技术领域technical field
本申请涉及电子设备领域，尤其涉及一种电子设备及其控制方法。The present application relates to the field of electronic equipment, in particular to an electronic equipment and a control method thereof.
背景技术Background technique
随着现有的电子设备技术的发展，越来越多的电子设备走进人们的日常生活。随着手机、平板等电子设备的性能越来越高、功能越来越强，这些电子设备的发热问题也越来越严重。With the development of existing electronic device technology, more and more electronic devices have entered people's daily life. As the performance and functions of electronic devices such as mobile phones and tablets are getting higher and higher, the heating problem of these electronic devices is also becoming more and more serious.
传统的电子设备的散热方式主要通过在电子设备内部增加石墨或铜箔等导热性能良好的散热材料，热量通过散热材料迅速在发热点周围散开，并传递到电子设备外壳的金属部件，最终散发到电子设备外部，以使电子设备温度降低。The heat dissipation method of traditional electronic equipment is mainly by adding heat dissipation materials with good thermal conductivity such as graphite or copper foil inside the electronic equipment. to the outside of the electronic device to cool down the electronic device.
但是，设置散热材料的散热方式需要在散热的结构上避让一些器件，由于电子设备内部的电子元件较为密集，散热材料的面积和设置区域会受到较大的限制，电子设备的散热效果稍差。However, the heat dissipation method of setting the heat dissipation material needs to avoid some devices in the heat dissipation structure. Since the electronic components inside the electronic equipment are relatively dense, the area of the heat dissipation material and the installation area will be greatly restricted, and the heat dissipation effect of the electronic equipment is slightly poor.
发明内容Contents of the invention
有鉴于此，本申请提供一种电子设备及控制方法，用于解决上述问题。In view of this, the present application provides an electronic device and a control method for solving the above problems.
本申请实施例提供一种电子设备，包括壳体、温度传感器、控制器和振动组件，其中，壳体设有换热孔，换热孔连通壳体的内腔与外界。温度传感器设于壳体内，控制器电连接于温度传感器。振动组件包括驱动件和振动件，驱动件与控制器电连接，驱动件在控制器的控制下驱动振动件振动，以推动壳体内的气体自换热孔与外界进行交换。An embodiment of the present application provides an electronic device, including a casing, a temperature sensor, a controller, and a vibration component, wherein the casing is provided with a heat exchange hole, and the heat exchange hole communicates the inner cavity of the casing with the outside. The temperature sensor is arranged in the casing, and the controller is electrically connected to the temperature sensor. The vibrating assembly includes a driving part and a vibrating part, the driving part is electrically connected to the controller, and the driving part drives the vibrating part to vibrate under the control of the controller, so as to push the gas in the casing to exchange with the outside from the heat exchange holes.
在一些实施方式中，电子设备还包括卡托以及卡托锁紧件，壳体设有卡托孔，卡托的端部与卡托孔相嵌合，卡托锁紧件连接于卡托与壳体之间，且卡托锁紧件与换热孔相对间隔设置。In some embodiments, the electronic device further includes a card tray and a card tray locking member, the housing is provided with a card tray hole, the end of the card tray fits into the card tray hole, and the card tray locking member is connected to the card tray and the card tray. between the housings, and the card tray locking member is arranged at intervals relative to the heat exchange hole.
在一些实施方式中，壳体的内壁设有连通凹槽，连通凹槽位于卡托锁紧件与换热孔之间，并与换热孔连通。In some embodiments, the inner wall of the casing is provided with a communication groove, and the communication groove is located between the card holder locking member and the heat exchange hole, and communicates with the heat exchange hole.
在一些实施方式中，卡托包括承载部以及设置于承载部的端部的卡托帽，卡托帽与卡托孔相嵌合并形成壳体的一部分；换热孔设置于卡托帽，并贯通卡托帽。In some embodiments, the card holder includes a bearing part and a card holder cap disposed on the end of the bearing part, the card holder cap is fitted into the holder hole and forms a part of the housing; the heat exchange hole is arranged on the card holder cap, and Through Cato cap.
在一些实施方式中，电子设备还包括可活动功能模组，可活动功能模组可活动地容置于壳体内，并能够经由换热孔伸出壳体之外。In some embodiments, the electronic device further includes a movable function module, which can be movably accommodated in the housing and can protrude out of the housing through the heat exchange hole.
在一些实施方式中，壳体的内壁凹设有台阶槽，换热孔设置于台阶槽的底部并贯通壳体；可活动功能模组的外周壁设有凸缘密封部，凸缘密封部封盖换热孔。In some embodiments, the inner wall of the casing is concavely provided with a step groove, and the heat exchange hole is arranged at the bottom of the step groove and penetrates through the casing; the outer peripheral wall of the movable functional module is provided with a flange sealing part, and the flange sealing part seals Cover the heat exchange hole.
在一些实施方式中，可活动功能模组包括前置摄像头、后置摄像头、闪光灯、受话筒、传感器中的任一个或多个。In some embodiments, the movable function module includes any one or more of a front camera, a rear camera, a flash, a receiver, and a sensor.
在一些实施方式中，电子设备还包括设于壳体内的电子元件，电子元件邻近换热孔设置，换热孔与电子元件之间的距离小于换热孔与振动组件的距离。In some embodiments, the electronic device further includes an electronic component disposed in the casing, the electronic component is disposed adjacent to the heat exchange hole, and the distance between the heat exchange hole and the electronic component is smaller than the distance between the heat exchange hole and the vibration assembly.
在一些实施方式中，振动件为由压电材料制成的压电振动片，驱动件为压电驱动电路，压电驱动电路电连接于压电振动片。In some embodiments, the vibrating element is a piezoelectric vibrating piece made of piezoelectric material, the driving element is a piezoelectric driving circuit, and the piezoelectric driving circuit is electrically connected to the piezoelectric vibrating piece.
在一些实施方式中，振动件包括振膜和连接于振膜的线圈，驱动件为磁体，磁体与振膜相对设置。In some embodiments, the vibrating element includes a vibrating membrane and a coil connected to the vibrating membrane, the driving element is a magnet, and the magnet is disposed opposite to the vibrating membrane.
在一些实施方式中，电子设备还包括设于壳体内的受话器以及扬声器，线圈为音圈，振膜为受话器或扬声器的振膜。In some embodiments, the electronic device further includes a receiver and a speaker disposed in the casing, the coil is a voice coil, and the diaphragm is a diaphragm of the receiver or the speaker.
在一些实施方式中，壳体还设有安装孔，电子设备还包括固定支架，固定支架设于壳体内并与安装孔相对设置，振动件连接于固定支架。In some embodiments, the housing is further provided with a mounting hole, the electronic device further includes a fixing bracket, the fixing bracket is disposed in the housing and opposite to the mounting hole, and the vibrating element is connected to the fixing bracket.
在一些实施方式中，固定支架为具有开口的箱体状，驱动件设置于固定支架内，振动件盖设于开口处，固定支架还设有泄露孔，泄露孔将所述固定支架的内腔与壳体的内腔连通。In some embodiments, the fixed bracket is in the shape of a box with an opening, the driving element is arranged in the fixed bracket, the vibrating element is covered at the opening, and the fixed bracket is also provided with a leakage hole, which connects the inner cavity of the fixed bracket Communicate with the inner cavity of the housing.
在一些实施方式中，电子设备还包括设于壳体内的麦克风，麦克风设有拾音管道，拾音管道与换热孔连通。In some embodiments, the electronic device further includes a microphone disposed in the casing, the microphone is provided with a sound pickup pipe, and the sound pickup pipe communicates with the heat exchange hole.
在一些实施方式中，电子设备还包括防水透气膜，防水透气膜遮蔽换热孔。In some embodiments, the electronic device further includes a waterproof and gas-permeable film, and the waterproof and gas-permeable film covers the heat exchange holes.
本申请实施例还提供一种电子设备的控制方法，应用于上述的电子设备，控制方法包括：获取电子设备的温度；判断温度是否落入第一预设温度范围；若温度落入第一预设温度范围，则控制振动件以第一频率振动；若温度未落入第一预设温度范围，则控制振动件以第二频率振动。The embodiment of the present application also provides a method for controlling an electronic device, which is applied to the above-mentioned electronic device. The control method includes: obtaining the temperature of the electronic device; judging whether the temperature falls within the first preset temperature range; if the temperature falls within the first preset temperature range; If the temperature range is set, the vibrating element is controlled to vibrate at a first frequency; if the temperature does not fall within the first preset temperature range, the vibrating element is controlled to vibrate at a second frequency.
在一些实施方式中，电子设备还包括可活动功能模组，可活动功能模组可活动地容置于壳体内；若温度未落入第一预设温度范围，则控制振动件以第二频率振动之后，方法还包括：判断温度是否落入第二预设温度范围；若温度落入第二预设温度，则控制可活动功能模组自换热孔伸出壳体之外。In some embodiments, the electronic device further includes a movable function module, which can be movably accommodated in the casing; After the vibration, the method further includes: judging whether the temperature falls into the second preset temperature range; if the temperature falls into the second preset temperature, controlling the movable functional module to extend out of the housing from the heat exchange hole.
本申请提供的电子设备及其控制方法，通过温度传感器检测壳体内的温度，并通过控制器控制振动组件的驱动件驱动振动件振动，以推动壳体内的气体自换热孔与外界进行交换，提升电子设备的散热性能。The electronic device and its control method provided by the present application detect the temperature inside the shell through the temperature sensor, and control the driving part of the vibrating component to drive the vibrating part to vibrate through the controller, so as to push the gas in the shell to exchange with the outside from the heat exchange hole, Improve the heat dissipation performance of electronic equipment.
附图说明Description of drawings
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without any creative effort.
图1为本申请实施例提供的电子设备的结构示意图。FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
图2为图1所示电子设备的内部结构框架示意图。FIG. 2 is a schematic diagram of an internal structural framework of the electronic device shown in FIG. 1 .
图3为图1所示的电子设备在振动组件未开启时的热量分布图。FIG. 3 is a heat distribution diagram of the electronic device shown in FIG. 1 when the vibration component is not turned on.
图4为图1所示的电子设备在振动组件开启时的热量分布图。FIG. 4 is a heat distribution diagram of the electronic device shown in FIG. 1 when the vibrating component is turned on.
图5为图4所示的电子设备的壳体内的气流速度分布图。FIG. 5 is a diagram showing the distribution of airflow velocity in the casing of the electronic device shown in FIG. 4 .
图6为图1所述的电子设备的另一种内部结构框架示意图。FIG. 6 is a schematic diagram of another internal structural framework of the electronic device shown in FIG. 1 .
图7为图1所示的电子设备的又一种内部结构框架示意图。FIG. 7 is a schematic diagram of another internal structural framework of the electronic device shown in FIG. 1 .
图8为图1所示的电子设备的还一种内部结构框架示意图。FIG. 8 is a schematic diagram of another internal structural framework of the electronic device shown in FIG. 1 .
图9为图1所示的电子设备的振动组件为受话器或扬声器时的局部剖面结构示意图。FIG. 9 is a partial cross-sectional structural schematic diagram of the electronic device shown in FIG. 1 when the vibrating component is a receiver or a speaker.
图10为图8所示的电子设备的振动组件的振动频率与音量的关系图。FIG. 10 is a graph showing the relationship between the vibration frequency and volume of the vibration component of the electronic device shown in FIG. 8 .
图11为图1所示的电子设备的换热孔和卡托的一种结构示意图。FIG. 11 is a structural schematic diagram of the heat exchange hole and the card tray of the electronic device shown in FIG. 1 .
图12为图1所示的电子设备的换热孔和卡托的另一种结构示意图。FIG. 12 is another schematic diagram of the structure of the heat exchange holes and the tray of the electronic device shown in FIG. 1 .
图13为本申请实施例提供的一种电子设备的控制方法的流程图。FIG. 13 is a flow chart of a method for controlling an electronic device provided by an embodiment of the present application.
具体实施方式Detailed ways
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.
传统的电子设备的散热方式主要通过在电子设备内部增加石墨或铜箔等导热性能良好的散热材料，热量通过散热材料迅速在发热点周围散开，并传递到电子设备外壳的金属部件，最终散发到电子设备外部，以使电子设备温度降低。但是，设置散热材料的散热方式需要在散热的结构上避让一些器件，由于电子设备内部的电子元件较为密集，散热材料的粘贴面积和设置区域会受到较大的限制，电子设备的散热效果稍差。The heat dissipation method of traditional electronic equipment is mainly by adding heat dissipation materials with good thermal conductivity such as graphite or copper foil inside the electronic equipment. to the outside of the electronic device to cool down the electronic device. However, the heat dissipation method of setting the heat dissipation material needs to avoid some devices in the heat dissipation structure. Since the electronic components inside the electronic equipment are relatively dense, the pasting area and installation area of the heat dissipation material will be greatly restricted, and the heat dissipation effect of the electronic equipment is slightly poor. .
基于此，发明人对电子设备的散热结构进行了大量的研究。发明人发现，在电子设备内温度高于外界温度的情况下，根据热力学第二定律，电子设备内的热量会向外界发生交换，也即，电子设备内的气体会自发地与外界气体实现换热，但由于电子设备具有防水密封的需求，电子设备内大致为密封结构，导致该过程的换热速度比较慢。此时，通过给予电子设备内的气体一个助推力，可以使电子设备内的气体与外界的换热加快，可以提高电子设备的散热速度。但是这样的散热结构下，发明人经过反复测试发现，发现如果加入风机作为助推力，会增加电子设备的重量，且会加大电子设备的体积，不符合当今电子设备薄型化的趋势，不利于携带。Based on this, the inventors have conducted a lot of research on the heat dissipation structure of electronic equipment. The inventors found that when the temperature inside the electronic device is higher than the outside temperature, according to the second law of thermodynamics, the heat inside the electronic device will exchange with the outside, that is, the gas inside the electronic device will spontaneously exchange with the outside gas. However, due to the need for waterproof sealing of electronic equipment, the interior of electronic equipment is generally a sealed structure, resulting in a relatively slow heat transfer rate in this process. At this time, by giving a boost force to the gas in the electronic device, the heat exchange between the gas in the electronic device and the outside can be accelerated, and the heat dissipation speed of the electronic device can be improved. However, under such a heat dissipation structure, the inventor found through repeated tests that if a fan is added as a booster, the weight of the electronic equipment will be increased, and the volume of the electronic equipment will be increased, which is not in line with the current trend of thinning electronic equipment. Easy to carry.
为此，发明人继续研究在维持电子设备的重量和体积的情况下，实现电子设备内的空气流通，以及外界进行空气交换的散热方法。其中，发明人的研究包括：如何加快电子设备内的气体与外界的换热，如何缩小风机的体积使其能适配于电子设备，如何利用电子设备内现有的结构替代风机等等。经过大量、反复的比对和研究，发明人进一步地就如何设计一种可以实现加快电子设备内的空气流通，以及与外界进行空气交换的电子设备进行了研究，并由此提出了本申请实施例的方案。For this reason, the inventor continues to study a heat dissipation method for achieving air circulation in the electronic device and exchanging air with the outside while maintaining the weight and volume of the electronic device. Among them, the inventor's research includes: how to speed up the heat exchange between the gas in the electronic device and the outside world, how to reduce the volume of the fan so that it can be adapted to the electronic device, how to use the existing structure in the electronic device to replace the fan, and so on. After a large number of repeated comparisons and researches, the inventor further conducted research on how to design an electronic device that can accelerate the air circulation in the electronic device and perform air exchange with the outside world, and thus proposed the implementation of this application Example scheme.
请一并参阅图1和图2，本申请实施例提供一种电子设备100，电子设备100可以为但不限于为手机、平板电脑等电子装置。本实施方式的电子设备100以手机为例进行说明。Please refer to FIG. 1 and FIG. 2 together. The embodiment of the present application provides an electronic device 100 . The electronic device 100 may be, but not limited to, an electronic device such as a mobile phone or a tablet computer. The electronic device 100 of this embodiment will be described by taking a mobile phone as an example.
电子设备100包括壳体110、温度传感器130、控制器150和振动组件170。其中，壳体110设有换热孔111，换热孔111连通壳体110的内腔与外界。温度传感器130设于壳体110内，并用于检测壳体110内部的温度。控制器150电连接于温度传感器130，并用于根据温度传感器130所检测的数据控制振动组件170工作。振动组件170包括驱动件171和振动件173，驱动件171与控制器150连接，驱动件171在控制器150的控制下驱动振动件173振动，以推动壳体110内的气体自换热孔111与外界进行交换。The electronic device 100 includes a housing 110 , a temperature sensor 130 , a controller 150 and a vibration assembly 170 . Wherein, the shell 110 is provided with a heat exchange hole 111 , and the heat exchange hole 111 communicates the inner cavity of the shell 110 with the outside. The temperature sensor 130 is disposed in the casing 110 and is used to detect the temperature inside the casing 110 . The controller 150 is electrically connected to the temperature sensor 130 and is used for controlling the vibration component 170 to work according to the data detected by the temperature sensor 130 . The vibrating assembly 170 includes a driving part 171 and a vibrating part 173. The driving part 171 is connected to the controller 150. The driving part 171 drives the vibrating part 173 to vibrate under the control of the controller 150 to push the gas in the housing 110 from the heat exchange holes 111. exchange with the outside world.
需要说明的是，电子设备100还包括其他电子元件104，如中央处理器(CentralProcessing Unit，CPU)、电池模块、指纹识别模块、传感器模块、摄像头模块等，电子元件104也容置于壳体110内，并实现电子设备100的功能，例如响应用户的触控操作并执行对应的指令等。其中，部分电子元件104在运行过程中会产生热量，进而使壳体110内的气体温度上升。可以理解的是，电子元件104长期在温度较高的环境下运行容易减少寿命，因此，需要通过换热孔111将壳体110内的热空气与外界进行交换，以对电子设备100进行散热，进而延长电子设备100的使用寿命。可选地，电子元件104邻近换热孔111设置，换热孔111与电子元件104之间的距离小于换热孔111与振动组件170的距离，通过将热源(产生热量的电子元件104)靠近换热孔111设置，以便于将电子元件104工作时产生的热量较为快速地导出至外界，加快电子设备100的散热速度。It should be noted that the electronic device 100 also includes other electronic components 104, such as a central processing unit (Central Processing Unit, CPU), a battery module, a fingerprint identification module, a sensor module, a camera module, etc., and the electronic components 104 are also accommodated in the casing 110 and implement functions of the electronic device 100, such as responding to a user's touch operation and executing corresponding instructions. Wherein, some electronic components 104 will generate heat during operation, and then the temperature of the gas inside the casing 110 will rise. It can be understood that the long-term operation of the electronic component 104 in a high temperature environment is likely to reduce the service life. Therefore, it is necessary to exchange the hot air in the casing 110 with the outside through the heat exchange hole 111 to dissipate heat from the electronic device 100. Further, the service life of the electronic device 100 is extended. Optionally, the electronic component 104 is arranged adjacent to the heat exchange hole 111, and the distance between the heat exchange hole 111 and the electronic component 104 is smaller than the distance between the heat exchange hole 111 and the vibration assembly 170. The heat exchanging holes 111 are provided so as to quickly conduct heat generated by the electronic components 104 to the outside to accelerate the heat dissipation speed of the electronic device 100 .
具体地，请一并参照图3至图5，其中图3至图5为发明人根据本实施例提供的电子设备100的结构做的仿真实验的数据分析图。其中，图3和图4为壳体110内的电子元件104产生热量时，即，电子元件104工作时，电子设备100内的温度分布图，其中，图3(a)为电子设备100第一表面的温度的分布示意，图3(b)为电子设备100第二表面的温度分布示意。需要说明的是，从电子设备100的第一表面观察，热源设置于电子设备100的左上方；从电子设备100的第二表面观察，热源设置于电子设备100的右上方；其中，换热孔111邻近热源设置。需要说明的是，本实验中的电子设备100的第一表面为电子设备100设有显示屏的表面，电子设备100的第二表面为电子设备100的后盖所在的表面。Specifically, please refer to FIG. 3 to FIG. 5 together, wherein FIG. 3 to FIG. 5 are data analysis diagrams of a simulation experiment conducted by the inventor according to the structure of the electronic device 100 provided by the present embodiment. Wherein, Fig. 3 and Fig. 4 are when the electronic component 104 in the casing 110 generates heat, that is, when the electronic component 104 works, the temperature distribution diagram in the electronic device 100, wherein, Fig. 3 (a) is the electronic device 100 first The temperature distribution of the surface is schematically shown, and FIG. 3( b ) is a schematic diagram of the temperature distribution of the second surface of the electronic device 100 . It should be noted that, viewed from the first surface of the electronic device 100, the heat source is arranged on the upper left of the electronic device 100; viewed from the second surface of the electronic device 100, the heat source is arranged on the upper right of the electronic device 100; wherein, the heat exchange hole 111 is set adjacent to the heat source. It should be noted that the first surface of the electronic device 100 in this experiment is the surface on which the electronic device 100 is provided with a display screen, and the second surface of the electronic device 100 is the surface on which the back cover of the electronic device 100 is located.
进一步地，在仿真实验中，以电子元件104在相同环境下以相同的功率进行工作为定量，并以设置于换热孔111呈对角线的振动组件170的工作与否为变量，通过对比图3和图4中电子设备100的温度分布图，可以清楚地看出振动组件170的工作效果。可以理解的是，在两次实验进行中，电子元件104在相同环境下以相同的功率进行工作，也即在两次实验进行中，电子元件104产生的热量为一样的，比对结果具有参考价值。Further, in the simulation experiment, the electronic components 104 work under the same environment with the same power as the quantification, and the operation of the vibrating assembly 170 arranged on the heat exchange hole 111 diagonally as the variable, by comparing From the temperature distribution diagrams of the electronic device 100 in FIG. 3 and FIG. 4 , the working effect of the vibrating component 170 can be seen clearly. It can be understood that, during the two experiments, the electronic components 104 worked under the same environment with the same power, that is, during the two experiments, the heat generated by the electronic components 104 was the same, and the comparison results have reference value.
其中，图3为振动组件170未开始工作时，电子设备100的各点温度分布图，可以看出，电子设备100由于自发散热的速度较慢，壳体110内的温度较高。图4为振动组件170以100HZ的振动频率开始工作时，电子设备100的各点温度分布图，可以看出，电子设备100由于振动组件170的振动辅助散热，电子设备100的散热速度提高，壳体110内的温度有效降低。进一步地，请参阅图5，图5显示图4的状态下，电子设备100内的气流流速分布图，可以看出气流在振动组件170、电子元件104以及换热孔111之间流动，具体在图5所示的实施例中，气流大致在壳体110的对角线方向上流动，且在对角线方向的空气速度较快，也即，壳体110内的空气进行热交换的速度较快，能对电子设备100快速降温。3 is a temperature distribution diagram of various points of the electronic device 100 when the vibrating component 170 does not start to work. It can be seen that the temperature inside the housing 110 of the electronic device 100 is relatively high due to the slow rate of spontaneous heat dissipation. Fig. 4 is when the vibrating component 170 starts to work with the vibrating frequency of 100HZ, the temperature distribution diagram of each point of the electronic device 100, it can be seen that the electronic device 100 is assisted by the vibration of the vibrating component 170 to dissipate heat, the heat dissipation speed of the electronic device 100 is improved, and the housing The temperature inside the body 110 is effectively reduced. Further, please refer to FIG. 5. FIG. 5 shows the distribution diagram of the air flow velocity in the electronic device 100 in the state of FIG. In the embodiment shown in FIG. 5 , the airflow generally flows in the diagonal direction of the casing 110, and the air speed in the diagonal direction is faster, that is, the air in the casing 110 performs heat exchange at a faster speed. Fast, can quickly cool down the electronic device 100 .
请继续参阅图2，壳体110设有内腔，温度传感器130、控制器150、振动组件170和电子元件104均容置于该内腔中。壳体110能够对温度传感器130、控制器150、振动组件170和电子元件104提供防护作用，避免温度传感器130、控制器150、振动组件170和电子元件104受外力撞击而导致内部发生错位或损坏，从而延长电子设备100的使用寿命。Please continue to refer to FIG. 2 , the casing 110 is provided with an inner cavity, and the temperature sensor 130 , the controller 150 , the vibrating component 170 and the electronic components 104 are all accommodated in the inner cavity. The housing 110 can provide protection for the temperature sensor 130, the controller 150, the vibration assembly 170 and the electronic components 104, preventing the temperature sensor 130, the controller 150, the vibration assembly 170 and the electronic components 104 from being impacted by external forces and causing internal dislocation or damage , thereby prolonging the service life of the electronic device 100 .
在本申请实施例中，壳体110大致为圆角矩形壳体，其中，壳体110为金属壳体。例如，壳体110可以由铝合金、镁合金等材料制成。在一些实施方式中，壳体110还可以由陶瓷、玻璃等材质制成。或者，壳体110可以为金属和塑胶相互结合的结构，例如，将塑胶材料注塑到金属材料上形成壳体110。In the embodiment of the present application, the housing 110 is substantially a rectangular housing with rounded corners, wherein the housing 110 is a metal housing. For example, the casing 110 may be made of aluminum alloy, magnesium alloy and other materials. In some embodiments, the housing 110 may also be made of materials such as ceramics and glass. Alternatively, the casing 110 may be a structure in which metal and plastic are combined with each other, for example, the casing 110 is formed by injecting plastic material onto a metal material.
进一步地，壳体110设有换热孔111，换热孔111连通壳体110的内腔与外界。壳体110内的气体可以通过换热孔111与外界进行换热，进而对电子设备100进行散热。可选地，换热孔111可以直接开设于壳体110的周壁。Further, the shell 110 is provided with a heat exchange hole 111 , and the heat exchange hole 111 communicates the inner cavity of the shell 110 with the outside. The gas in the casing 110 can exchange heat with the outside through the heat exchange hole 111 , and then dissipate heat from the electronic device 100 . Optionally, the heat exchange hole 111 may be directly opened on the peripheral wall of the casing 110 .
进一步地，壳体110还设有功能孔(图中未示出)，功能孔用于实现电子设备100的相关功能，可选地，功能孔可以用于暴露设于壳体110内的电子元件，也可以用于容置与电子设备100可拆卸连接的部件。其中，可以将换热孔111直接与功能孔相连通，进而，壳体110内的气体通过功能孔实现与外界的换热。可以理解的是，功能孔可以为扬声器的出音孔、受话器的出音孔、麦克风的拾音孔，或者为电子设备100的电子部件的容置孔等。Further, the housing 110 is also provided with functional holes (not shown in the figure), which are used to realize related functions of the electronic device 100, and optionally, the functional holes can be used to expose the electronic components arranged in the housing 110 , can also be used to accommodate components that are detachably connected to the electronic device 100 . Wherein, the heat exchange hole 111 can be directly connected with the functional hole, and further, the gas in the casing 110 realizes heat exchange with the outside through the functional hole. It can be understood that the functional hole may be a sound output hole of a speaker, a sound output hole of a receiver, a sound pickup hole of a microphone, or an accommodating hole of electronic components of the electronic device 100 .
例如，请参阅图6，电子设备100还包括设于壳体110内的麦克风120，麦克风120设有拾音管道(图中未标出)，此时功能孔为麦克风120的拾音孔，拾音管道与拾音孔相连通。也即，麦克风120的拾音管道通过功能孔与外界连通，以拾取相应的声音。进一步地，换热孔111与拾音管道连通，此时换热孔111可以作为麦克风120的拾音孔，因此，壳体110内的气体能够通过换热孔111以及拾音管道与外界进行交换。For example, please refer to Fig. 6, electronic equipment 100 also comprises the microphone 120 that is located in housing 110, and microphone 120 is provided with sound pickup pipeline (not marked among the figure), and this moment function hole is the sound pickup hole of microphone 120, picks up The sound pipe is connected with the sound pickup hole. That is, the sound pickup pipe of the microphone 120 communicates with the outside through the functional hole to pick up corresponding sounds. Further, the heat exchange hole 111 communicates with the sound pickup pipe. At this time, the heat exchange hole 111 can be used as the sound pickup hole of the microphone 120. Therefore, the gas in the housing 110 can exchange with the outside world through the heat exchange hole 111 and the sound pickup pipe. .
再例如，请参阅图7，电子设备100还包括可活动功能模组180，上述的功能孔作为可活动功能模组180的容置孔或活动通道。可活动功能模组180可活动地收容于壳体110内，并可选择地相对壳体110进行活动(例如，伸出壳体110或收回壳体110内)。此时，功能孔贯穿壳体110，换热孔111可以作为该功能孔使用，可活动功能模组180能够经由换热孔111相对壳体110伸出或缩回。For another example, please refer to FIG. 7 , the electronic device 100 further includes a movable function module 180 , and the above-mentioned function hole is used as an accommodating hole or a movable channel of the movable function module 180 . The movable function module 180 is movably accommodated in the housing 110 , and can be selectively moved relative to the housing 110 (for example, extending out of the housing 110 or retracting into the housing 110 ). At this time, the functional hole runs through the casing 110 , and the heat exchange hole 111 can be used as the functional hole, and the movable functional module 180 can extend or retract relative to the casing 110 through the heat exchange hole 111 .
其中，可活动功能模组180可以包括前置摄像头、后置摄像头、闪光灯、受话筒、传感器中的任一个或多个。可活动功能模组180容置于壳体110时，可活动功能模组180的端面可以与壳体110的外表面平齐，使电子设备100具有完整、平滑的外观面。进一步地，换热孔111为该功能孔时，壳体110内的气体能够被导引至换热孔111与外界进行交换。需要说明的是，当可活动功能模组180容置于壳体，并与换热孔111相嵌时，可活动功能模组180的端部与壳体110之间有间隙，也即，可活动功能模组180与形成换热孔111的孔壁之间存在预设的间隙，壳体110内的气体与外界的交换依然可以经由换热孔111实现；当可活动功能模组180远离换热孔111时，换热孔111与外界的连通截面积变大，更有利于壳体110内的气体与外界交换。Wherein, the movable function module 180 may include any one or more of a front camera, a rear camera, a flash, a microphone, and a sensor. When the movable function module 180 is accommodated in the casing 110 , the end surface of the movable function module 180 can be flush with the outer surface of the casing 110 , so that the electronic device 100 has a complete and smooth appearance. Further, when the heat exchange hole 111 is the functional hole, the gas in the casing 110 can be guided to the heat exchange hole 111 to exchange with the outside. It should be noted that when the movable functional module 180 is housed in the casing and is embedded in the heat exchange hole 111, there is a gap between the end of the movable functional module 180 and the casing 110, that is, it can There is a preset gap between the movable functional module 180 and the hole wall forming the heat exchange hole 111, and the exchange of the gas in the casing 110 with the outside world can still be realized through the heat exchange hole 111; when the movable functional module 180 is far away from the heat exchange hole When the heat holes 111 are formed, the communication cross-sectional area between the heat exchange holes 111 and the outside becomes larger, which is more conducive to the exchange of gas in the housing 110 with the outside.
进一步地，请参阅图8，可活动功能模组180的外周壁可以设有凸缘密封部181，可活动功能模组180容置于壳体110内时，该凸缘密封部181可大致封盖换热孔111，以实现防尘防水。此时，可活动功能模组180的外周壁的其他部位与形成换热孔111的孔壁之间仍存在预设的间隙，若可活动功能模组180远离换热孔111而伸出壳体110之外时，换热孔111与外界的连通截面积变大(也即增大壳体110的气体交换通道)，更有利于壳体110内的气体与外界交换。Further, referring to FIG. 8 , the outer peripheral wall of the movable functional module 180 may be provided with a flange sealing portion 181 , and when the movable functional module 180 is housed in the housing 110 , the flange sealing portion 181 may substantially seal the Cover the heat exchange hole 111 to achieve dustproof and waterproof. At this time, there is still a preset gap between other parts of the outer peripheral wall of the movable functional module 180 and the hole wall forming the heat exchange hole 111. When outside 110, the communication cross-sectional area between the heat exchange hole 111 and the outside becomes larger (that is, the gas exchange channel of the shell 110 is enlarged), which is more conducive to the exchange of gas in the shell 110 with the outside.
进一步地，在本实施例中，上述的功能孔可以为台阶孔，以在可活动功能模组180远离换热孔111时，能够进一步地增大壳体110的气体交换通道。具体在图8所示的实施方式中，壳体110的内壁可以凹陷地设有台阶槽1101，换热孔111则设置于台阶槽1101的底壁，并贯通壳体110。台阶槽1101与换热孔111共同形成了功能孔的台阶结构。在可活动功能模组180容置于壳体110时，凸缘密封部181可大致封闭换热孔111，以实现防尘防水。由于壳体110的内壁开设有台阶槽1101，相应部分的壳体110的厚度降低，也便于壳体110内的热量通过该部分壳体110向外界散热。进一步地，由于功能孔为台阶孔结构，可活动功能模组180的外周壁与形成台阶槽1101的侧壁之间仍具有一定的间隙，若可活动功能模组180远离换热孔111而伸出壳体110之外时，换热孔111与外界的连通截面积显著变大，更有利于壳体110内的气体与外界交换。Further, in this embodiment, the above-mentioned functional holes may be stepped holes, so as to further increase the gas exchange channel of the housing 110 when the movable functional module 180 is far away from the heat exchange holes 111 . Specifically, in the embodiment shown in FIG. 8 , the inner wall of the casing 110 may be recessedly provided with a stepped groove 1101 , and the heat exchange hole 111 is provided on the bottom wall of the stepped groove 1101 and penetrates through the casing 110 . The stepped groove 1101 and the heat exchange hole 111 jointly form a stepped structure of functional holes. When the movable function module 180 is accommodated in the casing 110 , the flange sealing portion 181 can substantially close the heat exchange hole 111 to realize dustproof and waterproof. Since the inner wall of the housing 110 is provided with a stepped groove 1101 , the thickness of the corresponding part of the housing 110 is reduced, and it is also convenient for the heat in the housing 110 to dissipate to the outside through the part of the housing 110 . Furthermore, since the functional hole is a stepped hole structure, there is still a certain gap between the outer peripheral wall of the movable functional module 180 and the side wall forming the stepped groove 1101, if the movable functional module 180 extends away from the heat exchange hole 111 When going out of the casing 110 , the communication cross-sectional area of the heat exchange hole 111 and the outside becomes significantly larger, which is more conducive to the exchange of gas in the casing 110 with the outside.
温度传感器130可以邻近运行时易发热的电子元件104(如电池模块等)设置，以便较有效地检测到壳体110内的温度变化。需要说明的是，温度传感器130采集的温度信息数据，将传递到与温度传感器130相连接的控制器150，通过控制器150预设的程序来根据检测到的壳体110的温度控制振动组件170的工作，以控制驱动件171驱动振动件173振动，进而推动壳体110内的气体自换热孔111与外界进行交换。The temperature sensor 130 can be disposed adjacent to the electronic components 104 (such as battery modules, etc.) that tend to generate heat during operation, so as to more effectively detect temperature changes in the casing 110 . It should be noted that the temperature information data collected by the temperature sensor 130 will be transmitted to the controller 150 connected to the temperature sensor 130, and the vibration assembly 170 will be controlled according to the detected temperature of the casing 110 through the preset program of the controller 150. The operation is to control the driving member 171 to drive the vibrating member 173 to vibrate, and then push the gas in the casing 110 to exchange with the outside from the heat exchange holes 111 .
请参阅图9，在本申请实施例中，驱动件171为磁体，振动件173包括振膜1731和连接于振膜1731的线圈1733，磁体与振膜1731相对设置。其中，当接收到控制器150的控制指令时，线圈1733通电，并在磁体的磁场影响下带动振膜1731进行振动。例如，通过对线圈1733输入第一方向的电流，使线圈1733成为磁极与磁体的磁极相同的电磁铁，进而在同性相斥的作用下远离磁体；对线圈1733输入第二方向的电流，使线圈1733成为磁极与磁体的磁极相反的电磁铁，进而在异性相斥的作用下靠近磁体；进一步地，通过交替向线圈1733输入第一方向和第二方向的电流，即可使线圈1733在磁体的磁场影响下运动。可以理解的是，线圈1733相对磁体运动时，连接于线圈1733的振膜1731也随着线圈1733进行振动，进而驱动壳体110内的气体自换热孔111与外界进行交换，对电子设备100进行散热。Referring to FIG. 9 , in the embodiment of the present application, the driving element 171 is a magnet, the vibrating element 173 includes a vibrating membrane 1731 and a coil 1733 connected to the vibrating membrane 1731 , and the magnet is arranged opposite to the vibrating membrane 1731 . Wherein, when receiving a control command from the controller 150, the coil 1733 is energized, and drives the diaphragm 1731 to vibrate under the influence of the magnetic field of the magnet. For example, by inputting an electric current in the first direction to the coil 1733, the coil 1733 becomes an electromagnet whose magnetic pole is the same as that of the magnet, and then stays away from the magnet under the effect of same-sex repulsion; inputting an electric current in the second direction to the coil 1733 makes the coil 1733 becomes an electromagnet whose magnetic pole is opposite to the magnetic pole of the magnet, and then approaches the magnet under the action of opposite sex repulsion; further, by alternately inputting the current of the first direction and the second direction to the coil 1733, the coil 1733 can be made to be in the direction of the magnet. Movement under the influence of a magnetic field. It can be understood that when the coil 1733 moves relative to the magnet, the diaphragm 1731 connected to the coil 1733 also vibrates along with the coil 1733, and then drives the gas in the casing 110 to exchange with the outside from the heat exchange hole 111, and the electronic device 100 To dissipate heat.
可选地，电子设备100还包括受话器以及扬声器，线圈1733可以为音圈，振膜1731为受话器或扬声器的振膜。也即，振动组件173为受话器或扬声器。需要说明的是，受话器或扬声器为电子设备100的常见元件，其用于将音频电信号转化为声音模拟信号，实现电子设备100的电声转换。其中，通过受话器或扬声器实现振动组件173的功能，可以利用电子设备100的现有元件，不用额外设置专用于推动空气进行交换的机构，节省了壳体110的内部空间，降低了生产成本，也降低了工艺难度，缩短了工艺流程。Optionally, the electronic device 100 further includes a receiver and a speaker, the coil 1733 may be a voice coil, and the diaphragm 1731 is a diaphragm of the receiver or the speaker. That is, the vibrating component 173 is a receiver or a speaker. It should be noted that a receiver or a speaker is a common component of the electronic device 100 , which is used to convert audio electrical signals into audio analog signals, so as to realize electro-acoustic conversion of the electronic device 100 . Wherein, the function of the vibrating assembly 173 is realized by the receiver or the loudspeaker, the existing components of the electronic device 100 can be utilized, and no additional mechanism dedicated to promoting air exchange is required, which saves the internal space of the housing 110, reduces the production cost, and The process difficulty is reduced and the process flow is shortened.
同样可选地，驱动件171可以为压电驱动电路，振动件173为由压电材料制成的压电振动片，压电驱动电路连接于压电振动片。其中，压电振动片接收到压电驱动电路的输入时，能够产生机械振动，进而产生对壳体110内的气体的推动力，加快壳体110内的气体通过换热孔111与外界进行交换。可选地，压电驱动电路可以为电流驱动电路，通过晶体管放大器提供正反馈，构成压电晶体振荡器，进而使压电振动片在特定频率中振动。可选地，压电驱动电路可以为电压驱动电路，通过输入特定频率的电压，进而使压电振动片以特定频率振动，进而推动壳体110内的气体自换热孔111与外界进行交换。Also optionally, the driving element 171 may be a piezoelectric driving circuit, the vibrating element 173 is a piezoelectric vibrating piece made of piezoelectric material, and the piezoelectric driving circuit is connected to the piezoelectric vibrating piece. Among them, when the piezoelectric vibrating piece receives the input from the piezoelectric drive circuit, it can generate mechanical vibration, and then generate a driving force on the gas in the housing 110, and accelerate the gas in the housing 110 to exchange with the outside through the heat exchange holes 111. . Optionally, the piezoelectric driving circuit may be a current driving circuit, which provides positive feedback through a transistor amplifier to form a piezoelectric crystal oscillator, and then makes the piezoelectric vibrating piece vibrate at a specific frequency. Optionally, the piezoelectric driving circuit may be a voltage driving circuit. By inputting a voltage of a specific frequency, the piezoelectric vibrating piece vibrates at a specific frequency, thereby pushing the gas in the casing 110 to exchange with the outside from the heat exchange holes 111 .
请继续参阅图9，壳体110还设有安装孔113，振动组件173设于壳体110内并对应于安装孔113。其中，当振动组件173为受话器或扬声器时，可以通过安装孔113出音，进而满足用户的通话或语音外放的需求。Please continue to refer to FIG. 9 , the casing 110 is further provided with an installation hole 113 , and the vibrating assembly 173 is disposed in the casing 110 and corresponds to the installation hole 113 . Wherein, when the vibrating component 173 is a receiver or a loudspeaker, sound can be produced through the installation hole 113 , thereby satisfying the user's needs for calls or voice playback.
进一步地，电子设备100还包括固定支架190，固定支架190架设于壳体110内并与安装孔113相对设置，振动件173连接于固定支架190。在本申请实施例中，固定支架190大致为具有开口的箱状体，驱动件171设置于固定支架190内，振动件173盖设于固定支架190的开口处。可以理解的是，通过固定支架190将驱动件171和振动件173形成一个大致密封的封闭结构，可以对驱动件171和振动件173提供防护，同时，使振动组件170模块化，便于确定振动组件170的位置，进而便于组装振动组件170。Further, the electronic device 100 further includes a fixing bracket 190 , which is erected in the housing 110 and opposite to the installation hole 113 , and the vibrating element 173 is connected to the fixing bracket 190 . In the embodiment of the present application, the fixing bracket 190 is roughly a box-shaped body with an opening, the driving element 171 is disposed in the fixing bracket 190 , and the vibrating element 173 is covered at the opening of the fixing bracket 190 . It can be understood that the driving member 171 and the vibrating member 173 are formed into a substantially airtight closed structure through the fixing bracket 190, which can provide protection for the driving member 171 and the vibrating member 173, and at the same time, make the vibrating assembly 170 modular to facilitate the determination of the vibrating assembly. 170, thereby facilitating the assembly of the vibrating assembly 170.
需要说明的是，当振动组件173为受话器或扬声器时，通过固定支架190将将驱动件171和振动件173形成一个大致密封的封闭结构，可以构成受话器或扬声器的音腔。进一步地，固定支架190设有泄露孔191，泄露孔191将固定支架190的内腔与壳体110的内腔相连通。因此，可以通过泄露孔191可以实现受话器或扬声器的空气内外交换，也能实现对受话器或扬声器的内部散热。例如，在受话器或扬声器工作时，振膜振动并推动外界的空气压缩膨胀，产生声压，使用户听到声音，同时，通过泄露孔191使壳体110内的空气收缩膨胀，推动壳体110内的空气，使其能通过换热孔111进行换热。It should be noted that, when the vibrating component 173 is a receiver or a speaker, the fixing bracket 190 will form a substantially airtight closed structure of the driving member 171 and the vibrating member 173, which can form a sound cavity of the receiver or speaker. Further, the fixing bracket 190 is provided with a leakage hole 191 , and the leakage hole 191 communicates the inner cavity of the fixing bracket 190 with the inner cavity of the housing 110 . Therefore, through the leak hole 191, the exchange of air inside and outside the receiver or speaker can be realized, and the internal heat dissipation of the receiver or speaker can also be realized. For example, when the receiver or the speaker is working, the diaphragm vibrates and pushes the outside air to compress and expand to generate sound pressure, so that the user can hear the sound. The air inside allows it to exchange heat through the heat exchange holes 111.
需要说明的是，当振动组件173为受话器或扬声器时，振动组件173的工作模式为两种，一种为通话模式，即，受话器或扬声器进行通话或声音外放的工作状态；另一种为散热模式，即，受话器或扬声器通过控制器150的控制进行散热的工作状态。It should be noted that, when the vibrating component 173 is a receiver or a speaker, there are two working modes of the vibrating component 173, one is a call mode, that is, the receiver or the speaker is talking or the working state of the sound; the other is The heat dissipation mode is a working state in which the receiver or the speaker is controlled by the controller 150 to dissipate heat.
具体地，在通话模式下，用户进行通话或声音外放的操作时，振动组件173会自动运行，在发出声音的同时实现散热。但是，由于此时的散热频率与声音的播放有关，其具有不稳定性且对壳体110内空气的推动效果一般。因此，在壳体110内温度较高的情况下，受话器或扬声器需要运行于散热模式，即，通过控制器150对振动组件173的振动频率进行控制，使得振动组件173能够以恒定的频率进行振动，以对壳体110内的气体起到较好的推动的效果，进而对电子设备100进行散热。Specifically, in the call mode, when the user makes a call or plays an operation of sound, the vibrating component 173 will automatically operate to realize heat dissipation while making sound. However, since the cooling frequency at this time is related to the playing of the sound, it is unstable and has a general pushing effect on the air in the casing 110 . Therefore, when the temperature in the casing 110 is high, the receiver or the speaker needs to operate in a heat dissipation mode, that is, the vibration frequency of the vibrating component 173 is controlled by the controller 150 so that the vibrating component 173 can vibrate at a constant frequency , so as to better push the gas in the casing 110 and further dissipate heat from the electronic device 100 .
需要说明的是，受话器或扬声器的工作频率越高，对壳体110内的空气的推动力越大，对电子设备100的散热效果也越好。但是，受话器或扬声器在工作时会发生声音，需要确保受话器或扬声器在适宜的分贝频率下进行工作，以避免对用户进行干扰。请参阅图10，发明人经过反复的研究发现，当受话器或扬声器的工作频率约为100HZ时，受话器或扬声器产生的音量大致为40分贝，此声音处于比较安静的正常环境，也即，100HZ的工作频率不会对用户造成干扰，也不会影响电子设备100的使用。因此，可以将100HZ作为受话器或扬声器在散热模式下的最大振动频率，以兼顾电子设备100的散热效果和用户的使用体验。It should be noted that the higher the operating frequency of the receiver or speaker, the greater the driving force on the air in the housing 110 , and the better the cooling effect on the electronic device 100 . However, the receiver or speaker will produce sound when it is working, and it is necessary to ensure that the receiver or speaker works at a suitable decibel frequency to avoid disturbing the user. Please refer to Fig. 10. After repeated research, the inventor found that when the operating frequency of the receiver or the speaker is about 100 Hz, the volume produced by the receiver or the speaker is about 40 decibels, and the sound is in a relatively quiet normal environment, that is, 100 Hz. The working frequency will not cause interference to users, nor will it affect the use of the electronic device 100 . Therefore, 100 Hz can be used as the maximum vibration frequency of the receiver or speaker in the heat dissipation mode, so as to take into account both the heat dissipation effect of the electronic device 100 and the user experience.
请参阅图11，电子设备100还包括卡托140和卡托锁紧件160，上述的功能孔可以为卡托孔，卡托140的端部与卡托孔相嵌合，卡托锁紧件160连接于卡托140与壳体110之间。其中，卡托140通过卡托锁紧件160与壳体110相连接，进而使卡托140固定连接于壳体110，且不易于脱落。Please refer to Fig. 11, the electronic device 100 also includes a card holder 140 and a card holder locking member 160, the above-mentioned functional hole can be a holder hole, the end of the card holder 140 is fitted into the card holder hole, and the card holder locking member 160 is connected between the card tray 140 and the housing 110 . Wherein, the card tray 140 is connected to the housing 110 through the card tray locking member 160 , so that the card tray 140 is fixedly connected to the housing 110 and is not easy to fall off.
进一步地，卡托140包括承载部141和设置于承载部141的端部的卡托帽143，承载部141容置于壳体110内，卡托帽143与卡托孔相嵌合形成壳体110的一部分，换热孔111设置于卡托帽143，并贯通卡托帽143。Further, the card holder 140 includes a bearing part 141 and a card holder cap 143 arranged at the end of the bearing part 141, the bearing part 141 is accommodated in the housing 110, and the card holder cap 143 is fitted with the holder hole to form a housing A part of 110 , the heat exchange hole 111 is disposed on the card holder cap 143 and passes through the card holder cap 143 .
可选地，此时换热孔111为设置于卡托帽143的卡托顶出孔(图中未示出)，其中，卡托顶出孔连通至外界，通过插针等工具插入卡托顶出孔并驱动卡托锁紧件160，进而使卡托140与壳体110分离。可以理解的是，利用卡托顶出孔作为换热孔111，可以避免在壳体110开孔，进而减少电子设备100的加工工序，同时保证壳体110的外观较为简洁美观。Optionally, at this time, the heat exchange hole 111 is a card holder ejection hole (not shown in the figure) provided on the card holder cap 143, wherein the card holder ejection hole is connected to the outside world, and inserted into the card holder through a tool such as a pin The hole is ejected and the card holder locking member 160 is driven to separate the card holder 140 from the housing 110 . It can be understood that, using the card tray ejection hole as the heat exchange hole 111 can avoid opening holes in the housing 110 , thereby reducing the processing steps of the electronic device 100 , and at the same time ensuring that the housing 110 has a more concise and beautiful appearance.
请参阅图12,可以理解的是，卡托顶出孔可以设置于壳体110，通过插针等工具插入卡托顶出孔并驱动卡托锁紧件160，进而使卡托140与壳体110分离。可选地，换热孔111可以作为该卡托顶出孔使用，可以简化壳体110的加工工艺。进一步地，壳体110的内壁可以凹陷地设有连通凹槽115，连通凹槽115位于卡托锁紧件160和换热孔111之间，并与换热孔111连通。其中，壳体110内的气体可以通过换热孔111和换热孔111与外界进行气体交换，进而实现电子设备100的散热，也即，增大了壳体110内气体与外界的接触面积，可以加快电子设备100的散热速度。需要说明的是，在本申请实施例中，换热孔111与卡托锁紧件160相间隔设置，且利用卡托顶出孔作为换热孔111，不用在壳体110额外开设换热孔111，兼顾了电子设备100的外观面的完整和美观，也减少了工艺流程。Please refer to FIG. 12 , it can be understood that the card holder ejection hole can be arranged in the housing 110, insert a tool such as a pin into the card holder ejection hole and drive the card holder locking member 160, and then make the card holder 140 and the housing 110 separation. Optionally, the heat exchange hole 111 can be used as the ejection hole of the card holder, which can simplify the processing technology of the housing 110 . Further, the inner wall of the housing 110 may be recessedly provided with a communication groove 115 , the communication groove 115 is located between the card holder locking member 160 and the heat exchange hole 111 , and communicates with the heat exchange hole 111 . Wherein, the gas in the housing 110 can exchange gas with the outside through the heat exchange hole 111 and the heat exchange hole 111, thereby realizing the heat dissipation of the electronic device 100, that is, increasing the contact area between the gas in the housing 110 and the outside world, The heat dissipation speed of the electronic device 100 can be accelerated. It should be noted that, in the embodiment of the present application, the heat exchange hole 111 is spaced apart from the card holder locking member 160, and the card holder ejection hole is used as the heat exchange hole 111, and no additional heat exchange hole is provided in the housing 110 111, taking into account the integrity and beauty of the appearance of the electronic device 100, and also reducing the process flow.
请再次参阅图2，在本申请实施例中，电子设备100还包括防水透气膜102，防水透气膜102遮蔽换热孔111。其中，防水透气膜102由高分子防水材料制成，如聚四氟乙烯聚合而成的高分子化合物。可以理解的是，通过设置防水透气膜102，壳体110内的气体仍能通过换热孔111与外界进行交换，但是外界的水分无法自换热孔111进入壳体110内，进而避免壳体110内的电子元件104因为水分而腐蚀和损坏的情况发生。Please refer to FIG. 2 again. In the embodiment of the present application, the electronic device 100 further includes a waterproof and gas-permeable film 102 , and the waterproof and gas-permeable film 102 covers the heat exchange holes 111 . Wherein, the waterproof and gas-permeable membrane 102 is made of a polymer waterproof material, such as a polymer compound polymerized by polytetrafluoroethylene. It can be understood that, by setting the waterproof and gas-permeable membrane 102, the gas in the housing 110 can still exchange with the outside world through the heat exchange holes 111, but the moisture from the outside cannot enter the housing 110 through the heat exchange holes 111, thereby avoiding the Corrosion and damage to electronic components 104 within 110 due to moisture occurs.
本申请实施例提供的电子设备100，通过温度传感器130检测壳体110内的温度，并通过控制器150控制振动组件170的驱动件171驱动振动件173振动，以推动壳体110内的气体自换热孔111与外界进行交换，提升电子设备100的散热性能。The electronic device 100 provided by the embodiment of the present application detects the temperature inside the casing 110 through the temperature sensor 130, and controls the driving part 171 of the vibrating component 170 to drive the vibrating part 173 to vibrate through the controller 150, so as to push the gas inside the casing 110 to The heat exchange hole 111 exchanges with the outside to improve the heat dissipation performance of the electronic device 100 .
请参阅图13，本申请实施例还提供一种电子设备的控制方法，可应用于上述的电子设备。电子设备包括壳体、温度传感器、控制器和振动组件，其中，壳体设有换热孔，换热孔连通壳体的内腔与外界。温度传感器设于壳体内，控制器电连接于温度传感器。振动组件包括驱动件和振动件，驱动件与控制器电连接，驱动件在控制器的控制下驱动振动件振动，以推动壳体内的气体自换热孔与外界进行交换。该电子设备的控制方法，通过获取电子设备的温度，进而向控制器输入不同指令，以使振动组件按预设的方式进行振动，达到对电子设备进行散热的效果。具体地，该电子设备的控制方法可以包括步骤S101～S109。Referring to FIG. 13 , the embodiment of the present application also provides a method for controlling an electronic device, which can be applied to the above-mentioned electronic device. The electronic equipment includes a housing, a temperature sensor, a controller and a vibrating assembly, wherein the housing is provided with a heat exchange hole, and the heat exchange hole communicates the inner cavity of the housing with the outside. The temperature sensor is arranged in the casing, and the controller is electrically connected to the temperature sensor. The vibrating assembly includes a driving part and a vibrating part, the driving part is electrically connected to the controller, and the driving part drives the vibrating part to vibrate under the control of the controller, so as to push the gas in the casing to exchange with the outside from the heat exchange holes. The control method of the electronic equipment obtains the temperature of the electronic equipment, and then inputs different instructions to the controller, so that the vibrating component vibrates in a preset manner, thereby achieving the effect of cooling the electronic equipment. Specifically, the electronic device control method may include steps S101-S109.
步骤S101：获取电子设备的温度。Step S101: Obtain the temperature of the electronic device.
在本申请实施例中，通过设置于壳体内的温度传感器进行获取电子设备的温度。其中，温度传感器可以为电阻传感器，也可以为热电偶传感器，在此不做限定。可选地，温度传感器可以邻近容易产生热量的电子元件设置，以阀芯壳体内局部温度的上升情况。In the embodiment of the present application, the temperature of the electronic device is acquired through a temperature sensor disposed in the casing. Wherein, the temperature sensor may be a resistance sensor or a thermocouple sensor, which is not limited here. Optionally, the temperature sensor can be arranged adjacent to the electronic components that are prone to generate heat, so as to detect the rise of the local temperature in the spool housing.
步骤S103：判断所述温度是否落入第一预设温度范围。Step S103: Determine whether the temperature falls within a first preset temperature range.
在本实施例中，第一预设温度范围以第一预设温度作为表征，判断所述温度与是否落入第一预设温度范围时，可以通过比较温度与第一预设温度的数值大小实现。In this embodiment, the first preset temperature range is characterized by the first preset temperature. When judging whether the temperature falls within the first preset temperature range, the numerical value of the temperature and the first preset temperature can be compared. accomplish.
其中，第一预设温度可以设定为略高于环境温度，或用户体感温度的温度。例如，第一预设温度可以设为30～35℃，在此不做限定。其中，当电子设备的温度高于第一预设温度时，用户在使用电子设备过程中会发觉电子设备的发热情况，影响用户对电子设备的使用。相对地，电子设备的温度小于第一预设温度时，用户可正常使用电子设备。可以理解的是，第一预设温度范围以第一预设温度为上限值，第一预设温度范围的下限值可以不做限定。可选地，温度小于第一预设温度时，可确定温度落入第一预设温度范围时；若温度大于或等于第一预设温度，则确定温度未落入第一预设温度范围。Wherein, the first preset temperature may be set to be slightly higher than the ambient temperature, or the temperature felt by the user. For example, the first preset temperature may be set at 30-35° C., which is not limited here. Wherein, when the temperature of the electronic device is higher than the first preset temperature, the user will find the heating of the electronic device during the use of the electronic device, which affects the use of the electronic device by the user. Relatively, when the temperature of the electronic device is lower than the first preset temperature, the user can use the electronic device normally. It can be understood that the first preset temperature range takes the first preset temperature as the upper limit, and the lower limit of the first preset temperature range may not be limited. Optionally, when the temperature is lower than the first preset temperature, it may be determined that the temperature falls within the first preset temperature range; if the temperature is greater than or equal to the first preset temperature, it is determined that the temperature does not fall within the first preset temperature range.
步骤S105：根据温度是否落入第一预设温度范围的判断结果，控制振动件运动。Step S105: Control the movement of the vibrating element according to the judgment result of whether the temperature falls within the first preset temperature range.
其中，温度是否落入第一预设温度范围的判断结果包括，温度落入第一预设温度范围，以及温度未落入第一预设温度范围。可以理解的是，根据两种不同的比较结果，控制器控制振动组件进行振动的频率也有所不同。Wherein, the judging result of whether the temperature falls within the first preset temperature range includes, the temperature falls within the first preset temperature range, and the temperature does not fall within the first preset temperature range. It can be understood that, according to the two different comparison results, the frequency at which the controller controls the vibrating component to vibrate is also different.
在本申请实施例中，温度落入第一预设温度范围为温度大于第一预设温度范围的下限值，且小于第一预设温度范围的上限值(第一预设温度)。温度未落入第一预设范围为温度大于或等于第一预设范围的上限值。例如以第一预设温度为30℃为例，第一预设温度范围为0～30℃，若温度为20℃，确定温度落入第一预设温度范围；若温度为30℃，则确定温度未落入第一预设温度范围。In the embodiment of the present application, the temperature falling within the first preset temperature range means that the temperature is greater than the lower limit of the first preset temperature range and smaller than the upper limit of the first preset temperature range (the first preset temperature). The temperature not falling within the first preset range means that the temperature is greater than or equal to the upper limit of the first preset range. For example, taking the first preset temperature as 30°C as an example, the first preset temperature range is 0-30°C, if the temperature is 20°C, determine that the temperature falls within the first preset temperature range; if the temperature is 30°C, determine The temperature does not fall within the first preset temperature range.
具体地，若温度落入第一预设温度范围，即温度小于第一预设温度时，控制振动件以第一频率振动。其中，第一频率为50HZ～80HZ的振动频率。可以理解的是，此时电子设备的温度较低，可以用较低频率的振动对电子设备进行散热。可选地，也可以不特意地控制振动件进行振动，而依赖用户进行通话时振动件进行振动来散热。若温度落入第一预设温度范围，即温度大于或等于第一预设温度时，控制振动件以第二频率振动。其中，第二频率为80HZ～100HZ的振动频率。可以理解的是，此时电子设备内的温度较高，需要通过振动件的振动对电子设备进行散热，因此需要振动件以比较高的频率进行振动，以加速电子设备的散热过程。Specifically, if the temperature falls within the first preset temperature range, that is, when the temperature is lower than the first preset temperature, the vibration member is controlled to vibrate at the first frequency. Wherein, the first frequency is a vibration frequency of 50HZ˜80HZ. It can be understood that at this time, the temperature of the electronic device is relatively low, and the vibration of a lower frequency can be used to dissipate heat from the electronic device. Optionally, the vibrating element may not be deliberately controlled to vibrate, but rely on the vibrating element vibrating to dissipate heat when the user is talking. If the temperature falls within the first preset temperature range, that is, when the temperature is greater than or equal to the first preset temperature, the vibrating element is controlled to vibrate at a second frequency. Wherein, the second frequency is a vibration frequency of 80HZ˜100HZ. It can be understood that at this time, the temperature inside the electronic device is high, and the electronic device needs to be dissipated through the vibration of the vibrating element. Therefore, the vibrating element needs to vibrate at a relatively high frequency to accelerate the heat dissipation process of the electronic device.
步骤S107：判断温度是否落入第二温度预设范围。Step S107: Determine whether the temperature falls within a second temperature preset range.
需要说明的是，若电子设备还包括可活动功能模组，可活动功能模组可活动地容置于壳体内，换热孔为可活动功能模组的容置孔或活动通道时，在温度未落入第一预设温度范围，且控制振动件以第二频率振动之后，再执行本步骤。It should be noted that if the electronic device also includes a movable functional module, the movable functional module can be movably accommodated in the casing, and when the heat exchange hole is the accommodating hole or movable channel of the movable functional module, the temperature This step is performed after the temperature does not fall into the first preset temperature range and the vibrating element is controlled to vibrate at the second frequency.
其中，第二预设温度范围以第二预设温度作为表征，判断所述温度与是否落入第二预设温度范围时，可以通过比较温度与第二预设温度的数值大小实现。Wherein, the second preset temperature range is characterized by the second preset temperature, and the judgment of whether the temperature falls within the second preset temperature range can be realized by comparing the temperature with the value of the second preset temperature.
需要说明的是，第二预设温度可以设定为较高的温度，例如35～40℃，此时，电子设备的温度超出环境温度5～10℃，或超过用户体感温度5～10℃。其中，电子设备的温度大于或等于第二预设温度时，用户在使用电子设备过程中会发觉电子设备发烫，难以长时间握持，并影响电子设备的正常使用。可以理解的是，第二预设温度范围以第二预设温度为下限值，第二预设温度范围的上限值可以不做限定。可选地，温度小于第二预设温度时，确定温度未落入第二预设温度范围；若温度大于或等于第二预设温度，则确定温度落入第二预设范围。It should be noted that the second preset temperature can be set to a higher temperature, for example, 35-40°C. At this time, the temperature of the electronic device is 5-10°C higher than the ambient temperature, or 5-10°C higher than the user's body temperature. Wherein, when the temperature of the electronic device is greater than or equal to the second preset temperature, the user will find that the electronic device is hot during use, making it difficult to hold it for a long time, and affecting the normal use of the electronic device. It can be understood that the second preset temperature range takes the second preset temperature as the lower limit, and the upper limit of the second preset temperature range may not be limited. Optionally, when the temperature is lower than the second preset temperature, it is determined that the temperature does not fall within the second preset temperature range; if the temperature is greater than or equal to the second preset temperature, it is determined that the temperature falls within the second preset range.
步骤S109：根据温度是否落入第二预设温度范围的判断结果，控制可活动功能模组运动。Step S109: Control the movement of the movable function module according to the judgment result of whether the temperature falls within the second preset temperature range.
其中，温度是否落入第二预设温度范围的判断结果包括，温度落入第二预设温度范围，以及温度未落入第二预设温度范围。可以理解的是，根据两种不同的比较结果，判断是否控制可活动功能模组运动。Wherein, the judging result of whether the temperature falls within the second preset temperature range includes, the temperature falls within the second preset temperature range, and the temperature does not fall within the second preset temperature range. It can be understood that, according to two different comparison results, it is judged whether to control the movement of the movable function module.
在本申请实施例中，温度落入第二预设温度范围为温度大于第二预设温度范围的下限值(第二预设温度)，且小于第二预设温度范围的上限值。温度未落入第二预设范围为温度小于第二预设范围的下限值。例如以第二预设温度为35℃为例，第二预设温度范围为35～60℃，若温度为35℃，确定温度落入第二预设温度范围；若温度为25℃，则确定温度未落入第二预设温度范围。In the embodiment of the present application, the temperature falling within the second preset temperature range means that the temperature is greater than the lower limit (second preset temperature) of the second preset temperature range and smaller than the upper limit of the second preset temperature range. The temperature not falling into the second preset range means that the temperature is lower than the lower limit of the second preset range. For example, taking the second preset temperature as 35°C as an example, the second preset temperature range is 35-60°C, if the temperature is 35°C, determine that the temperature falls within the second preset temperature range; if the temperature is 25°C, determine The temperature does not fall within the second preset temperature range.
具体地，若电子设备的温度落入第二温度预设范围，在控制振动件以第二频率进行振动的基础上，还可以控制可活动功能模组自换热孔伸出壳体之外。可以理解的是，可活动功能模组自换热孔伸出壳体外时，可以增大换热孔与外界的连通截面积，进而提高壳体内空气通过换热孔与外界进行交换的速率，进而提高电子设备的散热效率。若温度未落入第二温度预设范围，可以参照上述步骤S105对振动件的振动频率进行控制。Specifically, if the temperature of the electronic device falls within the second preset temperature range, on the basis of controlling the vibrating member to vibrate at the second frequency, the movable functional module can also be controlled to extend out of the casing from the heat exchange hole. It can be understood that when the movable functional module protrudes from the heat exchange hole outside the shell, the communication cross-sectional area between the heat exchange hole and the outside world can be increased, thereby increasing the rate at which the air in the shell exchanges with the outside world through the heat exchange hole, and thus Improve the heat dissipation efficiency of electronic equipment. If the temperature does not fall within the second temperature preset range, the vibration frequency of the vibrating element can be controlled with reference to the above step S105.
本申请实施例提供的电子设备的控制方法，通过获取电子设备内的温度，并根据电子设备内的温度是否落入第一预设温度范围的结果，控制振动件以第一预设频率或第二预设频率进行振动，在对电子设备进行散热的过程，也对电子设备的能耗做了分配，可以提高电子设备的续航时间。再根据电子设备内的温度是否落入第二预设温度范围，控制可活动功能模组与壳体的活动关系，可以改变换热孔与外界的连通截面积，提高壳体内空气通过换热孔与外界进行交换的速率，进而提高电子设备的散热效率。The electronic device control method provided in the embodiment of the present application obtains the temperature in the electronic device, and controls the vibrating element to operate at the first preset frequency or the first preset temperature range according to the result of whether the temperature in the electronic device falls into the first preset temperature range. Vibration at the second preset frequency, in the process of cooling the electronic equipment, also allocates the energy consumption of the electronic equipment, which can improve the battery life of the electronic equipment. Then, according to whether the temperature inside the electronic device falls into the second preset temperature range, the activity relationship between the movable functional module and the housing can be controlled to change the communication cross-sectional area between the heat exchange hole and the outside world, and improve the flow of air in the housing through the heat exchange hole. The rate of exchange with the outside world, thereby improving the heat dissipation efficiency of electronic equipment.
作为在本申请实施例中使用的“电子设备”包括，但不限于被设置成经由有线线路连接(如经由公共交换电话网络(Public Switched Telephone Network，PSTN)、数字用户线路(Digital Subscriber Line，DSL)、数字电缆、直接电缆连接，以及/或另一数据连接/网络)和/或经由(例如，针对蜂窝网络、无线局域网(Wireless Local Area Networks，WLAN)、诸如DVB-H网络的数字电视网络、卫星网络、AM-FM广播发送器，以及/或另一通信终端的)无线接口接收/发送通信信号的装置。被设置成通过无线接口通信的通信终端可以被称为“无线通信终端”、“无线终端”以及/或“电子设备”。电子设备的示例包括，但不限于卫星或蜂窝电话；可以组合蜂窝无线电电话与数据处理、传真以及数据通信能力的个人通信系统(Personal Communications Service，PCS)终端；可以包括无线电电话、寻呼机、因特网/内联网接入、Web浏览器、记事簿、日历以及/或全球定位系统(Global PositioningSystem，GPS)接收器的PDA；以及常规膝上型和/或掌上型接收器或包括无线电电话收发器的其它电子装置。"Electronic equipment" as used in the embodiments of this application includes, but is not limited to, configured to be connected via a wired line (such as via a public switched telephone network (Public Switched Telephone Network, PSTN), a digital subscriber line (Digital Subscriber Line, DSL ), digital cable, direct cable connection, and/or another data connection/network) and/or via (for example, for cellular networks, Wireless Local Area Networks (WLAN), digital television networks such as DVB-H networks , a satellite network, an AM-FM broadcast transmitter, and/or a device for receiving/transmitting communication signals via a wireless interface of another communication terminal. Communication terminals arranged to communicate over a wireless interface may be referred to as "wireless communication terminals", "wireless terminals" and/or "electronic devices". Examples of electronic devices include, but are not limited to, satellite or cellular telephones; Personal Communications Service (PCS) terminals that may combine cellular radiotelephones with data processing, facsimile, and data communication capabilities; may include radiotelephones, pagers, Internet/ PDAs with intranet access, web browsers, organizers, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palm-sized receivers or other electronic device.
以上所述仅为本申请的优选实施例而已，并不用于限制本申请，对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。The above descriptions are only preferred embodiments of the present application, and are not intended to limit the present application. For those skilled in the art, there may be various modifications and changes in the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application shall be included within the protection scope of this application.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910412888.2ACN110139538B (en) | 2019-05-17 | 2019-05-17 | Electronic equipment and control method thereof |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910412888.2ACN110139538B (en) | 2019-05-17 | 2019-05-17 | Electronic equipment and control method thereof |
| Publication Number | Publication Date |
|---|---|
| CN110139538Atrue CN110139538A (en) | 2019-08-16 |
| CN110139538B CN110139538B (en) | 2020-09-22 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910412888.2AActiveCN110139538B (en) | 2019-05-17 | 2019-05-17 | Electronic equipment and control method thereof |
| Country | Link |
|---|---|
| CN (1) | CN110139538B (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110536590A (en)* | 2019-08-30 | 2019-12-03 | 联想(北京)有限公司 | Electronic equipment and conference system |
| CN112911112A (en)* | 2021-01-21 | 2021-06-04 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN113419602A (en)* | 2021-06-17 | 2021-09-21 | Oppo广东移动通信有限公司 | Electronic device |
| CN113597192A (en)* | 2020-04-30 | 2021-11-02 | 维沃移动通信有限公司 | Electronic equipment |
| CN113597240A (en)* | 2020-04-30 | 2021-11-02 | 维沃移动通信有限公司 | Shielding cover assembly and electronic equipment |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102645820A (en)* | 2011-02-22 | 2012-08-22 | 鸿富锦精密工业（深圳）有限公司 | camera module |
| CN102841615A (en)* | 2011-06-24 | 2012-12-26 | 中兴通讯股份有限公司 | Method and device for regulating temperature of terminal and terminal |
| CN105007550A (en)* | 2015-07-20 | 2015-10-28 | 朝阳聚声泰（信丰）科技有限公司 | Noise-reduction high-quality receiver |
| CN105159424A (en)* | 2015-09-11 | 2015-12-16 | 小米科技有限责任公司 | Cooling structure, cooling method and device, and mobile device |
| CN205788067U (en)* | 2016-05-04 | 2016-12-07 | 中兴通讯股份有限公司 | Mobile terminal |
| CN207250845U (en)* | 2017-07-26 | 2018-04-17 | 维沃移动通信有限公司 | A kind of Kato ejecting structure and mobile terminal |
| CN108810769A (en)* | 2018-08-03 | 2018-11-13 | 瑞声光电科技(常州)有限公司 | Loud speaker module |
| CN109168294A (en)* | 2018-10-11 | 2019-01-08 | Oppo广东移动通信有限公司 | Electronic device and control method thereof |
| CN109348018A (en)* | 2018-11-29 | 2019-02-15 | 努比亚技术有限公司 | A kind of mobile terminal radiator structure and mobile terminal |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102645820A (en)* | 2011-02-22 | 2012-08-22 | 鸿富锦精密工业（深圳）有限公司 | camera module |
| CN102841615A (en)* | 2011-06-24 | 2012-12-26 | 中兴通讯股份有限公司 | Method and device for regulating temperature of terminal and terminal |
| CN105007550A (en)* | 2015-07-20 | 2015-10-28 | 朝阳聚声泰（信丰）科技有限公司 | Noise-reduction high-quality receiver |
| CN105159424A (en)* | 2015-09-11 | 2015-12-16 | 小米科技有限责任公司 | Cooling structure, cooling method and device, and mobile device |
| CN205788067U (en)* | 2016-05-04 | 2016-12-07 | 中兴通讯股份有限公司 | Mobile terminal |
| CN207250845U (en)* | 2017-07-26 | 2018-04-17 | 维沃移动通信有限公司 | A kind of Kato ejecting structure and mobile terminal |
| CN108810769A (en)* | 2018-08-03 | 2018-11-13 | 瑞声光电科技(常州)有限公司 | Loud speaker module |
| CN109168294A (en)* | 2018-10-11 | 2019-01-08 | Oppo广东移动通信有限公司 | Electronic device and control method thereof |
| CN109348018A (en)* | 2018-11-29 | 2019-02-15 | 努比亚技术有限公司 | A kind of mobile terminal radiator structure and mobile terminal |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110536590A (en)* | 2019-08-30 | 2019-12-03 | 联想(北京)有限公司 | Electronic equipment and conference system |
| CN113597192A (en)* | 2020-04-30 | 2021-11-02 | 维沃移动通信有限公司 | Electronic equipment |
| CN113597240A (en)* | 2020-04-30 | 2021-11-02 | 维沃移动通信有限公司 | Shielding cover assembly and electronic equipment |
| CN113597192B (en)* | 2020-04-30 | 2024-02-02 | 维沃移动通信有限公司 | Electronic equipment |
| CN112911112A (en)* | 2021-01-21 | 2021-06-04 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN113419602A (en)* | 2021-06-17 | 2021-09-21 | Oppo广东移动通信有限公司 | Electronic device |
| Publication number | Publication date |
|---|---|
| CN110139538B (en) | 2020-09-22 |
| Publication | Publication Date | Title |
|---|---|---|
| CN110139538B (en) | Electronic equipment and control method thereof | |
| WO2020140450A1 (en) | Speaker device | |
| CN208675525U (en) | Speakers and Microspeaker Components | |
| CN113016194B (en) | Earphone, earphone control method and system | |
| CN108566602A (en) | Screen assembly, backplane assembly, middle frame assembly, terminal equipment, sound control method and audio equipment | |
| CN210670547U (en) | Speaker device and mobile terminal | |
| CN112911472B (en) | Speaker device and mobile terminal | |
| CN210839669U (en) | Terminal device | |
| CN113660366A (en) | Electronic device and control method of electronic device | |
| CN216437414U (en) | Electronic equipment | |
| CN105848019A (en) | Mobile terminal equipment with closed housing structure | |
| CN207053763U (en) | Loudspeaker assembly and mobile terminal | |
| CN107864258B (en) | Shell assembly of electronic equipment and electronic equipment | |
| CN219370545U (en) | Support board, flexible display and electronic equipment | |
| CN113286029A (en) | Terminal equipment | |
| WO2024037183A1 (en) | Audio output method, electronic device and computer-readable storage medium | |
| CN207304680U (en) | The housing unit of terminal and there is its terminal | |
| CN214507136U (en) | Electronic device | |
| CN107666803A (en) | Housing assembly of terminal and terminal having same | |
| CN115720319A (en) | Electronic equipment | |
| CN210927970U (en) | Terminal device | |
| CN104221398B (en) | Transducer with output window in second plane | |
| CN219938514U (en) | Horn module and terminal equipment | |
| CN206908672U (en) | Waterproof mobile phone | |
| CN113747030B (en) | Camera module and electronic equipment |
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |