CN111122015A - Temperature sensing device, temperature sensing test system and working method thereof - Google Patents
Temperature sensing device, temperature sensing test system and working method thereofDownload PDFInfo
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- CN111122015A CN111122015ACN202010000596.0ACN202010000596ACN111122015ACN 111122015 ACN111122015 ACN 111122015ACN 202010000596 ACN202010000596 ACN 202010000596ACN 111122015 ACN111122015 ACN 111122015A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/04—Thermometers specially adapted for specific purposes for measuring temperature of moving solid bodies
- G01K13/08—Thermometers specially adapted for specific purposes for measuring temperature of moving solid bodies in rotary movement
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
- G01K1/024—Means for indicating or recording specially adapted for thermometers for remote indication
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
- G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
- G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K2205/00—Application of thermometers in motors, e.g. of a vehicle
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
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- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Description
Technical Field
The invention relates to the field of temperature measurement, in particular to a temperature sensing device, a temperature sensing test system and a working method thereof.
Background
At present, real-time testing of parameters such as temperature and pressure of high-temperature components has great influence on improving the working efficiency of the generator. Taking the high temperature extreme environment inside a rocket-propelled gas turbine engine as an example, the gas turbine engine is generally composed of a compressor, a combustor and a turbine, each of which is operated in different temperature environments. Wherein turbine blades of the turbine are exposed to combustion gases and operating temperatures may reach 2500 ° F to 3000 ° F.
In the prior art, a high-temperature sensing technology is usually adopted to test parameters such as pressure, temperature and the like in the fields of aerospace, transportation and machining and the like under extreme environments. Still taking the example of measuring the high temperature environment inside a gas turbine engine, a wired thermocouple may be used to measure the temperature of the turbine engine blades, with leads embedded into the blade interior or on the surface. However, this method of wire access often results in structural changes to the blade and in aerodynamic problems with the blade, such as disturbances to the air flow inside the blade for cooling, which can affect the boundary air layer around the blade and even interfere with the normal rotational operation of the engine blade.
Aiming at the temperature test in severe environments such as high temperature, another wireless passive in-situ test method is gradually the research direction of many inventors. The LC resonance type temperature sensor is made by printing an electric coil and a capacitor on a high-temperature resistant substrate, has a simple structure, is stable in test signal, is not easily interfered by external environment, has realized the test breakthrough of high temperature of 1000 ℃, but has the problems of short wireless test distance, low Q value, incapability of realizing metal target temperature test, easy interference of an electromagnetic field and the like, and has the defect that the lumped circuit can only work in a low-frequency range.
Therefore, it is desirable to provide a temperature sensing device, a temperature sensing test system and a method for operating the same that overcome the above problems.
Disclosure of Invention
The invention aims to provide a novel temperature sensing device, a temperature sensing test system and a working method thereof, so as to solve at least one of the problems in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
a first aspect of the present invention provides a temperature sensing device comprising:
a dielectric substrate;
the patch antenna is positioned on one side surface of the dielectric substrate and at least comprises an exposed part exposed outside the dielectric substrate; the patch antenna is configured to form an electrical connection with an object to be tested; and
the diode is positioned on the surface of one side of the dielectric substrate, and the cathode of the diode penetrates through the thickness of the dielectric substrate to form electric connection with an object to be measured; the anode of the diode is electrically connected with the exposed part of the patch antenna;
the diode is arranged between the patch antenna and the object to be tested in parallel.
Optionally, the dielectric substrate is formed with a first through hole penetrating through the thickness of the dielectric substrate, and the first through hole is filled with a first conductive member; the exposed part of the patch antenna is electrically connected with a tested object through the first conductive piece;
or the antenna comprises a buried part which penetrates through the thickness of the medium substrate and is buried in the medium substrate to form electric connection with the measured object.
Optionally, a second through hole penetrating through the thickness of the dielectric substrate is formed in the dielectric substrate, and a second conductive member is filled in the second through hole; and the cathode of the diode is electrically connected with the object to be tested through the second conductive piece.
Optionally, the apparatus further comprises an equivalent resonant circuit for enabling signal transmission between the patch antenna and the diode.
Optionally, the dielectric substrate is formed on the metal surface of the object to be tested by a deposition process.
Optionally, the material of the dielectric substrate is selected from one or more of alumina, aluminum nitride and yttria stabilized zirconia.
Optionally, the diode further comprises a semiconductor layer; the anode of the diode is made of platinum, the cathode of the diode is made of vanadium, and the semiconductor layer is made of zinc oxide doped with aluminum oxide.
A second aspect of the present invention provides a temperature sensing test system using the apparatus provided in the first aspect of the present invention, comprising:
at least one transceiver; and
at least one temperature sensing device for carrying out any one of the above first aspects;
the medium substrate process of each temperature sensing device is formed on the metal surface of the measured object.
A third aspect of the present invention provides a method of operating a temperature sensing test system provided by the second aspect of the present invention, the method comprising:
the transceiver transmits a frequency sweep inquiry signal and receives a response signal;
the patch antenna of the temperature sensing device receives the swept frequency interrogation signal;
and the diode of the temperature sensing device receives the sweep frequency inquiry signal, generates a harmonic signal containing temperature information of the measured object as a response signal, and the microstrip antenna outputs the response signal.
Optionally, the transceiver transmits the swept frequency interrogation signal and receives the response signal in a time division multiplexed manner.
The invention has the following beneficial effects:
the technical scheme of the invention adopts a wireless passive test method, the temperature sensing device is attached to the measured object, the structure of the measured object is not required to be changed, the sensing test of the temperature of the measured object can be completed through the signal transmission between the patch antenna and the diode, the long-distance wireless remote control measurement of the temperature of the measured object can be realized, and the wireless passive test device has the advantages of high Q value, application in metal environment and the like.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
FIG. 1 illustrates a schematic view of a turbine blade under test according to one embodiment of the present invention;
FIG. 2 shows a schematic view of a temperature sensing device of one embodiment provided by the present invention;
FIG. 3 illustrates a side view of a temperature sensing device according to one embodiment of the present invention
FIG. 4 illustrates a top view of a temperature sensing device according to one embodiment of the present invention;
FIG. 5 shows a circuit schematic of one embodiment provided by the present invention;
FIG. 6 shows a side view of the structure of a diode according to one embodiment of the present invention;
FIG. 7 shows a top view of a diode structure according to an embodiment of the present invention;
reference numerals: aturbine blade 1 to be tested; atemperature sensing device 2; adielectric substrate 21; apatch antenna 22; adiode 23; theanode 231 of the diode; thecathode 232 of the diode; asemiconductor layer 233;diode multiplier circuit 234; anequivalent resonance circuit 24; a firstconductive member 211; a second electricallyconductive member 212.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below with reference to preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
As shown in fig. 1, taking a specific example that the temperature sensing device provided by the embodiment of the present invention measures an internal high temperature environment of a gas turbine engine blade during operation, a measured object is aturbine blade 1, a metal surface of the measuredturbine blade 1 is a nichrome, and atemperature sensing device 2 provided by the embodiment of the present invention is disposed on the surface of the measuredturbine blade 1.
A first embodiment of the present invention discloses a temperature sensing device, including:
a dielectric substrate;
the patch antenna is positioned on one side surface of the dielectric substrate and at least comprises an exposed part exposed outside the dielectric substrate; the patch antenna is configured to form an electrical connection with an object to be tested; and
the diode is positioned on the surface of one side of the dielectric substrate, and the cathode of the diode penetrates through the thickness of the dielectric substrate to form electric connection with an object to be tested; the anode of the diode is electrically connected with the exposed part of the patch antenna;
the diode is arranged between the patch antenna and the object to be tested in parallel.
The embodiment of the invention adopts a wireless passive testing method, the temperature sensing device is arranged on the turbine blade to be tested, the structure of the turbine blade to be tested is not required to be changed, the sensing test of the temperature of the turbine blade to be tested can be completed through the signal transmission between the patch antenna and the diode, the long-distance wireless remote control measurement of the temperature of the turbine blade to be tested can be realized, and the invention has the advantages of high Q value, application in metal environment and the like.
In some optional implementations of this embodiment, the dielectric substrate is formed with a first through hole penetrating through a thickness of the dielectric substrate, and the first through hole is filled with a first conductive member; the exposed part of the patch antenna is electrically connected with a tested object through a first conductive piece;
or the antenna comprises a buried part which penetrates through the thickness of the medium substrate and is buried in the medium substrate to form electric connection with the measured object. In some optional implementations of this embodiment, the dielectric substrate is formed with a second through hole penetrating through a thickness of the dielectric substrate, and the second through hole is filled with a second conductive member; the cathode of the diode is electrically connected with the object to be tested through the second conductive piece.
In some optional implementations of this embodiment, the apparatus further includes an equivalent resonant circuit for enabling signal transmission between the patch antenna and the diode. In one specific example of this embodiment, the microstrip antenna, the dielectric substrate and the metal surface of the turbine blade under test form an RLC equivalent resonant circuit.
In some optional implementations of the present embodiment, as shown in fig. 5, the apparatus further includes an equivalentresonant circuit 24 for implementing signal transmission between thepatch antenna 22 and thediode 23.
As shown in fig. 5, in a specific example of the present embodiment, thediode 23 generates a harmonic signal containing information on the temperature value of theturbine blade 1 to be measured based on the signal of the patch antenna received by the equivalentresonant circuit 24, and transmits the harmonic signal to thepatch antenna 22.
As shown in fig. 5, in a specific example of the present embodiment, the equivalentresonant circuit 24 may adopt an RLC equivalent resonant circuit.
As shown in fig. 5, in a specific example of the embodiment, a diodefrequency multiplier circuit 234 is disposed in thediode 23, and when performing a temperature sensing test, a transceiver (not shown) outputs a resonant frequency f including thepatch antenna 22 to thepatch antenna 220The sweep frequency interrogation signal is received by thepatch antenna 22 attached to the second surface of thedielectric substrate 21 and then output to the equivalentresonant circuit 24, and the equivalentresonant circuit 24 receives the sweep frequency interrogation signal and then generates a resonant frequency f corresponding to the sweep frequency0The resonant signal is then coupled to the diodefrequency multiplier circuit 234, the diodefrequency multiplier circuit 234 generates a corresponding harmonic signal based on the resonant signal, and also generates a response signal corresponding to the resonant frequency and the temperature and other related information carried by the harmonic signal thereof, the response signal is transmitted back to the transceiver by thepatch antenna 22, and the emission of the frequency sweep interrogation signal of the transceiver and the transmission of the response signal generated by the temperature sensing measurement device after acquiring the frequency sweep interrogation signal are completed. The transceiver analyzes the response signal after acquiring the response signal carrying the temperature value information of theturbine blade 1 to be tested, and outputs the actual temperature value of theturbine blade 1 to be tested.
In one specific example of this embodiment, the frequency of the harmonic signal received by the transceiver may be used to distinguish between the response signal generated by the temperature sensing device and the frequency sweep interrogation signal output by the transceiver, and use a predetermined relationship between temperature and frequency within the temperature sensing measurement device to derive the actual value of the measured turbine blade temperature.
In some optional implementations of this embodiment, the dielectric substrate is formed on the metal surface of the object to be tested by a deposition process.
The thickness of the medium substrate directly deposited on theturbine blade 1 to be measured through the deposition process is less than 0.1mm, the structure of the measured object does not need to be influenced, and the working performance of the measured object cannot be influenced due to the fact that the thickness of the medium substrate is small.
In a specific example of the embodiment, the patch antenna may adopt a rectangular metal microstrip patch antenna; the diode can be a thin film Schottky diode.
In some optional implementations of this embodiment, the material of the dielectric substrate is selected from one or more of alumina, aluminum nitride, and yttria-stabilized zirconia.
In one specific example of the present embodiment, the electrical connection between the layers is achieved by filling metal through an etching process.
In some optional implementations of this embodiment, as shown in fig. 6 and 7, the diode 23 (not shown in the figures) further includes asemiconductor layer 233; theanode 231 of the diode is made of platinum, thecathode 232 of the diode is made of vanadium, and thesemiconductor layer 233 is made of zinc oxide doped with aluminum oxide.
As shown in fig. 2 to 4, a second embodiment of the present invention discloses a temperature sensing device, in which apatch antenna 22 of the device includes an exposed portion exposed to the outside of a dielectric substrate;
moreover, a first through hole penetrating the thickness of the dielectric substrate is formed in the dielectric substrate, and a firstconductive piece 211 is filled in the first through hole; thepatch antenna 22 is electrically connected with theturbine blade 1 to be tested through the firstconductive piece 211;
a second through hole penetrating the thickness of the dielectric substrate is formed in thedielectric substrate 21, and a secondconductive member 212 is filled in the second through hole; thecathode 232 of the diode is electrically connected to the object to be tested through the secondconductive member 212.
As shown in fig. 2 to 4, in this embodiment, the temperature sensing device specifically includes:
adielectric substrate 21; themedium substrate 21 is provided with a first through hole and a second through hole which respectively penetrate through the thickness of themedium substrate 21, the first through hole is internally filled with a firstconductive piece 211, the second through hole is internally filled with a secondconductive piece 212, and the bottom surface of the medium substrate is configured to be attached to the metal surface of the turbine blade to be tested;
and the number of the first and second groups,
apatch antenna 22 and adiode 23 respectively attached to the second surface of thedielectric substrate 21;
wherein, thepatch antenna 22 is electrically connected to the firstconductive member 211 in the first through hole;
theanode 231 of the diode is electrically connected to thepatch antenna 22 and thecathode 232 of the diode is electrically connected to the secondconductive member 212 in the second through hole.
Since the firstconductive member 211 and the secondconductive member 212 are electrically connected to theturbine blade 1 to be tested, respectively, it is realized that thepatch antenna 22 is electrically connected to the turbine blade to be tested through the firstconductive member 211, and simultaneously, thecathode 232 of the diode is electrically connected to theturbine blade 1 to be tested through the secondconductive member 212. With this configuration, thepatch antenna 22 may be connected in series with theturbine blade 1 under test, with thediode 23 being connected substantially in parallel between thepatch antenna 22 and theturbine blade 1 under test. Based on this, thediode 23 can acquire and output signals of thepatch antenna 22 and theturbine blade 1 to realize temperature sensing of theturbine blade 1.
When the temperature sensing device is in an operating state, signals related to temperature information of current, resistance and the like of theturbine blade 1 during operation can be sensed through thepatch antenna 22, and the signals are amplified by thediode 23 and harmonic signals carrying the temperature information of the turbine blade to be measured are generated and output to thepatch antenna 22 as responses.
In a specific example of the second embodiment of the present invention, thediode 23 is connected in parallel between thepatch antenna 22 and theturbine blade 1 under test to form a complete circuit of the diodefrequency multiplier circuit 234 and the equivalentresonant circuit 24 according to the first embodiment of the present invention as shown in fig. 5, so as to realize signal transmission.
A third embodiment of the present invention discloses a temperature sensing test system, which includes:
at least one transceiver; and
at least one of the above temperature sensing devices;
wherein the medium substrate process of each temperature sensing device is formed on the metal surface of the measured object.
A fourth embodiment of the present invention discloses a working method of the temperature sensing test system according to the third embodiment of the present invention:
the transceiver transmits a frequency sweep inquiry signal and receives a response signal;
a patch antenna of the temperature sensing device receives a sweep frequency interrogation signal;
the diode of the temperature sensing device receives the sweep frequency inquiry signal, generates a harmonic signal containing the temperature information of the object to be measured as a response signal, and the microstrip antenna outputs the response signal.
The temperature sensing system comprises a plurality of combination devices with different numbers of temperature sensing devices and transceivers. When the number of the transceivers is 1 and the number of the temperature sensing devices is more than or equal to 1, each temperature sensing device can be deposited on different parts of the turbine blade to be measured by using the MEMS process, so that the temperature of the different parts of the turbine blade to be measured during working can be determined, the structure of the turbine blade to be measured does not need to be changed, and the working performance of the turbine blade to be measured is not influenced. Each temperature sensing device may be configured to transmit a plurality of response signals that do not interfere with each other to the transceiver, the diode of each temperature sensing device may generate a harmonic signal containing information on the temperature value of the object to be measured as a response signal based on the sweep interrogation signal received by the corresponding patch antenna, and the patch antenna of each temperature sensing device may receive the response signal and output the response signal to the transceiver. After the transceiver receives the response signals, the transceiver can respectively determine the test temperature information corresponding to each temperature sensing device through the frequency of the transmitted sweep frequency interrogation signal.
When the number of the transceivers is greater than or equal to 1 and the number of the temperature sensing devices is greater than or equal to 1, each temperature sensing device may be configured to transmit a plurality of response signals that do not interfere with each other to each transceiver, and each transceiver may determine the test temperature information corresponding to each temperature sensing device after receiving the response signals. This is the case for remote testing of multiple transceivers to enable remote measurement of real-time temperature of turbine blades being tested at different locations.
In some optional implementations of this embodiment, the transceiver transmits the swept frequency interrogation signal and receives the response signal in a time division multiplexed manner.
The time division multiplexing mode is that different signals are mutually interleaved in different time periods and transmitted along the same channel; the transceiver extracts the signals in each time segment and restores the signals to the original signals. I.e. multiplexing of several independent signals, each arranged at separate periodic time intervals, in order to enable their transmission on one channel. In this way, multiple signals can be transmitted on the same channel.
In a specific example of this embodiment, the emission of the sweep frequency interrogation signals at different test time intervals can be realized by using only one transceiver, and the temperature sensing devices disposed at different positions of the turbine blade under test can further output the response signals corresponding to different test time intervals after receiving the sweep frequency interrogation signals at different test intervals.
In another specific example of this embodiment, a plurality of transceivers may be selected, and different transceivers may customize test time intervals different from those of other transceivers as needed, and since the response signals generated by different temperature sensing devices can be distinguished by using a time division multiplexing method and the frequency of the harmonic signal received by the transceivers, the frequency sweep interrogation signal between the transceivers, the response signal between the temperature sensing devices, and the signal between each transceiver and the corresponding temperature sensing device do not interfere with each other.
Also, in some optional implementations of this embodiment, the length of the patch antenna or the dielectric substrate thickness may be different for different temperature sensing devices. The temperature sensing device can be designed by testing personnel according to different testing requirements.
It should be noted that the temperature sensing test system and the working method provided by the embodiment of the present invention are similar to the principle and the working process of the temperature sensing device provided by the above embodiment, and reference may be made to the above description for relevant points, which are not described herein again.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (10)
1. A temperature sensing device, comprising:
a dielectric substrate;
the patch antenna is positioned on one side surface of the dielectric substrate and at least comprises an exposed part exposed outside the dielectric substrate; the patch antenna is configured to form an electrical connection with an object to be tested; and
the diode is positioned on the surface of one side of the dielectric substrate, and the cathode of the diode penetrates through the thickness of the dielectric substrate to form electric connection with an object to be measured; the anode of the diode is electrically connected with the exposed part of the patch antenna;
the diode is arranged between the patch antenna and the object to be tested in parallel.
2. The device of claim 1, wherein the dielectric substrate is formed with a first via through a thickness of the dielectric substrate, the first via filled with a first conductive member; the exposed part of the patch antenna is electrically connected with a tested object through the first conductive piece;
or the antenna comprises a buried part which penetrates through the thickness of the medium substrate and is buried in the medium substrate to form electric connection with the measured object.
3. The device of claim 1, wherein the dielectric substrate is formed with a second via through a thickness of the dielectric substrate, the second via filled with a second conductive member; and the cathode of the diode is electrically connected with the object to be tested through the second conductive piece.
4. The apparatus of claim 1, further comprising an equivalent resonant circuit for enabling signal transmission between the patch antenna and the diode.
5. The apparatus of claim 1, wherein the dielectric substrate is formed on the metallic surface of the object to be measured by a deposition process.
6. The apparatus of claim 1, wherein the dielectric substrate is a material selected from one or more of alumina, aluminum nitride, and yttria stabilized zirconia.
7. The apparatus of claim 1, wherein the diode further comprises a semiconductor layer; the anode of the diode is made of platinum, the cathode of the diode is made of vanadium, and the semiconductor layer is made of zinc oxide doped with aluminum oxide.
8. A temperature sensing test system, comprising:
at least one transceiver; and
at least one temperature sensing device implementing any one of the preceding claims 1-7;
the medium substrate process of each temperature sensing device is formed on the metal surface of the measured object.
9. A method of operating the temperature sensing test system of claim 8, the method comprising:
the transceiver transmits a frequency sweep inquiry signal and receives a response signal;
the patch antenna of the temperature sensing device receives the swept frequency interrogation signal;
and the diode of the temperature sensing device receives the sweep frequency inquiry signal, generates a harmonic signal containing temperature information of the measured object as a response signal, and the microstrip antenna outputs the response signal.
10. The method of operation of claim 9 wherein the transceiver transmits swept frequency interrogation signals and receives response signals in a time division multiplexed manner.
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| CN202010000596.0ACN111122015A (en) | 2020-01-02 | 2020-01-02 | Temperature sensing device, temperature sensing test system and working method thereof |
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| CN102722746A (en)* | 2012-06-01 | 2012-10-10 | 北京物资学院 | RFID label with thermosensitive device, RFID system and temperature detection method |
| CN105606245A (en)* | 2015-12-18 | 2016-05-25 | 中国电子科技集团公司第四十一研究所 | Non-contact temperature parameter extraction device in superhigh temperature environment |
- 2020
- 2020-01-02CNCN202010000596.0Apatent/CN111122015A/enactivePending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110280279A1 (en)* | 2010-05-12 | 2011-11-17 | Gregory Otto J | Wireless temperature measurement system and methods of making and using same |
| CN102722746A (en)* | 2012-06-01 | 2012-10-10 | 北京物资学院 | RFID label with thermosensitive device, RFID system and temperature detection method |
| CN105606245A (en)* | 2015-12-18 | 2016-05-25 | 中国电子科技集团公司第四十一研究所 | Non-contact temperature parameter extraction device in superhigh temperature environment |
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