Background
Currently, integrated circuit technology has penetrated into various fields of industry and social life, and the electronic industry has become the first industry today. The development of the electronic industry and the wide application of the products thereof have extremely profound effects on aspects such as global economic culture and the like. The importance of semiconductors is enormous, both from a technological and an economic point of view.
Most of today's electronic products, such as computers, mobile phones or core units in digital recorders, are very closely related to semiconductors. Packaging technology of electronic devices is one of the key links restricting the development of integrated circuits. The warpage problem caused by the difference of the size and material properties of various materials (substrate, bonding layer, chip and packaging material) in the packaging of electronic devices under the action of a large temperature difference has seriously affected the reliability, welding performance and yield of the electronic devices. Thus, the warpage problem of electronic devices has become a significant obstacle affecting the continued advancement of electronic packaging technology.
In the semiconductor process, various stresses are generated on the wafer surface along with the formation of various material layers and various semiconductor device structures on the wafer surface, so that the wafer is warped in the process. In the most ideal state, the wafer should not warp, even if the wafer cannot be completely flat, in the ideal state, the wafer should also have a bowl shape with the edge tilted towards the front direction of the wafer and symmetrical about the central axis of the vertical wafer, in actual situations, due to the asymmetry of stress on the front surface of the wafer, various forms of asymmetric warpage of the wafer are often caused, so that the wafer is easy to generate warping defects, and partial chips fail and even fragments occur.
In the prior art, on-line monitoring of warpage defects of electronic devices is difficult to achieve in industrial production. There are many methods for measuring warp deformation, such as electronic speckle interferometry, shadow moire, projection moire, digital Image Correlation (DIC), and the like. The methods have specific measurement precision and application scenes, and the measurement area and the measurement range are different. Electronic speckle interferometry is not suitable for the measurement and monitoring of large area warp deformations such as wafers due to its expensive high power lasers. The shadow moire is also not suitable for measuring and monitoring large-area buckling deformation due to the problem of light path arrangement. The digital image correlation method is not suitable for the sample piece which can not be subjected to surface pretreatment because a layer of speckles with specific gray scale is sprayed on the surface of the sample piece. The projection moire method is a modern optical measurement technology developed in the 70 th century of the 20 th century, and is used for detecting in-plane deformation, out-of-plane displacement and surface morphology. By virtue of the advantages of non-contact, rapidness, full-field measurement, high resolution and high precision, the projection moire method is widely applied to various fields such as biology, medical detection, product detection, reverse engineering and the like. The projection moire technology has mature equipment products at home and abroad at present, has higher measurement precision of warping which can reach 1.5 micrometers, but can only measure the surface of an object due to the principle of the projection moire technology, and basically has no penetrating capacity, so that the detection capacity of internal defects of the product is weaker.
In addition, the current warp deformation and defect of the electronic device are usually detected off-line only after the electronic device fails in the industrial production process, and the method is complex in flow, long in time consumption, poor in test effect and low in contribution to improving the production process of the electronic device. How to effectively and reliably monitor the warping state of an electronic device on line is a problem to be solved in the current industrial production.
Disclosure of Invention
The embodiment of the application solves the problem that the warp deformation and the defects of the packaging module cannot be monitored on line in the prior art by providing the method and the device for three-dimensional on-line monitoring of the warp deformation and the defects of the packaging module.
The embodiment of the application provides a three-dimensional on-line monitoring device for warp deformation and defects of a packaging module, which comprises a projection moire module, an ultrasonic module and a monitoring analysis module;
the monitoring and analyzing module is respectively connected with the projection moire module and the ultrasonic module;
the projection moire module is used for obtaining first warping information of a to-be-detected packaging module sample;
the ultrasonic module is used for obtaining second warping information of the packaging module sample to be tested;
the monitoring analysis module is used for obtaining monitoring result information according to the first warping information and the second warping information.
Preferably, the projection moire module comprises a CCD camera and a grating projector;
The grating projector is used for projecting a grating to the surface of the sample of the packaging module to be tested;
And the CCD camera is used for continuously shooting and collecting grating changes on the surface of the sample of the packaging module to be tested to obtain the first warping information.
Preferably, the projection moire module further comprises a first synchronous trigger;
The CCD camera is a CCD camera array formed by a plurality of CCD cameras, and the CCD camera array is connected with the first synchronous trigger;
The grating projector is a grating projector array formed by a plurality of grating projectors.
Preferably, the ultrasonic module comprises an air coupling ultrasonic probe, an ultrasonic signal transmitting and receiving device and a preamplifier;
the air coupling ultrasonic probe is connected with the ultrasonic signal transmitting and receiving device, the ultrasonic signal transmitting and receiving device is connected with the pre-amplifier, and the pre-amplifier is connected with the monitoring and analyzing module.
Preferably, the ultrasonic module further comprises a second synchronous trigger;
The air coupling ultrasonic probe is an array type air coupling ultrasonic probe group formed by a plurality of air coupling ultrasonic probes, and the array type air coupling ultrasonic probe group is connected with the second synchronous trigger.
Preferably, the monitoring and analyzing module comprises a data storage device, a data analyzing device and a monitoring and displaying device;
The data storage device is used for storing information from the projection moire module and the ultrasonic module and transmitting the information to the data analysis device;
the data analysis device is used for obtaining warp deformation information according to the first warp information, obtaining warp defect information according to the second warp information and obtaining the monitoring result information according to the warp deformation information and the warp defect information;
the monitoring display device is used for displaying the monitoring result information.
Preferably, the three-dimensional on-line monitoring device for the buckling deformation and the defects of the packaging module further comprises an optical three-dimensional measurement calibrator;
The optical three-dimensional measurement calibrator is used for calibrating internal parameters, external parameters and heights of the camera.
Preferably, the three-dimensional on-line monitoring device for the buckling deformation and the defects of the packaging module further comprises a plane placement table;
And the to-be-tested packaging module sample is placed on the plane placement table.
On the other hand, the embodiment of the application provides a three-dimensional on-line monitoring method for the buckling deformation and the defects of a packaging module, which adopts the device and comprises the following steps:
Obtaining first warping information of a sample of the packaging module to be tested through the projection moire module;
obtaining second warping information of a sample of the packaging module to be tested through the ultrasonic module;
And obtaining monitoring result information according to the first warping information and the second warping information.
Preferably, the second warp information is obtained by the ultrasonic module by using a transmission method, a surface reflection method, a bottom reflection method of V transmission method, and a bottom reflection method of surface wave.
One or more technical solutions provided in the embodiments of the present application at least have the following technical effects or advantages:
In the embodiment of the application, the first warping information of the packaging module sample to be tested is obtained through the projection moire, the second warping information of the packaging module sample to be tested is obtained through the ultrasonic wave, then the combination analysis is carried out according to the first warping information and the second warping information, and the monitoring result information is obtained, so that the on-line monitoring of the failure condition of the packaging module of the electronic device in the actual industrial production process is realized, and the previous dead of the industrial industry on off-line detection of the failure product is changed.
Detailed Description
In order to better understand the above technical solutions, the following detailed description will refer to the accompanying drawings and specific embodiments.
The embodiment provides a three-dimensional on-line monitoring device for warp deformation and defects of a packaging module, which mainly comprises a projection moire module, an ultrasonic module and a monitoring analysis module, wherein the monitoring analysis module is respectively connected with the projection moire module and the ultrasonic module.
The projection moire module is used for obtaining first warping information of a packaging module sample to be tested, the ultrasonic module is used for obtaining second warping information of the packaging module sample to be tested, and the monitoring analysis module is used for obtaining monitoring result information according to the first warping information and the second warping information.
The invention will be further illustrated with reference to specific examples.
Example 1:
the stereoscopic online monitoring device for the warp deformation and the defects of the packaging module provided by the embodiment 1 comprises a projection moire module, an ultrasonic module and a monitoring analysis module, wherein the monitoring analysis module is respectively connected with the projection moire module and the ultrasonic module.
The projection moire module comprises a CCD camera and a grating projector, wherein the grating projector is used for projecting a grating to the surface of a sample of the packaging module to be tested, and the CCD camera is used for continuously shooting and collecting grating changes on the surface of the sample of the packaging module to be tested to obtain the first warping information.
In the preferred scheme, the projection moire module further comprises a first synchronous trigger, the CCD camera is a CCD camera array formed by a plurality of CCD cameras, the CCD camera array is connected with the first synchronous trigger, and the grating projector is a grating projector array formed by a plurality of grating projectors.
The first synchronous trigger and the plurality of CCD cameras are respectively connected through a data line, and then the first synchronous trigger is connected with a workstation (namely a monitoring analysis module) for controlling photographing and analysis. The first synchronous trigger is used for ensuring that a plurality of CCD cameras can trigger photographing at the same time when photographing, so that the photos taken at the same time can be combined into a whole photo in the workstation.
The CCD camera array can realize on-line monitoring of a large-area packaging module, and can improve the limitation of the size of a camera view field. The measurement is performed by forming an array by a plurality of cameras, for example, the field of view of the 16 CCD camera group arrays is 600 x 600mm, the measurement precision can reach 4 micrometers, and the precision can reach 1.5 micrometers under the field of view of 240 x 240 mm. By adopting 64, 100, 200 or even more cameras to form an array, the invention can theoretically measure the warp deformation and defects under infinite area.
The number of the grating projectors is theoretically determined by whether the gratings projected by the projectors cover the whole surface of the to-be-tested packaging module sample piece or not. In order to achieve a theoretically infinite measurement area, the purpose of large-area monitoring can be achieved by increasing the number of grating projectors, i.e. the array assembly of grating projectors.
The ultrasonic module comprises an air coupling ultrasonic probe, an ultrasonic signal transmitting and receiving device and a pre-amplifier, wherein the air coupling ultrasonic probe is connected with the ultrasonic signal transmitting and receiving device, the ultrasonic signal transmitting and receiving device is connected with the pre-amplifier, and the pre-amplifier is connected with the monitoring and analyzing module.
According to application requirements, the air coupling ultrasonic probe can be any one of a plane probe, a point focusing probe and a line focusing probe. For example, a planar probe is suitable for planar detection of a large area, and a point focus probe is suitable for detection of a large object having a large thickness.
The pre-amplifier can improve the signal-to-noise ratio of the system, reduce the relative influence of external interference, is convenient for reasonable layout, is convenient for adjustment and use, and can realize impedance conversion and matching.
In the preferable scheme, the ultrasonic module further comprises a second synchronous trigger, the air-coupled ultrasonic probe is an array air-coupled ultrasonic probe group formed by a plurality of air-coupled ultrasonic probes, and the array air-coupled ultrasonic probe group is connected with the second synchronous trigger.
When on-line monitoring is performed on a large-area packaging module, a single ultrasonic probe may not cover the whole area to be detected, and therefore, large-area coverage can be achieved by adopting an array type air coupling ultrasonic probe group. The second synchronous trigger can ensure that a plurality of ultrasonic probes work simultaneously.
In addition, a third synchronous trigger can be arranged between the CCD camera array and the array type air coupling ultrasonic probe group so as to ensure that the two work simultaneously trigger accurately.
The monitoring analysis module comprises a data storage device, a data analysis device and a monitoring display device, wherein the data storage device is used for storing information from the projection moire module and the ultrasonic module and transmitting the information to the data analysis device, the data analysis device is used for obtaining warp deformation information according to the first warp information and warp defect information according to the second warp information and obtaining the monitoring result information according to the warp deformation information and the warp defect information, and the monitoring display device is used for displaying the monitoring result information.
The warp deformation and defect judging process is combined and analyzed, the warp deformation is completed by the projection moire module, and if the analysis result shows that the warp deformation of the to-be-tested packaging module sample is obviously larger, the result is obtained by combining the analysis result with the ultrasonic module responsible for warp defect monitoring. Namely, the two are required to be comprehensively analyzed to obtain the process of judging whether the sample to be tested fails or not.
Because the projection moire technology has higher precision for measuring the warp deformation of the product, the warp deformation measuring process of the large-area packaging module with larger warp defects can be monitored on line. The ultrasonic technology has the characteristics of high response speed, large detection area, capability of on-line monitoring certain objects to be detected which are difficult to contact or forbidden to contact, and the like, so that the method has remarkable advantage in defect characterization, and can be used for on-line monitoring the characterization process of large-area package modules possibly having large warping defects. The projection moire technology and the ultrasonic technology are combined, so that the warping defect of the electronic device in industrial production can be further monitored on line, the timeliness of the warping defect monitoring is improved, unqualified failure devices are found in time, effective dynamic reference is provided for quality improvement of the process flow of product production, the yield of the electronic device is improved, and the production cost is reduced.
In addition, the three-dimensional on-line monitoring device for the buckling deformation and the defects of the packaging module further comprises an optical three-dimensional measurement calibrator and a plane placement table. The optical three-dimensional measurement calibrator is used for calibrating internal parameters, external parameters and heights of cameras, and establishing a space coordinate system between the cameras and the to-be-tested packaging module sample. And the to-be-tested packaging module sample is placed on the plane placement table.
Specifically, referring to fig. 1, the CCD camera 1 is a CCD camera array formed by a plurality of CCD cameras, and the grating projector 2 is a grating projector array formed by a plurality of grating projectors. The air coupling ultrasonic probe is an array air coupling ultrasonic probe group formed by a plurality of air coupling ultrasonic probes, and the array air coupling ultrasonic probe group can be divided into a transmitting probe 3 and a receiving probe 4. The packaging module sample to be tested (such as a wafer or an OLED screen) 5 is placed on the plane placing table, the transmitting probe 3 is located above the packaging module sample to be tested 5, the receiving probe 4 is located below the packaging module sample to be tested 5, for example, the receiving probe 4 can be arranged inside the plane placing table, and the transmitting probe 3 and the receiving probe 4 are perpendicular to the packaging module sample to be tested 5.
Example 2:
Referring to fig. 2, the CCD camera 1 is a CCD camera array formed by a plurality of CCD cameras, and the grating projector 2 is a grating projector array formed by a plurality of grating projectors. The air coupling ultrasonic probe is an array air coupling ultrasonic probe group formed by a plurality of air coupling ultrasonic probes. Unlike example 1, the probe in example 2 is a transmitting/receiving probe 3. The to-be-tested packaging module sample 4 is placed on the plane placing table, and the transmitting and receiving probe 3 is positioned above the to-be-tested packaging module sample 4 and perpendicular to the to-be-tested packaging module sample 4.
Example 3:
Referring to fig. 3, the CCD camera 1 is a CCD camera array formed by a plurality of CCD cameras, and the grating projector 2 is a grating projector array formed by a plurality of grating projectors. The air coupling ultrasonic probe is an array air coupling ultrasonic probe group formed by a plurality of air coupling ultrasonic probes, and the array air coupling ultrasonic probe group can be divided into a transmitting probe 3 and a receiving probe 4. The packaging module sample 5 to be tested is placed on the plane placing table, the transmitting probe 3 and the receiving probe 4 are all positioned above the packaging module sample 5 to be tested, and the transmitting probe 3 and the receiving probe 4 are all at a certain angle with the packaging module sample 5 to be tested.
For the devices provided in examples 1-3, reference parameters are given below (1) the projected area of the grating fringes that can be emitted is 600mm x 600mm, the frequency is 50Hz, the fringe density is 2-50 lines adjustable, (2) the image resolution is 6400 ten thousand pixels, the camera frame rate is 75fps, the acquisition frame rate is not lower than 10fps at 6400 ten thousand pixels, the field of view is not less than 600mm x 600mm, and the warp deformation measurement resolution is 4 micrometers (600 mm x 600 mm).
By utilizing the device, the invention provides a three-dimensional on-line monitoring method for the buckling deformation and the defects of a packaging module, which comprises the following steps:
Obtaining first warping information of a sample of the packaging module to be tested through the projection moire module;
obtaining second warping information of a sample of the packaging module to be tested through the ultrasonic module;
And obtaining monitoring result information according to the first warping information and the second warping information.
Among them, the monitoring sequence method includes but is not limited to the following two methods:
(1) Meanwhile, the on-line monitoring of the warping defect is carried out by adopting the ultrasonic wave and the cloud pattern projection function.
(2) The on-line monitoring of the warping defect is carried out by adopting the ultrasonic wave and the cloud pattern projection function alternately or in a certain specific sequence.
The following description is made with reference to specific examples.
Example 4:
The method for three-dimensional on-line monitoring of the warp deformation and the defects of the packaging module provided in the embodiment 4 adopts the monitoring device provided in the embodiment 1. In example 4, the second warpage information is obtained by the ultrasonic module by using a transmission method, the schematic diagram of the transmission method is shown in fig. 4, the ultrasonic transmitting probe transmits an ultrasonic detection signal, the ultrasonic receiving probe receives a transmitted ultrasonic signal penetrating from the sample to be tested, and the transmitted ultrasonic signal is input into the workstation through the preamplifier to analyze and monitor the warpage defect of the sample.
Taking the package module warp deformation and defect three-dimensional on-line monitoring device provided by the embodiment 4 as an example, the corresponding on-line monitoring method comprises the steps of projecting a grating to the surface of a sample by a high-speed grating projector in a projection moire module, continuously shooting and collecting the grating change of the surface of the sample by an array CCD camera group, monitoring the warp defect of the sample by projection moire analysis software, using an array air coupling ultrasonic wave transmitting probe group with high sensitivity to control a workstation to send out ultrasonic signals in an ultrasonic module, continuously collecting the ultrasonic wave fluctuation signals of the sample to be detected by an array air coupling ultrasonic wave receiving probe group, and inputting the ultrasonic wave fluctuation signals into the workstation by a preamplifier to analyze and monitor the warp defect of the sample. Through the whole set of ultrasonic and projection moire system, the purposes of on-line monitoring of the warp deformation and defects of the large-area packaging module are achieved.
Example 5:
The method for three-dimensional on-line monitoring of the warp deformation and the defects of the packaging module provided in the embodiment 5 adopts the monitoring device provided in the embodiment 2. Example 5 the second warp information was obtained by the ultrasonic module using a surface reflection method. Schematic diagram of surface reflection method referring to fig. 5, an ultrasonic transmitting and receiving probe transmits an ultrasonic detection signal, then the ultrasonic transmitting and receiving probe receives an ultrasonic signal reflected from the surface of a sample to be detected, and the ultrasonic signal is input into a workstation through a preamplifier to analyze and monitor the warping defect of the sample.
Example 6:
the method for three-dimensional on-line monitoring of the warp deformation and the defects of the packaging module provided in the embodiment 6 adopts the monitoring device provided in the embodiment 3. Example 6 the second warp information was obtained by the ultrasonic module using a bottom reflection method (V transmission method). Referring to fig. 6, the schematic diagram of the principle of the bottom reflection method (V transmission method) is that an ultrasonic transmitting probe and a receiving probe are pre-adjusted to form a certain angle in a sample to-be-measured area, so that the reflected ultrasonic signals are smoothly collected by the receiving probe. Firstly, an ultrasonic transmitting probe sends out an ultrasonic detection signal, then an ultrasonic receiving probe receives a transmitted ultrasonic signal reflected and penetrated from the bottom surface of a sample to be detected, and the transmitted ultrasonic signal is input into a workstation through a preamplifier to analyze and monitor the warping defect of the sample.
Example 7:
The method for three-dimensional on-line monitoring of the warp deformation and the defects of the packaging module provided in the embodiment 7 adopts the monitoring device provided in the embodiment 3. Example 7 the second warp information was obtained by the ultrasonic module using bottom surface reflection (surface wave). Schematic diagram of bottom reflection method (surface wave) referring to fig. 7, the ultrasonic transmitting probe and receiving probe are pre-adjusted to form a certain angle in the sample to-be-measured area, so that the reflected ultrasonic signal is successfully collected by the receiving probe. Firstly, an ultrasonic transmitting probe sends out an ultrasonic detection signal, then an ultrasonic receiving probe simultaneously receives a transmitted ultrasonic signal reflected and penetrated from the bottom surface of a sample to be detected and a surface wave signal reflected back from the surface of the sample, and the transmitted ultrasonic signal and the surface wave signal are input into a workstation through a preamplifier to analyze and monitor the warping defect of the sample.
The method and the device for three-dimensional on-line monitoring of the buckling deformation and the defects of the packaging module provided by the embodiment of the invention at least comprise the following technical effects:
The invention can carry out on-line monitoring on the warping defect of the electronic device in industrial production, improves the timeliness of the warping defect monitoring, discovers unqualified failure devices in time, and provides effective dynamic reference for the quality improvement of the process flow of product production, thereby improving the yield of the electronic device and reducing the production cost.
Finally, it should be noted that the above-mentioned embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same, and although the present invention has been described in detail with reference to examples, it should be understood by those skilled in the art that modifications and equivalents may be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention, and all such modifications and equivalents are intended to be encompassed in the scope of the claims of the present invention.