single-vibration-source excitation imaging cannot reach the penetrating depth of more than 1 meter, and the effective detection depth is limited by the effective area of a probe wafer, so that the detection of the slender workpiece with the length of more than 1 meter cannot be realized. That is, the ultrasonic phased array detection technology is far inferior to the ultrasonic full focus imaging technology in terms of imaging resolution and defect recovery, but in terms of detection depth, the phased array is in a multi-array element participating transmission form, while the full focus technology is in a single-array element transmission form, so the detection depth of the phased array technology exceeds the ultrasonic full focus imaging technology.
In the existing ultrasonic full-focusing imaging technology, after one array element is excited each time, all the array elements collect the reflection energy of the direct sound wave of the ultrasonic wave to perform focusing accumulation calculation imaging, N excitation periods are arranged in each frame period, each excitation period is excited by a single array element to generate the ultrasonic wave, and reflection energy data are received through all the array elements, so that the focusing and energy accumulation are performed to complete the calculation imaging. The energy excited by a single array element adopted by the ultrasonic full-focusing imaging technology is much lower than the energy excited by a plurality of array elements adopted by the ultrasonic phased array detection technology, so that the penetration depth of the detection ultrasonic wave in the detected material is relatively low; particularly, when the ultrasonic full-focus imaging device is applied to the detection of elongated workpieces such as bolts, the detection depth is very deep, the detection surface area of the end part of the workpiece is small, and the requirements on the detection depth and the penetration force of ultrasonic energy are very high and severe, so that the existing ultrasonic full-focus imaging technology cannot be applied to the detection requirements on the elongated workpieces with high requirements on the detection depth.
Disclosure of Invention
The detection imaging space set by the existing ultrasonic full-focusing imaging technology is a direct sound field model of an open space, the energy of a side wall reflection sound field of a slender workpiece is not considered in the imaging model, only the energy of the direct ultrasonic field is considered for accumulation calculation, if the calculation of the reflection energy of the side wall reflection sound field of a bolt at an imaging point is accumulated in the detection imaging, the signal to noise ratio of defects can be greatly improved, and the detection depth of the ultrasonic full-focusing imaging technology on the slender workpiece is greatly improved.
In view of this, the present invention provides a full-focus imaging method for improving focus energy based on ultrasonic reflection, which can effectively improve detection depth to solve the problem of insufficient detection depth of the existing full-focus imaging method.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a promote full focus imaging method of focused energy based on supersound reflection, a plurality of imaging points of array division in the work piece of being surveyed, to arbitrary imaging point b, set up the amplitude of the ultrasonic echo signal intensity of emission array element k, receiving array element h at delay time t moment as I (k, b, h, t), then the amplitude I (k, b, h) of the ultrasonic echo signal intensity of emission array element k, receiving array element h is:
wherein k is 1,2, 3. N ═ 1,2,3, · N; n is the number of array elements of the ultrasonic array probe;
t(k,b,h)minaiming at an imaging point b, the delay time corresponding to the shortest sound path between a transmitting array element k and a receiving array element h;
t(k,b,h)endfor the imaging point b, the delay cut-off time of the ultrasonic echo signal of the transmitting array element k and the receiving array element h is t (k, b, h)end≥t(k,b,h)min；
For an imaging point b and a transmitting array element k, the amplitude I (k, b) of the ultrasonic echo signal intensity received by all array elements of the ultrasonic array probe is as follows:
aiming at an imaging point b, sequentially exciting N array elements of an ultrasonic array probe to transmit ultrasonic signals, wherein the amplitude I (b) of the total signal intensity of the obtained ultrasonic echo is as follows:
converting the amplitude I (b) of the ultrasonic echo total signal intensity of the imaging point b into imaging gray scale to obtain the imaging gray scale value of the imaging point b;
and finishing the measurement of the imaging gray values of all the imaging points in the workpiece to be measured to obtain the ultrasonic full-focus imaging image.
Further, for imaging point b, the shortest acoustic path between the transmitting array element k and the receiving array element h is L (k, b, h) which is the sum of the straight distances between the transmitting array element k and the receiving array element h, respectively, and the imaging point bminAnd then:
wherein v is the transmission rate of the ultrasonic wave in the workpiece to be tested.
Further, t (k, b, h)endFor the longest acoustic path L (k, b, h) between the transmit and receive elements k, h for imaging point bmaxThe corresponding delay time is as follows:
or the like, or, alternatively,
t(k,b,h)end＝mt(k,b,h)min
wherein m is a coefficient, and m is more than or equal to 1;
or the like, or, alternatively,
if aiming at the imaging point b, the transmitting array element k and the receiving array element h are delayed for time t0The amplitude of the ultrasonic echo signal intensity at the moment is I (k, b, h, t)0) Satisfies the following conditions:
I(k,b,h,t0)＝cI(k,b,h,tmin)
then:
t(k,b,h)end＝t0
wherein c is a coefficient, and c is more than or equal to 0 and less than or equal to 1.
Further, ultrasonic array probe includes the base plate, be equipped with at least one annular array district on the base plate, all coaxial setting between the annular array district, the array is equipped with the wafer in the annular array district, along the direction of the axial view in annular array district, all the area that the wafer occupies equals.
Further, the number of the annular array areas is at least two, and in two adjacent annular array areas, the diameter of the outer ring of the annular array area positioned on the inner side is equal to the diameter of the inner ring of the annular array area positioned on the outer side.
Furthermore, the center of the substrate is provided with a yielding hole for yielding the surface structure of the workpiece to be detected, and the yielding hole and the annular array area are coaxially arranged.
Further, the workpiece to be measured is a slender workpiece.
Further, the workpiece to be measured is a bolt, a screw or a broach.
The invention has the beneficial effects that:
the invention discloses a full-focusing imaging method for improving focusing energy based on ultrasonic reflection, aiming at any imaging point in a measured workpiece, the ultrasonic wave transmitting principle shows that the ultrasonic wave transmitted by a transmitting array element directly reaches the imaging point and then is reflected to the direct sound field of a receiving array element, and the sound path is shortest, so that the corresponding delay time t (k, b, h)minShortest; the sound path of the reflected sound field after being reflected at least once by the side wall of the workpiece is larger than that of the direct sound field, and the corresponding delay time is called as the extension of the direct sound field; because there are countless reflection paths among the transmitting array element, the imaging point and the receiving array element after being reflected at least once by the side wall of the workpiece, the time delay of the echo signal of the reflected sound field can continuously last for a period of time;
the invention sets the cut-off time t (k, b, h)endThe shortest delay time t (k, b, h) corresponding to the direct sound fieldminWith a cut-off time t (k, b, h)endThe amplitude values of all ultrasonic echo signal intensities in the process of ultrasonic imaging are accumulated, so that echo signals of a direct sound field and echo signals of all reflected sound fields received by the receiving array elements within a set delay time are accumulated in detection imaging, the energy of the echo signals of corresponding imaging points is greatly improved, the detection depth can be effectively improved, and the problem of insufficient detection depth of the existing full-focus imaging method is solved.
Drawings
In order to make the object, technical scheme and beneficial effect of the invention more clear, the invention provides the following drawings for explanation:
FIG. 1 is a diagram showing a positional relationship between an ultrasonic array probe and an elongated workpiece when the elongated workpiece is inspected by using the full focus imaging method for improving focus energy based on ultrasonic reflection according to the present invention;
fig. 2 is a schematic diagram of a wafer distribution structure of the ultrasonic array probe of the present embodiment;
FIG. 3 is a schematic diagram of a wafer array layout;
fig. 4 is a schematic diagram of a direct sound field path and a reflected sound field path.
Description of reference numerals:
1-an ultrasonic array probe; 2-an elongated workpiece; 3-a substrate; 4-a wafer; 5-abdicating holes.
Detailed Description
The present invention is further described with reference to the following drawings and specific examples so that those skilled in the art can better understand the present invention and can practice the present invention, but the examples are not intended to limit the present invention.
Fig. 1 is a diagram showing a positional relationship between anultrasonic array probe 1 and anelongated workpiece 2 when the elongated workpiece is inspected by using the full-focus imaging method for improving focus energy based on ultrasonic reflection according to the present invention. In use, theultrasonic array probe 1 is coupled to an end face of anelongate workpiece 2. Specifically, the specific implementation of detecting the elongated workpiece by using the full-focus imaging method based on the ultrasonic reflection to improve the focusing energy is as follows:
this embodiment is based on ultrasonic reflection promotes focus energy's full focus imaging method, and a plurality of imaging points are divided to the array in the work piece under test, to arbitrary imaging point b, and it is I (k, b, h, t) to set the amplitude of the ultrasonic echo signal intensity of transmission array element k, receiving array element h at delay time t moment, then the amplitude I (k, b, h) of the ultrasonic echo signal intensity of transmission array element k, receiving array element h is:
wherein k is 1,2, 3. N ═ 1,2,3, · N; n is the number of array elements of the ultrasonic array probe;
t(k,b,h)minaiming at an imaging point b, the delay time corresponding to the shortest sound path between a transmitting array element k and a receiving array element h; because the ultrasonic wave transmitted by the transmitting array element directly reaches the imaging point and is reflected to the direct sound field of the receiving array element, the sound path is shortest, and the corresponding delay time t (k, b, h)minShortest, in particular, for imaging point b, the shortest acoustic path between transmit element k and receive element h is L (k, b, h) the sum of the linear distances between transmit element k and receive element h, respectively, and imaging point bminAnd then:
wherein v is the transmission rate of the ultrasonic wave in the workpiece to be tested.
t(k,b,h)endFor the imaging point b, the delay cut-off time of the ultrasonic echo signal of the transmitting array element k and the receiving array element h is t (k, b, h)end≥t(k,b,h)min. Delay deadline t (k, b, h)endThe determination may be made in a variety of ways.
The first mode is as follows: t (k, b, h)endMay be the longest acoustic path L (k, b, h) between the transmitting array element k and the receiving array element h for the imaging point bmaxThe corresponding delay time is as follows:
at this time, pass L (k, b, h)maxSolving the obtained t (k, b, h)endConsidering the attenuation of ultrasonic waves as a theoretical value, the cut-off time t (k, b, h) can be appropriately shortened without affecting the detection accuracy and the detection depthendThat is, the cutoff time t (k, b, h) can be determined in the following two waysend。
The second mode is as follows:
t(k,b,h)end＝mt(k,b,h)min
wherein m is a coefficient, and m is more than or equal to 1.
I.e. with the shortest delay time t (k, b, h)minBasic, at the shortest delay time t (k, b, h)minOn the basis, the time of the set multiple is prolonged and then is used as the cut-off time, and the data value of the coefficient m can be determined according to the actual situation under the condition that the detection precision and the detection depth are not influenced.
Third methodFormula (II): if aiming at the imaging point b, the transmitting array element k and the receiving array element h are delayed for time t0The amplitude of the ultrasonic echo signal intensity at the moment is I (k, b, h, t)0) Satisfies the following conditions:
I(k,b,h,t0)＝cI(k,b,h,tmin)
then:
t(k,b,h)end＝t0
wherein c is a coefficient, and c is more than or equal to 0 and less than or equal to 1; t is tmin＝t(k,b,h)min。
That is, the cut-off time t (k, b, h) is determined as a delay time corresponding to a set ratio of attenuation of the ultrasonic echo signal in the reflected sound field with respect to the echo signal in the direct sound field based on the intensity of the ultrasonic echo signalendAt a cut-off time t (k, b, h)endThe echo signal of the reflected sound field is low in intensity, so that the detection precision and the detection depth are not affected. Specifically, the specific value of the coefficient c may be determined according to actual conditions.
The present embodiment employs a third way to finalize the deadline t (k, b, h)end。
Specifically, for an imaging point b and a transmitting array element k, the amplitude I (k, b) of the ultrasonic echo signal intensity received by all array elements of the ultrasonic array probe is:
specifically, for an imaging point b, N array elements of the ultrasonic array probe are sequentially excited to transmit ultrasonic signals, and the amplitude i (b) of the total signal intensity of the obtained ultrasonic echo is as follows:
converting the amplitude I (b) of the ultrasonic echo total signal intensity of the imaging point b into imaging gray scale to obtain the imaging gray scale value of the imaging point b; specifically, the algorithm for converting the amplitude i (b) into the imaging gray scale is as follows: and (b) taking an absolute value of I (a), (b) and dividing the absolute value by 256 to convert the absolute value into imaging gray scale.
And finishing the measurement of the imaging gray values of all the imaging points in the workpiece to be measured to obtain the ultrasonic full-focus imaging image.
Further,ultrasonic array probe 1 includesbase plate 3, be equipped with at least one annular array district on the base plate, all coaxial setting between the annular array district, the array is equipped withwafer 4 in the annular array district, along the direction of the axial view in annular array district, all the area thatwafer 4 occupies equals. Specifically, when the number of the annular array regions is at least two, the outer circle diameter of the annular array region located on the inner side is equal to the inner circle diameter of the annular array region located on the outer side in two adjacent annular array regions. For some slender workpieces with concave or convex structures on the end faces, a yieldinghole 5 for yielding the surface structure of the workpiece to be detected can be arranged in the center of the substrate, and the yielding hole and the annular array area are coaxially arranged.
Further, the workpiece to be detected is a slender workpiece, and the slender workpiece can be a bolt, a screw rod or a broach. Of course, the full-focus imaging method based on ultrasonic reflection to improve focusing energy of the embodiment may also be applied to the detection of other various elongated workpieces, even to the detection of workpieces with non-elongated structures, and will not be described again.
In the embodiment of the full-focusing imaging method for improving focusing energy based on ultrasonic reflection, aiming at any imaging point in a measured workpiece, the ultrasonic wave transmitting principle shows that the path of the direct sound field reflected to a receiving array element after the ultrasonic wave transmitted by a transmitting array element directly reaches the imaging point is shortest, so that the corresponding delay time t (k, b, h)minShortest; the sound path of the reflected sound field after being reflected at least once by the side wall of the workpiece is larger than that of the direct sound field, and the corresponding delay time is called as the extension of the direct sound field; and because there are countless reflection paths among the transmitting array element, the imaging point and the receiving array element after being reflected at least once by the side wall of the workpiece, the time delay of the echo signal of the reflected sound field can continuously last for a period of time, as shown in fig. 4. In fig. 4, a solid line indicates a path of a direct sound field, and a broken line indicates a path of a reflected sound field (there are numerous paths of the reflected sound field, and only one path is shown in fig. 4).The embodiment is realized by setting the cut-off time t (k, b, h)endThe shortest delay time t (k, b, h) corresponding to the direct sound fieldminWith a cut-off time t (k, b, h)endThe amplitude values of all ultrasonic echo signal intensities in the process of ultrasonic imaging are accumulated, so that echo signals of a direct sound field and echo signals of all reflected sound fields received by the receiving array elements within a set delay time are accumulated in detection imaging, the energy of the echo signals of corresponding imaging points is greatly improved, the detection depth can be effectively improved, and the problem of insufficient detection depth of the existing full-focus imaging method is solved.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Claims (8)
1. A full-focus imaging method for improving focus energy based on ultrasonic reflection is characterized in that:
a plurality of imaging points are divided in the measured workpiece in an array mode, aiming at any imaging point b, the amplitude of the ultrasonic echo signal intensity of a transmitting array element k and a receiving array element h at the time of delay time t is set to be I (k, b, h, t), and then the amplitude I (k, b, h) of the ultrasonic echo signal intensity of the transmitting array element k and the receiving array element h is set to be I (k, b, h):
wherein k is 1,2, 3. N ═ 1,2,3, · N; n is the number of array elements of the ultrasonic array probe;
t(k,b,h)minaiming at an imaging point b, the delay time corresponding to the shortest sound path between a transmitting array element k and a receiving array element h;
t(k,b,h)endfor the imaging point b, the delay cut-off time of the ultrasonic echo signal of the transmitting array element k and the receiving array element h is t (k, b, h)end≥t(k,b,h)min；
For an imaging point b and a transmitting array element k, the amplitude I (k, b) of the ultrasonic echo signal intensity received by all array elements of the ultrasonic array probe is as follows:
aiming at an imaging point b, sequentially exciting N array elements of an ultrasonic array probe to transmit ultrasonic signals, wherein the amplitude I (b) of the total signal intensity of the obtained ultrasonic echo is as follows:
converting the amplitude I (b) of the ultrasonic echo total signal intensity of the imaging point b into imaging gray scale to obtain the imaging gray scale value of the imaging point b;
and finishing the measurement of the imaging gray values of all the imaging points in the workpiece to be measured to obtain the ultrasonic full-focus imaging image.
2. The method of claim 1, wherein the shortest acoustic path between the transmitting element k and the receiving element h for the imaging point b is L (k, b, h) which is the sum of the linear distances between the transmitting element k and the receiving element h and the imaging point b respectivelyminAnd then:
wherein v is the transmission rate of the ultrasonic wave in the workpiece to be tested.
3. The full focus imaging method based on ultrasonic reflection to boost focus energy of claim 1, wherein:
t(k,b,h)endfor the longest acoustic path L (k, b, h) between the transmit and receive elements k, h for imaging point bmaxThe corresponding delay time is as follows:
or the like, or, alternatively,
t(k,b,h)end＝mt(k,b,h)min
wherein m is a coefficient, and m is more than or equal to 1;
or the like, or, alternatively,
if aiming at the imaging point b, the transmitting array element k and the receiving array element h are delayed for time t0The amplitude of the ultrasonic echo signal intensity at the moment is I (k, b, h, t)0) Satisfies the following conditions:
I(k,b,h,t0)＝cI(k,b,h,tmin)
then:
t(k,b,h)end＝t0
wherein c is a coefficient, and c is more than or equal to 0 and less than or equal to 1.
4. The full focus imaging method based on ultrasonic reflection enhanced focused energy according to any one of claims 1-3, characterized in that: the ultrasonic array probe comprises a substrate, wherein at least one annular array area is arranged on the substrate, all the annular array areas are coaxially arranged, wafers are arranged in the annular array areas in an array mode, and the occupied areas of all the wafers are equal in the direction of the axial view of the annular array areas.
5. The full focus imaging method based on ultrasonic reflection to boost focused energy of claim 4, wherein: the number of the annular array areas is at least two, and in two adjacent annular array areas, the diameter of the outer ring of the annular array area positioned on the inner side is equal to the diameter of the inner ring of the annular array area positioned on the outer side.
6. The full focus imaging method based on ultrasonic reflection to boost focused energy of claim 4, wherein: the center of base plate is equipped with the hole of stepping down of the measured workpiece surface structure, the hole of stepping down with the coaxial setting in annular array district.
7. The full focus imaging method based on ultrasonic reflection to boost focus energy of claim 1, wherein: the workpiece to be measured is a slender workpiece.
8. The full focus imaging method based on ultrasonic reflection to boost focused energy of claim 7, wherein: the workpiece to be measured is a bolt, a screw or a broach.
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Cited By (5)
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| CN118296858A (en)* | 2024-06-05 | 2024-07-05 | 汕头市超声仪器研究所股份有限公司 | Quick simulation method for full-focus imaging sound field |
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