CN111223849A - Multichannel Integrated Cooled Single Photon Avalanche Photodiode Device - Google Patents

Abstract

The invention discloses a multi-channel integrated refrigeration single photon avalanche photodiode device which comprises a shell, wherein a cavity is arranged in the shell, a thermoelectric refrigerator and a ceramic substrate are arranged in the cavity, a temperature-sensitive resistor and at least two avalanche photodiode chips are fixedly connected to the ceramic substrate, at least two groups of optical fiber assemblies are inserted into the cavity wall on one side of the cavity, and the ends of the insertion ends of the optical fiber assemblies are respectively coupled with the photosensitive surfaces of the corresponding avalanche photodiode chips in a facing manner. According to the invention, a plurality of avalanche photodiode chips are integrated in a shell, each chip can independently detect one path of single photon signal, and the detection of multiple paths of signals can be realized by using one single photon avalanche photodiode device, so that the use is convenient; and a plurality of avalanche photodiode chips share one thermoelectric refrigerator, so that the size, the cost and the power consumption of the single photon avalanche photodiode device can be obviously reduced.

Description

Multi-channel integrated refrigeration single photon avalanche photodiode device

Technical Field

The invention relates to the field of single photon detection, in particular to a multi-channel integrated refrigeration single photon avalanche photodiode device.

Background

With the development of space detection, biomedicine and quantum technology, the requirements on detection systems of weak optical signals, particularly single photon signals, are higher and higher, and convenience and easiness in use are required. The single photon avalanche photodiode is a core component of a single photon detection system, and can be widely applied to the fields of quantum communication, laser radar, time domain reflectometer, near infrared precise optical measurement and the like. The principle is that by utilizing the internal photoelectric effect, when incident photons are absorbed by an absorption layer material, electron-hole pairs are generated, electrons or holes are transported to a multiplication region under the action of an electric field, and a collision ionization process occurs in the multiplication region, so that macroscopic avalanche current capable of being observed is formed, and the detection of single photons is realized. In this process, the thermally generated carriers of the absorber layer material can generate dark current, reducing the sensitivity of the device. Therefore, there is a need for cooling single photon avalanche photodiode devices.

Currently, a single photon avalanche photodiode device generally adopts a to (transistor outline) package and a butterfly integrated refrigeration package. The single photon detection system adopting the TO encapsulation device needs an external refrigerator TO refrigerate the whole system, has low refrigeration efficiency and larger power consumption of the detection system, and the single photon avalanche photodiode devices of the existing butterfly integrated refrigeration encapsulation are single-channel devices, can only detect one-way single photon signals and need TO be paired with independent power circuits. In practical application, n (n is more than or equal to 2) single photon signals are often required to be detected, the volume and the power consumption of a detection unit are correspondingly increased by n times compared with a single-channel detection system, the design difficulty of the system is increased, and the use is inconvenient.

Disclosure of Invention

The invention aims to solve the technical problem of providing a multichannel integrated refrigeration single photon avalanche photodiode device which can detect multiple paths of single photon signals simultaneously and has low power consumption.

The technical scheme of the invention is as follows:

a multi-channel integrated refrigeration single photon avalanche photodiode device comprises a shell, wherein a cavity is arranged in the shell, a thermoelectric refrigerator is arranged at the bottom of the cavity, a hot end face of the thermoelectric refrigerator is fixedly connected with the cavity wall at the bottom of the cavity, a ceramic substrate is fixedly arranged on a cold end face of the thermoelectric refrigerator, a temperature-sensitive resistor and at least two avalanche photodiode chips are fixedly connected onto the ceramic substrate, a plurality of pins penetrate through the cavity walls on two sides of the cavity, and the pins are respectively and electrically connected with the avalanche photodiode chips, the temperature-sensitive resistor and the thermoelectric refrigerator through internal leads; at least two groups of optical fiber assemblies are inserted into the cavity wall on one side of the upper step section of the cavity, the optical fiber assemblies correspond to the avalanche photodiode chips one by one, the ends of the insertion ends are respectively coupled with the photosensitive surfaces of the corresponding avalanche photodiode chips, and the non-insertion ends of the optical fiber assemblies are used for connecting optical fibers.

Furthermore, the middle part of the shell is concave inwards to form an I-shaped structure, the shape of the cavity corresponds to that of the shell, so that the cavity is stepped, the upper part is larger than the lower part, the insertion end of each group of optical fiber assemblies is welded and fixed on the step surface of the cavity, and the lower step part of the cavity is matched with the thermoelectric refrigerator.

Further, the absorption layer of the avalanche photodiode chip is made of one of Si, InGaAs (P), Ge and inaias.

Furthermore, the shell is hermetically packaged, and nitrogen or argon is filled in the shell.

Furthermore, each avalanche photodiode chip is connected with a pin by using an independent internal lead, so that mutual influence during signal output is avoided.

Furthermore, the avalanche photodiode chip is fixed on the mounting rack through a flip-chip bonding process, and then the mounting rack is fixed on the ceramic substrate through bonding or welding.

Furthermore, mounting holes are formed in the cavity walls on the two sides of the cavity and correspond to the positions where the pins penetrate, and after the pins penetrate through the mounting holes, the pins and the hole walls of the mounting holes in the corresponding positions are fixed through sintering of the glass insulators at high temperature, so that an air-tight structure is formed.

Has the advantages that: according to the invention, a plurality of avalanche photodiode chips are integrated in a shell, each chip can independently detect one path of single photon signal, and the detection of multiple paths of signals can be realized by using one single photon avalanche photodiode device, so that the use is convenient; and a plurality of avalanche photodiode chips share one thermoelectric refrigerator, so that the size, the cost and the power consumption of the single photon avalanche photodiode device can be obviously reduced.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of a housing and pins;

fig. 3 is a partial cross-sectional view of fig. 2.

Detailed Description

The invention will be further explained with reference to the drawings.

In the description of the present invention, unless otherwise specified and limited, it is to be noted that the term "connected" is to be interpreted broadly, and may be, for example, a mechanical connection or an electrical connection, or a communication between two elements, or may be a direct connection or an indirect connection through an intermediate medium, and a specific meaning of the term may be understood by those skilled in the art according to specific situations.

As shown in fig. 1, 2 and 3, the multichannel integrated refrigeration single photon avalanche photodiode device of the present invention includes acasing 7, thecasing 7 is hermetically sealed and filled with nitrogen or argon, the middle of thecasing 7 is recessed inwards to form an i-shaped structure, astepped cavity 9 with a large top and a small bottom is arranged inside thecasing 7, athermoelectric refrigerator 6 is arranged at the bottom of thecavity 9, and the size of the lower step of thecavity 9 is adapted to the size of thethermoelectric refrigerator 6; the hot end face of thethermoelectric refrigerator 6 is fixedly connected with the cavity wall at the bottom of thecavity 9, the cold end face is fixedly provided with aceramic substrate 4, theceramic substrate 4 is fixedly connected with a temperature-sensitive resistor 5 and at least twoavalanche photodiode chips 2, preferably twoavalanche photodiode chips 2, and the absorption layer material of theavalanche photodiode chips 2 is one of Si, InGaAs (P), Ge and InAlAs; theavalanche photodiode chip 2 is fixed on the mounting rack through a flip-chip bonding process, and then the mounting rack is fixed on theceramic substrate 4 through bonding or welding.

A plurality ofpins 8 are arranged on the cavity walls on two sides of the upper step part of thecavity 9 in a penetrating manner, specifically, mounting holes are arranged on the cavity walls on two sides of thecavity 9 corresponding to the positions where thepins 8 penetrate, and after thepins 8 penetrate through the mounting holes, thepins 8 are fixed with the hole walls of the mounting holes at the corresponding positions through sintering of aglass insulator 10 at high temperature, so that an airtight structure is formed; the plurality ofpins 8 are respectively and electrically connected with theavalanche photodiode chip 2, the temperaturesensitive resistor 5 and thethermoelectric refrigerator 6 through theinternal lead 3, wherein eachavalanche photodiode chip 2 is connected with thepin 8 by using the independentinternal lead 3.

At least two groups ofoptical fiber assemblies 1, preferably two groups ofoptical fiber assemblies 1, are inserted into the cavity wall on one side of the upper step section of thecavity 9, theoptical fiber assemblies 1 correspond to theavalanche photodiode chips 2 one by one, the insertion ends of each group ofoptical fiber assemblies 1 are welded and fixed on the step surface of thecavity 9, the ends of the insertion ends are respectively coupled with the photosensitive surfaces of the correspondingavalanche photodiode chips 2, and the non-insertion ends of theoptical fiber assemblies 1 are used for connecting optical fibers.

The working principle of the embodiment is as follows:

as shown in fig. 1 to 3, when in use, the non-insertion ends of the twooptical fiber assemblies 1 are respectively connected to optical fibers, and bias voltage and gate control signals are loaded on the twoavalanche photodiode chips 2 through thepins 8, so that the two-path single photon signals can be simultaneously detected. The heat generated by theavalanche photodiode chip 2 is rapidly transferred to thethermoelectric refrigerator 6 through theceramic substrate 4, so that theavalanche photodiode chip 2 is refrigerated, the temperature inside theshell 7 can be detected through the temperaturesensitive resistor 5, thethermoelectric refrigerator 6 is adjusted, and the temperature inside theshell 7 is kept within the temperature range for the normal work of theavalanche photodiode chip 2. Because the two avalanche photodiode chips share the ceramic substrate and the thermoelectric refrigerator, the size, the cost and the power consumption of the single photon avalanche photodiode device can be obviously reduced compared with two independent detection devices.

In addition, the middle part of theshell 7 is concave inwards to form an I-shaped structure, and the size of the lower step part of thecavity 9 is matched with that of thethermoelectric refrigerator 6, so that redundant space inside theshell 7 is effectively removed, and the refrigerating efficiency of thethermoelectric refrigerator 6 is improved.

The undescribed parts of the present invention are consistent with the prior art, and are not described herein.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structures made by using the contents of the present specification and the drawings can be directly or indirectly applied to other related technical fields, and are within the scope of the present invention.

Claims (7)

Translated fromChinese

1.一种多通道集成制冷单光子雪崩光电二极管器件，包括壳体(7),其特征在于：所述壳体(7)的内部设有空腔(9)，所述空腔(9)的底部设有热电制冷器(6)，所述热电制冷器(6)的热端面与空腔(9)底部的腔壁固定连接，冷端面上固设有陶瓷基板(4)，所述陶瓷基板(4)上固定连接有温敏电阻(5)和至少两个雪崩光电二极管芯片(2)，所述空腔(9)两侧的腔壁上穿设有多个引脚(8)，多个所述引脚(8)分别通过内部引线(3)与雪崩光电二极管芯片(2)、温敏电阻(5)以及热电制冷器(6)电连接；所述空腔(9)的上台阶段一侧的腔壁上插设有至少两组光纤组件(1)，所述光纤组件(1)与雪崩光电二极管芯片(2)一一对应，且插入端的端头分别与对应的雪崩光电二极管芯片(2)的光敏面正对耦合，所述光纤组件(1)的非插入端用于连接光纤。1. A multi-channel integrated refrigeration single-photon avalanche photodiode device, comprising a housing (7), characterized in that: the interior of the housing (7) is provided with a cavity (9), and the cavity (9) A thermoelectric refrigerator (6) is arranged at the bottom of the thermoelectric refrigerator (6), the hot end face of the thermoelectric refrigerator (6) is fixedly connected to the cavity wall at the bottom of the cavity (9), and a ceramic substrate (4) is fixed on the cold end face, and the ceramic substrate (4) is fixed on the cold end face. A temperature sensitive resistor (5) and at least two avalanche photodiode chips (2) are fixedly connected to the substrate (4), and a plurality of pins (8) are pierced through the cavity walls on both sides of the cavity (9), The plurality of pins (8) are respectively electrically connected to the avalanche photodiode chip (2), the temperature sensitive resistor (5) and the thermoelectric refrigerator (6) through the inner lead (3); At least two groups of optical fiber components (1) are inserted into the cavity wall on one side of the stage, the optical fiber components (1) are in one-to-one correspondence with the avalanche photodiode chips (2), and the ends of the insertion ends are respectively connected with the corresponding avalanche photodiodes. The photosensitive surfaces of the chip (2) are coupled to each other, and the non-insertion end of the optical fiber assembly (1) is used for connecting optical fibers.2.如权利要求1所述的多通道集成制冷单光子雪崩光电二极管器件，其特征在于，所述壳体(7)的中部内凹呈“工”字形结构，所述空腔(9)的形状与壳体(7)相对应，从而呈上大下小的台阶状，每组所述光纤组件(1)的插入端均焊接固定在空腔(9)的台阶面上，所述空腔(9)的下台阶部分与热电制冷器(6)相适配。2. The multi-channel integrated refrigeration single-photon avalanche photodiode device according to claim 1, characterized in that the middle part of the casing (7) is concave in an "I"-shaped structure, and the cavity (9) has an "I" shape. The shape corresponds to that of the casing (7), so that it is in a stepped shape with a large upper and a small lower, and the insertion ends of each group of the optical fiber components (1) are welded and fixed on the stepped surface of the cavity (9). The lower step portion of (9) is adapted to the thermoelectric cooler (6).3.根据权利要求1所述的多通道集成制冷单光子雪崩光电二极管器件，其特征在于：所述雪崩光电二极管芯片(2)的吸收层材料为Si、InGaAs(P)、Ge和InAlAs中的一种。3. The multi-channel integrated refrigeration single-photon avalanche photodiode device according to claim 1, wherein the absorption layer material of the avalanche photodiode chip (2) is Si, InGaAs (P), Ge and InAlAs. A sort of.4.如权利要求1所述的多通道集成制冷单光子雪崩光电二极管器件，其特征在于，所述壳体(7)采用密闭封装，且内部充氮气或氩气。4 . The multi-channel integrated refrigeration single-photon avalanche photodiode device according to claim 1 , wherein the casing ( 7 ) is sealed and filled with nitrogen gas or argon gas. 5 .5.如权利要求1所述的多通道集成制冷单光子雪崩光电二极管器件，其特征在于，每个所述雪崩光电二极管芯片(2)均使用独立的内部引线(3)与引脚(8)连接。5. The multi-channel integrated refrigeration single-photon avalanche photodiode device according to claim 1, wherein each of the avalanche photodiode chips (2) uses independent internal leads (3) and pins (8) connect.6.如权利要求1所述的多通道集成制冷单光子雪崩光电二极管器件，其特征在于，所述雪崩光电二极管芯片(2)先通过倒装焊工艺固定在安装架上，再通过粘接或焊接的方式将安装架固定在陶瓷基板(4)上。6. The multi-channel integrated refrigeration single-photon avalanche photodiode device according to claim 1, wherein the avalanche photodiode chip (2) is first fixed on the mounting frame by a flip-chip welding process, and then is bonded or The mounting bracket is fixed on the ceramic base plate (4) by welding.7.如权利要求1所述的多通道集成制冷单光子雪崩光电二极管器件，其特征在于，在所述空腔(9)两侧的腔壁上，对应每个引脚(8)穿设的位置处均开设有安装孔，所述引脚(8)穿设过安装孔后，通过玻璃绝缘子(10)在高温下烧结使引脚(8)与对应位置安装孔的孔壁固定，从而形成气密性结构。7. The multi-channel integrated refrigeration single-photon avalanche photodiode device according to claim 1, characterized in that, on the cavity walls on both sides of the cavity (9), corresponding to each pin (8) passing through Mounting holes are provided at the positions, and after the pins (8) pass through the mounting holes, the pins (8) are fixed with the hole walls of the mounting holes at the corresponding positions by sintering the glass insulators (10) at high temperature, thereby forming Airtight structure.

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