CN110168135B

Movatterモバイル変換

Info

Publication number: CN110168135B
Application number: CN201780082884.1A
Authority: CN
Inventors: 尼尔·莫里森; 乔斯·曼纽尔·迭格斯-坎波; 海克·兰特格雷夫; 斯蒂芬·海因; 托比亚斯·斯托利
Original assignee: Applied Materials Inc
Current assignee: Applied Materials Inc
Priority date: 2017-01-12
Filing date: 2017-01-12
Publication date: 2021-12-31
Anticipated expiration: 2037-01-12
Also published as: WO2018130289A1; TWI702140B; CN110168135A; TW201945194A; TWI674192B; TW201838815A

Abstract

Translated fromChinese

描述一种适用于在触控屏幕面板中使用的硬涂层系统(100)。硬涂层系统(100)包括柔性基板(101)及设置于柔性基板(101)上的层堆叠物(110)。层堆叠物(110)包括粘附促进层(111)及无机硬涂顶层(113)，粘附促进层设置于柔性基板(101)上。粘附促进层(111)构造成以共价键结合于柔性基板的表面，其中粘附促进层(111)在与柔性基板(101)的界面(102)处的机械性质适用于柔性基板(101)的机械性质。

A hardcoat system (100) suitable for use in a touch screen panel is described. The hard coating system (100) includes a flexible substrate (101) and a layer stack (110) disposed on the flexible substrate (101). The layer stack (110) includes an adhesion promoting layer (111) and an inorganic hardcoat top layer (113), the adhesion promoting layer being disposed on the flexible substrate (101). The adhesion promoting layer (111) is configured to be covalently bonded to the surface of the flexible substrate, wherein the mechanical properties of the adhesion promoting layer (111) at the interface (102) with the flexible substrate (101) are suitable for the flexible substrate (101) ) of the mechanical properties.

Description

Hard coating system and method for producing a hard coating system in a continuous roll-to-roll process

Technical Field

Embodiments of the present disclosure relate to hard coating systems suitable for use in optoelectronic devices and methods of manufacturing such hard coating systems in a roll-to-roll process. In particular, embodiments of the present disclosure relate to hardcoat systems that include a stack of multiple layers deposited on a flexible substrate. More specifically, embodiments of the present disclosure relate to hardcoat systems made by continuous roll-to-roll vacuum deposition processes.

Background

In the packaging industry, semiconductor industry and other industries, the handling of flexible substrates such as plastic films or foils is highly desirable. Processing may consist of coating the flexible substrate with a desired material, such as metals, particularly aluminum, semiconductors, and dielectric materials, etching, and other processing activities performed on the substrate for the desired application. Systems for performing this task typically include a process drum, such as a cylindrical roller. The process drum is coupled to a processing system for transferring the substrate, and at least a portion of the substrate is processed on the process drum. Thus, a roll-to-roll (R2R) coating system can provide a high throughput system.

Processes such as Physical Vapor Deposition (PVD) processes, Chemical Vapor Deposition (CVD) processes, and Plasma Enhanced Chemical Vapor Deposition (PECVD) processes can typically be used to deposit thin layers of metal that can be coated onto flexible substrates. In particular, roll-to-roll deposition systems are experiencing a strong increase in demand in the display industry and the Photovoltaic (PV) industry.

Examples of products made from the coated flexible substrate are touch panels or Organic Light Emitting Diode (OLED) displays. In comparison to Liquid Crystal Displays (LCDs), touch panels or Organic Light Emitting Diode (OLED) displays have recently received significant attention in display applications due to faster response time, larger viewing angle, higher contrast ratio, lighter weight, lower power, and adaptability to flexible substrates (amenability).

Over the years, optoelectronic devices such as display devices or touch panels have evolved into multi-layer systems, where different layers have different functions. However, the quality of conventional multilayer systems still needs to be improved, such as scratch resistance (scratch resistance).

In view of the foregoing, there is a need to provide hard coating systems suitable for use in optoelectronic devices and methods of manufacturing these hard coating systems that overcome at least some of the problems in the prior art.

Disclosure of Invention

In view of the above, a hard coating system and a method for manufacturing a hard coating system according to the present disclosure are provided. Further aspects, advantages and features of the disclosure are apparent from the claims, the description and the drawings.

According to an aspect of the present disclosure, a hard coating system suitable for use in a touch screen panel is provided. The hard coating system includes a flexible substrate and a layer stack disposed on the flexible substrate. The layer stack includes an adhesion promoting layer disposed on the flexible substrate and an inorganic hard-coated top layer. The adhesion promoting layer is configured to be covalently bonded to a surface of the flexible substrate, wherein mechanical properties of the adhesion promoting layer at an interface with the flexible substrate are adapted to the mechanical properties of the flexible substrate.

According to another aspect of the present disclosure, a hard coating system suitable for use in a touch screen panel is provided. The hard coating system includes a flexible substrate selected from the group consisting of polycarbonate (polycarbonate), polyethylene terephthalate (polyethylene terephthalate), poly (methyl methacrylate), cellulose triacetate (triacetyl cellulose), cyclic olefin polymer (cyclo olefin polymer), poly (ethylene terephthalate). Further, the hardcoat system includes a layer stack disposed on the flexible substrate, where the layer stack includes an adhesion promoting layer and an inorganic hardcoat top layer, the adhesion promoting layer disposed on the flexible substrate. The adhesion promoting layer is configured to be covalently bonded to a surface of the flexible substrate, wherein the hardness of the adhesion promoting layer is configured to gradually increase from the flexible substrate to the inorganic hardcoat top layer. The inorganic hard coat top layer has a pencil hardness of from 2H to 9H. The adhesion-promoting layer and the inorganic hard-coat top layer are deposited by a roll-to-roll PECVD process using one and the same precursor.

According to yet another aspect of the present disclosure, there is provided a photovoltaic device having a hard coating system according to any embodiment described herein.

According to yet another aspect of the present disclosure, a method for manufacturing a hard coating system in a continuous roll-to-roll process is provided. The method includes providing a flexible substrate to at least one first processing region and at least one second processing region without breaking vacuum; depositing an adhesion promoting layer on the flexible substrate in the at least one first processing region; and depositing an inorganic hardcoat top layer in the at least one second treated region, wherein depositing the adhesion promoting layer comprises forming covalent bonds between the flexible substrate and the adhesion promoting layer. Further, depositing the adhesion promoting layer includes adapting the mechanical properties of the adhesion promoting layer to the mechanical properties of the flexible substrate.

Embodiments are also directed to apparatus for performing the disclosed methods and include apparatus portions for performing various described method aspects. These method aspects may be performed by hardware components, a computer programmed with appropriate software, any combination of the two, or in any other manner. Further, embodiments according to the present disclosure also relate to methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for performing the functions of the apparatus.

Drawings

So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The drawings relate to various embodiments of the disclosure and are described below:

FIGS. 1 and 2 show schematic views of a hard coating system according to embodiments described herein;

FIG. 3 shows a schematic view of a hard coating system according to other embodiments described herein;

FIGS. 4-6 show schematic views of a hard coating system according to yet another embodiment described herein;

FIG. 7 shows a schematic view of a processing system for manufacturing a hard coating system according to embodiments described herein;

FIG. 8 shows a schematic view of an optoelectronic device having a hard coating system according to embodiments described herein; and

fig. 9 shows a flow diagram illustrating a method for manufacturing a hard coating system in a continuous roll-to-roll process according to embodiments described herein.

Detailed Description

Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in each figure. The examples are provided by way of explanation and are not meant as limitations. For example, features illustrated or described as part of one embodiment can be used on or in conjunction with any other embodiment to yield yet a further embodiment. It is intended that the present disclosure include such modifications and variations.

In the following description of the drawings, the same reference numerals indicate the same or similar components. In general, only the differences between the individual embodiments will be described. Descriptions of parts or aspects in one embodiment can also apply to corresponding parts or aspects in another embodiment, unless explicitly stated otherwise.

Before describing various embodiments of the present disclosure in more detail, certain aspects will be explained with respect to certain terms and expressions used herein.

In the present disclosure, a "hard coating system" is understood to be a multilayer stack in which at least the topmost layer comprises a hard coating. In particular, a "hard coating system" can be understood as a stack of layers comprising an inorganic hard coating top layer. More particularly, the hard coating can be characterized as having a pencil hardness of at least 2H. In this regard, it will be understood that the resistance to coating, i.e. the hardness of the coated layer, can be determined as the grade of the hardest pencil that does not permanently leave a mark when firmly pressed against the coated layer at an angle of 45 degrees. Typically, the pencil is pressed against the surface to be tested with a force of 7.5N. The pencil hardness test is also known as the "Wolff-Wilborn test".

In the present disclosure, a "layer stack" is understood to be a multilayer stack having at least two layers of different material compositions. In particular, the multilayer stack described herein can be transparent. The term "transparent" as used herein can in particular include structures having the ability to transmit light in a relatively low scattering manner, so that for example light transmitted therethrough can be seen substantially in a clear manner.

In the present disclosure, a "flexible substrate" may be characterized as a substrate that is bendable. For example, the flexible substrate may be a foil. In particular, it will be understood that the flexible substrates described herein may be processed in a continuous roll-to-roll process as described herein, such as in a roll-to-roll processing system as described herein. In particular, the flexible substrates described herein are suitable for use in the manufacture of coatings or electronic devices on flexible substrates. In particular, the flexible substrate described herein can be transparent, e.g., the flexible substrate can be made of a transparent polymeric material. More particularly, the flexible substrate described herein may comprise materials like the following: polyethylene terephthalate (PET), Polycarbonate (PC), Polyethylene (PE), Polyimide (PI), Polyurethane (PU), polymethyl methacrylate (poly (methacrylic acid) ester), cellulose triacetate (triacetyl cellulose), cellulose Triacetate (TAC), cyclic olefin polymer (cyclo olefin polymer), polyethylene terephthalate (poly (ethylene naphthalate)), one or more metals, paper, combinations thereof, and coated substrates such as: hard-coated PET (HC-PET) or TAC (HC-TAC), and the like.

In the present disclosure, an "adhesion promoting layer" is understood to be a layer disposed between two structures, such as a substrate and a layer therebetween or a layer between two layers, and configured to promote adhesion between the two structures. For example, the adhesion promoting layer APL can be configured to be covalently bonded to at least one of the two structures between which the adhesion promoting layer is disposed. Thus, the adhesion promoting layer APL can be configured to be covalently bonded to the flexible substrate described herein and/or to a subsequent layer deposited on the adhesion promoting layer APL. Further, the mechanical properties of the adhesion promoting layer can be adapted to the mechanical properties of the flexible substrates described herein. For example, the flexibility, e.g. the elastic modulus, of the adhesion promoting layer APL can be adapted to the mechanical properties of the flexible substrate. Accordingly, since the adhesion promoting layer APL may follow the deformation of the flexible substrate, the adhesion of the adhesion promoting layer APL to the substrate may be improved.

In the present disclosure, "hard-coated top layer" is understood to be the topmost layer of a multilayer stack. In particular, the hard coat top layer can be characterized as having a pencil hardness of at least 2H.

FIG. 1 shows a schematic view of a hard coating system according to embodiments described herein. According to various embodiments, which can be combined with any other embodiment described herein, the hard coating system is suitable for use in a touch screen panel. In particular, the hard coating system includes aflexible substrate 101 and alayer stack 110 disposed on theflexible substrate 101. For example, theflexible substrate 101 may include a polymer material selected from the group consisting of polycarbonate (polycarbonate), polyethylene terephthalate (polyethylene terephthalate), polymethyl methacrylate (poly (methacrylic acid methyl ester)), cellulose triacetate (triacetyl cellulose), cyclo olefin polymer (cyclo olefin polymer), and poly (ethylene terephthalate). As exemplarily shown in fig. 1, thelayer stack 110 comprises anadhesion promoting layer 111 and an inorganic hard coattop layer 113, theadhesion promoting layer 111 being disposed on theflexible substrate 101. Theadhesion promoting layer 111 is configured to be covalently bonded to a surface of the flexible substrate. Further, the mechanical properties of theadhesion promoting layer 111 at theinterface 102 with theflexible substrate 101 are adapted to the mechanical properties of theflexible substrate 101. For example, the flexibility, such as the elastic modulus, of the adhesion promoting layer APL may be adapted to the mechanical properties of the flexible substrate.

Accordingly, various embodiments described herein provide improved hard coating systems. In particular, the hard coating systems described herein have improved structural stability and integrity (integration) compared to conventional hard coating systems. Thus, by employing various embodiments of the hard coating system as described herein in an optoelectronic device, such as a display device or touch panel, structural stability and scratch resistance may be improved such that improved product durability of the optoelectronic device may be achieved.

With exemplary reference to FIG. 2, according to various embodiments, which can be combined with any of the other embodiments described herein, theadhesion promoting layer 111 can have a T of 100nm ≦ T_APLThickness T less than or equal to 800nm_APL。

For example, the thickness T of theadhesion promoting layer 111_APLMay be selected from a range having a lower limit and an upper limit. The lower limit is 100nm, in particular 200nm, more in particular 300nm, and the upper limit is 600nm, in particular 700nm, more in particular 800 nm. Thus, by providing a film having a thickness T as described herein_APLThe hardness layer system of the adhesion promoting layer of (2), the stability of the entire hard coating system can be improved.

Further, referring exemplarily to fig. 2, according to various embodiments, which can be combined with any other embodiments described herein, the inorganichardcoat top layer 113 has a thickness T_HTLCan be 100nm or less T_HTLLess than or equal to 1 mu m. For example, the thickness T of the inorganic hardcoat top layer_HTLMay be selected from a range having a lower limit and an upper limit. The lower limit is 100nm, in particular 200nm, more in particular 300nm, and the upper limit is 600nm, in particular 800nm, more in particular 1 μm. Thus, by providing a film having a thickness T as described herein_HTLThe hard coating system of the inorganic hard coating top layerThe overall hard coating system stability can be improved, in particular the scratch resistance can be improved.

According to various embodiments, which can be combined with any of the other embodiments described herein, theadhesion promoting layer 111 comprises silicon oxycarbide SiO_xC_y. In particular, theadhesion promoting layer 111 may be formed of silicon oxycarbide SiO_xC_yAnd (4) forming. Thus, by employing an adhesion promoting layer having the material composition described herein, the adhesion promoting layer is configured to covalently bond to the surface of the flexible substrate described herein, which facilitates improved structural stability of the hardcoat system.

According to various embodiments, which can be combined with any of the other embodiments described herein, the inorganic hard coattop layer 113 comprises silicon oxide SiO_x. In particular, the inorganic hard coattop layer 113 can be made of silicon oxide SiO_xAnd (4) forming. Alternatively, the inorganic hard coatingtop layer 113 may comprise silicon carbide SiC, in particular the inorganic hard coatingtop layer 113 can consist of silicon carbide SiC.

According to various embodiments that can be combined with any of the other embodiments described herein, the inorganic hard coat top layer has a pencil hardness of from 2H to 9H. For example, the pencil hardness of the inorganic hard coat layer can be 2H, 3H, 4H, 5H, 6H, 7H, 8H, or 9H. The pencil hardness of the inorganic hard coat top layer can be measured using the pencil hardness test, also known as the Wolff-Wilborn test. In particular, the hardness of the hard coat top layer can be determined as the grade of the hardest pencil that does not permanently leave a mark on the hard coat top layer when firmly pressed against the hard coat top layer at an angle of 45 degrees. Typically, the pencil is pressed against the surface to be tested, e.g. the surface of the inorganic hard-coated top layer, with a force of 7.5N.

Referring to fig. 4 and 5 for example, according to various embodiments that may be combined with any of the other embodiments described herein, thelayer stack 110 may further include ananti-reflective layer stack 120 disposed between the adhesion-promotinglayer 111 and the inorganic hard-coatedtop layer 113. For example, as exemplarily shown in fig. 4, theanti-reflective layer stack 120 may include SiO disposed on the adhesion-promotinglayer 111_xFirst layer 121, NbO disposed on thefirst layer 121_xSecond layer 122 and SiO disposed onsecond layer 122_xAnd athird layer 123. Further, as exemplarily shown in fig. 5, theanti-reflective layer stack 120 may include afourth layer 124 of ITO (indium tin oxide) disposed on thethird layer 123.

For example, thefirst layer 121 can have a T ≦ 5nm₁Thickness T less than or equal to 10nm₁. For example, the thickness T of thefirst layer 121₁Can be selected from a range having a lower limit and an upper limit. The lower limit is 5nm, in particular 6nm, more in particular 7nm, and the upper limit is 8nm, in particular 9nm, more in particular 10 nm.

Thesecond layer 122 may have a T of 5nm ≦ T₂Thickness T less than or equal to 10nm₂. For example, the thickness T of thesecond layer 122₂Can be selected from a range having a lower limit and an upper limit. The lower limit is 5nm, in particular 6nm, more in particular 7nm, and the upper limit is 8nm, in particular 9nm, more in particular 10 nm.

Thethird layer 123 can have a T of 40nm ≦ T₃Thickness T less than or equal to 80nm₃. For example, the thickness T of thethird layer 123₃Can be selected from a range having a lower limit and an upper limit. The lower limit is 40nm, in particular 45nm, more in particular 50nm, and the upper limit is 60nm, in particular 70nm, more in particular 80 nm.

Thefourth layer 124 can have a T of 20nm ≦ T₄Thickness T less than or equal to 60nm₄. For example, the thickness T of thefourth layer 124₄Can be selected from a range having a lower limit and an upper limit. The lower limit is 20nm, particularly 25nm, more particularly 30nm, and the upper limit is 40nm, particularly 50nm, more particularly 60 nm.

Providing a hard coat system with ananti-reflective layer stack 120 as described herein can be advantageous for enhancing the optical performance of the hard coat system compared to conventional layer structures, particularly for use in optoelectronic devices such as OLED displays. For example, the layer stacks described herein may be advantageous for achieving a hard coating system with anti-reflective properties.

Referring to fig. 6 exemplarily, according to some embodiments, which may be combined with other embodiments described herein, an additional adhesion-promotinglayer 112 may be disposed between theanti-reflective layer stack 120 and the inorganic hard coattop layer 113. For example, the thickness of the other adhesion-promotinglayer 112 can be selected from a range having a lower limit and an upper limit. The lower limit is 100nm, in particular 200nm, more in particular 300nm, and the upper limit is 600nm, in particular 700nm, more in particular 800 nm. Thus, by providing a hard coat system with an additional adhesion promoting layer having a thickness as described herein, overall hard coat system stability may be improved.

Further, according to some embodiments, which can be combined with other embodiments described herein, the otheradhesion promoting layer 112 can be configured to be covalently bonded to the topmost layer of theanti-reflective layer stack 120, such as to thethird layer 123 or thefourth layer 124. Further, the mechanical properties of the otheradhesion promoting layer 112 may be adapted to the mechanical properties of the topmost layer of theanti-reflective layer stack 120, e.g. the mechanical properties of thethird layer 123 or thefourth layer 124. For example, the flexibility, e.g., elastic modulus, of other adhesion promoting layers can be adapted to the mechanical properties of the topmost layer of theanti-reflective layer stack 120. Thus, the structural stability and integrity of the hard coating systems described herein may be improved more than conventional hard coating systems.

According to examples that may be combined with other embodiments described herein, ahard coating system 100 suitable for use in a touch screen panel includes aflexible substrate 101. Theflexible substrate 101 is selected from the group consisting of polycarbonate (polycarbonate), polyethylene terephthalate (polyethylene terephthalate), polymethyl methacrylate (poly (methacrylic acid methyl ester)), cellulose triacetate (triacetyl cellulose), cyclic olefin polymer (cyclo olefin polymer), and poly (ethylene terephthalate). Further, thehard coating system 100 comprises alayer stack 110 disposed on theflexible substrate 101, wherein thelayer stack 110 comprises anadhesion promoting layer 111 and an inorganic hard coatingtop layer 113, theadhesion promoting layer 111 being disposed on theflexible substrate 101. In particular, theadhesion promoting layer 111 is configured to be covalently bonded to the surface of the flexible substrate, wherein the hardness of theadhesion promoting layer 111 can be configured to gradually increase from the flexible substrate to the inorganichardcoat top layer 113. The inorganichard coat layer 113 can have a pencil hardness of from 2H to 9H. Generally, the adhesion-promotinglayer 111 and the inorganic hard coattop layer 113 are deposited by a roll-to-roll PECVD process using one and the same precursor.

Thus, in view of the embodiments of the hard coating system described herein, it will be appreciated that the hard coating system is well suited for being manufactured in a continuous roll-to-roll process, particularly in a continuous vacuum deposition roll-to-roll process.

By way of example, aprocessing system 300 for manufacturing a hard coating system according to embodiments described herein is shown in FIG. 7. In particular, fig. 7 illustrates a roll-to-roll processing system configured to perform a method for manufacturing a hard coating system in a continuous roll-to-roll process according to embodiments described herein.

As illustrated in fig. 7, theprocessing system 300 can include at least three chamber sections, such as afirst chamber section 302A, asecond chamber section 302B, and athird chamber section 302C. In thethird chamber section 302C, one ormore deposition sources 630 andoptional etch stations 430 can be provided as processing tools. Aflexible substrate 101, such as the flexible substrate described herein, is disposed on afirst roller 764, such as having a shaft. The flexible substrate is unwound from thefirst roller 764 as shown by the direction of substrate movement shown byarrow 108. Apartition wall 701 is provided to separate thefirst chamber section 302A and thesecond chamber section 302B. Thepartition wall 701 can be further provided with a gap gate (gap gates) 740 to allow theflexible substrate 101 to pass therethrough. Thevacuum flange 312 disposed between thesecond chamber section 302B and thethird chamber section 302C can be provided with apertures to receive at least some of the processing tools.

Theflexible substrate 101 moves through a deposition area disposed at thecoating drum 710 and a position corresponding to thedeposition source 630. During operation, thecoating drum 710 rotates about an axis such that theflexible substrate 101 moves in the direction ofarrow 108. According to some embodiments, theflexible substrate 101 is directed from thefirst roller 764 to thecoating drum 710 via one, two or more rollers and from thecoating drum 710 to the second roller 764', e.g. having an axis of rotation. Theflexible substrate 101 is wound on the second roller 764' after the coating drum process.

According to some embodiments, thedeposition source 630 can be configured to deposit the layers of the hard coating systems described herein. As an example, at least one deposition source can be adapted to deposit theadhesion promoting layer 111 and at least one deposition source can be adapted to deposit the inorganic hard coattop layer 113. Further, respective deposition sources may be provided, which are adapted for depositing thefirst layer 121, thesecond layer 122, thethird layer 123, thefourth layer 124 and the furtheradhesion promoting layer 112.

In some embodiments, thefirst chamber portion 302A is separated into an interleaf chamber portion unit 302A1 and a substratechamber portion unit 302A 2. For example, tucker roll 766/766' and tucker roll 305 can be provided as modular elements ofprocessing system 300. Theprocessing system 300 can further include apre-heat unit 394 to heat the flexible substrate. Further, apretreatment plasma source 392 may additionally or alternatively be provided to treat substrates with plasma prior to entering thethird chamber portion 302C. Thepretreatment plasma source 392 is, for example, an RF (radio frequency) plasma source.

According to yet another embodiment, which can be combined with other embodiments described herein, anoptical measurement unit 494 and/or one ormore ionization units 492 are also optionally provided. Theoptical measurement unit 494 is used to evaluate the results of the substrate processing and theionization unit 492 is used to adapt the charge on the substrate.

According to some embodiments, the deposition material may be selected according to the deposition process and subsequent application of the coated substrate. For example, the deposition material of the deposition source may be selected according to the respective materials of the adhesion-promotinglayer 111, the inorganic hard coattop layer 113, thefirst layer 121, thesecond layer 122, thethird layer 123, thefourth layer 124, and the other adhesion-promotinglayer 112 described herein.

Referring illustratively to fig. 8, in accordance with an aspect of the present disclosure, there is provided anoptoelectronic device 150 having ahard coating system 100 in accordance with any embodiment described herein. Thus, it will be appreciated that the hard coating system described herein can be advantageously used in optical applications, such as the protection of OLEDs.

Exemplary referring to fig. 9, an embodiment of amethod 200 for manufacturing a hard coating system in a continuous roll-to-roll process is described. According to various embodiments, which can be combined with any of the other embodiments described herein, themethod 200 includes providing (see block 210) a flexible substrate to at least one first processing region and at least one second processing region without breaking vacuum. Further, the method includes depositing (see block 220) an adhesion-promoting layer on the flexible substrate in at least one first processing region, and depositing (see block 230) an inorganic hardcoat top layer in at least one second processing region.

In particular, depositing the adhesion promoting layer may include forming covalent bonds between the flexible substrate and the adhesion promoting layer. Further, depositing the adhesion promoting layer may include adapting the mechanical properties of the adhesion promoting layer to the mechanical properties of the flexible substrate. For example, the flexibility, e.g., elastic modulus, of the adhesion promoting layer may be adapted to the mechanical properties of the flexible substrate.

According to various embodiments of the method, which may be combined with any of the other embodiments described herein, depositing the adhesion promoting layer and depositing the inorganic hard coat top layer may comprise using a PECVD process and/or a HWCVD (Hot Wire Chemical Vapor Deposition) process. Further, depositing theanti-reflective layer stack 120 may also include utilizing a PECVD process and/or a HWCVD process. For example, the adhesion-promoting layer and/or inorganic hard coat top layer and/oranti-reflective layer stack 120 described herein may be deposited using a low temperature microwave PECVD process.

According to other embodiments of the method, which may be combined with any of the other embodiments described herein, depositing the adhesion promoting layer includes using at least one precursor selected from the group consisting of HMDSO Hexamethyldisiloxane (hexamethiodisiloxane); plasma polymerization of Hexamethyldisiloxane (plasmapolymer Hexamethyl disiloxane) by ppHMDSO; TOMCATS tetramethylcyclotetrasiloxane (C)₄H₁₆O₄Si₄) (ii) a HMDSN Hexamethyldisilazane (Hexamethyldisilazane) ([ (CH)₃)₃Si]₂NH) and TEOS Tetraethoxysilane (TEOS) and Si (OC)₂H₅)₄) The group consisting of.

Further, depositing an inorganic hardcoat top layer can also include utilizingAt least one precursor selected from the group consisting of HMDSO; ppHMDSO; TOMCATS tetramethylcyclotetrasiloxane (C)₄H₁₆O₄Si₄) (ii) a HMDSN Hexamethyldisilazane (Hexamethyldisilazane) ([ (CH)₃)₃Si]₂NH); and TEOS tetraethoxysilane (Si (OC))₂H₅)₄) The group consisting of. In particular, depositing the adhesion-promoting layer and depositing the inorganic hardness top layer may include using the same precursors.

In particular, depositing the adhesion promoting layer may further comprise using at least one agent selected from the group consisting of peroxides as initiator, in particular TBPO (tributylphosphine oxide tert-butyl peroxide); acrylate monomers, particularly ethylhexyl acrylate; and a crosslinking agent, particularly BDDA (butylene glycol diacrylate). Thus, by using at least one agent selected from the above-mentioned group, the adhesion ability of the adhesion promoting layer can be improved. Further, the use of at least one agent selected from the group may be beneficial in improving the structural stability of the hardcoat systems described herein.

In view of the foregoing, it will be appreciated that the various embodiments described herein provide improved hard coating systems and methods for manufacturing such improved hard coating systems, particularly for use in optoelectronic devices such as touch panels.

In conclusion, while the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

In particular, this description uses examples to disclose the disclosure, including the best mode, and also to enable any person skilled in the art to practice the subject matter, including making and using any devices or systems and performing any incorporated methods. Although the foregoing has disclosed various specific embodiments, features of the above-described embodiments that do not violate each other may be combined with each other. The patentable scope is defined by the claims, and other examples are intended to be included within the scope of the claims if the claims have structural elements that do not differ from the literal language of the claims, or if the claims include equivalent structural elements with insubstantial differences from the literal language of the claims.

Claims

1. A hard coating system (100) suitable for use in a touch screen panel, the hard coating system comprising:

a flexible substrate (101); and

a layer stack (110) disposed on the flexible substrate (101), wherein the layer stack (110) comprises an adhesion promoting layer (111) disposed on the flexible substrate (101), an anti-reflective layer stack (120) and an inorganic hard-coated top layer (113), wherein the anti-reflective layer stack (120) comprises NbO_xAnd silicon, and wherein the anti-reflective layer stack (120) is disposed between the adhesion promoting layer (111) and the inorganic hard coat top layer (113);

wherein the adhesion promoting layer (111) is configured to be covalently bonded to the surface of the flexible substrate, and wherein the mechanical properties of the adhesion promoting layer (111) at the interface (102) with the flexible substrate (101) are adapted to the mechanical properties of the flexible substrate (101).

2. The hard-coating system (100) according to claim 1, wherein the adhesion promoting layer (111) has a T of 100nm ≦ T_APLThickness T less than or equal to 800nm_APL。

3. The hard-coating system (100) according to claim 1 or 2, wherein the inorganic hard-coated top layer (113) has a thickness T_HTLT is more than or equal to 100nm_HTL≤1μm。

4. The hard-coating system (100) according to claim 1 or 2, wherein the adhesion promoting layer (111) comprises silicon oxycarbide, SiO_xC_y。

5. The hard-coating system (100) according to claim 1 or 2, wherein the adhesion promoting layer (110) is made of silicon oxycarbide SiO_xC_yAnd (4) forming.

6. The hard-coating system (100) according to claim 1 or 2, wherein the inorganic hard-coating top layer (113) comprises silicon oxide, SiO_xOr wherein the inorganic hard-coated top layer (113) comprises silicon carbide, SiC.

7. The hard-coating system (100) according to claim 1 or 2, wherein the inorganic hard-coating top layer (113) is made of silicon oxide, SiO_xOr wherein the inorganic hard-coated top layer (113) consists of silicon carbide, SiC.

8. The hard-coat system (100) according to claim 1 or 2, wherein the inorganic hard-coat top layer has a pencil hardness (pencilhardness) of from 2H to 9H.

9. The hard-coating system (100) as claimed in claim 1, wherein the anti-reflection layer stack (120) comprises SiO_xFirst layer (121), NbO_xSecond layer (122) of and SiO_xThe first layer (121) is disposed on the adhesion promoting layer (111), the second layer (122) is disposed on the first layer (121), and the third layer (123) is disposed on the second layer (122).

10. The hard-coating system (100) according to claim 9, wherein the anti-reflection layer stack (120) further comprises a fourth layer (124) of ITO, the fourth layer (124) being disposed on the third layer (123).

11. The hard-coat system (100) as claimed in claim 1, further comprising a further adhesion promoting layer (112), the further adhesion promoting layer (112) being located between the anti-reflection layer stack (120) and the inorganic hard-coat top layer (113).

12. The hard-coat system (100) as claimed in claim 9, further comprising a further adhesion promoting layer (112), the further adhesion promoting layer (112) being located between the anti-reflection layer stack (120) and the inorganic hard-coat top layer (113).

13. The hard-coat system (100) as claimed in claim 10, further comprising a further adhesion promoting layer (112), the further adhesion promoting layer (112) being located between the anti-reflection layer stack (120) and the inorganic hard-coat top layer (113).

14. A hard coating system (100) suitable for use in a touch screen panel, the hard coating system comprising:

a flexible substrate (101) selected from the group consisting of polycarbonate (polycarbonate), polyethylene terephthalate (polyethylene terephthalate), polymethyl methacrylate (poly (methacrylic acid methyl ester)), cellulose triacetate (triacetyl cellulose), cyclic olefin polymer (cyclo olefin polymer), and poly (ethylene terephthalate); and

a layer stack (110) disposed on the flexible substrate (101), wherein the layer stack (110) comprises an adhesion promoting layer (111), an anti-reflective layer stack (120) and an inorganic hard-coated top layer (113), the adhesion promoting layer (111) being disposed on the flexible substrate (101), wherein the anti-reflective layer stack (120) comprises NbO_xAnd silicon, and wherein the anti-reflective layer stack (120) is disposed between the adhesion promoting layer (111) and the inorganic hard coat top layer (113);

wherein the adhesion promoting layer (111) is configured to be covalently bonded to the surface of the flexible substrate, wherein the hardness of the adhesion promoting layer (111) is configured to gradually increase from the flexible substrate to the inorganic hard coat top layer (113), wherein the inorganic hard coat top layer (113) has a pencil hardness (pencil hardness) from 2H to 9H, and wherein the adhesion promoting layer (111) and the inorganic hard coat top layer (113) are deposited by a roll-up PECVD process using one and the same precursor.

15. An optoelectronic device (150) having a hard coating system (100) according to any one of claims 1 to 13.

16. A method (200) for manufacturing a hard coating system in a continuous roll-to-roll process, the method comprising:

providing (210) a flexible substrate to at least one first processing region and at least one second processing region without breaking vacuum;

depositing (220) an adhesion promoting layer on the flexible substrate in the at least one first treatment zone; and

depositing (230) an inorganic hard-coat top layer in the at least one second treatment zone;

wherein depositing (220) the adhesion promoting layer comprises forming covalent bonds between the flexible substrate and the adhesion promoting layer, and wherein depositing (220) the adhesion promoting layer further comprises adapting the mechanical properties of the adhesion promoting layer to the mechanical properties of the flexible substrate.

17. The method (200) of manufacturing a hard coating system according to claim 16, wherein depositing (220) the adhesion promoting layer and depositing (230) the inorganic hard coating top layer comprises utilizing a PECVD process and/or a HWCVD process.

18. The method (200) of manufacturing a hard-coating system according to claim 16 or 17, wherein depositing (220) the adhesion promoting layer further comprises using at least one precursor selected from the group consisting of HMDSO; ppHMDSO; TOMCATS tetramethylcyclotetrasiloxane (C)₄H₁₆O₄Si₄) (ii) a HMDSN hexamethyldisilazane ([ (CH)₃)₃Si]₂NH) and TEOS tetraethoxysilane (Si (OC)₂H₅)₄) And wherein depositing (220) the adhesion promoting layer further comprises using at least one reagent selected from the group consisting of a plurality of peroxides as a plurality of initiators; a plurality of acrylate monomers; and crosslinking agentsAnd (4) grouping.

19. The method (200) of making a hardcoat system of claim 18 wherein the plurality of peroxides as a plurality of initiators comprises TBPO (tributylphosphine oxide), wherein the plurality of acrylate monomers comprises ethylhexyl acrylate, and wherein the crosslinker comprises BDDA (butanediol diacrylate).