CN110519953A - Electronic equipment and its cover board - Google Patents

Abstract

The cover board of present invention offer a kind of electronic equipment, for being covered on electronic equipment ontology, the cover board includes cover board body and antenna structure, the cover board body includes upper cover plate and the lower cover plate that is oppositely arranged with the upper cover plate, the lower cover plate is close to the electronic equipment ontology, the upper cover plate is far from the electronic equipment ontology, the antenna structure is set between the upper cover plate and the lower cover plate, or the antenna structure is set in the upper cover plate or the antenna structure is set in the lower cover plate.Antenna structure is arranged in cover board, and then avoids antenna structure that from occupying the inside useful space of electronic equipment, solve the inside useful space that electronic equipment is occupied due to antenna structure it is too big and the technical issues of cause electronic equipment to be unsatisfactory for Structural Design Requirement.The structure of cover board will be introduced as follows.

Description

Electronic equipment and its cover board

Technical field

The present invention relates to technical field of electronic equipment, in particular to a kind of electronic equipment and its cover board.

Background technique

Currently, the antenna of electronic product is designed based on flexible circuit board.As comprehensive screen accounting is higher and higher,The arrival of 5G is more and more to the position of antenna and the requirement of area, and existing electronic equipment occupies electronic equipment due to antenna structureThe inside useful space it is too big and electronic equipment is made to be unsatisfactory for Structural Design Requirement.

Summary of the invention

The purpose of the present invention is to provide the cover board of a kind of electronic equipment and electronic equipments, to solve electronic equipment due to dayThe inside useful space technology that is too big and making electronic equipment be unsatisfactory for Structural Design Requirement that cable architecture occupies electronic equipment is askedTopic.

The present invention provides the cover board of a kind of electronic equipment, and for being covered on electronic equipment ontology, the cover board includes lidPlate ontology and antenna structure, the cover board body includes upper cover plate and the lower cover plate that is oppositely arranged with the upper cover plate, describedLower cover plate is set to institute far from the electronic equipment ontology, the antenna structure close to the electronic equipment ontology, the upper cover plateIt states between upper cover plate and the lower cover plate or the antenna structure is set in the upper cover plate or the antenna structure is set to instituteIt states in lower cover plate.Antenna structure is arranged in cover board, and then avoids antenna structure that from occupying the inside useful space of electronic equipment,It solves since the inside useful space that antenna structure occupies electronic equipment causes electronic equipment to be unsatisfactory for structure design very much greatlyIt is required that the technical issues of.The structure of cover board will be introduced as follows.

Wherein, the upper cover plate is equipped with groove close to the surface of the lower cover plate, and the groove is that connection is latticed, describedAntenna structure be it is latticed, the antenna structure be set to the groove in.Antenna structure is set to this in the groove of upper cover plateMode eliminates the thickness that antenna structure occupies upper cover plate, and electronic equipment is more compact, convenient for lightening.

Wherein, the lower cover plate is equipped with groove close to the surface of the upper cover plate, and the groove is that connection is latticed, describedAntenna structure be it is latticed, the antenna structure be set to the groove in.Antenna structure is set to this in the groove of lower cover plateMode eliminates the thickness that antenna structure occupies lower cover plate, and electronic equipment is more compact, convenient for lightening.

Wherein, the cover board further includes glue-line, and the glue-line is laminated between the upper cover plate and the lower cover plate, describedAntenna structure is set on the glue-line.Upper cover plate and the fixed bonding of lower cover plate are improved the steady of electronic equipment by the setting of glue-lineIt is qualitative, and glue-line is for accommodating antenna structure.

Wherein, the glue-line is equipped with groove close to the surface of the upper cover plate, and the groove is to be connected to latticed, the dayCable architecture be it is latticed, the antenna structure be set to the groove in.Antenna structure is set to this mode in the groove of glue-lineThe thickness that antenna structure occupies glue-line is eliminated, electronic equipment is more compact, convenient for lightening.

Wherein, the glue-line is equipped with groove close to the surface of the lower cover plate, and the groove is to be connected to latticed, the dayCable architecture be it is latticed, the antenna structure be set to the groove in.Antenna structure is set to this mode in the groove of glue-lineThe thickness that antenna structure occupies glue-line is eliminated, electronic equipment is more compact, convenient for lightening.

Wherein, the cover board further includes decorating film, and the decorating film is set to the lower cover plate close to electronic equipment ontologySide；Or, the decorating film is set to side of the upper cover plate far from electronic equipment ontology；Or, the decorating film is set to upper coverBetween plate and lower cover plate.

Wherein, the cover board further includes decorating film, and the decorating film is set between the upper cover plate and the glue-line；Or,The decorating film is set between the lower cover plate and the glue-line；Or, the decorating film is set to lower cover plate close to electronic equipment sheetThe side of body；Or, the decorating film is set to side of the upper cover plate far from electronic equipment ontology.The different location of decorating film is fullFoot more appearance demands of user, the user experience is improved.

Wherein, the decorating film includes the decoration glue-line, NCVM film plating layer and ink layer being cascading, the dressAdoring glue-line includes texture structure, and the decorating film is fixed on the cover board body by the decoration glue-line.

Wherein, the decorating film further includes substrate layer and optical adhesive layer, the optical adhesive layer, the substrate layer, the dressDecorations glue-line, the NCVM film plating layer and the ink layer are cascading, and the optical adhesive layer pastes the substrate layerOnto the cover board body.Decoration glue-line realizes the grain effect of decorating film, and NCVM film plating layer realizes the color of decorating filmEffect, ink layer are used to block the device of the non-display area of electronic equipment.

Wherein, the antenna structure is close close to the lower cover plate surface or the lower cover plate to be formed in the upper cover plateThe conductive film on the surface of the upper cover plate.The structure of the antenna structure of this kind of mode is simple, easy to manufacture.

Wherein, the antenna structure is the side by being directly coated with, being deposited, sputtering or being electroplated layer of transparent conductive materialMethod is formed in the conductive film on the surface of the upper cover plate or lower cover plate.The manufacture of this kind of antenna structure is relatively simple, efficiencyIt is higher.

The present invention provides a kind of electronic equipment, and including electronic equipment ontology and above-mentioned cover board, the cover plate lid is closedOn the electronic equipment ontology.Electronic equipment includes above-mentioned cover board, and antenna structure is arranged in cover board, avoids antenna structure meetingThe inside useful space for occupying electronic equipment, solve the inside useful space that electronic equipment is occupied due to antenna structure it is too big andThe technical issues of causing electronic equipment to be unsatisfactory for Structural Design Requirement.The structure of cover board will be introduced as follows.

In conclusion the present invention and then avoids antenna structure that from occupying electronics by being arranged antenna stack inside cover boardThe inside useful space of equipment is solved since the inside useful space that antenna structure occupies electronic equipment leads to electronics greatly very muchEquipment is unsatisfactory for the technical issues of Structural Design Requirement.

Detailed description of the invention

In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show belowThere is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only thisSome embodiments of invention for those of ordinary skill in the art without creative efforts, can be withIt obtains other drawings based on these drawings.

Fig. 1 is the first structural schematic diagram of the first cover board provided by the invention.

Fig. 2 is second of structural schematic diagram of the first cover board provided by the invention.

Fig. 3 is the third structural schematic diagram of the first cover board provided by the invention.

Fig. 4 a is the 4th kind of structural schematic diagram of the first cover board provided by the invention.

Fig. 4 b is the 5th kind of structural schematic diagram of the first cover board provided by the invention.

Fig. 5 is the 6th kind of structural schematic diagram of the first cover board provided by the invention.

Fig. 6 a is the 7th kind of structural schematic diagram of the first cover board provided by the invention.

Fig. 6 b is the 8th kind of structural schematic diagram of the first cover board provided by the invention.

Fig. 6 c is the 9th kind of structural schematic diagram of the first cover board provided by the invention.

Fig. 7 is the structural schematic diagram of decorating film provided by the invention.

Fig. 8 a is a kind of structural schematic diagram of stratiform antenna structure provided by the invention.

Fig. 8 b is another structural schematic diagram of stratiform antenna structure provided by the invention.

Fig. 8 c is the structural schematic diagram of groove.

Fig. 9 a is the first structural schematic diagram of latticed antenna structure provided by the invention.

Fig. 9 b is the first structural schematic diagram of latticed antenna structure provided by the invention.

Fig. 9 c is the first structural schematic diagram of latticed antenna structure provided by the invention.

Figure 10 is the first structural schematic diagram of the grid cell of latticed antenna structure provided by the invention.

Figure 11 is second of structural schematic diagram of the grid cell of latticed antenna structure provided by the invention.

Figure 12 a is the structural schematic diagram that latticed antenna structure provided by the invention is paved with cover board body.

Figure 12 b is the structural schematic diagram that latticed antenna structure portion provided by the invention is paved with cover board body.

Figure 13 is the first structural schematic diagram of second of glass cover-plate provided by the invention.

Figure 14 is second of structural schematic diagram of second of glass cover-plate provided by the invention.

Figure 15 is the third structural schematic diagram of second of glass cover-plate provided by the invention.

Figure 16 is the 4th kind of structural schematic diagram of second of glass cover-plate provided by the invention.

Figure 17 is the 5th kind of structural schematic diagram of second of glass cover-plate provided by the invention.

Figure 18 is the 6th kind of structural schematic diagram of second of glass cover-plate provided by the invention.

Figure 19 is the 7th kind of structural schematic diagram of second of glass cover-plate provided by the invention.

Figure 20 is the 8th kind of structural schematic diagram of second of glass cover-plate provided by the invention.

Figure 21 a is the 9th kind of structural schematic diagram of second of glass cover-plate provided by the invention.

Figure 21 b is the tenth kind of structural schematic diagram of second of glass cover-plate provided by the invention.

Figure 22 is the first structural schematic diagram of the third glass cover-plate provided by the invention.

Figure 23 is second of structural schematic diagram of the third glass cover-plate provided by the invention.

Figure 24 is the third structural schematic diagram of the third glass cover-plate provided by the invention.

Figure 25 is the 4th kind of structural schematic diagram of the third glass cover-plate provided by the invention.

Figure 26 is the 5th kind of structural schematic diagram of the third glass cover-plate provided by the invention.

Figure 27 is the 6th kind of structural schematic diagram of the third glass cover-plate provided by the invention.

Specific embodiment

Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, completeSite preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based onEmbodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every otherEmbodiment shall fall within the protection scope of the present invention.

The present invention provides a kind of electronic equipment, including electronic equipment ontology 10 and the cover board on electronic equipment ontology 1020.Cover board 20 includes but is not limited to following three kinds of structures.It will be described in detail cover board as follows.

Fig. 1-Fig. 3 is please referred to, cover board 20 includes cover board body 201 and antenna structure 202.That is, antenna structure 202 is set toThe inside of cover board 20.The material of antenna structure 202 is alloy, the silver nanoparticle of nano-Ag particles, tin indium oxide, tin indium oxide and silverLine, carbon nanotube are one such.The material of cover board body 201 is acrylic polycarbonate (PC), polymethyl methacrylate(PMMA), one of PMMA and PC compound material, glass or PET material or a variety of.The shape of antenna structure 202 includes twoKind: one kind is stratiform, and one kind is metal mesh trellis.The antenna structure 202 of stratiform and metal mesh trellis may be incorporated for as logicalIflytech's line.The formation process of antenna structure 202 will be described hereinafter.

In the present invention, by being arranged antenna structure 202 in cover board 20, and then avoid antenna structure 202 that from occupying electricityThe inside useful space of sub- equipment is solved since the inside useful space that antenna structure 202 occupies electronic equipment is led greatly very muchThe technical issues of causing electronic equipment to be unsatisfactory for Structural Design Requirement.The structure of cover board 20 will be introduced as follows.

The first structure of cover board 20 is as follows:

The antenna structure 202 is set to side of the cover board body 201 far from the electronic equipment ontology 10.This kind of sidePositional relationship and including but not limited to following three kind submode of the antenna structure 202 with cover board body 201 under formula.

Submode one:

Referring to Fig. 1, the cover board body 201 is equipped with groove 201a far from the surface of the electronic equipment ontology 10, it is recessedSlot 201a is that connection is latticed, and 202 material of antenna structure is formed in groove 201a, so that antenna structure 202 be made to be formed as netTrellis.Groove 201a is formed by the production of the methods of laser ablation or chemical etching.Latticed antenna structure 202 byFilling conductive material is formed in latticed groove 201a.That is, groove 201a is formed in the separate electricity of cover board body 201The side of sub- apparatus body 10, the antenna structure 202 being formed in groove 201a are also formed in the separate electronics of cover board body 201The side of apparatus body 10.

Submode two:

Referring to Fig. 2, the cover board 20 further includes glue-line 203, it is separate that the glue-line 203 is set to the cover board body 201The side of the electronic equipment ontology 10.In the present embodiment, which is UV glue.The glue-line 203 is close to the cover boardThe surface of ontology 201 is equipped with groove 201a, and the groove 201a is that connection is latticed, and 202 material of antenna structure is formed in grooveIn 201a, so that antenna structure 202 be made to be formed as latticed.Groove 201a is made on glue-line 203 by the methods of nano impressionIt is formed.Latticed antenna structure 202 is formed by filling conductive material in latticed groove 201a.Groove 201a shapeAt the side of the close cover board body 201 in glue-line 203, the antenna structure 202 being formed in groove 201a is also formed in glue-lineThe side of 203 close cover board body 201.

Submode three:

Referring to Fig. 3, the glue-line 203 is equipped with groove 201a, the groove far from the surface of the cover board body 201201a is that connection is latticed, and 202 material of antenna structure is formed in groove 201a, so that antenna structure 202 be made to be formed as gridShape.Groove 201a is made on glue-line 203 by the methods of nano impression and is formed.Latticed antenna structure 202 is by netFilling conductive material is formed in the groove 201a of trellis.Groove 201a is formed in the one of the separate cover board body 201 of glue-line 203Side, the antenna structure 202 being formed in groove 201a are also formed in the side of the separate cover board body 201 of glue-line 203.

In the present embodiment, latticed antenna structure 202 by latticed groove 201a fill nano-Ag particles,Tin indium oxide, the alloy of tin indium oxide and silver, silver nanowires, carbon nanotube are one such to be formed.

The surface of antenna structure 202 is covered with anti-fingerprint (Anti-fingerprint, AF) layer, scratch resistant cured film (HardCoating, HC) layer, diamond-film-like (Diamond-Like Coating, DLC) layer, one of silicon nitride layer or in whichIt is several.

Cover board 20 further includes decorating film 204, and the decorating film 204 is laminated on the cover board body 201.Decorating film 204With the stratification position of cover board body 201 and glue-line 203 there are several types of.

Fig. 4 a is please referred to, the first: the decorating film 204 is set to the cover board body 201 close to the electronic equipment sheetOn the surface of body 10, decorating film 204 is set between cover board body 201 and electronic equipment ontology 10.

Fig. 4 b is please referred to, second: the decorating film 204 is set to the cover board body 201 far from the electronic equipment sheetOn the surface of body 10, cover board body 201 is set between decorating film 204 and electronic equipment ontology 10.

Referring to Fig. 5, the third: the decorating film 204 is set to the cover board body 201 far from the electronic equipment ontology10 side, the decorating film 204 are set between the glue-line 203 and the cover board body 201.

Fig. 6 a is please referred to, the 4th kind: the decorating film 204 is set to the cover board body 201 far from the electronic equipment sheetThe side of body 10, the glue-line 203 are set between the cover board body 201 and the decorating film 204.

It please refers to shown in Fig. 6 b, the decorating film 204 is set between the cover board body 201 and the glue-line 203.

Fig. 6 c is please referred to, the decorating film 204 is set to cover board body 201 close to the side of electronic equipment ontology 10.

The different location of above-mentioned decorating film 204 meets more appearance demands of user, and the user experience is improved.

Referring to Fig. 7, the decorating film 204 includes decoration glue-line 2041 and NCVM (discontinuous coating technique) film plating layer2042, decoration glue-line 2041 includes texture structure, and the texture structure is formed in 2041 table of decoration glue-line by imprint processOn face.The decoration glue-line 2041 is also UV glue.

Decorating film 204 further includes INK ink layer 2043；The lamination order of the film layer of decorating film 204 is followed successively by decoration glue-line2041, NCVM film plating layer 2042, INK ink layer 2043.

Decorating film 204 further includes substrate layer 2045 and optical adhesive layer (OCA) 2046, the layer of the film layer of the decorating film 204Folded sequence is followed successively by optical adhesive layer (OCA) 2046, substrate layer 2045, decoration glue-line 2041, NCVM film plating layer 2042, INK inkLayer 2043.204 layers of the decorating film are pasted substrate layer 2045 on cover board body 201 by OCA glue 2046.

The generation type of antenna structure 202 is introduced as follows.About antenna structure 202 generation type there are two types of.

Mode one: Fig. 8 a- Fig. 8 b is please referred to, physical deposition can be used in antenna structure 202 or the method for chemical deposition carrys out shapeAt.After making antenna structure 202,202 entirety of antenna structure is attached on the surface of cover board body 201, can be fitted inCover board body 201 is close to the surface (Fig. 8 a) of electronic equipment ontology 10, or is fitted in cover board body 201 far from electronic equipment sheetThe surface (Fig. 8 b) of body 10.Antenna structure 202 can be paved with the surface of cover board body 201, or part is paved with cover board body 201Surface.Specific production method are as follows: by being directly coated with, being deposited, sputtering or being electroplated layer of transparent conductive material (such as oxygenChange alloy, silver nanowires, the carbon nanotube etc. of indium tin, tin indium oxide and silver), form one layer of whole face transparent conductive antenna structure202.In this way, the antenna structure 202 made is placed directly against to the surface of cover board body 201, and while saving space, antennaThe manufacture of structure 202 is relatively simple, more efficient.

Mode two: please referring to Fig. 8 c, and antenna structure 202 can be by nano impression, laser-induced thermal etching or chemical etchingConductive material is filled in groove 201a, to form one layer of latticed antenna structure 202.According to the design needs, groove 201a isMicro/nano level.Antenna structure 202 is latticed.Specifically, can be formed on cover board 20 by laser ablation or chemical etching recessedSlot 201a fills conductive material in groove 201a, forms latticed antenna structure 202.When forming groove on glue-line 203When 201a, glue-line 203 can be formed by way of coating, groove 201a is then formed using nanometer embossing, to glue-line 203After solidification, conductive material is filled into groove 201a, then does Darkening process, to form antenna structure 202.Conductive material is preferredConductive metallic material.Alternatively, can (include all conductive metals and synthesis by vapor deposition, sputtering or plating layer of conductive materialMetal), a kind of latticed conductive antenna structure 202 is obtained by techniques such as etching, development, laser direct-writings.

When forming groove 201a, the pattern of the pattern and antenna structure 202 of groove 201a matches.A kind of specificIt realizes in waterproof, the pattern of groove 201a is interconnected trellis groove body, so that accommodating enters the conduction in groove 201aThe antenna structure 202 that material is formed is latticed, and can preferably be matched with groove 201a.The shape of trellis groove body can beRectangular, bottom edge is that trapezoidal, the upper bottom rectangular, that bottom is longer than upper bottom of arc is not advised such as than long trapezoidal or other shapes of going to the bottomThen shape.

Fig. 9 a to Fig. 9 c is please referred to, in some embodiments, antenna structure 202 can be formed by latticed conductor wire.Antenna structure 202 includes multiple grid cells.Grid cell can be square, diamond shape or regular hexagon or other shapes if notRegular shape.Grid cell, which is square, refers to that each grid cell of antenna structure 202 is square.Grid cell isDiamond shape or regular hexagon have similar meaning.And grid cell refers to for irregular shape, constitutes the grid of antenna structure 202Unit may include square, diamond shape, regular hexagon, rectangle and other it is randomly shaped in two or more groupIt closes.It is appreciated that antenna structure 202 is grid-shaped can to keep the translucency with higher of antenna structure 202.

In some embodiments, the integrally formed antenna structure 202 of multiple grid cells can for bar shaped, it is I-shaped or" C " font.In the application, the concrete shape of antenna structure 202 it is not limited here, can also in addition to above-mentioned shape otherShape is determined with specific actual conditions.

In some embodiments, grid cell is formed by curing by the conductive material being filled in groove 201a.Conduction materialMaterial can be metal material or tin indium oxide (ITO).Preferably, conductive material is metal material, and metal material is selected from gold((Au), silver (Ag), copper (Cu), nickel (Ni), molybdenum (one of (Mo), aluminium (Al) and zinc (Zn) or by gold (Au), silver (Ag), copper(Cu), nickel (Ni), molybdenum ((Mo), aluminium (at least two alloys formed in (Al) and zinc (Zn).

Relative to expensive tin indium oxide oxide (ITO), gold (Au), silver (Ag), copper (Cu), nickel (Ni), molybdenum (Mo), aluminium(price of (Al) and zinc (Zn) is lower, advantageously reduces the price of decorating film 204, and the electric conductivity energy of these types of metalIt is enough to meet conductive requirement.Also, the phenomenon that metal wire has preferable toughness, is not susceptible to cracking, so that antenna structure 202Electric conductivity it is relatively stable.

Referring to Fig. 10, in some embodiments, the line width d1 of grid can be 0.5um-35um.It is appreciated that dayThe translucency of cable architecture 202 and the line width of grid are related, and the line width of grid is smaller, and the translucency of cover board 20 is better.It is appreciated thatIf cover board 20 does not require translucency, specific grid line width is set in order to manufacture the size of antenna.

In some embodiments, grid spacing d2 can be 20um-500um.Grid spacing can according to translucency,Electric conductivity and cost etc. are configured.

Figure 11 is please referred to, in certain embodiments, the aperture d3 of grid can be 20um-500um.It is appreciated that gridAperture d3 be configured according to translucency, electric conductivity and cost etc..The aperture d3 of grid includes two groups between angular vertexDistance.

In certain embodiments, grid lines depth 0.5um-20um.It should be understood that grid lines depth is the thickness of grid cellDegree, grid lines is deep associated with the depth of groove 201a, and grid lines deeply can according to translucency, electric conductivity and cost etc. intoRow setting.

In some embodiments, the resistivity of the conductive material of antenna structure 202 is lower, the square of antenna structure 202Resistance can be less than or equal to 10 Ω/sq.In this way, advantageously ensuring that the electric conductivity of antenna structure 202, be conducive to signal transmission.

Figure 12 a- Figure 12 b is please referred to, antenna structure 202 is whole face structure or part is designed on demand.In actual fabricationIn, can need to design antenna structure 202 according to the design of antenna structure 202 is whole face structure or part-structure.

Second of structure of cover board 20 is as follows:

Unlike the first cover board 20: cover board body 201 includes upper cover plate 2011 and lower cover plate 2012, upper cover plate2011 are set to the upper cover plate close to electronic equipment ontology 10, antenna structure 202 far from electronic equipment ontology 10, lower cover plate 2012Between 2011 and lower cover plate 2012 or antenna structure 202 is set in upper cover plate 2011 or antenna structure 202 is set to lower cover plateIn 2012.The shape of antenna structure 202 has been described above with formation process, and details are not described herein.

The material of upper cover plate 2011 and lower cover plate 2012 includes but is not limited to acrylic polycarbonate (PC), polymethylSour methyl esters (PMMA), PMMA and compound material, glass or the PET material of PC.In a kind of embodiment wherein, upper cover plate 2011Material can be acrylic polymethyl methacrylate (PMMA) material, the material of lower cover plate 2012 be acrylic polycarbonate(PC) material.

The positional relationship of antenna structure 202 and the upper cover plate 2011 and lower cover plate 2012 includes but is not limited to following 4Kind submode.

Submode one:

Figure 13 is please referred to, the upper cover plate 2011 is equipped with groove 201a close to the surface of the lower cover plate 2012, described recessedSlot 201a is that connection is latticed, and 202 material of antenna structure is formed in groove 201a, so that antenna structure 202 be made to be formed as netTrellis.Groove 201a is formed by the production of the methods of laser ablation or chemical etching.Latticed antenna structure 202 byFilling conductive material is formed in latticed groove 201a.That is, groove 201a is formed in upper cover plate 2011 close to describedThe surface of lower cover plate 2012, the antenna structure 202 being formed in groove 201a are also formed in upper cover plate 2011 close to the lower coverThe surface of plate 2012.

Submode two:

Figure 14 is please referred to, the lower cover plate 2012 is equipped with groove 201a close to the surface of the upper cover plate 2011, described recessedSlot 201a is that connection is latticed, and 202 material of antenna structure is formed in groove 201a, so that antenna structure 202 be made to be formed as netTrellis.Groove 201a is formed by the production of the methods of laser ablation or chemical etching.Latticed antenna structure 202 byConductive material is filled in latticed groove 201a to be formed.That is, groove 201a is formed in lower cover plate 2012 close to instituteThe surface for stating upper cover plate 2011, the antenna structure 202 being formed in groove 201a are also formed in lower cover plate 2012 on describedThe surface of cover board 2011.

Submode three:

Please refer to Figure 15, the cover board 20 further includes glue-line 203, the glue-line 203 be laminated in the upper cover plate 2011 withBetween the lower cover plate 2012, the antenna structure 202 is set on the glue-line 203.In the present embodiment, which isUV glue.The glue-line 203 is equipped with groove 201a close to the surface of the upper cover plate 2011, and the groove 201a is connection gridShape, 202 material of antenna structure is formed in groove 201a, so that antenna structure 202 be made to be formed as latticed.Groove 201a passes throughThe methods of nano impression makes formation on glue-line 203.Latticed antenna structure 202 passes through in latticed groove 201aInterior filling conductive material is formed.Groove 201a is formed in the side of the close upper cover plate 2011 of glue-line 203, is formed in groove 201aInterior antenna structure 202 is also formed in the side of the close upper cover plate 2011 of glue-line 203.

Submode four:

Figure 16 is please referred to, the glue-line 203 is equipped with groove 201a, the groove close to the surface of the lower cover plate 2012201a is that connection is latticed, and 202 material of antenna structure is formed in groove 201a, so that antenna structure 202 be made to be formed as gridShape.Groove 201a is made on glue-line 203 by the methods of nano impression and is formed.Latticed antenna structure 202 byFilling is electrically conductive forming in latticed groove 201a.Groove 201a is formed in the side of the close lower cover plate 2012 of glue-line 203, shapeThe side of the close lower cover plate 2012 of glue-line 203 is also formed at the antenna structure 202 in groove 201a.

In the present embodiment, latticed antenna structure 202 by latticed groove 201a fill nano-Ag particles,Tin indium oxide, the alloy of tin indium oxide and silver, silver nanowires, carbon nanotube are one such to be formed.

The surface of antenna structure 202 is covered with anti-fingerprint (Anti-fingerprint, AF) layer, scratch resistant cured film (HardCoating, HC) layer, diamond-film-like (Diamond-Like Coating, DLC) layer, one of silicon nitride layer or in whichIt is several.

Cover board 20 further includes decorating film 204, and the decorating film 204 is laminated on the cover board body 201.Decorating film 204With the stratification position of upper cover plate 2011, lower cover plate 2012 and glue-line 203 there are several types of.

Figure 17 is please referred to, the first: the decorating film 204 is set between the upper cover plate 2011 and the glue-line 203.

Figure 18 is please referred to, second: the decorating film 204 is set between the lower cover plate 2012 and the glue-line 203.

Figure 19 is please referred to, the third: decorating film 204 is set to side of the upper cover plate 2011 far from lower cover plate 2012.

Figure 20 is please referred to, the 4th kind: decorating film 204 is set to side of the lower cover plate 2012 far from upper cover plate 2011.

When not having glue-line 203, decorating film 204 and the positional relationship of upper cover plate 2011, lower cover plate 2012 are as follows.

Figure 21 a is please referred to, the 5th kind: decorating film 204 is set to side of the upper cover plate 2011 far from lower cover plate 2012.

Figure 21 b is please referred to, the 6th kind: decorating film 204 is set to side of the lower cover plate 2012 far from upper cover plate 2011.

7th kind: decorating film 204 is set between lower cover plate 2012 and upper cover plate 2011.

The structure of decorating film 204 is identical as the structure of decorating film 204 of the first covering plate structure, and details are not described herein.

The different location of above-mentioned decorating film 204 meets more appearance demands of user, and the user experience is improved.

The third structure of cover board 20 is as follows:

The antenna structure 202 is set to the cover board body 201 close to the side of the electronic equipment ontology 10.Its knotThe shape of structure 202 has been described above with formation process, and details are not described herein.Antenna structure 202 under this kind of modePositional relationship and including but not limited to following three kinds of submodes with cover board body 201.

Submode one:

Figure 22 is please referred to, the cover board body 201 is equipped with groove 201a, institute close to the surface of the electronic equipment ontology 10It is latticed to be connected to state groove 201a, and 202 material of antenna structure is formed in groove 201a, to make the formation of antenna structure 202It is latticed.Groove 201a is formed by the production of the methods of laser ablation or chemical etching.Latticed antenna structure 202 is logicalThe filling conductive material in latticed groove 201a is crossed to be formed.That is, groove 201a is formed in leaning on for cover board body 201The side of nearly electronic equipment ontology 10, the antenna structure 202 being formed in groove 201a are also formed in the close of cover board body 201The side of electronic equipment ontology 10.

Submode two:

Figure 23 is please referred to, the cover board further includes glue-line 203, and the glue-line 203 is set to the cover board body 201 close to instituteState the side of electronic equipment ontology 10.The glue-line 203 is UV glue.The glue-line 203 is set close to the surface of the cover board body 201Fluted 201a, the groove 201a are that connection is latticed, and 202 material of antenna structure is formed in groove 201a, to make dayCable architecture 202 is formed as latticed.Groove 201a is made on glue-line 203 by the methods of nano impression and is formed.It is latticedAntenna structure 202 is formed by filling conductive material in latticed groove 201a.Groove 201a is formed in leaning on for glue-line 203The side of nearly cover board body 201, the antenna structure 202 being formed in groove 201a are also formed in the close cover board sheet of glue-line 203The side of body 201.

Submode three:

Figure 24 is please referred to, the glue-line 203 is equipped with groove 201a, the groove far from the surface of the cover board body 201201a is that connection is latticed, and 202 material of antenna structure is formed in groove 201a, so that antenna structure 202 be made to be formed as gridShape.Groove 201a is made on glue-line 203 by the methods of nano impression and is formed.Latticed antenna structure 202 byFilling conductive material is formed in latticed groove 201a.Groove 201a is formed in the one of the separate cover board body 201 of glue-line 203Side, the antenna structure 202 being formed in groove 201a are also formed in the side of the close cover board body 201 of glue-line 203.

In the present embodiment, latticed antenna structure 202 by latticed groove 201a fill nano-Ag particles,Tin indium oxide, the alloy of tin indium oxide and silver, silver nanowires, carbon nanotube are one such to be formed.

The surface of antenna structure 202 is covered with anti-fingerprint (Anti-fingerprint, AF) layer, scratch resistant cured film (HardCoating, HC) layer, diamond-film-like (Diamond-Like Coating, DLC) layer, one of silicon nitride layer or in whichIt is several.

Cover board 20 further includes decorating film 204.Decorating film 204 and the stratification position of cover board body 201 and glue-line 203 haveIt is following several.

Figure 25 is please referred to, the first: the decorating film 204 is set to the cover board body 201 far from the electronic equipment sheetOn the surface of body 10.

Figure 26 is please referred to, second: the decorating film 204 is set to the cover board body 201 close to the electronic equipment sheetThe side of body 10, the decorating film 204 are set between the cover board body 201 and the glue-line 203.

Figure 27 is please referred to, the third: the decorating film 204 is set to the cover board body 201 close to the electronic equipment sheetThe side of body 10, the glue-line 203 are set between the cover board body 201 and the decorating film 204.

The structure phase of the structure of decorating film 204 and the first covering plate structure and the decorating film 204 of second of covering plate structureTogether, details are not described herein.

Decorating film 204 will be introduced as follows.Decorating film 204 includes antenna structure 202.Decorating film 204 is decoration aboveFilm 204.Antenna structure 202 is identical as antenna structure 202 above.Antenna structure 202 is set to substrate layer 2045 and decorating glueBetween layer 2041；Alternatively, antenna structure 202 is set between NCVM film plating layer 2042 and decoration glue-line 2041；Alternatively, antenna structure202 are set between NCVM film plating layer 2042 and ink layer 2043.

Decorating film 204 can also include glue-line 203, and antenna structure 202 is installed on glue-line 203.Day is set on glue-line 203The mode of cable architecture 202 with it is above identical, groove 201a, antenna structure 202 can be set on two surfaces of glue-line 203In groove 201a, details are not described herein.Glue-line 203 can be set between substrate layer 2045 and decoration glue-line 2041, orPerson is set between NCVM film plating layer 2042 and decoration glue-line 2041, or be set to NCVM film plating layer 2042 and ink layer 2043 itBetween.As for the shape of antenna structure 202, generation type with it is above identical.

In which, by being arranged antenna structure 202 in decorating film 204, antenna structure 202 will not occupy electronics and setThe standby inside useful space is solved since the inside useful space that antenna structure 202 occupies electronic equipment leads to electricity greatly very muchThe technical issues of sub- product is unsatisfactory for Structural Design Requirement.

And when the decorating film of the application 204 is applied and is covered after, 202 (metal grill of transparent antenna structure of the inventionAntenna, transparent metal antenna, transparent antenna) it is integrated in decorating film 204, there is collection high transparency, Low ESR, antenna to placePosition is optional to wait the advantages of being integrally designed.

Decorating film 204 can be attached on the display surface of display screen, if ink layer 2043 is opaque, ink layer 2043 and dayCable architecture 202 may be provided at the non-display area of electronic device, and decorating film 204 has transparent display window (not shown), inkLayer 2043 and antenna structure 202 are located at the side of display window.The display surface of display screen is correspondingly arranged with display window.Display screenIt can be touch display screen.Panel can be transparent panel, such as glass panel or sapphire panel.

In other embodiments, decorating film 204 can be attached on the touch panel of non-display class of electronic device, to protectProtect touch panel.

The above disclosure is only the preferred embodiments of the present invention, cannot limit the right model of the present invention with this certainlyIt encloses, those skilled in the art can understand all or part of the processes for realizing the above embodiment, and wants according to right of the present inventionMade equivalent variations is sought, is still belonged to the scope covered by the invention.

Claims (13)

1. the cover board of a kind of electronic equipment, for being covered on electronic equipment ontology, which is characterized in that the cover board includes cover boardOntology and antenna structure, the cover board body includes upper cover plate and the lower cover plate that is oppositely arranged with the upper cover plate, under describedCover board is set to described close to the electronic equipment ontology, the upper cover plate far from the electronic equipment ontology, the antenna structureBetween upper cover plate and the lower cover plate or the antenna structure is set in the upper cover plate or the antenna structure is set on describedIn lower cover plate.

2. cover board according to claim 1, which is characterized in that the upper cover plate is equipped with recessed close to the surface of the lower cover plateSlot, the groove be connected to it is latticed, the antenna structure be it is latticed, the antenna structure be set to the groove in.

3. cover board according to claim 1, which is characterized in that the lower cover plate is equipped with recessed close to the surface of the upper cover plateSlot, the groove be connected to it is latticed, the antenna structure be it is latticed, the antenna structure be set to the groove in.

4. cover board according to claim 1-3, which is characterized in that the cover board further includes glue-line, the glue-lineIt is laminated between the upper cover plate and the lower cover plate, the antenna structure is set on the glue-line.

5. cover board according to claim 4, which is characterized in that the glue-line is equipped with recessed close to the surface of the upper cover plateSlot, the groove be connected to it is latticed, the antenna structure be it is latticed, the antenna structure be set to the groove in.

6. cover board according to claim 4, which is characterized in that the glue-line is equipped with recessed close to the surface of the lower cover plateSlot, the groove be connected to it is latticed, the antenna structure be it is latticed, the antenna structure be set to the groove in.

7. cover board according to claim 1, which is characterized in that the cover board further includes decorating film,

The decorating film is set to the lower cover plate close to the side of electronic equipment ontology；

Or, the decorating film is set to side of the upper cover plate far from electronic equipment ontology；

Or, the decorating film is set between upper cover plate and lower cover plate.

8. cover board according to claim 4, which is characterized in that the cover board further includes decorating film,

The decorating film is set between the upper cover plate and the glue-line；

Or, the decorating film is set between the lower cover plate and the glue-line；

Or, the decorating film is set to lower cover plate close to the side of electronic equipment ontology；

Or, the decorating film is set to side of the upper cover plate far from electronic equipment ontology.

9. cover board according to claim 8, which is characterized in that the decorating film includes the decorating glue being cascadingLayer, NCVM film plating layer and ink layer, the decoration glue-line includes texture structure, and the decoration glue-line consolidates the decorating filmDue on the cover board body.

10. cover board according to claim 9, which is characterized in that the decorating film further includes substrate layer and optical adhesive layer, instituteOptical adhesive layer, the substrate layer, the decoration glue-line, the NCVM film plating layer and the ink layer is stated to be cascading,The optical adhesive layer pastes the substrate layer on the cover board body.

11. cover board according to claim 1, which is characterized in that the antenna structure is close to be formed in the upper cover plateThe conductive film on the surface of the lower cover plate surface or the lower cover plate close to the upper cover plate.

12. cover board according to claim 11, which is characterized in that the antenna structure is by being directly coated with, being deposited, splashThe method for penetrating or being electroplated layer of transparent conductive material is formed in the conductive film on the surface of the upper cover plate or lower cover plate.

13. a kind of electronic equipment, which is characterized in that including electronic equipment ontology and as described in claim any one of 1-12Cover board, the cover plate lid closes on the electronic equipment ontology.