本申请是中国发明专利申请(申请号：201310272229.6，申请日：2013年07月01日，发明名称：发光二极管组件及制作方法)的分案申请。This application is a divisional application of a Chinese invention patent application (application number: 201310272229.6, application date: July 1, 2013, name of invention: light-emitting diode assembly and manufacturing method).
技术领域technical field
发明涉及一种发光二极管(light emitting diode，LED)组件与制作方法，尤其是涉及可提供全周光光场的LED组件以及相关的制作方法。The invention relates to a light emitting diode (LED) component and a manufacturing method, in particular to an LED component that can provide a full-circumferential light field and a related manufacturing method.
背景技术Background technique
目前生活上已经可以看到各式各样LED商品的应用，例如交通号志机车尾灯、汽车头灯、路灯、电脑指示灯、手电筒、LED背光源等。这些商品除前端的芯片制作工艺外，几乎都必须经过后端的封装程序。At present, we can see the application of various LED products in daily life, such as traffic signs, locomotive tail lights, car headlights, street lights, computer indicators, flashlights, LED backlights, etc. In addition to the front-end chip manufacturing process, almost all of these products must go through the back-end packaging process.
LED封装的主要功能在于提供LED芯片电、光、热上的必要支援。LED芯片这样的半导体产品，如果长期暴露在大气中，会受到水汽或是环境中的化学物质影响而老化，造成特性上的衰退。LED封装中，常用环氧树酯来包覆LED芯片以有效隔绝大气。此外，为了达到更亮更省电的目标，LED封装还需要有良好的散热性以及光萃取效率。如果LED芯片发光时所产生的热没有及时散出，累积在LED芯片中的热对元件的特性、寿命以及可靠度都会产生不良的影响。光学设计也是LED封装制作工艺中重要的一环，如何更有效的把光导出，发光角度以及方向都是设计上的重点。The main function of the LED package is to provide the necessary support for the electricity, light and heat of the LED chip. If semiconductor products such as LED chips are exposed to the atmosphere for a long time, they will be affected by water vapor or chemical substances in the environment and age, resulting in deterioration in characteristics. In LED packaging, epoxy resin is often used to cover the LED chip to effectively isolate the atmosphere. In addition, in order to achieve the goal of brighter and more power saving, the LED package also needs to have good heat dissipation and light extraction efficiency. If the heat generated when the LED chip emits light is not dissipated in time, the heat accumulated in the LED chip will adversely affect the characteristics, life and reliability of the element. Optical design is also an important part of the LED packaging manufacturing process. How to export light more effectively, the angle and direction of light are the key points of design.
白光LED的封装技术，除了要考虑热的问题之外，还需要考虑色温(colortemperature)、演色系数(color rendering index)、荧光粉等问题。而且，若白光LED是采用蓝光LED芯片搭配黄绿荧光粉时，因蓝光的波长越短，对人眼的伤害越大，因此需要将蓝光有效阻绝于封装结构之中，避免蓝光外漏。In addition to thermal issues, the packaging technology of white LEDs also needs to consider issues such as color temperature, color rendering index, and phosphors. Moreover, if the white LED uses blue LED chips with yellow-green phosphors, the shorter the wavelength of blue light, the greater the damage to the human eye. Therefore, it is necessary to effectively block the blue light in the package structure to avoid blue light leakage.
为了LED商品能在市场上具有竞争力，如何让LED封装的制作工艺稳固、低成本、高良率，也是LED封装所追求的目标。In order for LED products to be competitive in the market, how to make the manufacturing process of LED packaging stable, low cost, and high yield is also the goal pursued by LED packaging.
发明内容SUMMARY OF THE INVENTION
为解决上述问题，本发明提供一发光二极管组件，其包含一透明基板、数个发光二极管芯片、一线路、一透明封装体、二电极板。该透明基板具有面对相反方向的一第一表面以及一第二表面。该多个发光二极管芯片，固定于该第一表面上。该线路电连接该多个发光二极管芯片。该透明封装体(capsule)，设于该第一表面上，大致包裹该多个发光二极管芯片与该线路。该多个电极板贴附于该第一表面或该第二表面，通过该线路电连接至该多个发光二极管芯片，作为该发光二极管封装结构的二电源输入端。In order to solve the above problems, the present invention provides a light-emitting diode assembly, which includes a transparent substrate, a plurality of light-emitting diode chips, a circuit, a transparent package body, and two electrode plates. The transparent substrate has a first surface and a second surface facing opposite directions. The plurality of light-emitting diode chips are fixed on the first surface. The circuit is electrically connected to the plurality of light emitting diode chips. The transparent capsule is disposed on the first surface and substantially wraps the plurality of LED chips and the circuit. The plurality of electrode plates are attached to the first surface or the second surface, and are electrically connected to the plurality of light-emitting diode chips through the circuit, serving as two power input terminals of the light-emitting diode package structure.
附图说明Description of drawings
图1为依据本发明的一实施例的LED组件的立体示意图；FIG. 1 is a three-dimensional schematic diagram of an LED assembly according to an embodiment of the present invention;
图2A显示LED组件100a的上视图；FIG. 2A shows a top view of the LED assembly 100a;
图2B显示LED组件100a的下视图；FIG. 2B shows a bottom view of the LED assembly 100a;
图3A与图3B分别显示图2A中AA与BB剖面示意图；3A and FIG. 3B respectively show the schematic cross-sectional views of AA and BB in FIG. 2A;
图4显示LED组件100设置于一灯泡；FIG. 4 shows the LED assembly 100 disposed in a light bulb;
图5A显示用焊锡固定LED组件100；FIG. 5A shows fixing the LED assembly 100 with solder;
图5B显示用金属夹片固定LED组件100；FIG. 5B shows fixing the LED assembly 100 with a metal clip;
图6显示形成图3A与图3B中的LED组件的制作工艺方法；FIG. 6 shows a manufacturing process method for forming the LED components in FIG. 3A and FIG. 3B;
图7A与图7B分别显示LED组件100b的上视图与下视图；7A and 7B respectively show the top view and bottom view of the LED assembly 100b;
图8A与图8B显示图7A中AA与BB剖面示意图；8A and FIG. 8B show schematic cross-sectional views of AA and BB in FIG. 7A;
图8C与图8D显示LED组件100c的二剖面图；8C and 8D show two cross-sectional views of the LED assembly 100c;
图9显示LED组件100b的制作工艺方法；FIG. 9 shows a manufacturing process method of the LED component 100b;
图10为依据本发明的一实施例的发光二极管组件400的立体示意图；FIG. 10 is a schematic perspective view of a light emitting diode assembly 400 according to an embodiment of the present invention;
图11A与图11B显示LED组件400a的上视图与下视图；11A and 11B show top and bottom views of the LED assembly 400a;
图12A与图12B分别显示图11A中LED组件400a的AA与BB剖面示意图；FIGS. 12A and 12B respectively show schematic cross-sectional views along AA and BB of the LED assembly 400a in FIG. 11A ;
图12C显示另一LED组件400b；Figure 12C shows another LED assembly 400b;
图13显示LED组件200的立体示意图；FIG. 13 shows a schematic perspective view of the LED assembly 200;
图14与图15分别为LED组件200a的一上视图与一侧面图；14 and 15 are a top view and a side view of the LED assembly 200a, respectively;
图16与图17显示另一LED组件200b；16 and 17 show another LED assembly 200b;
图18显示另一LED组件200c；Figure 18 shows another LED assembly 200c;
图19显示LED组件200c的一种制作工艺方法；FIG. 19 shows a manufacturing process method of the LED assembly 200c;
图20显示依据本发明的另一实施例的LED组件300的立体示意图；FIG. 20 shows a schematic perspective view of an LED assembly 300 according to another embodiment of the present invention;
图21A与图21B显示一LED组件300a的上视图与下视图；21A and 21B show top and bottom views of an LED assembly 300a;
图22显示LED组件300a的一剖面图；FIG. 22 shows a cross-sectional view of the LED assembly 300a;
图23显示LED组件300b的一侧面图；Figure 23 shows a side view of the LED assembly 300b;
图24显示LED组件600的立体示意图；FIG. 24 shows a schematic perspective view of the LED assembly 600;
图25A与图25B显示LED组件600a与600b的上视图；25A and 25B show top views of LED assemblies 600a and 600b;
图26A与图26B显示分别以LED组件300与600作为灯蕊的二LED灯泡。26A and 26B show two LED light bulbs with LED assemblies 300 and 600 as light cores, respectively.
符号说明Symbol Description
100、100a、100b、100c LED组件100, 100a, 100b, 100c LED assemblies
102 上表面102 upper surface
104 下表面104 Lower surface
106 透明基板106 Transparent substrate
107、107A、107B 导通孔107, 107A, 107B Vias
108、108a、108b 蓝光LED芯片108, 108a, 108b blue LED chips
110 焊线110 wire
112 透明胶体112 Transparent colloid
114、116 终端114, 116 Terminals
118 导电电极板118 Conductive electrode plate
119 导电电极板119 Conductive electrode plate
120 导电电极板120 Conductive Electrode Plate
122 导电电极板122 Conductive electrode plate
130 垂直导通元件130 Vertical pass element
131 荧光层131 Phosphor layer
132、133 透明粘着层132, 133 Transparent adhesive layer
148、150、151、152、154、154a、155、155a、156、157、158 步骤148, 150, 151, 152, 154, 154a, 155, 155a, 156, 157, 158 Steps
160 次基板160 substrates
180 灯罩180 Lampshade
182 散热机构182 Cooling mechanism
183 电连接机构183 Electrical connection mechanism
190 焊锡190 Solder
192 电路板192 circuit boards
194 金属夹片194 Metal clips
200、200a、200b、200c LED组件200, 200a, 200b, 200c LED assemblies
300、300a、300b LED组件300, 300a, 300b LED assemblies
400、400a、400b LED组件400, 400a, 400b LED assemblies
402 导电条402 Conductive strip
500a、500b LED灯泡500a, 500b LED bulbs
502 夹具502 Fixtures
600、600a、600b LED组件600, 600a, 600b LED assemblies
具体实施方式Detailed ways
图1为依据本发明的一实施例的发光二极管(light-emitting diode,LED)组件100的立体示意图。LED组件100包含有一透明基板106，在一实施例中，为不导电的一玻璃基板。透明基板106具有面对相反方向的上表面102以及下表面104。如图1所示，透明基板106大致为一长条状，具有两终端114与116。在此说明书中，透明仅仅用来表示可以通过光线，其可能是完全透明(transparent)或是半透明(translucent,or semitransparent)。在另一实施例中，透明基板106的材料可以是蓝宝石、碳化硅、或类钻碳。FIG. 1 is a schematic perspective view of a light-emitting diode (LED) device 100 according to an embodiment of the present invention. The LED assembly 100 includes a transparent substrate 106, which, in one embodiment, is a non-conductive glass substrate. The transparent substrate 106 has an upper surface 102 and a lower surface 104 facing opposite directions. As shown in FIG. 1 , the transparent substrate 106 is roughly in the shape of a long strip, and has two terminals 114 and 116 . In this specification, transparent is only used to mean that light can pass through, which may be transparent, or semitransparent. In another embodiment, the material of the transparent substrate 106 may be sapphire, silicon carbide, or diamond-like carbon.
图2A显示LED组件100a的上视图。请同时参考图1。在上表面102上，固着有数个蓝光LED芯片108，彼此通过焊线(bonding wire)110所形成线路来电连接。每一蓝光LED芯片108可为单一LED，其顺向电压约为2～3V(下称「低电压芯片」)，或是具有数个发光二极管串联在一起且顺向电压大于低电压芯片，例如12V、24V、48V等(下称「高电压芯片」)。具体言之，有别于打线方式，高电压芯片通过半导体制作工艺在一共同基板上形成数个彼此电连结的发光二极管单元(即至少具有发光层的发光二极管结构)，此共同基板可以为长晶基板或非长晶基板。在图1与图2A中，蓝光LED芯片108沿着连接透明基板106的两终端114与116的一纵轴的两侧，排成两列，彼此以焊线110串联在一起，电性上，等效的成为一个高顺向电压的发光二极管。但是本发明并不局限于此，在其他实施例中，上表面102上的蓝光LED芯片108可以排列成任意的图案，且彼此的电连接可以具有、串联、并联、同时有串联并联混合、或是桥式结构的连接方式。FIG. 2A shows a top view of the LED assembly 100a. Please also refer to Figure 1. On the upper surface 102 , a plurality of blue LED chips 108 are fixed, and are electrically connected to each other through a circuit formed by a bonding wire 110 . Each blue LED chip 108 can be a single LED with a forward voltage of about 2-3V (hereinafter referred to as a "low voltage chip"), or a plurality of light emitting diodes connected in series with a forward voltage greater than that of a low voltage chip, such as 12V, 24V, 48V, etc. (hereinafter referred to as "high voltage chips"). Specifically, different from the wire bonding method, the high-voltage chip forms a plurality of light-emitting diode units (ie, a light-emitting diode structure with at least a light-emitting layer) electrically connected to each other on a common substrate through a semiconductor fabrication process. The common substrate can be Crystalline substrates or amorphous substrates. In FIG. 1 and FIG. 2A , the blue LED chips 108 are arranged in two columns along the two sides of a longitudinal axis connecting the two terminals 114 and 116 of the transparent substrate 106, and are connected in series with each other by the bonding wires 110. Electrically, Equivalent to a high forward voltage light-emitting diode. However, the present invention is not limited to this. In other embodiments, the blue LED chips 108 on the upper surface 102 can be arranged in any pattern, and the electrical connections to each other can be in series, in parallel, in a mixture of series and parallel, or It is the connection method of bridge structure.
如同图2A所示，在靠近终端114附近，透明基板106具有一导通孔107。导通孔107具有一通孔，其贯穿透明基板106直达上表面102以及下表面104，且其中形成有导电物填满通孔或仅覆盖通孔的内壁，以形成导通孔107。通孔中的导电物可提供导通孔107两端电连接。在靠近终端114的上表面102，设置有一导电电极板118。导电电极板118并没有直接接触到导通孔107，亦即未直接接触通孔内的导电物。靠近终端114的蓝光LED芯片108其中之一(标示为108a)以一焊线110电连接到导电电极板118。靠近终端114的蓝光LED芯片108其中之一(标示为108b)，以另一焊线110电连接到导通孔107。As shown in FIG. 2A , near the terminal 114 , the transparent substrate 106 has a via hole 107 . The via hole 107 has a via hole that penetrates the transparent substrate 106 to the upper surface 102 and the lower surface 104 , and is formed with a conductive material to fill the via hole or only cover the inner wall of the via hole to form the via hole 107 . The conductive material in the through hole can provide electrical connection between the two ends of the through hole 107 . On the upper surface 102 near the terminal 114, a conductive electrode plate 118 is provided. The conductive electrode plate 118 does not directly contact the through hole 107 , that is, does not directly contact the conductive objects in the through hole. One of the blue LED chips 108 near the terminal 114 (designated as 108a ) is electrically connected to the conductive electrode plate 118 with a bonding wire 110 . One of the blue LED chips 108 close to the terminal 114 (marked as 108b ) is electrically connected to the via hole 107 by another bonding wire 110 .
位于上表面102上的所有焊线110与蓝光LED芯片108都被透明胶体112所覆盖，用来预防大气中的湿气或是化学物质对焊线110与蓝光LED芯片108所可能造成的老化与损害。透明胶体112的主要构成物可以是环氧树酯或是硅胶(silicone)。透明胶体112包含有至少一种荧光粉，可以受蓝光LED芯片108所发出的部分蓝光(譬如说其波峰值为430nm-480nm)所激发，而产生黄光(譬如说其波峰值为570nm-590nm)或黄绿光(譬如说其波峰值为540nm-570nm)。而黄光或黄绿光与剩余的蓝光适当地混成时，人眼会视为白光。图1只是一个示意图。在一例子中，图1中的LED组件100，因为透明胶体112中的荧光粉，可能无法如同图1所示的看到透明胶体112下的焊线110与蓝光LED芯片108。All the bonding wires 110 and the blue LED chips 108 on the upper surface 102 are covered by the transparent colloid 112 to prevent the bonding wires 110 and the blue LED chips 108 from aging and possibly caused by moisture or chemicals in the atmosphere. damage. The main constituent of the transparent colloid 112 may be epoxy resin or silicone. The transparent colloid 112 contains at least one phosphor, which can be excited by part of the blue light (eg, its peak value is 430nm-480nm) emitted by the blue LED chip 108 to generate yellow light (eg, its peak value is 570nm-590nm) ) or yellow-green light (for example, its peak value is 540nm-570nm). When yellow or yellow-green light is properly mixed with the remaining blue light, the human eye sees it as white light. Figure 1 is only a schematic diagram. In one example, the LED assembly 100 in FIG. 1 may not be able to see the bonding wire 110 and the blue LED chip 108 under the transparent gel 112 as shown in FIG. 1 because of the phosphors in the transparent gel 112 .
图2B显示LED组件100a的下视图。如同图2B所示，下表面104上，无设置任何LED芯片。在靠近终端114的下表面104上，设置有另一导电电极板120，其一部分与导通孔107相重叠，并直接接触通孔中的导电物而与其相互电连接。在另一实施例中，导电电极板120可以不直接与导通孔107相连，而通过另一导体，如焊线110，与导通孔107形成电连接。在靠近终端116的下表面104上，可以选择性地设置有另一导电电极板122。这样的设计，可以使导电电极板122与导电电极板120共平面，由此，LED组件100a放置上可以比较稳固，能避免运送或处理过程中翻落而造成的损害。在此实施例中，导电电极板122可以为电路上的浮接，没有电连接到LED组件100a中任何的电子元件、电路、或是其他电极板，因为其主要目的是使LED组件100a可以放置平稳。Figure 2B shows a bottom view of the LED assembly 100a. As shown in FIG. 2B , no LED chips are disposed on the lower surface 104 . On the lower surface 104 close to the terminal 114, there is another conductive electrode plate 120, a part of which overlaps with the through hole 107, and directly contacts the conductive objects in the through hole to be electrically connected to each other. In another embodiment, the conductive electrode plate 120 may not be directly connected to the via hole 107 , but may be electrically connected to the via hole 107 through another conductor, such as a bonding wire 110 . On the lower surface 104 near the terminal 116, another conductive electrode plate 122 may optionally be provided. Such a design can make the conductive electrode plate 122 and the conductive electrode plate 120 coplanar, so that the LED assembly 100a can be placed stably, and damage caused by falling over during transportation or handling can be avoided. In this embodiment, the conductive electrode plate 122 may be a floating connection on the circuit, not electrically connected to any electronic components, circuits, or other electrode plates in the LED assembly 100a, since its main purpose is to allow the LED assembly 100a to be placed smooth.
如同图2A与图2B的实施例所示，导电电极板120与118的边界位于下表面104与上表面102之内，也就是大致不超过下表面104与上表面102的边界。导电电极板120、118与122的形状不需约为长方形，大小也不需大致相同。在另一个实施例中，导电电极板120与118其中之一大致是长方形，另一大致是圆形，以方便识别出LED组件100a的正负极。As shown in the embodiment of FIGS. 2A and 2B , the boundary between the conductive electrode plates 120 and 118 is located within the lower surface 104 and the upper surface 102 , that is, not substantially beyond the boundary between the lower surface 104 and the upper surface 102 . The conductive electrode plates 120, 118 and 122 need not be approximately rectangular in shape, nor do they need to be approximately the same size. In another embodiment, one of the conductive electrode plates 120 and 118 is approximately rectangular, and the other is approximately circular, so as to facilitate the identification of the positive and negative electrodes of the LED assembly 100a.
从电性上来看，蓝光LED芯片108以及导通孔107串接于导电电极板120与118之间。导电电极板120与118可以做为LED组件100a的两个电源输入端。一驱动电源(未显示)的正电源端与负电源端可以分别电连接到导电电极板120与118，以驱动蓝光LED芯片108，使其发光。From an electrical point of view, the blue LED chip 108 and the via hole 107 are connected in series between the conductive electrode plates 120 and 118 . The conductive electrode plates 120 and 118 can be used as two power input terminals of the LED assembly 100a. The positive power terminal and the negative power terminal of a driving power supply (not shown) can be electrically connected to the conductive electrode plates 120 and 118, respectively, to drive the blue LED chip 108 to emit light.
图3A图3A显示图2A中LED组件100a的AA剖面示意图；而图3B图3B为图2A中LED组件100a的BB剖面示意图。3A and FIG. 3A are schematic cross-sectional views along AA of the LED assembly 100 a in FIG. 2A ; and FIGS. 3B and 3B are schematic cross-sectional views along BB of the LED assembly 100 a in FIG. 2A .
与现有所述类似的，在图3A图3A中，蓝光LED芯片108b通过一焊线110电连接到导通孔107，其连接到下表面104的导电电极板120；在图3B图3B中，蓝光LED芯片108a通过另一焊线110电连接到上表面102上的导电电极板118。图4显示LED组件100设置于一灯泡中，灯泡包含一灯罩180、LED组件100、电路板192、散热机构182、及电连接机构183(例如：爱迪生灯座)。LED组件100的终端114固定在电路板192上；电路板192与散热机构182相连接，用以将LED组件100所产生的热带离灯泡；电连接机构183与散热机构182相连接。因为用来驱动蓝光LED芯片108a的导电电极板120与118分别位于透明基板106的同一终端114侧的上表面102与下表面104，所以可以用焊锡之类的导电体，将导电电极板120与118同时焊接于一电路板上，如同图5A所示。焊锡190不但可以提供驱动电源的电连接使LED组件100发光，也同时提供机械性支撑给终端114，使LED组件100垂直站立于电路板192上向四周围发光，可提供全周光的光场。在图5A中，LED组件100仅仅靠焊锡190的机构支撑，即可大致垂直的站立于电路板192上，电路板192同时通过焊锡190对LED组件100供电。图5B是用金属夹片194所构成的夹子，把LED组件100夹住而大约垂直地固定于电路板192上。金属夹片194同时提供供电电源以及机构固定两个功能，也可以达到降低制作流程复杂度与成本的效果。惟，LED组件100也可以非垂直方式斜插于电路板192上。Similar to the prior art, in FIG. 3A and FIG. 3A , the blue LED chip 108b is electrically connected to the via hole 107 through a bonding wire 110, which is connected to the conductive electrode plate 120 of the lower surface 104; in FIG. 3B and FIG. 3B , the blue LED chip 108 a is electrically connected to the conductive electrode plate 118 on the upper surface 102 through another bonding wire 110 . FIG. 4 shows that the LED assembly 100 is disposed in a light bulb, and the light bulb includes a lampshade 180 , the LED assembly 100 , a circuit board 192 , a heat dissipation mechanism 182 , and an electrical connection mechanism 183 (eg, an Edison lamp socket). The terminal 114 of the LED assembly 100 is fixed on the circuit board 192; Because the conductive electrode plates 120 and 118 for driving the blue LED chip 108a are located on the upper surface 102 and the lower surface 104 of the same terminal 114 side of the transparent substrate 106, respectively, a conductor such as solder can be used to connect the conductive electrode plate 120 to the same terminal 114 side. 118 is simultaneously soldered to a circuit board, as shown in FIG. 5A. The solder 190 can not only provide the electrical connection of the driving power source to make the LED assembly 100 emit light, but also provide mechanical support to the terminal 114, so that the LED assembly 100 can stand vertically on the circuit board 192 to emit light around, and can provide a light field of full circumference light. . In FIG. 5A , the LED assembly 100 is only supported by the mechanism of the solder 190 , and can stand on the circuit board 192 approximately vertically, and the circuit board 192 supplies power to the LED assembly 100 through the solder 190 at the same time. FIG. 5B is a clip formed by a metal clip 194, which clamps the LED assembly 100 and is fixed to the circuit board 192 approximately vertically. The metal clip 194 simultaneously provides two functions of power supply and mechanism fixing, and can also achieve the effect of reducing the complexity and cost of the manufacturing process. However, the LED assembly 100 can also be obliquely inserted on the circuit board 192 in a non-vertical manner.
在图3A的实施例中，上表面102的导通孔107所在位置上，可设置有一垂直导通元件130，作为导通孔107与一焊线110之间的电连接。举例来说，垂直导通元件130为一pn接面二极管(例如：垂直型发光二极管、萧基二极管或稽纳二极管)、电阻、或是一金属块，以导电银胶粘着于导通孔107上。在另一实施例中，垂直导通元件130与导电银胶可以省略，而一焊线110可以直接接触导通孔107，产生电连接。In the embodiment of FIG. 3A , a vertical conductive element 130 may be disposed at the position of the via hole 107 on the upper surface 102 as an electrical connection between the via hole 107 and a bonding wire 110 . For example, the vertical conduction element 130 is a pn junction diode (such as a vertical light emitting diode, a Schocky diode or a Zener diode), a resistor, or a metal block, which is adhered to the via hole with conductive silver glue 107 on. In another embodiment, the vertical conduction element 130 and the conductive silver paste may be omitted, and a bonding wire 110 may directly contact the via hole 107 to generate electrical connection.
图3A与图3B中，每个蓝光LED芯片108下有一透明粘着层132，用以将蓝光LED芯片108固着于透明基板106的上表面102上。在图3A与图3B中，每个蓝光LED芯片108下有相对应的一透明粘着层132，彼此为一对一的关系，但本发明不限于此。在一实施例中，上表面102上有数个透明粘着层132，且每个透明粘着层132上粘着有数个蓝光LED芯片108；在另一个实施例中，上表面102上只有单一一个透明粘着层132，其上承载了所有的蓝光LED芯片108。透明粘着层132面积越大，对其上的蓝光LED芯片108散热效果越好，但是却可能产生因为热膨胀系数差异所造成的应力(shear)越大的缺点。因此，透明粘着层132的面积大小，以及承载蓝光LED芯片108的数量，可视实际应用而定。在一实施例中，透明粘着层132中混合有一些高导热系数的导热颗粒，譬如说氧化铝粉、类钻碳(diamond-like carbon)、或碳化硅(SiC)，其导热系数大于20W/mK，除了可以提高散热效果外，也可以有光散射的效应。In FIGS. 3A and 3B , there is a transparent adhesive layer 132 under each blue LED chip 108 for fixing the blue LED chip 108 on the upper surface 102 of the transparent substrate 106 . In FIGS. 3A and 3B , there is a corresponding transparent adhesive layer 132 under each blue LED chip 108 , which is in a one-to-one relationship with each other, but the invention is not limited thereto. In one embodiment, there are several transparent adhesive layers 132 on the upper surface 102 , and each transparent adhesive layer 132 is adhered with several blue LED chips 108 ; in another embodiment, there is only a single transparent adhesive layer on the upper surface 102 132, on which all blue LED chips 108 are carried. The larger the area of the transparent adhesive layer 132 is, the better the heat dissipation effect of the blue LED chips 108 thereon is, but it may cause the disadvantage of greater shear caused by the difference in thermal expansion coefficient. Therefore, the size of the area of the transparent adhesive layer 132 and the number of the blue LED chips 108 carrying the blue light can be determined according to practical applications. In one embodiment, the transparent adhesive layer 132 is mixed with some thermally conductive particles with high thermal conductivity, such as alumina powder, diamond-like carbon, or silicon carbide (SiC), the thermal conductivity of which is greater than 20W/ mK, in addition to improving the heat dissipation effect, can also have the effect of light scattering.
图3A与图3B中，透明粘着层132的材料，举例来说，可以是环氧树酯(epoxy resin)或是硅胶(silicone)，并混合有跟透明胶体112中相同、类似或相异的荧光粉。举例来说，荧光粉可以是YAG或是TAG荧光粉。如同先前所述的，具有荧光粉的透明胶体112覆盖住焊线110与蓝光LED芯片108的四周与上方，而透明粘着层132位于蓝光LED芯片108的下方。换句话说，每个蓝光LED芯片108不只是被透明胶体112以及透明粘着层132所包夹，也大致上完全被透明胶体112以及透明粘着层132所形成的一透明封装体(capsule)所包裹。蓝光LED芯片108所发出的蓝光，不是被荧光粉转换成黄绿光，就是跟黄绿光混合。因此，图3A与图3B中的LED组件100a，可以防止蓝光外漏的问题。In FIG. 3A and FIG. 3B , the material of the transparent adhesive layer 132 can be, for example, epoxy resin or silicone, and mixed with the same, similar or different materials of the transparent colloid 112 . phosphor. For example, the phosphor can be YAG or TAG phosphor. As previously described, the transparent colloid 112 with phosphors covers the surrounding and above the bonding wires 110 and the blue LED chip 108 , and the transparent adhesive layer 132 is located under the blue LED chip 108 . In other words, each blue LED chip 108 is not only sandwiched by the transparent colloid 112 and the transparent adhesive layer 132 , but also substantially completely encapsulated by a transparent capsule formed by the transparent colloid 112 and the transparent adhesive layer 132 . The blue light emitted by the blue LED chip 108 is either converted into yellow-green light by the phosphor powder, or mixed with the yellow-green light. Therefore, the LED assembly 100a in FIG. 3A and FIG. 3B can prevent the problem of blue light leakage.
图6显示形成图3A与图3B中的LED组件100a的制作工艺方法。首先，提供一透明基板106。透明基板106上预先形成有导通孔107(步骤148)。举例来说，可以用激光光从玻璃材质的透明基板106熔出一通孔，然后在通孔中填入导电物来形成导通孔107。步骤150预切透明基板106。在透明基板106上先形成一些沟槽，大略地预先定义了每个LED组件100在透明基板106上的位置，以方便之后的裁切。步骤152将导电电极板118与120分别贴附在透明基板106，靠近终端114的上表面102与下表面104的位置上。如果有导电电极板112的话，步骤152也将其形成在透明基板106上。在另一实施例中，导电电极板是用印刷的方式形成于上表面102或下表面104上。步骤154于上表面102形成具有荧光粉的透明粘着层132，其位置先设计好以放置蓝光LED芯片108于其上。透明粘着层132的形成方法，举例来说，可以用点胶、印刷或是喷涂的方式，将透明粘着层132形成在上表面102上。FIG. 6 shows a fabrication process for forming the LED device 100a of FIGS. 3A and 3B . First, a transparent substrate 106 is provided. Via holes 107 are formed in advance on the transparent substrate 106 (step 148). For example, the through hole 107 can be formed by melting a through hole from the transparent substrate 106 made of glass material by laser light, and then filling the through hole with a conductive material. Step 150 precuts the transparent substrate 106 . Some grooves are first formed on the transparent substrate 106 to roughly predefine the position of each LED assembly 100 on the transparent substrate 106 to facilitate subsequent cutting. In step 152 , the conductive electrode plates 118 and 120 are respectively attached to the transparent substrate 106 at positions close to the upper surface 102 and the lower surface 104 of the terminal 114 . Step 152 also forms the conductive electrode plate 112 on the transparent substrate 106, if present. In another embodiment, the conductive electrode plate is formed on the upper surface 102 or the lower surface 104 by printing. In step 154, a transparent adhesive layer 132 with phosphor powder is formed on the upper surface 102, and the position of the transparent adhesive layer 132 is first designed to place the blue LED chip 108 thereon. For the method of forming the transparent adhesive layer 132 , for example, the transparent adhesive layer 132 can be formed on the upper surface 102 by dispensing, printing or spraying.
步骤155将蓝光LED芯片108固着于透明粘着层132上。举例来说，可用真空吸嘴将蓝光LED芯片108自蓝膜(blue tape)上吸起，放置于透明粘着层132上。蓝光LED芯片108的放置位置最好是完全被一透明粘着层132的周边所围绕，亦即，透明粘着层132的面积大于蓝光LED芯片108的面积，以避免蓝光外漏的问题。垂直导通元件130可在此时，用导电银胶粘着于上表面102的导通孔107上。步骤156形成焊线110，来电连接一蓝光LED芯片108到另一蓝光LED芯片108、蓝光LED芯片108a到导电电极板118、以及蓝光LED芯片108b到垂直导通元件130。步骤157可以用点胶(dispense)或是印刷方式，将具有荧光粉的透明胶体112形成在上表面102上，覆盖住焊线110与蓝光LED芯片108。步骤158可以用人工扳裂或是机器切割的方式沿着先前预形成的沟槽，将一个个LED组件100独立出来。Step 155 is to fix the blue LED chip 108 on the transparent adhesive layer 132 . For example, the blue LED chip 108 can be sucked up from the blue tape by a vacuum nozzle and placed on the transparent adhesive layer 132 . The placement position of the blue LED chip 108 is preferably completely surrounded by the periphery of a transparent adhesive layer 132 , that is, the area of the transparent adhesive layer 132 is larger than that of the blue LED chip 108 to avoid the problem of blue light leakage. The vertical conduction element 130 may be adhered to the via hole 107 on the upper surface 102 by using conductive silver glue at this time. Step 156 forms bonding wires 110 that electrically connect one blue LED chip 108 to another blue LED chip 108 , blue LED chip 108 a to conductive electrode plate 118 , and blue LED chip 108 b to vertical conductive element 130 . In step 157 , a transparent colloid 112 with phosphor powder can be formed on the upper surface 102 by dispensing or printing, covering the bonding wires 110 and the blue LED chips 108 . In step 158 , the LED assemblies 100 can be separated out along the previously pre-formed grooves by manual cracking or machine cutting.
从图6的制作工艺方法可知，在LED组件的形成过程中，除了形成导电电极板120或122于下表面104之外，其他的步骤大致都是针对上表面102进行处理。因为下表面104仅有导电电极板这样大面积，且不容易被刮伤的图案，所以制作工艺载具可以用吸附或是持守住下表面104的方式，来搬运或是固定透明基板106，以避免位于上表面102上的细腻结构受到摩擦、刮伤等机械应力所产生的伤害。制作工艺良率可以相当地提升。It can be seen from the manufacturing process in FIG. 6 that in the process of forming the LED component, except for forming the conductive electrode plate 120 or 122 on the lower surface 104 , other steps are generally performed on the upper surface 102 . Because the lower surface 104 only has a large area such as a conductive electrode plate and is not easily scratched, the manufacturing process carrier can use the method of adsorbing or holding the lower surface 104 to transport or fix the transparent substrate 106 to The delicate structures on the upper surface 102 are prevented from being damaged by mechanical stress such as friction and scratches. The manufacturing process yield can be considerably improved.
在图3A、图3B与图6中的实施例中，蓝光LED芯片108的发光方向并没有受到任何的限制。对下方而言，蓝光LED芯片108可以通过透明粘着层132以及透明基板106，而提供混成的光线；对四周以及上方而言，通过透明胶体112，蓝光LED芯片108也可以提供混成的光线。因此，LED组件100a可视为一种可以提供六面发光的发光元件，而图4中有LED组件100的灯泡，则可视为一种全周光(Omnidirectional)照明装置。In the embodiments shown in FIGS. 3A , 3B and 6 , the light-emitting direction of the blue LED chip 108 is not limited in any way. For the lower side, the blue LED chip 108 can provide mixed light through the transparent adhesive layer 132 and the transparent substrate 106; for the surrounding and the upper side, the blue LED chip 108 can also provide mixed light through the transparent colloid 112. Therefore, the LED assembly 100a can be regarded as a light-emitting element that can provide six-sided lighting, and the light bulb with the LED assembly 100 in FIG. 4 can be regarded as an omnidirectional lighting device.
在图2A、图2B、图3A与图3B中，蓝光LED芯片108是直接用透明粘着层132粘着于透明基板106上，但本发明并不限于此。图7A与图7B分别显示，在另一个实施例中，LED组件100b的上视图与下视图。LED组件100b的二剖面图则显示于图8A与图8B。图9显示LED组件100b的制作工艺方法。图7A、图7B、图8A、图8B与图9分别类似与对应图2A、图2B、图3A、图3B与图6，其中相同的符号或是记号所对应的元件、装置或步骤，为具有类似或是相同的元件、装置或步骤。为简洁故，其解释可能在此说明书中省略。In FIGS. 2A , 2B, 3A and 3B, the blue LED chips 108 are directly adhered to the transparent substrate 106 by the transparent adhesive layer 132, but the present invention is not limited thereto. 7A and 7B respectively show, in another embodiment, a top view and a bottom view of the LED assembly 100b. Two cross-sectional views of the LED device 100b are shown in FIGS. 8A and 8B . FIG. 9 shows a manufacturing process method of the LED assembly 100b. 7A, 7B, 8A, 8B and 9 are respectively similar to and corresponding to FIGS. 2A, 2B, 3A, 3B and 6, wherein the elements, devices or steps corresponding to the same symbols or symbols are have similar or identical elements, devices or steps. For the sake of brevity, its explanation may be omitted in this specification.
不同于图2A，图7A多了一个次基板(submount)160，其放置于透明粘着层132的周边以内，被夹于蓝光LED芯片108与透明粘着层132之间。次基板160的材料可以是透明玻璃、蓝宝石、碳化硅、或类钻碳。跟图3A与图3B不同的，图8A与图8B中的蓝光LED芯片108中的部分或全部是固着于次基板160上，而次基板160以透明粘着层132固着于透明基板106上。Different from FIG. 2A , FIG. 7A has an additional submount 160 , which is placed within the periphery of the transparent adhesive layer 132 and sandwiched between the blue LED chip 108 and the transparent adhesive layer 132 . The material of the sub-substrate 160 may be transparent glass, sapphire, silicon carbide, or diamond-like carbon. Different from FIGS. 3A and 3B , some or all of the blue LED chips 108 in FIGS. 8A and 8B are fixed on the sub-substrate 160 , and the sub-substrate 160 is fixed on the transparent substrate 106 by the transparent adhesive layer 132 .
图9中，步骤154a以及步骤155a分别取代了图6中的步骤154以及步骤155。步骤154a以具有荧光粉的透明粘着层132将次基板160固接于透明基板106上。在一实施例中，透明粘着层132先形成于次基板160的背面，然后次基板160才贴附于透明基板106上；在另一个实施例中，透明粘着层132先涂布形成于透明基板106的上表面102上，然后次基板160才贴附于透明粘着层132上。步骤155a则接着将蓝光LED芯片108固着于次基板160上。In FIG. 9 , steps 154 a and 155 a replace steps 154 and 155 in FIG. 6 , respectively. In step 154a, the sub-substrate 160 is fixed on the transparent substrate 106 with the transparent adhesive layer 132 having phosphor powder. In one embodiment, the transparent adhesive layer 132 is formed on the backside of the sub-substrate 160 first, and then the sub-substrate 160 is attached to the transparent substrate 106 ; in another embodiment, the transparent adhesive layer 132 is first formed by coating on the transparent substrate 106 on the upper surface 102, and then the sub-substrate 160 is attached to the transparent adhesive layer 132. Step 155a is followed by fixing the blue LED chip 108 on the sub-substrate 160 .
图7A、图7B、图8A、图8B与图9中的实施例中，蓝光LED芯片108可以用跟透明粘着层132一样或是类似的材料，固着于次基板160上。但是本发明并不限于此，在一实施例中，蓝光LED芯片108可以用不含荧光粉的透明胶或是共晶金属，固着于次基板160上。在另一个实施例中，次基板160上印刷有导电条，而蓝光LED芯片108以倒装方式(flip chip)方式固着于其上，因此图9中的步骤156可能可以省略，然，蓝光LED芯片108b仍需通过焊线100以和导通孔107电连接；及蓝光LED芯片108a也需通过焊线100以和导电电极板118电连接。在另一个实施例中，蓝光LED芯片108是以异方性(各向异性)导电胶膜(anisotropic conductivefilm，ACF)固着于次基板160上。In the embodiments shown in FIGS. 7A , 7B, 8A, 8B and 9 , the blue LED chip 108 can be fixed on the sub-substrate 160 with the same or similar material as the transparent adhesive layer 132 . However, the present invention is not limited to this. In one embodiment, the blue LED chip 108 can be fixed on the sub-substrate 160 by transparent glue or eutectic metal without phosphor powder. In another embodiment, conductive strips are printed on the sub-substrate 160, and the blue LED chips 108 are fixed thereon in a flip chip manner, so step 156 in FIG. 9 may be omitted. The chip 108b still needs to be electrically connected to the via hole 107 through the bonding wire 100 ; and the blue LED chip 108a also needs to be electrically connected to the conductive electrode plate 118 through the bonding wire 100 . In another embodiment, the blue LED chip 108 is fixed on the sub-substrate 160 by an anisotropic conductive film (anisotropic conductive film, ACF).
图7A、图7B、图8A、图8B与图9中的LED组件100b，享有跟图2A、图2B、图3A、图3B与图6中的LED组件100a一样的好处。举例来说，LED组件100b的终端114可以单单用焊锡固定立在一电路板上并同时地提供驱动电源的电连接；LED组件100b的下表面104比较不怕刮伤，制作工艺良率能有效提升；LED组件100b可以适用于是一全周光照明装置；LED组件100b可以减轻或消弭蓝光漏光的问题。The LED assembly 100b of FIGS. 7A, 7B, 8A, 8B and 9 enjoys the same benefits as the LED assembly 100a of FIGS. 2A, 2B, 3A, 3B and 6 . For example, the terminal 114 of the LED component 100b can be fixed on a circuit board with solder and simultaneously provide electrical connection of the driving power source; the lower surface 104 of the LED component 100b is less prone to scratches, and the manufacturing process yield can be effectively improved ; The LED assembly 100b can be applied to a full-circumference lighting device; the LED assembly 100b can reduce or eliminate the problem of blue light leakage.
图8C与图8D显示LED组件100c的二剖面图，分别为图8A与图8B的变形。LED组件100b(于图8A与图8B中)中采用单一透明粘着层132，将次基板160固着于透明基板106上。跟LED组件100b不同的，LED组件100c(于图8C与图8D中)以两个透明粘着层132与133，将次基板160固着于透明基板106上。至少透明粘着层132与133其中之一包含有荧光粉。在图8C与图8D的实施例中，透明粘着层132具有荧光粉，而透明粘着层133没有。透明粘着层133的材料，举例来说，可以是环氧树酯(epoxy resin)或是硅胶(silicone)。因为透明粘着层133没有荧光粉，所以能够提供比较好的粘着效果，附着于透明基板106上。透明粘着层132、133可为相同或不同的材料。在另一实施例中，次基板160与透明粘着层132之间也可形成另一透明粘着层133于其中，以增加相互之间的粘着性。8C and 8D show two cross-sectional views of the LED assembly 100c, which are the modifications of FIGS. 8A and 8B, respectively. A single transparent adhesive layer 132 is used in the LED assembly 100b (in FIGS. 8A and 8B ) to attach the sub-substrate 160 to the transparent substrate 106 . Different from the LED assembly 100b, the LED assembly 100c (in FIGS. 8C and 8D ) uses two transparent adhesive layers 132 and 133 to fix the sub-substrate 160 on the transparent substrate 106 . At least one of the transparent adhesive layers 132 and 133 contains phosphor. In the embodiments of FIGS. 8C and 8D , the transparent adhesive layer 132 has phosphors, but the transparent adhesive layer 133 does not. The material of the transparent adhesive layer 133 can be, for example, epoxy resin or silicone. Because the transparent adhesive layer 133 has no phosphor, it can provide a better adhesive effect and be attached to the transparent substrate 106 . The transparent adhesive layers 132, 133 may be the same or different materials. In another embodiment, another transparent adhesive layer 133 may be formed between the sub-substrate 160 and the transparent adhesive layer 132 to increase mutual adhesion.
图1的发光二极管组件100中的蓝光LED芯片108彼此是通过焊线110彼此电连接，但本发明不限于此。图10为依据本发明的一实施例的发光二极管组件400的立体示意图，其中的蓝光LED芯片108是以倒装方式固着于上表面102上。图11A与图11B显示LED组件400a的上视图与下视图。图12A显示图11A中LED组件400a的AA剖面示意图；而图12B为图11A中LED组件400a的BB剖面示意图。图10、图11A、图11B、图12A与图12B分别类似与对应图1、图2A、图2B、图3A与图3B，其中相同的符号或是记号所对应的元件、装置或步骤，为具有类似或是相同的元件、装置或步骤。为简洁故，其解释可能在此说明书中省略。The blue LED chips 108 in the light emitting diode assembly 100 of FIG. 1 are electrically connected to each other through bonding wires 110 , but the invention is not limited thereto. 10 is a schematic three-dimensional view of a light emitting diode assembly 400 according to an embodiment of the present invention, wherein the blue LED chip 108 is fixed on the upper surface 102 by flip-chip. 11A and 11B show top and bottom views of the LED assembly 400a. 12A is a schematic cross-sectional view along AA of the LED assembly 400a in FIG. 11A; and FIG. 12B is a schematic cross-sectional view at BB of the LED assembly 400a in FIG. 11A. 10, 11A, 11B, 12A and 12B are respectively similar to and corresponding to FIG. 1, FIG. 2A, FIG. 2B, FIG. 3A and FIG. 3B, wherein the elements, devices or steps corresponding to the same symbols or symbols are have similar or identical elements, devices or steps. For the sake of brevity, its explanation may be omitted in this specification.
图12A与图12B相异于图3A图3A与图3B，在于图12A与图12B中，透明基板106上印刷有导电条402，且蓝光LED芯片108彼此是通过导电条402相电连接。所以图12A与图12B中的蓝光LED芯片108对于四周以及上下方而言，都可以发出光线，因此LED组件400a可视为一种可以提供六面发光的发光元件。图12C显示另LED组件400b，其中的下表面104上涂布有一荧光层131，荧光层131中具有荧光粉，可将蓝光LED芯片108所发出的光线，转换成另一种颜色的光线。如此，可以降低从下表面104泄漏蓝光的机会。在另一实施例中，LED组件400a中的蓝光LED芯片108可以用白光LED芯片取代，每个白光LED芯片基本上为表面形成有一荧光层的一蓝光LED芯片。如此，可以避免蓝光外漏的问题。FIGS. 12A and 12B are different from FIGS. 3A and 3A and 3B. In FIGS. 12A and 12B , conductive strips 402 are printed on the transparent substrate 106 , and the blue LED chips 108 are electrically connected to each other through the conductive strips 402 . Therefore, the blue LED chip 108 shown in FIGS. 12A and 12B can emit light from the surrounding area as well as the upper and lower sides, so the LED assembly 400a can be regarded as a light-emitting element that can provide six-sided light emission. 12C shows another LED assembly 400b, wherein a phosphor layer 131 is coated on the lower surface 104, and the phosphor layer 131 has phosphor powder, which can convert the light emitted by the blue LED chip 108 into light of another color. In this way, the chance of blue light leaking from the lower surface 104 can be reduced. In another embodiment, the blue LED chips 108 in the LED assembly 400a can be replaced with white LED chips, and each white LED chip is basically a blue LED chip with a phosphor layer formed on the surface. In this way, the problem of blue light leakage can be avoided.
尽管前面实施例中的LED组件100a与100b都具有导通孔107，作为一线路的一部分，使透明基板106的上下表面102与104上的导电电极板120与118可以作为LED组件100a与100b的二驱动电源输入端，但本发明不限于一定要有导通孔。Although the LED assemblies 100a and 100b in the previous embodiments have the via holes 107, as part of a circuit, the conductive electrode plates 120 and 118 on the upper and lower surfaces 102 and 104 of the transparent substrate 106 can be used as the LED assemblies 100a and 100b. Two drive power input terminals, but the present invention is not limited to having a via hole.
图13显示依据本发明的一实施例的LED组件200的立体示意图。图14与图15分别为LED组件200a的一上视图与一侧面图。跟LED组件100a与100b不同的，图14与图15中的LED组件200a在透明基板106的上表面102的两终端114与116，分别形成有导电电极板118以及119。LED组件200a中，导电电极板118以及119有部分跨出或延伸超过透明基板106的二终端114、116。而且，LED组件200a并没有导通孔107。图13、图14与图15中的LED组件200或200a的制造方法与步骤可以参考前述说明推知，故不再累述。FIG. 13 shows a schematic perspective view of an LED assembly 200 according to an embodiment of the present invention. 14 and 15 are a top view and a side view of the LED assembly 200a, respectively. Different from the LED assemblies 100a and 100b, the LED assembly 200a in FIGS. 14 and 15 has conductive electrode plates 118 and 119 formed on the two terminals 114 and 116 of the upper surface 102 of the transparent substrate 106, respectively. In the LED assembly 200 a, the conductive electrode plates 118 and 119 have two terminals 114 and 116 that partially extend out or extend beyond the transparent substrate 106 . Moreover, the LED assembly 200a does not have the via hole 107 . The manufacturing method and steps of the LED assembly 200 or 200 a in FIGS. 13 , 14 and 15 can be inferred with reference to the foregoing description, and thus will not be described again.
在LED组件200a中，每个蓝光LED芯片108下有单一相对应的透明粘着层132，但本发明不限于此。如同先前所描述的，在其他的实施例中，许多个蓝光LED芯片108可以共用一透明粘着层132，或是所有的蓝光LED芯片108只通过一透明粘着层132粘着于透明基板106上。In the LED assembly 200a, there is a single corresponding transparent adhesive layer 132 under each blue LED chip 108, but the invention is not limited thereto. As previously described, in other embodiments, a plurality of blue LED chips 108 may share a transparent adhesive layer 132 , or all blue LED chips 108 may be adhered to the transparent substrate 106 only through a transparent adhesive layer 132 .
图16与图17显示另一LED组件200b，其与图14与图15中的LED组件200a类似，但图16与图17中的每个蓝光LED芯片108是固着于一次基板160上，而次基板160是通过透明粘着层132固着于透明基板106上。LED组件200b中的细节，可以参考图8A以及图8B中的LED组件100b以及相关描述而推知，不再累述。FIGS. 16 and 17 show another LED assembly 200b, which is similar to the LED assembly 200a in FIGS. 14 and 15, but each blue LED chip 108 in FIGS. 16 and 17 is fixed on the primary substrate 160, while the second The substrate 160 is fixed on the transparent substrate 106 by the transparent adhesive layer 132 . The details of the LED assembly 200b can be inferred with reference to the LED assembly 100b in FIG. 8A and FIG. 8B and related descriptions, and will not be described again.
图18显示另一LED组件200c的侧视图。图19则显示LED组件200c的一种制作工艺方法。图18与图17近似，图18的上视图可与图16相似，图19与图9近似，其中相同之处不再累述。与图17不同的，在图18中，导电电极板118以及119是贴附于透明粘着层132上。图19中的制作工艺方法，在步骤150与152之间插有步骤151，其涂布透明粘着层132于透明基板106上。换言之，透明粘着层132的形成，可以在导电电极板118以及119贴附之前就进行。透明粘着层132可以是环氧树酯(epoxy resin)或是硅胶(silicone)，并混合有跟透明胶体112中相同或是类似的荧光粉。举例来说，荧光粉可以是YAG或是TAG荧光粉。Figure 18 shows a side view of another LED assembly 200c. FIG. 19 shows a manufacturing process of the LED assembly 200c. FIG. 18 is similar to FIG. 17 , the top view of FIG. 18 may be similar to that of FIG. 16 , and FIG. 19 is similar to FIG. 9 , and the same points will not be repeated. Different from FIG. 17 , in FIG. 18 , the conductive electrode plates 118 and 119 are attached to the transparent adhesive layer 132 . In the manufacturing method shown in FIG. 19 , a step 151 is inserted between the steps 150 and 152 , which coats the transparent adhesive layer 132 on the transparent substrate 106 . In other words, the formation of the transparent adhesive layer 132 can be performed before the conductive electrode plates 118 and 119 are attached. The transparent adhesive layer 132 can be epoxy resin or silicone, and mixed with the same or similar phosphors as in the transparent colloid 112 . For example, the phosphor can be YAG or TAG phosphor.
图17与图18中的LED组件200b与200c是采用单一透明粘着层132，将次基板160固着于透明基板106上。但本发明并不限于此。在其他实施例中，LED组件200b与200c可以被改变，采用图8C与图8D中的两层透明粘着层132与133，将次基板160固着于透明基板106上。在另一实施例中，次基板160与透明粘着层132之间也可形成另一透明粘着层133于其中，以增加相互之间的粘着性。The LED assemblies 200b and 200c in FIGS. 17 and 18 use a single transparent adhesive layer 132 to fix the sub-substrate 160 on the transparent substrate 106 . However, the present invention is not limited to this. In other embodiments, the LED assemblies 200b and 200c can be modified to use the two transparent adhesive layers 132 and 133 in FIGS. 8C and 8D to attach the sub-substrate 160 to the transparent substrate 106 . In another embodiment, another transparent adhesive layer 133 may be formed between the sub-substrate 160 and the transparent adhesive layer 132 to increase mutual adhesion.
LED组件200a、200b与200c的下表面104完全没有图案，完全没有下表面104刮伤的问题。LED组件200a、200b与200c一样可以适用于全周光光场的应用，且较无蓝光漏光问题。举例来说，一灯泡可以用焊锡或是导电夹具，来固定LED组件200a、200b或200c中，位于两终端114与116的导电电极板118以及119，并同时通过此二电极板提供驱动电源的电连接。The lower surfaces 104 of the LED assemblies 200a, 200b and 200c have no patterns at all, and there is no problem of scratches on the lower surfaces 104 at all. Like 200c, the LED assemblies 200a and 200b can be applied to the application of the full-circumferential light field, and there is no problem of blue light leakage. For example, a light bulb can use solder or a conductive clamp to fix the conductive electrode plates 118 and 119 located at the two terminals 114 and 116 in the LED components 200a, 200b or 200c, and at the same time provide the driving power through the two electrode plates. electrical connection.
图20显示本发明的另一实施例的LED组件300的立体示意图。图21A与图21B显示一LED组件300a的上视图与下视图。图22显示LED组件300a的一剖面图。LED组件300a在透明基板106的下表面104的两终端114与116，分别形成有导电电极板120以及122。在图21A、图21B与图22中，LED组件300a具有两导通孔107A、107B分别形成在靠近终端114、116的位置。导电电极板120通过导通孔107A，而导电电极板122通过导通孔107B，电连接到位于上表面102的蓝光LED芯片108。蓝光LED芯片108设置并电性地连接于导通孔107A与107B之间，也设置并电连接于导电电极板120以及122之间。LED组件300a中的细节与可能的变化，可以参考此说明书中其他实施例的描述而推知，不再累述。FIG. 20 shows a schematic perspective view of an LED assembly 300 according to another embodiment of the present invention. 21A and 21B show top and bottom views of an LED assembly 300a. FIG. 22 shows a cross-sectional view of the LED assembly 300a. Conductive electrode plates 120 and 122 are formed on the two terminals 114 and 116 of the lower surface 104 of the transparent substrate 106 of the LED assembly 300 a, respectively. In FIGS. 21A , 21B and 22 , the LED assembly 300 a has two conductive holes 107A and 107B formed at positions close to the terminals 114 and 116 , respectively. The conductive electrode plate 120 passes through the through hole 107A, and the conductive electrode plate 122 passes through the through hole 107B, and is electrically connected to the blue LED chip 108 located on the upper surface 102 . The blue LED chip 108 is disposed and electrically connected between the conductive holes 107A and 107B, and is also disposed and electrically connected between the conductive electrode plates 120 and 122 . The details and possible changes in the LED assembly 300a can be inferred with reference to the descriptions of other embodiments in this specification, and will not be repeated here.
图23显示LED组件300b的一侧面图。其中，次基板160夹于蓝光LED芯片108与透明粘着层132之间。LED组件300b中的细节与可能的变化，可以参考此说明书中其他实施例的描述而推知，不再累述。Figure 23 shows a side view of the LED assembly 300b. The sub-substrate 160 is sandwiched between the blue LED chip 108 and the transparent adhesive layer 132 . The details and possible changes in the LED assembly 300b can be inferred by reference to the descriptions of other embodiments in this specification, and will not be repeated here.
尽管在LED组件200与300中，位于两终端的导电电极板有部分跨出或延伸超过透明基板106的二终端114、116，但本发明不限于此。图24显示LED组件600的立体示意图。图25A显示LED组件600a，其为LED组件600的一种可能的上视图。在图25A中，导电电极板118以及119都有一边与透明基板106的边缘切齐。图25B显示LED组件600b，其为LED组件600的另一种可能的上视图。在图25B中，导电电极板118以及119完全坐落于透明基板106之内。Although in the LED assemblies 200 and 300 , the conductive electrode plates located at the two terminals partially span or extend beyond the two terminals 114 and 116 of the transparent substrate 106 , the invention is not limited thereto. FIG. 24 shows a schematic perspective view of the LED assembly 600 . FIG. 25A shows LED assembly 600a, which is one possible top view of LED assembly 600. FIG. In FIG. 25A , one edge of the conductive electrode plates 118 and 119 is cut flush with the edge of the transparent substrate 106 . FIG. 25B shows LED assembly 600b, which is another possible top view of LED assembly 600. FIG. In FIG. 25B , the conductive electrode plates 118 and 119 are completely seated within the transparent substrate 106 .
图26A显示以LED组件300作为一灯蕊的LED灯泡500a。LED灯泡500a有两个夹具502。夹具502可为V型或Y型。在一实施例中，夹具502可为长方形且具有一凹槽，用以固定LED组件300。每个夹具502皆以导电物所构成，用夹具502的两个尖端，箝制固定LED组件300两终端的导电电极板，并使LED组件300的上表面102朝上(Z的方向)。夹具502也使LED组件300两端的导电电极板电连接到LED灯泡500a的爱迪生灯座，以提供LED组件300发光需要的电能。图26B类似图26A，但以LED组件600作为一灯蕊的LED灯泡500b。与LED灯泡500a不同的，LED灯泡500b中LED组件600的上表面102朝向Y的方向，大致跟LED灯泡500b的旋转轴(Z方向)垂直。当然的，图26A与图26B中的LED组件300或600，都可以用先前所介绍的LED组件200替换，其细节与可能的变化，可以参考此说明书中其他实施例的描述而推知，不再累述。FIG. 26A shows an LED bulb 500a with the LED assembly 300 as a core. The LED light bulb 500a has two fixtures 502 . The clamp 502 may be V-shaped or Y-shaped. In one embodiment, the clamp 502 can be rectangular and has a groove for fixing the LED assembly 300 . Each jig 502 is made of a conductive material. The two tips of the jig 502 are used to clamp and fix the conductive electrode plates at the two terminals of the LED assembly 300 , and make the upper surface 102 of the LED assembly 300 face upward (Z direction). The fixture 502 also electrically connects the conductive electrode plates at both ends of the LED assembly 300 to the Edison socket of the LED bulb 500a, so as to provide the electric power required by the LED assembly 300 to emit light. FIG. 26B is similar to FIG. 26A, but uses the LED assembly 600 as an LED bulb 500b with a core. Different from the LED bulb 500a, the upper surface 102 of the LED assembly 600 in the LED bulb 500b faces the Y direction, which is substantially perpendicular to the rotation axis (Z direction) of the LED bulb 500b. Of course, the LED assembly 300 or 600 in FIG. 26A and FIG. 26B can be replaced with the previously introduced LED assembly 200. The details and possible changes can be inferred by referring to the descriptions of other embodiments in this specification, and no longer Tired.
LED组件300a与300b的下表面104只有大面积、不太惧怕刮伤的导电电极板120以及122，制作工艺良率可以获得相当的改善。LED组件600a与600b的下表面104完全没有图案，更不怕刮伤。LED组件300a、300b、600a与600b一样可以适用于全周光光场的应用、较无蓝光漏光问题。The lower surfaces 104 of the LED components 300a and 300b only have large conductive electrode plates 120 and 122 that are not afraid of scratches, and the manufacturing process yield can be considerably improved. The lower surfaces 104 of the LED assemblies 600a and 600b have no patterns at all, and are not afraid of being scratched. Like 600b, the LED assemblies 300a, 300b, 600a can be applied to the application of the full-circumferential light field, and there is no problem of blue light leakage.
尽管以上的实施例都采用蓝光LED芯片108作为光源，但本发明不限于此。在其他实施例中，有一些或是全部的LED芯片并不是蓝光，而是红光或是绿光。Although the above embodiments all use the blue LED chip 108 as the light source, the present invention is not limited thereto. In other embodiments, some or all of the LED chips are not blue, but red or green.
本发明的一些实施例，因为有透明基板106与透明粘着层132的存在，可以朝四面八方发光，所以可适用于全周光的应用。在一些实施例中，所有的蓝光LED芯片108都大致被透明粘着层132以及透明胶体112所包裹，所以没有蓝光漏光问题。一些实施例中的LED组件可以只要固定一终端就可以同时接受电源供电以及机构支撑；一些实施例中的LED组件可以在机构地固定两终端时，同时从两终端接受电源供电；一些实施例中的LED组件的下表面没有细致图案或是电路，比较不怕刮伤，可以方便制造过程中的拿取或固定，提高制作工艺良率。Some embodiments of the present invention, because of the existence of the transparent substrate 106 and the transparent adhesive layer 132, can emit light in all directions, so it can be applied to the application of all-round light. In some embodiments, all blue LED chips 108 are substantially surrounded by the transparent adhesive layer 132 and the transparent colloid 112, so there is no problem of blue light leakage. The LED assembly in some embodiments can receive power supply and mechanical support at the same time as long as one terminal is fixed; the LED assembly in some embodiments can simultaneously receive power supply from two terminals when two terminals are mechanically fixed; in some embodiments There are no detailed patterns or circuits on the lower surface of the LED components, so it is less afraid of scratches, which can be easily taken or fixed during the manufacturing process and improve the yield of the manufacturing process.
以上所述仅为本发明的数个实施例，而各个实施例在彼此不相冲突下当可以彼此参照、合并或替换，凡依本发明权利要求所做的均等变化与修饰，皆应属本发明的涵盖范围。The above descriptions are only a few embodiments of the present invention, and each embodiment can be referred to, combined or replaced with each other as long as they do not conflict with each other. All equivalent changes and modifications made according to the claims of the present invention shall belong to the present invention. Scope of Invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910613609.9ACN110350064A (en) | 2013-07-01 | 2013-07-01 | Light-emitting diode component and production method |
| Application Number | Priority Date | Filing Date | Title |
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| CN201910613609.9ACN110350064A (en) | 2013-07-01 | 2013-07-01 | Light-emitting diode component and production method |
| CN201310272229.6ACN104282817B (en) | 2013-07-01 | 2013-07-01 | Light emitting diode assembly and manufacturing method thereof |
| Application Number | Title | Priority Date | Filing Date |
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| CN201310272229.6ADivisionCN104282817B (en) | 2013-07-01 | 2013-07-01 | Light emitting diode assembly and manufacturing method thereof |
| Publication Number | Publication Date |
|---|---|
| CN110350064Atrue CN110350064A (en) | 2019-10-18 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910613684.5APendingCN110335932A (en) | 2013-07-01 | 2013-07-01 | Light Emitting Diode Assembly and Manufacturing Method |
| CN201310272229.6AActiveCN104282817B (en) | 2013-07-01 | 2013-07-01 | Light emitting diode assembly and manufacturing method thereof |
| CN201910613609.9APendingCN110350064A (en) | 2013-07-01 | 2013-07-01 | Light-emitting diode component and production method |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910613684.5APendingCN110335932A (en) | 2013-07-01 | 2013-07-01 | Light Emitting Diode Assembly and Manufacturing Method |
| CN201310272229.6AActiveCN104282817B (en) | 2013-07-01 | 2013-07-01 | Light emitting diode assembly and manufacturing method thereof |
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