本申请是2015年4月9日提交到国家知识产权局的发明名称为“电子组件”及申请号为201510166065.8的发明专利申请的分案申请。This application is a divisional application of the invention patent application with the title of "electronic component" and application number 201510166065.8 submitted to the State Intellectual Property Office on April 9, 2015.
技术领域technical field
本公开的示例性实施例涉及一种电子组件、包括该电子组件的电子装置及其接合方法。更具体地，本公开的示例性实施例涉及一种改善电连接的可靠性的电子组件、包括该电子组件的电子装置及其接合方法。Exemplary embodiments of the present disclosure relate to an electronic component, an electronic device including the electronic component, and a bonding method thereof. More particularly, exemplary embodiments of the present disclosure relate to an electronic component improving reliability of electrical connection, an electronic device including the electronic component, and a bonding method thereof.
背景技术Background technique
通常，电子装置可以包括至少两个电子组件。例如，诸如移动电话、笔记本计算机和电视机的电子装置可以包括电光面板、主布线基底和柔性布线基底以产生图像。Generally, an electronic device may include at least two electronic components. For example, electronic devices such as mobile phones, notebook computers, and televisions may include an electro-optical panel, a main wiring substrate, and a flexible wiring substrate to generate images.
电子装置的两个电子组件彼此电连接。例如，两个电子组件可以通过各自的焊盘区域的结合而彼此电连接。用于将两个电子组件的焊盘区域电连接的工艺(在下文中称作接合工艺)可以包括将两个电子组件的焊盘区域对齐并结合。结合工艺可以使用热压缩工具。Two electronic components of an electronic device are electrically connected to each other. For example, two electronic components may be electrically connected to each other through bonding of respective pad regions. A process for electrically connecting pad regions of two electronic components (hereinafter referred to as a bonding process) may include aligning and bonding pad regions of two electronic components. Bonding process can use thermal compression tools.
发明内容Contents of the invention
本公开的示例性实施例提供一种电子组件，所述电子组件包括：焊盘区域，包括沿着对应的延长线延伸并且在第一方向上彼此分隔开的多个焊盘；信号布线，被构造为从焊盘区域接收驱动信号，其中，所述多个焊盘包括连续地布置的多个第一焊盘和连续地布置的多个第二焊盘，其中，所述多个第一焊盘的延长线基本上会聚于第一点，所述多个第二焊盘的延长线基本上会聚于与第一点不同的第二点。An exemplary embodiment of the present disclosure provides an electronic component including: a pad region including a plurality of pads extending along corresponding extension lines and spaced apart from each other in a first direction; signal wiring, configured to receive a driving signal from a pad region, wherein the plurality of pads includes a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, wherein the plurality of first pads Extension lines of the pads substantially converge at a first point, and extension lines of the plurality of second pads substantially converge at a second point different from the first point.
由限定在焊盘区域的第一方向的中心处并且在与第一方向相交的第二方向上延伸的基准线和所述多个第一焊盘的延长线形成的第一夹角可以随着所述多个第一焊盘逐渐接近于基准线而减小，由基准线和所述多个第二焊盘的延长线形成的第二夹角可以随着所述多个第二焊盘逐渐接近于基准线而减小。The first included angle formed by the reference line defined at the center of the pad region in the first direction and extending in the second direction intersecting the first direction and the extension lines of the plurality of first pads may vary with The plurality of first pads gradually approach the reference line and decrease, and the second included angle formed by the extension line of the reference line and the plurality of second pads may gradually increase as the plurality of second pads gradually decrease close to the baseline.
第一夹角可以以第一值减小，第二夹角可以以第二值减小，第一值和第二值彼此不同。The first included angle may decrease by a first value and the second included angle may decrease by a second value, the first and second values being different from each other.
第一夹角θ1n可以由所述多个第一焊盘中的第n个第一焊盘的延长线和基准线形成，并且满足下面的等式1，The first included angleθ1n may be formed by an extension line and a reference line of the nth first pad among the plurality of first pads, and satisfies Equation 1 below,
[等式1][equation 1]
θ1n＝θ11-(n-1)α，θ1n = θ11 -(n-1)α,
其中，θ11是由所述多个第一焊盘中的设置在最外面的第一焊盘的延长线和基准线形成的第一夹角，n为大于或等于2的自然数，α为所述第一值。Wherein, θ11 is the first included angle formed by the extension line and the reference line of the outermost first pad among the plurality of first pads, n is a natural number greater than or equal to 2, and α is all the first value.
第二夹角θ2m可以由所述多个第二焊盘中的第m个第二焊盘的延长线和基准线形成，并且满足下面的等式2，The second included angleθ2m may be formed by the extension line and the reference line of the m-th second pad in the plurality of second pads, and satisfies the following equation 2,
[等式2][equation 2]
θ2m＝θ21-(m-1)β，θ2m = θ21 -(m-1)β,
其中，θ21是由所述多个第二焊盘中的设置在最外面的第二焊盘的延长线和基准线形成的第二夹角，m为大于或等于2的自然数，β为所述第二值。Wherein, θ21 is the second included angle formed by the extension line and the reference line of the outermost second pad among the plurality of second pads, m is a natural number greater than or equal to 2, and β is all the second value.
所述多个第一焊盘可以比所述多个第二焊盘更为接近所述基准线，并且θ11满足下面的等式3，The plurality of first pads may be closer to the reference line than the plurality of second pads, and θ11 satisfies Equation 3 below,
[等式3][equation 3]
θ11≠θ21-K×β，θ11 ≠ θ21 -K×β,
其中，K为第二焊盘的个数。Wherein, K is the number of the second pads.
第一点和第二点可以设置在基准线上的不同位置处。The first point and the second point can be set at different positions on the reference line.
第一点和第二点中的一个点可以设置在基准线上，第一点和第二点中的另一个点设置在基准线的外部。One of the first point and the second point may be set on the reference line, and the other point of the first point and the second point may be set outside the reference line.
第一点和第二点可以设置在沿第一方向延伸的平行线上。The first point and the second point may be disposed on parallel lines extending in the first direction.
所述多个第一焊盘和所述多个第二焊盘均可以具有在每条延长线上延伸的平行四边形形状。Each of the plurality of first pads and the plurality of second pads may have a parallelogram shape extending on each extended line.
本公开的示例性实施例还提供一种电子装置，所述电子装置包括包含第一焊盘区域的第一电子组件和包含电连接到第一焊盘区域的第二焊盘区域的第二电子组件，这里，第一焊盘区域和第二焊盘区域中的一个焊盘区域包括沿对应的延长线延伸并连续布置的多个第一焊盘以及沿对应的延长线延伸并连续布置的多个第二焊盘，其中，所述多个第一焊盘的延长线基本上会聚于第一点，所述多个第二焊盘的延长线基本上会聚于与所述第一点不同的第二点。Exemplary embodiments of the present disclosure also provide an electronic device including a first electronic component including a first pad region and a second electronic component including a second pad region electrically connected to the first pad region. component, here, one of the first pad area and the second pad area includes a plurality of first pads extending along the corresponding extension line and continuously arranged, and a plurality of first pads extending along the corresponding extension line and continuously arranged a second pad, wherein the extension lines of the plurality of first pads substantially converge at a first point, and the extension lines of the plurality of second pads substantially converge at a different point from the first point Second point.
第一电子组件可以包括电光面板或布线基底，第二电子组件可以包括柔性布线基底。The first electronic component may include an electro-optical panel or a wiring substrate, and the second electronic component may include a flexible wiring substrate.
第一点和第二点可以设置在电光面板或布线基底上。The first point and the second point may be provided on an electro-optical panel or a wiring substrate.
第一点和第二点可以设置在柔性布线基底上。The first point and the second point may be provided on the flexible wiring substrate.
第一焊盘区域和第二焊盘区域的另一个焊盘区域可以包括沿着对应的延长线延伸的多个第三焊盘和多个第四焊盘，所述多个第三焊盘的延长线基本上会聚于第三点，所述多个第四焊盘的延长线基本上会聚于与第三点不同的第四点，所述多个第三焊盘电连接到所述多个第一焊盘，所述多个第四焊盘电连接到所述多个第二焊盘。The other pad area of the first pad area and the second pad area may include a plurality of third pads and a plurality of fourth pads extending along corresponding extension lines, the plurality of third pads The extension lines basically converge at a third point, the extension lines of the plurality of fourth pads basically converge at a fourth point different from the third point, and the plurality of third pads are electrically connected to the plurality of The first pad, the plurality of fourth pads are electrically connected to the plurality of second pads.
本公开的示例性实施例还提供一种电子装置的接合方法，所述电子装置包括第一电子组件和第二电子组件，其中，第一电子组件和第二电子组件的焊盘区域彼此电结合，所述方法包括：将第一电子组件的焊盘区域和第二电子组件的焊盘区域对齐；计算第一电子组件的焊盘区域和第二电子组件的焊盘区域之间的X-轴位移误差值；当X-轴位移误差值小于基准值时，将第一电子组件的焊盘区域和第二电子组件的焊盘区域结合；当X-轴位移误差值大于基准值时，根据X-轴位移误差值来计算Y-轴校正值，并且基于Y-轴校正值来校正第一电子组件的焊盘区域和第二电子组件的焊盘区域中的至少一者的Y轴位移。Exemplary embodiments of the present disclosure also provide a bonding method of an electronic device including a first electronic component and a second electronic component, wherein pad regions of the first electronic component and the second electronic component are electrically bonded to each other , the method comprising: aligning the pad area of the first electronic component with the pad area of the second electronic component; calculating the X-axis between the pad area of the first electronic component and the pad area of the second electronic component Displacement error value; when the X-axis displacement error value is less than the reference value, the pad area of the first electronic component is combined with the pad area of the second electronic component; when the X-axis displacement error value is greater than the reference value, according to X -axis displacement error value to calculate a Y-axis correction value, and correct the Y-axis displacement of at least one of the pad area of the first electronic component and the pad area of the second electronic component based on the Y-axis correction value.
将第一电子组件的焊盘区域与第二电子组件的焊盘区域对齐的步骤可以包括将第一电子组件的对齐标记和第二电子组件的对齐标记对齐。Aligning the pad area of the first electronic component with the pad area of the second electronic component may include aligning an alignment mark of the first electronic component with an alignment mark of the second electronic component.
第一电子组件的焊盘区域和第二电子组件的焊盘区域中的一者包括沿X-轴布置并沿着对应的延长线延伸的多个第一焊盘和多个第二焊盘，所述多个第一焊盘的延长线基本上会聚于第一点，所述多个第二焊盘的延长线基本上会聚于与第一点不同的第二点。One of the pad area of the first electronic component and the pad area of the second electronic component includes a plurality of first pads and a plurality of second pads arranged along the X-axis and extending along corresponding extension lines, The extension lines of the plurality of first pads substantially converge at a first point, and the extension lines of the plurality of second pads substantially converge at a second point different from the first point.
第一电子组件的焊盘区域和第二电子组件的焊盘区域中的另一者可以包括沿X-轴布置并沿着对应的延长线延伸的多个第三焊盘和多个第四焊盘，所述多个第三焊盘的延长线基本上会聚于第三点，所述多个第四焊盘的延长线基本上会聚于与第三点不同的第四点，所述多个第三焊盘电连接到所述多个第一焊盘，所述多个第四焊盘电连接到所述多个第二焊盘。The other of the pad area of the first electronic component and the pad area of the second electronic component may include a plurality of third pads and a plurality of fourth pads arranged along the X-axis and extending along corresponding extension lines. The extension lines of the plurality of third pads basically converge at a third point, the extension lines of the plurality of fourth pads basically converge at a fourth point different from the third point, and the plurality of The third pads are electrically connected to the plurality of first pads, and the plurality of fourth pads are electrically connected to the plurality of second pads.
本公开的示例性实施例还提供一种电子组件，所述电子组件包括：焊盘区域，包括沿第一方向轴布置的多个第一焊盘和多个第二焊盘；信号布线，被构造为电连接到焊盘区域的，其中，所述多个第一焊盘具有沿着与第一方向轴平行的第一线测量的第一节距和与第一节距不同的第二节距，第二节距是沿着与第一方向轴平行的且不同于第一线的第二线测量的，所述多个第二焊盘具有与第一节距不同并沿着第一线测量的第三节距以及与第二节距不同并沿着第二线测量的第四节距，其中，第一节距被定义为所述多个第一焊盘中的一个第一焊盘的沿着第一线测量的宽度与所述多个第一焊盘中的相邻的两个第一焊盘之间的沿着第一线测量的间隔的和，其中，第二节距被定义为所述多个第一焊盘中的一个第一焊盘的沿着第二线测量的宽度与所述多个第一焊盘中的相邻的两个第一焊盘之间的沿着第二线测量的间隔的和，其中，第三节距被定义为所述多个第二焊盘中的一个第二焊盘的沿着第一线测量的宽度与所述多个第二焊盘中的相邻的两个第二焊盘之间的沿着第一线测量的间隔的和，其中，第四节距被定义为所述多个第二焊盘中的一个第二焊盘的沿着第二线测量的宽度与所述多个第二焊盘中的相邻的两个第二焊盘之间的沿着第二线测量的间隔的和。Exemplary embodiments of the present disclosure also provide an electronic component including: a pad region including a plurality of first pads and a plurality of second pads arranged along a first direction axis; configured to be electrically connected to the pad region, wherein the plurality of first pads have a first pitch measured along a first line parallel to the first direction axis and a second pitch different from the first pitch The second pitch is measured along a second line parallel to the first direction axis and different from the first line, and the plurality of second pads have a pitch different from the first line and measured along the first line and a fourth pitch different from the second pitch and measured along the second line, wherein the first pitch is defined as the edge of one first pad in the plurality of first pads The sum of the width measured along the first line and the interval measured along the first line between two adjacent first pads among the plurality of first pads, wherein the second pitch is defined as The width measured along the second line of one first pad among the plurality of first pads is the same as the width measured along the second line between two adjacent first pads among the plurality of first pads. The sum of measured intervals, wherein the third pitch is defined as the difference between the width of one of the plurality of second pads measured along the first line and the width of the plurality of second pads The sum of the intervals measured along the first line between two adjacent second pads, wherein the fourth pitch is defined as the distance between one second pad in the plurality of second pads along the The sum of the width measured along the second line and the interval between two adjacent second pads among the plurality of second pads measured along the second line.
由所述多个第一焊盘中的与焊盘区域的外部相邻的第一焊盘和第一方向轴形成的第一夹角可以小于由与焊盘区域的中心相邻的第一焊盘和第一方向轴形成的第一夹角。The first included angle formed by the first pads adjacent to the outside of the pad area and the first direction axis among the plurality of first pads may be smaller than that formed by the first pads adjacent to the center of the pad area. The first included angle formed by the disk and the first direction axis.
由所述多个第二焊盘中的与焊盘区域的外部相邻的第二焊盘和第一方向轴形成的第二夹角可以小于由与焊盘区域的中心相邻的第二焊盘和第一方向轴形成的第二夹角。The second included angle formed by the second pads adjacent to the outside of the pad area and the first direction axis among the plurality of second pads may be smaller than that formed by the second pads adjacent to the center of the pad area. The second angle formed by the disk and the first orientation axis.
所述多个第二焊盘可以被设置为与所述多个第一焊盘相比沿着第一方向轴距离中心更远，第三节距大于第一节距。The plurality of second pads may be disposed farther from the center along the first direction axis than the plurality of first pads, with a third pitch greater than the first pitch.
本公开的示例性实施例还提供一种电子组件，所述电子组件包括沿着第一方向轴布置的焊盘区域和被构造为电连接到焊盘区域的信号布线，所述焊盘区域包括相对于第一方向轴倾斜的多个焊盘，其中，所述多个焊盘包括具有第一夹角变量并且连续地布置的多个第一焊盘以及具有与第一夹角变量不同的第二夹角变量并且连续地布置的多个第二焊盘。Exemplary embodiments of the present disclosure also provide an electronic component including a pad area arranged along a first direction axis and a signal wiring configured to be electrically connected to the pad area, the pad area including A plurality of pads inclined with respect to the first direction axis, wherein the plurality of pads include a plurality of first pads arranged continuously with a first included angle variable and a first pad with a first included angle variable different from the first included angle variable A plurality of second bonding pads arranged continuously with variable included angles.
随着所述多个第一焊盘逐渐接近于焊盘区域的中心，由第一方向轴和所述多个第一焊盘形成的第一夹角可以根据第一夹角变量而增大；随着所述多个第二焊盘逐渐接近于焊盘区域的中心，由第一方向轴和所述多个第二焊盘形成的第二夹角可以根据第二夹角变量而增大。As the plurality of first pads gradually approaches the center of the pad area, a first included angle formed by the first direction axis and the plurality of first pads may increase according to a first included angle variable; As the plurality of second pads gradually approaches the center of the pad area, a second included angle formed by the first direction axis and the plurality of second pads may increase according to a second included angle variable.
第一夹角θ1n可以由所述多个第一焊盘中的第n个第一焊盘的延长线和基准线形成，并且满足下面的等式1，The first included angleθ1n may be formed by an extension line and a reference line of the nth first pad among the plurality of first pads, and satisfies Equation 1 below,
[等式1][equation 1]
θ1n＝θ11-(n-1)α，θ1n = θ11 -(n-1)α,
其中，θ11是由所述多个第一焊盘中的设置在最外面的第一焊盘的延长线和基准线形成的第一夹角，n为大于或等于2的自然数，α为所述第一夹角变量。Wherein, θ11 is the first included angle formed by the extension line and the reference line of the outermost first pad among the plurality of first pads, n is a natural number greater than or equal to 2, and α is all Describe the first included angle variable.
第二夹角θ2m可以由所述多个第二焊盘中的第m个第二焊盘的延长线和基准线形成，并且满足下面的等式2，The second included angleθ2m may be formed by the extension line and the reference line of the m-th second pad in the plurality of second pads, and satisfies the following equation 2,
[等式2][equation 2]
θ2m＝θ21-(m-1)β，θ2m = θ21 -(m-1)β,
其中，θ21是由所述多个第二焊盘中的设置在最外面的第二焊盘的延长线和基准线形成的第二夹角，m为大于或等于2的自然数，β为所述第二夹角变量。Wherein, θ21 is the second included angle formed by the extension line and the reference line of the outermost second pad among the plurality of second pads, m is a natural number greater than or equal to 2, and β is all Describe the second included angle variable.
本公开的示例性实施例还提供一种电子组件，所述电子组件包括被配置为接收驱动信号的焊盘区域以及电连接到所述焊盘区域的信号布线，所述焊盘区域包括：第一焊盘行，具有沿着对应的延长线延伸的焊盘；第二焊盘行，具有沿着对应的延长线延伸的焊盘，其中，第一焊盘行的焊盘包括多个第一焊盘和多个第二焊盘，所述多个第一焊盘的延长线基本上会聚于第一点，所述多个第二焊盘的延长线基本上会聚于不同于第一点的第二点，其中，第二焊盘行的焊盘包括多个第三焊盘和多个第四焊盘，所述多个第三焊盘的延长线基本上会聚于第三点，所述多个第四焊盘的延长线基本上会聚于不同于第三点的第四点。Exemplary embodiments of the present disclosure also provide an electronic component including a pad area configured to receive a driving signal and a signal wiring electrically connected to the pad area, the pad area including: a first A row of pads has pads extending along corresponding extension lines; a second row of pads has pads extending along corresponding extension lines, wherein the pads of the first row of pads include a plurality of first A pad and a plurality of second pads, the extension lines of the plurality of first pads basically converge at a first point, and the extension lines of the plurality of second pads basically converge at a location different from the first point The second point, wherein the pads in the second row of pads include a plurality of third pads and a plurality of fourth pads, and the extension lines of the plurality of third pads basically converge at the third point, the Extended lines of the plurality of fourth pads substantially converge at a fourth point different from the third point.
第一焊盘行的焊盘可以沿着第一方向轴布置，由第一焊盘行的焊盘的延长线和与第一方向轴垂直的第二方向轴形成的夹角可以随着从第一焊盘行的外部逐渐接近中心而减小。The pads of the first pad row may be arranged along the first direction axis, and the included angle formed by the extension line of the pads of the first pad row and the second direction axis perpendicular to the first direction axis may increase from the first direction axis. The outer portion of a row of pads gradually decreases towards the center.
由第一焊盘的延长线和第二方向轴形成的第一夹角可以随着从第一焊盘行的外部逐渐接近中心而以第一值减小，由第二焊盘的延长线和第二方向轴形成的第二夹角可以随着从第一焊盘行的外部逐渐接近中心而以与第一值不同的第二值减小。The first included angle formed by the extension line of the first pad and the second direction axis may decrease with a first value as it gradually approaches the center from the outside of the first pad row, and the extension line of the second pad row and The second included angle formed by the second direction axis may decrease with a second value different from the first value as gradually approaching the center from the outside of the first pad row.
第一夹角θ1n可以由所述多个第一焊盘中的第n个第一焊盘的延长线和基准线形成，并且满足下面的等式1，The first included angleθ1n may be formed by an extension line and a reference line of the nth first pad among the plurality of first pads, and satisfies Equation 1 below,
[等式1][equation 1]
θ1n＝θ11-(n-1)α，θ1n = θ11 -(n-1)α,
其中，θ11是由所述多个第一焊盘中的设置在最外面的第一焊盘的延长线和基准线形成的第一夹角，n为大于或等于2的自然数，α为所述第一值。Wherein, θ11 is the first included angle formed by the extension line and the reference line of the outermost first pad among the plurality of first pads, n is a natural number greater than or equal to 2, and α is all the first value.
第二夹角θ2m可以由所述多个第二焊盘中的第m个第二焊盘的延长线和基准线形成，并且满足下面的等式2，The second included angleθ2m may be formed by the extension line and the reference line of the m-th second pad in the plurality of second pads, and satisfies the following equation 2,
[等式2][equation 2]
θ2m＝θ21-(m-1)β，θ2m = θ21 -(m-1)β,
其中，θ21是由所述多个第二焊盘中的设置在最外面的第二焊盘的延长线和基准线形成的第二夹角，m为大于或等于2的自然数，β为所述第二值。Wherein, θ21 is the second included angle formed by the extension line and the reference line of the outermost second pad among the plurality of second pads, m is a natural number greater than or equal to 2, and β is all the second value.
所述多个第一焊盘可以沿着第一方向轴比所述多个第二焊盘更为接近中心，并且θ11满足下面的等式3，The plurality of first pads may be closer to the center along the first direction axis than the plurality of second pads, and θ11 satisfies Equation 3 below,
[等式3][equation 3]
θ11≠θ21-K×β，θ11 ≠ θ21 -K×β,
其中，K为第二焊盘的个数。Wherein, K is the number of the second pads.
与第二方向轴平行的基准线可以限定在第一焊盘行的中心，第一点和第二点设置在基准线上的不同位置处。A reference line parallel to the second direction axis may be defined at the center of the first pad row, and the first point and the second point are disposed at different positions on the reference line.
与第二方向轴平行的基准线可以限定在第一焊盘行的中心，第一点和第二点中的一个点可以设置在基准线上，第一点和第二点中的另一个点设置在基准线的外部。A reference line parallel to the second direction axis may be defined at the center of the first pad row, one of the first point and the second point may be set on the reference line, and the other point of the first point and the second point may be set on the reference line. Set outside the baseline.
第一点和第二点可以设置在与第一方向轴平行的平行线上。The first point and the second point may be arranged on a parallel line parallel to the first direction axis.
与第二方向轴平行的基准线可以限定在第一焊盘行的中心，第一焊盘行的焊盘还可以包括相对于基准线分别与所述多个第一焊盘和所述多个第二焊盘对称的多个第五焊盘和多个第六焊盘。A reference line parallel to the second direction axis may be defined at the center of the first row of pads, and the pads of the first row of pads may also include relative to the reference line, respectively associated with the plurality of first pads and the plurality of first pads. The second pad is symmetrical to a plurality of fifth pads and a plurality of sixth pads.
第二焊盘行的焊盘可以沿着第一方向轴布置，由第二焊盘行的焊盘的延长线和第二方向轴形成的夹角可以随着从第二焊盘行的外部逐渐接近第二焊盘行的中心而减小。The pads of the second pad row may be arranged along the first direction axis, and the included angle formed by the extension line of the pads of the second pad row and the second direction axis may gradually increase from the outside of the second pad row. Decreases near the center of the second pad row.
在平面上，第二焊盘行的焊盘的形式和布置可以与第一焊盘行的焊盘的形式和布置相同。On a plane, the form and arrangement of the pads of the second pad row may be the same as those of the first pad row.
与第二方向轴平行的第一基准线可以限定在第一焊盘行的中心，与第二方向轴平行的第二基准线可以限定在第二焊盘行的中心，第一基准线和第二基准线可以彼此叠置。A first reference line parallel to the second direction axis may be defined at the center of the first pad row, a second reference line parallel to the second direction axis may be defined at the center of the second pad row, the first reference line and the first Two baselines can be on top of each other.
第三点和第四点之间的距离可以与第一点和第二点之间的距离相同。The distance between the third point and the fourth point may be the same as the distance between the first point and the second point.
第一点和第二点可以设置在第一基准线上的不同位置处，第三点和第四点可以设置在第二基准线上的不同位置处。The first point and the second point may be set at different positions on the first reference line, and the third point and the fourth point may be set at different positions on the second reference line.
第一点和第二点中的一个点可以设置在第一基准线上而另一个点设置在第一基准线的外部，第三点和第四点中的一个点设置在第二基准线上而另一个点设置在第二基准线的外部。One of the first point and the second point may be set on the first reference line while the other point is set outside the first reference line, and one of the third point and the fourth point is set on the second reference line And another point is set outside the second reference line.
第一点和第二点可以设置在与第一方向轴平行的第一平行线上，第三点和第四点设置在与第一方向轴平行的第二平行线上。The first point and the second point may be arranged on a first parallel line parallel to the first direction axis, and the third point and the fourth point may be arranged on a second parallel line parallel to the first direction axis.
第一焊盘行的焊盘可以沿着第一方向轴布置，每个第一焊盘具有第一节距，每个第二焊盘具有与第一节距不同的第二节距，第一节距被定义为每个第一焊盘的沿着第一方向轴的宽度和所述多个第一焊盘中的相邻的两个第一焊盘之间的沿着第一方向轴的间隔的和，第二节距被定义为每个第二焊盘的沿着第一方向轴的宽度和所述多个第二焊盘中的相邻的两个第二焊盘之间的沿着第一方向轴的间隔的和。The pads of the first pad row may be arranged along the first direction axis, each first pad has a first pitch, each second pad has a second pitch different from the first pitch, the first The pitch is defined as the width of each first pad along the first direction axis and the distance between two adjacent first pads among the plurality of first pads along the first direction axis. The sum of intervals, the second pitch is defined as the width of each second pad along the first direction axis and the edge between two adjacent second pads among the plurality of second pads The sum of the intervals along the first direction axis.
所述多个第二焊盘可以被设置为与所述多个第一焊盘相比沿着第一方向轴距离中心更远，第二节距大于第一节距。The plurality of second pads may be disposed farther from the center along the first direction axis than the plurality of first pads, with a second pitch greater than the first pitch.
本公开的示例性实施例还提供一种电子装置，所述电子装置包括第一电子组件和电连接到第一电子组件的第二电子组件，其中，第一电子组件包括第一焊盘区域，第二电子组件电连接到第一焊盘区域，其中，第一焊盘区域包括具有沿着对应的延长线延伸的多个焊盘的第一焊盘行和具有沿着对应的延长线延伸的多个焊盘的第二焊盘行，其中，第一焊盘行的焊盘包括多个第一焊盘和多个第二焊盘，所述多个第一焊盘的延长线基本上会聚于第一点，所述多个第二焊盘的延长线基本上会聚于不同于第一点的第二点，其中，第二焊盘行的焊盘包括多个第三焊盘和多个第四焊盘，所述多个第三焊盘的延长线基本上会聚于第三点，所述多个第四焊盘的延长线基本上会聚于不同于第三点的第四点。Exemplary embodiments of the present disclosure also provide an electronic device including a first electronic component and a second electronic component electrically connected to the first electronic component, wherein the first electronic component includes a first pad region, The second electronic component is electrically connected to the first pad area, wherein the first pad area includes a first pad row having a plurality of pads extending along corresponding extension lines and a first pad row having pads extending along corresponding extension lines. A second pad row of a plurality of pads, wherein the pads of the first pad row include a plurality of first pads and a plurality of second pads, and extension lines of the plurality of first pads substantially converge At the first point, the extension lines of the plurality of second pads basically converge at a second point different from the first point, wherein the pads of the second row of pads include a plurality of third pads and a plurality of For the fourth pad, the extension lines of the plurality of third pads basically converge at a third point, and the extension lines of the plurality of fourth pads basically converge at a fourth point different from the third point.
第二焊盘区域可以包括电连接到第一焊盘行并包括沿对应的延长线延伸的焊盘的第三焊盘行以及电连接到第二焊盘行并包括沿对应的延长线延伸的焊盘的第四焊盘行。The second pad region may include a third row of pads electrically connected to the first row of pads and including pads extending along corresponding extension lines, and a third row of pads electrically connected to the second row of pads and including pads extending along corresponding extension lines. The fourth pad row of pads.
第三焊盘行的焊盘可以包括延长线基本上会聚于第五点的第五焊盘以及延长线基本上会聚于与第五点不同的第六点的第六焊盘，第四焊盘行的焊盘可以包括延长线基本上会聚于第七点的第七焊盘以及延长线基本上会聚于与第七点不同的第八点的第八焊盘。The pads of the third pad row may include a fifth pad whose extension line substantially converges at a fifth point and a sixth pad whose extension line basically converges at a sixth point different from the fifth point, and the fourth pad The pads of the row may include a seventh pad whose extension line substantially converges at a seventh point and an eighth pad whose extension line substantially converges at an eighth point different from the seventh point.
第一电子组件因热而受到的应力可以比第二电子组件因热而受到的应力小。The first electronic component may be less stressed by heat than the second electronic component.
第三焊盘行的焊盘在延伸方向上的长度可以小于第一焊盘行的焊盘在延伸方向上的长度，第四焊盘行的焊盘在延伸方向上的长度可以小于第二焊盘行的焊盘在延伸方向上的长度。The length of the pads in the third row of pads in the direction of extension may be smaller than the length of the pads in the first row of pads in the direction of extension, and the length of the pads in the fourth row of pads in the direction of extension may be shorter than that of the second pad row. The length of the pads of the pad row in the direction of extension.
第一电子组件可以包括电光面板或布线基底，第二电子组件可以包括柔性布线基底。The first electronic component may include an electro-optical panel or a wiring substrate, and the second electronic component may include a flexible wiring substrate.
所述柔性布线基底可以包括：绝缘层，具有可以设置有第五焊盘、第六焊盘、第七焊盘和第八焊盘的一侧；第一布线，设置在绝缘层的所述一侧上并且连接到第五焊盘、第六焊盘、第七焊盘和第八焊盘；第二布线，设置在绝缘层的另一侧上并且经由限定在绝缘层中的第一通孔而连接到一些第一布线。The flexible wiring substrate may include: an insulating layer having one side on which a fifth pad, a sixth pad, a seventh pad, and an eighth pad may be provided; a first wiring provided on the one side of the insulating layer. side and connected to the fifth pad, the sixth pad, the seventh pad, and the eighth pad; the second wiring is provided on the other side of the insulating layer and via the first through hole defined in the insulating layer And connect to some first wiring.
所述柔性布线基底还可以包括设置在绝缘层的一侧上并且与第一布线分隔开的第三布线，所述第三布线可以通过限定在绝缘层中的第二通孔连接到第二布线。The flexible wiring substrate may further include a third wiring provided on one side of the insulating layer and separated from the first wiring, and the third wiring may be connected to the second wiring through a second via hole defined in the insulating layer. wiring.
所述第二电子组件还可以包括连接到第一布线的驱动芯片。The second electronic component may further include a driving chip connected to the first wiring.
每条第二布线可以包括与第一通孔中对应的第一通孔叠置的连接盘部分和连接到连接盘部分的布线部分，其中，连接盘部分具有宽度随着从第一通孔逐渐接近于布线部分而减小的形式。Each of the second wirings may include a land portion overlapping with a corresponding first through hole among the first through holes and a wiring portion connected to the land portion, wherein the land portion has a width increasing gradually from the first through hole. A form that is reduced closer to the wiring portion.
所述柔性布线基底还可以包括设置在第三焊盘行和第四焊盘行之间的虚设焊盘。The flexible wiring substrate may further include dummy pads disposed between the third pad row and the fourth pad row.
所述虚设焊盘可以与第五焊盘、第六焊盘、第七焊盘和第八焊盘设置在同一层上。The dummy pad may be disposed on the same layer as the fifth pad, the sixth pad, the seventh pad, and the eighth pad.
附图说明Description of drawings
通过参照附图详细地描述示例性实施例，特征对于本领域普通技术人员而言将变得明显，在附图中：Features will become apparent to those of ordinary skill in the art by describing in detail exemplary embodiments with reference to the accompanying drawings, in which:
图1示出根据实施例的电子装置的平面图；1 shows a plan view of an electronic device according to an embodiment;
图2示出沿着图1的线I-I'截取的剖视图；Fig. 2 shows a sectional view taken along line II' of Fig. 1;
图3A示出根据实施例的第二电子组件的侧视图；Figure 3A shows a side view of a second electronic assembly according to an embodiment;
图3B示出根据实施例的第二电子组件的平面图；Figure 3B shows a plan view of a second electronic assembly according to an embodiment;
图4A示出图1中示出的两个电子组件的分开的焊盘区域的平面图；Figure 4A shows a plan view of separate pad regions of the two electronic components shown in Figure 1;
图4B示出图1中示出的两个电子组件的结合的焊盘区域的平面图；Figure 4B shows a plan view of the bonded pad regions of the two electronic components shown in Figure 1;
图4C示出沿着图4B中的线II-II'截取的组件122的局部剖视图；FIG. 4C shows a partial cross-sectional view of assembly 122 taken along line II-II' in FIG. 4B;
图5A至图5D示出根据实施例的第一电子组件的焊盘区域的平面图；5A to 5D illustrate plan views of pad regions of a first electronic component according to an embodiment;
图6至图11示出根据实施例的第一电子组件的焊盘区域的平面图；6 to 11 illustrate plan views of pad regions of a first electronic component according to an embodiment;
图12示出根据实施例的电子组件的结合的焊盘区域的平面图；12 shows a plan view of a bonded pad area of an electronic assembly according to an embodiment;
图13示出根据实施例的电子装置的接合工艺的流程图；13 shows a flowchart of a bonding process of an electronic device according to an embodiment;
图14A示出根据实施例的接合工艺期间的对齐操作的平面图；14A shows a plan view of an alignment operation during a bonding process according to an embodiment;
图14B示出根据实施例的接合工艺期间的Y轴校正操作的平面图；14B illustrates a plan view of a Y-axis correction operation during a bonding process according to an embodiment;
图14C示出根据实施例的接合工艺期间的结合操作的平面图；Figure 14C shows a plan view of a bonding operation during a bonding process according to an embodiment;
图15示出根据实施例完成接合工艺的电子装置的焊盘区域的平面图；15 shows a plan view of a pad region of an electronic device where a bonding process is completed according to an embodiment;
图16A示出根据实施例的两个电子组件的分开的焊盘区域的平面图；Figure 16A shows a plan view of separate pad regions of two electronic components according to an embodiment;
图16B示出根据实施例的两个电子组件的结合的焊盘区域的平面图；Figure 16B shows a plan view of the bonded pad regions of two electronic components according to an embodiment;
图17A和图17B示出根据实施例的第一电子组件的焊盘区域的平面图；17A and 17B illustrate plan views of pad regions of a first electronic component according to an embodiment;
图18至图23示出根据实施例的第一电子组件的焊盘区域的平面图；18 to 23 illustrate plan views of pad regions of a first electronic component according to an embodiment;
图24A示出根据实施例的第二电子组件的侧视图；Figure 24A shows a side view of a second electronic assembly according to an embodiment;
图24B示出根据实施例的第二电子组件的第一平面图；Figure 24B shows a first plan view of a second electronic assembly according to an embodiment;
图24C示出根据实施例的第二电子组件的第二平面图；Figure 24C shows a second plan view of a second electronic assembly according to an embodiment;
图25A示出根据实施例沿着图24B和图24C的第一截线截取的剖视图；25A shows a cross-sectional view taken along the first section line of FIGS. 24B and 24C , according to an embodiment;
图25B示出根据实施例沿着图24B和图24C的第二截线截取的剖视图；25B shows a cross-sectional view taken along the second section line of FIGS. 24B and 24C , according to an embodiment;
图26A至图26E示出图24B和图24C中示出的布线的局部放大视图；26A to 26E show partial enlarged views of the wiring shown in FIGS. 24B and 24C;
图27A示出根据实施例的第二电子组件的平面图；Figure 27A shows a plan view of a second electronic assembly according to an embodiment;
图27B示出沿着图27A的第三截线截取的剖视图；Figure 27B shows a cross-sectional view taken along the third section line of Figure 27A;
图28A示出根据实施例的第二电子组件的平面图；Figure 28A shows a plan view of a second electronic assembly according to an embodiment;
图28B示出图28A的第一虚设焊盘的平面图；以及Figure 28B shows a plan view of the first dummy pad of Figure 28A; and
图28C示出图28A的第二虚设焊盘的平面图。FIG. 28C illustrates a plan view of the second dummy pad of FIG. 28A.
具体实施方式Detailed ways
可以在各种实施中进行各种变型，附图中示出特定的实施例并且列出相关的详细描述。因此，实施例并不意图限制而是被理解为包括在示例性实施的范围内和技术范畴内的所有变型、等同物和替代物。Various modifications are possible in various implementations, specific embodiments are shown in the drawings and the associated detailed descriptions are set forth. Therefore, the embodiments are not intended to be limiting but to be understood to include all modifications, equivalents, and replacements within the scope of exemplary implementations and within the technical category.
在描述每幅图时，同样的附图标记指示相同的元件。在附图中，为了示出的清楚，会夸大结构的尺寸。将理解的是，术语“第一”和“第二”在这里用于描述各种组件，但是这些组件不应被这些术语限制。这些术语仅用于将一个组件与其他组件区分开。例如，在不脱离实施例的范围的情况下，第一组件可以被称为第二组件，反之亦然。单数形式的术语可以包括复数形式，除非它们在上下文中具有清确不同的含义。Like reference numerals refer to like elements in describing each figure. In the drawings, the size of structures may be exaggerated for clarity of illustration. It will be understood that the terms "first" and "second" are used herein to describe various components, but these components should not be limited by these terms. These terms are only used to distinguish one component from another. For example, a first component may be called a second component, and vice versa, without departing from the scope of the embodiments. Terms in a singular form may include plural forms unless they have clearly different meanings in context.
另外，在本说明书中，“包括”、“包含”及其变型形式表示性质、区域、固定数量、步骤、工艺、元件和/或组件，但是不排除其他的性质、区域、固定数量、步骤、工艺、元件和/或组件。还将理解的是，当层(或膜)被称作“在”另一个层或基底“上”时，该层(或膜)可以直接在另一个层或基底上，或者也可以存在中间层。还将理解的是，当层(或膜)被称作“在”另一个层或基底“下”时，该层(或膜)可以直接在另一个层或基底下，或者也可以存在中间层。In addition, in this specification, "comprises", "comprises" and their variant forms represent properties, regions, fixed quantities, steps, processes, elements and/or components, but do not exclude other properties, regions, fixed quantities, steps, process, element and/or assembly. It will also be understood that when a layer (or film) is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present. . It will also be understood that when a layer (or film) is referred to as being "under" another layer or substrate, it can be directly under the other layer or substrate, or intervening layers may also be present. .
在下文中，将参照附图更详细地描述优选的实施例。Hereinafter, preferred embodiments will be described in more detail with reference to the accompanying drawings.
图1是示出根据实施例的电子装置的平面图。图2是沿着图1的线I-I'截取的剖视图。图3A是根据实施例的第二电子组件的侧视图。图3B是根据实施例的第二电子组件的平面图。FIG. 1 is a plan view illustrating an electronic device according to an embodiment. FIG. 2 is a cross-sectional view taken along line II' of FIG. 1 . 3A is a side view of a second electronic assembly according to an embodiment. 3B is a plan view of a second electronic assembly according to an embodiment.
参照图1和图2，电子装置100包括第一电子组件110、第二电子组件120和第三电子组件130。第一电子组件至第三电子组件彼此电连接。在实施例中，第一电子组件110可以是电光面板。第二电子组件120可以是连接布线基底。第三电子组件130可以是主布线基底。连接布线基底和主布线基底均可以包括印刷电路板。本实施例示例性地示出了包括三个第二电子组件120的电子装置100，但实施例不限于此。根据应用或尺寸，电子装置100可以包括一个第二电子组件120。Referring to FIGS. 1 and 2 , the electronic device 100 includes a first electronic component 110 , a second electronic component 120 and a third electronic component 130 . The first to third electronic components are electrically connected to each other. In an embodiment, the first electronic component 110 may be an electro-optic panel. The second electronic component 120 may be a connection wiring substrate. The third electronic component 130 may be a main wiring substrate. Both the connection wiring substrate and the main wiring substrate may include a printed circuit board. This embodiment exemplarily shows the electronic device 100 including three second electronic components 120, but the embodiment is not limited thereto. According to applications or sizes, the electronic device 100 may include one second electronic component 120 .
如图1中所示，电光面板110(在下文中称作显示面板)可以是通过向多个像素PX施加驱动信号来显示期望图像的显示面板。多个像素PX可以按照彼此垂直的第一方向轴A1和第二方向轴A2以矩阵设置。根据实施例，像素PX可以包括分别显示红色R、绿色G和蓝色B的第一像素至第三像素。根据实施例，像素PX还可以包括显示白、青和品红的一些像素(未示出)。多个像素PX可以被限定为显示面板110的显示单元。As shown in FIG. 1 , the electro-optic panel 110 (hereinafter referred to as a display panel) may be a display panel that displays a desired image by applying a driving signal to a plurality of pixels PX. A plurality of pixels PX may be arranged in a matrix along a first direction axis A1 and a second direction axis A2 perpendicular to each other. According to an embodiment, the pixel PX may include first to third pixels displaying red R, green G, and blue B, respectively. According to an embodiment, the pixel PX may further include some pixels (not shown) displaying white, cyan, and magenta. A plurality of pixels PX may be defined as a display unit of the display panel 110 .
根据多个像素PX的类型，显示面板110可以分为液晶显示面板、有机发光显示面板和电润湿显示面板。在本实施例中，显示面板110可以是有机发光显示面板。According to the types of the plurality of pixels PX, the display panel 110 may be classified into a liquid crystal display panel, an organic light emitting display panel, and an electrowetting display panel. In this embodiment, the display panel 110 may be an organic light emitting display panel.
显示面板110可以在一个平面上包括设置有多个像素PX的显示区域DA、围绕显示区域DA的非显示区域BA和结合第二电子组件120的安装区域MA。根据实施例，非显示区域BA和安装区域MA可以不相互区分。可以省略非显示区域BA，或者安装区域MA可以是非显示区域BA的一部分。The display panel 110 may include a display area DA provided with a plurality of pixels PX, a non-display area BA surrounding the display area DA, and a mounting area MA incorporating the second electronic component 120 on one plane. According to an embodiment, the non-display area BA and the installation area MA may not be distinguished from each other. The non-display area BA may be omitted, or the installation area MA may be a part of the non-display area BA.
如图2所示，显示面板110可以包括显示基底112、设置在显示基底112上的显示装置层114以及设置在显示装置层114上的密封层116。显示基底112可以包括基础基底以及位于基础基底上的多个绝缘层、功能层和导电层。导电层可以包括栅极布线(未示出)、数据布线(未示出)和其他信号布线。另外，导电层可以包括连接到布线的焊盘区域(未示出)。布线向多个像素PX提供驱动信号。As shown in FIG. 2 , the display panel 110 may include a display substrate 112 , a display device layer 114 disposed on the display substrate 112 , and a sealing layer 116 disposed on the display device layer 114 . The display substrate 112 may include a base substrate and a plurality of insulating layers, functional layers and conductive layers on the base substrate. The conductive layer may include gate wiring (not shown), data wiring (not shown) and other signal wiring. In addition, the conductive layer may include a pad region (not shown) connected to the wiring. The wiring supplies drive signals to a plurality of pixels PX.
显示装置层114可以包括用于构造多个像素PX的多个绝缘层、功能层和导电层。功能层可以包括有机发光层。密封层116设置在显示装置层114上。密封层116保护显示装置层114。虽然图中没有具体示出，但是根据实施例，密封层116可以覆盖显示装置层114的一侧。另外，根据显示面板110的类型，密封层116可以被省略或用另一显示基底代替。The display device layer 114 may include a plurality of insulating layers, functional layers, and conductive layers for configuring the plurality of pixels PX. The functional layer may include an organic light emitting layer. The sealing layer 116 is disposed on the display device layer 114 . The sealing layer 116 protects the display device layer 114 . Although not specifically shown in the drawings, according to an embodiment, the sealing layer 116 may cover one side of the display device layer 114 . In addition, according to the type of the display panel 110, the sealing layer 116 may be omitted or replaced with another display substrate.
阻挡光的黑矩阵(未示出)可以设置在非显示区域BA中。用于向多个像素X施加栅极信号的栅极驱动电路(未示出)可以设置在非显示区域BA中。根据实施例，数据驱动电路(未示出)还可以设置在非显示区域BA中。用于接收来自第二电子组件120的信号的焊盘区域(未示出)设置在安装区域MA中。A black matrix (not shown) blocking light may be disposed in the non-display area BA. A gate driving circuit (not shown) for applying gate signals to the plurality of pixels X may be provided in the non-display area BA. According to an embodiment, a data driving circuit (not shown) may also be disposed in the non-display area BA. A pad area (not shown) for receiving a signal from the second electronic component 120 is disposed in the mounting area MA.
如图1和图2中所示，第二电子组件120包括柔性布线基底122和数据驱动电路125。数据驱动电路125可以包括至少一个驱动芯片。数据驱动电路125电连接到柔性布线基底122的布线。As shown in FIGS. 1 and 2 , the second electronic assembly 120 includes a flexible wiring substrate 122 and a data driving circuit 125 . The data driving circuit 125 may include at least one driving chip. The data driving circuit 125 is electrically connected to the wiring of the flexible wiring substrate 122 .
当第二电子组件120包括数据驱动电路125时，显示面板110的焊盘区域(未示出)可以包括电连接到数据布线的数据焊盘和电连接到控制信号布线的控制信号焊盘。数据布线可以连接到像素PX，控制信号布线可以连接到栅极驱动电路。在本实施例中，第二电子组件120具有膜上芯片结构，但实施例不限于此。When the second electronic component 120 includes the data driving circuit 125, the pad region (not shown) of the display panel 110 may include data pads electrically connected to data wirings and control signal pads electrically connected to control signal wirings. A data wiring can be connected to the pixel PX, and a control signal wiring can be connected to a gate driving circuit. In this embodiment, the second electronic component 120 has a chip-on-film structure, but the embodiment is not limited thereto.
可以参照图3A和图3B进一步描述第二电子组件120。柔性布线基底122包括绝缘层(未示出)、多个焊盘CPD、IPD-120和OPD-120以及多条布线SL-120。多个焊盘CPD、IPD-120和OPD-120以及多条布线SL-120设置在绝缘层上。绝缘层可以包括聚酰亚胺。The second electronic assembly 120 may be further described with reference to FIGS. 3A and 3B . The flexible wiring substrate 122 includes an insulating layer (not shown), a plurality of pads CPD, IPD-120 and OPD-120, and a plurality of wirings SL-120. A plurality of pads CPD, IPD-120, and OPD-120 and a plurality of wires SL-120 are provided on the insulating layer. The insulating layer may include polyimide.
多个焊盘CPD、IPD-120和OPD-120可以包括连接到数据驱动电路125的连接端子(未示出)的连接焊盘CPD、连接到第三电子组件130的输入焊盘IPD-120和连接到显示面板110的输出焊盘OPD-120。输入焊盘IPD-120可以限定为设置在柔性布线基底122的一侧处的输入焊盘区域IPP-120，输出焊盘OPD-120可以限定为设置在柔性布线基底122的另一侧处的输出焊盘区域OPP-120。在本实施例中，连接焊盘CPD被布置为与数据驱动电路125的两侧叠置，但是与图3B不同，连接焊盘CPD可以与数据驱动电路125的连接端子对应地随机布置。The plurality of pads CPD, IPD-120, and OPD-120 may include a connection pad CPD connected to a connection terminal (not shown) of the data driving circuit 125, an input pad IPD-120 connected to the third electronic component 130, and Connected to the output pad OPD-120 of the display panel 110 . The input pad IPD-120 may be defined as an input pad region IPP-120 disposed at one side of the flexible wiring substrate 122, and the output pad OPD-120 may be defined as an output pad region disposed at the other side of the flexible wiring substrate 122. Pad area OPP-120. In this embodiment, the connection pads CPD are arranged to overlap both sides of the data driving circuit 125 , but unlike FIG. 3B , the connection pads CPD may be randomly arranged corresponding to the connection terminals of the data driving circuit 125 .
在本实施例中，示例性地示出了均包括一个焊盘行的输入焊盘区域IPP-120和输出焊盘区域OPP-120。焊盘行包括沿着第一方向轴A1布置的多个焊盘。根据实施例，输入焊盘区域IPP-120和输出焊盘区域OPP-120均可以包括多个焊盘行。In the present embodiment, an input pad area IPP- 120 and an output pad area OPP- 120 each including one pad row are exemplarily shown. The pad row includes a plurality of pads arranged along the first direction axis A1. According to an embodiment, each of the input pad area IPP-120 and the output pad area OPP-120 may include a plurality of pad rows.
一些布线SL-120将连接焊盘CPD与输入焊盘IPD-120连接，另一些布线将连接焊盘CPD与输出焊盘OPD-120连接。虽然图中没有示出，但是布线SL-120可以将一些输入焊盘IPD-120与一些输出焊盘OPD-120直接连接。Some of the wires SL-120 connect the connection pads CPD with the input pads IPD-120, and some of the wires connect the connection pads CPD with the output pads OPD-120. Although not shown in the figure, the wiring SL-120 may directly connect some of the input pads IPD-120 with some of the output pads OPD-120.
柔性布线基底122可以设置在绝缘层上，并且还可以包括至少覆盖多条布线SL-120的阻焊层。阻焊层还可以覆盖多个焊盘CPD、IPD-120和OPD-120的外围，并且可以至少暴露多个焊盘CPD、IPD-120和OPD-120中的每个焊盘。可以在阻焊层中形成与多个焊盘CPD、IPD-120和OPD-120对应的开口。The flexible wiring substrate 122 may be disposed on the insulating layer, and may further include a solder resist layer covering at least the plurality of wirings SL-120. The solder resist layer may also cover the periphery of the plurality of pads CPD, IPD-120 and OPD-120 and may expose at least each of the plurality of pads CPD, IPD-120 and OPD-120. Openings corresponding to the plurality of pads CPD, IPD-120, and OPD-120 may be formed in the solder resist layer.
另外，柔性布线基底122可以包括用于稍后描述的接合工艺的对齐标记AM2和AM20。图3B示例性示出与多个焊盘CPD、IPD-120和OPD-120分隔开的四个第一对齐标记AM2以及连接到输入焊盘IPD-120和输出焊盘OPD-120的四个第二对齐标记AM20。可以省略第一对齐标记AM2和第二对齐标记AM20中的至少一个。In addition, the flexible wiring substrate 122 may include alignment marks AM2 and AM20 for a bonding process described later. Fig. 3 B exemplarily shows four first alignment marks AM2 separated from a plurality of pads CPD, IPD-120 and OPD-120 and four alignment marks connected to input pad IPD-120 and output pad OPD-120. Second alignment mark AM20. At least one of the first alignment mark AM2 and the second alignment mark AM20 may be omitted.
根据实施例，使输入焊盘IPD-120和输出焊盘OPD-120暴露的表面限定为柔性布线基底122的结合表面CS，面对结合表面的表面限定为非结合表面NCS。在本实施例中，虽然示出的是数据驱动电路125设置在结合表面CS上，但实施例不限于此，数据驱动电路125可以设置在非结合表面NCS上。According to an embodiment, a surface exposing the input pad IPD-120 and the output pad OPD-120 is defined as a bonding surface CS of the flexible wiring substrate 122, and a surface facing the bonding surface is defined as a non-bonding surface NCS. In this embodiment, although it is shown that the data driving circuit 125 is disposed on the bonding surface CS, the embodiment is not limited thereto, and the data driving circuit 125 may be disposed on the non-bonding surface NCS.
再次参照图1和图2，第三电子组件130向显示面板110或数据驱动电路125提供图像数据、控制信号和电源电压。第三电子组件130可以在不同于柔性布线基底122的布线基底上包括有源器件和无源器件。第三电子组件130可以在柔性布线基底或刚性布线基底上包括连接到柔性布线基底122的焊盘区域(未示出)。Referring again to FIGS. 1 and 2 , the third electronic component 130 supplies image data, control signals and power supply voltage to the display panel 110 or the data driving circuit 125 . The third electronic component 130 may include active devices and passive devices on a wiring substrate different from the flexible wiring substrate 122 . The third electronic component 130 may include a pad region (not shown) connected to the flexible wiring substrate 122 on the flexible wiring substrate or the rigid wiring substrate.
参照图1至图3B，柔性布线基底122的输出焊盘区域OPP-120和显示面板110的焊盘区域可以通过导电粘附膜140彼此电连接。柔性布线基底122的输入焊盘区域IPP-120和第三电子组件130的焊盘区域可以通过导电粘附膜140彼此电连接。导电粘附膜140可以是各向异性导电膜(ACF)。根据实施例，焊料凸起可以代替导电粘附膜140。Referring to FIGS. 1 to 3B , the output pad region OPP-120 of the flexible wiring substrate 122 and the pad region of the display panel 110 may be electrically connected to each other through the conductive adhesive film 140 . The input pad region IPP- 120 of the flexible wiring substrate 122 and the pad region of the third electronic component 130 may be electrically connected to each other through the conductive adhesive film 140 . The conductive adhesive film 140 may be an anisotropic conductive film (ACF). According to an embodiment, a solder bump may replace the conductive adhesive film 140 .
显示面板110的焊盘区域可以包括与柔性布线基底122的输出焊盘OPD-120对应的焊盘。或者，第三电子组件130的焊盘区域可以包括与柔性布线基底122的输入焊盘IPD-120对应的焊盘。The pad region of the display panel 110 may include a pad corresponding to the output pad OPD-120 of the flexible wiring substrate 122 . Alternatively, the pad region of the third electronic component 130 may include a pad corresponding to the input pad IPD- 120 of the flexible wiring substrate 122 .
在下文中，将通过参照显示面板110的焊盘区域和柔性布线基底122的输出焊盘区域OPP-120来更详细地描述第一至第三电子组件110、120和130的电连接结构。第二电子组件120和第三电子组件130的电连接结构可以与稍后描述的显示面板110的焊盘区域和柔性布线基底122的输出焊盘区域OPP-120的电连接结构对应。另外，虽然描述的是电子装置100包括第一至第三电子组件110、120和130，但是可以省略第一电子组件110和第三电子组件130中的任何一个。Hereinafter, the electrical connection structures of the first to third electronic components 110 , 120 and 130 will be described in more detail by referring to the pad region of the display panel 110 and the output pad region OPP-120 of the flexible wiring substrate 122 . The electrical connection structure of the second electronic component 120 and the third electronic component 130 may correspond to the electrical connection structure of the pad region of the display panel 110 and the output pad region OPP-120 of the flexible wiring substrate 122 described later. In addition, although it is described that the electronic device 100 includes the first to third electronic components 110, 120, and 130, any one of the first electronic component 110 and the third electronic component 130 may be omitted.
图4A是示出图1中示出的两个电子组件的分开的焊盘区域的平面图。图4B是示出图1中示出的两个电子组件的结合的焊盘区域的平面图。图4C是沿着图4B中的线II-II'截取的剖视图。FIG. 4A is a plan view showing separated pad regions of the two electronic components shown in FIG. 1 . FIG. 4B is a plan view showing bonded pad regions of the two electronic components shown in FIG. 1 . FIG. 4C is a cross-sectional view taken along line II-II' in FIG. 4B.
如图4A中所示，显示面板110包括与柔性布线基底122的输出焊盘区域OPP-120对应的输入焊盘区域IPP-110。输入焊盘区域IPP-110包括与柔性布线基底122的输出焊盘OPD-120对应的输入焊盘IPD-110。在本实施例中，虽然示出的是输入焊盘IPD-110与输出焊盘OPD-120一一对应，但是实施例不限于此。根据另一实施例，输入焊盘区域IPP-110和输出焊盘区域OPP-120可以包括不同数量的焊盘和不同数量的焊盘行。As shown in FIG. 4A , the display panel 110 includes an input pad region IPP-110 corresponding to the output pad region OPP-120 of the flexible wiring substrate 122 . The input pad region IPP-110 includes input pads IPD-110 corresponding to the output pads OPD-120 of the flexible wiring substrate 122 . In this embodiment, although it is shown that the input pads IPD- 110 correspond to the output pads OPD- 120 one-to-one, the embodiment is not limited thereto. According to another embodiment, the input pad area IPP-110 and the output pad area OPP-120 may include different numbers of pads and different numbers of pad rows.
显示面板110可以包括与柔性布线基底122的第一对齐标记AM2和第二对齐标记AM20对应的第一对齐标记AM1和第二对齐标记AM10。第一对齐标记AM1和第二对齐标记AM10中的一个可以省略。The display panel 110 may include first and second alignment marks AM1 and AM10 corresponding to the first and second alignment marks AM2 and AM20 of the flexible wiring substrate 122 . One of the first alignment mark AM1 and the second alignment mark AM10 may be omitted.
如图4B中所示，柔性布线基底122的输出焊盘OPD-120和显示面板110的输入焊盘IPD-110彼此电连接。通过使用柔性布线基底122的第一对齐标记AM2和第二对齐标记AM20以及显示面板110的第一对齐标记AM1和第二对齐标记AM10，将输出焊盘区域OPP-120和输入焊盘区域IPP-110对齐并沿着第二方向轴A2执行对齐校正。然后，通过使用工具利用输出焊盘OPD-120和输入焊盘IPD-110之间的导电粘附膜140将输出焊盘OPD-120和输入焊盘IPD-110彼此结合。As shown in FIG. 4B , the output pad OPD-120 of the flexible wiring substrate 122 and the input pad IPD-110 of the display panel 110 are electrically connected to each other. By using the first alignment mark AM2 and the second alignment mark AM20 of the flexible wiring substrate 122 and the first alignment mark AM1 and the second alignment mark AM10 of the display panel 110, the output pad area OPP-120 and the input pad area IPP- 110 align and perform alignment correction along the second orientation axis A2. Then, the output pad OPD-120 and the input pad IPD-110 are bonded to each other with the conductive adhesive film 140 between the output pad OPD-120 and the input pad IPD-110 by using a tool.
为了便于描述，在图4B中示出的是输出焊盘OPD-120和输入焊盘IPD-110的对应焊盘彼此完全叠置。实施例不限于此。由于在制造工艺期间发生的数值误差(即，由于输出焊盘OPD-120和输入焊盘IPD-110之间在它们的制造工艺期间的尺寸缺陷)或者由于在接合工艺期间发生的数值误差(即，由于输出焊盘OPD-120和输入焊盘IPD-110之间在接合工艺期间的变形)，会导致输出焊盘OPD-120和输入焊盘IPD-110的对应焊盘不完全叠置。稍后将对此进行详细描述。For convenience of description, it is shown in FIG. 4B that corresponding pads of the output pad OPD-120 and the input pad IPD-110 completely overlap each other. Embodiments are not limited thereto. Due to numerical errors occurring during the manufacturing process (i.e., due to dimensional defects between the output pad OPD-120 and the input pad IPD-110 during their manufacturing process) or due to numerical errors occurring during the bonding process (i.e. , due to deformation between the output pad OPD-120 and the input pad IPD-110 during the bonding process), corresponding pads of the output pad OPD-120 and the input pad IPD-110 may not completely overlap. This will be described in detail later.
如图4C中所示，信号布线SL-110设置在显示面板110的基础基底110-BS上。绝缘层110-IL设置在基础基底110-BS上。绝缘层110-IL可以包括阻挡层和钝化层。输入焊盘IPD-110设置在绝缘层110-IL上，并通过限定在绝缘层110-IL中的通孔110-ILOP而连接到信号布线SL-110。As shown in FIG. 4C , the signal wiring SL-110 is disposed on the base substrate 110 -BS of the display panel 110 . The insulating layer 110-IL is disposed on the base substrate 110-BS. The insulating layer 110-IL may include a barrier layer and a passivation layer. The input pad IPD-110 is disposed on the insulating layer 110-IL, and is connected to the signal wiring SL-110 through the via hole 110-ILOP defined in the insulating layer 110-IL.
图4B的布线SL-120和连接到布线SL-120的输出焊盘OPD-120设置在柔性布线基底122的绝缘层120-IL上。布线SL-120和输出焊盘OPD-120可以设置在同一层上。根据实施例，布线SL-120和输出焊盘OPD-120可以设置在不同层上且它们之间有另一绝缘层。就这一点而言，布线SL-120和输出焊盘OPD-120可以通过形成在另一绝缘层中的通孔而彼此连接。The wiring SL-120 of FIG. 4B and the output pad OPD-120 connected to the wiring SL-120 are disposed on the insulating layer 120 -IL of the flexible wiring substrate 122 . The wiring SL-120 and the output pad OPD-120 may be provided on the same layer. According to an embodiment, the wiring SL-120 and the output pad OPD-120 may be disposed on different layers with another insulating layer therebetween. In this regard, the wiring SL-120 and the output pad OPD-120 may be connected to each other through a via hole formed in another insulating layer.
阻焊层120-SR设置在绝缘层120-IL上。输出焊盘OPD-120经由形成在阻焊层120-SR中的通孔120-SROP暴露。根据实施例，阻焊层120-SR仅覆盖布线SL-120而不覆盖输出焊盘OPD-120。The solder resist layer 120-SR is disposed on the insulating layer 120-IL. The output pad OPD-120 is exposed through the via hole 120-SROP formed in the solder resist layer 120-SR. According to an embodiment, the solder resist layer 120-SR covers only the wiring SL-120 and does not cover the output pad OPD-120.
输出焊盘OPD-120和输入焊盘IPD-110通过导电粘附膜140而彼此电连接。虽然图中没有示出，但是输出焊盘OPD-120和输入焊盘IPD-110中对应的输出焊盘和输入焊盘可以通过导电粘附膜140中的多个导电球而彼此电连接。The output pad OPD-120 and the input pad IPD-110 are electrically connected to each other through the conductive adhesive film 140 . Although not shown in the drawing, corresponding ones of the output pad OPD- 120 and the input pad IPD- 110 may be electrically connected to each other through a plurality of conductive balls in the conductive adhesive film 140 .
如图4B中所示，柔性布线基底122的第一对齐标记AM2和第二对齐标记AM20与显示面板110的第一对齐标记AM1和第二对齐标记AM10沿着第二方向轴A2未对齐的原因是因为在接合工艺期间沿第二方向轴A2执行了对齐校正。通过对齐校正可以增大输出焊盘OPD-120和输入焊盘IPD-110中的输出焊盘和输入焊盘的结合面积(即，叠置面积)。如稍后描述的，结合面积通过对齐校正而增大的原因是因为输出焊盘OPD-120和输入焊盘IPD-110具有在相对于第一方向轴A1的倾斜方向上延伸的形式。稍后将对其进行详细描述。As shown in FIG. 4B, the reason why the first alignment mark AM2 and the second alignment mark AM20 of the flexible wiring substrate 122 are misaligned with the first alignment mark AM1 and the second alignment mark AM10 of the display panel 110 along the second direction axis A2 This is because alignment correction is performed along the second direction axis A2 during the bonding process. The bonding area (ie, overlapping area) of the output pad and the input pad among the output pad OPD- 120 and the input pad IPD- 110 may be increased by the alignment correction. As described later, the reason why the bonding area is increased by the alignment correction is because the output pad OPD-120 and the input pad IPD-110 have a form extending in an oblique direction with respect to the first direction axis A1. It will be described in detail later.
在接合工艺中的使用工具的结合操作期间，输出焊盘区域OPP-120和输入焊盘区域IPP-110会因从工具发射的热而沿着第一方向轴A1膨胀。输出焊盘区域OPP-120和输入焊盘区域IPP-110可以以不同的比率膨胀。另外，输出焊盘区域OPP-120和输入焊盘区域IPP-110根据距第一方向轴A1的位置而以不同的比率膨胀。During a bonding operation using a tool in a bonding process, the output pad region OPP-120 and the input pad region IPP-110 may expand along the first direction axis A1 due to heat emitted from the tool. The output pad area OPP-120 and the input pad area IPP-110 may expand at different rates. In addition, the output pad region OPP-120 and the input pad region IPP-110 expand at different rates according to positions from the first direction axis A1.
根据本实施例，即使当输出焊盘区域OPP-120和输入焊盘区域IPP-110在结合操作期间沿第一方向轴A1膨胀时，对应的输出焊盘和输入焊盘也可以具有预定的结合面积(即，叠置面积)而与沿第一方向轴A1的位置无关。如稍后描述的，这是因为输出焊盘区域OPP-120和输入焊盘区域IPP-110中的至少一个焊盘包括沿第一方向轴A1具有不同节距的焊盘组。稍后将对其进行详细描述。According to the present embodiment, even when the output pad region OPP-120 and the input pad region IPP-110 expand along the first direction axis A1 during the bonding operation, the corresponding output pad and input pad can have a predetermined bonding area (ie, overlapping area) regardless of the position along the first direction axis A1. This is because at least one pad in the output pad area OPP-120 and the input pad area IPP-110 includes pad groups having different pitches along the first direction axis A1 as described later. It will be described in detail later.
图5A至图5D是示出根据实施例的第一电子组件的焊盘区域的平面图。图5B是仅示出图5A中示出的延长线的一部分的视图。图5C示出第一焊盘和第二焊盘，图5D示出各种焊盘形式。5A to 5D are plan views illustrating pad regions of the first electronic component according to the embodiment. FIG. 5B is a view showing only a part of the extension line shown in FIG. 5A. FIG. 5C shows the first pad and the second pad, and FIG. 5D shows various pad forms.
如图5A和图5B中所示，显示面板110的输入焊盘区域IPP-110包括沿第一方向轴A1布置的多个输入焊盘。基于基准线RL，输入焊盘区域IPP-110包括设置在左边的第一焊盘组PG1和第二焊盘组PG2以及设置在右边的第三焊盘组PG3和第四焊盘组PG4。基准线RL以与第二方向轴A2平行的虚轴为基线设置在输入焊盘区域IPP-110的沿第一方向轴A1的中央处。输入焊盘区域IPP-110还可以包括与基准线RL叠置且平行的基准焊盘RPD。As shown in FIGS. 5A and 5B , the input pad region IPP-110 of the display panel 110 includes a plurality of input pads arranged along the first direction axis A1. Based on the reference line RL, the input pad region IPP-110 includes first and second pad groups PG1 and PG2 disposed on the left and third and fourth pad groups PG3 and PG4 disposed on the right. The reference line RL is disposed at the center of the input pad region IPP- 110 along the first direction axis A1 with an imaginary axis parallel to the second direction axis A2 as a base line. The input pad region IPP-110 may further include a reference pad RPD overlapping and parallel to the reference line RL.
在本实施例中，第一焊盘组PG1和第三焊盘组PG3关于基准线RL彼此对称，第二焊盘组PG2和第四焊盘组PG4关于基准线RL彼此对称。然而，实施例不限于此。第三焊盘组PG3可以包括布置与第一焊盘组PG1不同的焊盘，第四焊盘组PG4可以包括布置与第二焊盘组PG2不同的焊盘。另外，第一焊盘组PG1和第三焊盘组PG3可以关于基准线RL对称地布置，但可以包括不同数量的焊盘。另外，第二焊盘组PG2和第四焊盘组PG4可以关于基准线RL对称地布置，但可以包括不同数量的焊盘。In this embodiment, the first pad group PG1 and the third pad group PG3 are symmetrical to each other about the reference line RL, and the second pad group PG2 and the fourth pad group PG4 are symmetrical to each other about the reference line RL. However, embodiments are not limited thereto. The third pad group PG3 may include pads arranged differently from the first pad group PG1, and the fourth pad group PG4 may include pads arranged differently from the second pad group PG2. In addition, the first pad group PG1 and the third pad group PG3 may be symmetrically arranged with respect to the reference line RL, but may include different numbers of pads. In addition, the second pad group PG2 and the fourth pad group PG4 may be symmetrically arranged with respect to the reference line RL, but may include different numbers of pads.
输入焊盘区域IPP-110可以包括多于两个、三个、五个的焊盘组，但在本实施例中，为了便于描述，示出的是包括四个焊盘组(即，第一焊盘组PG1、第二焊盘组PG2、第三焊盘组PG3和第四焊盘组PG4)的输入焊盘区域IPP-110作为一个示例。第一焊盘组PG1包括多个第一焊盘PD1，第二焊盘组PG2包括多个第二焊盘PD2。另外，第三焊盘组PG3包括多个第三焊盘PD3，第四焊盘组PG4包括多个第四焊盘PD4。示例性示出的是均包括三个焊盘的第一焊盘组至第四焊盘组PG1、PG2、PG3、PG4。实质上，第一焊盘组至第四焊盘组PG1、PG2、PG3和PG4可以是图4A和图4B中示出的输入焊盘IPD-110。The input pad area IPP-110 may include more than two, three, or five pad groups, but in this embodiment, for ease of description, it is shown that four pad groups (ie, the first The input pad region IPP- 110 of the pad group PG1 , the second pad group PG2 , the third pad group PG3 , and the fourth pad group PG4 ) is taken as an example. The first pad group PG1 includes a plurality of first pads PD1, and the second pad group PG2 includes a plurality of second pads PD2. In addition, the third pad group PG3 includes a plurality of third pads PD3, and the fourth pad group PG4 includes a plurality of fourth pads PD4. Exemplarily shown are the first pad group to the fourth pad group PG1 , PG2 , PG3 , PG4 each including three pads. In essence, the first to fourth pad groups PG1 , PG2 , PG3 , and PG4 may be the input pad IPD- 110 shown in FIGS. 4A and 4B .
多个第一焊盘PD1、多个第二焊盘PD2、多个第三焊盘PD3和多个第四焊盘PD4均具有在与基准线RL和第一方向轴A1相交的方向上延伸的形式。图5A示出了：表示多个第一焊盘PD1的延伸方向的延长线L1(在下文中称作多条第一线)，表示多个第二焊盘PD2的延伸方向的延长线L2(在下文中称作多条第二线)，表示多个第三焊盘PD3的延伸方向的延长线L3(在下文中称作多条第三线)，以及表示多个第四焊盘PD4的延伸方向的延长线L4(在下文中称作多条第四线)。Each of the plurality of first pads PD1, the plurality of second pads PD2, the plurality of third pads PD3, and the plurality of fourth pads PD4 has a form. 5A shows: an extension line L1 (hereinafter referred to as a plurality of first lines) representing the extending direction of a plurality of first pads PD1, an extension line L2 (hereinafter referred to as a plurality of first lines) representing an extending direction of a plurality of second pads PD2 (hereinafter referred to as a plurality of extending lines L2 ). hereinafter referred to as a plurality of second lines), an extension line L3 representing the extending direction of the plurality of third pads PD3 (hereinafter referred to as a plurality of third lines), and an extension line representing the extending direction of the plurality of fourth pads PD4 L4 (hereinafter referred to as a plurality of fourth lines).
第一线L1是相对于多个第一焊盘PD1在相同条件下定义的。例如，可以将每条第一线L1定义为将对应的第一焊盘PD1的面积二等分的线。当第一焊盘PD1具有平行四边形形式时，可以将每条第一线L1定义为使对应的第一焊盘PD1的面积二等分并与长边平行的线。当第一焊盘PD1具有平行四边形形式时，可以将每条第一线L1定义为使对应的第一焊盘PD1的面积二等分的对角线和与该对角线平行的线。The first line L1 is defined under the same condition with respect to the plurality of first pads PD1. For example, each first line L1 may be defined as a line that halves the area of the corresponding first pad PD1. When the first pad PD1 has a parallelogram form, each first line L1 may be defined as a line that bisects the area of the corresponding first pad PD1 and is parallel to the long side. When the first pad PD1 has a parallelogram form, each first line L1 may be defined as a diagonal line bisecting an area of the corresponding first pad PD1 and a line parallel to the diagonal line.
与定义第一线L1类似，同样针对多个第二焊盘PD2来定义第二线L2，同样针对多个第三焊盘PD3来定义第三线L3，同样针对多个第四焊盘PD4来定义第四线L4。Similar to the definition of the first line L1, the second line L2 is also defined for the plurality of second pads PD2, the third line L3 is also defined for the plurality of third pads PD3, and the third line L3 is also defined for the plurality of fourth pads PD4. Four-wire L4.
第一线L1会聚于第一点P1，第二线L2会聚于第二点P2。第一点P1可以设置在基准线RL上，第二点P2可以设置在基准线RL外部。The first line L1 converges at the first point P1, and the second line L2 converges at the second point P2. The first point P1 may be set on the reference line RL, and the second point P2 may be set outside the reference line RL.
第三线L3会聚于第三点P3，第四线L4会聚于第四点P4。第一点P1和第三点P3可以设置在同一位置处。第四点P4可以设置在相对于基准线RL与第二点P2对称的位置处。The third line L3 converges at the third point P3, and the fourth line L4 converges at the fourth point P4. The first point P1 and the third point P3 may be set at the same position. The fourth point P4 may be disposed at a position symmetrical to the second point P2 with respect to the reference line RL.
多条第一线L1、多条第二线L2、多条第三线L3和多条第四线L4与基准线RL形成预定的夹角(between-angle)。由多条第一线L1和基准线RL形成的夹角可以改变，由多条第二线L2和基准线RL形成的夹角可以改变。The plurality of first lines L1, the plurality of second lines L2, the plurality of third lines L3, and the plurality of fourth lines L4 form a predetermined between-angle with the reference line RL. The included angle formed by the plurality of first lines L1 and the reference line RL may be changed, and the included angle formed by the plurality of second lines L2 and the reference line RL may be changed.
图5B示出由多个第一焊盘PD1中的设置在距基准线RL最外面处的第一焊盘(在下文中称作最外面的第一焊盘)的第一线L1-1和基准线RL形成的夹角θ11以及由多个第二焊盘PD2中的设置在距基准线RL最外面处的第二焊盘(在下文中称作最面外的第二焊盘)的第二线L2-1和基准线RL形成的夹角θ21。FIG. 5B shows the first line L1-1 and the reference line L1-1 of the first pad disposed outermost from the reference line RL (hereinafter referred to as the outermost first pad) among the plurality of first pads PD1. The included angleθ11 formed by the line RL and the second line formed by the second pad (hereinafter referred to as the outermost second pad) disposed at the outermost position from the reference line RL among the plurality of second pads PD2 The angle θ21 formed by L2-1 and the reference line RL.
由多个第一焊盘PD1中的第n焊盘的第一线和基准线RL形成的夹角θ1n满足下面的等式1。An angle θ1n formed by the first line of the n-th pad among the plurality of first pads PD1 and the reference line RL satisfies Equation 1 below.
[等式1][equation 1]
θ1n＝θ11-(n-1)αθ1n = θ11 -(n-1)α
其中，n是大于或等于2的自然数。α是由多个第一焊盘PD1的第一线L1和基准线RL形成的夹角的变量(在下文中称作第一夹角变量)。如稍后描述的，可以根据多个第一焊盘PD1的位置和第一点P1的位置来确定α。Wherein, n is a natural number greater than or equal to 2. α is a variable of an angle formed by the first line L1 of the plurality of first pads PD1 and the reference line RL (hereinafter referred to as a first angle variable). As described later, α may be determined according to the positions of the plurality of first pads PD1 and the position of the first point P1.
可以通过测量多个第一焊盘PD1的所有夹角来计算第一夹角变量α。另外，对于第一夹角变量α，在最外面的第一焊盘的倾斜角度和第n个第一焊盘的倾斜角度均被测量之后计算这些倾斜角度的差值，然后将该差值除以第一焊盘的个数来计算平均变量。图5B示出由多个第一焊盘PD1中的最外面的第一焊盘的第一线L1-1和第一方向轴A1形成的夹角γ11以及由多个第二焊盘PD2中的最外面的第二焊盘的第二线L2-1和第一方向轴A1形成的夹角γ21。The first included angle variable α may be calculated by measuring all included angles of the plurality of first pads PD1. In addition, for the first included angle variable α, after the tilt angle of the outermost first pad and the tilt angle of the n-th first pad are both measured, the difference between these tilt angles is calculated, and then the difference is divided by The average variable is calculated by the number of the first pads. FIG. 5B shows the included angle γ11 formed by the first line L1-1 of the outermost first pad among the plurality of first pads PD1 and the first direction axis A1 and the angleγ11 formed by the first line L1-1 of the outermost first pad PD2 among the plurality of second pads PD2. The angle γ 21 formed by the second line L2-1 of the outermost second pad and the first direction axis A1 is γ21 .
由多个第一焊盘PD1中的第n焊盘的第一线和第一方向轴A1形成的夹角γ1n满足下面的等式2。夹角γ1n可以由下面的等式2来表示，并且还可以由等式1的形式来表示。即，最外面的第一焊盘的第一线L1-1和第一方向轴A1之间的夹角γ11可以由90－θ11来表示。An angleγ1n formed by the first line of the n-th pad among the plurality of first pads PD1 and the first direction axis A1 satisfies Equation 2 below. The included angle γ1n can be represented by Equation 2 below, and can also be represented by the form of Equation 1. That is, the angleγ11 between the first line L1-1 of the outermost first pad and the first direction axis A1 can be represented by 90−θ11 .
[等式2][equation 2]
γ1n＝90-θ1nγ1n =90-θ1n
由多个第二焊盘PD2中的第m焊盘的第二线和基准线RL形成的夹角θ2m满足下面的等式3。An angleθ2m formed by the second line of the m-th pad among the plurality of second pads PD2 and the reference line RL satisfies Equation 3 below.
[等式3][equation 3]
θ2m＝θ21-(m-1)βθ2m = θ21 -(m-1)β
其中，m是大于或等于2的自然数。β是由多个第二焊盘PD2的第二线L2和基准线RL形成的夹角的变量(在下文中称作第二夹角变量)。如稍后描述的，可以根据多个第二焊盘PD2的位置和第二点P2的位置来确定β。β与α相同或者不同。可以由与测量第一夹角变量α的方式相同的方式来测量第二夹角变量β。Wherein, m is a natural number greater than or equal to 2. β is a variable of an included angle formed by the second line L2 of the plurality of second pads PD2 and the reference line RL (hereinafter referred to as a second included angle variable). As described later, β may be determined according to the positions of the plurality of second pads PD2 and the position of the second point P2. β is the same as or different from α. The second included angle variable β can be measured in the same manner as the first included angle variable α.
另外，当第二焊盘组PG2包括K个第二焊盘时，第K第二焊盘的第二线和基准线RL之间的夹角可以与多个第一焊盘PD1中最外面的第一焊盘的第一线L1-1和基准线RL之间的夹角θ11不同。这可以由下面的等式4来表示。In addition, when the second pad group PG2 includes K second pads, the included angle between the second line of the Kth second pad and the reference line RL may be the same as that of the outermost first pad PD1 among the plurality of first pads PD1. The included angle θ11 between the first line L1-1 and the reference line RL of a pad is different. This can be expressed by Equation 4 below.
[等式4][equation 4]
θ11≠θ21-Kβθ11 ≠θ21 -Kβ
如等式5中所示，当第二焊盘组PG2包括K个第二焊盘时，第K个第二焊盘的第二线和基准线RL之间的夹角大于最外面的第一焊盘的第一线L1-1和基准线RL之间的夹角θ11。第K个第二焊盘可以是第二焊盘中最接近第一焊盘组PG1的焊盘。As shown in Equation 5, when the second pad group PG2 includes K second pads, the included angle between the second line of the Kth second pad and the reference line RL is larger than that of the outermost first pad An angle θ11 between the first line L1-1 of the disk and the reference line RL. The K-th second pad may be a pad closest to the first pad group PG1 among the second pads.
[等式5][equation 5]
θ11＜θ2K-βθ11 < θ2K -β
将参照图5C更详细地描述第一焊盘PD1和第二焊盘PD2。第一焊盘PD1和第二焊盘PD2可以均具有沿第一方向轴A1的宽度W1和W2是一致的平行四边形形式。第一焊盘PD1具有相同的宽度W1，第二焊盘PD2具有相同的宽度W2。第一焊盘PD1的宽度W1可以与第二焊盘PD2的宽度W2相同或者不同。The first pad PD1 and the second pad PD2 will be described in more detail with reference to FIG. 5C . The first pad PD1 and the second pad PD2 may each have a parallelogram form in which widths W1 and W2 along the first direction axis A1 are consistent. The first pads PD1 have the same width W1, and the second pads PD2 have the same width W2. The width W1 of the first pad PD1 may be the same as or different from the width W2 of the second pad PD2.
第一焊盘PD1和第二焊盘PD2的在基准线RL(见图5A和图5B)上的投影的长度可以彼此相同。沿着多个第一焊盘PD1的每条延长线测量的长度和每个第一焊盘PD1的夹角θ1n(见等式1)余弦的乘积可以基本相同。沿着多个第二焊盘PD2的每条延长线测量的长度和每个第二焊盘PD2的夹角θ2m(见等式3)余弦的乘积可以基本相同。The lengths of projections of the first pad PD1 and the second pad PD2 on the reference line RL (see FIGS. 5A and 5B ) may be the same as each other. A product of a length measured along each extension line of the plurality of first pads PD1 and a cosine of an included angle θ1n (see Equation 1) of each first pad PD1 may be substantially the same. A product of a length measured along each extension line of the plurality of second pads PD2 and a cosine of an included angle θ2m (see Equation 3) of each second pad PD2 may be substantially the same.
如图5A中所示，第一线L1和第二线L2会聚于不同的第一点P1和第二点P2，原因是：因为包括相对于基准线RL倾斜的焊盘的第一焊盘组PG1和第二焊盘组PG2是不连续的。这里，“不连续”是指第一焊盘组PG1和第二焊盘组PG2具有不同的节距。As shown in FIG. 5A, the first line L1 and the second line L2 converge at different first points P1 and second points P2 because the first pad group PG1 including pads inclined with respect to the reference line RL and the second pad group PG2 are discontinuous. Here, "discontinuous" means that the first pad group PG1 and the second pad group PG2 have different pitches.
通过对第一焊盘PD1的宽度W1与相邻的第一焊盘PD1之间的间隔G1和G10求和来定义第一焊盘组PG1的节距PT1和PT10。通过对第二焊盘PD2的宽度W2与相邻的第二焊盘PD2之间的间隔G2和G20求和来定义第二焊盘组PG2的节距PT2和PT20。The pitches PT1 and PT10 of the first pad group PG1 are defined by summing the width W1 of the first pad PD1 and the intervals G1 and G10 between adjacent first pads PD1. Pitches PT2 and PT20 of the second pad group PG2 are defined by summing the width W2 of the second pad PD2 and the intervals G2 and G20 between adjacent second pads PD2.
第一焊盘组PG1的节距PT1和PT10的值会根据测量位置而不同。其原因是：第一焊盘PD1之间的间隔G1和G10沿着第二方向轴A2改变。在本实施例中，第一焊盘PD1之间的间隔G1和G10随着逐渐远离第一点P1(见图5A和图5B)而增大。The values of the pitches PT1 and PT10 of the first pad group PG1 may vary according to measurement positions. The reason for this is that the intervals G1 and G10 between the first pads PD1 vary along the second direction axis A2. In the present embodiment, the intervals G1 and G10 between the first pads PD1 increase as they gradually move away from the first point P1 (see FIGS. 5A and 5B ).
第二焊盘PD2之间的间隔G2和G20随着逐渐远离第二点P2(见图5A和图5B)而增大。藉由与第一焊盘组PG1的节距PT1和PT10相同的原因，第二焊盘组PG2的节距PT2和PT20的值可以根据测量位置而不同。第一焊盘组PG1和第二焊盘组PG2具有不同的节距PT1/PT10和PT2/PT20。可以在与第一方向轴A1平行的假想线上测量第一焊盘组PG1的节距PT1和PT10以及第二焊盘组PG2的节距PT2和PT20。如图5C中所示，可以在不同的第一假想线IL1和第二假想线IL2上测量第一焊盘组PG1和第二焊盘组PG2的节距PT1/PT10和PT2/PT20。The intervals G2 and G20 between the second pads PD2 increase as they get away from the second point P2 (see FIGS. 5A and 5B ). By the same reason as the pitches PT1 and PT10 of the first pad group PG1 , the values of the pitches PT2 and PT20 of the second pad group PG2 may vary according to measurement positions. The first pad group PG1 and the second pad group PG2 have different pitches PT1/PT10 and PT2/PT20. The pitches PT1 and PT10 of the first pad group PG1 and the pitches PT2 and PT20 of the second pad group PG2 may be measured on an imaginary line parallel to the first direction axis A1. As shown in FIG. 5C , pitches PT1 / PT10 and PT2 / PT20 of the first and second pad groups PG1 and PG2 may be measured on different first and second imaginary lines IL1 and IL2 .
第一焊盘组PG1具有在第一假想线IL1上测量的第一节距PT1。第一焊盘组PG1具有在第二假想线IL2上测量的第二节距PT10。第二焊盘组PG2具有在第一假想线IL1上测量的第三节距PT2。第二焊盘组PG2具有在第二假想线IL2上测量的第四节距PT20。The first pad group PG1 has a first pitch PT1 measured on the first imaginary line IL1. The first pad group PG1 has a second pitch PT10 measured on the second imaginary line IL2. The second pad group PG2 has a third pitch PT2 measured on the first imaginary line IL1. The second pad group PG2 has a fourth pitch PT20 measured on the second imaginary line IL2.
第一节距PT1小于第三节距PT2。第二焊盘PD2的宽度W2大于第一焊盘PD1的宽度W1。就这一点而言，在第一假想线IL1上测量的相邻的第二焊盘PD2之间的间隔G2可以大于或等于相邻的第一焊盘PD1之间的间隔G1。根据实施例，第二焊盘PD2的宽度W2可以与第一焊盘PD1的宽度W1相同。就这一点而言，在第一假想线IL1上测量的相邻的第二焊盘PD2之间的间隔G2大于相邻的第一焊盘PD1之间的间隔G1。The first pitch PT1 is smaller than the third pitch PT2. The width W2 of the second pad PD2 is larger than the width W1 of the first pad PD1. In this regard, the interval G2 between adjacent second pads PD2 measured on the first imaginary line IL1 may be greater than or equal to the interval G1 between adjacent first pads PD1. According to an embodiment, the width W2 of the second pad PD2 may be the same as the width W1 of the first pad PD1. In this regard, the interval G2 between adjacent second pads PD2 measured on the first imaginary line IL1 is greater than the interval G1 between adjacent first pads PD1.
第一焊盘组PG1的节距小于第二焊盘组PG2的节距。在第二假想线IL2上测量的第二节距PT10小于第四节距PT20。The pitch of the first pad group PG1 is smaller than the pitch of the second pad group PG2. The second pitch PT10 measured on the second imaginary line IL2 is smaller than the fourth pitch PT20.
在假想线IL1和IL2上测量的第一焊盘组PG1和第二焊盘组PG2之间的间隔G3和G30与相邻的第一焊盘PD1之间的间隔G1和G10不同。在假想线IL1和IL2上测量的第一焊盘组PG1和第二焊盘组PG2之间的间隔G3和G30可以与相邻的第二焊盘PD2之间的间隔G2和G20相同或不同。The intervals G3 and G30 between the first pad group PG1 and the second pad group PG2 measured on the imaginary lines IL1 and IL2 are different from the intervals G1 and G10 between the adjacent first pads PD1. The intervals G3 and G30 between the first and second pad groups PG1 and PG2 measured on the imaginary lines IL1 and IL2 may be the same as or different from the intervals G2 and G20 between the adjacent second pads PD2.
虽然图中没有单独示出，但是输入焊盘区域IPP-110还可以包括设置在第二焊盘组PG2左边的焊盘组(在下文中称作左焊盘组)和设置在第四焊盘组PG4右边的焊盘组(在下文中称作右焊盘组)。每个左焊盘组中的焊盘的延长线会聚于特定的点。左焊盘组的会聚点可以彼此不同。左焊盘组可以具有不同的节距。左焊盘组的节距可以随着逐渐向左而增大。右焊盘组可以与左焊盘组关于基准线RL对称。Although not shown separately in the figure, the input pad area IPP-110 may also include a pad group (hereinafter referred to as the left pad group) disposed on the left side of the second pad group PG2 and a pad group disposed on the fourth pad group. The pad group on the right side of PG4 (hereinafter referred to as the right pad group). The extension lines of the pads in each left pad group converge at a specific point. Convergence points of the left pad groups may be different from each other. The left pad groups may have different pitches. The pitch of the left pad group may increase gradually to the left. The right pad group may be symmetrical to the left pad group with respect to the reference line RL.
图5D示出各种焊盘形式。第一焊盘PD1和第二焊盘PD2基本上均为平行四边形形式。图5D中的第一个图(1)示出的是长边L-L和短边L-S彼此平行的典型平行四边形形式。如第二个图(2)中所示，第一焊盘PD1和第二焊盘PD2均可以为在长边L-L和延长线L之间具有预定夹角δ的不等腰梯形形式或等腰梯形形式。如第三个图(3)中所示，每条长边L-L可以包括两条边。所述两条边可以相对于延长线L具有相同或不同的预定夹角δ。Figure 5D shows various pad forms. Both the first pad PD1 and the second pad PD2 are substantially in the form of a parallelogram. The first diagram (1) in FIG. 5D shows a typical parallelogram form in which the long side L-L and the short side L-S are parallel to each other. As shown in the second figure (2), both the first pad PD1 and the second pad PD2 can be in the form of an isosceles trapezoid or an isosceles trapezoid with a predetermined angle δ between the long side L-L and the extension line L trapezoidal form. As shown in the third figure (3), each long side L-L may include two sides. The two sides may have the same or different predetermined included angles δ with respect to the extension line L.
如第四个图(4)或第五个图(5)中所示，第一焊盘PD1和第二焊盘PD2均可以为具有变形的顶点的平行四边形形式。第一焊盘PD1和第二焊盘PD2均可以具有长边L-L和短边L-S相连的顶点区域呈锥形或被倒圆的平行四边形形式。在将焊盘设计成典型的平行四边形形式之后，可能由于制造误差而产生如第四个图(4)或第五个图(5)中所示的焊盘的形式。As shown in the fourth figure (4) or the fifth figure (5), both the first pad PD1 and the second pad PD2 may be in the form of a parallelogram with deformed vertices. Both the first pad PD1 and the second pad PD2 may have a conical or rounded parallelogram form in which the apex regions connected by the long side L-L and the short side L-S are connected. After designing the pads into a typical parallelogram form, the form of the pads as shown in the fourth figure (4) or the fifth figure (5) may be produced due to manufacturing errors.
虽然图中没有单独示出，但是柔性布线基底122的输出焊盘区域OPP-120(见图4A和图4B)可以包括与参照图5A至图5D描述的显示面板110的输入焊盘区域IPP-110的焊盘相同地设计的焊盘。Although not separately shown in the figure, the output pad region OPP-120 (see FIGS. 4A and 4B ) of the flexible wiring substrate 122 may include the same input pad region IPP-120 of the display panel 110 described with reference to FIGS. 5A to 5D . The pads of 110 are similarly designed pads.
另外，虽然特定设计值不同，但是柔性布线基底122的输入焊盘IPD-120可以包括布置和形式与参照图5A至图5D描述的显示面板110的输入焊盘区域IPP-110的焊盘相似的焊盘。In addition, although specific design values are different, the input pad IPD-120 of the flexible wiring substrate 122 may include pads similar in arrangement and form to those of the input pad region IPP-110 of the display panel 110 described with reference to FIGS. 5A to 5D . pad.
图6至图11是示出根据实施例的电子装置的第一电子组件的焊盘区域的平面图。在下文中，将参照图6至图11描述根据实施例的第一电子组件的焊盘区域。然而，将省略针对参照图5A至图5D描述的重叠构造的详细描述。6 to 11 are plan views illustrating pad regions of a first electronic component of an electronic device according to an embodiment. Hereinafter, a pad region of a first electronic component according to an embodiment will be described with reference to FIGS. 6 to 11 . However, a detailed description for the overlapping configuration described with reference to FIGS. 5A to 5D will be omitted.
参照图6，第一线L1会聚于第一点P1，第二线L2会聚于第二点P2。第一点P1和第二点P2可以设置在基准线RL上的不同位置处。Referring to FIG. 6, the first line L1 converges at a first point P1, and the second line L2 converges at a second point P2. The first point P1 and the second point P2 may be set at different positions on the reference line RL.
第三线L3会聚于第三点P3，第三点P3设置在基准线RL上与第一点P1相同的位置处。另外，第四线L4会聚于第四点P4，第四点P4设置在基准线RL上与第二点P2相同的位置处。The third line L3 converges to a third point P3 which is set at the same position as the first point P1 on the reference line RL. In addition, the fourth line L4 converges to a fourth point P4 which is set at the same position as the second point P2 on the reference line RL.
根据实施例，从第一点P1和第三点P3到基准焊盘RPD的分离距离d1小于从第二点P2和第四点P4到基准焊盘RPD的分离距离d2。According to an embodiment, the separation distance d1 from the first point P1 and the third point P3 to the reference pad RPD is smaller than the separation distance d2 from the second point P2 and the fourth point P4 to the reference pad RPD.
参照图7，第一点P1和第三点P3设置在基准线RL上的同一位置处，第二点P2和第四点P4设置在基准线RL上的同一位置处。Referring to FIG. 7 , the first point P1 and the third point P3 are set at the same position on the reference line RL, and the second point P2 and the fourth point P4 are set at the same position on the reference line RL.
根据实施例，从第一点P1和第三点P3到基准焊盘RPD的分离距离d1大于从第二点P2和第四点P4到基准焊盘RPD的分离距离d2。According to an embodiment, the separation distance d1 from the first point P1 and the third point P3 to the reference pad RPD is greater than the separation distance d2 from the second point P2 and the fourth point P4 to the reference pad RPD.
参照图8，第一点P1和第三点P3可以设置在基准线RL上的同一位置处。第二点P2和第四点P4设置在经过第一点P1和第三点P3并与第一方向轴A1平行的平行线PL上。另外，第二点P2可以设置在基准线RL的左边，第四点P4可以设置在基准线RL的右边。Referring to FIG. 8, the first point P1 and the third point P3 may be set at the same position on the reference line RL. The second point P2 and the fourth point P4 are disposed on a parallel line PL passing through the first point P1 and the third point P3 and parallel to the first direction axis A1. In addition, the second point P2 may be set to the left of the reference line RL, and the fourth point P4 may be set to the right of the reference line RL.
参照图9，第一点P1和第三点P3可以设置在基准线RL上的同一位置处。第二点P2和第四点P4设置在经过第一点P1和第三点P3并垂直于基准线RL的平行线PL上。另外，第二点P2可以设置在基准线RL的右边，第四点P4可以设置在基准线RL的左边。Referring to FIG. 9 , the first point P1 and the third point P3 may be set at the same position on the reference line RL. The second point P2 and the fourth point P4 are disposed on a parallel line PL passing through the first point P1 and the third point P3 and perpendicular to the reference line RL. In addition, the second point P2 may be set on the right side of the reference line RL, and the fourth point P4 may be set on the left side of the reference line RL.
参照图10，可以定义与基准线RL平行的子基准线RL1和RL2。子基准线RL1和RL2中的第一子基准线RL1设置在基准线RL和第一焊盘组PG1之间，第二子基准线RL2设置在基准线RL和第三焊盘组PG3之间。Referring to FIG. 10 , sub-reference lines RL1 and RL2 parallel to the reference line RL may be defined. Of the sub-reference lines RL1 and RL2, the first sub-reference line RL1 is disposed between the reference line RL and the first pad group PG1, and the second sub-reference line RL2 is disposed between the reference line RL and the third pad group PG3.
输入焊盘区域IPP-110与子基准线RL1和RL2叠置，并且还包括在与子基准线RL1和RL2平行的方向上延伸的第一基准焊盘RPD1和第二基准焊盘RPD2。第一基准焊盘RPD1和第二基准焊盘RPD2设置在第一焊盘组PG1和第三焊盘组PG3之间。The input pad region IPP-110 overlaps the sub-reference lines RL1 and RL2, and further includes first and second reference pads RPD1 and RPD2 extending in a direction parallel to the sub-reference lines RL1 and RL2. The first reference pad RPD1 and the second reference pad RPD2 are disposed between the first pad group PG1 and the third pad group PG3 .
第一线L1所会聚的第一点P1设置在第一子基准线RL1上，第三线L3所会聚的第三点P3设置在第二子基准线RL2上。另外，第二线L2所会聚的第二点P2和第四线L4所会聚的第四点P4可以设置在同一位置，第二点P2和第四点P4可以设置在基准线RL处。第二点P2和第四点P4可以设置在基准线RL外部的第一子基准线RL1和第二子基准线RL2之间。A first point P1 where the first lines L1 converge is set on the first sub-reference line RL1, and a third point P3 where the third lines L3 converge is set on the second sub-reference line RL2. In addition, the second point P2 where the second line L2 converges and the fourth point P4 where the fourth line L4 converges may be set at the same position, and the second point P2 and the fourth point P4 may be set at the reference line RL. The second point P2 and the fourth point P4 may be disposed between the first sub-reference line RL1 and the second sub-reference line RL2 outside the reference line RL.
参照图11，可以不在第一焊盘组PG1和第三焊盘组PG3之间设置基准焊盘。可以在第一焊盘组PG1和第三焊盘组PG3之间仅定义基准线RL。Referring to FIG. 11 , a reference pad may not be provided between the first pad group PG1 and the third pad group PG3 . Only the reference line RL may be defined between the first pad group PG1 and the third pad group PG3.
图12是示出根据实施例的电子装置的电子组件所结合的焊盘区域的平面图。在下文中，将参照图12描述根据实施例的电子装置。然而，将省略针对参照图1至图11描述的重叠构造的详细描述。FIG. 12 is a plan view illustrating pad regions to which electronic components of the electronic device according to the embodiment are combined. Hereinafter, an electronic device according to an embodiment will be described with reference to FIG. 12 . However, a detailed description for the overlapping configuration described with reference to FIGS. 1 to 11 will be omitted.
柔性布线基底122的输出焊盘OPD-120电连接到显示面板110的输入焊盘IPD-110。在本实施例中，第二电子组件120(见图3A和图3B)可以仅包括柔性布线基底122。虽然图中没有示出，但是数据驱动电路125(见图3A和图3B)可以设置在显示面板110的非显示区域BA中。虽然在本实施例中数据驱动电路125被描述为驱动芯片的示例，但是可以改变驱动芯片的类型。The output pad OPD-120 of the flexible wiring substrate 122 is electrically connected to the input pad IPD-110 of the display panel 110 . In this embodiment, the second electronic assembly 120 (see FIGS. 3A and 3B ) may only include the flexible wiring substrate 122 . Although not shown in the drawing, a data driving circuit 125 (see FIGS. 3A and 3B ) may be disposed in the non-display area BA of the display panel 110 . Although the data driving circuit 125 is described as an example of a driving chip in the present embodiment, the type of driving chip may be changed.
显示面板110还可以包括设置在非显示区域BA中的用于数据驱动电路的连接焊盘区域IPP-110'和OPP-110'。连接焊盘区域IPP-110'和OPP-110'可以包括输入焊盘区域IPP-110'和输出焊盘区域OPP-110'。输入焊盘区域IPP-110'可以包括输入焊盘IPD-110'，输出焊盘区域OPP-110'可以包括输出焊盘OPD-110'。The display panel 110 may further include connection pad areas IPP-110' and OPP-110' for data driving circuits disposed in the non-display area BA. The connection pad regions IPP-110' and OPP-110' may include an input pad region IPP-110' and an output pad region OPP-110'. The input pad area IPP-110' may include the input pad IPD-110', and the output pad area OPP-110' may include the output pad OPD-110'.
另外，虽然特定设计值不同，但是输出焊盘区域OPP-110'可以包括布置和形式与参照图5A至图5D描述的显示面板110的输入焊盘区域IPP-110的焊盘相似的焊盘。另外，输出焊盘区域OPP-110'可以包括图案与图6至图11中示出的输入焊盘区域IPP-110的焊盘相似的焊盘。输入焊盘区域IPP-110'可以包括与输出焊盘区域OPP-110'的焊盘相同的焊盘，或者可以包括与输出焊盘区域OPP-110'的焊盘相对于第一方向轴A1对称的焊盘。In addition, the output pad region OPP-110' may include pads similar in arrangement and form to those of the input pad region IPP-110 of the display panel 110 described with reference to FIGS. 5A to 5D although specific design values are different. In addition, the output pad region OPP-110' may include pads having a pattern similar to that of the input pad region IPP-110 shown in FIGS. 6 to 11 . The input pad area IPP-110' may include the same pads as the pads of the output pad area OPP-110', or may include pads that are symmetrical to the pads of the output pad area OPP-110' with respect to the first direction axis A1. pads.
显示面板110的输入焊盘IPD-110可以通过一些信号布线SL-110而连接到针对数据驱动电路的输入焊盘区域IPP-110'。虽然图中没有示出，但是其他一些信号布线SL-110可以直接连接到针对数据驱动电路的输入焊盘区域IPP-110'。显示面板110的输入焊盘IPD-110可以通过其他一些信号布线SL-110而直接连接到栅极布线(未示出)或数据布线(未示出)。The input pad IPD-110 of the display panel 110 may be connected to the input pad region IPP-110' for the data driving circuit through some signal wirings SL-110. Although not shown in the figure, some other signal wirings SL-110 may be directly connected to the input pad region IPP-110' for the data driving circuit. The input pad IPD-110 of the display panel 110 may be directly connected to a gate wiring (not shown) or a data wiring (not shown) through some other signal wiring SL-110.
数据驱动电路125包括与输入焊盘区域IPP-110'和输出焊盘区域OPP-110'对应的焊盘区域。数据驱动电路125可以包括与输入焊盘区域IPP-110'相同地设计的焊盘区域以及与输出焊盘区域OPP-110'相同地设计的焊盘区域。数据驱动电路125的焊盘区域可以通过导电粘附膜(未示出)而电连接到输入焊盘区域IPP-110'和输出焊盘区域OPP-110'。即，数据驱动电路125、输入焊盘区域IPP-110'和输出焊盘区域OPP-110'的结合结构可以与参照图4A至图4C描述的显示面板110的输入焊盘区域IPP-110和柔性布线基底122的输出焊盘区域OPP-120的结合结构基本相同。The data driving circuit 125 includes pad regions corresponding to the input pad region IPP-110' and the output pad region OPP-110'. The data driving circuit 125 may include a pad area designed the same as the input pad area IPP-110' and a pad area designed the same as the output pad area OPP-110'. The pad area of the data driving circuit 125 may be electrically connected to the input pad area IPP-110' and the output pad area OPP-110' through a conductive adhesive film (not shown). That is, the combined structure of the data driving circuit 125, the input pad region IPP-110' and the output pad region OPP-110' may be the same as the input pad region IPP-110 and the flexible pad region 110 of the display panel 110 described with reference to FIGS. The bonding structure of the output pad region OPP-120 of the wiring substrate 122 is basically the same.
图13是示出根据实施例的电子装置的接合工艺的流程图。图14A是示出根据实施例的接合工艺期间的对齐操作的平面图。图14B是示出根据实施例的接合工艺期间的Y轴校正操作的平面图。图14C是示出根据实施例的接合工艺期间的结合操作的平面图。FIG. 13 is a flowchart illustrating a bonding process of an electronic device according to an embodiment. FIG. 14A is a plan view illustrating an alignment operation during a bonding process according to an embodiment. 14B is a plan view illustrating a Y-axis correction operation during a bonding process according to an embodiment. FIG. 14C is a plan view illustrating a bonding operation during a bonding process according to an embodiment.
图14A至图14C示出包括第一焊盘组PG1至第四焊盘组PG4的输入焊盘区域IPP-110和包括第一焊盘组PG10至第四焊盘组PG40的输出焊盘区域OPP-120。输入焊盘区域IPP-110的每个焊盘组包括两个输入焊盘，输出焊盘区域OPP-120的每个焊盘组包括两个输出焊盘。在本实施例中，根据输入焊盘区域IPP-110的输入焊盘的每条延长线的长度可以大于根据输出焊盘区域OPP-120的输出焊盘的每条延长线的长度。为了简化附图，没有示出输出焊盘区域OPP-120的输出焊盘的延长线。14A to 14C show the input pad region IPP-110 including the first pad group PG1 to the fourth pad group PG4 and the output pad region OPP including the first pad group PG10 to the fourth pad group PG40. -120. Each pad group of the input pad area IPP-110 includes two input pads, and each pad group of the output pad area OPP-120 includes two output pads. In this embodiment, the length of each extension line according to the input pads of the input pad region IPP-110 may be greater than the length of each extension line according to the output pads of the output pad region OPP-120. In order to simplify the drawing, the extension lines of the output pads of the output pad region OPP-120 are not shown.
参照图13，首先，在操作S601中，首先对齐输入焊盘区域IPP-110和输出焊盘区域OPP-120。如图14A中所示，使用显示面板110的第一对齐标记AM1和第二对齐标记AM10以及柔性布线基底122的第一对齐标记AM2和第二对齐标记AM20来对齐。显示面板110的第一对齐标记AM1和第二对齐标记AM10以及柔性布线基底122的第一对齐标记AM2和第二对齐标记AM20与第二方向轴A2的位移匹配。在描述接合方法时，第二方向轴A2表示Y-轴，第一方向轴A1表示X-轴。Referring to FIG. 13, first, in operation S601, the input pad region IPP-110 and the output pad region OPP-120 are first aligned. As shown in FIG. 14A , alignment is performed using the first and second alignment marks AM1 and AM10 of the display panel 110 and the first and second alignment marks AM2 and AM20 of the flexible wiring substrate 122 . The first alignment mark AM1 and the second alignment mark AM10 of the display panel 110 and the first alignment mark AM2 and the second alignment mark AM20 of the flexible wiring substrate 122 are matched with the displacement of the second direction axis A2. In describing the joining method, the second direction axis A2 represents the Y-axis, and the first direction axis A1 represents the X-axis.
即使相同地设计输入焊盘区域IPP-110和输出焊盘区域OPP-120时，由于柔性布线基底122或显示面板110的制造误差，也会导致输入焊盘区域IPP-110和输出焊盘区域OPP-120的根据X-轴的位移互不相同。例如，由于制造工艺期间的温度和湿度的影响，还会导致柔性布线基底122的输出焊盘区域OPP-120与设计值相比在X-轴上收缩。即，输入焊盘区域IPP-110和输出焊盘区域OPP-120均可能具有与所设计的节距不同的节距。Even when the input pad region IPP-110 and the output pad region OPP-120 are designed identically, due to manufacturing errors of the flexible wiring substrate 122 or the display panel 110, the input pad region IPP-110 and the output pad region OPP The displacements of -120 according to the X-axis are different from each other. For example, due to the influence of temperature and humidity during the manufacturing process, the output pad region OPP-120 of the flexible wiring substrate 122 may also shrink in the X-axis compared to a design value. That is, each of the input pad region IPP-110 and the output pad region OPP-120 may have a different pitch from the designed pitch.
因此，输入焊盘区域IPP-110的第一焊盘组PG1和第三焊盘组PG3的输入焊盘的延长线可以会聚于设置在同一位置处的第一点P1和第三点P3，输入焊盘区域IPP-110的第二焊盘组PG2和第四焊盘组PG4的输入焊盘的延长线可以会聚于设置在同一位置处的第二点P2和第四点P4。输出焊盘区域OPP-120的第一焊盘组PG10和第三焊盘组PG30的输出焊盘的延长线可以会聚于设置在同一位置处的第五点P10和第七点P30，输出焊盘区域OPP-120的第二焊盘组PG20和第四焊盘组PG40的输出焊盘的延长线可以会聚于设置在同一位置处的第六点P20和第八点P40。第五点P10和第七点P30设置在与第一点P1和第三点P3的位置不同的位置处。第六点P20和第八点P40设置在与第二点P2和第四点P4的位置不同的位置处。Therefore, the extension lines of the input pads of the first pad group PG1 and the third pad group PG3 of the input pad region IPP-110 may converge to the first point P1 and the third point P3 provided at the same position, and the input Extension lines of the input pads of the second and fourth pad groups PG2 and PG4 of the pad region IPP-110 may converge to the second and fourth points P2 and P4 disposed at the same location. The extension lines of the output pads of the first pad group PG10 and the third pad group PG30 of the output pad area OPP-120 may converge at the fifth point P10 and the seventh point P30 arranged at the same position, the output pads Extension lines of the output pads of the second pad group PG20 and the fourth pad group PG40 of the area OPP-120 may converge to the sixth point P20 and the eighth point P40 disposed at the same location. The fifth point P10 and the seventh point P30 are disposed at positions different from those of the first point P1 and the third point P3. The sixth point P20 and the eighth point P40 are disposed at positions different from those of the second point P2 and the fourth point P4.
然后，在操作S602中，测量根据输入焊盘区域IPP-110和输出焊盘区域OPP-120的X-轴的位移误差ΔX。如图14A中所示，测量显示面板110的第一对齐标记AM1和柔性布线基底122的第一对齐标记AM2之间的位移差ΔX1或者显示面板110的第二对齐标记AM10和柔性布线基底122的第二对齐标记AM20之间的位移差ΔX2。Then, in operation S602, a displacement error ΔX according to the X-axis of the input pad area IPP-110 and the output pad area OPP-120 is measured. As shown in FIG. 14A , the displacement difference ΔX1 between the first alignment mark AM1 of the display panel 110 and the first alignment mark AM2 of the flexible wiring substrate 122 or the displacement difference ΔX1 between the second alignment mark AM10 of the display panel 110 and the flexible wiring substrate 122 is measured. The displacement difference ΔX2 between the second alignment marks AM20.
然后，在操作S603中，确定位移误差ΔX。当位移误差ΔX小于基准值(例如，0)时，确定没有发生制造误差。因此，在操作S604中立刻将输入焊盘区域IPP-110和输出焊盘区域OPP-120彼此接合。可以根据输入焊盘区域IPP-110和输出焊盘区域OPP-120的数值(numerical value)将基准值设置在预定范围内。Then, in operation S603, a displacement error ΔX is determined. When the displacement error ΔX is smaller than a reference value (for example, 0), it is determined that no manufacturing error has occurred. Accordingly, the input pad region IPP-110 and the output pad region OPP-120 are immediately bonded to each other in operation S604. The reference value may be set within a predetermined range according to numerical values of the input pad area IPP-110 and the output pad area OPP-120.
当位移误差ΔX大于基准值时，确定发生了制造误差。因此，在操作S605中计算Y-轴校正值ΔY。然而，用于计算Y-轴校正值ΔY的工艺在根据X-轴的位移误差ΔX落入许可范围内时执行。即，当根据X-轴的位移误差ΔX比基准值大很多时，可以将此视为有缺陷。When the displacement error ΔX is greater than the reference value, it is determined that a manufacturing error has occurred. Therefore, a Y-axis correction value ΔY is calculated in operation S605. However, the process for calculating the Y-axis correction value ΔY is performed when the displacement error ΔX according to the X-axis falls within the allowable range. That is, when the displacement error ΔX according to the X-axis is much larger than the reference value, this can be regarded as defective.
可以通过下面的等式6来计算Y-轴校正值ΔY。The Y-axis correction value ΔY can be calculated by Equation 6 below.
[等式6][equation 6]
其中，θ可以定义为基准线RL与样本焊盘的延长线之间的夹角。样本焊盘可以是设置在最外面的焊盘。如图14A中所示，样本焊盘可以是连接到第二对齐标记AM10的输入焊盘IPD-110或者连接到第二对齐标记AM20的输出焊盘OPD-120。Among them, θ can be defined as the angle between the reference line RL and the extension line of the sample pad. The sample pad may be the outermost pad. As shown in FIG. 14A , the sample pad may be an input pad IPD-110 connected to the second alignment mark AM10 or an output pad OPD-120 connected to the second alignment mark AM20 .
当通过等式6来计算Y-轴校正值ΔY时，如图14B中所示，在操作S606中执行Y-轴校正。通过将显示面板110和柔性布线基底122中的一个在沿着第二方向轴A2的上/下方向上移动Y-轴校正值ΔY来执行Y-轴校正。因此，如图14B中所示，增大了输入焊盘IPD-110和输出焊盘OPD-120的对应焊盘的叠置区域。When the Y-axis correction value ΔY is calculated by Equation 6, as shown in FIG. 14B , Y-axis correction is performed in operation S606. Y-axis correction is performed by moving one of the display panel 110 and the flexible wiring substrate 122 in an up/down direction along the second direction axis A2 by a Y-axis correction value ΔY. Therefore, as shown in FIG. 14B , the overlapping area of the corresponding pads of the input pad IPD- 110 and the output pad OPD- 120 is increased.
通过Y-轴校正，可以将第五点P10和第七点P30基本上设置在与第一点P1和第三点P3的位置相同的位置处。可以将第六点P20和第八点P40基本上设置在与第二点P2和第四点P4的位置相同的位置处。Through the Y-axis correction, the fifth point P10 and the seventh point P30 may be disposed substantially at the same positions as those of the first point P1 and the third point P3. The sixth point P20 and the eighth point P40 may be disposed substantially at the same positions as those of the second point P2 and the fourth point P4.
根据实施例，可以用另一种方法来代替Y-轴校正值ΔY的计算和Y-轴校正。可以通过沿着第二方向轴A2的上/下方向上移动显示面板110和柔性布线基底122中的一个来选择使输入焊盘IPD-110和输出焊盘OPD-120的叠置区域最大化的点。According to an embodiment, another method may be used instead of the calculation of the Y-axis correction value ΔY and the Y-axis correction. A point that maximizes the overlapping area of the input pad IPD-110 and the output pad OPD-120 may be selected by moving one of the display panel 110 and the flexible wiring substrate 122 up/down along the second direction axis A2. .
在Y-轴校正之后，在操作S604中将输入焊盘区域IPP-110和输出焊盘区域OPP-120彼此接合。通过使用工具，将输入焊盘区域IPP-110和输出焊盘区域OPP-120与它们之间的导电粘附膜140一起热压缩。After the Y-axis correction, the input pad region IPP-110 and the output pad region OPP-120 are bonded to each other in operation S604. The input pad region IPP-110 and the output pad region OPP-120 are thermally compressed together with the conductive adhesive film 140 therebetween by using a tool.
输出焊盘区域OPP-120和输入焊盘区域IPP-110会因从工具发射的热而沿着第一方向轴A1膨胀。由于柔性布线基底122的热膨胀系数基本上大于显示面板110的热膨胀系数，因此输出焊盘区域OPP-120会比输入焊盘区域IPP-110膨胀得要多。另外，输出焊盘区域OPP-120可以根据距第一方向轴A1的位置而以不同的比率膨胀。The output pad area OPP-120 and the input pad area IPP-110 may expand along the first direction axis A1 due to heat emitted from the tool. Since the thermal expansion coefficient of the flexible wiring substrate 122 is substantially greater than that of the display panel 110, the output pad region OPP-120 expands more than the input pad region IPP-110. In addition, the output pad region OPP-120 may expand at different rates according to a position from the first direction axis A1.
如图14C中所示，在热压缩之后，输出焊盘OPD-120相对于对应的输入焊盘IPD-110自基准线RL向外部移动。原因是：因为输出焊盘OPD-120沿着第一方向轴A1膨胀。随着自基准线RL更向外地设置，输出焊盘OPD-120的移动位移增加。As shown in FIG. 14C , after thermal compression, the output pad OPD- 120 moves outward from the reference line RL relative to the corresponding input pad IPD- 110 . The reason is: because the output pad OPD-120 expands along the first direction axis A1. As it is set further outward from the reference line RL, the shift displacement of the output pad OPD- 120 increases.
因此，第五点P10和第七点P30设置在与第一点P1和第三点P3的位置不同的位置处。第六点P20和第八点P40设置在与第二点P2和第四点P4的位置不同的位置处。Therefore, the fifth point P10 and the seventh point P30 are disposed at positions different from those of the first point P1 and the third point P3. The sixth point P20 and the eighth point P40 are disposed at positions different from those of the second point P2 and the fourth point P4.
对于根据实施例的电子装置，即使当输出焊盘区域OPP-120和输入焊盘区域IPP-110在使用工具的热压缩工艺中如上所述地改变时，输出焊盘区域OPP-120和输入焊盘区域IPP-110的电结合可靠性也得以改善。With the electronic device according to the embodiment, even when the output pad area OPP-120 and the input pad area IPP-110 are changed as described above in the thermal compression process using a tool, the output pad area OPP-120 and the input pad area OPP-120 and the input pad area are changed as described above. The electrical bonding reliability of the disk area IPP-110 is also improved.
如参照图5C描述的，对于根据实施例的电子装置，由于输出焊盘OPD-120包括具有不同节距的焊盘组PG10至PG40并且输入焊盘IPD-110包括具有不同节距的焊盘组PG1至PG4，因此即使输出焊盘区域OPP-120和输入焊盘区域IPP-110沿着第一方向轴A1各向异性地膨胀，对应的输出焊盘和输入焊盘的结合面积也会大于预定的面积。因此，对应的输出焊盘和输入焊盘可以具有小于基准值的接触电阻。As described with reference to FIG. 5C , for the electronic device according to the embodiment, since the output pad OPD-120 includes pad groups PG10 to PG40 with different pitches and the input pad IPD-110 includes pad groups with different pitches PG1 to PG4, so even if the output pad region OPP-120 and the input pad region IPP-110 are anisotropically expanded along the first direction axis A1, the combined area of the corresponding output pad and input pad will be larger than predetermined area. Accordingly, the corresponding output pads and input pads may have a contact resistance less than a reference value.
膨胀比率相对小的第一焊盘组PG10的输出焊盘OPD-120的结合面积以相对小的比率减小。膨胀比率相对大的第二焊盘组PG20的输出焊盘OPD-120的结合面积以相对大的比率减小。虽然如此，但由于第二焊盘组PG20的输出焊盘OPD-120的宽度大于第一焊盘组PG10的输出焊盘OPD-120的宽度，因此仍可以提供比预定面积大的结合面积。The bonding area of the output pad OPD- 120 of the first pad group PG10 having a relatively small expansion ratio is reduced at a relatively small ratio. The bonding area of the output pad OPD-120 of the second pad group PG20 having a relatively large expansion ratio is reduced at a relatively large ratio. Even so, since the width of the output pad OPD-120 of the second pad group PG20 is larger than that of the output pad OPD-120 of the first pad group PG10, a bonding area larger than a predetermined area may still be provided.
另外，由于膨胀比率相对大的第二焊盘组PG20的输出焊盘OPD-120以比第一焊盘组PG10的输出焊盘OPD-120的间隔G1和G10相对大的间隔G2和G20彼此分隔开，因此它们没有电连接到与对应的输入焊盘IPD-110相邻的输入焊盘。即，防止了错误连接。由于第二焊盘组PG2的输入焊盘IPD-110以相对大的间隔G2和G20彼此分隔开，因此进一步减小了误差校正。In addition, since the output pads OPD-120 of the second pad group PG20 having a relatively large expansion ratio are separated from each other by the intervals G2 and G20 relatively larger than the intervals G1 and G10 of the output pads OPD-120 of the first pad group PG10. spaced apart so they are not electrically connected to the input pads adjacent to the corresponding input pads IPD-110. Namely, wrong connection is prevented. Since the input pads IPD- 110 of the second pad group PG2 are separated from each other by relatively large intervals G2 and G20 , error correction is further reduced.
图14A至图14C是示出设计为允许将输入焊盘区域IPP-110的第一点至第四点P1、P2、P3和P4设置在显示面板110处的焊盘结构的视图。就这一点而言，提供一种被设计为允许将输出焊盘区域OPP-120的第五点至第八点P10、P20、P30和P40设置在显示面板110处的焊盘结构。然而，输入焊盘区域IPP-110和输出焊盘区域OPP-120的焊盘结构不限于此。14A to 14C are views illustrating a pad structure designed to allow first to fourth points P1 , P2 , P3 and P4 of the input pad region IPP- 110 to be disposed at the display panel 110 . In this regard, there is provided a pad structure designed to allow fifth to eighth points P10 , P20 , P30 , and P40 of the output pad region OPP- 120 to be disposed at the display panel 110 . However, the pad structures of the input pad area IPP-110 and the output pad area OPP-120 are not limited thereto.
图15是示出根据实施例的完成接合工艺的电子装置的焊盘区域的平面图。输入焊盘区域IPP-110的第一点至第四点P1、P2、P3和P4设置在柔性布线基底122处。就这一点而言，输出焊盘区域OPP-120的第五点至第八点P10、P20、P30和P40设置在柔性布线基底122处。FIG. 15 is a plan view illustrating a pad region of an electronic device on which a bonding process is completed according to an embodiment. First to fourth points P1 , P2 , P3 and P4 of the input pad region IPP- 110 are disposed at the flexible wiring substrate 122 . In this regard, fifth to eighth points P10 , P20 , P30 and P40 of the output pad region OPP- 120 are disposed at the flexible wiring substrate 122 .
图15中示出的电子装置的接合工艺与参照图13至图14C描述的接合工艺相同。在参照图14B描述的Y-轴操作中，可以通过在与图14B的移动方向相反的方向上移动柔性布线基底122来执行Y-轴校正。The bonding process of the electronic device shown in FIG. 15 is the same as the bonding process described with reference to FIGS. 13 to 14C . In the Y-axis operation described with reference to FIG. 14B, Y-axis correction can be performed by moving the flexible wiring substrate 122 in a direction opposite to that of FIG. 14B.
图16A是示出根据实施例的两个电子组件的分开的焊盘区域的平面图。图16B是示出根据实施例的两个电子组件的结合的焊盘区域的平面图。在下文中，将参照图16A和图16B来描述根据实施例的电子装置。然而，将省略对参照图1至图15描述的重叠构造的详细描述。16A is a plan view showing separated pad regions of two electronic components according to an embodiment. 16B is a plan view showing bonded pad regions of two electronic components according to the embodiment. Hereinafter, an electronic device according to an embodiment will be described with reference to FIGS. 16A and 16B . However, a detailed description of the overlapping configuration described with reference to FIGS. 1 to 15 will be omitted.
如图16A和图16B中所示，显示面板110和柔性布线基底122均包括沿第二方向轴A2布置的多个焊盘行。每个焊盘行包括沿第一方向轴A1布置的多个焊盘。在本实施例中，示例性地示出的是显示面板110和柔性布线基底122均包括两个焊盘行。由于显示面板110和柔性布线基底122均包括多个焊盘行，因此可以在沿第一方向轴A1的狭窄范围内设置更多的焊盘。As shown in FIGS. 16A and 16B , each of the display panel 110 and the flexible wiring substrate 122 includes a plurality of pad rows arranged along the second direction axis A2. Each pad row includes a plurality of pads arranged along the first direction axis A1. In this embodiment, it is exemplarily shown that both the display panel 110 and the flexible wiring substrate 122 include two pad rows. Since the display panel 110 and the flexible wiring substrate 122 each include a plurality of pad rows, more pads may be disposed within a narrow range along the first direction axis A1.
可以将显示面板110的两个焊盘行定义为第一输入焊盘区域IPP1-110和第二输入焊盘区域IPP2-110。第一输入焊盘区域IPP1-110和第二输入焊盘区域IPP2-110均包括多个输入焊盘IPD-110。第一输入焊盘区域IPP1-110的输入焊盘IPD-110和第二输入焊盘区域IPP2-110的输入焊盘IPD-110可以接收不同的信号。根据实施例，第一输入焊盘区域IPP1-110的一些输入焊盘IPD-110和第二输入焊盘区域IPP2-110的一些输入焊盘IPD-110可以接收相同的信号。Two pad rows of the display panel 110 may be defined as a first input pad area IPP1-110 and a second input pad area IPP2-110. Each of the first input pad region IPP1-110 and the second input pad region IPP2-110 includes a plurality of input pads IPD-110. The input pads IPD-110 of the first input pad region IPP1-110 and the input pads IPD-110 of the second input pad region IPP2-110 may receive different signals. According to an embodiment, some of the input pads IPD-110 of the first input pad region IPP1-110 and some of the input pads IPD-110 of the second input pad region IPP2-110 may receive the same signal.
可以将柔性布线基底122的两个焊盘行定义为第一输出焊盘区域OPP1-120和第二输出焊盘区域OPP2-120。第一输出焊盘区域OPP1-120和第二输出焊盘区域OPP2-120均包括多个输出焊盘OPD-120。Two pad rows of the flexible wiring substrate 122 may be defined as a first output pad region OPP1-120 and a second output pad region OPP2-120. Each of the first output pad region OPP1-120 and the second output pad region OPP2-120 includes a plurality of output pads OPD-120.
如图16B中所示，第一输出焊盘区域OPP1-120和第二输出焊盘区域OPP2-120分别电连接到第一输入焊盘区域IPP1-110和第二输入焊盘区域IPP2-110。在本实施例中，虽然示出的是输入焊盘IPD-110与输出焊盘OPD-120一一对应，但是实施例不限于此。根据另一个实施例，输入焊盘区域IPP-110和输出焊盘区域OPP-120可以包括不同数量的焊盘和不同数量的焊盘行。As shown in FIG. 16B , the first output pad region OPP1-120 and the second output pad region OPP2-120 are electrically connected to the first input pad region IPP1-110 and the second input pad region IPP2-110, respectively. In this embodiment, although it is shown that the input pads IPD- 110 correspond to the output pads OPD- 120 one-to-one, the embodiment is not limited thereto. According to another embodiment, the input pad area IPP-110 and the output pad area OPP-120 may include different numbers of pads and different numbers of pad rows.
图17A和图17B是示出根据实施例的第一电子组件焊盘区域的平面图。图17A详细示出第一输入焊盘区域IPP1-110的输入焊盘的延长线，图17B详细示出第二输入焊盘区域IPP2-110的输入焊盘的延长线。17A and 17B are plan views illustrating pad regions of the first electronic component according to the embodiment. FIG. 17A shows the extension of the input pads of the first input pad region IPP1-110 in detail, and FIG. 17B shows the extension of the input pads of the second input pad region IPP2-110 in detail.
如图17A中所示，第一输入焊盘区域IPP1-110包括与参照图5A至图5D描述的输入焊盘区域IPP-110的输入焊盘相同地布置的多个输入焊盘。第一输入焊盘区域IPP1-110包括相对于基准线RL设置在左边的第一焊盘组PG1和第二焊盘组PG2以及相对于基准线RL设置在右边的第三焊盘组PG3和第四焊盘组PG4。第一焊盘组至第四焊盘组PG1、PG2、PG3和PG4分别包括多个第一焊盘PD1、多个第二焊盘PD2、多个第三焊盘PD3和多个第四焊盘PD4。As shown in FIG. 17A , the first input pad region IPP1-110 includes a plurality of input pads arranged identically to the input pads of the input pad region IPP-110 described with reference to FIGS. 5A to 5D . The first input pad area IPP1-110 includes the first pad group PG1 and the second pad group PG2 arranged on the left relative to the reference line RL, and the third pad group PG3 and the second pad group arranged on the right relative to the reference line RL. Four pad group PG4. The first pad group to the fourth pad group PG1, PG2, PG3 and PG4 respectively include a plurality of first pads PD1, a plurality of second pads PD2, a plurality of third pads PD3 and a plurality of fourth pads PD4.
多个第一焊盘PD1的第一线L1会聚于第一点P1-1，多个第二焊盘PD2的第二线L2会聚于第二点P2-1。第一点P1-1可以设置在基准线RL上，第二点P2-1可以设置在基准线RL外部。多个第三焊盘PD3的第三线L3会聚于第三点P3-1，多个第四焊盘PD4的第四线L4会聚于第四点P4-1。第一点P1-1和第三点P3-1可以设置在同一位置处。第四点P4-1可以设置在与第二点P2-1关于基准线RL对称的位置处。The first lines L1 of the plurality of first pads PD1 converge at a first point P1-1, and the second lines L2 of the plurality of second pads PD2 converge at a second point P2-1. The first point P1-1 may be set on the reference line RL, and the second point P2-1 may be set outside the reference line RL. The third lines L3 of the plurality of third pads PD3 converge at the third point P3-1, and the fourth lines L4 of the plurality of fourth pads PD4 converge at the fourth point P4-1. The first point P1-1 and the third point P3-1 may be set at the same position. The fourth point P4-1 may be disposed at a position symmetrical to the second point P2-1 with respect to the reference line RL.
根据实施例，可以改变第一焊盘PD1、第二焊盘PD2、第三焊盘PD3和第四焊盘PD4相对于基准线RL的节距和倾斜度，以使第一点P1-1、第二点P2-1、第三点P3-1和第四点P4-1能够分别与图6至图11中示出的第一点P1、第二点P2、第三点P3和第四点P4对应。According to an embodiment, the pitch and inclination of the first pad PD1, the second pad PD2, the third pad PD3 and the fourth pad PD4 relative to the reference line RL may be changed so that the first point P1-1, The second point P2-1, the third point P3-1, and the fourth point P4-1 can be compared with the first point P1, the second point P2, the third point P3, and the fourth point shown in FIGS. 6 to 11, respectively. P4 correspondence.
如图17B中所示，第二输入焊盘区域IPP2-110包括与参照图5A至图5D描述的输入焊盘区域IPP-110的输入焊盘相同地布置的多个输入焊盘。第二输入焊盘区域IPP2-110包括相对于基准线RL设置在左边的第一焊盘组PG10和第二焊盘组PG20以及相对于基准线RL设置在右边的第三焊盘组PG30和第四焊盘组PG40。第一焊盘组至第四焊盘组PG10、PG20、PG30和PG40分别包括多个第一焊盘PD10、多个第二焊盘PD20、多个第三焊盘PD30和多个第四焊盘PD40。As shown in FIG. 17B , the second input pad region IPP2-110 includes a plurality of input pads arranged identically to the input pads of the input pad region IPP-110 described with reference to FIGS. 5A to 5D . The second input pad region IPP2-110 includes the first pad group PG10 and the second pad group PG20 arranged on the left relative to the reference line RL, and the third pad group PG30 and the second pad group arranged on the right relative to the reference line RL. Four pad group PG40. The first pad group to the fourth pad group PG10, PG20, PG30 and PG40 respectively include a plurality of first pads PD10, a plurality of second pads PD20, a plurality of third pads PD30 and a plurality of fourth pads PD40.
多个第一焊盘PD10的第一线L10会聚于第五点P1-2，多个第二焊盘PD20的第二线L20会聚于第六点P2-2。第五点P1-2可以设置在基准线RL上，第六点P2-2可以设置在基准线RL外部。多个第三焊盘PD30的第三线L30会聚于第七点P3-2，多个第四焊盘PD40的第四线L40会聚于第八点P4-2。第五点P1-2和第七点P3-2可以设置在同一位置处。第八点P4-2可以设置在与第六点P2-2关于基准线RL对称的位置处。The first lines L10 of the plurality of first pads PD10 converge at the fifth point P1-2, and the second lines L20 of the plurality of second pads PD20 converge at the sixth point P2-2. The fifth point P1-2 may be set on the reference line RL, and the sixth point P2-2 may be set outside the reference line RL. The third lines L30 of the plurality of third pads PD30 converge at the seventh point P3-2, and the fourth lines L40 of the plurality of fourth pads PD40 converge at the eighth point P4-2. The fifth point P1-2 and the seventh point P3-2 may be provided at the same position. The eighth point P4-2 may be disposed at a position symmetrical to the sixth point P2-2 with respect to the reference line RL.
在本实施例中，第二输入焊盘区域IPP2-110中的多个第一焊盘PD10、多个第二焊盘PD20、多个第三焊盘PD30和多个第四焊盘PD40可以分别具有与第一输入焊盘区域IPP1-110中的多个第一焊盘PD1、多个第二焊盘PD2、多个第三焊盘PD3和多个第四焊盘PD4的相对于基准线RL的节距和倾斜度相同的相对于基准线RL的节距和倾斜度。即，第二输入焊盘区域IPP2-110的焊盘具有按第一输入焊盘区域IPP1-110的焊盘沿第二方向轴A2移动而获得的节距和布置。因此，随着第一点至第四点P1-1、P2-1、P3-1和P4-1沿第二方向轴A2移动，它们与第五点至第八点P1-2、P2-2、P3-2和P4-2叠置。In this embodiment, the plurality of first pads PD10, the plurality of second pads PD20, the plurality of third pads PD30 and the plurality of fourth pads PD40 in the second input pad region IPP2-110 can be respectively With respect to the reference line RL with respect to the plurality of first pads PD1, the plurality of second pads PD2, the plurality of third pads PD3 and the plurality of fourth pads PD4 in the first input pad region IPP1-110 The pitch and inclination are the same as the pitch and inclination relative to the reference line RL. That is, the pads of the second input pad region IPP2-110 have a pitch and arrangement obtained by moving the pads of the first input pad region IPP1-110 along the second direction axis A2. Therefore, as the first to fourth points P1-1, P2-1, P3-1, and P4-1 move along the second direction axis A2, they are aligned with the fifth to eighth points P1-2, P2-2 , P3-2 and P4-2 overlap.
根据实施例，可以改变第一焊盘PD10、第二焊盘PD20、第三焊盘PD30和第四焊盘PD40的相对于基准线RL的节距和倾斜度，以使第五点P1-2、第六点P2-2、第七点P3-2和第八点P4-2能够分别与图6至图11中示出的第一点P1、第二点P2、第三点P3和第四点P4对应。根据实施例，可以将第五点P1-2、第六点P2-2、第七点P3-2和第八点P4-2设置为分别与第一点P1、第二点P2、第三点P3和第四点P4叠置。根据实施例，可以改变第一焊盘PD10、第二焊盘PD20、第三焊盘PD30和第四焊盘PD40的相对于基准线RL的节距和倾斜角，以使第五点P1-2、第六点P2-2、第七点P3-2和第八点P4-2能够分别与第一点P1、第二点P2、第三点P3和第四点P4叠置。According to an embodiment, the pitch and inclination of the first pad PD10, the second pad PD20, the third pad PD30, and the fourth pad PD40 relative to the reference line RL may be changed so that the fifth point P1-2 , the sixth point P2-2, the seventh point P3-2 and the eighth point P4-2 can be respectively compared with the first point P1, the second point P2, the third point P3 and the fourth point shown in Fig. 6 to Fig. 11 Point P4 corresponds. According to the embodiment, the fifth point P1-2, the sixth point P2-2, the seventh point P3-2 and the eighth point P4-2 can be set to be respectively related to the first point P1, the second point P2, the third point P3 and the fourth point P4 overlap. According to an embodiment, the pitch and inclination angle of the first pad PD10, the second pad PD20, the third pad PD30, and the fourth pad PD40 relative to the reference line RL may be changed so that the fifth point P1-2 , the sixth point P2-2, the seventh point P3-2, and the eighth point P4-2 can overlap the first point P1, the second point P2, the third point P3, and the fourth point P4, respectively.
图18至图23是示出根据实施例的第一电子组件的焊盘区域的平面图。在下文中，将参照图18至图23描述根据实施例的第一电子组件的焊盘区域。然而，将省略对参照图16A至图17B描述的重叠构造的详细描述。18 to 23 are plan views illustrating pad regions of the first electronic component according to the embodiment. Hereinafter, the pad region of the first electronic component according to the embodiment will be described with reference to FIGS. 18 to 23 . However, a detailed description of the overlapping configuration described with reference to FIGS. 16A to 17B will be omitted.
图18至图23中示出的第二输入焊盘区域IPP2-110的焊盘是按照第一输入焊盘区域IPP1-110的焊盘沿第二方向轴A2移动而获得的。虽然图中没有单独示出，但是根据实施例，第二输入焊盘区域IPP2-110的焊盘和第一输入焊盘区域IPP1-110的焊盘中的一者可以在满足图6至图11中示出的焊盘的相对于基准线RL的节距和倾斜度的范围内改变。The pads of the second input pad region IPP2-110 shown in FIGS. 18 to 23 are obtained by moving the pads of the first input pad region IPP1-110 along the second direction axis A2. Although not shown separately in the figure, according to an embodiment, one of the pads of the second input pad region IPP2-110 and the pads of the first input pad region IPP1-110 may satisfy the conditions shown in FIGS. 6 to 11 . The pitch and inclination of the pads relative to the reference line RL are varied within the range shown in .
参照图18，第一点P1-1和第二点P2-1可以设置在基准线RL上的不同位置处。第三点P3-1和第一点P1-1设置在基准线RL上的同一位置处。另外，第四点P4-1和第二点P2-1设置在基准线RL上的同一位置处。Referring to FIG. 18 , the first point P1-1 and the second point P2-1 may be set at different positions on the reference line RL. The third point P3-1 and the first point P1-1 are set at the same position on the reference line RL. In addition, the fourth point P4-1 and the second point P2-1 are set at the same position on the reference line RL.
根据实施例，从第一点P1-1和第三点P3-1到基准焊盘RPD的分离距离d1小于从第二点P2-1和第四点P4-1到基准焊盘RPD的分离距离d2。According to an embodiment, the separation distance d1 from the first point P1-1 and the third point P3-1 to the reference pad RPD is smaller than the separation distance from the second point P2-1 and the fourth point P4-1 to the reference pad RPD d2.
第五点P1-2和第六点P2-2可以设置在基准线RL上的不同位置处。第七点P3-2和第五点P1-2设置在基准线RL上的同一位置处。另外，第八点P4-2和第六点P2-2设置在基准线RL上的同一位置处。The fifth point P1-2 and the sixth point P2-2 may be set at different positions on the reference line RL. The seventh point P3-2 and the fifth point P1-2 are set at the same position on the reference line RL. In addition, the eighth point P4-2 and the sixth point P2-2 are set at the same position on the reference line RL.
参照图19，第一点P1-1和第三点P3-1设置在基准线RL上的同一位置处，第二点P2-1和第四点P4-1设置在基准线RL上的同一位置处。根据实施例，从第一点P1-1和第三点P3-1到基准焊盘RPD的分离距离d1大于从第二点P2-1和第四点P4-1到基准焊盘RPD的分离距离d2。Referring to FIG. 19, the first point P1-1 and the third point P3-1 are set at the same position on the reference line RL, and the second point P2-1 and the fourth point P4-1 are set at the same position on the reference line RL place. According to an embodiment, the separation distance d1 from the first point P1-1 and the third point P3-1 to the reference pad RPD is greater than the separation distance from the second point P2-1 and the fourth point P4-1 to the reference pad RPD d2.
第五点P1-2和第七点P3-2设置在基准线RL上的同一位置处，第六点P2-2和第八点P4-2设置在基准线RL上的同一位置处。The fifth point P1-2 and the seventh point P3-2 are set at the same position on the reference line RL, and the sixth point P2-2 and the eighth point P4-2 are set at the same position on the reference line RL.
参照图20，第一点P1-1和第三点P3-1可以设置在基准线RL上的同一位置处。第二点P2-1和第四点P4-1设置在经过第一点P1-1和第三点P3-1并与第一方向轴A1平行的第一平行线PL1上。另外，第二点P2-1可以设置在基准线RL的左边，第四点P4-1可以设置在基准线RL的右边。Referring to FIG. 20, the first point P1-1 and the third point P3-1 may be set at the same position on the reference line RL. The second point P2-1 and the fourth point P4-1 are disposed on a first parallel line PL1 passing through the first point P1-1 and the third point P3-1 and parallel to the first direction axis A1. In addition, the second point P2-1 may be set to the left of the reference line RL, and the fourth point P4-1 may be set to the right of the reference line RL.
第五点P1-2和第七点P3-2设置在基准线RL上的同一位置处。第六点P2-2和第八点P4-2设置在经过第五点P1-2和第七点P3-2并与第一方向轴A1平行的第二平行线PL2上。另外，第六点P2-2可以设置在基准线RL的左边，第八点P4-2可以设置在基准线RL的右边。The fifth point P1-2 and the seventh point P3-2 are set at the same position on the reference line RL. The sixth point P2-2 and the eighth point P4-2 are disposed on a second parallel line PL2 passing through the fifth point P1-2 and the seventh point P3-2 and parallel to the first direction axis A1. In addition, the sixth point P2-2 may be set to the left of the reference line RL, and the eighth point P4-2 may be set to the right of the reference line RL.
参照图21，第一点P1-1和第三点P3-1可以设置在基准线RL上的同一位置处。第二点P2-1和第四点P4-1设置在经过第一点P1-1和第三点P3-1并垂直于基准线RL的第一平行线PL1上。另外，第二点P2-1可以设置在基准线RL的右边，第四点P4-1可以设置在基准线RL的左边。Referring to FIG. 21 , the first point P1-1 and the third point P3-1 may be set at the same position on the reference line RL. The second point P2-1 and the fourth point P4-1 are disposed on a first parallel line PL1 passing through the first point P1-1 and the third point P3-1 and perpendicular to the reference line RL. In addition, the second point P2-1 may be set to the right of the reference line RL, and the fourth point P4-1 may be set to the left of the reference line RL.
第五点P1-2和第七点P3-2设置在基准线RL上的同一位置处。第六点P2-2和第八点P4-2设置在经过第五点P1-2和第七点P3-2并垂直于基准线RL的第二平行线PL2上。另外，第六点P2-2可以设置在基准线RL的右边，第八点P4-2可以设置在基准线RL的左边。The fifth point P1-2 and the seventh point P3-2 are set at the same position on the reference line RL. The sixth point P2-2 and the eighth point P4-2 are disposed on the second parallel line PL2 passing through the fifth point P1-2 and the seventh point P3-2 and perpendicular to the reference line RL. In addition, the sixth point P2-2 may be set on the right side of the reference line RL, and the eighth point P4-2 may be set on the left side of the reference line RL.
参照图22，可以定义与基准线RL平行的子基准线RL1和RL2。子基准线RL1和RL2中的第一子基准线RL1设置在基准线RL和第一焊盘组PG1之间，第二子基准线RL2设置在基准线RL和第三焊盘组PG3之间。Referring to FIG. 22 , sub-reference lines RL1 and RL2 parallel to the reference line RL may be defined. Of the sub-reference lines RL1 and RL2, the first sub-reference line RL1 is disposed between the reference line RL and the first pad group PG1, and the second sub-reference line RL2 is disposed between the reference line RL and the third pad group PG3.
第一输入焊盘区域IPP1-110与子基准线RL1和RL2叠置，并且还包括在与子基准线RL1和RL2平行的方向上延伸的第一基准焊盘RPD1和第二基准焊盘RPD2。第一基准焊盘RPD1和第二基准焊盘RPD2设置在第一焊盘组PG1和第三焊盘组PG3之间。The first input pad region IPP1-110 overlaps the sub-reference lines RL1 and RL2, and further includes first and second reference pads RPD1 and RPD2 extending in a direction parallel to the sub-reference lines RL1 and RL2. The first reference pad RPD1 and the second reference pad RPD2 are disposed between the first pad group PG1 and the third pad group PG3 .
第一点P1-1设置在第一子基准线RL1上，第三点P3-1设置在第二子基准线RL2上。另外，第二点P2-1和第四点P4-1可以设置在同一位置处，第二点P2-1和第四点P4-1可以设置在基准线RL处。第二点P2-1和第四点P4-1可以设置在基准线RL外部，或者可以设置在第一子基准线RL1和第二子基准线RL2之间。The first point P1-1 is set on the first sub-reference line RL1, and the third point P3-1 is set on the second sub-reference line RL2. In addition, the second point P2-1 and the fourth point P4-1 may be set at the same position, and the second point P2-1 and the fourth point P4-1 may be set at the reference line RL. The second point P2-1 and the fourth point P4-1 may be disposed outside the reference line RL, or may be disposed between the first sub-reference line RL1 and the second sub-reference line RL2.
第五点P1-2设置在第一子基准线RL1上，第七点P3-2设置在第二子基准线RL2上。另外，第六点P2-2和第八点P4-2可以设置在同一位置处，第六点P2-2和第八点P4-2可以设置在基准线RL处。第六点P2-2和第八点P4-2可以设置在基准线RL外部，或者可以设置在第一子基准线RL1和第二子基准线RL2之间。The fifth point P1-2 is set on the first sub-reference line RL1, and the seventh point P3-2 is set on the second sub-reference line RL2. In addition, the sixth point P2-2 and the eighth point P4-2 may be set at the same position, and the sixth point P2-2 and the eighth point P4-2 may be set at the reference line RL. The sixth point P2-2 and the eighth point P4-2 may be disposed outside the reference line RL, or may be disposed between the first sub-reference line RL1 and the second sub-reference line RL2.
参照图23，可以不在第一焊盘组PG1和第三焊盘组PG3之间设置基准焊盘。可以在第一焊盘组PG1和第三焊盘组PG3之间仅定义基准线RL。除了基准焊盘之外，图23中示出的第一电子组件的焊盘区域可以与图17A和图17B中示出的第一电子组件的焊盘区域基本相同。Referring to FIG. 23 , a reference pad may not be provided between the first pad group PG1 and the third pad group PG3 . Only the reference line RL may be defined between the first pad group PG1 and the third pad group PG3. The pad area of the first electronic component shown in FIG. 23 may be substantially the same as that of the first electronic component shown in FIGS. 17A and 17B except for the reference pad.
图24A是根据实施例的第二电子组件的侧视图。图24B是根据实施例的第二电子组件的第一平面图。图24C是根据实施例的第二电子组件的第二平面图。图25A是根据实施例沿着图24B和图24C的第一截线CL1截取的剖视图。图25B是根据实施例沿着图24B和图24C的第二截线CL2截取的剖视图。24A is a side view of a second electronic assembly according to an embodiment. 24B is a first plan view of a second electronic assembly according to an embodiment. 24C is a second plan view of a second electronic assembly according to an embodiment. 25A is a cross-sectional view taken along the first section line CL1 of FIGS. 24B and 24C according to an embodiment. 25B is a cross-sectional view taken along the second section line CL2 of FIGS. 24B and 24C according to an embodiment.
图24B是示出第二电子组件120的结合表面CS的平面图，图24C是示出第二电子组件120的非结合表面NCS的平面图。在图24B和图24C中，为了描述布线SL-121、SL-122、SL-123和SL-124而省略了阻焊层。在下文中，将参照图24A至图24C来描述根据本实施例的第二电子组件。24B is a plan view showing the bonding surface CS of the second electronic component 120 , and FIG. 24C is a plan view showing the non-bonding surface NCS of the second electronic component 120 . In FIGS. 24B and 24C , the solder resist layer is omitted for describing the wirings SL- 121 , SL- 122 , SL- 123 , and SL- 124 . Hereinafter, a second electronic component according to the present embodiment will be described with reference to FIGS. 24A to 24C .
第二电子组件120包括柔性布线基底122和数据驱动电路125。数据驱动电路125可以包括至少一个驱动芯片。数据驱动电路125电连接到柔性布线基底122的布线。在本实施例中，第二电子组件120具有膜上芯片结构，但实施例不限于此。根据实施例，可以省略数据驱动电路125。另外，没有示出柔性布线基底122上的对齐标记。The second electronic assembly 120 includes a flexible wiring substrate 122 and a data driving circuit 125 . The data driving circuit 125 may include at least one driving chip. The data driving circuit 125 is electrically connected to the wiring of the flexible wiring substrate 122 . In this embodiment, the second electronic component 120 has a chip-on-film structure, but the embodiment is not limited thereto. According to an embodiment, the data driving circuit 125 may be omitted. In addition, alignment marks on the flexible wiring substrate 122 are not shown.
柔性布线基底122包括至少一个绝缘层120-IL、多个焊盘CPD、IPD-120和OPD-120、以及多条布线SL-121、SL-122、SL-123和SL-124。多个焊盘CPD、IPD-120和OPD-120以及多条布线SL-121、SL-122、SL-123和SL-124布置在绝缘层120-IL上。The flexible wiring substrate 122 includes at least one insulating layer 120-IL, a plurality of pads CPD, IPD-120, and OPD-120, and a plurality of wirings SL-121, SL-122, SL-123, and SL-124. A plurality of pads CPD, IPD-120 and OPD-120 and a plurality of wirings SL-121, SL-122, SL-123 and SL-124 are arranged on the insulating layer 120-IL.
多个焊盘CPD、IPD-120和OPD-120可以包括连接到数据驱动电路125的连接端子的连接焊盘CPD、连接到第三电子组件130(见图1)的输入焊盘IPD-120以及连接到显示面板110(见图1)的输出焊盘OPD-120。在平面上，输入焊盘IPD-120可以限定为设置在柔性布线基底122的一侧处的输入焊盘区域IPP1-120和IPP2-120，输出焊盘OPD-120可以限定为设置在柔性布线基底122的另一侧处的输出焊盘区域OPP1-120和OPP2-120。The plurality of pads CPD, IPD-120, and OPD-120 may include a connection pad CPD connected to a connection terminal of the data driving circuit 125, an input pad IPD-120 connected to a third electronic component 130 (see FIG. 1 ), and Connect to the output pad OPD-120 of the display panel 110 (see FIG. 1 ). On a plane, the input pads IPD-120 may be defined as input pad regions IPP1-120 and IPP2-120 disposed at one side of the flexible wiring substrate 122, and the output pads OPD-120 may be defined as disposed at one side of the flexible wiring substrate 122. Output pad areas OPP1-120 and OPP2-120 at the other side of 122.
输入焊盘区域IPP1-120和IPP2-120包括第一输入焊盘区域IPP1-120和第二输入焊盘区域IPP2-120。第一输入焊盘区域IPP1-120和第二输入焊盘区域IPP2-120均包括一个焊盘行。焊盘行包括沿第一方向轴A1布置的多个输入焊盘IPD-120。The input pad areas IPP1-120 and IPP2-120 include a first input pad area IPP1-120 and a second input pad area IPP2-120. Each of the first input pad area IPP1-120 and the second input pad area IPP2-120 includes one pad row. The pad row includes a plurality of input pads IPD- 120 arranged along the first direction axis A1.
输出焊盘区域OPP1-120和OPP2-120包括第一输出焊盘区域OPP1-120和第二输出焊盘区域OPP2-120。第一输出焊盘区域OPP1-120和第二输出焊盘区域OPP2-120均包括一个焊盘行。焊盘行包括沿第一方向轴A1布置的多个输出焊盘OPD-120。The output pad areas OPP1-120 and OPP2-120 include a first output pad area OPP1-120 and a second output pad area OPP2-120. Each of the first output pad area OPP1-120 and the second output pad area OPP2-120 includes one pad row. The pad row includes a plurality of output pads OPD-120 arranged along the first direction axis A1.
输入焊盘区域IPP1-120和IPP2-120的输入焊盘IPD-120与第三电子组件130的输出焊盘区域(未示出)对应地布置。第三电子组件130的输出焊盘区域可以具有图16A至图23中示出的布置。因此，输入焊盘区域IPP1-120和IPP2-120的输入焊盘IPD-120可以具有图16A至图23中示出的布置。The input pads IPD-120 of the input pad regions IPP1-120 and IPP2-120 are arranged corresponding to output pad regions (not shown) of the third electronic component 130 . The output pad area of the third electronic component 130 may have the arrangement shown in FIGS. 16A to 23 . Accordingly, the input pads IPD-120 of the input pad regions IPP1-120 and IPP2-120 may have the arrangements shown in FIGS. 16A to 23 .
输出焊盘区域OPP1-120和OPP2-120的输出焊盘OPD-120与输入焊盘IPD-110的布置对应地布置。因此，输出焊盘区域OPP1-120和OPP2-120的输出焊盘OPD-120可以具有图16A至图23中示出的布置。The output pads OPD-120 of the output pad regions OPP1-120 and OPP2-120 are arranged corresponding to the arrangement of the input pads IPD-110. Accordingly, the output pads OPD-120 of the output pad regions OPP1-120 and OPP2-120 may have the arrangements shown in FIGS. 16A to 23 .
如图24A至图25B中所示，多个焊盘CPD、IPD-120和OPD-120设置在绝缘层120-IL的一侧上。多条布线SL-121、SL-122、SL-123和SL-124中的一些布线和其他一些布线设置在不同的层上。多条布线SL-121、SL-122、SL-123和SL-124中的一些布线设置在绝缘层120-IL的一侧上，其他一些布线设置在绝缘层120-IL的另一侧上。As shown in FIGS. 24A to 25B , a plurality of pads CPD, IPD-120, and OPD-120 are disposed on one side of the insulating layer 120-IL. Some of the plurality of wirings SL-121, SL-122, SL-123, and SL-124 and some of the other wirings are provided on different layers. Some of the plurality of wirings SL-121, SL-122, SL-123, and SL-124 are provided on one side of the insulating layer 120-IL, and others are provided on the other side of the insulating layer 120-IL.
多条布线SL-121、SL-122、SL-123和SL-124包括第一布线SL-121、第二布线SL-122、第三布线SL-123和第四布线SL-124。第二输出焊盘区域OPP2-120的输出焊盘OPD-120通过第一布线SL-121电连接到连接焊盘CPD中对应的焊盘，第二输入焊盘区域IPP2-120的输入焊盘IPD-120通过第一布线SL-121电连接到连接焊盘CPD中对应的焊盘。在本实施例中，连接焊盘CPD被布置为与数据驱动电路125的两侧叠置，但是与图24B不同，连接焊盘CPD可以与数据驱动电路125的连接端子对应地随机布置。The plurality of wirings SL-121, SL-122, SL-123, and SL-124 include a first wiring SL-121, a second wiring SL-122, a third wiring SL-123, and a fourth wiring SL-124. The output pad OPD-120 of the second output pad area OPP2-120 is electrically connected to the corresponding pad in the connection pad CPD through the first wiring SL-121, and the input pad IPD of the second input pad area IPP2-120 -120 is electrically connected to corresponding ones of the connection pads CPD through the first wiring SL-121. In this embodiment, the connection pads CPD are arranged to overlap both sides of the data driving circuit 125 , but unlike FIG. 24B , the connection pads CPD may be randomly arranged corresponding to the connection terminals of the data driving circuit 125 .
第一输出焊盘区域OPP1-120的输出焊盘OPD-120经由第二布线SL-122、第三布线SL-123和第四布线SL-124而电连接到连接焊盘CPD中对应的焊盘。第一输入焊盘区域IPP1-120的输入焊盘IPD-120经由第二布线SL-122、第三布线SL-123和第四布线SL-124而电连接到连接焊盘CPD中对应的焊盘。The output pads OPD-120 of the first output pad region OPP1-120 are electrically connected to corresponding ones of the connection pads CPD via the second wiring SL-122, the third wiring SL-123, and the fourth wiring SL-124. . The input pads IPD-120 of the first input pad region IPP1-120 are electrically connected to corresponding ones of the connection pads CPD via the second wiring SL-122, the third wiring SL-123, and the fourth wiring SL-124. .
第二布线SL-122连接到连接焊盘CPD中对应的焊盘。第三布线SL-123连接到第一输出焊盘区域OPP1-120的输出焊盘OPD-120。第四布线SL-124均连接到第二布线SL-122和第三布线SL-123。The second wiring SL-122 is connected to corresponding ones of the connection pads CPD. The third wiring SL-123 is connected to the output pad OPD-120 of the first output pad region OPP1-120. The fourth wiring SL-124 is each connected to the second wiring SL-122 and the third wiring SL-123.
第四布线SL-124和第二布线SL-122经由穿过绝缘层120-IL的第一通孔CH1而彼此连接，第四布线SL-124和第三布线SL-123经由穿过绝缘层120-IL的第二通孔CH2而彼此连接。The fourth wiring SL-124 and the second wiring SL-122 are connected to each other via the first through hole CH1 passing through the insulating layer 120-IL, and the fourth wiring SL-124 and the third wiring SL-123 are connected to each other via the first through hole CH1 passing through the insulating layer 120-IL. -IL's second through hole CH2 and connected to each other.
柔性布线基底122可以设置在绝缘层120-IL的一侧上，并且还可以包括至少覆盖第一布线SL-121、第二布线SL-122和第三布线SL-123的第一阻焊层120-SR1。可以从第一阻焊层120-SR1暴露至少连接焊盘CPD、输入焊盘IPD-120和输出焊盘OPD-120。另外，柔性布线基底122可以设置在绝缘层120-IL的另一侧上，并且还可以包括至少覆盖第四布线SL-124的第二阻焊层120-SR2。The flexible wiring substrate 122 may be provided on one side of the insulating layer 120-IL, and may further include a first solder resist layer 120 covering at least the first wiring SL-121, the second wiring SL-122, and the third wiring SL-123. -SR1. At least the connection pad CPD, the input pad IPD-120, and the output pad OPD-120 may be exposed from the first solder resist layer 120-SR1. In addition, the flexible wiring substrate 122 may be disposed on the other side of the insulating layer 120-IL, and may further include a second solder resist layer 120-SR2 covering at least the fourth wiring SL-124.
图26A至图26E是图24B和图24C中示出的布线的局部放大视图。将省略对参照图24A至图25B描述的重叠构造的详细描述。26A to 26E are partially enlarged views of the wirings shown in FIGS. 24B and 24C . A detailed description of the overlapping configuration described with reference to FIGS. 24A to 25B will be omitted.
图26A示出一条第二布线SL-122的与第一通孔CH1叠置的被放大的部分。如图26A中所示，第二布线SL-122可以包括连接盘部分LP和布线部分SP。FIG. 26A shows an enlarged portion of one second wiring SL-122 overlapping with the first through hole CH1. As shown in FIG. 26A , the second wiring SL-122 may include a land portion LP and a wiring portion SP.
连接盘部分LP与第一通孔CH1叠置，并具有宽度W1随着逐渐接近布线部分SP而减小的形式。虽然图26A中示例性示出了圆形的连接盘部分LP，但实施例不限于此，连接盘部分LP的形式可以改变。The land portion LP overlaps the first through hole CH1 and has a form in which the width W1 decreases as it approaches the wiring portion SP. Although a circular land portion LP is exemplarily shown in FIG. 26A , the embodiment is not limited thereto, and the form of the land portion LP may be changed.
布线部分SP连接连接盘部分LP和对应的连接焊盘CPD。连接盘部分LP具有可变化的第一宽度W1，布线部分SP具有小于或等于连接盘部分LP的最小宽度W1的第二宽度W2。在与布线部分SP的延伸方向相垂直的方向上测量第一宽度W1和第二宽度W2。The wiring portion SP connects the land portion LP and the corresponding connection pad CPD. The land portion LP has a variable first width W1, and the wiring portion SP has a second width W2 less than or equal to the minimum width W1 of the land portion LP. The first width W1 and the second width W2 are measured in a direction perpendicular to the extending direction of the wiring portion SP.
随着连接盘部分LP越接近布线部分SP，宽度W1减小，使得当柔性布线基底122弯曲时，作用于连接盘部分LP和布线部分SP的边界的应力减小。原因是：作用于连接盘部分LP和布线部分SP的边界的应力被连接盘部分LP所分散。因此，当柔性布线基底122弯曲时，可以防止在第二布线SL-122中出现裂纹。As the land portion LP gets closer to the wiring portion SP, the width W1 decreases so that when the flexible wiring substrate 122 is bent, the stress acting on the boundary of the land portion LP and the wiring portion SP decreases. The reason is that the stress acting on the boundary of the land portion LP and the wiring portion SP is dispersed by the land portion LP. Therefore, when the flexible wiring substrate 122 is bent, cracks can be prevented from occurring in the second wiring SL-122.
虽然图中没有单独示出，但是第四布线SL-124可以包括第一连接盘部分和第二连接盘部分，其中，第一连接盘部分设置在与第二通孔CH2叠置的部分处并且宽度随着越接近于布线区域而减小，第二连接盘部分设置在与第一通孔CH1叠置的部分处并且宽度随着越接近于布线区域而减小。Although not shown separately in the figure, the fourth wiring SL-124 may include a first land portion and a second land portion, wherein the first land portion is provided at a portion overlapping with the second through hole CH2 and The width decreases as it gets closer to the wiring region, the second land portion is provided at a portion overlapping the first through hole CH1 and the width decreases as it gets closer to the wiring region.
图26B示出一条第三布线SL-123的与第二通孔CH2叠置的被放大的部分。如图26B中所示，第三布线SL-123可以包括连接盘部分LP以及布线部分SP1和SP2。FIG. 26B shows an enlarged portion of one third wiring SL-123 overlapping with the second through hole CH2. As shown in FIG. 26B , the third wiring SL- 123 may include a land portion LP and wiring portions SP1 and SP2 .
连接盘部分LP与第二通孔CH2叠置并具有宽度W1随着逐渐越接近于布线部分SP而减小的形式。虽然图26B中示例性示出圆形的连接盘部分LP，但实施例不限于此，连接盘部分LP的形式可以改变。The land portion LP overlaps the second through hole CH2 and has a form in which the width W1 decreases as it gets closer to the wiring portion SP. Although a circular land portion LP is exemplarily shown in FIG. 26B , the embodiment is not limited thereto, and the form of the land portion LP may be changed.
布线部分SP1和SP2包括第一布线部分SP1和第二布线部分SP2。第一布线部分SP1连接与第二通孔CH2叠置的连接盘部分LP和第一输出焊盘区域OPP1-120的输出焊盘OPD-120。第二布线部分SP2连接到与第二通孔CH2叠置的连接盘部分LP。虽然图中没有示出，但是可以通过第二布线部分SP2来测试第二布线SL-122、第三布线SL-123和第四布线SL-124的连接可靠性。The wiring portions SP1 and SP2 include a first wiring portion SP1 and a second wiring portion SP2. The first wiring part SP1 connects the land part LP overlapping with the second through hole CH2 and the output pad OPD-120 of the first output pad region OPP1-120. The second wiring part SP2 is connected to the land part LP overlapping the second through hole CH2. Although not shown in the figure, the connection reliability of the second wiring SL-122, the third wiring SL-123, and the fourth wiring SL-124 may be tested through the second wiring portion SP2.
图26C至图26E是第三布线SL-123的放大视图。如图26C至图26E中所示，第三布线SL-123与延伸方向垂直地布置。第二通孔CH2可以相对于第一方向轴A1倾斜地布置。因此，第三布线SL-123的连接盘部分LP可以相对于第一方向轴A1倾斜地布置。因此，大量的第三布线SL-123可以沿第一方向轴A1布置在狭窄的范围内。26C to 26E are enlarged views of the third wiring SL-123. As shown in FIGS. 26C to 26E , the third wiring SL- 123 is arranged perpendicular to the extending direction. The second through hole CH2 may be obliquely arranged with respect to the first direction axis A1. Therefore, the land portion LP of the third wiring SL- 123 may be arranged obliquely with respect to the first direction axis A1. Therefore, a large number of third wirings SL- 123 can be arranged within a narrow range along the first direction axis A1.
如图26C至图26E中所示，连接盘部分LP的形式可以改变。虽然图中没有单独示出，但是第二布线SL-122也可以如图26C至图26E中所示地布置。As shown in FIGS. 26C to 26E , the form of the land portion LP may be changed. Although not separately shown in the drawings, the second wiring SL- 122 may also be arranged as shown in FIGS. 26C to 26E .
图27A是根据实施例的第二电子组件的平面图。图27B是沿着图27A的第三截线截取的剖视图。图27A中没有示出布线。图27B中没有示出显示面板110的输入焊盘。将省略对参照图24A至图25B描述的重叠构造的详细描述。27A is a plan view of a second electronic assembly according to an embodiment. Fig. 27B is a cross-sectional view taken along the third section line of Fig. 27A. Wiring is not shown in Fig. 27A. The input pads of the display panel 110 are not shown in FIG. 27B. A detailed description of the overlapping configuration described with reference to FIGS. 24A to 25B will be omitted.
如图27A中所示，柔性布线基底122还可以包括设置在第一输出焊盘区域OPP1-120和第二输出焊盘区域OPP2-120之间的虚设焊盘DPD。在本实施例中，可以将第一输出焊盘区域OPP1-120和第二输出焊盘区域OPP2-120之间沿第二方向轴A2的区域定义为中间区域DPA。As shown in FIG. 27A, the flexible wiring substrate 122 may further include a dummy pad DPD disposed between the first output pad region OPP1-120 and the second output pad region OPP2-120. In this embodiment, an area along the second direction axis A2 between the first output pad area OPP1-120 and the second output pad area OPP2-120 may be defined as the middle area DPA.
虚设焊盘DPD可以沿第一方向轴A1布置。虚设焊盘DPD可以被布置为彼此分隔开预定间隔。虚设焊盘DPD与输出焊盘OPD-120分隔开。虚设焊盘DPD防止中间区域DPA在参照图13描述的接合工艺之后的剥离缺陷。The dummy pads DPD may be arranged along the first direction axis A1. The dummy pads DPD may be arranged to be separated from each other by a predetermined interval. The dummy pad DPD is separated from the output pad OPD-120. The dummy pad DPD prevents the peeling defect of the middle area DPA after the bonding process described with reference to FIG. 13 .
如图27B中所示，虚设焊盘DPD与输出焊盘OPD-120设置在同一层上，即，设置在绝缘层120-IL的一侧上。虚设焊盘DPD接合到导电粘附膜140。As shown in FIG. 27B , the dummy pad DPD is disposed on the same layer as the output pad OPD- 120 , that is, disposed on one side of the insulating layer 120 -IL. The dummy pad DPD is bonded to the conductive adhesive film 140 .
虚设焊盘DPD防止导电粘附膜140在中间区域DPA中接合到绝缘层120-IL的一侧。上面参照图13描述了在接合工艺期间使用工具的热压缩操作。当导电粘附膜140直接接合到绝缘层120-IL的一侧时，在热压缩操作之后，由于绝缘层120-IL恢复到热压缩之前的形式，因而会发生剥离缺陷。The dummy pad DPD prevents the conductive adhesive film 140 from being bonded to one side of the insulating layer 120-IL in the middle area DPA. The thermal compression operation using a tool during the bonding process is described above with reference to FIG. 13 . When the conductive adhesive film 140 is directly bonded to one side of the insulating layer 120-IL, after the thermocompression operation, since the insulating layer 120-IL returns to a form before thermocompression, a peeling defect may occur.
在导电粘附膜140和绝缘层120-IL之间或导电粘附膜140和显示面板110之间会发生剥离缺陷。由于虚设焊盘DPD在中间区域DPA中使导电粘附膜140和绝缘层120-IL的一侧之间保持间隔，因此可以防止剥离缺陷。A peeling defect may occur between the conductive adhesive film 140 and the insulating layer 120 -IL or between the conductive adhesive film 140 and the display panel 110 . Since the dummy pad DPD maintains a space between the conductive adhesive film 140 and one side of the insulating layer 120 -IL in the middle area DPA, peeling defects may be prevented.
图28A是根据实施例的第二电子组件的平面图。图28B是图28A的第一虚设焊盘的平面图。图28C是图28A的第二虚设焊盘的平面图。图28A中没有示出布线。将省略对参照图24A至图25B、图27A和图27B描述的重叠构造的详细描述。28A is a plan view of a second electronic assembly according to an embodiment. FIG. 28B is a plan view of the first dummy pad of FIG. 28A. FIG. 28C is a plan view of the second dummy pad of FIG. 28A. Wiring is not shown in Fig. 28A. A detailed description of the overlapping configuration described with reference to FIGS. 24A to 25B , 27A, and 27B will be omitted.
如图28A中所示，柔性布线基底122还可以包括至少一个第一虚设焊盘OPD-120D1和至少一个第二虚设焊盘OPD-120D2。可以省略第一虚设焊盘OPD-120D1和第二虚设焊盘OPD-120D2中的一者。可以不向第一虚设焊盘OPD-120D1和第二虚设焊盘OPD-120D2施加信号。就这一点而言，第一虚设焊盘OPD-120D1和第二虚设焊盘OPD-120D2可以不连接到布线。As shown in FIG. 28A, the flexible wiring substrate 122 may further include at least one first dummy pad OPD-120D1 and at least one second dummy pad OPD-120D2. One of the first dummy pad OPD-120D1 and the second dummy pad OPD-120D2 may be omitted. Signals may not be applied to the first dummy pad OPD-120D1 and the second dummy pad OPD-120D2. In this regard, the first dummy pad OPD-120D1 and the second dummy pad OPD-120D2 may not be connected to the wiring.
如图28A和图28B中所示，第一虚设焊盘OPD-120D1可以包括第一部分PP1、第二部分PP2以及连接第一部分PP1和第二部分PP2的第三部分DP。第一部分PP1和第二部分PP2均可以具有与相邻的两个输出焊盘OPD-120中的一个的节距相同的节距。As shown in FIGS. 28A and 28B , the first dummy pad OPD-120D1 may include a first part PP1 , a second part PP2 , and a third part DP connecting the first part PP1 and the second part PP2 . Each of the first portion PP1 and the second portion PP2 may have the same pitch as one of adjacent two output pads OPD- 120 .
第三部分DP可以根据与图27A和图27B中示出的虚设焊盘DPD相同的原理来防止在中间区域DPA中发生剥离缺陷。由于第三部分DP在中间区域DPA中使导电粘附膜140和绝缘层120-IL的一侧之间保持间隔，因此可以防止剥离缺陷。The third part DP may prevent the peeling defect from occurring in the middle area DPA according to the same principle as the dummy pad DPD shown in FIGS. 27A and 27B . Since the third portion DP maintains a space between the conductive adhesive film 140 and one side of the insulating layer 120 -IL in the middle area DPA, peeling defects may be prevented.
如图28A和图28C中所示，第二虚设焊盘OPD-120D2可以包括第一部分PP和连接到第一部分PP的第二部分DP。第一部分PP可以具有与相邻的两个输出焊盘OPD-120中的一个的节距相同的节距。As shown in FIGS. 28A and 28C , the second dummy pad OPD-120D2 may include a first part PP and a second part DP connected to the first part PP. The first part PP may have the same pitch as one of adjacent two output pads OPD-120.
第二部分DP可以根据与图27A和图27B中示出的虚设焊盘DPD相同的原理来防止在中间区域DPA中发生剥离缺陷。由于第二部分DP在中间区域DPA中使导电粘附膜140和绝缘层120-IL的一侧之间保持间隔，因此可以防止剥离缺陷。The second part DP may prevent the peeling defect from occurring in the middle area DPA according to the same principle as the dummy pad DPD shown in FIGS. 27A and 27B . Since the second part DP maintains a space between the conductive adhesive film 140 and one side of the insulating layer 120 -IL in the middle area DPA, peeling defects may be prevented.
作为总结和回顾，电子装置的两个电子组件的焊盘区域会因制造误差而具有与设计尺寸不同的尺寸。另外，两个电子组件因接合工艺产生的热经历膨胀或收缩。因此，会降低两个电子组件中的电连接的可靠性。As a summary and review, pad areas of two electronic components of an electronic device may have different dimensions from the designed dimensions due to manufacturing errors. In addition, two electronic components undergo expansion or contraction due to heat generated by the bonding process. Therefore, the reliability of the electrical connection in the two electronic components may be reduced.
因此，实施例提供一种具有校正了在制造工艺期间发生的焊盘区域的数值误差和在接合工艺期间发生的焊盘区域的数值误差的焊盘区域的电子组件。实施例还提供一种改善了电连接的可靠性的电子装置。实施例还提供一种改善了电连接的可靠性的电子装置的接合方法。Accordingly, embodiments provide an electronic component having a pad region corrected for a numerical error of the pad region occurring during a manufacturing process and a numerical error of the pad region occurring during a bonding process. Embodiments also provide an electronic device with improved reliability of electrical connection. Embodiments also provide a bonding method of an electronic device that improves reliability of electrical connection.
详细地，第一电子组件的焊盘区域和第二电子组件的焊盘区域均包括上面提到的一个焊盘行。第一焊盘和第二焊盘相对于第一方向轴形成不同的夹角，使得第一焊盘的延长线和第二焊盘的延长线基本上会聚于不同的位置。即使当第一电子组件的焊盘区域和/或第二电子组件的焊盘区域具有在制造工艺期间发生的数值误差时，也可以改善第一电子组件的焊盘区域和第二电子组件的焊盘区域之间的电连接可靠性。In detail, both the pad area of the first electronic component and the pad area of the second electronic component include the above-mentioned one pad row. The first pad and the second pad form different included angles with respect to the first direction axis, so that the extension lines of the first pad and the extension lines of the second pad basically converge at different positions. Even when the pad area of the first electronic component and/or the pad area of the second electronic component have numerical errors that occur during the manufacturing process, the soldering of the pad area of the first electronic component and the second electronic component can be improved. Electrical connection reliability between disk areas.
第二电子组件的结合到第一电子组件的焊盘的第一焊盘的第二焊盘可以具有不同的节距。即使当第二电子组件的焊盘区域在接合工艺期间发生数值误差时，也可以改善第一电子组件的焊盘区域和第二电子组件的焊盘区域之间的电连接可靠性。The second pads of the second electronic component coupled to the first pads of the pads of the first electronic component may have different pitches. Even when a numerical error occurs to the pad region of the second electronic component during the bonding process, electrical connection reliability between the pad region of the first electronic component and the pad region of the second electronic component may be improved.
第一电子组件的焊盘区域和第二电子组件的焊盘区域均可以包括多个焊盘行。因此，多个焊盘可以设置在狭窄的区域中。Each of the pad area of the first electronic component and the pad area of the second electronic component may include a plurality of pad rows. Therefore, a plurality of pads can be provided in a narrow area.
第二电子组件可以是柔性布线基底。柔性布线基底包括多条布线。多条布线中的一些布线包括连接盘部分和布线部分。随着连接盘部分逐渐地接近于布线部分，连接盘部分的宽度减小，使得当柔性布线基底弯曲时，作用于连接盘部分和布线部分的边界的应力减小。因此，当柔性布线基底122弯曲时，可以防止在布线中发生裂纹。The second electronic component may be a flexible wiring substrate. A flexible wiring substrate includes a plurality of wirings. Some of the plurality of wires include a land portion and a wire portion. As the land portion gets closer to the wiring portion, the width of the land portion decreases, so that when the flexible wiring substrate is bent, the stress acting on the boundary of the land portion and the wiring portion decreases. Therefore, when the flexible wiring substrate 122 is bent, cracks can be prevented from occurring in the wiring.
柔性布线基底还可以包括设置在焊盘行与焊盘行之间的虚设焊盘。虚设焊盘保持柔性布线基底的导电粘附膜和绝缘层之间的间隔。因此，可以防止导电粘附膜和绝缘层之间的剥离缺陷。The flexible wiring substrate may further include dummy pads disposed between pad rows. The dummy pad maintains a space between the conductive adhesive film and the insulating layer of the flexible wiring substrate. Therefore, peeling defects between the conductive adhesive film and the insulating layer can be prevented.
已经在此公开了示例实施例，虽然使用了特定术语，但是仅以普遍的和描述性的意义而非出于限制的目的来使用和解释它们。在一些示例中，如本领域普通技术人员在截止到本申请的提交时所明了的，除非另外明确指明，否则与描述具体实施例有关的特征、特性和/或元件可以单独地使用，或者与描述其他实施例有关的特征、特性和/或元件组合使用。因此，本领域技术人员将理解的是，在不脱离如权利要求书所阐述的本发明的精神和范围的情况下，可以做出形式上和细节上的各种变化。Example embodiments have been disclosed herein, and although specific terms are employed, they are used and interpreted in a generic and descriptive sense only and not for purposes of limitation. In some instances, as would be apparent to those of ordinary skill in the art as of the filing of this application, unless expressly stated otherwise, features, characteristics, and/or elements described in relation to a particular embodiment may be used on their own or in conjunction with Combinations of features, characteristics and/or elements are described in relation to other embodiments. Accordingly, it will be understood by those skilled in the art that various changes in form and details may be made without departing from the spirit and scope of the present invention as set forth in the claims.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910525427.6ACN110246822B (en) | 2014-04-10 | 2015-04-09 | electronic components |
| Application Number | Priority Date | Filing Date | Title |
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| KR20140043136 | 2014-04-10 | ||
| KR20140043134 | 2014-04-10 | ||
| KR10-2014-0043136 | 2014-04-10 | ||
| KR10-2014-0043134 | 2014-04-10 | ||
| KR1020140079080AKR102379591B1 (en) | 2014-04-10 | 2014-06-26 | Electronic component, electric device including the same and method of bonding thereof |
| KR10-2014-0079080 | 2014-06-26 | ||
| CN201910525427.6ACN110246822B (en) | 2014-04-10 | 2015-04-09 | electronic components |
| CN201510166065.8ACN104979316B (en) | 2014-04-10 | 2015-04-09 | electronic components |
| Application Number | Title | Priority Date | Filing Date |
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| CN201510166065.8ADivisionCN104979316B (en) | 2014-04-10 | 2015-04-09 | electronic components |
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| CN110246822Atrue CN110246822A (en) | 2019-09-17 |
| CN110246822B CN110246822B (en) | 2023-09-26 |
| Application Number | Title | Priority Date | Filing Date |
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| CN201910525427.6AActiveCN110246822B (en) | 2014-04-10 | 2015-04-09 | electronic components |
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| JP (2) | JP6699991B2 (en) |
| KR (1) | KR102379591B1 (en) |
| CN (1) | CN110246822B (en) |
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