A kind of laser boring diced system for semiconductor materialTechnical field
The present invention relates to semiconductor processing technology field more particularly to a kind of laser boring cuttings for semiconductor materialSystem.
Background technique
Semiconductor refers to material of the electric conductivity between conductor and insulator under room temperature.Semiconductor is in radio, TVIt has a wide range of applications on machine and thermometric.If diode is exactly the device using semiconductor fabrication.Semiconductor refers to that one kind is ledIt can electrically be controlled, range can be from insulator to the material between conductor.No matter from the perspective of science and technology or economic development,The importance of semiconductor is all very huge.Today most electronic product, as computer, mobile phone or number recordCore cell in sound machine all has extremely close connection with semiconductor.Common semiconductor material has silicon, germanium, GaAsDeng, and silicon is even more most influential one kind in business application in various semiconductor materials.
It needs to cut it in the process to semiconductor, punch, in the prior art, filled using laser cuttingIt sets and semiconductor process very common, be in the prior art more because laser cutting device process velocity is fast, precision is highMature technological means, but when utilizing laser cutting device to semiconductor machining, infrared distance sensor is utilized to carry out distancePositioning is a kind of common mode, and infrared distance sensor is generally placed into the external world and carries out range measurement, will lead in this wayThe waste material generated during laser cutting impacts the measurement accuracy of infrared distance sensor, in addition, in the prior artBy X/Y axis drive laser cutting device moved, be inconvenient in this way when being punched to semiconductor, and punch atCircular precision is not also high.
In conclusion still having certain inconvenience when carrying out punch-cuts to semiconductor, for this purpose, it is proposed that a kind ofIt solves the above problems for the laser boring diced system of semiconductor material.
Summary of the invention
A kind of laser boring diced system for semiconductor material proposed by the present invention solves and utilizes laser cutting dressWhen setting to semiconductor machining, generally infrared distance sensor is placed into the external world and carries out range measurement, will lead to laser in this wayThe waste material generated during cutting impacts the measurement accuracy of infrared distance sensor, in addition, passing through in the prior artX/Y axis drives laser cutting device to be moved, and is inconvenient in this way when punching to semiconductor, and punches into circlePrecision also not high problem.
To achieve the goals above, present invention employs following technical solutions:
A kind of laser boring diced system for semiconductor material, including pedestal, the upper end side wall of the pedestal are fixedIt is connected with mounting base, the mounting base is hollow structure, and the inner wall of the mounting base is fixedly connected with stepper motor, the installationThe inner wall of seat be rotatably connected to the matched ball-screw of the output shaft of stepper motor, sliding sleeve, which is equipped with, on the ball-screw slidesMotion block, the upper end side wall of the sliding shoe are fixedly connected with light barrier, are fixedly connected between the two sides inner wall of the mounting baseSlide bar, sliding sleeve is equipped with sliding sleeve on the slide bar, and the bottom side of the wall and light barrier of the sliding sleeve are fixed far from the side wall of sliding shoeConnection, the inner wall of the mounting base are fixedly connected with infrared distance sensor, and the light barrier is far from infrared distance sensorSide wall is fixedly connected with cross bar, and the cross bar runs through the inner wall of mounting base and be fixedly connected with far from one end of light barrier pneumatically to be stretchedContracting bar, the telescopic end of the Pneumatic extension bar are fixedly connected with laser cutting device, and the upper end side wall of the pedestal offers peaceTankage, the side wall of the mounting groove are fixedly connected with uniform speed electric motor, the side wall of the mounting groove by bearing be rotatably connected toThe matched worm screw of the output shaft of uniform speed electric motor, the bottom wall of the mounting groove are rotatably connected to bull stick by shaft, on the bull stickFixing sleeve is equipped with to be run through the opening of mounting groove far from one end of shaft and is fixedly connected with the matched worm gear of worm screw, the bull stickWorkbench, the workbench are hollow structure, are equipped with clamping device in the workbench.
Preferably, the clamping device includes positive and negative motor, and the positive and negative motor is fixedly connected with the inner wall of workbench, instituteThe output shaft for stating positive and negative motor is fixedly connected with gear, and the top and bottom sidewall of the workbench slidably connects matched with the gearRack gear, the side wall of two rack gears are fixedly connected to strut, and the upper end side wall of the workbench offers two bar shapeds and opensMouthful, two struts extend through two strip gabs, and the strut outside workbench is fixedly connected with grip block.
Preferably, the two sides side wall of the rack gear is fixedly connected to baffle, and the side wall of the rack gear offers limiting slot,Gag lever post is slidably connected in the limiting slot, the gag lever post runs through the opening of limiting slot and fixes with the inner wall of workbench and connectsIt connects.
Preferably, the bottom side of the wall of the workbench is fixedly connected there are two support rod, and two support rods distinguish positionSymmetrical in the two sides of bull stick, the support rod is fixedly connected with sliding block, the upper end side wall of the pedestal far from one end of workbenchIt offers and the matched annular groove of sliding block.
Preferably, the upper end side wall of the mounting base is fixedly connected with multi-colour alarm lamp, the multi-colour alarm lamp respectively withInfrared distance sensor and servo motor electrical connection.
Compared with prior art, the beneficial effects of the present invention are:
1, by being arranged infrared distance sensor to mounting base inner wall in the present invention, and ball-screw and sliding shoe are utilizedCooperation drive light barrier mobile, can rapidly and accurately measure mobile distance in this way and then be cut, be avoided infraredDistance measuring sensor is guaranteed the accuracy of cutting position by external influence, in addition, driving worm and worm wheel by uniform speed electric motorWorkbench rotation is rotated and then driven, quickly semiconductor can be punched in this way, of simple structure and strong practicability.
2, make rack gear movement using the rotation of positive and negative motor driven gear in the present invention, so that strut and grip block be driven to moveIt is dynamic, can be rapidly completed in this way and the clamping of semiconductor is loosened, facilitate pick-and-place, in addition, using baffle block rack gear avoid its withGear separation, and the limitation of gag lever post does not interfere the sliding of rack gear and guarantee rack gear in sliding process will not wallowing motion, and alsoHave and played a supporting role by support rod and sliding block to workbench, and can smooth rotation to completing quick punch-cuts.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of the laser boring diced system for semiconductor material proposed by the present invention；
Fig. 2 is the structural schematic diagram in Fig. 1 at A；
Fig. 3 is the structural schematic diagram in Fig. 1 at B；
Fig. 4 is the structural schematic diagram in Fig. 1 at C.
In figure: 1 pedestal, 2 mounting bases, 3 stepper motors, 4 ball-screws, 5 sliding shoes, 6 light barriers, 7 slide bars, 8 sliding sleeves, 9Infrared distance sensor, 10 cross bars, 11 Pneumatic extension bars, 12 laser cutting devices, 13 uniform speed electric motors, 14 worm screws, 15 worm gears, 16Workbench, 17 clamping devices, 1701 positive and negative motors, 1702 gears, 1703 rack gears, 1704 struts, 1705 grip blocks, 18 baffles,19 gag lever posts, 20 support rods, 21 sliding blocks, 22 multi-colour alarm lamps, 23 bull sticks.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, completeSite preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Referring to Fig.1-4, a kind of laser boring diced system for semiconductor material, including pedestal 1, the upper end of pedestal 1Side wall is fixedly connected with mounting base 2, and the upper end side wall of mounting base 2 is fixedly connected with multi-colour alarm lamp 22, and multi-colour alarm lamp 22 is adoptedWith red, yellow and green, illustrate work safety when green, illustrates that drill process is made a fault in red and yellow, mentionAwake worker overhauls, and multi-colour alarm lamp 22 is electrically connected with infrared distance sensor 9 and servo motor respectively, during mounting base 2 isHollow structure, the inner wall of mounting base 2 are fixedly connected with stepper motor 3, and the inner wall of mounting base 2 is rotatably connected to and stepper motor 3The matched ball-screw 4 of output shaft, sliding sleeve is equipped with sliding shoe 5 on ball-screw 4, and the upper end side wall of sliding shoe 5 is fixedly connectedThere is light barrier 6, slide bar 7 is fixedly connected between the two sides inner wall of mounting base 2, sliding sleeve is equipped with sliding sleeve 8 on slide bar 7, sliding sleeve 8Bottom side of the wall is fixedly connected with light barrier 6 far from the side wall of sliding shoe 5, and the inner wall of mounting base 2 is fixedly connected with infrared distance measurement biographySensor 9 can measure to fast accurate the mobile distance of laser cutting device 12 using infrared distance sensor 9；
Light barrier 6 is fixedly connected with cross bar 10 far from the side wall of infrared distance sensor 9, and cross bar 10 is far from light barrier 6One end runs through the inner wall of mounting base 2 and is fixedly connected with Pneumatic extension bar 11, and the telescopic end of Pneumatic extension bar 11 is fixedly connected withLaser cutting device 12, using the vertical distance of the telescopic adjustment laser cutting device 12 of Pneumatic extension bar 11, keep its close orPerson offers mounting groove far from workbench 16, the upper end side wall of pedestal 1, and the side wall of mounting groove is fixedly connected with uniform speed electric motor 13,The side wall of mounting groove is rotatably connected to by bearing to be led to the matched worm screw 14 of the output shaft of uniform speed electric motor 13, the bottom wall of mounting grooveIt crosses shaft and is rotatably connected to bull stick, fixing sleeve is equipped with and the matched worm gear 15 of worm screw 14, the one end of bull stick far from shaft on bull stickThrough mounting groove opening and be fixedly connected with workbench 16, the bottom side of the wall of workbench 16 is fixedly connected there are two support rod20, the two sides that two support rods 20 are located at bull stick are symmetrical, and support rod 20 is fixedly connected with cunning far from one end of workbench 16Block 21, the upper end side wall of pedestal 1 offer with the matched annular groove of sliding block 21, by support rod 20 and sliding block 21 to workbench16 play a supporting role, and can smooth rotation to completing quick punch-cuts；
Workbench 16 is hollow structure, and clamping device 17 is equipped in workbench 16, and clamping device 17 includes positive and negative motor1701, positive and negative motor 1701 is fixedly connected with the inner wall of workbench 16, and the output shaft of positive and negative motor 1701 is fixedly connected with gear1702, the top and bottom sidewall of workbench 16 slidably connects and the matched rack gear 1703 of gear 1702, the two sides side of rack gear 1703Wall is fixedly connected to baffle 18, and the side wall of rack gear 1703 offers limiting slot, and gag lever post 19 is slidably connected in limiting slot, limitPosition bar 19 runs through the opening of limiting slot and is fixedly connected with the inner wall of workbench 16, blocks rack gear 1703 using baffle 18 and avoids itIt is separated with gear 1702, and the limitation of gag lever post 19 does not interfere the sliding of rack gear 1703 and guarantees rack gear 1703 in sliding processWill not wallowing motion, the side wall of two rack gears 1703 is fixedly connected to strut 1704, and the upper end side wall of workbench 16 offersTwo strip gabs, two struts 1704 extend through two strip gabs, and the strut 1704 outside workbench 16 is fixed to be connectedIt is connected to grip block 1705.
Semiconductor is put on workbench 16 by the present invention when needing to punch semiconductor, makes positive and negative motor 1701It rotates forward, positive and negative motor 1701 is rotated with moving gear 1702, slides rack gear 1703 by engagement, rack gear 1703 drivesStrut 1704 is mobile, and grip block 1705 follows strut 1704 thus to press from both sides semiconductor to close to the movement of the direction of semiconductorIt holds on workbench 16, the radius length then punched as needed adjusts the position of laser cutting device 12, and laser cutting isThe horizontal laser beam issued from laser becomes laser beam vertically downward through 45 ° of total reflection mirrors, by lens focus, in cokeIt is polymerized to a minimum hot spot at point, when hot spot is radiated on material, material is made to be heated to vapourizing temperature quickly, evaporation forms holeHole, the movement with light beam to material, and cooperate auxiliary gas, usually inert gas, the waste residue of fusing is blown away, hole is connectedThe very narrow joint-cutting of continuous formation width completes the cutting to material；
When adjusting the position of laser cutting device 12, makes stepper motor 3 that ball-screw 4 be driven to rotate, pass through 7 He of slide barThe limitation of sliding sleeve 8 makes sliding shoe 5 along 4 transverse shifting of ball-screw, and such sliding shoe 5 is able to drive 6 transverse shifting of light barrier,And the spacing of light barrier 6 is measured when the movement of light barrier 6 using infrared distance sensor 9, infrared distance sensor 9 has a pairInfrared signal transmitting and reception diode, the infrared distance sensor 9LDM301 utilized launch a branch of infrared light, are being irradiated toThe process that a reflection is formed after object is reflected into sensor and is followed by the collection of letters number, then receives transmitting using image procossing and connectsThe data of the time difference of receipts calculate the distance of object after signal processor processes；
And light barrier 6 drives cross bar 10 and pneumatic telescopic rod 11 mobile in the process of moving, it in this way can quickly, accuratelyLaser cutting device 12 is moved to designated position by ground, after being moved to designated position, first makes Pneumatic extension bar 11 that laser be driven to cutThe decline of device 12 is cut, laser cutting device 12 is opened and punch-cuts is carried out to semiconductor, then uniform speed electric motor 13 is made to drive worm screw 14Rotation makes bull stick that workbench 16 be driven to rotate by the rotation of worm gear 15, and this makes it possible to quickly to partly leading on workbench 16Body carries out punch-cuts, and structure is simple, easy to operate, again rotates backward positive and negative motor 1701 after the completion of punching, grip block1705 separate with semiconductor, and this makes it possible to remove semiconductor from workbench 16.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and itsInventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.