CN111463652A - light-emitting device - Google Patents

Abstract

A light emitting device includes a substrate structure, a vertical cavity surface emitting laser diode, a first conductive line, a packaging adhesive layer, a lens element, and an air gap. The substrate structure includes a substrate, a first conductive pad, and a second conductive pad. The vertical resonant cavity surface emitting laser diode is arranged on the substrate structure and is electrically connected with the first conductive pad. The first wire is electrically connected with the vertical resonant cavity surface emitting laser diode and the second conductive pad. The packaging adhesive layer covers the vertical resonant cavity surface emitting laser diode, the first lead and the substrate structure. The lens element is arranged on the packaging adhesive layer. The air gap is located between the lens element and the packaging adhesive layer. The light-emitting device of the invention has smaller size, and compared with the prior art, the manufacturing process is simpler and the production cost is lower.

Description

Translated fromChinese

发光装置light-emitting device

技术领域technical field

本揭示内容是关于一种发光装置。The present disclosure relates to a light emitting device.

背景技术Background technique

垂直共振腔面射型激光(Vertical-Cavity Surface-Emitting Laser，VCSEL)二极管为近年来常见的点光源。包含VCSEL二极管的发光装置具有许多优点，例如较低的能量消耗、较长的寿命、更小的尺寸与更快的开关切换速度。Vertical-Cavity Surface-Emitting Laser (VCSEL) diodes are a common point light source in recent years. Lighting devices incorporating VCSEL diodes have many advantages, such as lower power consumption, longer lifetime, smaller size, and faster switching speeds.

现行的发光装置通常包括围绕VCSEL二极管的反射杯体及上盖，其中反射杯体与上盖之间透过胶体粘结在一起。然而，反射杯体与VCSEL二极管之间需间隔一适当距离，以避免因制程公差导致在装设反射杯体时挤压到导线。因此，发光装置的大小受限于反射杯体，而无法有效地减小。Existing light-emitting devices generally include a reflective cup body and an upper cover surrounding the VCSEL diode, wherein the reflective cup body and the upper cover are bonded together through colloid. However, an appropriate distance is required between the reflector cup and the VCSEL diode to avoid pinching the wires when the reflector cup is installed due to process tolerances. Therefore, the size of the light-emitting device is limited by the reflection cup and cannot be effectively reduced.

发明内容SUMMARY OF THE INVENTION

本揭示内容的一态样是提供一种发光装置，包括基板结构、垂直共振腔面射型激光二极管、第一导线、封装胶层、透镜元件、以及空气间隙。基板结构包含基板、第一导电垫、以及第二导电垫。垂直共振腔面射型激光二极管设置于基板结构上，并与第一导电垫电性连接。第一导线电性连接垂直共振腔面射型激光二极管与第二导电垫。封装胶层覆盖垂直共振腔面射型激光二极管、第一导线、以及基板结构。透镜元件设置于封装胶层之上。空气间隙位于透镜元件与封装胶层之间。An aspect of the present disclosure is to provide a light emitting device including a substrate structure, a vertical resonant cavity surface-emitting laser diode, a first wire, an encapsulant layer, a lens element, and an air gap. The substrate structure includes a substrate, a first conductive pad, and a second conductive pad. The vertical resonant cavity surface-emitting laser diode is arranged on the substrate structure and is electrically connected with the first conductive pad. The first wire is electrically connected to the vertical resonant cavity surface-emitting laser diode and the second conductive pad. The encapsulation adhesive layer covers the vertical resonant cavity surface-emitting laser diode, the first wire, and the substrate structure. The lens element is arranged on the encapsulation adhesive layer. An air gap is located between the lens element and the encapsulant layer.

在本揭示内容的一实施方式中，透镜元件包含载体及透镜阵列。透镜阵列设置于载体下，且透镜阵列包含多个透镜。In one embodiment of the present disclosure, the lens element includes a carrier and a lens array. The lens array is disposed under the carrier, and the lens array includes a plurality of lenses.

在本揭示内容的一实施方式中，各透镜具有球形表面，且球形表面面向封装胶层。In one embodiment of the present disclosure, each lens has a spherical surface, and the spherical surface faces the encapsulant layer.

在本揭示内容的一实施方式中，封装胶层与所述多个透镜具有实质上相同的折射率。In one embodiment of the present disclosure, the encapsulant layer and the plurality of lenses have substantially the same refractive index.

在本揭示内容的一实施方式中，透镜元件还包含支撑件。支撑件接触载体及封装胶层，且支撑件的高度高于所述多个透镜的高度。In one embodiment of the present disclosure, the lens element further includes a support. The support member contacts the carrier and the encapsulation adhesive layer, and the height of the support member is higher than that of the plurality of lenses.

在本揭示内容的一实施方式中，支撑件包括硅胶粘着剂、环氧树脂粘着剂、压克力胶粘着剂或其组合。In one embodiment of the present disclosure, the support includes a silicone adhesive, an epoxy adhesive, an acrylic adhesive, or a combination thereof.

在本揭示内容的一实施方式中，支撑件围绕透镜阵列，从而形成空气间隙。In an embodiment of the present disclosure, the support surrounds the lens array, thereby forming an air gap.

在本揭示内容的一实施方式中，封装胶层掺杂有光学材料。In one embodiment of the present disclosure, the encapsulant layer is doped with an optical material.

在本揭示内容的一实施方式中，发光装置进一步包括光电元件。光电元件设置于基板结构上，并被封装胶层所覆盖。In an embodiment of the present disclosure, the light emitting device further includes a photovoltaic element. The photoelectric element is arranged on the substrate structure and covered by the encapsulation adhesive layer.

在本揭示内容的一实施方式中，发光装置进一步包括第二导线，且基板结构还包括第三导电垫及第四导电垫。光电元件与第三导电垫电性连接，且第二导线电性连接光电元件与第四导电垫。In an embodiment of the present disclosure, the light emitting device further includes a second wire, and the substrate structure further includes a third conductive pad and a fourth conductive pad. The optoelectronic element is electrically connected to the third conductive pad, and the second wire is electrically connected to the optoelectronic element and the fourth conductive pad.

由上述实施方式可知，本发明提供一种发光装置。在此发光装置中，以封装胶层取代了反射杯体，因此有效地缩小发光装置的尺寸，并阻隔水气及避免氧化及剥离情况的发生。再者，相较于先前技术，本发明的发光装置的制造制程较简化，减少了制程工序并降低生产成本。此外，本发明的发光装置还可包含光电元件，确保发光装置的安全性，避免对人眼的安全造成危害。As can be seen from the above embodiments, the present invention provides a light-emitting device. In this light-emitting device, the reflective cup is replaced by an encapsulating adhesive layer, thereby effectively reducing the size of the light-emitting device, blocking moisture and avoiding the occurrence of oxidation and peeling. Furthermore, compared with the prior art, the manufacturing process of the light-emitting device of the present invention is simplified, which reduces the manufacturing process and reduces the production cost. In addition, the light-emitting device of the present invention may further include optoelectronic elements to ensure the safety of the light-emitting device and avoid harm to the safety of human eyes.

以下将以实施方式对上述的说明作详细的描述，并对本揭示内容的技术方案提供更进一步的解释。The above description will be described in detail in the following embodiments, and further explanations will be provided for the technical solutions of the present disclosure.

附图说明Description of drawings

当结合附图阅读时，从以下详细描述中可以更好地理解本揭露的各个方面。应注意，依据工业中的标凖实务，多个特征并未按比例绘制。实际上，多个特征的尺寸可任意增大或缩小，以便使论述明晰。Various aspects of the present disclosure may be better understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that in accordance with standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or decreased in order to clarify the discussion.

图1A绘示根据本揭示内容的一些实施方式的发光装置的立体示意图；FIG. 1A is a schematic perspective view of a light-emitting device according to some embodiments of the present disclosure;

图1B绘示根据本揭示内容的一些实施方式的发光装置的侧视示意图；FIG. 1B is a schematic side view of a light emitting device according to some embodiments of the present disclosure;

图1C绘示根据本揭示内容的一些实施方式的发光装置的上视示意图；1C is a schematic top view of a light emitting device according to some embodiments of the present disclosure;

图1D绘示根据本揭示内容的一些实施方式的发光装置的下视示意图；1D is a schematic bottom view of a light-emitting device according to some embodiments of the present disclosure;

图2A绘示根据本揭示内容的一些实施方式的发光装置的立体示意图；2A is a schematic perspective view of a light-emitting device according to some embodiments of the present disclosure;

图2B绘示根据本揭示内容的一些实施方式的发光装置的爆炸示意图；2B is a schematic exploded view of a light-emitting device according to some embodiments of the present disclosure;

图2C绘示根据本揭示内容的一些实施方式的发光装置的侧视示意图；2C is a schematic side view of a light-emitting device according to some embodiments of the present disclosure;

图2D绘示根据本揭示内容的一些实施方式的发光装置的上视示意图；2D illustrates a schematic top view of a light-emitting device according to some embodiments of the present disclosure;

图2E绘示根据本揭示内容的一些实施方式的发光装置的下视示意图。2E is a schematic bottom view of a light emitting device according to some embodiments of the present disclosure.

具体实施方式Detailed ways

以下揭示内容提供许多不同实施例或实例以用于实现所提供标的物的不同的特征。下文描述组件及排列的特定实例以简化本揭露。当然，这些仅仅为实例，并不旨在限制本揭露。举例而言，在随后描述中的在第二特征之上或在第二特征上形成第一特征可包括形成直接接触的第一特征和第二特征的实施例，还可以包括在第一特征和第二特征之间形成额外特征，从而使第一特征和第二特征不直接接触的实施例。另外，本揭露在各实例中可重复元件符号及/或字母。此重复是出于简化及清楚的目的，且本身不指示所论述各实施例及/或构造之间的关系。The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are only examples and are not intended to limit the present disclosure. By way of example, embodiments in the ensuing description where forming a first feature over or on a second feature may include forming direct contact between the first feature and the second feature may also include embodiments where the first feature and the second feature are in direct contact. Embodiments in which additional features are formed between the second features so that the first and second features are not in direct contact. Additionally, the present disclosure may repeat reference numerals and/or letters throughout the examples. This repetition is for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or configurations discussed.

另外，空间相对用语，诸如“下方”、“以下”、“下部”、“上方”、“上部”及类似者，在此用于简化描述附图所示的一个元件或特征与另一元件(或多个元件)或特征(或多个特征)的关系。除附图中描绘的方向外，空间相对用语旨在包含于使用或操作中的装置的不同方向。装置可为不同的方向(旋转90度或在其他的方向)，并且在此使用的空间相关描述词也可相应地被解释。In addition, spatially relative terms, such as "below," "below," "lower," "above," "upper," and the like, are used herein to simplify the description of one element or feature shown in the figures compared to another element ( or elements) or feature (or features). In addition to the orientation depicted in the figures, spatially relative terms are intended to encompass different orientations of the device in use or operation. The device may be oriented in different directions (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

请参照图1A、图1B、图1C、以及图1D。图1A绘示根据本揭示内容的一些实施方式的发光装置10a的立体示意图，图1B、图1C、以及图1D则分别绘示发光装置10a的侧视示意图、上视示意图、以及下视示意图。如图1A、图1B、图1C、以及图1D所示，发光装置10a包括基板结构100、垂直共振腔面射型激光(Vertical-Cavity Surface-Emitting Laser，VCSEL)二极管200、第一导线310、封装胶层400、以及透镜元件500。Please refer to FIG. 1A , FIG. 1B , FIG. 1C , and FIG. 1D . 1A is a schematic three-dimensional view of a light-emittingdevice 10a according to some embodiments of the present disclosure, and FIGS. 1B , 1C, and 1D are a schematic side view, a top view, and a bottom view of the light-emittingdevice 10a, respectively. As shown in FIG. 1A , FIG. 1B , FIG. 1C , and FIG. 1D , the light-emittingdevice 10 a includes asubstrate structure 100 , a vertical-cavity surface-emitting laser (VCSEL)diode 200 , afirst wire 310 , Theencapsulation adhesive layer 400 and thelens element 500 .

基板结构100包含基板110、第一导电垫120、以及第二导电垫130。基板110可以包含任何合适的基板。在某些实施方式中，基板110可以为透明基板或不透明基板。在某些实施方式中，基板110可以为软性基板。在其他实施方式中，基板110可以为刚性基板。例如，基板110可以为蓝宝石基板、硅基板、玻璃基板、印刷电路板、金属基板或陶瓷基板等，但不以此为限。Thesubstrate structure 100 includes asubstrate 110 , a firstconductive pad 120 , and a secondconductive pad 130 .Substrate 110 may comprise any suitable substrate. In some embodiments, thesubstrate 110 may be a transparent substrate or an opaque substrate. In some embodiments, thesubstrate 110 may be a flexible substrate. In other embodiments, thesubstrate 110 may be a rigid substrate. For example, thesubstrate 110 may be a sapphire substrate, a silicon substrate, a glass substrate, a printed circuit board, a metal substrate, or a ceramic substrate, but not limited thereto.

第一导电垫120及第二导电垫130可透过例如模具成型、贴附或电镀等方式，形成在基板110上。在一些实施例中，第一导电垫120及第二导电垫130可包括铜、铝、镍、锡或前述的组合，但不以此为限。应理解的是，虽然在图1A～图1D中，第一导电垫120及第二导电垫130是设置于基板110的上表面上，但在某些实施方式中，第一导电垫120及第二导电垫130亦可嵌置于基板中，并与基板110的上表面齐平。The firstconductive pads 120 and the secondconductive pads 130 can be formed on thesubstrate 110 by, for example, mold molding, attachment, or electroplating. In some embodiments, the firstconductive pad 120 and the secondconductive pad 130 may include copper, aluminum, nickel, tin, or a combination thereof, but not limited thereto. It should be understood that although the firstconductive pad 120 and the secondconductive pad 130 are disposed on the upper surface of thesubstrate 110 in FIGS. 1A to 1D , in some embodiments, the firstconductive pad 120 and the secondconductive pad 130 are disposed on the upper surface of thesubstrate 110 . The twoconductive pads 130 can also be embedded in the substrate and are flush with the upper surface of thesubstrate 110 .

VCSEL二极管200设置于基板结构100上，并与第一导电垫120及第二导电垫130电性连接。具体地，如图1A及图1B所示，VCSEL二极管200可设置于第一导电垫120上，并通过打线接合(wire bonding)方式，通过第一导线310电性连接至第二导电垫130，以形成回路。值得一提的是，虽然在本实施方式中，发光装置10a具有两条第一导线310(如图1A及图1C所示)，但本发明不限于此。例如，当一条导线即可供应VCSEL二极管200足够的电流时，发光装置10a亦可仅具有一条第一导线310。TheVCSEL diode 200 is disposed on thesubstrate structure 100 and is electrically connected to the firstconductive pad 120 and the secondconductive pad 130 . Specifically, as shown in FIG. 1A and FIG. 1B , theVCSEL diode 200 can be disposed on the firstconductive pad 120 and electrically connected to the secondconductive pad 130 through thefirst wire 310 by wire bonding. , to form a loop. It is worth mentioning that although in this embodiment, thelight emitting device 10a has two first wires 310 (as shown in FIG. 1A and FIG. 1C ), the present invention is not limited thereto. For example, when one wire can supply enough current to theVCSEL diode 200 , thelight emitting device 10 a can also have only onefirst wire 310 .

封装胶层400覆盖VCSEL二极管200、第一导线310、以及基板结构100。据此，封装胶层400可阻隔水气，并避免第一导电垫120、第二导电垫130、以及第一导线310的氧化。另一方面，封装胶层400亦可保护VCSEL二极管200与第一导电垫120之间的接合，以及第一导线310与VCSEL二极管200或第二导电垫130之间的接合，从而避免剥离情况的发生。在一些实施例中，封装胶层400包括硅氧树脂、环氧树脂或压克力树脂，但不以此为限。Theencapsulant layer 400 covers theVCSEL diode 200 , thefirst wires 310 , and thesubstrate structure 100 . Accordingly, theencapsulation adhesive layer 400 can block moisture and avoid oxidation of the firstconductive pads 120 , the secondconductive pads 130 , and thefirst wires 310 . On the other hand, theencapsulant layer 400 can also protect the bonding between theVCSEL diode 200 and the firstconductive pad 120, and the bonding between thefirst wire 310 and theVCSEL diode 200 or the secondconductive pad 130, so as to avoid peeling occur. In some embodiments, theencapsulation adhesive layer 400 includes silicone resin, epoxy resin or acrylic resin, but not limited thereto.

如先前技术所述，在目前现有的VCSEL二极管发光装置中，反射杯体与VCSEL二极管之间需间隔一适当距离，以避免因制程公差导致在装设反射杯体时挤压到导线。因此，现有的VCSEL二极管发光装置的大小受限于反射杯体，而无法有效地减小。相较于上述先前技术所遇到的困难，在此揭露的发光装置10a中，以封装胶层400取代了反射杯体，因此可有效缩小装置的尺寸。举例来说，以约1毫米×1毫米大小的VCSEL二极管为例，包含此大小的VCSEL二极管的本发明的发光装置的大小可仅为约1.6毫米×1.6毫米。此外，亦可通过封装胶层400的设置，达到上述的避免氧化及剥离情况的功效。As described in the prior art, in the existing VCSEL diode light-emitting device, an appropriate distance is required between the reflector cup and the VCSEL diode to avoid extrusion of the wires when the reflector cup is installed due to process tolerances. Therefore, the size of the existing VCSEL diode light-emitting device is limited by the reflection cup, and cannot be effectively reduced. Compared with the above-mentioned difficulties encountered in the prior art, in the light-emittingdevice 10a disclosed herein, the reflective cup body is replaced by theencapsulation adhesive layer 400, so that the size of the device can be effectively reduced. For example, taking a VCSEL diode with a size of about 1 mm by 1 mm as an example, the size of the light emitting device of the present invention including a VCSEL diode of this size can be only about 1.6 mm by 1.6 mm. In addition, the above-mentioned effect of avoiding oxidation and peeling can also be achieved through the disposition of theencapsulation adhesive layer 400 .

在一些实施方式中，封装胶层400可掺杂有光学材料。光学材料可为波长转换材料或散射材料。在一些实施例中，波长转换材料例如是荧光粉。在一些实施例中，散射材料例如是SiO₂、TiO₂等散射粒子。In some embodiments, theencapsulant layer 400 may be doped with optical materials. The optical material may be a wavelength converting material or a scattering material. In some embodiments, the wavelength converting material is, for example, a phosphor. In some embodiments, the scattering material is, for example,_SiO2 ,_TiO2 , etc. scattering particles.

透镜元件500设置于封装胶层400之上。具体地，透镜元件500包含载体510及透镜阵列520。透镜阵列520设置于载体510下，且包含多个透镜521。如图1B所示，各透镜521具有球形表面，且球形表面面向封装胶层400。据此，透镜阵列520配置以用于改变出光的角度及提高出光的均匀性。Thelens element 500 is disposed on theencapsulation adhesive layer 400 . Specifically, thelens element 500 includes acarrier 510 and alens array 520 . Thelens array 520 is disposed under thecarrier 510 and includes a plurality oflenses 521 . As shown in FIG. 1B , eachlens 521 has a spherical surface, and the spherical surface faces theencapsulant layer 400 . Accordingly, thelens array 520 is configured to change the angle of light output and improve the uniformity of light output.

需注意的是，发光装置10a还包括空气间隙600。空气间隙600位于透镜元件500与封装胶层400之间。详言之，透镜元件500包括支撑件530。支撑件530的底部接触封装胶层400，且支撑件530的顶部接触并支撑载体510。更详细而言之，支撑件530围绕出一空间以容纳透镜阵列520。如图1C所示，支撑件530的俯视轮廓为“中空矩形”(或“口字型”)，但本发明不以此为限。在一些实施方式中，支撑件530的高度H1高于透镜521的高度H2(如图1B所示)。据此，封装胶层400、透镜阵列520、以及支撑件530界定出空气间隙600。It should be noted that thelight emitting device 10a further includes anair gap 600 . Theair gap 600 is located between thelens element 500 and theencapsulant layer 400 . In detail, thelens element 500 includes asupport 530 . The bottom of thesupport member 530 contacts theencapsulant layer 400 , and the top of thesupport member 530 contacts and supports thecarrier 510 . In more detail, thesupport 530 surrounds a space to accommodate thelens array 520 . As shown in FIG. 1C , the top-view outline of thesupport member 530 is a “hollow rectangle” (or “mouth shape”), but the present invention is not limited thereto. In some embodiments, the height H1 of thesupport 530 is higher than the height H2 of the lens 521 (as shown in FIG. 1B ). Accordingly, theencapsulant layer 400 , thelens array 520 , and thesupport member 530 define theair gap 600 .

通过支撑件530的设置，使透镜阵列520与封装胶层400通过空气间隙600而间隔开，可有效地提高装置出光的均匀性。详细而言，当封装胶层400与透镜521具有实质上相同或近似的折射率时，若封装胶层400接触到透镜阵列520或甚至与透镜阵列520密合，则透镜阵列520将无法有效地改变出光角度及提高出光的均匀性。在一些实施方式中，支撑件530包括硅胶粘着剂、环氧树脂粘着剂、压克力胶粘着剂或其组合，但不以此为限。Through the disposition of thesupport member 530, thelens array 520 and theencapsulation adhesive layer 400 are spaced apart by theair gap 600, which can effectively improve the uniformity of light output from the device. In detail, when theencapsulant layer 400 and thelens 521 have substantially the same or similar refractive indices, if theencapsulant layer 400 is in contact with thelens array 520 or even closely adhered to thelens array 520 , thelens array 520 will not be able to effectively Change the light angle and improve the uniformity of light. In some embodiments, thesupport member 530 includes a silicone adhesive, an epoxy adhesive, an acrylic adhesive, or a combination thereof, but is not limited thereto.

请参照图2A、图2B、图2C、图2D、以及图2E。图2A绘示根据本揭示内容的另一些实施方式的发光装置10b的立体示意图。图2B绘示发光装置10b的爆炸示意图。图2C绘示发光装置10b从图2A的方向D1观看的侧视示意图。图2D及图2E分别绘示发光装置10b的上视示意图、以及下视示意图。须说明的是，在图2A～图2E中，与图1A～图1D中相同或相似的元件被给予相同的符号，并省略相关说明。图2A～图2E的发光装置10b与图1A～图1D的发光装置10a相似，差异在发光装置10b进一步包括光电元件700。Please refer to FIGS. 2A , 2B, 2C, 2D, and 2E. FIG. 2A is a schematic perspective view of alight emitting device 10b according to other embodiments of the present disclosure. FIG. 2B is a schematic exploded view of the light-emittingdevice 10b. FIG. 2C is a schematic side view of thelight emitting device 10b viewed from the direction D1 of FIG. 2A . 2D and 2E are a schematic top view and a bottom view of the light-emittingdevice 10b, respectively. It should be noted that, in FIGS. 2A to 2E , the same or similar elements as those in FIGS. 1A to 1D are given the same symbols, and the related descriptions are omitted. The light-emittingdevice 10b of FIGS. 2A-2E is similar to the light-emittingdevice 10a of FIGS. 1A-1D , except that the light-emittingdevice 10b further includes aphotoelectric element 700 .

当发光装置10b用于人脸辨识时，通过光电元件700的设置，可确保发光装置10b的安全性，避免对人眼的安全造成危害。具体而言，若透镜元件500破损(例如其中一些透镜521脱落)，则VCSEL二极管200发射的红外光通过破损位置直接照射人眼，可能会对人眼造成伤害。因此，通过光电元件700的设置，光电元件700可即时侦测经透镜元件500反射回来的光，以辨别透镜元件500是否有破损或瑕疵。When thelight emitting device 10b is used for face recognition, the safety of thelight emitting device 10b can be ensured by the arrangement of thephotoelectric element 700, and the safety of human eyes can be avoided. Specifically, if thelens elements 500 are damaged (for example, some of thelenses 521 fall off), the infrared light emitted by theVCSEL diode 200 will directly irradiate the human eye through the damaged position, which may cause damage to the human eye. Therefore, through the arrangement of thephotoelectric element 700, thephotoelectric element 700 can immediately detect the light reflected by thelens element 500, so as to identify whether thelens element 500 is damaged or defective.

如图2A～图2E所示，光电元件700设置于基板结构100上，并被封装胶层400所覆盖。具体地，基板结构100还包括第三导电垫140及第四导电垫150。第三导电垫140及第四导电垫150可透过例如模具成型、贴附或电镀等方式，形成在基板110上。在一些实施例中，第三导电垫140及第四导电垫150可包括铜、铝、镍、锡或前述的组合，但不以此为限。应理解的是，虽然在图2A～图2E中，第三导电垫140及第四导电垫150是设置于基板110的上表面上，但在某些实施方式中，第三导电垫140及第四导电垫150亦可嵌置于基板中，并与基板110的上表面齐平。As shown in FIGS. 2A to 2E , theoptoelectronic element 700 is disposed on thesubstrate structure 100 and covered by theencapsulation adhesive layer 400 . Specifically, thesubstrate structure 100 further includes a thirdconductive pad 140 and a fourthconductive pad 150 . The thirdconductive pad 140 and the fourthconductive pad 150 may be formed on thesubstrate 110 by, for example, mold molding, attachment, or electroplating. In some embodiments, the thirdconductive pad 140 and the fourthconductive pad 150 may include copper, aluminum, nickel, tin or a combination of the foregoing, but not limited thereto. It should be understood that although in FIGS. 2A to 2E , the thirdconductive pad 140 and the fourthconductive pad 150 are disposed on the upper surface of thesubstrate 110 , in some embodiments, the thirdconductive pad 140 and the fourthconductive pad 150 are disposed on the upper surface of thesubstrate 110 . The fourconductive pads 150 can also be embedded in the substrate and are flush with the upper surface of thesubstrate 110 .

如图2A～图2E所示，发光装置10b进一步包括第二导线320。光电元件700与第三导电垫140电性连接，且第二导线320电性连接光电元件700与第四导电垫150。具体地，光电元件700可设置于第三导电垫140上，并通过打线接合(wire bonding)方式，通过第二导线320电性连接至第四导电垫150，以形成回路。As shown in FIGS. 2A to 2E , thelight emitting device 10b further includes asecond wire 320 . Theoptoelectronic element 700 is electrically connected to the thirdconductive pad 140 , and thesecond wire 320 is electrically connected to theoptoelectronic element 700 and the fourthconductive pad 150 . Specifically, theoptoelectronic element 700 may be disposed on the thirdconductive pad 140 and electrically connected to the fourthconductive pad 150 through thesecond wire 320 by wire bonding to form a loop.

在本实施方式中，封装胶层400亦覆盖光电元件700、第二导线320、第三导电垫140、以及第四导电垫150。因此，封装胶层400亦可避免第二导线320、第三导电垫140、以及第四导电垫150的氧化。另一方面，封装胶层400亦可保护光电元件700与第三导电垫140之间的接合，以及第二导线320与光电元件700或第四导电垫150之间的接合，从而避免剥离情况的发生。In this embodiment, theencapsulant layer 400 also covers thephotoelectric element 700 , thesecond wire 320 , the thirdconductive pad 140 , and the fourthconductive pad 150 . Therefore, theencapsulant layer 400 can also avoid oxidation of thesecond wires 320 , the thirdconductive pads 140 , and the fourthconductive pads 150 . On the other hand, theencapsulant layer 400 can also protect the bonding between theoptoelectronic element 700 and the thirdconductive pad 140, as well as the bonding between thesecond wire 320 and theoptoelectronic element 700 or the fourthconductive pad 150, so as to avoid peeling. occur.

如上所述，相较于先前技术，在此揭露的发光装置10b中，以封装胶层400取代了反射杯体，因此可有效缩小装置的尺寸。举例来说，包含约1毫米×1毫米大小的VCSEL二极管及光电元件的本发明的发光装置的大小可仅为约2.0毫米×2.0毫米。此外，亦可通过封装胶层400的设置，达到上述的避免氧化及剥离情况的功效。As mentioned above, compared with the prior art, in thelight emitting device 10b disclosed herein, the reflective cup body is replaced by theencapsulation adhesive layer 400 , so that the size of the device can be effectively reduced. For example, a light emitting device of the present invention including a VCSEL diode and optoelectronic element having a size of about 1 mm by 1 mm may be only about 2.0 mm by 2.0 mm in size. In addition, the above-mentioned effect of avoiding oxidation and peeling can also be achieved through the disposition of theencapsulation adhesive layer 400 .

由上述发明实施例可知，在此揭露的发光装置中，以封装胶层取代了反射杯体，因此有效地缩小发光装置的尺寸，并阻隔水气及避免氧化及剥离情况的发生。再者，相较于先前技术，本发明的发光装置的制造制程较简化，减少了制程工序并降低生产成本。此外，本发明的发光装置还可包含光电元件，确保发光装置的安全性，避免对人眼的安全造成危害。As can be seen from the above embodiments of the invention, in the light-emitting device disclosed herein, the reflective cup is replaced by an encapsulating adhesive layer, thereby effectively reducing the size of the light-emitting device, blocking moisture, and preventing oxidation and peeling. Furthermore, compared with the prior art, the manufacturing process of the light-emitting device of the present invention is simplified, which reduces the manufacturing process and reduces the production cost. In addition, the light-emitting device of the present invention may further include optoelectronic elements to ensure the safety of the light-emitting device and avoid harm to the safety of human eyes.

上文概述若干实施例的特征，使得熟悉此项技术者可更好地理解本揭露的态样。熟悉此项技术者应了解，可轻易使用本揭露作为设计或修改其他制程及结构的基础，以便实施本文所介绍的实施例的相同目的及/或实现相同优势。熟悉此项技术者亦应认识到，此类等效结构并未脱离本揭露的精神及范畴，且可在不脱离本揭露的精神及范畴的情况下产生本文的各种变化、替代及更改。The foregoing outlines the features of several embodiments so that those skilled in the art may better understand aspects of the present disclosure. Those skilled in the art should appreciate that the present disclosure may be readily utilized as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments described herein. Those skilled in the art should also realize that such equivalent structures do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions and alterations herein can be made without departing from the spirit and scope of the present disclosure.

Claims (10)

1. A light-emitting device, comprising:

a substrate structure including a substrate, a first conductive pad, and a second conductive pad;

a vertical cavity surface emitting laser diode disposed on the substrate structure and electrically connected to the first conductive pad;

a first conductive wire electrically connecting the VCSEL diode and the second conductive pad;

a packaging adhesive layer covering the vertical resonant cavity surface emitting laser diode, the first lead and the substrate structure;

a lens element disposed on the packaging adhesive layer; and

an air gap is located between the lens element and the packaging adhesive layer.

2. The light-emitting device according to claim 1, wherein the lens element comprises:

a carrier; and

and the lens array is arranged under the carrier, and comprises a plurality of lenses.

3. The light-emitting device according to claim 2, wherein each of the lenses has a spherical surface facing the encapsulant layer.

4. The light-emitting device of claim 2, wherein the encapsulant layer has the same refractive index as the lenses.

5. The light-emitting device according to claim 2, wherein the lens element further comprises:

and a support member contacting the carrier and the packaging adhesive layer, wherein a height of the support member is higher than a height of the plurality of lenses.

6. The light-emitting device according to claim 5, wherein the supporting member comprises a silicone adhesive, an epoxy adhesive, an acryl adhesive, or a combination thereof.

7. The light-emitting device according to claim 5, wherein the support member surrounds the lens array, thereby forming the air gap.

8. The light-emitting device of claim 1, wherein the encapsulant is doped with an optical material.

9. The light-emitting device according to claim 1, further comprising:

and the photoelectric element is arranged on the substrate structure and is covered by the packaging adhesive layer.

10. The light-emitting device according to claim 9, further comprising a second conductive line,

the substrate structure further includes a third conductive pad and a fourth conductive pad, the optoelectronic device is electrically connected to the third conductive pad, and the second wire is electrically connected to the optoelectronic device and the fourth conductive pad.

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