Disclosure of Invention
The invention aims to provide an air flow guiding and dispersing device for a coating device and application thereof, wherein the air flow guiding and dispersing device is used for blocking and dispersing air filled in a chamber of the coating device and enabling the air to be dispersed to the surface of a base material as uniformly as possible in a coating process, so that the surface of the base material is coated with a coating layer as uniformly as possible, and quality consistency and color uniformity are guaranteed.
Another object of the present invention is to provide an airflow dispersion device for a film coating apparatus and its application, wherein the airflow dispersion device realizes that the surface of the substrate along the radial direction can be coated with a uniform film layer as much as possible by the flowing direction of the dispersion gas, so as to prevent the color difference visible to the naked eye on the surface of the substrate, and ensure the beauty.
Another object of the present invention is to provide a gas flow dispersing device for a film coating apparatus and its application, wherein the gas flow dispersing device can disperse the gas flow in the flowing direction of the gas filled into the chamber, thereby preventing the gas from gathering in the flowing direction, and achieving the effect of dispersing the gas as uniformly as possible.
Another object of the present invention is to provide an airflow dispersion device for a coating apparatus and the application thereof, wherein the airflow dispersion device can be reused and is convenient for maintenance.
The invention also aims to provide an airflow dispersion device for the coating equipment and application thereof, wherein the airflow dispersion device has the advantages of simple structure, strong practicability and low cost.
According to one aspect of the present invention, the present invention provides an airflow dispersion device for a film plating apparatus, wherein the airflow dispersion device forms a mounting cavity for mounting a bracket of the film plating apparatus, and the airflow dispersion device has an airflow dispersion surface and a plurality of through holes arranged along a circumferential direction on the airflow dispersion surface, so that part of the gas filled in a chamber of the film plating apparatus enters the mounting cavity through the through holes, and the gas is diffused to the surface of a substrate mounted on the bracket as uniformly as possible.
In some embodiments, the airflow dispersion device further has an upper port and a lower port communicated with the mounting cavity, so that the rest of the gas filled into the chamber of the coating equipment is diffused along the extending direction of the airflow dispersion surface and enters the mounting cavity from the ports.
In some embodiments, the airflow dispersion device includes a high end portion, a middle end portion and a low end portion, wherein the high end portion, the middle end portion and the low end portion are sequentially and integrally connected to form the airflow dispersion surface, and the number of the through holes located at the middle end portion is greater than the number of the through holes located at the high end portion and the low end portion of the airflow dispersion surface, respectively.
In some embodiments, the airflow dispersion device includes a high end portion, a middle end portion and a low end portion, wherein the high end portion, the middle end portion and the low end portion are sequentially and integrally connected to form the airflow dispersion surface, and the aperture of the through hole located at the middle end portion is larger than the aperture of the through hole located at the high end portion and the aperture of the through hole located at the low end portion of the airflow dispersion surface.
In some embodiments, the number and the diameter of the through holes at the high end portion are the same as those of the through holes at the low end portion.
In some embodiments, the air deflector is adhesively joined together end-to-end and forms a cylindrical structure.
In some embodiments, the airflow dispersion device further comprises a first radial shield, wherein the first radial shield extends radially inward along the top end of the airflow dispersion device and forms the through opening.
In some embodiments, the high end has at least one connector, wherein the connector is adhesively attached to the first radial shield.
In some embodiments, the first radial shield is implemented as an annular structure having a radial width.
In some embodiments, the airflow dispersion device further comprises a second radial shield, wherein the second radial shield is removably mounted to the bottom end of the airflow dispersion device, wherein the second radial shield extends radially inward along the bottom end of the airflow dispersion device and forms the opening.
In some embodiments, the second radial shield comprises a radially extending portion and a connecting portion, wherein the connecting portion is connected to the radially extending portion perpendicularly, wherein the connecting portion is adapted to be mounted to a bottom end of the airflow dispersion device, and wherein the radially extending portion extends radially inward along the bottom end of the airflow dispersion device.
In some embodiments, the second radial shield is equal in radial width to the first radial shield.
According to another aspect of the present invention, the present invention further provides a film coating apparatus, wherein the film coating apparatus includes a chamber, a power supply and a support, wherein the film coating apparatus further includes the airflow dispersion device, and the airflow dispersion device is disposed on the support.
According to another aspect of the present invention, the present invention further provides a method for manufacturing an airflow dispersion device for a coating apparatus, comprising the steps of:
A. the coating equipment comprises an airflow dispersion device and a coating device, wherein the airflow dispersion device is of a cylindrical structure and forms a mounting cavity for mounting a bracket of the coating equipment, and the airflow dispersion device is provided with an airflow dispersion surface and a plurality of through holes which are arranged along the circumferential direction and are positioned on the airflow dispersion surface.
In some embodiments, the number of through holes at the middle end of the air dispersion surface is greater than the number of through holes at the high and low ends of the air dispersion surface, respectively.
In some embodiments, the aperture of the through hole at the middle end of the air flow dispersion surface is larger than the aperture of the through hole at the high end and the low end of the air flow dispersion surface, respectively.
In some embodiments, the number and the diameter of the through holes at the high end of the air flow dispersing surface are the same as those of the through holes at the low end of the air flow dispersing surface.
In some embodiments, further comprising the step of: a first radial shielding piece extends radially inwards to the high end of the airflow dispersion device and forms a through hole communicated with the installation cavity.
In some embodiments, further comprising the step of: and detachably mounting a second radial shielding piece on the lower end part of the airflow dispersion device, wherein the second radial shielding piece extends inwards along the lower end part in the radial direction and forms a through hole communicated with the mounting cavity.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.
It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Referring to fig. 1 to 7, anairflow diffuser 100 according to a preferred embodiment of the present invention is shown, wherein theairflow diffuser 100 is used in acoating apparatus 500, wherein thecoating apparatus 500 has achamber 510 and at least onesupport 520, wherein thesupport 520 is disposed in thechamber 510, and wherein thesupport 520 is used for supporting at least one substrate, as shown in fig. 1. Thechamber 510 is adapted to be filled with agas 800 to coat the substrate by thecoating apparatus 500, wherein the gasflow dispersing device 100 is disposed in thechamber 510 to prevent thegas 800 from gathering in a diffusion direction, so that thegas 800 is diffused as uniformly as possible to the surface of the substrate in thechamber 510, and the surface of the substrate is coated with a film layer as uniformly as possible to ensure uniform quality and uniform color.
For example, thechamber 510 has a pumping port for connecting a pumping pump for continuously pumping the gas in thechamber 510 outwards through the pumping port at a certain rate, a gas inlet for introducing a pipe for delivering an inert gas such as nitrogen or argon to fill thechamber 510 with the inert gas such as nitrogen or argon, and at least one material inlet for introducing a chemical gas material to fill thechamber 510 with the chemical gas material to provide a plasma environment and to generate the film on the surface of the substrate by a discharge reaction.
Typically, the feed port and the gas inlet are adjacent, wherein the feed port is remote from the pumping port, wherein the gas diffuses from the gas inlet and the feed port in the direction of the pumping port, wherein thesupport 520 and the substrate are placed between the feed port and the pumping port of thechamber 510, i.e., to ensure as far as possible that the gas reacts at the surface of the substrate and generates the protrusions. In order to prevent thegas 800 from gathering in the diffusion direction, thegas diffusion device 100 is disposed between the feed opening and the pumping opening of thechamber 510, wherein thegas diffusion device 100 is disposed between the feed opening and thesupport 520, and preferably, thegas diffusion device 100 is disposed between the feed opening and thesupport 520 in a vertical state, so that thegas 800 can be uniformly diffused to all the substrates mounted on thesupport 520.
In this embodiment, the inlet and the inlet are disposed on the sidewall of thechamber 510, wherein the pumping port is disposed in the middle of thechamber 510, wherein the pumping port may be formed by a pumping column that is vertical to the middle of thechamber 510, such that thegas 800 is diffused from the sidewall of thechamber 510 toward the middle, wherein thesupport 520 is disposed between the middle and the sidewall of thechamber 510 for being located in the diffusion direction of the gas, wherein thesupport 520 rotates around its central axis, such that all the substrates supported on thesupport 520 can be uniformly and uniformly located in the diffusion direction of the gas. It will be understood by those skilled in the art that the relative positions of the feed port, the gas inlet, and the pumping port can be adjusted, such as the feed port and the gas inlet are located in the middle or the top or bottom wall of the chamber, and the pumping port is located in the side wall or the top or bottom wall of the chamber, etc., without limitation.
Alternatively, the substrate may be a keyboard membrane, wherein theframe 520 has a plurality ofsupport cavities 521 arranged along a circumferential direction and acentral axis 522, wherein a plurality of substrates are mounted in thesupport cavities 521 arranged along the circumferential direction, wherein the substrates extend inward along a radial direction, that is, each substrate extends radially outward along the radial direction with thecentral axis 522 of theframe 520 as a symmetry axis. During coating, theholder 520 rotates around thecentral axis 522, wherein each substrate axially rotates around thecentral axis 522. Alternatively, thesupport chamber 521 is provided as a vertical chamber, wherein the substrate is held vertically to thesupport chamber 521. Alternatively, to reduce the vertical height of thesupport 520, thesupport chamber 521 is configured as an arc-shaped chamber, wherein the substrate is mounted to thesupport chamber 521 in an arc so as to be fittingly mounted to thesupport 520.
Preferably, theair deflector 100 is mounted on the outer side of thebracket 520, wherein theair deflector 100 is implemented in a ring structure or a cylindrical structure, and wherein theair deflector 100 is annularly wrapped on the outer side of thebracket 520. Alternatively, thesupport 520 is implemented as a cylindrical structure and forms at least one support cavity, wherein the substrate is placed in thesupport cavity 521 of thesupport 520, and wherein theairflow dispersion device 100 is implemented as a circular ring-like structure that is fittingly wrapped around the outside of thesupport 520. Alternatively, thebracket 520 may be implemented as a square column structure, wherein thebracket 520 is implemented as a square ring structure that is fittingly wrapped around the outer side of thebracket 520, etc., without being limited thereto. Optionally, theairflow dispersion device 100 remains fixed relative to thebracket 520, and when thebracket 520 rotates, theairflow dispersion device 100 rotates synchronously with thebracket 520. Optionally, theairflow dispersion device 100 is fixed to thechamber 510, wherein theairflow dispersion device 100 does not contact thebracket 520, such that theairflow dispersion device 100 remains fixed at all times and does not rotate as thebracket 520 rotates.
As shown in fig. 7, further, theairflow dispersion device 100 has anairflow dispersion surface 101 and a plurality of throughholes 102 located on theairflow dispersion surface 101 and arranged along the circumferential direction, wherein theairflow dispersion device 100 forms a mountingcavity 110 and two throughholes 120 respectively located on the upper side and the lower side and communicating with the mountingcavity 110, wherein thebracket 520 is mounted on the mountingcavity 110, wherein theairflow dispersion surface 101 is located between the charging opening (and the feeding opening) of thechamber 510 and thebracket 520, and wherein theairflow dispersion surface 101 is perpendicular to the diffusion direction of thegas 800 charged into thechamber 510. When thegas 800 is filled into thechamber 510, part of the gas diffuses to the supportingcavity 521 of thebracket 520 in the mountingcavity 110 through the throughholes 102, and the rest of the gas diffuses along the extending direction of the gasflow dispersing surface 101 and diffuses to the supportingcavity 521 of thebracket 520 in the mountingcavity 110 from the throughholes 120 at the upper and lower sides, so that the gas filled into thechamber 510 of thecoating equipment 500 is dispersed, the gas is prevented from gathering in the diffusing direction, and the gas can diffuse to the surface of the substrate as uniformly as possible, so that the surface of the substrate is coated with the film layer as uniformly as possible, the quality is ensured to be as uniform as possible, and the color is as uniform as possible.
It is understood that the throughholes 102 may be uniformly arranged along the circumferential direction on the same plane of the gasflow dispersing surface 101 to ensure that the amount of thegas 800 passing through the throughholes 102 at any position on the circumferential direction on the same plane of the gasflow dispersing surface 101 is as uniform as possible. That is, when thesupport 520 drives the substrate to rotate in the mountingcavity 110 of the gasflow dispersing device 100, the amount of thegas 800 filled in thechamber 510 passing through the throughholes 102 at any position in the circumferential direction on the same plane of the gasflow dispersing device 100 is substantially the same, and the rest of the gas enters the mountingcavity 110 along the throughholes 120 at the upper and lower sides, so that the concentration of the gas on the same plane around each substrate in the mountingcavity 100 is substantially the same.
As shown in fig. 2 and 3, further, theairflow dispersion device 100 includes ahigh end portion 10, amiddle end portion 20 and alow end portion 30, wherein thehigh end portion 10, themiddle end portion 20 and thelow end portion 30 are integrally connected in sequence and respectively form an upper region, a middle region and a lower region of theairflow dispersion surface 101, wherein the number of the throughholes 102 of thehigh end portion 10 and the number of the throughholes 102 of thelow end portion 30 are smaller than the number of the throughholes 102 of themiddle end portion 20, or the aperture of the throughholes 102 of thehigh end portion 10 and the aperture of the throughholes 102 of thelow end portion 30 are smaller than the aperture of the throughholes 102 of themiddle end portion 20, so that the amount of thegas 800 passing through themiddle end portion 20 is larger than the amount of the gas passing through thehigh end portion 10 or thelow end portion 30, thereby balancing the upper region, the middle region and the lower region in the mountingcavity 110, The gas concentrations in the lower and middle regions are made to be as uniform as possible in theentire installation chamber 100. It is understood that thehigh end portion 10 and thelow end portion 30 having a smaller number of throughholes 102 or a smaller diameter may be located adjacent to the loading position of the coating apparatus while themiddle end portion 20 is located farther from the loading position of the coating apparatus.
That is, since the gas that does not pass through the throughholes 102 is diffused into the mountingcavity 110 along the throughholes 120 on the upper and lower sides of the gasflow dispersing device 100, it may be caused that the concentration of the gas in the upper or lower area of theinstallation cavity 110 near the through-holes 120 is higher than that in the middle area, and in order to balance the gas concentrations in the upper, middle and lower areas in theinstallation cavity 110, the number of the through-holes 102 in the middle area (i.e., the middle end portion 20) of the gasflow dispersing surface 101 is greater than that in the upper area (i.e., the high end portion 10) or the lower area (i.e., the low end portion 30), or the aperture of the throughhole 102 located in the middle area of the airflow dispersion surface 101 is larger than that of the throughhole 102 located in the upper or lower area, thereby increasing the amount ofgas 800 that passes through the through-holes 102 in the central region of the gasflow dispersion surface 101.
It should be noted that the number, the aperture and the density of the throughholes 102 of thehigh end portion 10, themiddle end portion 20 and thelow end portion 30 can be respectively preset according to actual requirements so as to adjust the amount of the gas respectively passing through thehigh end portion 10, themiddle end portion 20 and thelow end portion 30 and entering the mountingcavity 110. In the present embodiment, the heights of thehigh end portion 10, themiddle end portion 20 and thelow end portion 30 are substantially the same, wherein the number, the aperture and the density of the throughholes 102 of thehigh end portion 10 and thelow end portion 30 are substantially the same, wherein the number and the density of the throughholes 102 of themiddle end portion 20 are greater than the number and the density of the throughholes 102 of thehigh end portion 10, and the aperture is kept the same.
It is understood that thecoating apparatus 500 is a vacuum coating apparatus, wherein thecoating apparatus 500 provides thechamber 510 with a higher vacuum degree, i.e. thechamber 510 is not an absolute vacuum, for example, the vacuum degree of thechamber 510 is approximately 0.1 to 20Pa, and thecoating tool 100 and the substrate are put into thechamber 510 together after being assembled to complete coating. Optionally, the coating type of thecoating apparatus 500 may be vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, PLD laser sputtering deposition, physical vapor deposition, or plasma chemical vapor deposition, and the working principle thereof is not described herein again. Optionally, the film layer includes a film, a thin film, a nano film layer, or the like, which is plated on the surface of the substrate. Alternatively, the film layer may be implemented as an organic silicon nano-protection film layer, an organic silicon hard nano-protection film layer, a composite structure high insulation hard nano-protection film layer, a high insulation nano-protection film layer having a modulated structure, a plasma polymerization film layer, a gradient increasing structure liquid-proof film layer, a gradient decreasing structure liquid-proof film layer, a film layer with controllable cross-linking degree, a waterproof click-through resistant film layer, a low adhesion corrosion resistant film layer, a liquid-proof film layer having a multi-layer structure, a polyurethane nano-film layer, an acrylamide nano-film layer, an antistatic liquid-proof nano-film layer, an epoxy nano-film layer, a high transparent low color difference nano-film layer, a high adhesion aging resistant nano-film layer, a silicon-containing copolymer nano-film layer, a polyimide nano-film layer, or the like. Accordingly, thecoating apparatus 500 may be implemented to coat the surface of the substrate with any one or more of the above-described films or film layers, etc., to improve the surface properties of the substrate, without being limited thereto.
Further, the airdispersion guide device 100 is connected end to form the mountingcavity 110 and aconnection end 130, wherein the size of the mountingcavity 110 of the airdispersion guide device 100 is slightly larger than that of thebracket 520 to fit thebracket 520, and the airdispersion guide device 100 is overlapped end to form theconnection end 130. Preferably, the connection of the connection ends 130 is implemented as an adhesive connection, such as a seamless adhesive connection, i.e., theair deflector 100 is overlapped and adhered together end to end. In the manufacturing process, the adhering surfaces of the head end and the tail end of theairflow dispersion device 100 are cleaned by alcohol, and after being dried in the sun, the head end and the tail end of theairflow dispersion device 100 are overlapped and adhered together by using ABS glue or solid glue, so that the connectingend 130 and the mountingcavity 110 with a preset shape and size are formed, so that theairflow dispersion device 100 can be detachably sleeved outside thebracket 520, and theairflow dispersion device 100 is convenient to clean or replace, and the like. Optionally, theconnection end 130 may also be formed by sewing, clamping, welding, or integrally connecting. Alternatively, the connectingend 130 of theairflow dispersion device 100 may be detachably connected to thebracket 520, which is not limited herein.
It should be noted that, by adjusting and changing the area of the connectingend 130, that is, adjusting and changing the area of the overlapping surface of the head end and the tail end of theairflow dispersion device 100, the size of the mountingcavity 110 of theairflow dispersion device 100 can be adjusted to adaptively mount thebrackets 520 with different sizes, which is more compatible and has a wider application range.
Theairflow dispersion device 100 may be made of the same material as thebracket 520. Theairflow dispersion device 100 is made of a flexible material and has a certain toughness, for example, the airflow dispersion device is made of a plastic material with a certain thickness, wherein the head and the tail of theairflow dispersion device 100 are bonded to form theinstallation cavity 110 and then can be fixed and molded. That is, in the manufacturing process, the throughhole 102 is opened on a flexible material with a square plane structure, and then the flexible material is bonded end to form theairflow dispersion device 100 with a cylindrical structure having the mountingcavity 110.
As shown in fig. 5, further, theairflow dispersion device 100 further includes a firstradial shield 40, wherein the firstradial shield 40 is connected to the top edge of thehigh end portion 10 and extends radially inward to form the throughopening 120, wherein the firstradial shield 40 is an annular structure, wherein the radial dimension of the firstradial shield 40 is smaller than the radial dimension of the mountingcavity 120, and wherein the firstradial shield 40 is effective to make the concentration of the gas in the radial direction in the mountingcavity 110 as uniform as possible, so that the surface of the substrate in the radial direction can be coated with a uniform film layer as possible, thereby preventing the color difference of the substrate surface from being visible to the naked eye, and ensuring the aesthetic appearance.
In the present embodiment, as a specific example, the radial width of the firstradial shielding member 40 is 44mm, wherein the diameter of the throughopening 120, i.e. the inner diameter of the firstradial shielding member 40, is 265mm, and wherein the diameter of theinstallation cavity 510, i.e. the outer diameter of the firstradial shielding member 40, is less than or equal to 365 mm. Of course, it should be understood by those skilled in the art that the radial width of the firstradial shield 40 can be preset to achieve the adjustment of the gas concentration of the gas in the radial direction in theinstallation cavity 110, without limitation.
Preferably, the top edge of thehigh end 10 has at least oneconnector 11, wherein theconnector 11 is adhesively connected to the firstradial shield 40 and keeps the firstradial shield 40 relatively fixed. In this embodiment, the connectingmembers 11 are uniformly arranged and extend radially along the top edge of thehigh end portion 10, wherein the connectingmembers 11 and the firstradial shielding member 40 are adhesively connected in a surface-to-surface contact manner, so as to improve the fixing effect and prevent the firstradial shielding member 40 from falling off. Alternatively, theconnection 11 can be glued to the upper or lower side of the firstradial shield 40.
Alternatively, the connectingpiece 11 may be implemented as a circular ring structure integrally connected to thehigh end portion 10. Alternatively, the connectingmember 11 may be implemented as a toothed ring structure integrally connected to theheight part 10, etc., without being limited thereto.
Alternatively, theconnection element 11 may be provided by the firstradial shield 40, wherein the firstradial shield 40 is fixedly connected to thehigh end 10 via theconnection element 11. For example, the connectingmember 11 is integrally connected to the firstradial direction shield 40, wherein the connectingmember 11 is adhesively connected to the inner side surface or the outer side surface of thehigh end portion 10, without being limited thereto.
As shown in fig. 6, theairflow dispersion device 100 further includes a secondradial shielding element 50, wherein the secondradial shielding element 50 is detachably mounted on a bottom edge of thelower end portion 30 and extends toward a radially inward direction to form the throughopening 120, wherein thelower end portion 30 is detachably sleeved on the mountinggroove 51 of the secondradial shielding element 50, and after being detached, thelower end portion 30 forms a mounting opening 31 communicated with the mountingcavity 110 for detaching or mounting thebracket 520 to the mountingcavity 110.
In the embodiment, the radial width of the secondradial shield 50 is smaller than the radial dimension of the mountingcavity 110, wherein the firstradial shield 40 and the secondradial shield 50 can cooperate with each other to effectively uniform the concentration of the gas in the radial direction in the mountingcavity 110, so that the surface of the substrate in the radial direction can be coated with a uniform film layer as much as possible, thereby preventing the color difference of the substrate surface from being visible to naked eyes and ensuring the aesthetic appearance. It will be appreciated that the radial width of the secondradial shield 50 can be preset to form the throughopening 120 of a preset size.
Further, the secondradial shield 50 has aradial extension 51 and a connectingportion 52, wherein the connectingportion 52 is adhesively connected to an outer diameter edge of theradial extension 51, wherein the connectingportion 52 is adapted to fit snugly around a bottom edge of thelower end portion 30, wherein the connectingportion 52 is perpendicular to theradial extension 51, wherein theradial extension 51 extends radially inward toward the mountingcavity 110, wherein the connectingportion 52 is implemented as a circular ring structure matching with the bottom edge of thelower end portion 11, wherein the connectingportion 52 is connected with the bottom edge of thelower end portion 11 by interference fit, so that the secondradial shield 50 and the bottom edge of thelower end portion 11 can be detached or mounted by manual force to facilitate detachment and mounting. Alternatively, the connectingportion 52 may be formed of a rectangular piece of flexible material joined end-to-end and adhesively bonded to form anattachment end 521. Alternatively, thejoint end 521 may be formed by a snap-fit connection, an integral connection, or a seam connection.
Preferably, the cross section of the secondradial shield 50 in the radial direction is an L-shaped section, wherein the connectingportion 52 is fitted with interference fit outside the bottom edge of thelower end portion 30. Alternatively, the connectingportion 52 may be implemented to fit inside the bottom edge of thelower end portion 30 in an interference fit manner.
As shown in fig. 4, it is worth mentioning that when the secondradial shield 50 is mounted to thelower end portion 30, the connectingportion 52 avoids the throughhole 102 at thelower end portion 30 to prevent the throughhole 102 from being shielded. Preferably, theupper side 522 of the connectingportion 52 is just circumscribed with the throughhole 102 on the same circumferential plane of thelower end portion 30 without shielding the throughhole 102.
When installed, the secondradial shield 50 is not mounted to thelower end portion 30 such that the mounting opening 31 of thelower end portion 30 is fully exposed, and a worker can mount thebracket 520 to the mountingchamber 110 through the mounting opening 31, and then, the worker mounts the secondradial shield 50 to thelower end portion 30 such that the mounting opening 31 is shielded by theradial extension 51 to form the throughopening 120.
It is understood that theradial extension 51 and the firstradial shield 40 may have the same radial width, i.e. the size of the throughopenings 120 on the upper and lower sides of theairflow dispersing device 100 is the same. Alternatively, the radial width of theradial extension 51 and the radial width of the firstradial shielding element 40 may be different, that is, the size of the throughopenings 120 on the upper and lower sides of theairflow dispersion device 100 is different.
In order to facilitate the dismounting of the secondradial shield 50 by the operator, the outer surface of the connectingportion 52 of the secondradial shield 50 is roughened to increase the roughness of the outer surface of the connectingportion 52. Preferably, the roughness of the outer surface of the connectingportion 52 is equal to or greater than ra 3.2.
According to another aspect of the present invention, the present embodiment further provides a method for manufacturing theairflow dispersion device 100, including the steps of:
s01, connecting theairflow dispersion device 100 end to form a cylindrical structure to form the mountingcavity 110 for mounting thebracket 520, wherein theairflow dispersion device 100 has theairflow dispersion surface 101 and the plurality of throughholes 102 arranged along the circumferential direction on theairflow dispersion surface 101.
Wherein the number, aperture and density of the throughholes 102 located at thehigh end 10 of theairflow dispersion surface 101 are the same as the number, aperture and density of the throughholes 102 located at thelow end 30 of theairflow dispersion surface 101, wherein the number of the throughholes 102 located at themiddle end 20 of theairflow dispersion surface 10 is greater than the number of the throughholes 102 located at thehigh end 10 of theairflow dispersion surface 101, or the aperture of the throughholes 102 located at themiddle end 20 of theairflow dispersion surface 10 is greater than the aperture of the throughholes 102 located at thehigh end 10 of theairflow dispersion surface 101.
S02, extending the firstradial shield 40 radially inwards of thehigh end 10 and forming the throughopening 120 communicating with the upper side of the mountingcavity 110.
S03, removably mounting the secondradial shield 50 to thelower end 30, wherein the secondradial shield 50 extends radially inwardly of thelower end 30 and forms the throughopening 120 communicating with the underside of the mountingcavity 110.
According to another aspect of the present invention, the present embodiment further provides thecoating apparatus 500, wherein the coating apparatus includes: a chamber, a power source, thesupport 520 and the gasflow diversion device 100, wherein the chamber has thechamber 510 for being pumped in and out, wherein thesupport 520 is disposed in thechamber 510, wherein the power source is used for providing radio frequency and/or pulse voltage, wherein the gasflow diversion device 100 is disposed in thesupport 520 for preventing gas from gathering in a diffusion direction, so that gas is diffused as uniformly as possible to the substrate mounted on thesupport 520 for coating the surface of the substrate with a uniform film.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.