CN110645902A - Online monitoring method and device for warpage deformation and defects of packaging module - Google Patents
Online monitoring method and device for warpage deformation and defects of packaging moduleDownload PDFInfo
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- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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Abstract
Translated fromChineseDescription
Translated fromChinese技术领域technical field
本发明涉及封装模块监测技术领域，尤其涉及一种封装模块翘曲变形及缺陷的在线监测方法和装置。The present invention relates to the technical field of package module monitoring, in particular to an on-line monitoring method and device for warpage deformation and defects of a package module.
背景技术Background technique
目前集成电路技术已渗透到工业及社会生活的各个领域，电子工业已成为当今第一大产业。从20世纪70年代以来，全球电子信息产业迅速发展。电子信息产业是在电子科学技术发展和应用的基础上发展起来的。电子信息产业的发展由于生产技术的提高和加工工艺的改进，集成电路差不多每三年就更新一代；大规模集成电路和计算机的大量生产和使用，光纤通信、数字化通信、卫星通信技术的兴起，使电子工业成为一个迅速崛起的高技术产业。电子工业的发展及其产品的广泛应用，对全球经济文化等方面产生了极其深刻的影响。而无论从科技或是经济发展的角度来看，半导体的重要性都是非常巨大的。At present, integrated circuit technology has penetrated into all fields of industry and social life, and the electronics industry has become the largest industry today. Since the 1970s, the global electronic information industry has developed rapidly. The electronic information industry is developed on the basis of the development and application of electronic science and technology. The development of the electronic information industry Due to the improvement of production technology and the improvement of processing technology, integrated circuits are replaced by a new generation almost every three years; the mass production and use of large-scale integrated circuits and computers, the rise of optical fiber communication, digital communication, and satellite communication technologies, Make the electronics industry a rapidly rising high-tech industry. The development of the electronics industry and the wide application of its products have had a profound impact on the global economy and culture. From the perspective of technology or economic development, the importance of semiconductors is very huge.
当今大部分的电子产品，如计算机、移动电话或是数字录音机当中的核心单元都和半导体有着极为密切的关联。电子器件的封装技术是制约集成电路发展的关键环节之一。电子器件在封装中由于各种材料(基底、粘结层、芯片及封装材料)的尺寸和材料性能的差异在较大温差作用下引起的翘曲问题已严重影响了电子器件的可靠性、焊接性能和成品率。因此，电子器件的翘曲问题已成为影响电子封装技术继续深入发展的一个重大障碍。Most of today's electronic products, such as computers, mobile phones or the core unit of digital recorders, are closely related to semiconductors. The packaging technology of electronic devices is one of the key links restricting the development of integrated circuits. The warpage problem caused by the difference in size and material properties of various materials (substrate, bonding layer, chip and packaging material) in the packaging of electronic devices under the action of large temperature difference has seriously affected the reliability and welding of electronic devices. performance and yield. Therefore, the warpage problem of electronic devices has become a major obstacle that affects the further development of electronic packaging technology.
在半导体工艺过程中，随着在晶圆表面形成各种材料层以及各种半导体器件结构，会对晶圆表面产生各种应力，使得晶圆在工艺过程中发生翘曲。最理想的状态下，晶圆不应发生翘曲的，即便无法完全平坦，在理想状态下，晶圆的翘曲也应当是边缘向晶圆正面方向翘起的且关于垂直晶圆的中轴线对称的碗状；而实际情况中，由于晶圆正面受到应力的不对称性，经常会造成晶圆各种形态的不对称的翘曲，导致晶圆容易发生翘曲缺陷导致部分芯片失效甚至发生碎片的情况。During the semiconductor process, as various material layers and various semiconductor device structures are formed on the surface of the wafer, various stresses will be generated on the surface of the wafer, causing the wafer to warp during the process. In the ideal state, the wafer should not be warped. Even if it cannot be completely flat, in the ideal state, the warpage of the wafer should be warped from the edge to the front of the wafer and perpendicular to the central axis of the wafer. Symmetrical bowl shape; in practice, due to the asymmetry of the stress on the front side of the wafer, it often causes asymmetric warpage of various forms of the wafer, which makes the wafer prone to warpage defects and causes some chips to fail or even occur. Fragmentation.
现有技术中，在工业生产中难以实现对于电子器件的封装模块的翘曲缺陷在线监测。翘曲变形的测量方法有许多，例如电子散斑干涉技术、阴影云纹、投影云纹及数字图像相关法(DIC)等。这些方法各自有其特定的测量精度及应用场景，同时其测量面积及测量范围也有所不同。电子散斑干涉技术因其昂贵的大功率激光器不适用于例如晶圆这类大面积翘曲变形的测量与监测。阴影云纹因其光路设置的问题同样不适用于大面积翘曲变形的测量与监测。而数字图像相关法因其需在样件表面喷一层具有特异性灰度的散斑而不适用于不能进行表面预处理的样件。投影云纹法是20世纪70年代发展起来的一种现代光学测量技术，多用于面内变形、离面位移、表面形貌的检测。凭借非接触、快速、全场测量、高分辨率、高精度的优势，投影云纹法被广泛应用于生物、医学检测、产品检测、逆向工程等众多领域。而投影云纹技术目前国内外均有成熟的设备产品，对于翘曲的测量精度较高，可达1.5微米的精度，但投影云纹技术因其自身原理的缘故，只能对物体表面进行测量，其基本不具有穿透能力，因而对于产品的内部缺陷的探测能力较弱。In the prior art, it is difficult to realize on-line monitoring of warpage defects of packaged modules of electronic devices in industrial production. There are many measurement methods for warping deformation, such as electronic speckle interferometry, shadow moiré, projection moiré and digital image correlation (DIC). Each of these methods has its specific measurement accuracy and application scenarios, and its measurement area and measurement range are also different. Electronic speckle interferometry is not suitable for the measurement and monitoring of large-area warpage deformation such as wafers because of its expensive high-power lasers. Shadow moiré is also not suitable for the measurement and monitoring of large-area warping deformation due to the problem of optical path setting. However, the digital image correlation method is not suitable for samples that cannot be pretreated because it needs to spray a layer of speckle with specific grayscale on the surface of the sample. The projection moiré method is a modern optical measurement technology developed in the 1970s, and is mostly used for the detection of in-plane deformation, off-plane displacement, and surface topography. With the advantages of non-contact, fast, full-field measurement, high resolution, and high precision, the projection moiré method is widely used in many fields such as biology, medical testing, product testing, and reverse engineering. The projection moiré technology currently has mature equipment and products at home and abroad. The measurement accuracy of warpage is high, up to 1.5 microns. However, due to its own principle, the projection moiré technology can only measure the surface of the object. , which basically does not have the ability to penetrate, so the ability to detect the internal defects of the product is weak.
此外，当前对于电子器件的封装模块的翘曲变形及缺陷，在工业生产过程中通常的只是在电子器件失效之后对其进行离线检测，该方法不但流程复杂、所需设备繁多，而且耗时较长、测试效果不佳，对于改善电子器件的生产工艺也助益不大。如何有效可靠地在线监测电子器件的翘曲状态，是目前工业生产中亟待解决的问题。In addition, for the current warpage deformation and defects of the packaging modules of electronic devices, in the industrial production process, only offline detection is usually performed after the electronic devices fail. It is long and the test effect is not good, and it is not helpful for improving the production process of electronic devices. How to effectively and reliably monitor the warpage state of electronic devices online is an urgent problem to be solved in current industrial production.
发明内容SUMMARY OF THE INVENTION
本申请实施例通过提供一种封装模块翘曲变形及缺陷的在线监测方法和装置，解决了现有技术中无法对封装模块的翘曲变形及缺陷进行在线监测的问题。The embodiments of the present application solve the problem of inability to perform online monitoring of the warpage deformation and defects of the package module in the prior art by providing an online monitoring method and device for the warpage deformation and defects of the package module.
本申请实施例提供一种封装模块翘曲变形及缺陷的在线监测装置，包括：投影云纹模块、红外成像模块、监测分析模块；An embodiment of the present application provides an online monitoring device for warpage deformation and defects of a packaged module, including: a projection moiré module, an infrared imaging module, and a monitoring and analysis module;
所述监测分析模块分别与所述投影云纹模块、所述红外成像模块相连；The monitoring and analysis module is respectively connected with the projection moiré module and the infrared imaging module;
所述投影云纹模块用于获得待测封装模块样品的第一翘曲信息；The projection moiré module is used to obtain the first warpage information of the packaged module sample to be tested;
所述红外成像模块用于获得待测封装模块样品的第二翘曲信息；The infrared imaging module is used to obtain the second warpage information of the package module sample to be tested;
所述监测分析模块用于根据所述第一翘曲信息、所述第二翘曲信息获得监测结果信息。The monitoring and analysis module is configured to obtain monitoring result information according to the first warpage information and the second warpage information.
优选的，所述投影云纹模块包括：CCD相机、光栅投影仪；Preferably, the projection moiré module includes: a CCD camera and a grating projector;
所述光栅投影仪用于投射光栅至待测封装模块样品表面；The grating projector is used to project the grating to the sample surface of the packaged module to be tested;
所述CCD相机用于对所述待测封装模块样品表面的光栅变化进行连续拍摄采集，获得所述第一翘曲信息。The CCD camera is used for continuously photographing and collecting the grating changes on the sample surface of the packaged module to be tested to obtain the first warpage information.
优选的，所述投影云纹模块还包括：第一同步触发器；Preferably, the projection moiré module further comprises: a first synchronization trigger;
所述CCD相机为多个CCD相机组成的CCD相机阵列；所述CCD相机阵列与所述第一同步触发器连接；The CCD camera is a CCD camera array composed of multiple CCD cameras; the CCD camera array is connected to the first synchronization trigger;
所述光栅投影仪为多个光栅投影仪组成的光栅投影仪阵列。The grating projector is a grating projector array composed of a plurality of grating projectors.
优选的，所述红外成像模块包括：红外相机；Preferably, the infrared imaging module includes: an infrared camera;
所述红外相机用于对待测封装模块样品表面进行红外图像的连续采集，获得所述第二翘曲信息。The infrared camera is used to continuously collect infrared images of the surface of the package module sample to be tested to obtain the second warpage information.
优选的，所述红外成像模块包括：热冲击源、红外相机；Preferably, the infrared imaging module includes: a thermal shock source and an infrared camera;
所述热冲击源用于对待测封装模块样品进行热冲击；The thermal shock source is used to thermally shock the packaged module sample to be tested;
所述红外相机用于对热冲击后的待测封装模块样品表面进行红外图像的连续采集，获得所述第二翘曲信息。The infrared camera is used to continuously collect infrared images of the surface of the packaged module sample to be tested after thermal shock, so as to obtain the second warpage information.
优选的，所述红外成像模块还包括：第二同步触发器；Preferably, the infrared imaging module further comprises: a second synchronization trigger;
所述红外相机为多个红外相机组成的红外相机阵列，所述红外相机阵列与所述第二同步触发器连接。The infrared camera is an infrared camera array composed of a plurality of infrared cameras, and the infrared camera array is connected with the second synchronization trigger.
优选的，所述监测分析模块包括：数据存储装置、数据分析装置、监测显示装置；Preferably, the monitoring and analysis module includes: a data storage device, a data analysis device, and a monitoring and display device;
所述数据存储装置用于存储来自所述投影云纹模块、所述红外成像模块的信息，并传输至所述数据分析装置；The data storage device is used to store the information from the projection moiré module and the infrared imaging module, and transmit it to the data analysis device;
所述数据分析装置用于根据所述第一翘曲信息获得翘曲变形信息，用于根据所述第二翘曲信息获得翘曲缺陷信息，用于根据所述翘曲变形信息和所述翘曲缺陷信息获得所述监测结果信息；The data analysis device is used for obtaining warpage deformation information according to the first warpage information, for obtaining warpage defect information according to the second warpage information, for obtaining warpage deformation information according to the warpage deformation information and the warpage Curve defect information to obtain the monitoring result information;
所述监测显示装置用于对所述监测结果信息进行显示。The monitoring display device is used for displaying the monitoring result information.
优选的，所述封装模块翘曲变形及缺陷的在线监测装置还包括：光学三维测量标定器；Preferably, the on-line monitoring device for warpage deformation and defects of the package module further comprises: an optical three-dimensional measurement calibrator;
所述光学三维测量标定器用于对相机进行内参、外参、高度标定。The optical three-dimensional measurement calibrator is used to calibrate internal parameters, external parameters and height of the camera.
优选的，所述封装模块翘曲变形及缺陷的在线监测装置还包括：平面安置台；Preferably, the on-line monitoring device for warpage deformation and defects of the package module further comprises: a plane mounting table;
所述待测封装模块样品放置在所述平面安置台上；所述热冲击源设置在所述平面安置台的内部或侧边。The packaged module sample to be tested is placed on the plane mounting table; the thermal shock source is arranged inside or on the side of the plane mounting table.
另一方面，利用上述装置，本申请实施例提供一种封装模块翘曲变形及缺陷的在线监测方法，包括以下步骤：On the other hand, using the above device, an embodiment of the present application provides an online monitoring method for warpage deformation and defects of a package module, comprising the following steps:
通过投影云纹模块获得待测封装模块样品的第一翘曲信息；Obtain the first warpage information of the packaged module sample to be tested by projecting the moiré module;
通过红外成像模块获得待测封装模块样品的第二翘曲信息；Obtain the second warpage information of the packaged module sample to be tested through the infrared imaging module;
根据所述第一翘曲信息、所述第二翘曲信息获得监测结果信息。The monitoring result information is obtained according to the first warpage information and the second warpage information.
本申请实施例中提供的一个或多个技术方案，至少具有如下技术效果或优点：One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:
在本申请实施例中，通过投影云纹获得待测封装模块样品的第一翘曲信息，通过红外成像获得待测封装模块样品的第二翘曲信息，然后根据第一翘曲信息、第二翘曲信息进行结合分析，获得监测结果信息，实现对实际工业生产过程中的电子器件的封装模块的失效情况进行在线监测，改变了以往工业界对于失效产品离线检测的僵局。In the embodiment of the present application, the first warpage information of the packaged module sample to be tested is obtained by projecting the moiré, the second warpage information of the packaged module sample to be tested is obtained by infrared imaging, and then according to the first warpage information, the second warpage information The warpage information is combined and analyzed, and the monitoring result information is obtained, which realizes the online monitoring of the failure of the packaging module of the electronic device in the actual industrial production process, and changes the previous deadlock of the offline detection of the failed product in the industry.
附图说明Description of drawings
为了更清楚地说明本实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本发明的一个实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to explain the technical solutions in this embodiment more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are an embodiment of the present invention. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.
图1为本发明实施例提供的一种封装模块翘曲变形及缺陷的在线监测装置的结构示意图一；FIG. 1 is a schematic structural diagram 1 of an online monitoring device for warpage deformation and defects of a package module according to an embodiment of the present invention;
图2为本发明实施例提供的一种封装模块翘曲变形及缺陷的在线监测装置的结构示意图二；FIG. 2 is a second structural schematic diagram of an on-line monitoring device for warpage deformation and defects of a package module provided by an embodiment of the present invention;
图3为本发明实施例提供的一种封装模块翘曲变形及缺陷的在线监测装置的结构示意图三；FIG. 3 is a third structural schematic diagram of an online monitoring device for warpage deformation and defects of a package module provided by an embodiment of the present invention;
图4为本发明实施例提供的一种封装模块翘曲变形及缺陷的在线监测装置的结构示意图四。FIG. 4 is a fourth schematic structural diagram of an on-line monitoring device for warping deformation and defects of a package module according to an embodiment of the present invention.
其中，1-CCD相机、2-光栅投影仪、3-热冲击源、4-红外相机、5-待测封装模块样品。Among them, 1-CCD camera, 2-grating projector, 3-thermal shock source, 4-infrared camera, 5-package module sample to be tested.
具体实施方式Detailed ways
为了更好的理解上述技术方案，下面将结合说明书附图以及具体的实施方式对上述技术方案进行详细的说明。In order to better understand the above technical solutions, the above technical solutions will be described in detail below with reference to the accompanying drawings and specific embodiments.
本发明提供一种封装模块翘曲变形及缺陷的在线监测装置，主要包括：投影云纹模块、红外成像模块、监测分析模块；所述监测分析模块分别与所述投影云纹模块、所述红外成像模块相连。The present invention provides an online monitoring device for warping deformation and defects of a packaged module, which mainly includes: a projection moiré module, an infrared imaging module, and a monitoring and analysis module; the monitoring and analysis module is respectively connected with the projection moiré module, the infrared The imaging module is connected.
所述投影云纹模块用于获得待测封装模块样品的第一翘曲信息；所述红外成像模块用于获得待测封装模块样品的第二翘曲信息；所述监测分析模块用于根据所述第一翘曲信息、所述第二翘曲信息获得监测结果信息。The projection moiré module is used to obtain the first warpage information of the packaged module sample to be tested; the infrared imaging module is used to obtain the second warpage information of the packaged module sample to be tested; the monitoring and analysis module is used to obtain the second warpage information of the packaged module sample to be tested; The first warpage information and the second warpage information are used to obtain monitoring result information.
下面结合具体的实施例对本发明做进一步的说明。The present invention will be further described below in conjunction with specific embodiments.
实施例1：Example 1:
实施例1提供的一种封装模块翘曲变形及缺陷的在线监测装置包括投影云纹模块、红外成像模块、监测分析模块；所述监测分析模块分别与所述投影云纹模块、所述红外成像模块相连。An online monitoring device for warpage deformation and defects of a packaged module provided in
其中，参看图1-图4，所述投影云纹模块包括：CCD相机1、光栅投影仪2；所述光栅投影仪2用于投射光栅至待测封装模块样品5表面；所述CCD相机1用于对所述待测封装模块样品5表面的光栅变化进行连续拍摄采集，获得所述第一翘曲信息。1-4, the projection moiré module includes: a
所述红外成像模块包括：红外相机4；所述红外相机4用于对待测封装模块样品5表面进行红外图像的连续采集，获得所述第二翘曲信息。The infrared imaging module includes: an
所述监测分析模块包括：数据存储装置、数据分析装置、监测显示装置。所述数据存储装置用于存储来自所述投影云纹模块、所述红外成像模块的信息，并传输至所述数据分析装置；所述数据分析装置用于根据所述第一翘曲信息获得翘曲变形信息，用于根据所述第二翘曲信息获得翘曲缺陷信息，用于根据所述翘曲变形信息和所述翘曲缺陷信息获得所述监测结果信息；所述监测显示装置用于对所述监测结果信息进行显示。The monitoring and analysis module includes: a data storage device, a data analysis device, and a monitoring and display device. The data storage device is used to store the information from the projection moiré module and the infrared imaging module, and transmit it to the data analysis device; the data analysis device is used to obtain warpage according to the first warpage information warping deformation information for obtaining warping defect information according to the second warping information, for obtaining the monitoring result information according to the warping deformation information and the warping defect information; the monitoring display device is used for The monitoring result information is displayed.
翘曲变形及缺陷的判断过程是结合分析的，翘曲变形由所述投影云纹模块完成，若其分析结果显待测封装模块样品的翘曲变形明显偏大，则与负责翘曲缺陷监测的所述红外成像模块相结合综合分析得出结果。即二者需综合分析，才能得出待测样件是否失效的过程。The warpage deformation and defect judgment process is combined with analysis. The warpage deformation is completed by the projection moiré module. If the analysis result shows that the warpage deformation of the packaged module sample to be tested is significantly larger, the warpage defect monitoring will be conducted with the The infrared imaging module is combined with the comprehensive analysis to obtain the result. That is to say, the two need to be comprehensively analyzed in order to obtain the process of whether the sample to be tested fails.
由于投影云纹技术对于产品翘曲变形的测量具有较高的精度，因此可在线监测可能存在较大翘曲缺陷的大面积封装模块的翘曲变形测量的过程。由于红外成像技术具有响应速度快、检测区域大、可在线监测某些难以接触或禁止接触的被测物体等特点，因此可在线监测大面积封装模块中可能存在较大翘曲缺陷的表征过程。将投影云纹技术与红外成像技术进行结合，可进一步对工业生产中的电子器件的翘曲缺陷进行在线监测，提高翘曲缺陷监测的时效性，及时发现不合格的失效器件，为产品生产的工艺流程的质量提升提供有效的动态参考，从而提高电子器件的良品率，降低生产成本。Since the projection moiré technology has high accuracy for the measurement of product warpage deformation, the process of warpage deformation measurement of large-area packaged modules that may have large warpage defects can be monitored online. Because infrared imaging technology has the characteristics of fast response speed, large detection area, and online monitoring of some objects to be measured that are difficult or forbidden to be touched, it can monitor the characterization process of large warpage defects in large-area package modules online. The combination of projection moiré technology and infrared imaging technology can further monitor the warpage defects of electronic devices in industrial production online, improve the timeliness of warpage defect monitoring, and discover unqualified failed devices in time. The quality improvement of the process flow provides an effective dynamic reference, thereby improving the yield of electronic devices and reducing production costs.
实施例2：Example 2:
实施例2提供的一种封装模块翘曲变形及缺陷的在线监测装置与实施例1的不同在于，所述投影云纹模块还包括第一同步触发器，所述CCD相机1为多个CCD相机组成的CCD相机阵列；所述CCD相机阵列与所述第一同步触发器连接。所述光栅投影仪2为多个光栅投影仪组成的光栅投影仪阵列。The difference between the online monitoring device for warpage deformation and defects of a packaged module provided in
通过数据线将所述第一同步触发器和多台CCD相机分别连接起来，再将所述第一同步触发器与控制拍照和分析的工作站(即监测分析模块)连接起来。采用第一同步触发器是为了在拍照时保证多个CCD相机能够同时触发拍照，以保证在同一时刻拍出的照片能够在工作站中被合成一整张照片。The first synchronization trigger and multiple CCD cameras are respectively connected through data lines, and then the first synchronization trigger is connected with a workstation (ie, a monitoring and analysis module) that controls photographing and analysis. The purpose of using the first synchronization trigger is to ensure that multiple CCD cameras can trigger to take pictures at the same time, so as to ensure that the pictures taken at the same moment can be combined into a whole picture in the workstation.
采用CCD相机阵列可以实现对大面积的封装模块进行在线监测，可改善相机视场大小的限制。通过多个相机组成阵列来测量，例如16个CCD相机组阵列的视场为600*600mm，测量精度可达4微米，在240*240mm视场下精度可达1.5微米。通过本发明采用64、100、200乃至更多的相机组成阵列，理论上可以测量无限大的面积下的翘曲变形及缺陷。Using a CCD camera array can realize online monitoring of large-area packaged modules, which can improve the limitation of the field of view of the camera. It is measured by forming an array of multiple cameras. For example, the field of view of the 16 CCD camera group array is 600*600mm, and the measurement accuracy can reach 4 microns, and the accuracy can reach 1.5 microns under the 240*240mm field of view. By using 64, 100, 200 or even more cameras to form an array in the present invention, it is theoretically possible to measure warpage deformation and defects in an infinite area.
所述光栅投影仪2的个数的多少理论上取决于投影仪投出的光栅是否覆盖待测封装模块样件5的全部表面。为了实现理论上无限大的测量面积，通过增加光栅投影仪的数量，即光栅投影仪阵列式组装可以实现大面积监测的目的。The number of the
实施例3：Example 3:
实施例3提供的一种封装模块翘曲变形及缺陷的在线监测装置与实施例1或实施例2的不同在于，所述红外成像模块还包括第二同步触发器，所述红外相机4为多个红外相机组成的红外相机阵列，所述红外相机阵列与所述第二同步触发器连接。每个所述红外相机包括一个红外镜头和一个红外探测器。The difference between the online monitoring device for warpage deformation and defects of a packaged module provided in
对大面积的封装模块进行在线监测时，单个红外镜头可能不能覆盖整个待检测区域，因此，采用红外相机阵列可实现大面积的覆盖。采用所述第二同步触发器可保证多个红外相机能够同时触发拍照。When online monitoring of a large-area packaged module, a single infrared lens may not cover the entire area to be inspected. Therefore, a large-area coverage can be achieved by using an infrared camera array. The use of the second synchronization trigger can ensure that multiple infrared cameras can be triggered to take pictures at the same time.
实施例4：Example 4:
实施例4提供的一种封装模块翘曲变形及缺陷的在线监测装置与实施例1-3的不同在于，所述红外成像模块还包括：热冲击源3，所述热冲击源3用于对待测封装模块样品5进行热冲击；所述红外相机4用于对热冲击后的待测封装模块样品5表面进行红外图像的连续采集，获得所述第二翘曲信息。The difference between the on-line monitoring device for warpage deformation and defects of a packaged module provided in
加入所述热冲击源3的主要目的是为了使得所述红外成像模块能够在工业生产的流水线中更好地工作，因为往往产品生产临近检测时的温度不存在温度梯度，而红外成像模块正常工作需要样件本身存在一定的温度梯度。所述热冲击源3冲击样件后，因为样件本身不同材料的热膨胀系数不同，在相同时间内升高的温度也是不一样的，从而形成一定的温度梯度。The main purpose of adding the
此外，实施例1-4中，还可采用光学三维测量标定器对相机进行内参、外参、高度标定，将所述待测封装模块样品5放置在平面安置台上。其中，高精度三维标定器的作用在于对多台相机进行内参和外参以及高度标定，建立相机之间以及相机与待测封装模块样件5之间的空间坐标系。In addition, in Embodiments 1-4, an optical three-dimensional measurement calibrator can also be used to calibrate the internal parameters, external parameters, and height of the camera, and place the
根据红外成像的待监测区域不同，具体器件的安装方式也可相应的进行调整。如图1-图4所示，所述红外相机4可集成于待测封装模块样件5的侧边(例如安装在温度箱侧壁)或顶部(例如安装在温度箱顶部)，所述热冲击源3可设置在所述平面安置台的内部或侧边(例如安装在温度箱侧壁)。According to the different areas to be monitored by infrared imaging, the installation method of specific devices can also be adjusted accordingly. As shown in FIGS. 1-4 , the
下面给出一个参考参数：(1)可以发射的光栅条纹投影面积为600mm×600mm，频率为50Hz，条纹密度为2-50线可调；(2)图像分辨率为6400万像素，相机帧率为75fps，帧频为6400万像素下采集帧频不低于10fps，视场不小于600mm×600mm，翘曲变形测量分辨率为4微米(600mm×600mm)。A reference parameter is given below: (1) The projected area of grating fringes that can be emitted is 600mm×600mm, the frequency is 50Hz, and the fringe density is adjustable from 2 to 50 lines; (2) The image resolution is 64 million pixels, and the camera frame rate The frame rate is 75fps, the frame rate is not less than 10fps when the frame rate is 64 million pixels, the field of view is not less than 600mm×600mm, and the warpage deformation measurement resolution is 4 microns (600mm×600mm).
利用上述实施例提供的封装模块翘曲变形及缺陷的在线监测装置，本实施例提供一种封装模块翘曲变形及缺陷的在线监测方法，包括以下步骤：Utilizing the online monitoring device for warpage deformation and defects of a package module provided by the above embodiments, the present embodiment provides an online monitoring method for warpage deformation and defects of a package module, comprising the following steps:
通过投影云纹模块获得待测封装模块样品的第一翘曲信息；Obtain the first warpage information of the packaged module sample to be tested by projecting the moiré module;
通过红外成像模块获得待测封装模块样品的第二翘曲信息；Obtain the second warpage information of the packaged module sample to be tested through the infrared imaging module;
根据所述第一翘曲信息、所述第二翘曲信息获得监测结果信息。The monitoring result information is obtained according to the first warpage information and the second warpage information.
其中，监测顺序方法包括但不限于以下两种：Among them, monitoring sequence methods include but are not limited to the following two:
(1)同时采用红外成像和投影云纹功能的方式进行翘曲缺陷的在线监测。(1) On-line monitoring of warpage defects is carried out by means of infrared imaging and projection moiré function at the same time.
(2)先后交替采用或是以某种特定先后重复顺序采用红外成像及投影云纹功能的方式进行翘曲缺陷的在线监测。(2) The on-line monitoring of warpage defects is carried out alternately or in a specific repeated sequence by using infrared imaging and projection moiré functions.
以实施例4提供的封装模块翘曲变形及缺陷的在线监测装置为例，相应的采用的在线监测方法如下：投影云纹模块中，高速光栅投影仪投射出光栅至样品表面，阵列式CCD相机组对样品表面的光栅变化进行连续拍摄采集，通过投影云纹分析软件对样品翘曲缺陷进行监测；红外成像模块中，热冲击源对样品进行短暂而适当的热冲击，使样品因自身材料的导热系数的不同而产生温度差，然后阵列式红外相机对样品表面(例如截面侧视方向)进行红外图像的连续采集，通过红外探测器输入到计算机内对样品的翘曲缺陷进行分析监测。红外成像及投影云纹的数据均通过数据线输入到数据存储装置，再由其输出至数据分析装置和图像显示装置中，实现翘曲缺陷的可视化在线监测。通过这整套红外成像及投影云纹系统，达到对大面积封装模块的翘曲变形及缺陷在线监测的目的。Taking the online monitoring device for warpage deformation and defects of the packaged module provided in
本发明实施例提供的一种封装模块翘曲变形及缺陷的在线监测方法和装置至少包括如下技术效果：An online monitoring method and device for warping deformation and defects of a packaged module provided by the embodiments of the present invention include at least the following technical effects:
本发明可对工业生产中的电子器件的翘曲缺陷进行在线监测，提高翘曲缺陷监测的时效性，及时发现不合格的失效器件，为产品生产的工艺流程的质量提升提供有效的动态参考，从而提高电子器件的良品率，降低生产成本。The invention can monitor the warpage defects of electronic devices in industrial production on-line, improve the timeliness of warpage defect monitoring, discover unqualified failed devices in time, and provide an effective dynamic reference for the quality improvement of the product production process. Thereby, the yield of electronic devices is improved and the production cost is reduced.
最后所应说明的是，以上具体实施方式仅用以说明本发明的技术方案而非限制，尽管参照实例对本发明进行了详细说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的精神和范围，其均应涵盖在本发明的权利要求范围当中。Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to examples, those of ordinary skill in the art should understand that the technical solutions of the present invention can be Modifications or equivalent substitutions without departing from the spirit and scope of the technical solutions of the present invention should be included in the scope of the claims of the present invention.
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