技术领域technical field
本发明涉及存储设备技术领域，特别涉及一种1U通用型模块化高密度储存JBOD设备。The invention relates to the technical field of storage devices, in particular to a 1U universal modular high-density storage JBOD device.
背景技术Background technique
随着中国电子技术的发展，越来越多的电子设备已得到广泛使用。With the development of electronic technology in China, more and more electronic devices have been widely used.
服务器是电子设备中的重要组成部分，是提供计算服务的设备。由于服务器需要响应服务请求，并进行处理，因此一般来说服务器应具备承担服务并且保障服务的能力。根据服务器提供的服务类型不同，分为文件服务器，数据库服务器，应用程序服务器，WEB服务器等。服务器的主要构成包括处理器、硬盘、内存、系统总线等，和通用的计算机架构类似，但是由于需要提供高可靠的服务，因此在处理能力、稳定性、可靠性、安全性、可扩展性、可管理性等方面要求较高。The server is an important part of electronic equipment and is a device that provides computing services. Since the server needs to respond to the service request and process it, generally the server should have the ability to undertake and guarantee the service. According to the different types of services provided by the server, it is divided into file server, database server, application server, WEB server, etc. The main components of the server include processors, hard disks, memory, system buses, etc., which are similar to general computer architectures, but due to the need to provide highly reliable services, the processing power, stability, reliability, security, scalability, Manageability and other aspects have higher requirements.
在大数据时代，大量的IT设备会集中放置在数据中心。这些数据中心包含各类型的服务器、存储、交换机及大量的机柜及其它基础设施。每种IT设备都是有各种硬件板卡组成，如计算模块、存储模块、机箱、风扇模块等等。而随着信息社会的发展，信息量呈现几何倍数增长，数据中心中内服务器及存储设备处理的数据量越来越大，而这些信息数据必然由相应的计算和存储设备来进行处理和保存，同时对这些计算和存储数据的设备维护及维护效率要求越来越高，目前一般使用JBOD(Just a Bunch Of Disks，硬盘簇)设备来实现高密度数据存储。In the era of big data, a large number of IT equipment will be centrally placed in data centers. These data centers contain various types of servers, storage, switches, and numerous racks and other infrastructure. Each type of IT equipment is composed of various hardware boards, such as computing modules, storage modules, chassis, fan modules, and so on. With the development of the information society, the amount of information has increased exponentially, and the amount of data processed by the servers and storage devices in the data center is increasing, and these information data must be processed and stored by the corresponding computing and storage devices. At the same time, the requirements for the maintenance and maintenance efficiency of these devices for computing and storing data are getting higher and higher. Currently, JBOD (Just a Bunch Of Disks, hard disk cluster) devices are generally used to realize high-density data storage.
现有技术中的JBOD设备，一般是将多块硬盘组合成一个逻辑磁盘，然后安装到服务器上，同时将与各块硬盘信号连接的其余部件分别安装到服务器上，实现与服务器的整合安装。然而，服务器上的安装空间狭窄，尤其是1U标准型服务器等，因服务器本身的元器件就繁多，在安装时非常麻烦，且维修、更换不方便。同时，JBOD设备中的某个部件损坏之后，难以进行单独更换和维修，导致设备扩展性能不强，无法满足不同性能的客制化需求。The JBOD equipment in the prior art generally combines multiple hard disks into a logical disk, which is then installed on the server, and at the same time, the other components that are signally connected to the hard disks are installed on the server respectively to realize integrated installation with the server. However, the installation space on the server is narrow, especially the 1U standard server, etc., because the server itself has many components, it is very troublesome to install, and maintenance and replacement are inconvenient. At the same time, after a certain component in the JBOD equipment is damaged, it is difficult to replace and repair it separately, resulting in the poor expansion performance of the equipment and the inability to meet the customization requirements of different performances.
因此，如何提高JBOD设备的拆装易行性，方便部件的维修和更换，实现部件模块化设计和通用性设计，提高设备存储性能和扩展性能，是本领域技术人员所面临的技术问题。Therefore, how to improve the ease of disassembly and assembly of the JBOD equipment, facilitate the maintenance and replacement of components, realize the modular design and universal design of components, and improve the storage performance and expansion performance of the equipment are technical problems faced by those skilled in the art.
发明内容SUMMARY OF THE INVENTION
本发明的目的是提供一种1U通用型模块化高密度储存JBOD设备，能够提高JBOD设备的拆装易行性，方便部件的维修和更换，实现部件模块化设计和通用性设计，提高设备存储性能和扩展性能。The purpose of the present invention is to provide a 1U universal modularized high-density storage JBOD equipment, which can improve the ease of disassembly and assembly of the JBOD equipment, facilitate the maintenance and replacement of components, realize the modular design and universal design of components, and improve the storage of equipment. performance and scalability.
为解决上述技术问题，本发明提供一种1U通用型模块化高密度储存JBOD设备，包括安装壳体、可滑动地插设于所述安装壳体一侧安装空间内并用于存储数据及处理指令的存储控制组件、可滑动地插设于所述安装壳体另一侧安装空间内并用于使所述存储控制组件与外界设备实现数据交互的业务接口组件、可拆卸地安装于所述安装壳体内并用于对所述存储控制组件及所述业务接口组件提供电源的电源组件。In order to solve the above technical problems, the present invention provides a 1U general-purpose modular high-density storage JBOD device, which includes an installation casing, slidably inserted in the installation space on one side of the installation casing, and used for storing data and processing instructions. The storage control assembly, a business interface assembly slidably inserted in the installation space on the other side of the installation shell and used to enable the storage control assembly to realize data interaction with external devices, detachably installed in the installation shell A power supply component inside the body and used to provide power to the storage control component and the service interface component.
优选地，所述安装壳体包括底板、可拆卸地扣合于所述底板表面上的顶板、沿所述底板的长度方向分布于其表面上以将所述安装壳体的内部空间分隔为第一安装空间及第二安装空间的分隔板，且所述第一安装空间用于安装所述存储控制组件，所述第二安装空间用于安装所述业务接口组件及所述电源组件。Preferably, the mounting shell comprises a bottom plate, a top plate detachably fastened to the surface of the bottom plate, distributed on the surface of the bottom plate along the length direction of the bottom plate to divide the inner space of the mounting shell into first A partition plate for an installation space and a second installation space, the first installation space is used for installing the storage control component, and the second installation space is used for installing the service interface component and the power supply component.
优选地，所述底板的两侧边上均设置有用于与机柜内壁可拆卸连接的紧固件；所述底板的表面上还设置有用于收束线缆以防止缠绕的束线链带。Preferably, two sides of the bottom plate are provided with fasteners for detachable connection with the inner wall of the cabinet; and a surface of the bottom plate is also provided with a cable tie for bundling cables to prevent entanglement.
优选地，所述存储控制组件包括可滑动地插设于所述安装壳体中的滑动底板、可拆卸地设置于所述滑动底板表面一端位置处的若干个用于存储数据的硬盘阵列、设置于所述滑动底板表面另一端位置处的若干个用于处理指令的控制器组，且所述控制器组与所述硬盘阵列信号连接。Preferably, the storage control assembly comprises a sliding bottom plate slidably inserted in the installation housing, a plurality of hard disk arrays for storing data detachably arranged at one end of the surface of the sliding bottom plate, and a set of hard disk arrays for storing data. A plurality of controller groups for processing instructions are located at the other end of the surface of the sliding bottom plate, and the controller groups are signally connected to the hard disk array.
优选地，所述存储控制组件还包括设置于所述滑动底板表面上并位于所述硬盘阵列与所述控制器组之间、与所述电源组件及所述业务接口组件信号连接、用于实现信号转接的信号转接板。Preferably, the storage control assembly further comprises a device disposed on the surface of the sliding bottom plate and located between the hard disk array and the controller group, signally connected to the power supply assembly and the service interface assembly, for realizing Signal transfer board for signal transfer.
优选地，所述信号转接板上设置有用于与所述业务接口组件信号连接、用于将其输出信号发送给所述控制器组的第一传输连接器，以及与所述硬盘阵列信号连接、用于将经过所述控制器组处理后的输出数据传输给所述硬盘阵列的第二传输连接器。Preferably, the signal transfer board is provided with a first transmission connector for signal connection with the service interface component, for sending its output signal to the controller group, and for signal connection with the hard disk array and a second transmission connector for transmitting the output data processed by the controller group to the hard disk array.
优选地，所述存储控制组件还包括可拆卸地设置于所述滑动底板表面上并位于所述硬盘阵列与所述信号转接板之间、用于对所述硬盘阵列进行降温冷却的散热器模组。Preferably, the storage control assembly further comprises a radiator detachably disposed on the surface of the sliding bottom plate and between the hard disk array and the signal transfer board, for cooling the hard disk array module.
优选地，所述存储控制组件还包括可拆卸地设置于所述滑动底板的前端面上、用于防护及过滤空气中杂质的通风前面板。Preferably, the storage control assembly further includes a ventilated front panel detachably disposed on the front end surface of the sliding bottom plate for protecting and filtering impurities in the air.
优选地，所述业务接口组件包括可滑动地插设于所述安装壳体中的滑动托盘、设置于所述滑动托盘表面上并用于提供与外界设备物理连接接口的业务接口卡、设置于所述滑动托盘表面上并与所述业务接口卡信号连接的接口转接板、与所述接口转接板的输出端信号连接并用于将外界设备的数据信号发送至所述存储控制组件中的业务转接模块。Preferably, the service interface assembly includes a sliding tray slidably inserted into the installation housing, a service interface card disposed on the surface of the sliding tray and used to provide a physical connection interface with external equipment, and a service interface card disposed on the surface of the sliding tray. An interface adapter board on the surface of the sliding tray and signally connected to the service interface card, signally connected to the output end of the interface adapter board and used to send data signals from external equipment to the service in the storage control assembly transfer module.
优选地，所述滑动托盘的前端面上设置有便于推拉操作的扶手，所述滑动托盘的表面上还设置有用于对所述业务接口卡、所述接口转接板及所述业务转接模块进行散热冷却的散热风扇。Preferably, the front end surface of the sliding tray is provided with a handrail which is convenient for push-pull operation, and the surface of the sliding tray is also provided with an armrest for connecting the service interface card, the interface adapter board and the service adapter module. A cooling fan for cooling.
本发明所提供的1U通用型模块化高密度储存JBOD设备，主要包括安装壳体、存储控制组件、业务接口组件和电源组件。其中，安装壳体主要用于安装和支撑其余零部件。存储控制组件设置在安装壳体的一侧安装空间内，主要用于存储数据及处理指令，并且存储控制组件可在安装壳体内进行滑动安装，以从安装壳体的开口处进行插设安装，方便安装与拆卸操作。业务接口组件设置在安装壳体的另一侧安装空间内，主要用于使存储控制组件与外界设备实现数据交互，并且业务接口组件与存储控制组件一样，也可在安装壳体内进行滑动安装，以从安装壳体的开口处进行插设安装，方便安装与拆卸操作。电源组件安装在安装壳体内，主要用于对存储控制组件和业务接口组件进行供电，并且可在安装壳体内方便地进行拆装操作。如此，本发明所提供的1U通用型模块化高密度储存JBOD设备，通过业务接口组件的作用实现外界设备与存储控制组件的数据交互，如此可以方便地实现数据存储与读写，同时，存储控制组件、业务接口组件和电源组件均能够在安装壳体内方便地进行拆装操作，从而能够方便地进行各模块的单独维修和更换，同时方便地进行模块扩展；并且，各模块之间的拆装操作互不影响，并可独立进行，因此能够容易地实现部件模块化设计和通用性设计。The 1U universal modularized high-density storage JBOD device provided by the present invention mainly includes an installation casing, a storage control component, a service interface component and a power supply component. Among them, the installation housing is mainly used to install and support other components. The storage control assembly is arranged in the installation space on one side of the installation casing, and is mainly used for storing data and processing instructions, and the storage control assembly can be slidably installed in the installation casing, so as to be inserted and installed from the opening of the installation casing, Easy to install and remove. The service interface component is arranged in the installation space on the other side of the installation housing, and is mainly used to enable the storage control component to realize data interaction with external devices, and the service interface component, like the storage control component, can also be slidably installed in the installation housing. It can be inserted and installed from the opening of the installation shell, which is convenient for installation and removal. The power supply assembly is installed in the installation casing, is mainly used to supply power to the storage control assembly and the service interface assembly, and can be easily disassembled and assembled in the installation casing. In this way, the 1U universal modular high-density storage JBOD device provided by the present invention realizes the data interaction between the external device and the storage control component through the function of the business interface component, so that data storage and reading and writing can be conveniently realized, and at the same time, the storage control The components, business interface components and power components can be easily disassembled and assembled in the installation housing, so that each module can be easily repaired and replaced separately, and at the same time, the module can be easily expanded; The operations do not affect each other and can be carried out independently, so the modular design and universal design of components can be easily realized.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to the provided drawings without creative work.
图1为本发明所提供的一种具体实施方式的整体结构示意图。FIG. 1 is a schematic diagram of the overall structure of a specific embodiment provided by the present invention.
图2为图1中所示的安装壳体及电源组件的具体结构示意图。FIG. 2 is a schematic diagram of a specific structure of the mounting housing and the power supply assembly shown in FIG. 1 .
图3为图1中所示的存储控制组件的具体结构示意图。FIG. 3 is a schematic diagram of a specific structure of the storage control assembly shown in FIG. 1 .
图4为图3的分解结构示意图。FIG. 4 is a schematic diagram of the exploded structure of FIG. 3 .
图5为图1中所示的业务接口组件的具体结构示意图。FIG. 5 is a schematic diagram of a specific structure of the service interface component shown in FIG. 1 .
其中，图1—图5中：Among them, in Figure 1-Figure 5:
安装壳体—1，存储控制组件—2，业务接口组件—3，电源组件—4；Installation shell-1, storage control assembly-2, service interface assembly-3, power supply assembly-4;
第一安装空间—1a，第二安装空间—1b；The first installation space—1a, the second installation space—1b;
底板—101，顶板—102，分隔板—103，紧固件—104，束线链带—105；Bottom plate-101, top plate-102, partition plate-103, fasteners-104, cable ties-105;
滑动底板—201，硬盘阵列—202，控制器组—203，信号转接板—204，散热器模组—205，通风前面板—206，第一传输连接器—2041，第二传输连接器—2042；Sliding bottom plate—201, hard disk array—202, controller group—203, signal transfer board—204, radiator module—205, ventilation front panel—206, first transmission connector—2041, second transmission connector— 2042;
滑动托盘—301，业务接口卡—302，接口转接板—303，业务转接模块—304，扶手—305，散热风扇—306；Sliding tray-301, service interface card-302, interface adapter board-303, service adapter module-304, armrest-305, cooling fan-306;
电源模块—401，电源转接板—402。Power module—401, power adapter board—402.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
请参考图1，图1为本发明所提供的一种具体实施方式的整体结构示意图。在本发明所提供的一种具体实施方式中，1U通用型模块化高密度储存JBOD设备主要包括安装壳体1、存储控制组件2、业务接口组件3和电源组件4。Please refer to FIG. 1 . FIG. 1 is a schematic diagram of the overall structure of a specific embodiment provided by the present invention. In a specific embodiment provided by the present invention, a 1U universal modular high-density storage JBOD device mainly includes an installation casing 1 , a storage control assembly 2 , a service interface assembly 3 and a power supply assembly 4 .
其中，安装壳体1主要用于安装和支撑其余零部件。一般的，该安装壳体1可呈矩形状，同时由于本实施例主要适用于1U服务器机柜，因此，该安装壳体1具体可呈长条矩形状，并且其三维尺寸可为442mmx43.2mmx800mm。Among them, the mounting housing 1 is mainly used for mounting and supporting other components. Generally, the installation casing 1 can be rectangular, and since this embodiment is mainly applicable to a 1U server cabinet, the installation casing 1 can be a long rectangular shape, and its three-dimensional size can be 442mmx43.2mmx800mm.
存储控制组件2设置在安装壳体1的一侧安装空间内，主要用于存储数据及处理指令，并且存储控制组件2可在安装壳体1内进行滑动安装，以从安装壳体1的开口处进行插设安装，方便安装与拆卸操作。The storage control assembly 2 is arranged in the installation space on one side of the installation housing 1, and is mainly used for storing data and processing instructions. It is easy to install and remove.
业务接口组件3设置在安装壳体1的另一侧安装空间内，主要用于使存储控制组件2与外界设备实现数据交互，并且业务接口组件3与存储控制组件2一样，也可在安装壳体1内进行滑动安装，以从安装壳体1的开口处进行插设安装，方便安装与拆卸操作。The service interface component 3 is arranged in the installation space on the other side of the installation housing 1, and is mainly used to enable the storage control component 2 to realize data interaction with external devices, and the service interface component 3 is the same as the storage control component 2. The body 1 is slidably installed, so as to be inserted and installed from the opening of the installation housing 1, which is convenient for installation and removal operations.
电源组件4安装在安装壳体1内，主要用于对存储控制组件2和业务接口组件3进行供电，并且可在安装壳体1内方便地进行拆装操作。具体的，该电源组件4可与业务接口组件3安装在安装壳体1的同一侧位置，并且两者可分别位于安装壳体1的长度方向上的两端位置，比如，业务接口组件3可设置于安装壳体1的前端位置，而电源组件4可设置于安装壳体1的后端位置。The power supply assembly 4 is installed in the installation casing 1 , and is mainly used for supplying power to the storage control assembly 2 and the service interface assembly 3 , and can be easily disassembled and assembled in the installation casing 1 . Specifically, the power supply assembly 4 and the service interface assembly 3 can be installed on the same side of the installation casing 1, and the two can be respectively located at both ends of the installation casing 1 in the length direction. For example, the service interface assembly 3 can be It is arranged at the front end of the installation casing 1 , and the power supply assembly 4 can be arranged at the rear end of the installation casing 1 .
如此，本实施例所提供的1U通用型模块化高密度储存JBOD设备，通过业务接口组件3的作用实现外界设备与存储控制组件2的数据交互，如此可以方便地实现数据存储与读写，同时，存储控制组件2、业务接口组件3和电源组件4均能够在安装壳体1内方便地进行拆装操作，从而能够方便地进行各模块的单独维修和更换，同时方便地进行模块扩展；并且，各模块之间的拆装操作互不影响，并可独立进行，因此能够容易地实现部件模块化设计和通用性设计。In this way, the 1U universal modular high-density storage JBOD device provided by this embodiment realizes the data interaction between the external device and the storage control component 2 through the function of the business interface component 3, so that data storage and reading and writing can be easily realized, and at the same time , the storage control assembly 2, the service interface assembly 3 and the power supply assembly 4 can be easily disassembled and assembled in the installation housing 1, so that the individual modules can be easily repaired and replaced, and the modules can be easily expanded; and , the disassembly and assembly operations between the modules do not affect each other and can be carried out independently, so the modular design and universal design of components can be easily realized.
如图2所示，图2为图1中所示的安装壳体及电源组件的具体结构示意图。As shown in FIG. 2 , FIG. 2 is a schematic diagram of a specific structure of the mounting housing and the power supply assembly shown in FIG. 1 .
在关于安装壳体1的一种优选实施例中，该安装壳体1主要包括底板101、顶板102和分隔板103。其中，顶板102扣合在底板101的表面上，两者可通过螺钉等实现可拆卸连接。底板101表面主要用于安装存储控制组件2、业务接口组件3和电源组件4，而顶板102主要将其进行压紧、遮盖。在关于顶板102的一种优选实施例中，该顶板102可包括三部分，即前板、中板和后板，三者沿底板101的长度方向分布，分别用于遮盖底板101的不同区域。In a preferred embodiment of the installation housing 1 , the installation housing 1 mainly includes a bottom plate 101 , a top plate 102 and a partition plate 103 . The top plate 102 is fastened on the surface of the bottom plate 101, and the two can be detachably connected by screws or the like. The surface of the bottom plate 101 is mainly used for installing the storage control component 2, the service interface component 3 and the power supply component 4, while the top plate 102 is mainly used for pressing and covering them. In a preferred embodiment of the top plate 102 , the top plate 102 may include three parts, namely a front plate, a middle plate and a rear plate, which are distributed along the length of the bottom plate 101 and used to cover different areas of the bottom plate 101 respectively.
分隔板103沿底板101的长度方向立设在其表面上，并且顶端连接至顶板102的底面，主要用于将安装壳体1的内部空间沿纵向分隔为两部分，即第一安装空间1a和第二安装空间1b。其中，第一安装空间1a主要用于安装存储控制组件2，而第二安装空间1b主要用于安装业务接口组件3和电源组件4。由于存储控制组件2的面积较大，因此，分隔板103可在底板101表面上靠近其中一侧边而设置，如此，第一安装空间1a的安装面积与第二安装空间1b的安装面积之比可为3～1等。The partition plate 103 is erected on the surface of the bottom plate 101 along the length direction thereof, and the top end is connected to the bottom surface of the top plate 102, and is mainly used to divide the inner space of the installation housing 1 into two parts in the longitudinal direction, namely the first installation space 1a and the second installation space 1b. The first installation space 1 a is mainly used for installing the storage control component 2 , and the second installation space 1 b is mainly used for installing the service interface component 3 and the power supply component 4 . Since the area of the storage control assembly 2 is relatively large, the partition plate 103 can be disposed on the surface of the bottom plate 101 close to one of the sides. In this way, the installation area of the first installation space 1a and the installation area of the second installation space 1b are equal to each other. The ratio can be 3 to 1 and so on.
同时，底板101的表面光滑，并且在其两侧边上可架设轨道，方便存储控制组件2、业务接口组件3和电源组件4在其上的滑动安装和拆卸。Meanwhile, the surface of the bottom plate 101 is smooth, and rails can be erected on both sides of the base plate 101 to facilitate the sliding installation and removal of the storage control assembly 2 , the service interface assembly 3 and the power source assembly 4 thereon.
此外，为使本JBOD设备能够方便地安装在服务器机柜上，本实施例在底板101的两侧边上还设置了紧固件104，比如螺栓、工字钉等，如此可使安装壳体1通过该紧固件104与服务器机柜的内壁形成可拆卸连接，从而方便地进行上架安装与下架拆卸操作。In addition, in order to enable the JBOD device to be easily installed on the server cabinet, in this embodiment, fasteners 104, such as bolts, I-shaped nails, etc., are also arranged on both sides of the bottom plate 101, so that the housing 1 can be installed. The fastener 104 forms a detachable connection with the inner wall of the server cabinet, so that the rack-up installation and the down-rack dismounting can be conveniently performed.
同时，本实施例还在底板101的表面上设置了束线链带105，比如坦克链等，主要用于整理、收束电源线、信号线等线缆，同时保证各种线缆在随存储控制组件2拔插抽拉时能够有序移动，避免互相缠绕、打结等。At the same time, in this embodiment, a cable tie belt 105, such as a tank chain, is also provided on the surface of the bottom plate 101, which is mainly used for sorting and bundling cables such as power cables and signal cables, and at the same time ensuring that various cables are stored with The control assembly 2 can move in an orderly manner when it is pulled out and pulled out, avoiding intertwining and knotting.
如图3和图4所示，图3为图1中所示的存储控制组件的具体结构示意图，图4为图3的分解结构示意图。As shown in FIG. 3 and FIG. 4 , FIG. 3 is a schematic diagram of a specific structure of the storage control assembly shown in FIG. 1 , and FIG. 4 is a schematic diagram of an exploded structure of FIG. 3 .
在关于存储控制组件2的一种优选实施方式中，该存储控制组件2主要包括滑动底板201101、硬盘阵列202、控制器组203和信号转接板204。In a preferred embodiment of the storage control assembly 2 , the storage control assembly 2 mainly includes a sliding base plate 201101 , a hard disk array 202 , a controller group 203 and a signal transfer board 204 .
其中，滑动底板201101为存储控制组件2的承载件，主要用于安装硬盘阵列202、控制器组203和信号转接板204，并且底部表面光滑，可在安装壳体1中的底板101表面上的第一安装空间1a内进行滑动安装，方便技术人员进行推拉操作。The sliding bottom plate 201101 is the carrier of the storage control assembly 2, and is mainly used to install the hard disk array 202, the controller group 203 and the signal adapter board 204, and the bottom surface is smooth, which can be installed on the surface of the bottom plate 101 in the housing 1. Sliding installation is carried out in the first installation space 1a, which is convenient for technicians to perform push-pull operations.
硬盘阵列202安装在滑动底板201101表面的一端位置处，并且为可拆卸连接，比如卡接安装等，主要包括若干个硬盘，其中可同时包括HDD或SSD以及硬盘背板模块等。本实施例中，硬盘阵列202具体包括2组并列安装的4x2＝8块硬盘，并且2组硬盘沿着滑动底板201101的长度方向前后分布。The hard disk array 202 is installed at one end of the surface of the sliding base plate 201101, and is detachably connected, such as snap-fit installation, etc., and mainly includes several hard disks, which may include HDD or SSD and hard disk backplane modules at the same time. In this embodiment, the hard disk array 202 specifically includes two groups of 4×2=8 hard disks installed in parallel, and the two groups of hard disks are distributed forward and backward along the length direction of the sliding base plate 201101 .
同时，在滑动底板201101的前端面上设置有通风前面板206，一方面用于对后方的硬盘阵列202形成防护，另一方面能够过滤掉空气中的杂质，防止硬盘阵列202内积灰。并且，该通风前面板206同时是可拆卸地连接在滑动底板201101上，比如可通过螺钉或卡接结构等，如此设置，在需要对硬盘阵列202进行维修、更换或扩展时，即可首先将通风前面板206拆卸下来，之后再将第一组硬盘从其中拔出，最后再将第二组硬盘从其中拔出，或者可以垂向旋转第二组硬盘的背板模块，从垂向方向上对其中的硬盘进行拔插。At the same time, a ventilation front panel 206 is provided on the front surface of the sliding bottom plate 201101. On the one hand, it is used to form protection for the rear hard disk array 202, and on the other hand, it can filter out impurities in the air and prevent the hard disk array 202 from accumulating dust. In addition, the ventilation front panel 206 is also detachably connected to the sliding bottom plate 201101, for example, it can be connected to the sliding bottom plate 201101 by means of screws or a clamping structure. Remove the ventilation front panel 206, then pull out the first group of hard disks, and finally pull out the second group of hard disks, or you can rotate the backplane module of the second group of hard disks vertically, from the vertical direction Unplug and insert the hard disk.
控制器组203具体设置在滑动底板201101的另一端位置处，主要用于处理指令，实现数据转换、流向控制等，其余硬盘阵列202信号连接，可将外界设备的输入数据经过协议处理转换为符合硬盘阵列202所需的存储数据，或者也可以反过来将硬盘阵列202中的存储数据经过协议处理转换为符合外界设备所需的输出数据，如此实现数据在硬盘阵列202中的读写操作。具体的，该控制器组203可采用两块处理器同时进行工作，实现控制冗余设计。The controller group 203 is specifically arranged at the other end of the sliding base plate 201101, and is mainly used for processing instructions, realizing data conversion, flow direction control, etc., and the other hard disk arrays 202 are connected by signals, which can convert the input data of external devices through protocol processing. The storage data required by the hard disk array 202 , or conversely, the stored data in the hard disk array 202 can be converted into output data required by external devices through protocol processing, so as to realize the read and write operations of data in the hard disk array 202 . Specifically, the controller group 203 can use two processors to work at the same time, so as to realize the control redundancy design.
信号转接板204也设置在滑动底板201101的表面上，并且具体位于硬盘阵列202与控制器组203之间，整体位于滑动底板201101的中间区域。该信号转接板204与电源组件4和业务接口组件3信号连接，一方面可以将电源组件4传输的电信号进行处理后再传输给控制器组203和硬盘阵列202，另一方面可以将外界设备输入的数据信号进行处理后再传输给控制器组203和硬盘阵列202。整体而言，信号转接板204的作用为外界设备、电源组件4与硬盘阵列202、控制器组203之间的数据中转站。The signal transfer board 204 is also disposed on the surface of the sliding base plate 201101 , and is specifically located between the hard disk array 202 and the controller group 203 , and is generally located in the middle area of the sliding base plate 201101 . The signal transfer board 204 is connected to the power supply unit 4 and the service interface unit 3 for signal connection. On the one hand, it can process the electrical signal transmitted by the power supply unit 4 and then transmit it to the controller group 203 and the hard disk array 202. The data signal input by the device is processed and then transmitted to the controller group 203 and the hard disk array 202 . In general, the signal transfer board 204 functions as a data transfer station between external devices, the power supply assembly 4 , the hard disk array 202 , and the controller group 203 .
具体的，在信号转接板204的表面上设置有第一传输连接器2041和第二传输连接器2042。其中，该第一传输连接器2041与业务接口组件3信号连接，主要用于将其输出信号发送给控制器组203，而第二传输连接器2042与硬盘阵列202信号连接，主要用于将经过控制器组203处理后的输出数据传输给硬盘阵列202。Specifically, a first transmission connector 2041 and a second transmission connector 2042 are provided on the surface of the signal adapter board 204 . Among them, the first transmission connector 2041 is connected to the service interface component 3 by signal, and is mainly used to send its output signal to the controller group 203, and the second transmission connector 2042 is connected to the hard disk array 202 by signal, and is mainly used to transmit the output signal to the controller group 203. The output data processed by the controller group 203 is transmitted to the hard disk array 202 .
此外，本实施例还在滑动底板201101的表面上设置了若干个散热器模组205，主要用于对硬盘阵列202进行降温冷却。具体的，该散热器模块可包括4+1＝5个风扇，实现散热冗余涉及，可允许在损坏一个风扇的情况下仍然保证存储控制组件2的正常运行。同时，各个散热器模组205可拆卸地设置在滑动底板201101上，比如通过螺钉或卡接结构等。In addition, in this embodiment, several radiator modules 205 are also arranged on the surface of the sliding bottom plate 201101 , which are mainly used for cooling the hard disk array 202 . Specifically, the radiator module may include 4+1=5 fans, and the implementation of heat dissipation redundancy can allow the normal operation of the storage control assembly 2 to be guaranteed even if one fan is damaged. At the same time, each radiator module 205 is detachably disposed on the sliding bottom plate 201101, for example, by means of screws or clamping structures.
如图5所示，图5为图1中所示的业务接口组件的具体结构示意图。As shown in FIG. 5 , FIG. 5 is a schematic diagram of a specific structure of the service interface component shown in FIG. 1 .
在关于业务接口组件3的一种优选实施方式中，该业务接口组件3主要包括滑动托盘301、业务接口卡302、接口转接板303和业务转接模块304。其中，滑动托盘301的底部光滑，并且可滑动地插设在安装壳体1内的第二安装空间1b中，技术人员可以方便地对其进行推拉操作，实现安装与拆卸操作。一般的，该滑动托盘301可呈长条矩形状。In a preferred embodiment of the service interface assembly 3 , the service interface assembly 3 mainly includes a sliding tray 301 , a service interface card 302 , an interface adapter board 303 and a service adapter module 304 . The sliding tray 301 has a smooth bottom and is slidably inserted into the second installation space 1b in the installation housing 1, so that technicians can conveniently push and pull it to achieve installation and removal operations. Generally, the sliding tray 301 can be in the shape of a long rectangle.
业务接口卡302设置在滑动托盘301的表面上，主要用于提供各种数据接口，比如USB等，外界设备可通过该业务接口卡302上开设的各个数据接口与其实现物理连接和数据交互。The service interface card 302 is arranged on the surface of the sliding tray 301 and is mainly used to provide various data interfaces, such as USB, etc., external devices can realize physical connection and data interaction with each data interface opened on the service interface card 302 .
接口转接板303也设置在滑动托盘301的表面上，并且业务接口卡302安装于接口转接板303上，两者可通过金手指等连接器实现信号连接，如此业务接口卡302可将外界设备的输入信号传递至接口转接板303上。The interface adapter board 303 is also arranged on the surface of the sliding tray 301, and the service interface card 302 is installed on the interface adapter board 303, and the two can be connected by a connector such as a golden finger, so that the service interface card 302 can connect the outside world. The input signal of the device is transmitted to the interface adapter board 303 .
同时，接口转接板303的输出端上还通过连接器与业务转接模块304信号连接，该业务转接模块304虽然没有直接设置在滑动托盘301的表面上，而是直接设置在安装壳体1的底板101表面上，但仍然可以通过与接口转接板303之间的连接器实现稳定连接，在推拉时带动其同步运动。并且，该业务转接模块304的作用主要为信号中转，一方面可将由接口转接板303传递来的外界设备的输入信号通过束线链带105传递至控制器组203中，另一方面还可以将由电源组件4传递来的电信号通过连接器传递至接口转接板303和业务接口卡302上，为两者提供电能。At the same time, the output end of the interface adapter board 303 is also signally connected to the service adapter module 304 through a connector. Although the service adapter module 304 is not directly arranged on the surface of the sliding tray 301, it is directly arranged on the installation housing. 1 on the surface of the bottom plate 101, but still can achieve a stable connection through the connector with the interface adapter plate 303, and drive it to move synchronously when pushing and pulling. In addition, the function of the service switching module 304 is mainly for signal relay. On the one hand, it can transmit the input signal of the external device transmitted by the interface switching board 303 to the controller group 203 through the wire harness 105, and on the other hand, it can also The electrical signal transmitted by the power supply assembly 4 can be transmitted to the interface adapter board 303 and the service interface card 302 through the connector to provide power for both.
此外，为方便技术人员实现对滑动托盘301的在安装壳体1内的推拉操作，本实施例在滑动托盘301的前端面上增设了扶手305，如此，技术人员可以通过对扶手305的推拉操作实现滑动托盘301的滑动。In addition, in order to facilitate the technical personnel to realize the push-pull operation of the sliding tray 301 in the installation housing 1, in this embodiment, a handrail 305 is added on the front end surface of the sliding tray 301, so that the technical personnel can push and pull the handrail 305 through the operation of the handrail 305. The sliding of the sliding tray 301 is realized.
不仅如此，本实施例还在滑动托盘301的表面上增设了若干个散热风扇306，比如离心风扇等，该散热风扇306主要用于对业务接口卡302、接口转接板303和业务转接模块304进行散热冷却，保证其长期处于正常运行状态。Not only that, in this embodiment, several cooling fans 306 are added on the surface of the sliding tray 301 , such as centrifugal fans, etc. 304 conducts heat dissipation and cooling to ensure that it is in normal operation for a long time.
在关于电源组件4的一种优选实施方式中，该电源组件4主要包括电源模块401和电源转接板402。其中，电源模块401可同时设置2块，实现共同供电。而电源转接板402的输入端与2块电源模块401的输出端相连，其输出端可通过业务转接模块304连接至业务接口卡302为其提供电能，同时还可通过束线链带105连接至信号转接板204，为硬盘阵列202和控制器组203提供电能。In a preferred embodiment of the power supply assembly 4 , the power supply assembly 4 mainly includes a power supply module 401 and a power adapter board 402 . Among them, two power modules 401 can be set at the same time to realize common power supply. The input end of the power adapter board 402 is connected to the output ends of the two power supply modules 401 , and the output end can be connected to the service interface card 302 through the service adapter module 304 to provide power for it, and can also be connected to the service interface card 302 through the service adapter module 304. Connected to the signal transfer board 204 to provide power for the hard disk array 202 and the controller group 203 .
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。The above description of the disclosed embodiments enables any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910760796.3ACN110515431A (en) | 2019-08-16 | 2019-08-16 | A 1U universal modular high-density storage JBOD device |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910760796.3ACN110515431A (en) | 2019-08-16 | 2019-08-16 | A 1U universal modular high-density storage JBOD device |
| Publication Number | Publication Date |
|---|---|
| CN110515431Atrue CN110515431A (en) | 2019-11-29 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910760796.3APendingCN110515431A (en) | 2019-08-16 | 2019-08-16 | A 1U universal modular high-density storage JBOD device |
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|---|---|
| CN (1) | CN110515431A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111278252A (en)* | 2020-03-19 | 2020-06-12 | 英业达科技有限公司 | Server device |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070230111A1 (en)* | 2006-03-31 | 2007-10-04 | Spectra Logic Corporation | High density array system with active movable media drawers |
| CN101963831A (en)* | 2009-07-21 | 2011-02-02 | 英业达股份有限公司 | Server device with storage array module |
| CN103941825A (en)* | 2013-01-23 | 2014-07-23 | 达西系统股份有限公司 | Storage device carrier for high density storage system |
| CN104090637A (en)* | 2014-07-04 | 2014-10-08 | 北京百度网讯科技有限公司 | Server |
| US20150032928A1 (en)* | 2013-07-23 | 2015-01-29 | International Business Machines Corporation | Optimized redundant high availability sas topology |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070230111A1 (en)* | 2006-03-31 | 2007-10-04 | Spectra Logic Corporation | High density array system with active movable media drawers |
| CN101963831A (en)* | 2009-07-21 | 2011-02-02 | 英业达股份有限公司 | Server device with storage array module |
| CN103941825A (en)* | 2013-01-23 | 2014-07-23 | 达西系统股份有限公司 | Storage device carrier for high density storage system |
| US20150032928A1 (en)* | 2013-07-23 | 2015-01-29 | International Business Machines Corporation | Optimized redundant high availability sas topology |
| CN104090637A (en)* | 2014-07-04 | 2014-10-08 | 北京百度网讯科技有限公司 | Server |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111278252A (en)* | 2020-03-19 | 2020-06-12 | 英业达科技有限公司 | Server device |
| Publication | Publication Date | Title |
|---|---|---|
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication | Application publication date:20191129 |