CN111030727A - A kind of signal transceiver equipment and electronic equipment - Google Patents
A kind of signal transceiver equipment and electronic equipmentDownload PDFInfo
- Publication number
- CN111030727A CN111030727ACN201911326597.8ACN201911326597ACN111030727ACN 111030727 ACN111030727 ACN 111030727ACN 201911326597 ACN201911326597 ACN 201911326597ACN 111030727 ACN111030727 ACN 111030727A
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- signal
- millimeter wave
- interface contact
- shell
- power
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Transceivers (AREA)
- Telephone Set Structure (AREA)
Abstract
Description
Technical Field
The present invention relates to the field of communications technologies, and in particular, to a signal transceiver and an electronic device.
Background
The fifth Generation mobile communication technology (5th-Generation, 5G) can provide higher communication speed, lower latency, and a larger number of simultaneous connections than the previous Generation technologies. Millimeter wave communication technology with frequency band above 20GHz is one of the key technologies in 5G technology because of its very wide communication bandwidth. In general, the millimeter wave band is divided into 5G bands, and therefore, in the future, various electronic products, particularly mobile communication terminals such as mobile phones, equipped with a millimeter wave antenna module will be increasing.
The user terminal Equipment (CPE) may convert the mobile network signal into a wireless network signal and then connect the wireless network signal to a mobile terminal such as a mobile phone of a user. The space link loss of 5G millimeter wave communication is large, and the power consumption and the heat generation of the mobile terminal are high, so that the 5G millimeter wave network signal can be converted into a wireless network signal and provided for CPE used by a plurality of users, and the practicability is very high.
However, the millimeter wave communication technology and 5G millimeter wave CPE of the current mobile terminal have the following defects:
in order to ensure certain millimeter wave communication quality, more than 2 millimeter wave communication modules are required to be installed at different positions on the mobile terminal. However, due to the limitations of the internal space of mobile terminals such as mobile phones and the like and the influence of the shell material of the mobile terminal on the millimeter wave antenna, the space and the position for installing the millimeter wave communication module in the mobile terminal are very limited, which has a great influence on the communication quality;
the power consumption and the heat productivity of the millimeter wave communication system are very high, so that the battery power consumption of mobile terminals such as mobile phones is high, and the heat dissipation effect inside the terminals is poor;
the mobility of the mobile terminal and the influence of surrounding human bodies and objects can cause the communication quality of millimeter wave communication to be low, and meanwhile, because the mobile terminal needs to continuously scan beams again to search the direction of the base station, the power consumption and the heat productivity of the system are increased;
the current 5G millimeter wave CPE is large in size and needs to be fixedly placed for use. Because the communication range of the wireless network is relatively small, after a user leaves the wireless network communication range of the CPE, the user cannot be connected to the CPE to carry out 5G millimeter wave high-speed communication, and the communication experience of the user is influenced to a great extent.
Disclosure of Invention
The embodiment of the invention provides a signal receiving and transmitting device and an electronic device, and aims to solve the problem that a user cannot be connected to the signal receiving and transmitting device to carry out 5G millimeter wave high-speed communication after leaving a wireless network communication range.
In order to solve the technical problem, the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a signal transceiver device, including:
the device comprises a shell, a first signal interface contact and a second signal interface contact, wherein a power input interface contact, the first signal interface contact and a magnetic component are arranged on the shell;
the millimeter wave array antenna and the wireless network antenna are arranged on the shell;
the radio frequency circuit module is arranged on the shell, wherein the millimeter wave array antenna, the wireless network antenna and the first signal interface contact are respectively connected with the radio frequency circuit module;
and the power supply management chip is arranged on the shell, wherein the power supply input interface contact is connected with the power supply management chip.
In a second aspect, an embodiment of the present invention further provides an electronic device, including a housing, further including: a signal transceiving apparatus as described above;
wherein the signal transceiving equipment is arranged on the housing.
In this way, in the embodiment of the present invention, a power input interface contact, a first signal interface contact and a magnetic component are arranged on a housing, and a millimeter wave array antenna, a wireless network antenna, a radio frequency circuit module and a power management chip are arranged inside the housing, wherein the millimeter wave array antenna, the wireless network antenna and the first signal interface contact are respectively connected to the radio frequency circuit module, and the power input interface contact is connected to the power management chip, so that the power input interface contact can be used as a 5G millimeter wave communication module of an electronic device to provide a 5G millimeter wave high-speed communication function for the electronic device, and can also be used as a signal transceiver to provide a 5G millimeter wave high-speed communication function for a plurality of electronic devices.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic structural diagram of a signal transceiver according to an embodiment of the present invention;
fig. 2 is a second schematic structural diagram of a signal transceiver according to an embodiment of the present invention;
fig. 3 is a third schematic structural diagram of a signal transceiver according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a signal transceiver device according to an embodiment of the present invention connected to an external power source;
FIG. 5 is a second schematic diagram of the connection between the signal transceiver and the external power source according to the embodiment of the invention;
FIG. 6 is a schematic structural diagram of an electronic device according to an embodiment of the invention;
FIG. 7 is a second schematic structural diagram of an electronic device according to an embodiment of the invention;
FIG. 8 is a diagram illustrating an electronic device according to an embodiment of the present invention;
FIG. 9 is a second exploded view of an electronic device according to an embodiment of the invention;
description of reference numerals:
1-shell, 11-power input interface contact, 12-first signal interface contact, 13-magnetic component, 14-millimeter wave array antenna, 15-wireless network antenna, 16-radio frequency circuit module, 17-heat dissipation hole, 18-power access port, 2-shell, 21-battery rear cover, 22-groove, 3-data line and 4-charging seat.
Detailed Description
Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
As shown in fig. 1 to 5, an embodiment of the present invention provides a signal transceiving apparatus, including:
the device comprises ashell 1, wherein a powerinput interface contact 11, a firstsignal interface contact 12 and amagnetic component 13 are arranged on theshell 1;
and the millimeterwave array antenna 14 and thewireless network antenna 15 are arranged on theshell 1. Millimeter-wave array antenna 14 may be disposed on a surface of the housing, i.e., visible in appearance; thewireless network antenna 15 may also be provided on the surface of the housing. The millimeter-wave array antenna 14 may be disposed inside the housing, shielded by external shielding, i.e., invisible in appearance, but the external shielding may penetrate the millimeter-wave signals and not affect the reception and transmission of the millimeter-wave signals. Thewireless network antenna 15 is also similar.
The radiofrequency circuit module 16 is arranged on thehousing 1, wherein the millimeterwave array antenna 14, thewireless network antenna 15 and the firstsignal interface contact 12 are respectively connected with the radiofrequency circuit module 16; therf circuit module 16 may be disposed inside thehousing 1 and enclosed by thehousing 1.
And the power supply management chip is arranged on theshell 1, wherein the power supplyinput interface contact 11 is connected with the power supply management chip. A power management chip may also be provided within thehousing 1.
Specifically, the signal transceiver device may be a CPE or other devices with the same function as the CPE, where the CPE is a mobile signal access device that receives a mobile signal and forwards the mobile signal as a wireless network signal, and is also a device that converts a high-speed 4G or 5G signal into a wireless network signal, and the number of electronic devices that can access the internet at the same time is also large.
Specifically, the signal transceiver device may provide beam scanning and communication functions corresponding to the direction of the orientation according to the orientation of the millimeterwave array antenna 14. The signal transceiver device performs wireless network communication with the electronic device through thewireless network antenna 15, where the number of thewireless network antennas 15 may be Multiple, and a wireless network Multiple-Input Multiple-Output (MIMO) communication function may be performed between the signal transceiver device and the electronic device, so as to improve a communication speed of the wireless network. Therf circuit module 16 may include an integrated circuit of an rf chip.
Specifically, themagnetic component 13 may be a magnetic strip, or may be in other shapes, and may be used to be adsorbed on the surface of an iron object, so as to perform positioning and fixing functions. Millimeter-wave array antenna 14 may include a plurality of millimeter-wave antenna elements that form millimeter-wave array antenna 14. The positions and the number of the powerinput interface contact 11, the firstsignal interface contact 12 and themagnetic component 13 arranged on theshell 1 are not limited; the shape and size of thehousing 1 are not limited.
In the above embodiment of the present invention, a powerinput interface contact 11, a firstsignal interface contact 12 and amagnetic component 13 are arranged on ahousing 1, and a millimeterwave array antenna 14, awireless network antenna 15, a radiofrequency circuit module 16 and a power management chip are arranged inside thehousing 1, wherein the millimeterwave array antenna 14, thewireless network antenna 15 and the firstsignal interface contact 12 are respectively connected to the radiofrequency circuit module 16, and the powerinput interface contact 11 is connected to the power management chip, so that the powerinput interface contact 11 can be used as a 5G millimeter wave communication module of an electronic device to provide a 5G millimeter wave high-speed communication function for the local device, and can also be used as a signal forwarding device to provide a 5G millimeter wave high-speed communication function for a plurality of electronic devices.
Further, as shown in fig. 1 and 2, the number of the millimeterwave array antennas 14 is at least two, and the orientations of at least two of the millimeterwave array antennas 14 are different.
Specifically, the number of the millimeterwave array antennas 14 may be two or more than two, and at least two millimeterwave array antennas 14 have different orientations, and the signal transceiver device may provide beam scanning and communication functions in multiple directions, so as to enhance the communication coverage effect of millimeter wave communication and improve the millimeter wave communication quality.
Further, as shown in fig. 1 to 5, aheat dissipation hole 17 may be formed on thehousing 1.
Specifically, the number of theheat dissipation holes 17 may be one or more, and when the number of theheat dissipation holes 17 is multiple, theheat dissipation holes 17 may be distributed on different side surfaces of thehousing 1, so as to improve the heat dissipation capability of the signal transceiver.
Further, as shown in fig. 2, the signal transceiving apparatus may further include:
and thepower access port 18 is arranged on theshell 1, and thepower access port 18 is connected with the power management chip.
Specifically, as shown in fig. 4 and 5, thepower input interface 18 may be a Universal Serial Bus (USB) interface, and the signal transceiver device may be connected to an external power source through the data line 3, or the signal transceiver device may be connected to the external power source through the chargingdock 4, and is configured to provide continuous electric quantity to the signal transceiver device, so as to ensure that the signal transceiver device provides a 5G millimeter wave high-speed communication function for the electronic device, and make millimeter wave communication more stable.
Further, the signal transceiving equipment may further include:
and the battery is arranged in theshell 1 and is connected with the power management chip.
Specifically, the signal transceiver equipment can be connected with an external power supply through thepower access port 18 under the condition that the signal transceiver equipment comprises a battery, and the battery can supply power to the signal transceiver equipment under the condition that the battery is fully charged, so that the signal transceiver equipment is not required to be connected with the external power supply through the data line 3, and the signal transceiver equipment is more convenient to move.
Furthermore, the signal transceiver device can be provided with other devices such as a camera and a loudspeaker, so that multiple functions are realized.
In the embodiment of the invention, a powerinput interface contact 11, a firstsignal interface contact 12 and amagnetic part 13 are arranged on ashell 1, and a millimeterwave array antenna 14, awireless network antenna 15, a radiofrequency circuit module 16 and a power management chip are arranged inside theshell 1, wherein the millimeterwave array antenna 14, thewireless network antenna 15 and the firstsignal interface contact 12 are respectively connected with the radiofrequency circuit module 16, and the powerinput interface contact 11 is connected with the power management chip, so that the power input interface contact can be used as a 5G millimeter wave communication module of electronic equipment to provide a 5G millimeter wave high-speed communication function for a local machine, and can also be used as a signal forwarding device to provide a 5G millimeter wave high-speed communication function for a plurality of electronic equipment; moreover, the radiating holes 17 are distributed on different side surfaces of thehousing 1, so that the radiating capacity of the signal transceiving equipment can be improved; furthermore, the millimeterwave array antenna 14 can provide wave beam scanning and communication functions in multiple directions, enhance the communication coverage effect of millimeter wave communication, and improve the millimeter wave communication quality.
As shown in fig. 6 to 9, an embodiment of the present invention further provides an electronic device, including ahousing 2, and further including: a signal transceiving apparatus as described in any of the above embodiments;
wherein the signal transceiving equipment is arranged on thehousing 2.
Specifically, when the signal transceiver is connected to the electronic device, the signal transceiver can be connected to an external power source through thepower access port 18 to provide power, so that power consumption of the electronic device can be reduced.
In the above embodiment of the present invention, the signal transceiver is disposed on thehousing 2, and can be used as a 5G millimeter wave communication module of the electronic device to provide a 5G millimeter wave high-speed communication function for the local computer; under the condition that the signal transceiver device is detached from thehousing 2, the signal transceiver device can be used as a signal forwarding device to provide a 5G millimeter wave high-speed communication function for a plurality of electronic devices.
Further, as shown in fig. 6 to 9, thehousing 2 includes a display screen and arear battery cover 21 disposed opposite to the display screen, and the signal transceiver is disposed on therear battery cover 21.
Further, as shown in fig. 6 to 9, agroove 22 is formed on therear cover 21 of the battery, and the signal transceiver is absorbed in thegroove 22 through themagnetic component 13.
Specifically, thebattery back cover 21 may be provided with agroove 22, and the length and width of thegroove 22 may be greater than or equal to those of the signal transceiver device, so that the signal transceiver device may be placed in thegroove 22. The height of thegroove 22 may be less than or equal to the height of the signal transceiver, and the height of thegroove 22 may also be greater than the height of the signal transceiver, which is not limited herein.
Further, as shown in fig. 6 to 9, a power output interface contact and a second signal interface contact are arranged on thehousing 2;
the power output interface contact is electrically connected with the powerinput interface contact 11, and the firstsignal interface contact 12 is electrically connected with the second signal interface contact.
Specifically, the inner wall of thegroove 22 may be provided with a magnetic strip having a magnetic opposite pole attracted to themagnetic member 13, so that when the signal transceiver device is placed in thegroove 22, the magnetic opposite pole is attracted to fix the signal transceiver device in thegroove 22. The number of the firstsignal interface contacts 12 may be the same as that of the second signal interface contacts, the number of the power output interface contacts may be the same as that of the powerinput interface contacts 11, the firstsignal interface contacts 12 are in contact with the second signal interface contacts, and the power output interface contacts are in contact with the powerinput interface contacts 11, so that the signal transceiver device is electrically connected with thehousing 2, and the signal transceiver device is used as a 5G millimeter wave communication module of an electronic device to provide a 5G millimeter wave high-speed communication function for the local computer.
In the above embodiments of the present invention, a mobile phone is used as a specific example of the electronic device of the present invention for illustration, and it can be understood by those skilled in the art that, besides the mobile phone is used as the electronic device, the present invention is also applicable to other electronic devices with a display screen, such as a tablet computer, an electronic book reader, an MP3 (Moving Picture experts Group Audio Layer III) player, an MP4 (Moving Picture experts Group Audio Layer IV) player, a laptop portable computer, a vehicle-mounted computer, a desktop computer, a set-top box, an intelligent television, a wearable device, and the like, which are within the protection scope of the embodiments of the present invention.
In the above embodiment of the present invention, the signal transceiver is disposed on thehousing 2, and can be used as a 5G millimeter wave communication module of the electronic device to provide a 5G millimeter wave high-speed communication function for the local computer; under the condition that the signal transceiving equipment is detached from theshell 2, the signal transceiving equipment can be used as signal forwarding equipment to provide a 5G millimeter wave high-speed communication function for a plurality of electronic equipment; moreover, the radiating holes 17 are distributed on different side surfaces of thehousing 1, so that the radiating capacity of the signal transceiving equipment can be improved; moreover, the millimeterwave array antenna 14 can provide wave beam scanning and communication functions in multiple directions, enhance the communication coverage effect of millimeter wave communication, and improve the millimeter wave communication quality; and, through set up onshell 1magnetic part 13, convenient and fast will signal transceiver equipment is connected fixedly withcasing 2 after signal transceiver equipment andcasing 2 split, signal transceiver equipment can also pass throughmagnetic part 13 and adsorb on the surface of objects such as ironwork, and is more convenient.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
While the preferred embodiments of the present invention have been described, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims.
Claims (9)
1. A signal transceiving apparatus, comprising:
the device comprises a shell (1), wherein a power input interface contact (11), a first signal interface contact (12) and a magnetic component (13) are arranged on the shell (1);
the millimeter wave array antenna (14) and the wireless network antenna (15) are arranged on the shell (1);
the radio frequency circuit module (16) is arranged on the shell (1), wherein the millimeter wave array antenna (14), the wireless network antenna (15) and the first signal interface contact (12) are respectively connected with the radio frequency circuit module (16);
and the power supply management chip is arranged on the shell (1), wherein the power supply input interface contact (11) is connected with the power supply management chip.
2. The signal transceiving apparatus of claim 1, wherein the number of the millimeter wave array antennas (14) is at least two, and at least two of the millimeter wave array antennas (14) have different orientations.
3. The signal transceiving apparatus of claim 1, wherein the housing (1) is provided with a heat dissipation hole (17).
4. The signal-transceiving apparatus of claim 1, further comprising:
and the power access port (18) is arranged on the shell (1), and the power access port (18) is connected with the power management chip.
5. The signal-transceiving apparatus of claim 1, further comprising:
and the battery is arranged in the shell (1) and is connected with the power management chip.
6. An electronic device comprising a housing (2), characterized by further comprising: the signal transceiving apparatus of any of claims 1 to 5;
wherein the signal transceiving equipment is arranged on the housing (2).
7. The electronic device according to claim 6, characterized in that the housing (2) comprises a display screen and a battery back cover (21) arranged opposite to the display screen, the signal transceiving device being arranged on the battery back cover (21).
8. The electronic device according to claim 7, wherein a groove (22) is formed in the rear cover (21), and the signal transceiver is attracted to the groove (22) through the magnetic member (13).
9. The electronic device according to claim 6, characterized in that the housing (2) is provided with a power output interface contact and a second signal interface contact;
the power output interface contact is electrically connected with the power input interface contact (11), and the first signal interface contact (12) is electrically connected with the second signal interface contact.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911326597.8ACN111030727B (en) | 2019-12-20 | 2019-12-20 | Signal receiving and transmitting equipment and electronic equipment |
| PCT/CN2020/136761WO2021121259A1 (en) | 2019-12-20 | 2020-12-16 | Signal transceiving device and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911326597.8ACN111030727B (en) | 2019-12-20 | 2019-12-20 | Signal receiving and transmitting equipment and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111030727Atrue CN111030727A (en) | 2020-04-17 |
| CN111030727B CN111030727B (en) | 2022-02-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911326597.8AActiveCN111030727B (en) | 2019-12-20 | 2019-12-20 | Signal receiving and transmitting equipment and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111030727B (en) |
| WO (1) | WO2021121259A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021121259A1 (en)* | 2019-12-20 | 2021-06-24 | 维沃移动通信有限公司 | Signal transceiving device and electronic device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116346153A (en)* | 2022-12-07 | 2023-06-27 | 歌尔股份有限公司 | Wireless transmission circuit for intelligent wearable device and charging base |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN111030727B (en) | 2022-02-08 |
| WO2021121259A1 (en) | 2021-06-24 |
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