CN110922910A - Film, electronic product and preparation method of film - Google Patents

Abstract

The invention relates to a sticking film, an electronic product and a preparation method of the sticking film, wherein the sticking film is used for being removably stuck on the surface of a stuck object, the surface of the stuck object comprises a plane area and a curved area which are mutually connected, the sticking film comprises a protective film and a sticking layer, and the sticking layer is positioned on the protective film and is used for enabling the protective film to be stuck on the surface of the stuck object; the adhesive layer comprises a first adhesive and a second adhesive, the first adhesive is used for being adhered between the plane area of the adhered object and the protective film, the second adhesive is used for being adhered between the curved surface area of the adhered object and the protective film, and the adhesive force of the first adhesive is smaller than that of the second adhesive. According to the adhesive film, the electronic product and the preparation method of the adhesive film, the protective film can be tightly attached to the surface of the attached object and cannot be peeled from the attached object in the curved surface area of the attached object, and when the protective film is peeled off, the adhesive layer can be peeled off along with the protective film, so that no or little residue can be left on the surface of the attached object.

Description

Film, electronic product and preparation method of film

Technical Field

The invention relates to the technical field of processing or assembling of electronic products, in particular to a film, an electronic product and a preparation method of the film.

Background

In recent years, the design of consumer 3C electronic products or vehicle-mounted products is extended from a traditional 2D plane to a 3D curved surface, and in order to conform to the design trend of terminal products, the processing process is also changed from traditional plane processing to curved surface processing. When processed or assembled electronic products or parts thereof are transported or shipped on a production line, a protective film is generally attached to the surfaces of the electronic products or the parts thereof. The protective film is used for protecting the surfaces of electronic products or parts thereof and preventing the electronic products or the parts from being scratched. The surface is pasted with the electronic product or the spare part of the electronic product which is pasted with the protective film is called as the pasted object for short. However, in the existing protective film for manufacturing process or shipment, in order to overcome the problem of curved surface sticking, the adhesion between the protective film and the object to be stuck is often improved, the difficulty of subsequent tearing is increased, and the risk of adhesive residue on the surface of the object to be stuck is also increased.

Disclosure of Invention

Accordingly, there is a need for a film, an electronic product and a method for manufacturing the film, so as to solve the above-mentioned problems.

The sticking film is used for being removably stuck on the surface of a stuck object, the surface of the stuck object comprises a plane area and a curved area which are connected with each other, the sticking film comprises a protective film and a sticking layer, and the sticking layer is positioned on the protective film and used for enabling the protective film to be stuck on the surface of the stuck object; the adhesive layer comprises a first adhesive and a second adhesive, the first adhesive is used for being adhered between the plane area of the adhered object and the protective film, the second adhesive is used for being adhered between the curved surface area of the adhered object and the protective film, and the adhesive force of the first adhesive is smaller than that of the second adhesive.

In one embodiment, the first adhesive has an adhesive force of less than 1N/inch and the second adhesive has an adhesive force of greater than 1N/inch.

In one embodiment, the second adhesive surrounds the first adhesive.

In one embodiment, the patch is in the form of a sheet or a roll.

The invention also provides an electronic product, which comprises the adhesive film and an attached object, wherein the adhesive film is removably attached to the surface of the attached object, the surface of the attached object comprises a planar area and a curved area which are connected with each other, a first adhesive of the adhesive film is attached between the planar area of the attached object and the protective film, a second adhesive of the adhesive film is attached between the curved area of the attached object and the protective film, and the adhesive force of the first adhesive is smaller than that of the second adhesive.

In one embodiment, the R angle arc of the curved surface area of the surface of the attached object is more than 30 degrees.

The invention also provides a preparation method of the adhesive film, which comprises the following steps: step S1: disposing the adhesive layer on a protective film; step S2: according to the surface condition of the attached object, the adhesive layer is subjected to partition processing, so that the adhesive layer is divided into a first area and a second area, the first area corresponds to the plane area of the attached object, the second area corresponds to the curved area of the attached object, the first area forms the first adhesive, and the second area forms the second adhesive.

In one embodiment, the adhesive layer is a UV type sensing adhesive, and in step S1, a pre-cured UV type sensing adhesive is disposed on the protective film; in step S2, the pre-cured UV-sensitive adhesive is cured in a partitioned manner, so that the first adhesive is formed in the first area and the second adhesive is formed in the second area.

In one embodiment, in the step S2, a light shielding cover with a hollow middle portion is first disposed above the second area of the adhesive layer; then all areas of the sticking layer are subjected to UV illumination; and after the illumination is finished, removing the light shield, so that a first adhesive is formed in the first area of the pasting layer, and a second adhesive is formed in the second area of the pasting layer.

In one embodiment, in step S2, a release film is first disposed on the adhesive layer, where a position of the release film corresponding to the first area of the adhesive layer is a light-transmitting area, and a position of the release film corresponding to the second area of the adhesive layer is provided with a light-shielding ink; then all areas of the sticking layer are subjected to UV illumination; and after the illumination is finished, removing the release film, so that a first adhesive is formed in the first area of the pasting layer, and a second adhesive is formed in the second area of the pasting layer.

In one embodiment, the light-blocking ink is disposed on the release film by spraying, ink-jet printing, screen printing, or transfer printing.

The film, the electronic product and the film pasting method thereof have the beneficial effects that:

according to the film, the electronic product and the film pasting method thereof, the pasting layer is partitioned to enable the pasting layer to comprise the first adhesive and the second adhesive, the first adhesive is used for being pasted between the plane area of the pasted object and the protective film, the second adhesive is used for being pasted between the curved surface area of the pasted object and the protective film, the adhesive force of the first adhesive is smaller than that of the second adhesive, and therefore the protective film can be tightly pasted on the surface of the pasted object and cannot be peeled from the pasted object in the curved surface area of the pasted object. In addition, the first adhesive used for being adhered between the plane area of the adhered object and the protective film has small adhesive force, so when the protective film is removed, the adhering layer can be torn off along with the protective film, and no or little residue can be left on the surface of the adhered object.

Drawings

Fig. 1 is a longitudinal sectional view of an electronic product in one embodiment of the invention.

Fig. 2 is a schematic view of a sheet adhesive layer according to an embodiment of the present invention.

Fig. 3 is a schematic view of a portion of a web-form adhesive layer along a length in accordance with an embodiment of the present invention.

Figure 4 is a longitudinal cross-sectional view of a web-form adhesive layer in the width direction according to one embodiment of the present invention.

Fig. 5a is a schematic structural diagram of a first step of a method for preparing a sheet adhesive layer according to an embodiment of the present invention.

Fig. 5b is a schematic view of a light shield disposed on an adhesive layer in a method for manufacturing a sheet type adhesive layer according to an embodiment of the present invention.

Fig. 5c is a schematic view of the structure of the sheet type adhesive layer in the UV irradiation in the method for preparing the adhesive layer according to an embodiment of the present invention.

Fig. 5d is a schematic structural view of the sheet type adhesive layer manufacturing method according to an embodiment of the present invention after removing the light shielding cover.

Fig. 6a is a schematic diagram of the first step of the roll-to-roll cling layer manufacturing process in accordance with an embodiment of the present invention.

Fig. 6b is a schematic structural view illustrating a release film disposed on an adhesive layer in a method for manufacturing a roll type adhesive layer according to an embodiment of the present invention.

Fig. 6c is a schematic view of the structure of the roll type adhesive layer in the UV irradiation in the manufacturing method of the roll type adhesive layer according to an embodiment of the present invention.

Fig. 6d is a schematic structural view of the sheet type adhesive layer manufacturing method according to an embodiment of the present invention after the release film is removed.

Reference numerals:

the light-shielding film comprises an attachedobject 100, aplane area 110, acurved area 120, anadhesive layer 200, afirst adhesive 210, asecond adhesive 220, afirst area 230, asecond area 240, aprotective film 300, alight shield 400, arelease film 500, a light-transmittingarea 510 and light-shielding ink 520.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "inner", "outer", "left", "right" and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

In one embodiment, the electronic product has a longitudinal cross-sectional structure as shown in fig. 1, and includes an adherend 100 and a sticker, the sticker is used for being removably attached to a surface of theadherend 100, the surface of theadherend 100 includes aplanar area 110 and acurved area 120 connected to each other, theplanar area 110 is located at a central position of the surface of theadherend 100, thecurved area 120 is located at an edge position of the surface of the adherend 100, and thecurved area 120 surrounds theplanar area 110, the sticker includes aprotection film 300 and anadhesive layer 200, theprotection film 300 is removably attached to the surface of theadherend 100 and is used for preventing the surface of theadherend 100 from being scratched, theadhesive layer 200 is located on a side of theprotection film 300 close to the surface of theadherend 100 and is used for enabling theprotection film 300 to be attached to the surface of theadherend 100, theadhesive layer 200 includes afirst adhesive 210 and asecond adhesive 220, thesecond adhesive 220 surrounds thefirst adhesive 210, thefirst adhesive 210 is located between theplanar area 110 of the adherend 100 and theprotection film 300, thesecond adhesive 220 is located between thearea 120 of the adherend 100 and theprotection film 300, the curved area of the first adhesive 35n is less than 1, and N is greater than N of the curved area of the second adhesive of the adhesive 120.

As shown in fig. 1, theplanar area 110 of theadherend 100 is located at the center of theadherend 100, and thecurved area 120 of theadherend 100 is located at the edge of theadherend 100, and the shape of the adhesive film and theadhesive layer 200 may be a sheet type or a roll type depending on the surface shape of theadherend 100. In one embodiment, the sheetadhesive layer 200 is shaped as shown in figure 2. theadhesive layer 200 includes afirst area 230 and asecond area 240, thefirst adhesive 210 is located in thefirst area 230 and thesecond adhesive 220 is located in thesecond area 240, thefirst area 230 and thesecond area 240 are located in the same plane, thefirst area 230 is located in a central location of theadhesive layer 200 and thesecond area 240 is located at an edge location of theadhesive layer 200, and thesecond area 240 surrounds thefirst area 230.

In another embodiment, the adhesive patch andlayer 200 is in the form of a roll, theadhesive patch 200 is partially configured in the longitudinal direction as shown in figure 3, theadhesive patch 200 is partially configured in the transverse direction as shown in figure 4, and as can be seen in figures 3 and 4, theadhesive patch 200 includes afirst area 230 and asecond area 240, thefirst area 230 and thesecond area 240 each extending along the longitudinal direction of theadhesive patch 200, thefirst adhesive 210 is located in thefirst area 230, thesecond adhesive 220 is located in thesecond area 240, thefirst area 230 and thesecond area 240 are located in the same plane, thefirst area 230 is located at a central location of theadhesive patch 200, thesecond area 240 is located at an edge location of theadhesive patch 200, and thesecond area 240 surrounds thefirst area 230.

In one embodiment, a film pasting method for the electronic product is provided, which includes the following steps: step S1: disposing theadhesive layer 200 on theprotective film 300; step S2: according to the surface condition of the attachedobject 100, theadhesive layer 200 is subjected to partition processing, so that theadhesive layer 200 is divided into afirst area 230 and asecond area 240, thefirst area 230 corresponds to theplanar area 110 of the attachedobject 100, thesecond area 240 corresponds to thecurved area 120 of the attachedobject 100, thefirst area 230 forms afirst adhesive 210, thesecond area 240 forms a second adhesive 220, and the adhesive force of thefirst adhesive 210 is smaller than that of the second adhesive 220; step S3: theprotection film 300 is attached to the surface of theobject 100, thefirst adhesive 210 is attached between theplanar area 110 of theobject 100 and theprotection film 300, and the second adhesive 220 is attached between thecurved area 120 of theobject 100 and theprotection film 300. Step S1 and step S2 described above refer to a method for producing a patch.

In one embodiment, theadhesive layer 200 is a UV type sensing adhesive, the shape of the adhesive film and theadhesive layer 200 is a sheet type, and in step S1, as shown in fig. 5a, a pre-cured UV type sensing adhesive is disposed on theprotective film 300; in step S2, the pre-cured UV-sensitive adhesive is subjected to a partition curing process, such that thefirst area 230 forms thefirst adhesive 210 and thesecond area 240 forms the second adhesive 220. More specifically, as shown in fig. 5b, theadhesive layer 200 is divided into afirst area 230 and asecond area 240, thefirst area 230 corresponds to theplanar area 110 of theobject 100, thesecond area 240 corresponds to thecurved area 120 of theobject 100, thelight shielding cover 400 with a hollow middle portion is disposed above thesecond area 240 of theadhesive layer 200, the structure of thelight shielding cover 400 disposed above thesecond area 240 of theadhesive layer 200 is shown in fig. 5c, thesecond area 240 of theadhesive layer 200 is shielded by thelight shielding cover 400, then all areas of theadhesive layer 200 are subjected to UV light irradiation, the direction of the UV light irradiation is shown by an arrow in fig. 5c, the pre-cured UV sensitive adhesive distributed in thesecond area 240 of theadhesive layer 200 is not cured due to being shielded by thelight shielding cover 400, so that a high adhesive force is maintained, the pre-cured UV sensitive adhesive distributed in thefirst area 230 of theadhesive layer 200 is cured without being shielded by thelight shielding cover 400, and therefore has less adhesion; after the light irradiation is finished, as shown in fig. 5d, thelight shielding cover 400 is removed, the removing direction is shown by an arrow in fig. 5d, after thelight shielding cover 400 is removed, thefirst adhesive 210 is formed in thefirst area 230 of theadhesive layer 200, thesecond adhesive 220 is formed in thesecond area 240 of theadhesive layer 200, the adhesive force of thefirst adhesive 210 is smaller than that of thesecond adhesive 220, thefirst adhesive 210 is the pre-cured UV-sensitive adhesive with higher adhesive force that is firstly disposed on theprotective film 300, and thesecond adhesive 220 is the UV-sensitive adhesive with lower adhesive force after being cured.

In another embodiment, theadhesive layer 200 is a UV type sensitive adhesive, the shape of the adhesive film and theadhesive layer 200 is a roll type, and in step S1, as shown in fig. 6a, a pre-cured UV type sensitive adhesive is disposed on theprotective film 300; in step S2, first, as shown in fig. 6b, therelease film 500 is disposed on theadhesive layer 200, the position of therelease film 500 corresponding to thefirst region 230 of theadhesive layer 200 is the light-transmittingregion 510, and the position corresponding to thesecond region 240 of theadhesive layer 200 is disposed with the light-shieldingink 520; after therelease film 500 is disposed on theadhesive layer 200, as shown in fig. 6c, UV light is applied to all areas of theadhesive layer 200, the direction of the UV light is shown by an arrow in fig. 6c, the pre-cured UV-sensitive adhesive distributed in thesecond area 240 of theadhesive layer 200 is not cured due to being shielded by the light-shieldingink 520, so that high adhesive force is maintained, and the pre-cured UV-sensitive adhesive distributed in thefirst area 230 of theadhesive layer 200 is cured due to not being shielded by the light-shieldingink 520, so that low adhesive force is achieved; after the light irradiation is finished, as shown in fig. 6d, therelease film 500 is removed, the removing direction is shown by an arrow in fig. 6d, after therelease film 500 is removed, thefirst adhesive 210 is formed in thefirst area 230 of theadhesive layer 200, and thesecond adhesive 220 is formed in thesecond area 240 of theadhesive layer 200, where thefirst adhesive 210 is the pre-cured UV-type adhesive with higher adhesive force that is firstly disposed on theprotective film 300, and thesecond adhesive 220 is the UV-type adhesive with lower adhesive force after being cured.

In a specific embodiment, the light-shieldingink 520 is disposed on therelease film 500 by spraying, ink-jet printing, screen printing, or transferring. Theadhesive layer 200 is a UV type sensitive adhesive, and more specifically, a UV Hotmelt adhesive material such as BASF 3532 or 204 may be used.

In the above embodiment, by selecting the UV type sensing adhesive as theadhesive layer 200, and utilizing the characteristic that after the UV type sensing adhesive is cured by UV light, the adhesive force is reduced, theadhesive layer 200 is first partitioned, so that theadhesive layer 200 is divided into thefirst area 230 and thesecond area 240, thefirst area 230 corresponds to theplanar area 110 of theobject 100, thesecond area 240 corresponds to thecurved area 120 of theobject 100, and then thelight shielding cover 400 with a hollow middle portion is disposed above thesecond area 240 of theadhesive layer 200, or therelease film 500 with thelight shielding ink 520 is disposed on theadhesive layer 200. Accordingly, after the UV irradiation is performed on theadhesive layer 200, the pre-cured UV-sensitive adhesive distributed in thesecond area 240 of theadhesive layer 200 remains high in adhesive force because it is not cured due to the shielding of thelight shield 400 or thelight shielding ink 520, and the pre-cured UV-sensitive adhesive distributed in thefirst area 230 of theadhesive layer 200 remains low in adhesive force because it is cured without being shielded. The method for processing theadhesive layer 200 in a partitioned manner is simple to operate, the adhesive force of thesecond adhesive 220 can be controlled by controlling the pre-curing degree of the pre-cured UV type induction glue, and the adhesive force of thefirst adhesive 210 can be controlled by controlling the intensity and time of subsequent UV illumination, so that the method for processing theadhesive layer 200 in a partitioned manner is easy to control in process and strong in practicability.

Theadhesive layer 200 is divided into afirst adhesive 210 and asecond adhesive 220, thefirst adhesive 210 is used for adhering between theplanar area 110 of theobject 100 and theprotective film 300, thesecond adhesive 220 is used for adhering between thecurved area 120 of theobject 100 and theprotective film 300, the adhesive force of thefirst adhesive 210 is smaller than that of thesecond adhesive 220, so that theprotective film 300 can be tightly adhered to the surface of theobject 100 without being peeled off from thecurved area 120 of theobject 100, and in addition, the adhesive force of thefirst adhesive 210 adhered between theplanar area 110 of theobject 100 and theprotective film 300 is smaller, so when theprotective film 300 is peeled off, theadhesive layer 200 can be peeled off along with theprotective film 300, and no residue or little residue can be left on the surface of the object.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. The adhesive film is characterized by being removably attached to the surface of an attached object, wherein the surface of the attached object comprises a plane area and a curved area which are connected with each other, the adhesive film comprises a protective film and an adhesive layer, and the adhesive layer is positioned on the protective film and used for enabling the protective film to be attached to the surface of the attached object; the adhesive layer comprises a first adhesive and a second adhesive, the first adhesive is used for being adhered between the plane area of the adhered object and the protective film, the second adhesive is used for being adhered between the curved surface area of the adhered object and the protective film, and the adhesive force of the first adhesive is smaller than that of the second adhesive.

2. The film of claim 1, wherein the first adhesive has an adhesion of less than 1N/inch and the second adhesive has an adhesion of greater than 1N/inch.

3. The film of claim 1 wherein the second adhesive surrounds the first adhesive.

4. An electronic product, comprising:

the adhesive film of any one of claims 1 to 3; and

the adhesive film is removably attached to the surface of the attached object, the surface of the attached object comprises a plane area and a curved area which are connected with each other, the first adhesive of the adhesive film is attached between the plane area of the attached object and the protective film, and the second adhesive of the adhesive film is attached between the curved area of the attached object and the protective film.

5. The electronic product of claim 4, wherein the R-angle arc of the surface curved region of the object is greater than 30 °.

6. A method for producing the patch according to claims 1 to 3, which comprises:

step S1: disposing the adhesive layer on a protective film;

step S2: according to the surface condition of the object to be pasted, the pasting layer is subjected to partition processing, so that the pasting layer is divided into a first area and a second area, the first area corresponds to the plane area of the object to be pasted, the second area corresponds to the curved area of the object to be pasted, the first area forms the first viscose, the second area forms the second viscose, and the adhesive force of the first viscose is smaller than that of the second viscose.

7. The method for preparing a patch according to claim 6, wherein the adhesive layer is a UV type sensitive adhesive, and in the step S1, a pre-cured UV type sensitive adhesive is disposed on the protective film; in step S2, the pre-cured UV-sensitive adhesive is cured in a partitioned manner, so that the first adhesive is formed in the first area and the second adhesive is formed in the second area.

8. The method for preparing a patch according to claim 7, wherein in step S2, a light shielding cover with a hollow central portion is first disposed above the second area of the adhesive layer; then all areas of the sticking layer are subjected to UV illumination; and after the illumination is finished, removing the light shield, so that a first adhesive is formed in the first area of the pasting layer, and a second adhesive is formed in the second area of the pasting layer.

9. The method for preparing a patch according to claim 7, wherein in the step S2, a release film is first provided on the adhesive layer, wherein a position of the release film corresponding to the first area of the adhesive layer is a light-transmitting area, and a position of the release film corresponding to the second area of the adhesive layer is provided with a light-blocking ink; then all areas of the sticking layer are subjected to UV illumination; and after the illumination is finished, removing the release film, so that a first adhesive is formed in the first area of the pasting layer, and a second adhesive is formed in the second area of the pasting layer.

10. The method for preparing the adhesive film according to claim 9, wherein the light-shielding ink is disposed on the release film by spraying, ink-jet printing, screen printing or transfer printing.

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