Disclosure of Invention
The present invention is directed to a display panel and a display device, in which the package layer is formed in an inclined plane structure, so that the problem of cracking of the display panel when the display panel is curled can be effectively solved.
To solve the above technical problem, the present invention provides a display panel, including: a substrate; the functional device layer is arranged on the substrate; at least one packaging layer arranged on the substrate and the functional device layer; one side of the packaging layer, which is far away from the functional device layer, is a first inclined plane, and the inclination angle of the first inclined plane is an acute angle.
Further, the angle range of the inclination angle is 0 to 30 °.
Further, the encapsulation layer includes: the first inorganic layer is arranged on the functional device layer and the substrate, and one side of the first inorganic layer, which is far away from the functional device layer, is a plane; the organic layer is arranged on one side, away from the functional device layer, of the first inorganic layer, and a second inclined plane is arranged on one side, away from the first inorganic layer, of the organic layer and is parallel to the first inclined plane; and the second inorganic layer is arranged on one side of the organic layer far away from the first inorganic layer.
Further, the first inorganic layer includes at least one inorganic film layer; the second inorganic layer includes at least one inorganic film layer.
Further, the thickness of the organic layer decreases from one end to the other end.
Further, the material of the first inorganic layer includes silicon nitride, silicon oxynitride, and aluminum oxide.
Further, the material of the second inorganic layer includes silicon nitride, silicon oxynitride, and aluminum oxide.
Further, still include: and the retaining wall is arranged between the substrate and the packaging layer and surrounds the functional device layer.
Further, the functional device layer includes: a first electrode disposed on the substrate; the hole injection layer is arranged on one side of the first electrode, which is far away from the substrate; the hole transport layer is arranged on one side of the hole injection layer, which is far away from the first electrode; the light-emitting layer is arranged on one side of the hole transport layer, which is far away from the hole injection layer; the electron transport layer is arranged on one side of the light-emitting layer, which is far away from the hole transport layer; the electron injection layer is arranged on one side of the electron transport layer, which is far away from the luminescent layer; the second electrode is arranged on one side of the electron injection layer, which is far away from the electron transport layer; the first electrode is an anode and the second electrode is a cathode.
Further, the present invention also provides a display device, including the display panel described above.
The invention has the beneficial effects that: the invention provides a display panel and a display device, wherein the display panel can be curled, an organic layer in an encapsulation layer is provided with a structure with uneven thickness according to different curling bending radiuses, specifically, the thickness of the encapsulation layer is gradually reduced from one end to the other end, so that the uneven thickness of the encapsulation layer can be caused, different stresses can be well released in the curling process, and the display panel is prevented from cracking. In the manufacturing process, when the organic layer is printed by ink jet, the substrate is firstly inclined to form an angle, and then the organic layer is manufactured by ink jet printing.
Detailed Description
The following description of the embodiments refers to the accompanying drawings for illustrating the specific embodiments in which the invention may be practiced. Directional phrases used herein, such as, for example, upper, lower, front, rear, left, right, inner, outer, lateral, etc., refer only to the orientation of the accompanying drawings. The names of the elements, such as the first, the second, etc., mentioned in the present invention are only used for distinguishing different elements and can be better expressed. In the drawings, elements having similar structures are denoted by the same reference numerals.
Embodiments of the present invention will be described in detail herein with reference to the accompanying drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided to explain the practical application of the invention and to enable others skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use contemplated.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 2, in the present embodiment, the present invention provides adisplay panel 100, including: asubstrate 101, aretaining wall 104, afunctional device layer 102, and anencapsulation layer 103.
Thesubstrate 101 has flexible characteristics; the material of thesubstrate 101 is polyimide.
Thefunctional device layer 102 is disposed on thesubstrate 101. In this embodiment, thefunctional device layer 102 includes: the organic light emitting diode comprises a first electrode, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer and a second electrode.
The first electrode is arranged on thesubstrate 101; the first electrode is an anode. The hole injection layer is arranged on one side of the first electrode, which is far away from thesubstrate 101;
the hole transport layer is arranged on one side of the hole injection layer, which is far away from the first electrode; the light-emitting layer is arranged on one side of the hole transport layer far away from the hole injection layer; the electron transport layer is arranged on one side of the light-emitting layer far away from the hole transport layer. The electron injection layer is arranged on one side of the electron transport layer, which is far away from the light emitting layer.
The second electrode is arranged on one side of the electron injection layer far away from the electron transport layer, and the second electrode is a cathode.
Theretaining wall 104 is disposed between thesubstrate 101 and theencapsulation layer 103 and surrounds thefunctional device layer 102. Theretaining wall 104 is used to prevent theencapsulating layer 103 from overflowing during the preparation process.
Theencapsulation layer 103 is disposed on thesubstrate 101 and thefunctional device layer 102. The number of theencapsulation layers 103 is not limited by the present invention, and may be a single layer or a multi-layer stack.
The side of theencapsulation layer 103 away from thefunctional device layer 102 is a firstinclined plane 110; theinclination angle 130 of the firstinclined plane 110 is an acute angle, and the angle range of theinclination angle 130 is 0-30 °.
Theencapsulation layer 103 includes: a firstinorganic layer 1031, anorganic layer 1032, and a secondinorganic layer 1033.
The firstinorganic layer 1031 is disposed on thefunctional device layer 102 and thesubstrate 101, and a side of the firstinorganic layer 1031 away from thefunctional device layer 102 is a plane.
The firstinorganic layer 1031 comprises at least one inorganic film layer. The material of the firstinorganic layer 1031 includes silicon nitride, silicon oxynitride, and aluminum oxide.
Theorganic layer 1032 is disposed on a side of the firstinorganic layer 1031 away from thefunctional device layer 102, a side of theorganic layer 1032 away from the firstinorganic layer 1031 is a secondinclined plane 120, and the secondinclined plane 120 is parallel to the firstinclined plane 110.
The thickness of theorganic layer 1032 decreases from one end to the other end, and as shown in fig. 2, the thickness of theorganic layer 1032 is the largest at the left end and the smallest at the right end. The thickness of theorganic layer 1032 is not uniformly set due to the different stresses experienced at different locations during the screen curling process. The thickness of the left side of the invention is thicker, and gradually decreases towards the right side, and also gradually decreases from the right side to the left side, which mainly depends on which side is used as the starting point of the curling.
The thickness of theorganic layer 1032 varies, which further causes the thickness variation of theencapsulation layer 103, and the thickness also decreases from one end to the other end, thereby forming the firstinclined plane 110 structure of the present invention.
In the preparation of theorganic layer 1032, thesubstrate 101 is mainly tilted and then ink-jet printed. The angle of inclination is the same as theacute angle 130.
The secondinorganic layer 1033 is disposed on a side of theorganic layer 1032 remote from the firstinorganic layer 1031.
The secondinorganic layer 1033 includes at least one inorganic film layer. The material of the secondinorganic layer 1033 includes silicon nitride, silicon oxynitride, and aluminum oxide.
The present invention also provides a display device including thedisplay panel 100.
Thedisplay panel 100 can be curled, theorganic layer 1032 in theencapsulation layer 103 is provided with a structure with uneven thickness according to different curling bending radiuses, and the structure is gradually decreased from one side to the other side, so that the thickness of theencapsulation layer 103 is uneven, different stresses can be well released in the curling process, and thedisplay panel 100 is prevented from being cracked. In the manufacturing process, when theorganic layer 1032 is ink-jet printed, thesubstrate 101 is first tilted to form an angle, and then the organic layer is formed by ink-jet printing.
It should be noted that many variations and modifications of the embodiments of the present invention fully described are possible and are not to be considered as limited to the specific examples of the above embodiments. The above examples are intended to be illustrative of the invention and are not intended to be limiting. In conclusion, the scope of the present invention should include those changes or substitutions and modifications which are obvious to those of ordinary skill in the art.