CN110429080B - Mini LED packaging method and Mini LED - Google Patents
Mini LED packaging method and Mini LEDDownload PDFInfo
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- CN110429080B CN110429080BCN201910737652.6ACN201910737652ACN110429080BCN 110429080 BCN110429080 BCN 110429080BCN 201910737652 ACN201910737652 ACN 201910737652ACN 110429080 BCN110429080 BCN 110429080B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
Translated fromChinese
Description
Technical Field
The invention relates to the field of semiconductor lighting display, in particular to a method for packaging a Mini LED and the Mini LED prepared by the method.
Background
The Mini LED is a display screen which adopts a more precise device and a new packaging mode to realize pixel particles of 0.2-0.9 mm. With the reduction of the cost of the LED chip and the progress of the technology, and the recent increase and weakness of the LED lighting industry, new market growth points are searched for at large time at home and abroad with LED chips and packaging huge times, Mini & Micro LEDs are particularly concerned in two years as a new technology with wide market prospects, Micro LEDs are difficult to be commercialized on a large scale in a short time due to uncertain technical routes and high cost at present, and Mini LEDs are used as the extension of small-distance LED products and the introduction of Micro LEDs, and are already delivered in LCD backlight and RGB display products.
The conventional Mini led generally uses a cob (chip On board) package, that is, a bare chip is directly packaged On a substrate, although the advantages of compactness and rapidness can be realized, the chip is not screened by a photoelectric test, and the yield of the packaging method is poor due to the abnormality during packaging. The other mode is to package through the mode of paster, encapsulates the chip earlier and forms single small-size lamp pearl on the support promptly, then pastes the lamp pearl on the base plate, and this kind of mode can carry out normal photoelectric test in advance because of the encapsulation of chip earlier, and the encapsulation yield promotes by a wide margin. However, each bead is independently and electrically connected to the substrate, which requires a corresponding connection electrode on the substrate, and the structure formed by the beads is limited to the layout of the connection electrodes on the substrate, so that the beads cannot be randomly arranged.
Disclosure of Invention
Therefore, the invention provides a method for packaging a Mini LED and the Mini LED prepared by the method, which can effectively solve the problems in the background art.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
a method for packaging a Mini LED comprises the following steps:
a1, providing a packaging support, wherein the packaging support is of a Z-shaped structure and comprises a packaging part, a first pin part connected to the upper part of one side surface of the packaging part and a second pin part connected to the lower part of the other side surface of the packaging part, the upper surface of the packaging part is flush with the upper surface of the first pin part to form a packaging surface, the packaging surface is provided with a first electrode and a second electrode with opposite polarities, the lower surface of the first pin part is provided with a first contact connected with the first electrode, and the upper surface of the second pin part is provided with a second contact connected with the second electrode;
a2, packaging the LED chip on the packaging surface of the packaging support to form a lamp bead unit;
a3, performing photoelectric detection on the lamp bead units, and performing the treatment of the step A4 on the detected qualified product;
a4, arrange and be fixed in a plane base plate with a plurality of lamp pearl unit array on, form the Mini LED light emitting module who has the patterning, overlap the cooperation from top to bottom with the second pin portion in the first pin portion of adjacent lamp pearl unit, and the first contact of first pin portion forms the electricity with the second contact of second pin portion and is connected, and then realizes the electricity between the adjacent lamp pearl unit and connect.
Further, in step a1, the upper surfaces of the package part and the first lead part are recessed downward to form a bowl structure, and the bottom surface of the bowl structure forms the package surface.
Furthermore, the packaging part, the first pin part and the second pin part are all of square structures with equal width.
Further, the sum of the heights of the first lead part and the second lead part is slightly smaller than the height of the packaging part.
Further, in step a4, a conductive adhesive layer is coated on an upper surface of the second lead portion of the previous lamp bead unit, and then the first lead portion of the next lamp bead unit is in overlapping fit with the second lead portion of the previous lamp bead unit, so that the first contact of the first lead portion is electrically connected with the second contact of the second lead portion.
Further, in the step a4, a bonding adhesive layer is coated on the surface of the planar substrate, and then the lamp bead unit arrays are arranged and fixedly bonded on the planar substrate.
Further, in the step a4, the lamp bead units are connected end to form a row unit which is electrically connected, the row units are arranged in parallel to form the Mini LED light emitting module, and the lamp bead units at the edge of the row unit are electrically connected through metal welding rods.
A Mini LED comprises a planar substrate and a Mini LED light-emitting module arranged on the planar substrate, wherein the Mini LED light-emitting module is formed by arranging a plurality of lamp bead units in an array mode, each lamp bead unit comprises a packaging support and an LED chip, each packaging support is of a Z-shaped structure and comprises a packaging portion, a first pin portion connected to the upper portion of one side face of the packaging portion and a second pin portion connected to the lower portion of the other side face of the packaging portion, the upper surface of the packaging portion is flush with the upper surface of the first pin portion to form a packaging surface, the packaging surface is provided with a first electrode and a second electrode which are opposite in polarity, the lower surface of the first pin portion is provided with a first contact connected with the first electrode, and the upper surface of the second pin portion is provided with a second contact connected with the second electrode; the LED chip is packaged on the packaging surface of the packaging support; the first pin part and the second pin part of the adjacent lamp bead units are in up-and-down overlapped fit, and the first contact of the first pin part is electrically connected with the second contact of the second pin part.
Through the technical scheme provided by the invention, the method has the following beneficial effects:
the packaging support is arranged into a Z-shaped structure, photoelectric detection is carried out after packaging and forming are carried out, then array arrangement is carried out to form the required patterned Mini LED light-emitting module, and the yield is high; the Z-shaped structure is easy to assemble, namely the first pin part and the second pin part of the adjacent lamp bead units are in up-and-down overlapped fit and form electric connection, the structure is compact in connection, no gap exists, the density is good, the arrangement size is accurate, and deviation is not easy to occur; and electrodes do not need to be arranged on the substrate for surface mount packaging, the limitation of the substrate electrodes is cancelled, and the electrodes can be randomly arranged.
Drawings
FIG. 1 is a block diagram showing a flow chart of a method for packaging a Mini LED in an embodiment;
FIG. 2 is a schematic perspective view of an exemplary package support;
FIG. 3 is a cross-sectional view of a package support in an embodiment;
FIG. 4 is a cross-sectional view of a lamp bead unit in an embodiment;
FIG. 5 is a schematic diagram illustrating connection between adjacent bead units in an embodiment;
fig. 6 is a schematic structural diagram of a Mini LED in the embodiment.
Detailed Description
To further illustrate the various embodiments, the invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. Those skilled in the art will appreciate still other possible embodiments and advantages of the present invention with reference to these figures. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.
The invention will now be further described with reference to the accompanying drawings and detailed description.
Example one
Referring to fig. 1, the present invention provides a method for packaging a Mini LED, including the following steps:
a1, providing apackage support 1, as shown in fig. 2 and 3, the package support is in a "Z" shape and includes apackage portion 13, afirst lead portion 11 connected to an upper position of one side surface of thepackage portion 13, and asecond lead portion 12 connected to a lower position of the other side surface of thepackage portion 13, an upper surface of thepackage portion 13 is flush with an upper surface of thefirst lead portion 11 and forms a package surface, the package surface is provided with afirst electrode 101 and a second electrode 102 (i.e., a positive electrode and a negative electrode) with opposite polarities, a lower surface of thefirst lead portion 11 is provided with afirst contact 111 connected to thefirst electrode 101, and an upper surface of thesecond lead portion 12 is provided with asecond contact 112 connected to thesecond electrode 102;
a2, packaging theLED chip 21 on the packaging surface of thepackaging support 1 to form alamp bead unit 2, as shown in FIG. 4; theLED chip 21 is die-bonded on the packaging surface of thepackaging support 1, the P electrode and the N electrode of theLED chip 21 are respectively connected with thefirst electrode 101 and thesecond electrode 102 of thepackaging support 1, and then thepackaging glue 22 is covered to realize the die-bonding, and the packaging of the LED chip is the prior art.
A3, performing photoelectric detection on thelamp bead unit 2, such as detecting parameters of light emission quantity, voltage, current and the like, screening, and performing the processing of the step A4 on detected qualified products;
a4, as shown in fig. 6, arranging and fixing a plurality ofbead units 2 on aplanar substrate 40 in an array to form a Mini LED lighting module 3 with patterning, thereby obtaining a Mini LED; the connection mode between thelamp bead units 2 is specifically as shown in fig. 5, thefirst lead part 11 and thesecond lead part 12 of the adjacentlamp bead units 2 are in up-down overlapped fit, and thefirst contact 111 of thefirst lead part 11 and thesecond contact 112 of thesecond lead part 12 form an electrical connection, so that the electrical connection between the adjacentlamp bead units 2 is realized.
Thepackaging support 1 is arranged to be of a Z-shaped structure, photoelectric detection is carried out after packaging and forming are carried out, then array arrangement is carried out to form the required patterned Mini LED light-emitting module 3, and the yield is high; the Z-shaped structure is easy to assemble, namely, thefirst lead part 11 and thesecond lead part 12 of the adjacentlamp bead units 2 are in up-down overlapped fit and form electric connection, the structure connection is compact, the density is good, the arrangement size is accurate, and the deviation is not easy to occur; and electrodes do not need to be arranged on the substrate for surface mount packaging, the limitation of the substrate electrodes is cancelled, and the electrodes can be randomly arranged.
Further, in this embodiment, in step a1, the upper surfaces of thesealing portion 13 and thefirst lead portion 11 are recessed downward to form abowl structure 14, and the bottom surface of thebowl structure 14 forms the sealing surface. By adopting thebowl structure 14, on one hand, the inner wall of thebowl structure 14 has a reflection function, so that the light output amount can be increased, and the concentration of the emergent light is good; on the other hand,bowl cup structure 14 has the effect of holding, can makeLED chip 21 andencapsulation glue 22 all hold wherein, andencapsulation glue 22 can not be excessive, assurancelamp pearl unit 2's that can be fine quality. Of course, in other embodiments, a bowl structure may not be required.
Further, in this embodiment, thepackaging portion 13, thefirst lead portion 11, and thesecond lead portion 12 are all square structures with equal widths, which can achieve good matching, and the overall appearance is neat and well connected. Of course, in other embodiments, the shapes of thepackage portion 13, thefirst lead portion 11, and thesecond lead portion 12 are not limited thereto.
Further, in this embodiment, the sum of the heights of thefirst lead part 11 and thesecond lead part 12 is slightly smaller than the height of thepackaging part 13, so that when the adjacentlamp bead units 2 are matched, a yield space can be provided for the matching size of thefirst lead part 11 and thesecond lead part 12 which are overlapped and matched, and the abnormal warpage caused by a large error in size during matching is prevented; meanwhile, thefirst contact 111 of thefirst lead part 11 and thesecond contact 112 of thesecond lead part 12 preferably protrude from the surface of the lead parts, so that electrical contact can be well ensured.
Still further, in this embodiment, in step a4, firstly, the conductiveadhesive layer 30 is coated on the upper surface of thesecond pin portion 12 of the previouslamp bead unit 2, and then thefirst pin portion 11 of the nextlamp bead unit 2 is overlapped and matched with thesecond pin portion 12 of the previouslamp bead unit 2, so that the conductiveadhesive layer 30 can well perform the functions of bonding and electrical conduction, and the bonding firmness and the electrical connection between thelamp bead units 2 are ensured. Specifically, the conductiveadhesive layer 30 is solder paste or silver paste in the prior art. Of course, in other embodiments, the structure of coating the conductiveadhesive layer 30 may not be required.
Further, in this embodiment, a bonding adhesive layer (not shown) is coated on the surface of theplanar substrate 40, and then thelamp bead units 2 are arranged in an array and fixedly bonded on theplanar substrate 40. The bonding glue layer can be fine with 2 rigid couplings of lamp pearl unit inplane base plate 40, and simple structure, the realization of being convenient for. Of course, in other embodiments, other methods of fastening may be used.
Further, in this embodiment, in step a4, the plurality ofbead units 2 are connected end to form an electrically connected row unit, and the plurality of row units are arranged in parallel to form the Mini LED lighting module 3, which is configured as a 10X 10 array in this embodiment; thelamp bead units 2 at the edge of the row unit are electrically connected throughmetal welding rods 51, namely, thesecond contacts 112 of thelamp bead units 2 at the edge of the row unit are arranged upwards and are directly connected through themetal welding rods 51, namely, thefirst contacts 111 of thelamp bead units 2 at the edge of the row unit are arranged, aconvex rib 52 can be added on theplanar substrate 40, themetal welding rods 51 are embedded on theconvex rib 52, and when thelamp bead units 2 are arranged, thefirst contacts 111 of thelamp bead units 2 at the edge are aligned to themetal welding rods 51 on the convexrib 52 for electrical connection; thereby forming the electric connection of the whole Mini LED light-emitting module; this kind of mode of arrangement is simple. Of course, in other embodiments, the Mini LED lighting modules may be arranged in other array manners.
With continued reference to fig. 2 to 6, the present embodiment further provides a Mini LED prepared by the above method, including aplanar substrate 40 and a Mini LED lighting module 3 disposed on theplanar substrate 40, where the Mini LED lighting module 3 is formed by arranging a plurality ofbead units 2 in an array, eachbead unit 2 includes apackage support 1 and anLED chip 21, thepackage support 1 is in a "Z" shape, and includes apackage portion 13, afirst lead portion 11 connected to an upper position of one side surface of thepackage portion 13, and asecond lead portion 12 connected to a lower position of the other side surface of thepackage portion 13, an upper surface of thepackage portion 13 is flush with an upper surface of thefirst lead portion 11 to form a package surface, the package surface is provided with afirst electrode 101 and a second electrode 102 (i.e., a positive electrode and a negative electrode) with opposite polarities, afirst contact 111 connected to thefirst electrode 101 is disposed on a lower surface of thefirst lead portion 11, the upper surface of thesecond lead part 12 is provided with asecond contact 112 connected with thesecond electrode 102; theLED chip 21 is packaged on the packaging surface of thepackaging support 1; thefirst lead part 11 and thesecond lead part 12 of the adjacentlamp bead unit 2 are in up-down overlapped fit, and thefirst contact 111 of thefirst lead part 11 is electrically connected with thesecond contact 112 of thesecond lead part 12.
Thelamp bead units 2 made by thepackaging support 1 with the Z-shaped structure are arranged to form the Mini LED light-emitting module 3, the Z-shaped structure is easy to assemble, namely, thefirst pin part 11 and thesecond pin part 12 of the adjacentlamp bead units 2 are overlapped and matched up and down and form electric connection, the structure is compact in connection, free of gap, good in concentration, accurate in arrangement size and not prone to deviation; and electrodes do not need to be arranged on the substrate for surface mount packaging, the limitation of the substrate electrodes is cancelled, and the electrodes can be randomly arranged. Meanwhile, thelamp bead units 2 can be subjected to photoelectric detection, and then the patterned Mini LED light-emitting modules 3 are arranged in an array mode, so that the yield is improved.
Specifically, theLED chip 21 is packaged on the packaging surface of thepackaging support 1, that is, theLED chip 21 is die-bonded on the packaging surface of thepackaging support 1, the P electrode and the N electrode of theLED chip 21 are respectively connected to thefirst electrode 101 and thesecond electrode 102 of thepackaging support 1, and then thepackaging adhesive 22 is covered to realize the die-bonding, where the packaging manner of theLED chip 21 is the prior art.
Further, in the present embodiment, the upper surfaces of thesealing portion 13 and thefirst lead portion 11 are recessed downward to form abowl structure 14, and the bottom surface of thebowl structure 14 forms the sealing surface. By adopting thebowl structure 14, on one hand, the inner wall of thebowl structure 14 has a reflection function, so that the light output amount can be increased, and the concentration of the emergent light is good; on the other hand,bowl cup structure 14 has the effect of holding, can makeLED chip 21 andencapsulation glue 22 all hold wherein, andencapsulation glue 22 can not be excessive, assurancelamp pearl unit 2's that can be fine quality. Of course, in other embodiments, a bowl structure may not be required.
Further, in this embodiment, thepackaging portion 13, thefirst lead portion 11, and thesecond lead portion 12 are all square structures with equal widths, which can achieve good matching, and the overall appearance is neat and well connected. Of course, in other embodiments, the shapes of thepackage portion 13, thefirst lead portion 11, and thesecond lead portion 12 are not limited thereto.
Further, in this embodiment, the sum of the heights of the firstlead part 11 and the secondlead part 12 is slightly smaller than the height of the package part, so that when the adjacentlamp bead units 2 are matched, a yield space can be provided for the matching size of the firstlead part 11 and the secondlead part 12 which are overlapped and matched, and the abnormal situation of warping caused by large error of size during matching is prevented; meanwhile, thefirst contact 111 of the firstlead part 11 and thesecond contact 112 of the secondlead part 12 preferably protrude from the surface of the lead parts, so that electrical contact can be well ensured.
Still further, in this embodiment, a conductiveadhesive layer 30 is disposed between thefirst pin portion 11 and thesecond pin portion 12 of the adjacentlamp bead units 2 in overlapped fit, the conductiveadhesive layer 30 is coated on the upper surface of thesecond pin portion 12 of the previouslamp bead unit 2, thefirst pin portion 11 of the nextlamp bead unit 2 is in overlapped fit with thesecond pin portion 12 of the previouslamp bead unit 2, the conductive adhesive layer can well perform bonding and conductive functions, and the bonding firmness and the electrical connection between thelamp bead units 2 are ensured. Specifically, the conductiveadhesive layer 30 is solder paste or silver paste in the prior art. Of course, in other embodiments, the structure of coating the conductiveadhesive layer 30 may not be required.
Further, in this embodiment, the surface of theplanar substrate 40 is coated with a bonding adhesive layer (not shown), thelamp bead units 2 are fixed on theplanar substrate 40 by bonding of the bonding adhesive layer, the surface of theplanar substrate 40 is coated with a bonding adhesive layer, and then thelamp bead units 2 are arranged in an array and are fixedly bonded on theplanar substrate 40. The bonding glue layer can be fine with lamp pearl unit rigid coupling onplanar substrate 40, and simple structure, the realization of being convenient for. Of course, in other embodiments, other methods of fastening may be used.
Further, in this embodiment, a plurality of thebead units 2 are connected end to form electrically connected row units, the plurality of the row units are arranged in parallel to form the Mini LED lighting module 3, and thebead units 2 at the edges of adjacent rows are electrically connected by themetal welding rod 51 to form the electrical connection of the whole Mini LED lighting module 3; this kind of mode of arrangement is simple. Specifically, arrange thesecond contact 112 of the marginallamp pearl unit 2 of unit and set up upwards, directly connect throughmetal welding rod 51, arrange thefirst contact 111 of the marginallamp pearl unit 2 of unit promptly, the accessible increases a protrudingmuscle 52 atplanar substrate 40, inlaysmetal welding rod 51 on protrudingmuscle 52, when arranginglamp pearl unit 2, alignsmetal welding rod 51 on the protrudingmuscle 52 with thefirst contact 111 of marginallamp pearl unit 2, carries out the electricity and connects. Of course, in other embodiments, the Mini LED lighting modules 3 may be arranged in other array manners.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (7)
1. A method for packaging a Mini LED is characterized in that: the method comprises the following steps:
a1, providing a packaging support, wherein the packaging support is of a Z-shaped structure and comprises a packaging part, a first pin part connected to the upper part of one side surface of the packaging part and a second pin part connected to the lower part of the other side surface of the packaging part, the upper surface of the packaging part is flush with the upper surface of the first pin part to form a packaging surface, the packaging surface is provided with a first electrode and a second electrode with opposite polarities, the lower surface of the first pin part is provided with a first contact connected with the first electrode, and the upper surface of the second pin part is provided with a second contact connected with the second electrode;
a2, packaging the LED chip on the packaging surface of the packaging support to form a lamp bead unit;
a3, performing photoelectric detection on the lamp bead units, and performing the treatment of the step A4 on the detected qualified product;
a4, arrange and be fixed in a plane base plate with a plurality of lamp pearl unit array on, form the Mini LED light emitting module who has the patterning, overlap the cooperation from top to bottom with the second pin portion in the first pin portion of adjacent lamp pearl unit, and the first contact of first pin portion forms the electricity with the second contact of second pin portion and is connected, and then realizes the electricity between the adjacent lamp pearl unit and connect.
2. The method of claim 1, wherein the MiniLED package comprises: the packaging part, the first pin part and the second pin part are all of square structures with equal width.
3. The method for encapsulating a Mini LED as claimed in claim 1, wherein: the sum of the heights of the first lead part and the second lead part is slightly smaller than the height of the packaging part.
4. The method of claim 3, wherein the method further comprises the steps of: in step a4, a conductive adhesive layer is coated on the upper surface of the second lead portion of the previous lamp bead unit, and then the first lead portion of the next lamp bead unit is in overlapping fit with the second lead portion of the previous lamp bead unit, thereby achieving the electrical connection between the first contact of the first lead portion and the second contact of the second lead portion.
5. The method for encapsulating a Mini LED as claimed in claim 1, wherein: in the step A4, a bonding adhesive layer is coated on the surface of the planar substrate, and then the lamp bead unit arrays are arranged and fixedly bonded on the planar substrate.
6. The method for encapsulating a Mini LED as claimed in claim 1, wherein: in the step A4, the lamp bead units are connected end to form an electrically connected row unit, the row units are arranged in parallel to form the Mini LED light-emitting module, and the lamp bead units at the edge of the row unit are electrically connected through metal welding rods.
7. A Mini LED, characterized by: the Mini LED light-emitting module comprises a planar substrate and a Mini LED light-emitting module arranged on the planar substrate, wherein the Mini LED light-emitting module is formed by arraying a plurality of lamp bead units, each lamp bead unit comprises a packaging support and an LED chip, each packaging support is of a Z-shaped structure and comprises a packaging part, a first pin part connected to the upper part of one side face of the packaging part and a second pin part connected to the lower part of the other side face of the packaging part, the upper surface of the packaging part is flush with the upper surface of the first pin part to form a packaging surface, the packaging surface is provided with a first electrode and a second electrode which are opposite in polarity, the lower surface of the first pin part is provided with a first contact connected with the first electrode, and the upper surface of the second pin part is provided with a second contact connected with the second electrode; the LED chip is packaged on the packaging surface of the packaging support; the first pin part and the second pin part of the adjacent lamp bead units are in up-and-down overlapped fit, and the first contact of the first pin part is electrically connected with the second contact of the second pin part.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910737652.6ACN110429080B (en) | 2019-08-12 | 2019-08-12 | Mini LED packaging method and Mini LED |
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| CN201910737652.6ACN110429080B (en) | 2019-08-12 | 2019-08-12 | Mini LED packaging method and Mini LED |
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| CN110429080Btrue CN110429080B (en) | 2021-01-12 |
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| CN111710749B (en)* | 2020-04-23 | 2022-09-09 | 中国科学院上海技术物理研究所 | Long-line detector splicing structure based on multi-substrate secondary splicing and implementation method |
| CN112768441B (en)* | 2020-12-29 | 2024-06-25 | 滁州惠科光电科技有限公司 | Display screen packaging support and packaging method |
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| JP3878579B2 (en)* | 2003-06-11 | 2007-02-07 | ローム株式会社 | Optical semiconductor device |
| US20060279196A1 (en)* | 2005-06-02 | 2006-12-14 | Wei-Jen Hsu | White LED |
| JP5528900B2 (en)* | 2010-04-30 | 2014-06-25 | ローム株式会社 | Light emitting element module |
| CN102446909B (en)* | 2010-09-30 | 2015-03-11 | 赛恩倍吉科技顾问（深圳）有限公司 | Light-emitting diode combination |
| KR101783955B1 (en)* | 2011-02-10 | 2017-10-11 | 삼성디스플레이 주식회사 | Light emitting diode package and back light unit having the same |
| KR101260180B1 (en)* | 2011-07-07 | 2013-05-06 | 김규한 | LED Package and manufacturing method thereof |
| CN204067431U (en)* | 2014-09-05 | 2014-12-31 | 佛山市国星光电股份有限公司 | A kind of Novel LED support and LED component |
| CN109411588B (en)* | 2018-12-11 | 2020-03-13 | 深圳市晶族科技有限公司 | Parallel mounting LED element, transparent display screen module and production method thereof |
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