技术领域technical field
本发明属于电子器件散热技术领域，具体涉及一种大功率芯片封闭式液态金属二回路冷却系统。The invention belongs to the technical field of heat dissipation of electronic devices, and in particular relates to a high-power chip closed-type liquid metal secondary circuit cooling system.
背景技术Background technique
随着当代科技创新技术进程日益加快，目前能达到的冷却技术与相应的散热系统已经愈发不能满足高容量、大功率、小体积的电子器件发展需求，电子器件在高热流密度以及过热工况下无法有良好的冷却，这种热障问题甚至已经限制了大功率微电子领域的进一步发展。目前针对大功率电子器件冷却的方式主要为水作为冷却液的普通对流换热及射流换热。但水冷换热需要面临相变沸腾，过热干烧、换热能力有限、需要通过复杂的通道结构进一步提高表面换热系数，同时还有阻力增大，回流导致换热能力减弱等问题。而单纯使用一次冷却液作为冷却液也会面临价格高昂，高热导率、高黏度系数无法与其他冷却系统配合的问题。With the accelerating process of contemporary scientific and technological innovation, the cooling technology and corresponding heat dissipation system that can be achieved at present are increasingly unable to meet the development needs of high-capacity, high-power, and small-volume electronic devices. This thermal barrier problem has even limited the further development in the field of high-power microelectronics. At present, the cooling methods for high-power electronic devices are mainly ordinary convective heat transfer and jet heat transfer with water as the cooling liquid. However, water-cooled heat transfer needs to face phase change boiling, overheating and dry burning, limited heat transfer capacity, and the need to further increase the surface heat transfer coefficient through a complex channel structure. At the same time, there are problems such as increased resistance and weakened heat transfer capacity due to backflow. However, simply using primary coolant as a coolant will also face the problems of high price, high thermal conductivity, and high viscosity coefficient that cannot be matched with other cooling systems.
因此针对大功率电子芯片冷却技术，团队致力于开发一种能满足高热流密度冷却且经济适用、安全可靠、产业化过程简单的一次冷却液冷却系统。Therefore, for high-power electronic chip cooling technology, the team is committed to developing a primary coolant cooling system that can meet high heat flux cooling, is economical, safe and reliable, and has a simple industrialization process.
发明内容Contents of the invention
鉴于目前冷却系统的上述缺陷，本发明的目的在于提出一种大功率芯片封闭式液态金属二回路冷却系统，以缓解目前针对大功率芯片在高热流密度工况下的冷却能力的不足。利用一次冷却液的高热导性，将热量传递给温度更低的二次冷却液，同时通过对二次回路的搅拌作用提升其与外界环境的换热强度，在负载功率发生变化时，可通过改变电磁泵及电机电压的方式调整一次冷却液流速及辐射式搅拌棒组的转速，改变流态，达到可调节的封闭式冷却，换热能力增强，无污染的目的。为保持其工作稳定性，可定期补二次冷却液，价格低廉，稳定性好。In view of the above-mentioned defects of the current cooling system, the purpose of the present invention is to propose a closed-type liquid metal secondary circuit cooling system for high-power chips, so as to alleviate the current shortage of cooling capacity for high-power chips under high heat flux density conditions. Utilize the high thermal conductivity of the primary coolant to transfer heat to the secondary coolant with a lower temperature, and at the same time increase the heat exchange intensity between it and the external environment through the agitation of the secondary circuit. When the load power changes, it can pass through By changing the voltage of the electromagnetic pump and the motor, the flow rate of the primary coolant and the speed of the radiant stirring rod group can be adjusted to change the flow state and achieve the purpose of adjustable closed cooling, enhanced heat exchange capacity, and no pollution. In order to maintain its working stability, the secondary coolant can be replenished regularly, with low price and good stability.
为了实现上述目的，本发明采用如下技术方案：In order to achieve the above object, the present invention adopts the following technical solutions:
一种大功率芯片封闭式液态金属二回路冷却系统，包括一次回路管、一次冷却液、二次冷却管、二次冷却液、适应型感应式电磁泵、直流电机、搅拌棒组、补液盖，所述一次回路管内填充有一次冷却液，一次回路管外壁通过固定套套装有适应型感应式电磁泵，一次回路管与二次冷却管密封连接，二次冷却管内填充有二次冷却液，二次冷却管内腔尾端转动安装有搅拌棒组，二次冷却管尾部外端安装有直流电机，且直流电机输出轴与搅拌棒组固定安装，所述二次冷却管的凸口与补液盖相连。A high-power chip closed-type liquid metal secondary circuit cooling system, including a primary circuit pipe, a primary cooling liquid, a secondary cooling pipe, a secondary cooling liquid, an adaptive induction electromagnetic pump, a DC motor, a stirring rod group, and a liquid replenishment cover, The primary circuit pipe is filled with primary cooling liquid, and the outer wall of the primary circuit pipe is fitted with an adaptive induction electromagnetic pump through a fixed sleeve. The primary circuit pipe is sealed and connected with the secondary cooling pipe, and the secondary cooling pipe is filled with secondary cooling liquid. A stirring rod group is installed at the end of the inner cavity of the secondary cooling tube, and a DC motor is installed at the outer end of the secondary cooling tube, and the output shaft of the DC motor is fixedly installed with the stirring rod group. .
所述搅拌棒组由包括基板和搅拌棒，所述基板通过若干连接臂与圆环内壁固定安装，圆环截面呈矩形，相邻连接臂、圆环及基板围成的孔为扇形孔，在连接臂与圆环的连接处设置有搅拌棒，且相邻搅拌棒相对于连接臂对称设置，所述基板的中心处设置有半圆形凸起，所述半圆形凸起上开设有盲孔。The stirring rod group consists of a base plate and a stirring rod. The base plate is fixedly installed on the inner wall of the ring through several connecting arms. The cross section of the ring is rectangular. Stirring rods are arranged at the connection between the connecting arm and the ring, and the adjacent stirring rods are arranged symmetrically with respect to the connecting arm. A semicircular protrusion is provided at the center of the base plate, and a blind hole is opened on the semicircular protrusion. hole.
所述适应型感应式电磁泵由若干磁极铁芯和若干三相绕组线圈组成，所述若干磁极铁芯沿着周向均匀布置成内孔为椭圆形的结构，沿若干磁极铁芯的轴向按三相顺序循环布置若干三相绕组线圈。The adaptive induction electromagnetic pump is composed of several magnetic pole cores and several three-phase winding coils. The several magnetic pole cores are uniformly arranged along the circumferential direction to form a structure with an elliptical inner hole. Several three-phase winding coils are circularly arranged in three-phase order.
所述一次冷却液为低熔点金属液或低熔点合金溶液，且熔点位于或低于室温。The primary cooling liquid is a low-melting-point metal liquid or a low-melting-point alloy solution, and its melting point is at or below room temperature.
所述凸口外圆面设置有外螺纹，凸口通过螺纹连接补液盖。The outer circular surface of the convex mouth is provided with an external thread, and the convex mouth is connected with the liquid replacement cap through the thread.
所述适应型感应式电磁泵为三相感应式电磁泵。The adaptive induction electromagnetic pump is a three-phase induction electromagnetic pump.
所述补液盖采用抗氧化、耐腐蚀的材料制成。The liquid replenishment cap is made of anti-oxidation and corrosion-resistant materials.
所述固定套由上套体和下套体组成，上套体和下套体通过卡口相连，上套体与下套体结构相同，上套体和下套体的内腔中部设置有三角板，上套体和下套体的两端均对称设置有水平板，固定套采用磁性材料制成。The fixed sleeve is composed of an upper sleeve body and a lower sleeve body, the upper sleeve body and the lower sleeve body are connected by a bayonet, the upper sleeve body and the lower sleeve body have the same structure, and a triangular plate is arranged in the middle of the inner cavity of the upper sleeve body and the lower sleeve body , both ends of the upper sleeve body and the lower sleeve body are symmetrically provided with horizontal plates, and the fixed sleeve is made of magnetic material.
本发明的有益效果为：The beneficial effects of the present invention are:
1、本发明的液态金属二回路冷却系统，弥补了液态金属单一工质冷却的换热困难问题，同时封闭形式也提高了此系统的稳定性，适用范围涵盖了普通家电、工业逆变器以及更大功率的充电桩，仍具有体积小，安装方便的优点。1. The liquid metal secondary circuit cooling system of the present invention makes up for the difficult heat exchange problem of liquid metal single working fluid cooling, and at the same time, the closed form also improves the stability of the system. The scope of application covers ordinary household appliances, industrial inverters and The charging pile with higher power still has the advantages of small size and convenient installation.
2、本发明使用的适应型感应式电磁泵，可在无接触条件下完成对液态金属流速的调控，截面形状与液态金属管截面形状相匹配，同时兼具了电磁泵本身噪声小，易跟随负载调控的优点。2. The adaptive induction electromagnetic pump used in the present invention can complete the control of the liquid metal flow rate without contact, and the cross-sectional shape matches the liquid metal pipe cross-sectional shape. At the same time, the electromagnetic pump itself has low noise and is easy to follow. Advantages of load regulation.
3、本发明使用的二次冷却液可根据不同材质的配件、动力系统变更以及不同工况改变冷却液的物理性质以达到不同的效果，在高比热容的前提下，此冷却系统有更大的利用空间。3. The secondary coolant used in the present invention can change the physical properties of the coolant according to accessories of different materials, power system changes and different working conditions to achieve different effects. Under the premise of high specific heat capacity, this cooling system has greater Use the space.
4、本发明使用的搅拌棒组结构稳定，可替换性好。根据不同热流需求，通过改变叶片形状，数量以及旋转方式更有效地辅助二次冷却液旋流散热。4. The stirring rod group used in the present invention has a stable structure and good replaceability. According to different heat flow requirements, by changing the shape, number and rotation mode of the blades, it is more effective to assist the secondary coolant to swirl and dissipate heat.
5、本发明的二回路嵌套管结构紧凑，效率高，且附件少，放置方式可变，在设备空间不足的情况更易发挥作用。5. The secondary circuit nested pipe of the present invention has compact structure, high efficiency, few accessories, variable placement, and is easier to play a role in the case of insufficient equipment space.
6、所述一次回路管和二次冷却管部分嵌套，既保证了一次冷却液与器件的热传导，也保证了一次冷却液热量的及时输出，保证了冷却系统的稳定性。同时，二嵌套也可通过改变管长及管道形状，增加风冷模式。6. The primary loop pipe and the secondary cooling pipe are partially nested, which not only ensures the heat conduction between the primary coolant and the device, but also ensures the timely output of heat from the primary coolant, ensuring the stability of the cooling system. At the same time, double nesting can also increase the air cooling mode by changing the length and shape of the pipe.
附图说明Description of drawings
图1为大功率芯片封闭式液态金属二回路冷却系统主视图；Figure 1 is the front view of the high-power chip closed liquid metal secondary circuit cooling system;
图2为大功率芯片封闭式液态金属二回路冷却系统B-B向剖视图；Figure 2 is a B-B sectional view of the high-power chip closed liquid metal secondary circuit cooling system;
图3为大功率芯片封闭式液态金属二回路冷却系统C-C向剖视图；Figure 3 is a C-C cross-sectional view of the closed-type liquid metal secondary circuit cooling system for high-power chips;
图4为大功率芯片封闭式液态金属二回路冷却系统的适应型感应式电磁泵和固定套配合结构示意图；Figure 4 is a schematic diagram of the matching structure of the adaptive induction electromagnetic pump and the fixed sleeve of the high-power chip closed liquid metal secondary circuit cooling system;
图5为大功率芯片封闭式液态金属二回路冷却系统的搅拌棒组三维示意图；Fig. 5 is a three-dimensional schematic diagram of a stirring bar group of a high-power chip closed-type liquid metal secondary circuit cooling system;
图6为大功率芯片封闭式液态金属二回路冷却系统的适应型感应式电磁泵示意图；Fig. 6 is a schematic diagram of an adaptive induction electromagnetic pump of a high-power chip closed-type liquid metal secondary circuit cooling system;
图7为大功率芯片封闭式液态金属二回路冷却系统上套体结构示意图；Fig. 7 is a schematic diagram of the structure of the upper casing of the closed-type liquid metal secondary circuit cooling system for high-power chips;
图8为大功率芯片封闭式液态金属二回路冷却系统L形卡扣和L形孔结构示意图；Figure 8 is a schematic diagram of the structure of the L-shaped buckle and the L-shaped hole of the closed-type liquid metal secondary circuit cooling system for high-power chips;
图9为液态金属封闭式二回路冷却系统运行示意图；Figure 9 is a schematic diagram of the operation of the liquid metal closed secondary loop cooling system;
1-一次回路管，2-补液盖，3-二次冷却管，4-凸口，5-适应型感应式电磁泵，501-磁极铁芯，502-三相绕组线圈，6-直流电机，7-搅拌棒组，701-基板，702-连接臂，703-搅拌棒，704-扇形孔，8-固定套，801-上套体，802-下套体，803-水平板，804-三角板，805-L形卡扣，806-L形孔。1-primary circuit tube, 2-replenishment cap, 3-secondary cooling tube, 4-bulge, 5-adaptive induction electromagnetic pump, 501-magnetic pole core, 502-three-phase winding coil, 6-DC motor, 7-Stirring bar group, 701-base plate, 702-connecting arm, 703-stirring bar, 704-fan-shaped hole, 8-fixed sleeve, 801-upper sleeve, 802-lower sleeve, 803-horizontal plate, 804-triangular plate , 805-L-shaped buckle, 806-L-shaped hole.
具体实施方式Detailed ways
下面结合附图和实施例对本发明作进一步的详细说明。The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
如图1至图4、图9所示，一种大功率芯片封闭式液态金属二回路冷却系统，包括采用高导热率、导电率金属材料制成的一次回路管1、一次冷却液、采用高导热材料制成的二次冷却管2、二次冷却液、适应型感应式电磁泵5、直流电机6、搅拌棒组7、补液盖2，所述一次回路管1内填充有一次冷却液，一次回路管1一段水平管外壁通过固定套8套装有适应型感应式电磁泵5，且适应型感应式电磁泵5被固定套8包围，位于固定套8内腔，一次回路管1另一端水平段部分与芯片连接，一次回路管1外壁与芯片接触处涂抹导热硅脂，以达到良好的导热效果，一次回路管1的截面为椭圆形，以增大与芯片的接触面积，同时一次回路管1具有长直化的特点，保证了足够的冷却长度和流动稳定性，一次回路管1与二次冷却管2的前端孔口密封连接，二次冷却管2内填充有二次冷却液，二次冷却液的比热容为1600-5000J/(kg.K)，热导率为0.16-1W/(m·K)，导电率小于0.005S/m，动力粘度小于10-5Pa·s，二次冷却液的工作温度区间宽于被降温芯片工作温度区间，热稳定性良好，在搅拌棒组7的运动下跟随其形成旋流运动，二次冷却液为水、二甲基硅烷或两者的混合液，二次冷却管2内腔尾端转动安装有搅拌棒组7，二次冷却管2尾部通过尾端孔口和轴封安装有直流电机6，防止在使用过程中二次冷却管2漏液，且直流电机6输出轴与搅拌棒组7固定安装，所述二次冷却管2的凸口4与补液盖2相连，通过凸口4可以定期补充二次冷却液，保证冷却效果，本系统大功率芯片包含电脑芯片、家电产品芯片、工业产品芯片。As shown in Figures 1 to 4 and Figure 9, a high-power chip closed-type liquid metal secondary circuit cooling system includes a primary circuit pipe 1 made of metal materials with high thermal conductivity and electrical conductivity, a primary coolant, and a high Secondary cooling pipe 2 made of heat-conducting material, secondary cooling liquid, adaptive induction electromagnetic pump 5, DC motor 6, stirring bar group 7, liquid replacement cover 2, the primary circuit pipe 1 is filled with primary cooling liquid, The outer wall of a section of the horizontal pipe of the primary circuit pipe 1 is set with an adaptive induction electromagnetic pump 5 through a fixed sleeve 8, and the adaptive induction electromagnetic pump 5 is surrounded by the fixed sleeve 8 and is located in the inner cavity of the fixed sleeve 8. The other end of the primary circuit pipe 1 is horizontal The section part is connected with the chip, and the outer wall of the primary circuit tube 1 is coated with heat-conducting silicone grease to achieve a good heat conduction effect. The cross-section of the primary circuit tube 1 is elliptical to increase the contact area with the chip. 1 has the characteristics of long and straight, which ensures sufficient cooling length and flow stability. The primary circuit pipe 1 is sealed and connected with the front end of the secondary cooling pipe 2. The secondary cooling pipe 2 is filled with secondary cooling liquid. The specific heat capacity of the secondary coolant is 1600-5000J/(kg.K), the thermal conductivity is 0.16-1W/(m·K), the electrical conductivity is less than 0.005S/m, and the dynamic viscosity is less than 10-5 Pa·s. The working temperature range of the cooling liquid is wider than the working temperature range of the chip to be cooled, and the thermal stability is good. Under the movement of the stirring rod group 7, it forms a swirling flow movement, and the secondary cooling liquid is water, dimethylsilane or both. Mixed liquid, the tail end of the secondary cooling pipe 2 is rotated and installed with a stirring rod group 7, and the tail of the secondary cooling pipe 2 is installed with a DC motor 6 through the tail end hole and shaft seal to prevent the secondary cooling pipe 2 during use. Liquid leakage, and the output shaft of the DC motor 6 is fixedly installed with the stirring bar group 7, and the protrusion 4 of the secondary cooling pipe 2 is connected with the liquid replacement cover 2, and the secondary cooling liquid can be regularly replenished through the protrusion 4 to ensure the cooling effect. The high-power chips of this system include computer chips, home appliance chips, and industrial product chips.
如图5所示，所述搅拌棒组7由包括基板701和搅拌棒703，所述基板701通过若干连接臂702与圆环内壁固定安装，圆环截面呈矩形，相邻连接臂702、圆环及基板701围成的孔为扇形孔704，扇形孔704防止液体运动受阻，同时还能加固基板701，减少其变形，在连接臂702与圆环的连接处设置有搅拌棒703，且相邻搅拌棒703相对于连接臂702对称设置，所述基板701的中心处设置有半圆形凸起，所述半圆形凸起上开设有盲孔，盲孔用于与直流电机6的输出轴相连。所述搅拌棒组7采用高抗压、抗变形、耐腐蚀材料制成，呈辐射状，所有搅拌棒703作为一个整体一起运动，在直流电机6驱动下，搅拌棒组7克服二次冷却液的重力及粘性力绕轴运动，以此带动液体流动，增强换热，搅拌棒组7材料、基板701结构、叶片型式可根据受冷却对象的功率变化进行数目和形状上的调整，以适应不同工况。As shown in Figure 5, the stirring bar group 7 is composed of a base plate 701 and a stirring bar 703, the base plate 701 is fixedly installed with the inner wall of the ring through a plurality of connecting arms 702, and the cross section of the ring is rectangular, and the adjacent connecting arms 702, circular The hole surrounded by the ring and the base plate 701 is a fan-shaped hole 704. The fan-shaped hole 704 prevents the movement of the liquid from being hindered. The adjacent stirring rod 703 is arranged symmetrically with respect to the connecting arm 702, and the center of the base plate 701 is provided with a semicircular protrusion, and a blind hole is opened on the semicircular protrusion, and the blind hole is used for the output of the DC motor 6. Axes are connected. The stirring rod group 7 is made of high compression resistance, deformation resistance and corrosion resistance material, and is radial. All the stirring rods 703 move together as a whole. Driven by the DC motor 6, the stirring rod group 7 overcomes the secondary cooling liquid. The gravity and viscous force move around the axis, so as to drive the liquid flow and enhance heat transfer. The material of the stirring rod group 7, the structure of the substrate 701, and the blade type can be adjusted in number and shape according to the power change of the cooled object to adapt to different working conditions.
如图6所示，所述适应型感应式电磁泵5为三相感应式电磁泵，由若干磁极铁芯501和若干三相绕组线圈502组成，所述若干磁极铁芯501沿着周向均匀布置成内孔为椭圆形的结构，沿若干磁极铁芯501的轴向按三相顺序循环布置若干三相绕组线圈502。所述三相绕组线圈502在通交流电时，产生随时间变化的正弦交变电流，之后形成了正弦行进磁场，此磁场切割封闭环状液态金属使其内部感生电流，液态金属内部的感生电流也随行进磁场同时变化，在液态金属表面磁感应强度最大，以驱动液态金属的流动。通过对电源电压的调节，改变正弦交变电流，调节液态金属受到的洛伦兹力，以控制液态金属流速；所述磁极铁芯501均匀分布于一次回路管1的管壁，通过影响液态金属的磁场分布来改变液态金属受力情况。As shown in Figure 6, the adaptive induction electromagnetic pump 5 is a three-phase induction electromagnetic pump, which is composed of several magnetic pole cores 501 and several three-phase winding coils 502, and the several magnetic pole cores 501 are uniformly It is arranged in a structure with an elliptical inner hole, and several three-phase winding coils 502 are circularly arranged in three-phase order along the axial direction of several magnetic pole cores 501 . When the three-phase winding coil 502 is supplied with alternating current, it generates a sinusoidal alternating current that changes with time, and then forms a sinusoidal marching magnetic field. The current also changes simultaneously with the traveling magnetic field, and the magnetic induction intensity is the largest on the surface of the liquid metal to drive the flow of the liquid metal. By adjusting the power supply voltage, the sinusoidal alternating current is changed, and the Lorentz force on the liquid metal is adjusted to control the flow rate of the liquid metal; The distribution of the magnetic field to change the force of the liquid metal.
所述一次冷却液为低熔点金属液或低熔点合金溶液，且熔点位于或低于室温，热导率为15-45W/(m·K)，动力黏度为0.0017-0.003Pa·s，具有优良的导电性，能在电磁泵驱动下在一次回路中循环运动，所述低熔点合金溶液为镓、镓铟合金、镓铟锡合金、钠钾合金中的一种或几种的组合。The primary cooling liquid is a low-melting point metal liquid or a low-melting point alloy solution, and its melting point is at or below room temperature, its thermal conductivity is 15-45W/(m·K), and its dynamic viscosity is 0.0017-0.003Pa·s. It can circulate in the primary circuit under the drive of the electromagnetic pump, and the low melting point alloy solution is one or a combination of gallium, gallium indium alloy, gallium indium tin alloy, and sodium potassium alloy.
所述凸口4外圆面设置有外螺纹，凸口4通过螺纹连接补液盖2。The outer circular surface of the convex mouth 4 is provided with an external thread, and the convex mouth 4 is connected to the liquid replenishing cap 2 through threads.
所述补液盖2采用抗氧化、耐腐蚀的材料制成，在补液盖2内端面与凸口4端面的接触处安装有橡胶密封圈，防止二次冷却液通过凸口4泄露。The liquid replenishment cover 2 is made of anti-oxidation and corrosion-resistant materials, and a rubber sealing ring is installed at the contact between the inner end face of the liquid replenishment cover 2 and the end face of the protrusion 4 to prevent secondary cooling liquid from leaking through the protrusion 4 .
如图7和图8所示，所述固定套8由上套体801和下套体802组成，上套体801延长度方向对称设置的内壁上均设置有L形卡扣805，下套体802延长度方向设置的两个端面上均设置有L形孔806，上套体801和下套体802通过L形卡扣805和L形孔806配合固定连接，上套体801和下套体802的水平板沿长度方向均设置有三角板804，三角板804安装于适应型感应式电磁泵5上相邻设置的磁极铁芯501的缝隙内顶紧适应型感应式电磁泵5，上套体801和下套体802的两端沿长度方向均对称设置有水平板803，位于一端设置的上套体801上的水平板803和下套体802上的水平板803配合夹紧适应型感应式电磁泵5的磁极铁芯501，固定套8采用磁性材料制成，以隔绝适应型感应式电磁泵5对其他设备产生磁干扰。As shown in Figures 7 and 8, the fixed sleeve 8 is composed of an upper sleeve body 801 and a lower sleeve body 802, and the inner walls of the upper sleeve body 801, which are arranged symmetrically in the extension direction, are provided with L-shaped buckles 805, and the lower sleeve body 802 is provided with L-shaped holes 806 on both end faces of the extension direction. The upper sleeve body 801 and the lower sleeve body 802 are fixedly connected through the L-shaped buckle 805 and the L-shaped hole 806. The upper sleeve body 801 and the lower sleeve body The horizontal plate of 802 is provided with a triangular plate 804 along the length direction, and the triangular plate 804 is installed in the gap of the magnetic pole core 501 adjacently arranged on the adaptive induction electromagnetic pump 5 to push against the adaptive induction electromagnetic pump 5, and the upper sleeve 801 Both ends of the lower sleeve body 802 are symmetrically provided with a horizontal plate 803 along the length direction, and the horizontal plate 803 on the upper sleeve body 801 located at one end and the horizontal plate 803 on the lower sleeve body 802 cooperate with the clamping adaptive induction electromagnetic The magnetic pole core 501 of the pump 5 and the fixed sleeve 8 are made of magnetic materials to isolate the adaptive induction electromagnetic pump 5 from magnetic interference to other equipment.
本发明的工作原理为：Working principle of the present invention is:
首先将本发明装置的一次回路管1未安装适应型感应式电磁泵5一侧的表面与芯片贴合设置，当电子器件工作时，适应型感应式电磁泵5与直流电机6同时开始运行，一次冷却液在适应型感应式电磁泵5驱动下在一次回路管1内沿芯片方向运动，为保持流动和吸热的稳定性，使一次冷却液流动始终处于低速状态，当一次冷却液流经位于二次冷却管2内的一次回路管1部分时，直流电机6工作带动搅拌棒组7旋转，搅拌棒组7使二次冷却液以均匀速度绕轴流动，一次冷却液所携带的热量经对流换热传递到一次回路管1的管壁上，由二次冷却液对流带走一次回路管1的热量，由于二次冷却液有较高的比热容，温度变化率较低，所以热量传导到外界更为容易也存在较长的缓冲时间，导出芯片产生的热量，一次回路管1中的一次冷却液通过进入二次冷却管2冷却后，由适应型感应式电磁泵5提供的驱动力返回适应型感应式电磁泵5入口，完成一次散热循环，二次冷却管2中的二次冷却液吸收一次冷却液传递的热量后，通过二次冷却液的旋流作用向外界导热维持温度的稳定，在设备低负荷或停机时进一步降温，实现二次回路的封闭式控温作用。First, the surface of the primary circuit pipe 1 of the device of the present invention that is not installed with the adaptive induction electromagnetic pump 5 is attached to the chip. When the electronic device is working, the adaptive induction electromagnetic pump 5 and the DC motor 6 start running simultaneously. Driven by the adaptive induction electromagnetic pump 5, the primary coolant moves along the direction of the chip in the primary circuit pipe 1. In order to maintain the stability of flow and heat absorption, the flow of the primary coolant is always at a low speed. When the primary coolant flows through When the primary circuit pipe 1 is located in the secondary cooling pipe 2, the DC motor 6 works to drive the stirring rod group 7 to rotate, and the stirring rod group 7 makes the secondary cooling liquid flow around the axis at a uniform speed, and the heat carried by the primary cooling liquid passes through The convective heat transfer is transferred to the tube wall of the primary loop pipe 1, and the heat of the primary loop pipe 1 is taken away by the secondary coolant convection. Since the secondary coolant has a high specific heat capacity and a low temperature change rate, the heat is conducted to It is easier for the outside world and there is a longer buffer time to export the heat generated by the chip. After the primary coolant in the primary circuit pipe 1 enters the secondary cooling pipe 2 to cool, the driving force provided by the adaptive induction electromagnetic pump 5 returns to the The inlet of the adaptive induction electromagnetic pump 5 completes a heat dissipation cycle. After the secondary coolant in the secondary cooling pipe 2 absorbs the heat transferred by the primary coolant, it conducts heat to the outside through the swirling effect of the secondary coolant to maintain temperature stability. , to further reduce the temperature when the equipment is under low load or shut down, and realize the closed temperature control function of the secondary circuit.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910559089.8ACN110299336A (en) | 2019-06-26 | 2019-06-26 | A kind of closed liquid metal secondary circuit cooling system of high-power chip |
| PCT/CN2019/095383WO2020258379A1 (en) | 2019-06-26 | 2019-07-10 | High-power chip closed liquid metal two-loop cooling system |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910559089.8ACN110299336A (en) | 2019-06-26 | 2019-06-26 | A kind of closed liquid metal secondary circuit cooling system of high-power chip |
| Publication Number | Publication Date |
|---|---|
| CN110299336Atrue CN110299336A (en) | 2019-10-01 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910559089.8APendingCN110299336A (en) | 2019-06-26 | 2019-06-26 | A kind of closed liquid metal secondary circuit cooling system of high-power chip |
| Country | Link |
|---|---|
| CN (1) | CN110299336A (en) |
| WO (1) | WO2020258379A1 (en) |
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| CN117577601A (en)* | 2024-01-12 | 2024-02-20 | 广东海洋大学 | An efficient thermal control system for microcircuit based on liquid metal carrier cooling |
| US12295125B1 (en) | 2024-01-12 | 2025-05-06 | Guangdong Ocean University | Efficient thermal control system for microcircuit based on liquid metal coolant |
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| RJ01 | Rejection of invention patent application after publication | Application publication date:20191001 |