CN110806770A - Temperature control method, temperature control system and vehicle-mounted entertainment machine - Google Patents

Abstract

The application provides a temperature control method, which comprises the following steps: acquiring the current temperature of a heating load in the vehicle-mounted entertainment machine; comparing the current temperature with a preset temperature range; and if the current temperature is within the preset temperature range, reducing the working parameters of the heating load. The temperature control method solves the problem that an effective temperature control method is not available in the conventional vehicle-mounted entertainment machine. The application also provides a temperature control system and a vehicle-mounted entertainment machine.

Description

Temperature control method, temperature control system and vehicle-mounted entertainment machine

Technical Field

The application relates to the technical field of automobiles, in particular to a temperature control method, a temperature control system and a vehicle-mounted entertainment machine.

Background

The vehicle-mounted entertainment machine is a main machine of the vehicle-mounted entertainment system and is an important component of the vehicle-mounted entertainment system. Along with the functions of the vehicle-mounted entertainment system are more and more, the load of the vehicle-mounted entertainment machine is larger and larger, and therefore the heat dissipation requirement is larger and larger. In order to reduce the probability of failure of the host due to excessive power consumption and even avoid the problem of burning the whole machine, it is more important to control the heat generated by the host. However, the existing in-vehicle entertainment machine has no effective temperature control method for regulating the temperature thereof in real time.

Disclosure of Invention

The application provides a temperature control method, a temperature control system and a vehicle-mounted entertainment machine, and solves the problem that the existing vehicle-mounted entertainment machine does not have an effective temperature control method to regulate and control the temperature of the vehicle-mounted entertainment machine in real time.

The application provides a temperature control method, which comprises the following steps:

acquiring the current temperature of a heating load in the vehicle-mounted entertainment machine;

comparing the current temperature with a preset temperature range;

and if the current temperature is within the preset temperature range, reducing the working parameters of the heating load.

Wherein the temperature control method further comprises: and when the current temperature exceeds the preset temperature range, controlling the heating load to stop running.

Wherein, after the reducing the operating parameter of the heat generating load if the current temperature is within the preset temperature range, the temperature control method further comprises:

the temperature of the heat generating load is continuously monitored.

Wherein, the heating load includes a chip system and a power amplifier, the current temperature includes a first current temperature and a second current temperature, the obtaining the current temperature of the heating load in the in-vehicle entertainment machine includes:

acquiring the first current temperature of the chip system;

acquiring the second current temperature of the power amplifier.

Wherein, predetermine the temperature range and include first preset temperature range and the second preset temperature range, will current temperature and preset the temperature range and compare and include:

comparing the first current temperature with the first preset temperature range;

and comparing the second current temperature with the second preset temperature range.

Wherein the operating parameters include a frequency parameter, a process parameter, and a volume parameter, and if the current temperature is within the preset temperature range, the reducing the operating parameters of the heat generating load includes:

if the first current temperature is within the first preset temperature range, reducing the frequency parameter and/or the process parameter of the chip system;

and if the second current temperature is within the second preset temperature range, reducing the volume parameter of the power amplifier.

Wherein, if the first current temperature is within the first preset temperature range, reducing the frequency parameter and/or the process parameter of the chip system comprises:

reducing the operating frequency of the system-on-chip, and/or shutting down the processes that are not operating in the system-on-chip.

If the second current temperature is within the second preset temperature range, reducing the volume parameter of the power amplifier comprises:

acquiring the current working volume of the power amplifier;

comparing the current working volume with a preset volume;

and if the current working volume is larger than the preset volume, adjusting the current working volume of the power amplifier to the preset volume.

If the second current temperature is within the second preset temperature range, the volume of the power amplifier cannot be adjusted by a user; and if the second current temperature is lower than the second preset temperature range, the user can adjust the volume of the power amplifier.

The present application further provides a temperature control system, the temperature control system includes:

the acquisition module is used for acquiring the current temperature value of the heating load in the vehicle-mounted entertainment machine;

the comparison module is used for comparing the current temperature value with a preset temperature value range;

and the control module is used for reducing the working parameters of the heating load if the current temperature value is within the preset temperature value range.

The present application further provides an in-vehicle entertainment machine, including: the power supply, the switch, the controller and the load that generates heat, the power the switch and the load that generates heat all with the controller electricity is connected, the load that generates heat includes chip system and power amplifier, the switch with chip system with the power electricity is connected, the controller with the switch cooperatees according to chip system's current temperature real time control chip system's operating condition, power amplifier with the power with the controller electricity is connected, the controller is according to power amplifier's current temperature real time control power amplifier's operating condition.

This application is through right in the on-vehicle amusement machine the load that generates heat detects, and obtain according to the detection the data of the load that generates heat come right the operating parameter of the load that generates heat adjusts, thereby control the temperature of on-vehicle amusement machine effectively reduces the probability that the on-vehicle amusement machine caused the inefficacy because of the consumption is too big generates heat, improves the life of on-vehicle amusement machine.

Drawings

In order to more clearly illustrate the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic flow chart of a temperature control method according to an embodiment of the present disclosure.

Fig. 2 is a schematic configuration diagram of the in-vehicle entertainment machine.

Fig. 3 is a schematic flow chart of another temperature control method according to an embodiment of the present disclosure.

Fig. 4 is a schematic structural diagram of a temperature control system according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The following description of the various embodiments refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings). Directional phrases used in this disclosure, such as, for example, "upper," "lower," "front," "rear," "left," "right," "inner," "outer," "side," and the like, refer only to the orientation of the appended drawings and are, therefore, used herein for better and clearer illustration and understanding of the invention, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; may be a mechanical connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. It should be noted that the terms "first", "second", and the like in the description and claims of the present application and in the drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions.

Referring to fig. 1, fig. 1 is a schematic flow chart of a temperature control method for real-time controlling the temperature of a vehicle-mounted entertainment machine according to an embodiment of the present application, where the temperature control method at least includes the following steps S110 to S130.

S110: the current temperature of a heat-generating load in the in-vehicle entertainment machine is acquired.

Specifically, referring to fig. 2, fig. 2 is a schematic structural diagram of the in-vehicle entertainment machine 100. The in-vehicle entertainment machine 100 includes apower source 10, aswitch 20, acontroller 30 and aheat generating load 40, wherein thecontroller 30 is electrically connected to thepower source 10, theswitch 20 and theheat generating load 40, theswitch 20 is electrically connected to thepower source 10 and theheat generating load 40, and thecontroller 30 is matched with theswitch 20 to control the working state of theheat generating load 40 in real time. The operating state here includes a normal operating state, an operating parameter for reducing a heat generating load, and a stop operating state.

In this embodiment, theheat generating load 40 at least includes a system-on-chip 41 and a power amplifier 42, oneswitch 20 is provided, and oneswitch 20 is provided between the system-on-chip 41 and thepower supply 10. The current temperature includes a first current temperature and a second current temperature, the first current temperature is the current temperature of the chip system 41, and the second current temperature is the current temperature of the power amplifier 42.

The acquiring of the current temperature of the heat-generatingload 40 in the in-vehicle entertainment machine 100 may specifically include: acquiring the first current temperature of the chip system 41; and, the second present temperature of the power amplifier 42 is acquired. Specifically, the first current temperature is obtained through a relevant temperature detection module in the chip system 41, and the second current temperature is obtained through thecontroller 30. Of course, in other embodiments, theheat generating load 40 further includes other heat generating electronic components such as a display screen. The first current temperature may also be acquired by thecontroller 30. Wherein, temperature detection module can have temperature real-time measurement function for thermometer, temperature detection circuit etc. and have the temperature detection module of higher precision and sensitivity, and this application does not do specific limit to this concrete expression form.

S120: and comparing the current temperature with a preset temperature range.

Specifically, the preset temperature range includes a first preset temperature range and a second preset temperature range, and the first preset temperature range is a temperature range of the chip system 41 that needs to be adjusted. The second preset temperature range is a temperature range in which the power amplifier 42 needs to perform the adjustment operation.

In this embodiment, comparing the current temperature with the preset temperature range may specifically include: comparing the first current temperature with the first preset temperature range; and comparing the second current temperature with the second preset temperature range. In this embodiment, the temperature detection module associated with the chip system 41 may compare the first current temperature with the first preset temperature range, and thecontroller 30 compares the second current temperature with the second preset temperature range. Of course, in other embodiments, the first current temperature may be compared with the first preset temperature range by thecontroller 30.

S130: and if the current temperature is within the preset temperature range, reducing the working parameters of theheating load 40.

Specifically, the operating parameters include a frequency parameter, a process parameter, and a volume parameter, where the frequency parameter corresponds to an operating process of the chip system 41, and the volume parameter corresponds to an operating volume of the power amplifier 42.

In this embodiment, if the current temperature is within the preset temperature range, the reducing the operating parameters of theheat generating load 40 may specifically include:

if the first current temperature is within the first preset temperature range, the frequency parameter and/or the process parameter of the chip system 41 are/is decreased. For example, the first current temperature of the system-on-chip 41 is n degrees, and the first predetermined temperature range is T1-T2 degrees, if T1 ≦ n < T2, the frequency parameter and/or the process parameter of the system-on-chip 41 are decreased. In this embodiment, if n is greater than or equal to T1 and less than T2, the frequency parameter and the process parameter of the system-on-chip 41 are reduced, so that the temperature of the system-on-chip 41 can be rapidly reduced. Specifically, the frequency parameter of the chip system 41 is reduced by reducing the operating frequency of the chip system 41. For example, the operating frequency of the system-on-chip 41 in the normal operating state (i.e., when n < T1) is 1GHz, and when T1 ≦ n < T2, the operating frequency of the system-on-chip 41 is reduced from 1GHz to 700MHz, thereby reducing the amount of heat generated by the system-on-chip 41. The way to reduce the process parameter of the chipset system 41 is to close the idle process in the chipset system 41, in other words, close the background running process in the chipset system 41, and specifically, the related process management module in the chipset system 41 completes this operation. In the embodiment, the frequency parameter and the process parameter of the chip system 41 are reduced, so that the operating power consumption of the chip system 41 is effectively reduced, the temperature of the chip system 41 is effectively reduced, the first current temperature n is less than T1, the problem that the chip system 41 fails due to the influence of heat generated by the chip system 41 on the chip system and other electronic components in the vehicle-mountedentertainment machine 100 is avoided, the working performance of the chip system 41 is ensured, and the service life of the vehicle-mountedentertainment machine 100 is prolonged. If n < T1, then system-on-chip 41 is operating normally, i.e., system-on-chip 41 is in a normal operating state. Of course, in other embodiments, if the first current temperature is within the first preset temperature range, only the frequency parameter of the system-on-chip 41 may be reduced, or only the process parameter of the system-on-chip 41 may be reduced. The system-on-chip 41 may be controlled by thecontroller 30 to reduce a frequency parameter and/or a process parameter.

If the second current temperature is within the second preset temperature range, the volume parameter of the power amplifier 42 is decreased. For example, the second current temperature of the power amplifier 42 is m degrees, and the second predetermined temperature range is T3-T4 degrees, if T3 ≦ m < T4, the volume parameter of the power amplifier 42 is decreased. Specifically, first, thecontroller 30 obtains the current working volume of the power amplifier 42, then compares the current working volume with a preset volume, and if the current working volume is greater than the preset volume, the current working volume of the power amplifier 42 is adjusted to the preset volume. And if the current working volume is less than or equal to the preset volume, keeping the volume unchanged. If m < T3, the power amplifier 42 is operating normally, i.e., the power amplifier 42 is in a normal operating state.

If the second current temperature is within the second preset temperature range, the working volume of the power amplifier 42 may not be adjusted by the user, that is, if T3 is not less than m < T4, thecontroller 30 controls the power amplifier 42 to adjust the working volume to the preset volume, the volume adjusting function of the power amplifier 42 is locked, and at this time, the user may not adjust the working volume of the power amplifier 42 at will. If the second current temperature is lower than the second preset temperature range, the user may adjust the operating volume of the power amplifier 42, that is, if m < T3, the user may optionally adjust the operating volume of the power amplifier 42. By controlling the working volume of the power amplifier 42, the performance of the power amplifier 42 and other electronic components arranged around the power amplifier 42 are prevented from being affected by the overhigh temperature of the power amplifier 42, the working performance of the power amplifier 42 is ensured, and the service life of the vehicle-mountedentertainment machine 100 is prolonged.

And if the current temperature exceeds the preset temperature range, controlling the heat-generatingload 40 to stop running, namely controlling the heat-generatingload 40 to be in a running stop state. Specifically, when the first current temperature of the chip system 41 exceeds the first preset temperature range, that is, when n is greater than or equal to T2, the temperature information is sent to thecontroller 30, and thecontroller 30 controls theswitch 20 to be turned off, so that the chip system 41 is turned off, and the condition that the chip system 41 is failed due to an excessively high temperature is avoided in time. After the heat of the system-on-chip 41 is dissipated, that is, when the first current temperature n < T2, theswitch 20 is controlled to be closed, and specifically, the reclosing of theswitch 20 can be controlled by presetting the time length for opening theswitch 20, so as to automatically open the system-on-chip 41. In other embodiments, thecontroller 30 may directly control the power amplifier 42 to stop operating when the second current temperature of the power amplifier 42 exceeds the second predetermined temperature range, i.e., when m ≧ T4. When the heat of the power amplifier 42 is dissipated, i.e., when the second current temperature m < T4, the power amplifier 42 is controlled to restart.

Theheating load 40 in the vehicle-mountedentertainment machine 100 is detected, the working parameters of theheating load 40 are adjusted according to the data of theheating load 40 obtained through detection, so that the temperature of the vehicle-mountedentertainment machine 100 is controlled, the probability of failure caused by heating of the vehicle-mountedentertainment machine 100 due to overlarge power consumption is effectively reduced, and the service life of the vehicle-mountedentertainment machine 100 is prolonged.

Referring to fig. 3, fig. 3 is a schematic flow chart of another temperature control method according to an embodiment of the present disclosure, where the temperature control method is used for controlling the temperature of the in-vehicle entertainment machine in real time, and the temperature control method at least includes the following steps S210 to S240.

S210: the current temperature of the heat-generatingload 40 in the in-vehicle entertainment machine 100 is acquired.

Specifically, referring to fig. 2, fig. 2 is a schematic structural diagram of the in-vehicle entertainment machine 100. The in-vehicle entertainment machine 100 includes apower source 10, aswitch 20, acontroller 30 and aheat generating load 40, wherein thecontroller 30 is electrically connected to thepower source 10, theswitch 20 and theheat generating load 40, theswitch 20 is electrically connected to thepower source 10 and theheat generating load 40, and thecontroller 30 is matched with theswitch 20 to control the working state of theheat generating load 40 in real time. The operating state here includes a normal operating state, an operating parameter for reducing a heat generating load, and a stop operating state.

In this embodiment, theheat generating load 40 at least includes a system-on-chip 41 and a power amplifier 42, oneswitch 20 is provided, and oneswitch 20 is provided between the system-on-chip 41 and thepower supply 10. The current temperature includes a first current temperature and a second current temperature, the first current temperature is the current temperature of the chip system 41, and the second current temperature is the current temperature of the power amplifier 42.

The acquiring of the current temperature of the heat-generatingload 40 in the in-vehicle entertainment machine 100 may specifically include: acquiring the first current temperature of the chip system 41; and, the second present temperature of the power amplifier 42 is acquired. Specifically, the first current temperature is obtained through a relevant temperature detection module in the chip system 41, and the second current temperature is obtained through thecontroller 30. Of course, in other embodiments, theheat generating load 40 may also include other heat generating electronic components such as a display screen. The first current temperature may also be acquired by thecontroller 30. Wherein, temperature detection module can have temperature real-time measurement function for thermometer, temperature detection circuit etc. and have the temperature detection module of higher precision and sensitivity, and this application does not do specific limit to this concrete expression form.

S220: and comparing the current temperature with a preset temperature range.

Specifically, the preset temperature range includes a first preset temperature range and a second preset temperature range, and the first preset temperature range is a temperature range of the chip system 41 that needs to be adjusted. The second preset temperature range is a temperature range in which the power amplifier 42 needs to perform the adjustment operation.

In this embodiment, comparing the current temperature with the preset temperature range may specifically include: comparing the first current temperature with a first preset temperature range; and comparing the second current temperature with a second preset temperature range. In this embodiment, the temperature detection module associated with the chip system 41 may compare the first current temperature with a first preset temperature range, and thecontroller 30 compares the second current temperature with a second preset temperature range. Of course, in other embodiments, the first current temperature may be compared with the first preset temperature range by thecontroller 30.

S230: and if the current temperature is within the preset temperature range, reducing the working parameters of theheating load 40.

Specifically, the operating parameters include a frequency parameter, a process parameter, and a volume parameter, where the frequency parameter corresponds to an operating process of the chip system 41, and the volume parameter corresponds to an operating volume of the power amplifier 42.

In this embodiment, if the current temperature is within the preset temperature range, the reducing the operating parameters of theheat generating load 40 may specifically include:

if the first current temperature is within the first preset temperature range, the frequency parameter and/or the process parameter of the chip system 41 are/is decreased. For example, the first current temperature of the chipset system 41 is n degrees, and the first predetermined temperature range is T1-T2 degrees, if T1 ≦ n < T2, the frequency parameter and/or the process parameter of the chipset system 41 are decreased. In this embodiment, if T1 is not less than n < T2, the frequency parameter and the process parameter of the system-on-chip 41 are decreased, so that the temperature of the system-on-chip 41 can be decreased rapidly. Specifically, the frequency parameter of the system-on-chip 41 is reduced by reducing the operating frequency of the system-on-chip 41. For example, the operating frequency of the system-on-chip 41 in the normal operating state (i.e., when n < T1) is 1GHz, and when T1 ≦ n < T2, the operating frequency of the system-on-chip 41 is reduced from 1GHz to 700MHz, thereby reducing the amount of heat generated by the system-on-chip 41. The way to reduce the process parameter of the system-on-chip 41 is to shut down the inactive process in the system-on-chip 41, in other words, to shut down the background running process in the system-on-chip 41, and specifically, the relevant temperature detection module in the system-on-chip 41 completes this operation. In the embodiment, by reducing the frequency parameter and the process parameter of the chip system 41, the operation consumption load of the chip system 41 is effectively reduced, and the temperature of the chip system 41 is effectively reduced, so that the first current temperature n is less than T1, thereby avoiding the problem that the chip system 41 fails due to the influence of heat generated by the chip system 41 on the chip system and other electronic components in the in-vehicle entertainment machine 100, ensuring the working performance of the chip system 41, and prolonging the service life of the in-vehicle entertainment machine 100. If n < T1, the system-on-chip 41 operates normally, i.e., the system-on-chip 41 is in a normal operating state. Of course, in other embodiments, if the first current temperature is within the first preset temperature range, only the frequency parameter of the system-on-chip 41 may be reduced, or only the process parameter of the system-on-chip 41 may be reduced. The system-on-chip 41 may be controlled by thecontroller 30 to reduce a frequency parameter and/or a process parameter.

If the second current temperature is within the second preset temperature range, the volume parameter of the power amplifier 42 is decreased. For example, the second current temperature of the power amplifier 42 is m degrees, and the second predetermined temperature range is T3-T4 degrees, if T3 ≦ m < T4, the volume parameter of the power amplifier 42 is decreased. Specifically, first, thecontroller 30 obtains the current working volume of the power amplifier 42, then compares the current working volume with a preset volume, and if the current working volume is greater than the preset volume, the current working volume of the power amplifier 42 is adjusted to the preset volume. And if the current working volume is less than or equal to the preset volume, keeping the volume unchanged. If m < T3, the power amplifier 42 is operating normally, i.e., the power amplifier 42 is in a normal operating state.

If the second current temperature is within the second preset temperature range, the working volume of the power amplifier 42 may not be adjusted by the user, that is, if T3 is not less than m < T4, thecontroller 30 controls the power amplifier 42 to adjust the working volume to the preset volume, the working volume adjusting function of the power amplifier 42 is locked, and at this time, the user may not adjust the working volume of the power amplifier 42 at will. If the second current temperature is lower than the second preset temperature range, the user may adjust the operating volume of the power amplifier 42, that is, if m < T3, the user may optionally adjust the operating volume of the power amplifier 42. By controlling the working volume of the power amplifier 42, the performance of the power amplifier 42 and other electronic components arranged around the power amplifier 42 are prevented from being affected by the overhigh temperature of the power amplifier 42, the working performance of the power amplifier 42 is ensured, and the service life of the vehicle-mountedentertainment machine 100 is prolonged.

And if the current temperature exceeds the preset temperature range, controlling the heat-generatingload 40 to stop running, namely controlling the heat-generatingload 40 to be in a running stop state. Specifically, when the first current temperature of the chip system 41 exceeds the first preset temperature range, that is, when n is greater than or equal to T2, the temperature information is sent to thecontroller 30, and thecontroller 30 controls theswitch 20 to be turned off, so that the chip system 41 is turned off, and the condition that the chip system 41 is failed due to an excessively high temperature is avoided in time. After the heat of the system-on-chip 41 is dissipated, that is, when the first current temperature n < T2, theswitch 20 is controlled to be closed, and specifically, the reclosing of theswitch 20 can be controlled by presetting the time length for opening theswitch 20, so as to automatically open the system-on-chip 41. In other embodiments, thecontroller 30 may directly control the power amplifier 42 to stop operating when the second current temperature of the power amplifier 42 exceeds the second predetermined temperature range, i.e., when m ≧ T4. When the heat of the power amplifier 42 is dissipated, i.e., when the second current temperature m < T4, the power amplifier 42 is controlled to restart.

S240: the temperature of theheat generating load 40 is continuously monitored.

Specifically, after the operating frequency of the system-on-chip 41 is reduced, the temperature of the system-on-chip 41 is continuously monitored in real time by the relevant temperature detection module in the system-on-chip 41, and when the temperature of the system-on-chip 41 reaches a normal temperature, the system-on-chip 41 resumes normal operation, where the normal temperature is a temperature less than or equal to T1. If the temperature of the chipset 41 continuously rises to a value greater than or equal to T2, a signal is sent to thecontroller 30, so that thecontroller 30 turns off theswitch 20 to turn off the chipset 41, and then turns on the chipset 41 after the temperature of the chipset 41 is sufficiently reduced. Meanwhile, after the chip system 41 recovers to normal operation, the temperature detection module associated with the chip system 41 still continuously monitors the temperature of the chip system 41, that is, the method can detect the temperature of the chip system 41 in real time, and when the temperature of the chip system 41 is too high, the corresponding measures in step S230 can be taken to reduce the frequency parameter of the chip system 41, so as to adjust the temperature of the chip system 41 in time.

Meanwhile, after the volume parameter of the power amplifier 42 is decreased, thecontroller 30 continuously detects the temperature of the power amplifier 42, and the user can adjust the temperature of the power amplifier 42 at will when the temperature of the power amplifier 42 reaches the unlocking temperature, which is a temperature less than or equal to T3. When the temperature of the power amplifier 42 does not reach the unlocking temperature, the user may not adjust the operating volume of the power amplifier 42. And thecontroller 30 still continuously monitors the temperature of the power amplifier 42 in real time after the power amplifier 42 recovers to normal operation, that is, the method can detect the temperature of the power amplifier 42 in real time, and can take corresponding measures in step S230 to reduce the volume parameter of the power amplifier 42 whenever the power amplifier 42 is too high, so as to adjust the temperature of the power amplifier 42 in time. The method effectively ensures the working performance of the chip system 41 and the power amplifier 42, and effectively prolongs the service life of the vehicle-mountedentertainment machine 100.

Theheating load 40 in the vehicle-mountedentertainment machine 100 is detected, the working parameters of theheating load 40 are adjusted according to the data of theheating load 40 obtained through detection, so that the temperature of the vehicle-mountedentertainment machine 100 is controlled, the probability of failure caused by heating of the vehicle-mountedentertainment machine 100 due to overlarge power consumption is effectively reduced, and the service life of the vehicle-mountedentertainment machine 100 is prolonged.

Referring back to fig. 2, the present application further provides a vehicle-mountedentertainment machine 100. The in-vehicle entertainment machine 100 may perform the temperature control method of the above-described embodiment shown in fig. 1 and 3 to detect and adjust the operating parameters of theheat generating load 40 thereof in real time to control the temperature thereof. The in-vehicle entertainment machine 100 comprises apower supply 10, aswitch 20, acontroller 30 and a heat-generatingload 40, wherein thepower supply 10, theswitch 20 and the heat-generatingload 40 are all electrically connected with thecontroller 30, the heat-generatingload 40 comprises a chip system 41 and a power amplifier 42, theswitch 20 is electrically connected with the chip system 41 and thepower supply 10, thecontroller 30 is matched with theswitch 20 to control the working state of the chip system 41 in real time according to the current temperature of the chip system 41, the power amplifier 42 is electrically connected with thepower supply 10 and thecontroller 30, and thecontroller 30 controls the working state of the power amplifier 42 in real time according to the current temperature of the power amplifier 42.

Referring to fig. 4, fig. 4 is a schematic structural diagram of a temperature control system 300 according to an embodiment of the present disclosure. The temperature control system 300 is applied to the in-vehicle entertainment machine 100 of the embodiment shown in fig. 2, and at the same time, the temperature control system 300 can also execute the temperature control method of the embodiments shown in fig. 1 and 3 to detect and adjust the operating parameters of the heat-generatingload 40 in the in-vehicle entertainment machine 100 in real time to control the temperature of the in-vehicle entertainment machine 100. In this embodiment, the temperature control system 300 includes an obtaining module 310, a comparing module 320, and a control module 330, and the comparing module 320, the obtaining module 310, and the control module 330 are electrically connected. The acquisition module 310 acquires a current temperature value of the heat-generatingload 40 in the in-vehicle entertainment machine 100 and transmits the current temperature value to the comparison block 320. After receiving the current temperature value, the comparison module 320 compares the current temperature value with a preset temperature value range, and sends a comparison result to the control module 330. After receiving the comparison result, the control module 330 determines, according to the comparison result, that the working parameters of theheat generating load 40 are reduced if the current temperature value is within the preset temperature value range.

The temperature control system 300 of the present application detects theheat generating load 40 in the vehicle-mountedentertainment machine 100, and adjusts the operating parameters of theheat generating load 40 according to the detected data of theheat generating load 40, so as to control the temperature of the vehicle-mountedentertainment machine 100, effectively reduce the probability of failure caused by heat generation due to excessive power consumption of the vehicle-mountedentertainment machine 100, and improve the service life of the vehicle-mountedentertainment machine 100. It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference signs in the claims shall not be construed as limiting the claim concerned.

The foregoing detailed description of the embodiments of the present application has been presented to illustrate the principles and implementations of the present application, and the above description of the embodiments is only provided to help understand the method and the core concept of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (10)

1. A temperature control method, characterized in that the temperature control method comprises:

acquiring the current temperature of a heating load in the vehicle-mounted entertainment machine;

comparing the current temperature with a preset temperature range;

and if the current temperature is within the preset temperature range, reducing the working parameters of the heating load.

2. The temperature control method of claim 1, further comprising: and when the current temperature exceeds the preset temperature range, controlling the heating load to stop running.

3. The method of claim 1, wherein after the decreasing the operating parameter of the heat generating load if the current temperature is within the preset temperature range, the method further comprises:

the temperature of the heat generating load is continuously monitored.

4. The temperature control method according to any one of claims 1 to 3, wherein the heat-generating load includes a chip system and a power amplifier, the current temperature includes a first current temperature and a second current temperature, and the acquiring the current temperature of the heat-generating load in the in-vehicle entertainment machine includes:

acquiring the first current temperature of the chip system;

acquiring the second current temperature of the power amplifier.

5. The temperature control method of claim 4, wherein the preset temperature range comprises a first preset temperature range and a second preset temperature range, and the comparing the current temperature with the preset temperature range comprises:

comparing the first current temperature with the first preset temperature range;

and comparing the second current temperature with the second preset temperature range.

6. The method of claim 5, wherein the operating parameters include a frequency parameter, a process parameter, and a volume parameter, and wherein reducing the operating parameters of the heat generating load if the current temperature is within the preset temperature range comprises:

if the first current temperature is within the first preset temperature range, reducing the frequency parameter and/or the process parameter of the chip system;

and if the second current temperature is within the second preset temperature range, reducing the volume parameter of the power amplifier.

7. The method as claimed in claim 6, wherein if the first current temperature is within the first preset temperature range, the reducing the frequency parameter and/or the process parameter of the system on chip comprises:

reducing the working frequency of the chip system and/or closing the non-working process in the chip system;

if the second current temperature is within the second preset temperature range, reducing the volume parameter of the power amplifier comprises:

acquiring the current working volume of the power amplifier;

comparing the current working volume with a preset volume;

and if the current working volume is larger than the preset volume, adjusting the current working volume of the power amplifier to the preset volume.

8. The temperature control method of claim 7, wherein if the second current temperature is within the second preset temperature range, the volume of the power amplifier is not adjustable by a user; and if the second current temperature is lower than the second preset temperature range, the user can adjust the volume of the power amplifier.

9. A temperature control system, comprising:

the acquisition module is used for acquiring the current temperature value of the heating load in the vehicle-mounted entertainment machine;

the comparison module is used for comparing the current temperature value with a preset temperature value range;

and the control module is used for reducing the working parameters of the heating load if the current temperature value is within the preset temperature value range.

10. An in-vehicle entertainment machine, comprising: the power supply, the switch, the controller and the load that generates heat, the power the switch and the load that generates heat all with the controller electricity is connected, the load that generates heat includes chip system and power amplifier, the switch with chip system with the power electricity is connected, the controller with the switch cooperatees according to chip system's current temperature real time control chip system's operating condition, power amplifier with the power with the controller electricity is connected, the controller is according to power amplifier's current temperature real time control power amplifier's operating condition.

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