CN111326424A - QFN frame arrangement and packaging production method - Google Patents
QFN frame arrangement and packaging production methodDownload PDFInfo
- Publication number
- CN111326424A CN111326424ACN201811531530.3ACN201811531530ACN111326424ACN 111326424 ACN111326424 ACN 111326424ACN 201811531530 ACN201811531530 ACN 201811531530ACN 111326424 ACN111326424 ACN 111326424A
- Authority
- CN
- China
- Prior art keywords
- packaging
- qfn
- region
- package
- production method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806packaging method and processMethods0.000titleclaimsabstractdescription140
- 238000004519manufacturing processMethods0.000titleclaimsabstractdescription44
- 238000002955isolationMethods0.000claimsabstractdescription16
- 238000000034methodMethods0.000claimsabstractdescription15
- 238000005520cutting processMethods0.000claimsabstractdescription10
- 238000007789sealingMethods0.000claimsdescription6
- 238000010586diagramMethods0.000description6
- 238000010276constructionMethods0.000description1
- 238000005260corrosionMethods0.000description1
- 230000010354integrationEffects0.000description1
- 238000012986modificationMethods0.000description1
- 230000004048modificationEffects0.000description1
- 239000007787solidSubstances0.000description1
Images
Classifications
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Packages (AREA)
Abstract
Description
Technical Field
The invention relates to the technical field of packaging, in particular to the technical field of multi-chip packaging, and specifically relates to an arrangement and packaging production method of a QFN frame.
Background
In QFN (Quad Flat No-lead Package) square Flat non-lead frames in the prior art, a semi-corrosion frame is used, but if the chip area is overlarge, a frame needs to be newly opened at the moment; technicians sometimes actively want to improve the integration level, and package several different chips on different islands of the same frame (the "island" is also called as a chip mount or chip carrier) to improve the performance, but the method also needs to develop a new QFN frame. When the frame is newly opened, if any problem occurs on the application end or the line, or any small negligence occurs during the construction of the scheme, the newly opened QFN frame can be scrapped (see fig. 1), wherein all the cells in the QFN frame are the same.
Disclosure of Invention
The object of the present invention is to overcome the above disadvantages of the prior art and to provide a QFN frame layout and package production method capable of meeting the packaging requirements of a plurality of devices to be packaged.
In order to achieve the above purpose, the layout and package production method of the QFN frame of the present invention is as follows:
the QFN frame arrangement and packaging production method is mainly characterized by comprising the following steps:
(1) dividing the packaging area of the QFN frame;
(2) arranging the divided packaging areas according to requirements so that the packaging requirements of devices to be packaged with different packaging forms can be met;
(3) isolating the arranged packaging areas through isolation belts;
(4) and carrying out plastic package and cutting treatment on the arranged packaging area.
The QFN frame arrangement and packaging production method specifically comprises the following steps (1):
and dividing the QFN frame into a first packaging area, a second packaging area, a third packaging area and a fourth packaging area.
The first packaging area, the second packaging area, the third packaging area and the fourth packaging area of the QFN frame arrangement and packaging production method are obtained by dividing according to a cross center line structure.
The QFN frame arrangement and packaging production method specifically comprises the following steps (2):
the first packaging region is arranged into a first QFN small-base packaging region with the specification of QFN3 × 3, the second packaging region is arranged into a second QFN large-base packaging region with the specification of QFN3 × 3, the third packaging region is arranged into a third QFN packaging region with the specification of QFN4 × 4, and the fourth packaging region is arranged into a fourth QFN packaging region with the specification of QFN5 × 5.
The QFN frame arrangement and packaging production method specifically comprises the following steps (2):
the first package region is arranged as a first QFN package region of QFN3 × 3 format, the second package region is arranged as a second QFN package region of QFN3.3 × 3.3.3 format, the third package region is arranged as a third QFN package region of QFN3.3 × 3.6.6 format, and the fourth package region is arranged as a fourth QFN package region of QFN3 × 4 format.
The QFN frame arrangement and packaging production method specifically comprises the following steps (2):
the first packaging region is arranged into a first QFN three-base island packaging region with the specification of QFN5 × 5, the second packaging region is arranged into a second QFN double-base island packaging region with the specification of QFN5 × 5, the third packaging region is arranged into a third QFN single-base island packaging region with the specification of QFN3 × 3, and the fourth packaging region is arranged into a fourth QFN packaging region with the specification of QFN0 × 0.
The QFN frame is arranged and a plurality of cells are arranged in a packaging area of the packaging production method, the shapes of the plurality of cells in the same packaging area are the same, and the shapes of the plurality of cells in different packaging areas are different.
The isolation belt of the QFN frame arrangement and packaging production method is a strip isolation belt, and the dimension length of the strip isolation belt is larger than the dimension length of any divided packaging area.
Before step (4) of the QFN frame arrangement and packaging production method, the method also comprises the following steps:
(4.0) sealing the packaging area in a test way, wherein the sealing test process specifically comprises the following steps:
and correspondingly carrying out surface mounting, bonding and plastic packaging on the devices to be packaged in different packaging forms in a packaging area respectively.
In step (4) of the QFN frame layout and package production method, the cutting process specifically comprises:
and separating different packaging areas along the strip-shaped isolation belt.
In the step (1) of the layout and packaging production method of the QFN frame, the shape of the QFN frame is square or rectangular.
In the step (4) of the QFN frame arrangement and packaging production method, after cutting treatment, different packaging areas are subjected to disc loading or taping.
By adopting the arrangement of the QFN frame and the packaging production method, the devices to be packaged in different packaging forms can be packaged in the same QFN frame, the development cost of the QFN frame is saved, meanwhile, the product performance of the QFN frame can be researched by comparing different base islands, and the method has a wider application range.
Drawings
Fig. 1 is a schematic structural diagram of a QFN frame of the prior art, in which all unit cells are identical.
Fig. 2 is a schematic structural diagram of a QFN frame with four different unit cells according to the present invention.
Fig. 3 is a schematic diagram of a divided QFN frame according to the present invention.
Fig. 4 is a structural schematic diagram of the QFN frame after division.
Fig. 5 is another schematic diagram of the divided QFN frame according to the present invention.
Fig. 6 is a partial structural schematic diagram of a QFN frame of the present invention.
Detailed Description
Before explaining embodiments in accordance with the present invention in detail, it should be noted that first and second like relational terms are used hereinafter only to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
The QFN frame arrangement and packaging production method is mainly characterized by comprising the following steps:
(1) dividing the packaging area of the QFN frame;
(2) arranging the divided packaging areas according to requirements so that the packaging requirements of devices to be packaged with different packaging forms can be met;
(3) isolating the arranged packaging areas through isolation belts;
(4) and carrying out plastic package and cutting treatment on the arranged packaging area.
The QFN frame arrangement and packaging production method specifically comprises the following steps (1):
and dividing the QFN frame into a first packaging area, a second packaging area, a third packaging area and a fourth packaging area.
The first packaging area, the second packaging area, the third packaging area and the fourth packaging area of the QFN frame arrangement and packaging production method are obtained by dividing a cross center line structure (refer to fig. 2).
The QFN frame arrangement and packaging production method specifically comprises the following steps (2):
the first package region is arranged as a first QFN small island package region having a specification of QFN3 × 3, the second package region is arranged as a second QFN large island package region having a specification of QFN3 × 3, the third package region is arranged as a third QFN package region having a specification of QFN4 × 4, and the fourth package region is arranged as a fourth QFN package region having a specification of QFN5 × 5 (see fig. 3).
The QFN frame arrangement and packaging production method specifically comprises the following steps (2):
the first package region is arranged as a first QFN package region having a specification of QFN3 × 3, the second package region is arranged as a second QFN package region having a specification of QFN3.3 × 3.3.3, the third package region is arranged as a third QFN package region having a specification of QFN3.3 × 3.6.6, and the fourth package region is arranged as a fourth QFN package region having a specification of QFN3 × 4 (see fig. 4).
The QFN frame arrangement and packaging production method specifically comprises the following steps (2):
the first package region is arranged into a first QFN three-base island package region having a specification of QFN5 × 5, the second package region is arranged into a second QFN double-base island package region having a specification of QFN5 × 5, the third package region is arranged into a third QFN single-base island package region having a specification of QFN3 × 3, and the fourth package region is arranged into a fourth QFN package region having a specification of QFN0 × 0 (see fig. 5).
The QFN frame is arranged and a plurality of cells are arranged in a packaging area of the packaging production method, the shapes of the plurality of cells in the same packaging area are the same, and the shapes of the plurality of cells in different packaging areas are different.
The isolation belt of the QFN frame arrangement and packaging production method is a strip isolation belt, and the dimension length of the strip isolation belt is larger than the dimension length of any divided packaging area.
Before step (4) of the QFN frame arrangement and packaging production method, the method also comprises the following steps:
(4.0) sealing the packaging area in a test way, wherein the sealing test process specifically comprises the following steps:
and correspondingly carrying out surface mounting, bonding and plastic packaging on the devices to be packaged in different packaging forms in a packaging area respectively.
In step (4) of the QFN frame layout and package production method, the cutting process specifically comprises:
and separating different packaging areas along the strip-shaped isolation belt.
In the step (1) of the layout and packaging production method of the QFN frame, the shape of the QFN frame is square or rectangular.
In the step (4) of the QFN frame arrangement and packaging production method, after cutting treatment, different packaging areas are subjected to disc loading or taping.
In a specific embodiment, the shape and size of the footprint of the present invention is determined by the needs of the designer or customer.
In step (3) of the QFN frame placement and package production method, the release tape may extend to the edge of the QFN frame, as within the solid circle of fig. 6.
By adopting the arrangement of the QFN frame and the packaging production method, the devices to be packaged in different packaging forms can be packaged in the same QFN frame, the development cost of the QFN frame is saved, meanwhile, the product performance of the QFN frame can be researched by comparing different base islands, and the method has a wider application range.
In this specification, the invention has been described with reference to specific embodiments thereof. It will, however, be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of the invention. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.
Claims (12)
1. A QFN frame arrangement and packaging production method is characterized by comprising the following steps:
(1) dividing the packaging area of the QFN frame;
(2) arranging the divided packaging areas according to requirements so that the packaging requirements of devices to be packaged with different packaging forms can be met;
(3) isolating the arranged packaging areas through isolation belts;
(4) and carrying out plastic package and cutting treatment on the arranged packaging area.
2. The QFN frame layout and package production method according to claim 1, wherein the step (1) comprises:
and dividing the QFN frame into a first packaging area, a second packaging area, a third packaging area and a fourth packaging area.
3. The QFN frame layout and package production method according to claim 2, wherein the first package region, the second package region, the third package region and the fourth package region are obtained by dividing a cross center line structure.
4. The QFN frame layout and package production method according to claim 3, wherein the step (2) comprises:
the first packaging region is arranged into a first QFN small-base packaging region with the specification of QFN3 × 3, the second packaging region is arranged into a second QFN large-base packaging region with the specification of QFN3 × 3, the third packaging region is arranged into a third QFN packaging region with the specification of QFN4 × 4, and the fourth packaging region is arranged into a fourth QFN packaging region with the specification of QFN5 × 5.
5. The QFN frame layout and package production method according to claim 3, wherein the step (2) comprises:
the first package region is arranged as a first QFN package region of QFN3 × 3 format, the second package region is arranged as a second QFN package region of QFN3.3 × 3.3.3 format, the third package region is arranged as a third QFN package region of QFN3.3 × 3.6.6 format, and the fourth package region is arranged as a fourth QFN package region of QFN3 × 4 format.
6. The QFN frame layout and package production method according to claim 2, wherein the step (2) is specifically:
the first packaging region is arranged into a first QFN three-base island packaging region with the specification of QFN5 × 5, the second packaging region is arranged into a second QFN double-base island packaging region with the specification of QFN5 × 5, the third packaging region is arranged into a third QFN single-base island packaging region with the specification of QFN3 × 3, and the fourth packaging region is arranged into a fourth QFN packaging region with the specification of QFN0 × 0.
7. The method as claimed in any of claims 2 to 6, wherein the package region has a plurality of cells therein, the plurality of cells have the same shape in the same package region, and the plurality of cells have different shapes in different package regions.
8. The method for arranging and producing packages on QFN frames according to claim 1, wherein the isolation strips are strip-shaped isolation strips, and the dimension length of the strip-shaped isolation strips is greater than the dimension length of any one of the divided package regions.
9. The QFN frame placement and package production method according to claim 1, wherein step (4) is preceded by the steps of:
(4.0) sealing the packaging area in a test way, wherein the sealing test process specifically comprises the following steps:
and correspondingly carrying out surface mounting, bonding and plastic packaging on the devices to be packaged in different packaging forms in a packaging area respectively.
10. The QFN frame layout and package production method according to claim 1, wherein in the step (4), the cutting process specifically comprises:
and separating different packaging areas along the strip-shaped isolation belt.
11. The QFN frame layout and package production method according to claim 8, wherein in step (1), the QFN frame is square or rectangular in shape.
12. The QFN frame layout and package production method according to claim 1, wherein in the step (4), after the cutting process, the different package regions are palletized or taped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811531530.3ACN111326424A (en) | 2018-12-14 | 2018-12-14 | QFN frame arrangement and packaging production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811531530.3ACN111326424A (en) | 2018-12-14 | 2018-12-14 | QFN frame arrangement and packaging production method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111326424Atrue CN111326424A (en) | 2020-06-23 |
Family
ID=71167264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811531530.3APendingCN111326424A (en) | 2018-12-14 | 2018-12-14 | QFN frame arrangement and packaging production method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111326424A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030071333A1 (en)* | 2001-10-15 | 2003-04-17 | Shinko Electric Industries Co., Ltd. | Leadframe, method of manufacturing the same, and method of manufacturing a semiconductor device using the same |
| CN1577828A (en)* | 2003-07-02 | 2005-02-09 | 株式会社瑞萨科技 | Semiconductor device and lead frame |
| US6885086B1 (en)* | 2002-03-05 | 2005-04-26 | Amkor Technology, Inc. | Reduced copper lead frame for saw-singulated chip package |
| US20050101055A1 (en)* | 2001-10-26 | 2005-05-12 | Shinko Electric Industries Co., Ltd. | Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same |
| US20080265412A1 (en)* | 2007-04-27 | 2008-10-30 | Oki Electric Industry Co., Ltd. | Semiconductor device and method of manufacturing thereof |
| CN104854695A (en)* | 2012-09-07 | 2015-08-19 | 联达科技控股有限公司 | Lead carrier with printed formed terminal pads |
| CN105097755A (en)* | 2014-05-08 | 2015-11-25 | 英飞凌科技股份有限公司 | Method of singularizing packages and leadframe |
| CN105679682A (en)* | 2014-12-05 | 2016-06-15 | 珠海越亚封装基板技术股份有限公司 | Method of fabricating polymer frame with rectangular array of cavities |
| US20160329306A1 (en)* | 2006-12-14 | 2016-11-10 | Advanpack Solutions Pte Ltd. | Semiconductor package and manufacturing method thereof |
| CN107946259A (en)* | 2017-12-21 | 2018-04-20 | 苏州迈瑞微电子有限公司 | A kind of QFN encapsulating structures and its manufacture method |
- 2018
- 2018-12-14CNCN201811531530.3Apatent/CN111326424A/enactivePending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030071333A1 (en)* | 2001-10-15 | 2003-04-17 | Shinko Electric Industries Co., Ltd. | Leadframe, method of manufacturing the same, and method of manufacturing a semiconductor device using the same |
| US20050101055A1 (en)* | 2001-10-26 | 2005-05-12 | Shinko Electric Industries Co., Ltd. | Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same |
| US6885086B1 (en)* | 2002-03-05 | 2005-04-26 | Amkor Technology, Inc. | Reduced copper lead frame for saw-singulated chip package |
| CN1577828A (en)* | 2003-07-02 | 2005-02-09 | 株式会社瑞萨科技 | Semiconductor device and lead frame |
| US20160329306A1 (en)* | 2006-12-14 | 2016-11-10 | Advanpack Solutions Pte Ltd. | Semiconductor package and manufacturing method thereof |
| US20080265412A1 (en)* | 2007-04-27 | 2008-10-30 | Oki Electric Industry Co., Ltd. | Semiconductor device and method of manufacturing thereof |
| CN104854695A (en)* | 2012-09-07 | 2015-08-19 | 联达科技控股有限公司 | Lead carrier with printed formed terminal pads |
| CN105097755A (en)* | 2014-05-08 | 2015-11-25 | 英飞凌科技股份有限公司 | Method of singularizing packages and leadframe |
| CN105679682A (en)* | 2014-12-05 | 2016-06-15 | 珠海越亚封装基板技术股份有限公司 | Method of fabricating polymer frame with rectangular array of cavities |
| CN107946259A (en)* | 2017-12-21 | 2018-04-20 | 苏州迈瑞微电子有限公司 | A kind of QFN encapsulating structures and its manufacture method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2008027694A3 (en) | Stackable packages for three-dimensional packaging of semiconductor dice | |
| US20160379916A1 (en) | Method for making semiconductor device with sidewall recess and related devices | |
| US7554179B2 (en) | Multi-leadframe semiconductor package and method of manufacture | |
| JPH06163798A (en) | Semiconductor package and its manufacture | |
| US20080029856A1 (en) | Leadframe and non-lead package therewith | |
| CN101477973B (en) | Lead frame strip, sealing method thereof and sealing structure | |
| US8637974B2 (en) | Integrated circuit packaging system with tiebar-less design and method of manufacture thereof | |
| CN111326424A (en) | QFN frame arrangement and packaging production method | |
| US7749866B2 (en) | Method for sawing a wafer and method for manufacturing a semiconductor package by using a multiple-type tape | |
| CN103400806A (en) | Frame based flat package part manufacturing process adopting cutting channel optimization technology | |
| US8643156B2 (en) | Lead frame for assembling semiconductor device | |
| US8716845B2 (en) | Lead frame strip for reduced mold sticking during degating | |
| CN105390482A (en) | Stacked chip and processing method thereof | |
| CN106298493A (en) | Method for manufacturing semiconductor device | |
| CN110718484A (en) | Method for separating integrated circuit packages | |
| TWI244167B (en) | Semiconductor package and method thereof | |
| CN101477974B (en) | Sealing method of lead frame bar and structure of semiconductor package with lead frame | |
| CN107430983B (en) | Semiconductor devices and its packaging method | |
| US20150206829A1 (en) | Semiconductor package with interior leads | |
| CN103107098A (en) | Encapsulating method of advanced square flat pins-free and encapsulating structure thereof | |
| KR100355797B1 (en) | semiconductor package and its manufacturing method | |
| CN216354192U (en) | Semiconductor chip routing structure | |
| US20070108626A1 (en) | Flip-chip integrated circuit packaging method | |
| CN203721712U (en) | Lead frame strip used for semiconductor packaging | |
| KR100543510B1 (en) | Singulation Method of Semiconductor Package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information | Address after:214135 -6, Linghu Avenue, Wuxi Taihu international science and Technology Park, Wuxi, Jiangsu, China, 180 Applicant after:China Resources micro integrated circuit (Wuxi) Co.,Ltd. Address before:No.180-22, Linghu Avenue, Taihu International Science and Technology Park, Wuxi, Jiangsu 214135 Applicant before:WUXI CHINA RESOURCES SEMICO Co.,Ltd. | |
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication | Application publication date:20200623 |