CN111367129A

Movatterモバイル変換

Info

Publication number: CN111367129A
Application number: CN202010272960.9A
Authority: CN
Inventors: 汤爱华
Original assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2020-04-09
Filing date: 2020-04-09
Publication date: 2020-07-03

Abstract

Translated fromChinese

本发明提供一种扇出走线结构及显示面板，所述扇出走线结构，具有扇出走线，所述扇出走线包括第一走线、第二走线以及第三走线；其中,所述第二走线设于与所述第一走线的上方且与所述第一走线交错排列，所述第三走线对应地设于第二走线的上方且在所述第一走线上的投影完全落入所述第一走线范围内；或者所述第二走线设于与所述第一走线的上方且与所述第一走线部分重叠，所述第三走线设于所述第二走线的上方且与所述第二走线部分重叠；或者所述第二走线设于与所述第一走线的上方且与所述第一走线部分重叠，所述第三走线设于所述第一走线的上方且与所述第一走线部分重叠。

The present invention provides a fan-out wiring structure and a display panel. The fan-out wiring structure has a fan-out wiring, and the fan-out wiring includes a first wiring, a second wiring and a third wiring; wherein, the The second wiring is arranged above the first wiring and staggered with the first wiring, and the third wiring is correspondingly arranged above the second wiring and on the first wiring The projection on it completely falls within the range of the first trace; or the second trace is arranged above the first trace and partially overlaps with the first trace, and the third trace set above the second trace and partially overlap with the second trace; or the second trace is set above the first trace and partially overlap with the first trace, The third wiring is disposed above the first wiring and partially overlaps the first wiring.

Description

Translated fromChinese

扇出走线结构及显示面板Fan-out wiring structure and display panel

技术领域technical field

本申请涉及显示技术领域，尤其涉及一种扇出走线结构及显示面板。The present application relates to the field of display technology, and in particular, to a fan-out wiring structure and a display panel.

背景技术Background technique

液晶面板是液晶显示装置的重要组件，在背光模组的配合以及驱动电路的驱动下下，液晶面板能够显示出图像。The liquid crystal panel is an important component of the liquid crystal display device. Under the cooperation of the backlight module and the driving of the driving circuit, the liquid crystal panel can display images.

在液晶面板的阵列基板上设置有TFT阵列区域，TFT阵列区域内布满了信号线以及TFT，驱动电路板通过扇出线(fanout line)将阵列基板的信号线与驱动电路板的焊脚连接，而扇出线的设置区域则称为扇出区(fanout area)。A TFT array area is arranged on the array substrate of the liquid crystal panel. The TFT array area is covered with signal lines and TFTs. The drive circuit board connects the signal lines of the array substrate with the solder pins of the drive circuit board through fanout lines. The setting area of the fanout line is called the fanout area.

如图2所示，现有扇出区的单层金属走线结构包括：基板101、设于所述基板101上多条平行间隔排列的第一扇出线102、覆盖所述基板101和第一扇出线102的绝缘层103、设于所述绝缘层103上的第一钝化层104以及设于第一钝化层104上的第二钝化层105。如图 1所示，图1为扇出区的单层金属走线的平面图，所有第一扇出线102 均位于同一金属层，并且任意相邻两条第一扇出线102彼此不重叠。然而，第一扇出线102间无重叠会导致扇出结构整体高度的增加，从而不利于液晶显示面板的窄边框化。As shown in FIG. 2 , the existing single-layer metal wiring structure of the fan-out area includes: asubstrate 101 , a plurality of first fan-outlines 102 arranged on thesubstrate 101 in parallel and spaced apart, covering thesubstrate 101 and the first fan-outlines 102 . Theinsulating layer 103 of the fan-outline 102 , thefirst passivation layer 104 disposed on theinsulating layer 103 , and thesecond passivation layer 105 disposed on thefirst passivation layer 104 . As shown in FIG. 1 , which is a plan view of a single-layer metal trace in the fan-out area, all the first fan-outlines 102 are located in the same metal layer, and any two adjacent first fan-outlines 102 do not overlap each other. However, the lack of overlap between the first fan-outlines 102 will lead to an increase in the overall height of the fan-out structure, which is not conducive to narrowing the frame of the liquid crystal display panel.

然而，现有技术中，由于窄边框的液晶显示面板的边框(border) 空间受限，在相同的制程条件下，扇出区的走线结构会采用同层金属，并选择双层金属走线来减少同一膜层的走线数量，缓解同膜层的布线压力，实现对Fanout高度的压缩。如图4所示，现有的扇出区的单层金属走线结构包括单层金属走线结构的大部分技术特征，其区别在于，还包括第二扇出线106，设于绝缘层106与第一钝化层104之间，且与第一扇出线102交错设置。如图3所示，图3为扇出区的双层金属走线的平面图，采用双层金属走线来减少同一膜层的走线数量，缓解同膜层的布线压力，有利于实现对扇出结构整体高度的压缩。However, in the prior art, due to the limited space of the border of the liquid crystal display panel with a narrow frame, under the same process conditions, the wiring structure of the fan-out area adopts the same layer of metal, and selects double-layer metal wiring. To reduce the number of traces on the same film layer, ease the wiring pressure on the same film layer, and achieve high compression of Fanout. As shown in FIG. 4 , the existing single-layer metal wiring structure of the fan-out region includes most of the technical features of the single-layer metal wiring structure, and the difference lies in that it also includes a second fan-outline 106 , which is arranged between theinsulating layer 106 and theinsulating layer 106 . Thefirst passivation layers 104 are interlaced with the first fan-outlines 102 . As shown in Figure 3, Figure 3 is a plan view of the double-layer metal wiring in the fan-out area. Double-layer metal wiring is used to reduce the number of wirings on the same film layer, relieve the wiring pressure on the same film layer, and facilitate the realization of fan Compression of the overall height of the structure.

为了追求边框的极致压缩，扇出区的双层金属走线设计已无法满足极窄边框的要求。In order to pursue the ultimate compression of the frame, the double-layer metal trace design in the fan-out area can no longer meet the requirements of the extremely narrow frame.

发明内容SUMMARY OF THE INVENTION

本发明的目的在于，提供一种扇出走线结构及显示面板，以解决现有扇出区的双层金属走线设计无法满足显示面板边框的极窄压缩的技术问题。The purpose of the present invention is to provide a fan-out wiring structure and a display panel, so as to solve the technical problem that the double-layer metal wiring design of the existing fan-out area cannot meet the extremely narrow compression of the frame of the display panel.

为实现上述目的，本发明提供一种扇出走线结构，具有扇出走线，所述扇出走线包括第一走线、第二走线以及第三走线；其中,所述第二走线设于与所述第一走线的上方且与所述第一走线交错排列，所述第三走线对应地设于第二走线的上方且在所述第一走线上的投影完全落入所述第一走线范围内；或者所述第二走线设于与所述第一走线的上方且与所述第一走线部分重叠，所述第三走线设于所述第二走线的上方且与所述第二走线部分重叠；或者所述第二走线设于与所述第一走线的上方且与所述第一走线部分重叠，所述第三走线设于所述第一走线的上方且与所述第一走线部分重叠。In order to achieve the above object, the present invention provides a fan-out routing structure, which has a fan-out routing, and the fan-out routing includes a first routing, a second routing and a third routing; wherein, the second routing is set. Above the first trace and staggered with the first trace, the third trace is correspondingly disposed above the second trace and the projection on the first trace completely falls. within the range of the first wiring; or the second wiring is arranged above the first wiring and partially overlaps the first wiring, and the third wiring is arranged on the first wiring Above the two traces and partially overlapping the second trace; or the second trace is arranged above the first trace and partially overlapping the first trace, the third trace The wire is arranged above the first wire and partially overlapped with the first wire.

进一步地，当所述第三走线对应地设于第二走线的上方且在所述第一走线上的投影完全落入所述第一走线范围内时，所述扇出走线还包括：第一基板；述第一走线设于所述第一基板上；第一绝缘层，设于所述第一走线上，且完全覆盖所述第一走线；所述第二走线设于所述第一绝缘层上，且位于两条第一走线之间；一钝化层，设于所述第二走线上，且完全覆盖所述第二走线；以及所述第三走线设于所述第一钝化层上，且所述第三走线在所述第一走线上的投影与所述第一走线完全重叠。Further, when the third wiring is correspondingly disposed above the second wiring and the projection on the first wiring completely falls within the range of the first wiring, the fan-out wiring is also It includes: a first substrate; the first wiring is arranged on the first substrate; a first insulating layer is arranged on the first wiring and completely covers the first wiring; the second wiring wires are arranged on the first insulating layer and located between two first wires; a passivation layer is arranged on the second wires and completely covers the second wires; and the The third trace is disposed on the first passivation layer, and the projection of the third trace on the first trace completely overlaps with the first trace.

进一步地，所述第一绝缘层包括：第一凸起，突出于所述第一走线的表面；以及第一凹槽，设于两个第一凸起之间；其中，所述第二走线设于所述第一凹槽内，贴附所述第一凹槽的底壁。Further, the first insulating layer includes: a first protrusion, protruding from the surface of the first wiring; and a first groove, located between the two first protrusions; wherein, the second The wiring is arranged in the first groove and attached to the bottom wall of the first groove.

进一步地，当所述第三走线设于所述第二走线的上方且与所述第二走线部分重叠时，所述扇出走线还包括：第二基板；所述第一走线设于所述第二基板上；第二绝缘层，设于所述第一走线上，且完全覆盖所述第一走线；所述第二走线设于所述第二绝缘层上，且所述第二走线在所述第一走线上的投影与所述第一走线部分重叠；第二钝化层，设于所述第二走线上，且完全覆盖所述第二走线；以及所述第三走线设于所述第二钝化层上。Further, when the third wiring is arranged above the second wiring and partially overlaps the second wiring, the fan-out wiring further comprises: a second substrate; the first wiring is arranged on the second substrate; a second insulating layer is arranged on the first wiring and completely covers the first wiring; the second wiring is arranged on the second insulating layer, and the projection of the second trace on the first trace overlaps with the first trace; a second passivation layer is disposed on the second trace and completely covers the second trace wiring; and the third wiring is arranged on the second passivation layer.

进一步地，所述第二绝缘层包括：第二凸起，突出于所述第一走线的表面；以及第二凹槽，设于两个第二凸起之间；其中，所述第二走线从所述第二凸起的顶面延伸至所述第二凹槽的底壁。Further, the second insulating layer includes: a second protrusion, protruding from the surface of the first wiring; and a second groove, located between the two second protrusions; wherein, the second The traces extend from the top surface of the second protrusion to the bottom wall of the second groove.

进一步地，所述第二钝化层包括：第三凸起，突出于所述第二走线的表面；以及第三凹槽，设于两个第三凸起之间，且所述第三凹槽在所述第二槽上的投影与所述第二凹槽部分重叠；其中，所述第三走线从所述第三凸起的顶面延伸至所述第三凹槽的底壁。Further, the second passivation layer includes: a third protrusion, protruding from the surface of the second wiring; and a third groove, located between two third protrusions, and the third The projection of the groove on the second groove partially overlaps with the second groove; wherein, the third trace extends from the top surface of the third protrusion to the bottom wall of the third groove .

进一步地，当所述第三走线设于所述第一走线的上方且与所述第一走线部分重叠时，所述扇出走线还包括：第三基板；所述第一走线设于所述第三基板上；第三绝缘层，设于所述第一走线上，且完全覆盖所述第一走线；所述第二走线设于所述第三绝缘层上，且所述第二走线在所述第一走线上的投影与所述第一走线部分重叠；第三钝化层，设于所述第二走线上；以及所述第三走线设于所述第三钝化层上。Further, when the third wiring is arranged above the first wiring and partially overlaps the first wiring, the fan-out wiring further includes: a third substrate; the first wiring is arranged on the third substrate; a third insulating layer is arranged on the first wiring and completely covers the first wiring; the second wiring is arranged on the third insulating layer, and the projection of the second trace on the first trace overlaps with the first trace; a third passivation layer is disposed on the second trace; and the third trace on the third passivation layer.

进一步地，所述第三绝缘层包括：第四凸起，突出于所述第一走线的表面；以及第四凹槽，设于两个第四凸起之间；其中，所述第二走线从所述第四凸起的顶面延伸至所述第四凹槽的底壁。Further, the third insulating layer includes: a fourth protrusion, protruding from the surface of the first wiring; and a fourth groove, located between two fourth protrusions; wherein, the second The traces extend from the top surface of the fourth protrusion to the bottom wall of the fourth groove.

进一步地，所述第三钝化层包括：第五凸起，突出于所述第二走线的表面；以及第五凹槽，设于两个第五凸起之间；其中，所述第三走线从所述第五凹槽的槽壁延伸至所述第五凹槽的底壁，所述第三走线与所述第二走线交错设置。Further, the third passivation layer includes: a fifth protrusion, protruding from the surface of the second wiring; and a fifth groove, located between two fifth protrusions; wherein, the first Three traces extend from the groove wall of the fifth groove to the bottom wall of the fifth groove, and the third traces and the second traces are staggered.

为实现上述目的，本发明还提供一种显示面板，包括扇出区，所述扇出区前文所述的扇出走线。In order to achieve the above object, the present invention further provides a display panel, which includes a fan-out area, and the fan-out wiring in the fan-out area is described above.

本发明的技术效果在于，提供一种扇出走线结构及显示面板，在第一钝化层与第二钝化层之间增加一层走线，以实现三层走线的扇出走线结构，并于该走线来分摊另外两层的走线数量，从而进一步压缩扇出走线结构的高度，有利于具有该扇出结构的显示面板的窄边框化，同时也不会影响扇出区的开口率。The technical effect of the present invention is to provide a fan-out wiring structure and a display panel. A layer of wiring is added between the first passivation layer and the second passivation layer to realize a fan-out wiring structure with three layers of wiring. The number of traces of the other two layers is distributed among the traces, thereby further reducing the height of the fan-out trace structure, which is beneficial to the narrow frame of the display panel with the fan-out structure, and will not affect the opening of the fan-out area. Rate.

附图说明Description of drawings

下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。The technical solutions and other beneficial effects of the present application will be apparent through the detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings.

图1为现有技术所述扇出走线结构单层金属层的结构示意图。FIG. 1 is a schematic structural diagram of a single-layer metal layer of a fan-out wiring structure according to the prior art.

图2为图1沿A-A’方向的所述扇出走线结构的截面图。Fig. 2 is a cross-sectional view of the fan-out routing structure in the direction A-A' of Fig. 1 .

图3为现有技术所述扇出走线结构双层金属层的结构示意图。FIG. 3 is a schematic structural diagram of a double-layer metal layer of the fan-out wiring structure in the prior art.

图4为图3沿B-B’方向的所述扇出走线结构的截面图。FIG. 4 is a cross-sectional view of the fan-out routing structure in the direction B-B' of FIG. 3 .

图5为本申请所述显示面板的结构示意图。FIG. 5 is a schematic structural diagram of the display panel according to the present application.

图6实施例1所述扇出走线结构的结构示意图。6 is a schematic structural diagram of the fan-out routing structure according toEmbodiment 1.

图7为图6沿C-C’方向的所述扇出走线结构的截面图。FIG. 7 is a cross-sectional view of the fan-out routing structure of FIG. 6 along the C-C' direction.

图8为实施例2所述扇出走线结构的结构示意图。FIG. 8 is a schematic structural diagram of the fan-out wiring structure according toEmbodiment 2. FIG.

图9为图8沿D-D’方向的所述扇出走线结构的截面图。FIG. 9 is a cross-sectional view of the fan-out routing structure of FIG. 8 along the D-D' direction.

图10为实施例3所述扇出走线结构的结构示意图。FIG. 10 is a schematic structural diagram of the fan-out wiring structure according toEmbodiment 3. FIG.

图11为图10沿E-E’方向的所述扇出走线结构的截面图。FIG. 11 is a cross-sectional view of the fan-out routing structure in the direction E-E' of FIG. 10 .

附图部分标识如下：Parts of the attached drawings are identified as follows:

101基板；102第一扇出线；103绝缘层；101 substrate; 102 first fan-out line; 103 insulating layer;

104第一钝化层；105第二钝化层；106第二扇出线；104 the first passivation layer; 105 the second passivation layer; 106 the second fan-out line;

1000显示面板；11TFT阵列区；12驱动电路板；13扇出区；1000 display panel; 11TFT array area; 12 driver circuit board; 13 fan-out area;

1第一走线；2第二走线；3第三走线；1 The first line; 2 The second line; 3 The third line;

10绑定端子；20接入端子；10 binding terminals; 20 access terminals;

100第一扇出走线；200第二扇出走线；300第三扇出走线；100 first fan-out routing; 200 second fan-out routing; 300 third fan-out routing;

110第一基板；120第一绝缘层；130第一钝化层；140第四钝化层；110 first substrate; 120 first insulating layer; 130 first passivation layer; 140 fourth passivation layer;

1101第一凸起；1102第一凹槽；1101 the first protrusion; 1102 the first groove;

210第二基板；220第二绝缘层；230第二钝化层；240第五钝化层；210 second substrate; 220 second insulating layer; 230 second passivation layer; 240 fifth passivation layer;

2101第二凸起；2102第二凹槽；2101 The second protrusion; 2102 The second groove;

2301第三凸起；2302第三凹槽；2301 the third protrusion; 2302 the third groove;

310第三基板；320第三绝缘层；330第三钝化层；340第六钝化层；310 third substrate; 320 third insulating layer; 330 third passivation layer; 340 sixth passivation layer;

3201第四凸起；3202第四凹槽；3201 the fourth protrusion; 3202 the fourth groove;

3301第五凸起；3302第五凹槽。3301 fifth protrusion; 3302 fifth groove.

具体实施方式Detailed ways

下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。In this application, unless otherwise expressly specified and defined, a first feature "on" or "under" a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和 /或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the application. Furthermore, this application may repeat reference numerals and/or reference letters in various instances for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, this application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

如图5所示，本实施例提供一种显示面板，该显示面板为液晶面板，包括TFT阵列区、驱动电路板以及扇出区。其中，在液晶面板的阵列基板上设置有TFT阵列区，TFT阵列区内布满了信号线以及 TFT，驱动电路板通过扇出走线(fanout line)将阵列基板的信号线与驱动电路板的焊脚连接，而扇出走线的设置区域则称为扇出区。As shown in FIG. 5 , this embodiment provides a display panel, which is a liquid crystal panel, and includes a TFT array area, a driving circuit board, and a fan-out area. A TFT array area is set on the array substrate of the liquid crystal panel, the TFT array area is covered with signal lines and TFTs, and the drive circuit board connects the signal lines of the array substrate to the drive circuit board through fanout lines. The pin connection, and the setting area of the fan-out trace is called the fan-out area.

实施例1Example 1

如图6所示，本实施例提供一种扇出走线结构，具有第一扇出走线100，其中,所述扇出走线的一端连接至一驱动电路板的绑定端子 (bonding pad)10，其另一端连接至TFT阵列区的接入端子20。第一扇出走线100包括第一走线1、第二走线2以及第三走线3，第二走线2设于与第一走线1的上方且与第一走线1交错排列，第三走线 3对应地设于第二走线2的上方且在第一走线1上的投影完全落入第一走线1范围内。换句话来说，第一走线1与第二走线2交错排列，第三走线3在第一走线1上的垂直投影与第一走线1相互重叠的布线方式。As shown in FIG. 6 , the present embodiment provides a fan-out wiring structure with a first fan-out wiring 100, wherein one end of the fan-out wiring is connected to abonding pad 10 of a driving circuit board, The other end thereof is connected to theaccess terminal 20 of the TFT array region. The first fan-out trace 100 includes afirst trace 1 , asecond trace 2 and athird trace 3 . Thesecond trace 2 is arranged above thefirst trace 1 and is staggered with thefirst trace 1 . Thethird trace 3 is correspondingly disposed above thesecond trace 2 and the projection on thefirst trace 1 completely falls within the range of thefirst trace 1 . In other words, thefirst trace 1 and thesecond trace 2 are alternately arranged, and the vertical projection of thethird trace 3 on thefirst trace 1 overlaps with thefirst trace 1.

如图7所示，当第三走线3对应地设于第二走线2的上方且在第一走线1上的投影完全落入第一走线1范围内时，第一扇出走线100 包括第一基板110、第一绝缘层120、第一钝化层130以及第四钝化层140。As shown in FIG. 7 , when thethird trace 3 is correspondingly disposed above thesecond trace 2 and the projection on thefirst trace 1 completely falls within the range of thefirst trace 1, the first fan-out trace 100 includes afirst substrate 110 , a first insulatinglayer 120 , afirst passivation layer 130 and afourth passivation layer 140 .

第一基板110为玻璃基板。Thefirst substrate 110 is a glass substrate.

第一走线1设于第一基板110上。第一走线1由一金属层图案化形成。Thefirst trace 1 is disposed on thefirst substrate 110 . Thefirst trace 1 is formed by patterning a metal layer.

第一绝缘层110图案化设于第一走线1上，且完全覆盖第一走线 1。第一绝缘层110包括第一凸起1101以及第一凹槽1102。第一凸起 1101突出于第一走线1的表面。第一凹槽1102设于两个第一凸起1101 之间。第一绝缘层110的材质为无机材料，用以第一走线1绝缘第二走线2，防止发生短路现象。The first insulatinglayer 110 is patterned on thefirst trace 1 and completely covers thefirst trace 1. The first insulatinglayer 110 includes afirst protrusion 1101 and afirst groove 1102 . Thefirst protrusion 1101 protrudes from the surface of thefirst trace 1. Thefirst groove 1102 is formed between the twofirst protrusions 1101 . The material of the first insulatinglayer 110 is an inorganic material, and is used to insulate thefirst wiring 1 and thesecond wiring 2 to prevent short circuit phenomenon.

第二走线2设于第一绝缘层120上，且位于两条第一走线1之间，第二走线2由一金属层图案化形成。其中，第二走线2设于第一凹槽 1102内，贴附于第一凹槽1102的底壁，使得第二走线2和第一走线 1交错排列。Thesecond trace 2 is disposed on the first insulatinglayer 120 and located between the twofirst traces 1 , and thesecond trace 2 is formed by patterning a metal layer. Wherein, thesecond wiring 2 is arranged in thefirst groove 1102, and is attached to the bottom wall of thefirst groove 1102, so that thesecond wiring 2 and thefirst wiring 1 are staggered.

第一钝化层130图案化设于第二走线2上，且完全覆盖第二走线 2。第一钝化层130的材质为无机材料，用以第二走线2绝缘第三走线3，防止发生短路现象。Thefirst passivation layer 130 is patterned on thesecond trace 2 and completely covers thesecond trace 2 . The material of thefirst passivation layer 130 is an inorganic material, and is used to insulate thesecond wire 2 from thethird wire 3 to prevent short circuit.

第三走线3设于第一钝化层130上，第三走线3在第一走线1上的投影完全落入第一走线1范围内，第三走线在第一走线上的垂直投影与第一走线1完全重叠。Thethird trace 3 is disposed on thefirst passivation layer 130, the projection of thethird trace 3 on thefirst trace 1 completely falls within the range of thefirst trace 1, and the third trace is on the first trace The vertical projection of 1 completely overlaps with thefirst trace 1.

第四钝化层140图案化设于第三走线3上，且完全覆盖第三走线 3，其材质为无机材料。Thefourth passivation layer 140 is patterned on thethird wiring 3, and completely covers thethird wiring 3, and its material is an inorganic material.

本实施例中，所述第一走线、所述第二走线以及第三走线的材质均为同种金属，金属优选为铜、铝、钼等。所述第一绝缘层、所述第一钝化层以及所述第四钝化层的材质均为无机材料，除了起绝缘作用，还可以阻隔水氧，防止水氧入侵腐蚀金属走线。In this embodiment, the materials of the first wiring, the second wiring and the third wiring are all the same metal, and the metal is preferably copper, aluminum, molybdenum, or the like. The materials of the first insulating layer, the first passivation layer and the fourth passivation layer are all inorganic materials, which not only play an insulating role, but also can block water and oxygen, and prevent water and oxygen from invading and corroding metal wires.

与现有技术相比，本实施例提供一种扇出走线结构及显示面板，第一走线、第二走线和第三走线分别位于不同的金属层上，采用第一走线与第二走线交错排列，第三走线在第一金属走线上的投影与第一走线完全重叠的布线方式，利用第三走线来分摊另外两层的走线数量，从而进一步压缩扇出走线结构的高度，有利于具有该扇出结构的显示面板的窄边框化，同时也不会影响扇出区的开口率。Compared with the prior art, the present embodiment provides a fan-out wiring structure and a display panel. The first wiring, the second wiring and the third wiring are respectively located on different metal layers. The two traces are staggered, and the projection of the third trace on the first metal trace completely overlaps with the first trace. The third trace is used to share the number of traces on the other two layers, thereby further compressing the fan-out routing. The height of the line structure is beneficial to the narrow frame of the display panel with the fan-out structure, and at the same time, the aperture ratio of the fan-out area is not affected.

实施例2Example 2

如图8所示，本实施例提供一种扇出走线结构，具有第二扇出走线200，其中,所述扇出走线的一端连接至一驱动电路板的绑定端子 (bonding pad)10，其另一端连接至TFT阵列区的接入端子20。第二扇出走线200包括第一走线1、第二走线2以及第三走线3，第二走线2设于与第一走线1的上方且与第一走线1部分重叠，第三走线 3设于第二走线2的上方且与第二走线2部分重叠。As shown in FIG. 8 , the present embodiment provides a fan-out wiring structure with a second fan-out wiring 200, wherein one end of the fan-out wiring is connected to abonding pad 10 of a driving circuit board, The other end thereof is connected to theaccess terminal 20 of the TFT array region. The second fan-out trace 200 includes afirst trace 1 , asecond trace 2 and athird trace 3 . Thesecond trace 2 is disposed above thefirst trace 1 and partially overlaps with thefirst trace 1 . Thethird trace 3 is disposed above thesecond trace 2 and partially overlaps with thesecond trace 2 .

如图9所示，当第三走线3设于第二走线2的上方且与第二走线 2部分重叠时，第二扇出走线200还包括第二基板210、第二绝缘层 220、第二钝化层230以及第五钝化层240。As shown in FIG. 9 , when thethird trace 3 is disposed above thesecond trace 2 and partially overlaps with thesecond trace 2 , the second fan-out trace 200 further includes asecond substrate 210 and a second insulatinglayer 220 , thesecond passivation layer 230 and thefifth passivation layer 240 .

第二基板210为玻璃基板。Thesecond substrate 210 is a glass substrate.

第一走线210设于第二基板210上。第一走线210由一金属层图案化形成。The first traces 210 are disposed on thesecond substrate 210 . The first traces 210 are formed by patterning a metal layer.

第二绝缘层220设于第一走线210上，且完全覆盖第一走线210。所述第二绝缘层220包括第二凸起2101以及第二凹槽2102。第二凸起2101突出于第一走线1的表面。第二凹槽2102设于两个第二凸起 2101之间。第二绝缘层210的材质为无机材料，用以第一走线1绝缘第二走线2，防止发生短路现象。The secondinsulating layer 220 is disposed on thefirst traces 210 and completely covers the first traces 210 . The secondinsulating layer 220 includes a second protrusion 2101 and a second groove 2102 . The second protrusion 2101 protrudes from the surface of thefirst trace 1 . The second groove 2102 is formed between the two second protrusions 2101. The material of the second insulatinglayer 210 is an inorganic material, and is used for thefirst wiring 1 to insulate thesecond wiring 2 to prevent short circuit.

第二走线2设于第二绝缘层220上，且第二走线2在第一走线1上的投影与第一走线1部分重叠。其中，第二走线2从第二凸起 2101的顶面延伸至第二凹槽2102的底壁。具体的，第二走线2覆盖部分第二凸起2101的顶面并延伸至部分第二凹槽2102的底壁，使得第二走线2与第一走线1部分重叠。第二走线2的纵向截面图为Z 型结构。Thesecond trace 2 is disposed on the second insulatinglayer 220 , and the projection of thesecond trace 2 on thefirst trace 1 partially overlaps with thefirst trace 1 . Thesecond wiring 2 extends from the top surface of the second protrusion 2101 to the bottom wall of the second groove 2102. Specifically, thesecond trace 2 covers part of the top surface of the second protrusion 2101 and extends to part of the bottom wall of the second groove 2102 , so that thesecond trace 2 partially overlaps thefirst trace 1 . The longitudinal cross-sectional view of thesecond wiring 2 is a Z-shaped structure.

第二钝化层230设于第二走线2上，且完全覆盖第二走线2。第二钝化层230的材质为无机材料，用以第一走线1绝缘第二走线2，防止发生短路现象。第二钝化层230包括第三凸起2301以及第三凹槽2302。第三凸起2301突出于所述第二走线的表面。第三凹槽2302 设于两个第三凸起2301之间，且第三凹槽2302在第二槽2102上的投影与第二凹槽2102部分重叠。Thesecond passivation layer 230 is disposed on thesecond trace 2 and completely covers thesecond trace 2 . The material of thesecond passivation layer 230 is an inorganic material, and is used to insulate thefirst trace 1 from thesecond trace 2 to prevent short circuit. Thesecond passivation layer 230 includes athird protrusion 2301 and athird groove 2302 . Thethird protrusion 2301 protrudes from the surface of the second trace. Thethird groove 2302 is disposed between the twothird protrusions 2301 , and the projection of thethird groove 2302 on the second groove 2102 partially overlaps with the second groove 2102 .

第三走线3设于第二钝化层220上。其中，第三走线3从第三凸起2301的顶面延伸至第三凹槽2302的底壁。具体的，第三走线3覆盖部分第三凸起2301的顶面并延伸至部分第三凹槽2302的底壁，使得第三走线3在第二走线上的投影与第二走线2部分重叠。第三走线 2的纵向截面图为Z型结构。Thethird wiring 3 is disposed on thesecond passivation layer 220 . Thethird wiring 3 extends from the top surface of thethird protrusion 2301 to the bottom wall of thethird groove 2302 . Specifically, thethird trace 3 covers part of the top surface of thethird protrusion 2301 and extends to part of the bottom wall of thethird groove 2302, so that the projection of thethird trace 3 on the second trace is the same as that of thesecond trace 2 parts overlap. The longitudinal cross-sectional view of thethird wiring 2 is a Z-shaped structure.

第五钝化层240图案化设于第二钝化层230上，且完全覆盖第三走线3，其材质为无机材料。Thefifth passivation layer 240 is patterned on thesecond passivation layer 230 and completely covers thethird traces 3 , and is made of inorganic materials.

本实施例中，所述第一走线、所述第二走线以及第三走线的材质均为同种金属，金属优选为铜、铝、钼等。所述第二绝缘层、所述第二钝化层以及所述第五钝化层的材质均为无机材料，除了起绝缘作用，还可以阻隔水氧，防止水氧入侵腐蚀金属走线。In this embodiment, the materials of the first wiring, the second wiring and the third wiring are all the same metal, and the metal is preferably copper, aluminum, molybdenum, or the like. The materials of the second insulating layer, the second passivation layer and the fifth passivation layer are all inorganic materials, which not only play an insulating role, but also can block water and oxygen, and prevent water and oxygen from invading and corroding metal wires.

与现有技术相比，本实施例提供一种扇出走线结构及显示面板，采用三层走线部分重叠的布线方式，即第二走线在第一走线上的投影与第一走线部分重叠，第三走线在第二走线上的投影与第二走线部分重叠，从而避免三层走线完全重叠产生段差(段差指两层走线间的地势差)，容易出现过电流、走线短路等现象，因此可有效减少扇出结构的整体高度，有利于具有该扇出结构的显示面板的窄边框化。Compared with the prior art, the present embodiment provides a fan-out wiring structure and a display panel, which adopts a wiring method in which three layers of wiring are partially overlapped, that is, the projection of the second wiring on the first wiring and the Partially overlapping, the projection of the third trace on the second trace partially overlaps with the second trace, so as to avoid the complete overlap of the three-layer traces resulting in a stage difference (the stage difference refers to the ground potential difference between the two-layer traces), which is prone to overcurrent Therefore, the overall height of the fan-out structure can be effectively reduced, which is beneficial to the narrow frame of the display panel with the fan-out structure.

实施例3Example 3

如图10所示，本实施例提供一种扇出走线结构，具有第三扇出走线300，其中,所述扇出走线的一端连接至一驱动电路板的绑定端子(bonding pad)10，其另一端连接至TFT阵列区的接入端子20。第一扇出走线100包括第一走线1、第二走线2以及第三走线3，第二走线2设于与第一走线1的上方且与第一走线1部分重叠，第三走线3设于第一走线1的上方且与第一走线1部分重叠。As shown in FIG. 10 , the present embodiment provides a fan-out wiring structure with a third fan-out wiring 300, wherein one end of the fan-out wiring is connected to abonding pad 10 of a driving circuit board, The other end thereof is connected to theaccess terminal 20 of the TFT array region. The first fan-out trace 100 includes afirst trace 1 , asecond trace 2 and athird trace 3 . Thesecond trace 2 is arranged above thefirst trace 1 and partially overlaps with thefirst trace 1 . Thethird trace 3 is disposed above thefirst trace 1 and partially overlaps thefirst trace 1 .

如图11所示，当第三走线3设于第一走线1的上方且与第一走线1部分重叠时，第一扇出走线100还包括第三基板310、第三绝缘层320、第三钝化层330以及第六钝化层340。As shown in FIG. 11 , when thethird trace 3 is disposed above thefirst trace 1 and partially overlaps thefirst trace 1 , the first fan-out trace 100 further includes athird substrate 310 and a thirdinsulating layer 320 , thethird passivation layer 330 and thesixth passivation layer 340 .

第三基板310为玻璃基板。Thethird substrate 310 is a glass substrate.

第一走线1设于第三基板310上。第一走线1由一金属层图案化形成。Thefirst trace 1 is disposed on thethird substrate 310 . Thefirst trace 1 is formed by patterning a metal layer.

第三绝缘层320图案化设于第一走线1上，且完全覆盖第一走线 1。第三绝缘层320包括第四凸起3201以及第四凹槽3202。第四凸起3201突出于第一走线1的表面。第四凹槽3202设于两个第四凸起 3201之间。The thirdinsulating layer 320 is patterned on thefirst trace 1 and completely covers thefirst trace 1. The thirdinsulating layer 320 includesfourth protrusions 3201 and fourth grooves 3202 . Thefourth protrusion 3201 protrudes from the surface of thefirst trace 1 . The fourth groove 3202 is provided between the twofourth protrusions 3201.

第二走线2设于第三绝缘层320上，且第二走线2在第一走线1 上的投影与第一走线1部分重叠。其中，第二走线2从第四凸起3201 的顶面延伸至第四凹槽3202的底壁。具体的，第二走线2覆盖部分第四凸起3201的顶面并延伸至部分第四凹槽3202的底壁，使得第二走线2与第一走线1部分重叠。第二走线2的纵向截面图为Z型结构。Thesecond trace 2 is disposed on the third insulatinglayer 320 , and the projection of thesecond trace 2 on thefirst trace 1 partially overlaps with thefirst trace 1 . Thesecond trace 2 extends from the top surface of thefourth protrusion 3201 to the bottom wall of the fourth groove 3202 . Specifically, thesecond trace 2 covers part of the top surface of thefourth protrusion 3201 and extends to part of the bottom wall of the fourth groove 3202 , so that thesecond trace 2 partially overlaps thefirst trace 1 . The longitudinal cross-sectional view of thesecond wiring 2 is a Z-shaped structure.

第三钝化层330图案化设于第二走线2上。第三钝化层330的材质为无机材料，用以第一走线1绝缘第二走线2，防止发生短路现象。第三钝化层330包括第五凸起3301以及第五凹槽3302。第五凸起 3301突出于所述第二走线的表面。第五凹槽3302设于两个第五凸起3301之间。其中，第三走线3从第五凹槽3302的槽壁延伸至第五凹槽3302的底壁，第三走线3与第二走线2交错设置。Thethird passivation layer 330 is patterned on thesecond trace 2 . The material of thethird passivation layer 330 is an inorganic material, and is used to insulate thefirst trace 1 from thesecond trace 2 to prevent short circuit. Thethird passivation layer 330 includesfifth protrusions 3301 andfifth grooves 3302 . Thefifth protrusion 3301 protrudes from the surface of the second trace. Thefifth groove 3302 is formed between the twofifth protrusions 3301 . The third traces 3 extend from the groove wall of thefifth groove 3302 to the bottom wall of thefifth groove 3302 , and thethird traces 3 and thesecond traces 2 are staggered.

第三走线3设于第三钝化层330上，第三走线3在第一走线上的投影与第一走线部分重合，第三走线3与第二走线2交错设置。The third traces 3 are disposed on thethird passivation layer 330 , the projections of thethird traces 3 on the first traces overlap with the first traces, and thethird traces 3 and thesecond traces 2 are staggered.

第六钝化层340图案化设于第三走线3上，且完全覆盖第三走线 3，其材质为无机材料。Thesixth passivation layer 340 is patterned on thethird wiring 3 and completely covers thethird wiring 3, and its material is an inorganic material.

本实施例中，所述第一走线、所述第二走线以及第三走线的材质均为同种金属，金属优选为铜、铝、钼等。所述第三绝缘层、所述第三钝化层以及所述第六钝化层的材质均为无机材料，除了起绝缘作用，还可以阻隔水氧，防止水氧入侵腐蚀金属走线。In this embodiment, the materials of the first wiring, the second wiring and the third wiring are all the same metal, and the metal is preferably copper, aluminum, molybdenum, or the like. The materials of the third insulating layer, the third passivation layer and the sixth passivation layer are all inorganic materials, which not only play an insulating role, but also block water and oxygen, and prevent water and oxygen from invading and corroding metal wires.

与现有技术相比，本实施例提供一种扇出走线结构及显示面板，第一走线、第二走线和第三走线分别位于不同的金属层上，采用第三走线在第一走线上的投影与第一走线部分重合，第三走线与第二走线交错设置的布线方式，从而避免三层走线完全重叠产生段差(段差指两层走线间的地势差)，容易出现过电流、走线短路等现象，因此可有效减少扇出结构的整体高度，有利于具有该扇出结构的显示面板的窄边框化。Compared with the prior art, this embodiment provides a fan-out wiring structure and a display panel. The first wiring, the second wiring and the third wiring are respectively located on different metal layers, and the third wiring is used in the first wiring. The projection on the first trace overlaps with the first trace, and the third trace and the second trace are alternately arranged, so as to avoid the complete overlap of the three-layer traces and the level difference (the level difference refers to the terrain difference between the two-layer traces) ), overcurrent, wiring short circuit and other phenomena are prone to occur, so the overall height of the fan-out structure can be effectively reduced, which is beneficial to the narrow frame of the display panel with the fan-out structure.

在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。In the above-mentioned embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

以上对本申请实施例所提供的一种扇出走线结构及显示面板进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。A fan-out wiring structure and a display panel provided by the embodiments of the present application have been introduced in detail above. The principles and implementations of the present application are described in this paper by using specific examples. The descriptions of the above embodiments are only used to help understanding. The technical solution of the present application and its core idea; those of ordinary skill in the art should understand that it is still possible to modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements to some of the technical features; and these modifications or replacements , does not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.