技术领域technical field
本公开涉及发光装置以及发光装置的制造方法。The present disclosure relates to a light-emitting device and a method of manufacturing the light-emitting device.
背景技术Background technique
例如专利文献1记载有在发光元件上粘合荧光体板，并由光反射性的白色部件被覆其周围的发光装置。这样的发光装置的上表面由荧光体板所含有的荧光体的颜色(例如黄色)、和白色部件的颜色(白色)这两个颜色构成。For example, Patent Document 1 describes a light-emitting device in which a phosphor plate is bonded to a light-emitting element, and the periphery thereof is covered with a light-reflective white member. The upper surface of such a light-emitting device is composed of two colors, the color of the phosphor contained in the phosphor plate (eg, yellow) and the color of the white member (white).
专利文献1：日本特开2013-12545号公报Patent Document 1: Japanese Patent Laid-Open No. 2013-12545
以往的发光装置例如作为智能手机的相机的闪光灯等照明装置的光源而使用的情况下，在非发光时，导致透镜映入荧光体的颜色和白色部件的颜色。因此，例如，根据智能手机、其外壳的外观设计的不同，以往的发光装置有时在非发光时发光装置的上表面整体未成为波长转换部件的色彩，外观不优选。When a conventional light-emitting device is used as a light source of a lighting device such as a flash of a camera of a smartphone, when it is not emitting light, the lens reflects the color of the phosphor and the color of the white member. Therefore, for example, depending on the appearance design of smartphones and their casings, the entire upper surface of the light-emitting device in the conventional light-emitting device may not have the color of the wavelength conversion member when it is not emitting light, and the appearance is not preferable.
发明内容SUMMARY OF THE INVENTION
本发明的实施方式的课题在于提供在发光时发光区域与非发光区域的对比度大，并且在非发光时发光装置的上表面整体成为波长转换部件的色彩的发光装置以及发光装置的制造方法。An object of the embodiments of the present invention is to provide a light-emitting device and a method of manufacturing the light-emitting device in which the contrast between the light-emitting region and the non-light-emitting region is high when light is emitted, and the entire upper surface of the light-emitting device becomes the color of the wavelength conversion member when non-light-emitting.
本公开的实施方式的发光装置具备：发光元件，其具有发光面和侧面；反射部件，其设置于上述发光元件的侧面；波长转换部件，其设置在上述发光元件的发光面上以及上述反射部件上；以及被覆部件，其对上述波长转换部件的外侧面的从上端至下端进行被覆，上述被覆部件含有反射物质以及着色物质，上述波长转换部件的体色与上述被覆部件的体色为同系色。A light-emitting device according to an embodiment of the present disclosure includes: a light-emitting element having a light-emitting surface and a side surface; a reflection member provided on the side surface of the light-emitting element; a wavelength conversion member provided on the light-emitting surface of the light-emitting element and the reflection member and a covering member covering from the upper end to the lower end of the outer surface of the wavelength conversion member, the covering member contains a reflective substance and a coloring substance, and the body color of the wavelength conversion member and the body color of the covering member are the same color .
本公开的实施方式的发光装置的制造方法包括：在具有第一面和与上述第一面的相反一侧的第二面的波长转换部件的上述第一面以使发光面与上述第一面对面的方式载置发光元件的工序；由反射部件来被覆上述发光元件的工序；将上述发光元件的周围的上述波长转换部件的一部分除去，并使上述波长转换部件的外侧面露出的工序；以及通过含有反射物质以及着色物质且体色为与上述波长转换部件的体色同系色的被覆部件来被覆上述波长转换部件的外侧面的工序。A method of manufacturing a light-emitting device according to an embodiment of the present disclosure includes: aligning the light-emitting surface with the first surface on the first surface of the wavelength conversion member having a first surface and a second surface opposite to the first surface a step of placing a light-emitting element in a manner; a step of covering the light-emitting element with a reflective member; a step of removing a part of the wavelength conversion member around the light-emitting element and exposing the outer surface of the wavelength conversion member; and A step of covering the outer surface of the wavelength conversion member with a covering member containing a reflective material and a coloring material and having a body color of the same color as the body color of the wavelength conversion member.
根据本发明的实施方式的发光装置，能够使发光时发光区域与非发光区域的对比度变大，并且能够使非发光时发光装置的上表面整体成为波长转换部件的色彩。According to the light-emitting device according to the embodiment of the present invention, the contrast between the light-emitting region and the non-light-emitting region can be increased during light emission, and the entire upper surface of the light-emitting device during non-light emission can be made into the color of the wavelength conversion member.
根据本发明的实施方式的发光装置的制造方法，能够获得发光时的发光区域与非发光区域的对比度变大并且非发光时发光装置的上表面整体成为波长转换部件的色彩的发光装置。According to the method for manufacturing a light-emitting device according to an embodiment of the present invention, a light-emitting device in which the contrast between the light-emitting region and the non-light-emitting region during light emission is increased and the entire upper surface of the light-emitting device becomes the color of the wavelength conversion member when not light-emitting can be obtained.
附图说明Description of drawings
图1A是示意性地示出实施方式的发光装置的结构的立体图。FIG. 1A is a perspective view schematically showing the structure of a light-emitting device according to the embodiment.
图1B是图1A的IB-IB线的剖视图。FIG. 1B is a cross-sectional view taken along line IB-IB of FIG. 1A .
图1C是示意性地示出实施方式的发光装置的结构的俯视图。1C is a plan view schematically showing the structure of the light-emitting device of the embodiment.
图1D是示意性地示出实施方式的发光装置的结构的仰视图。1D is a bottom view schematically showing the structure of the light-emitting device of the embodiment.
图2是示意性地示出蒙塞尔色彩体系的色相的等色相面(5Y)的图。FIG. 2 is a diagram schematically showing the isohue plane (5Y) of the hue of the Munsell color system.
图3是实施方式的发光装置的制造方法的流程图。3 is a flowchart of a method of manufacturing the light-emitting device according to the embodiment.
图4A是表示在实施方式的发光装置的制造方法中在片材上形成波长转换部件的工序的剖视图。4A is a cross-sectional view showing a step of forming a wavelength conversion member on a sheet in the method of manufacturing a light-emitting device according to the embodiment.
图4B是表示在实施方式的发光装置的制造方法中载置发光元件的工序的剖视图。4B is a cross-sectional view showing a step of placing a light-emitting element in the method of manufacturing the light-emitting device according to the embodiment.
图4C是表示在实施方式的发光装置的制造方法中由反射部件被覆发光元件等的工序的剖视图。4C is a cross-sectional view showing a step of covering a light-emitting element and the like with a reflective member in the method of manufacturing the light-emitting device according to the embodiment.
图5A是表示在实施方式的发光装置的制造方法中使波长转换部件的外侧面露出的工序的剖视图。5A is a cross-sectional view showing a step of exposing the outer surface of the wavelength conversion member in the method of manufacturing the light-emitting device according to the embodiment.
图5B是表示在实施方式的发光装置的制造方法中使波长转换部件的外侧面露出的工序的俯视图。5B is a plan view showing a step of exposing the outer surface of the wavelength conversion member in the method of manufacturing the light-emitting device according to the embodiment.
图6A是表示在实施方式的发光装置的制造方法中，通过被覆部件来被覆波长转换部件的外侧面的工序的剖视图。6A is a cross-sectional view showing a step of covering the outer surface of the wavelength conversion member with a covering member in the method of manufacturing the light-emitting device according to the embodiment.
图6B是表示在实施方式的发光装置的制造方法中，使电极从反射部件露出的工序的剖视图。6B is a cross-sectional view showing a step of exposing electrodes from a reflective member in the method of manufacturing the light-emitting device according to the embodiment.
图7A是表示在实施方式的发光装置的制造方法中转印于其他片材的工序的剖视图。7A is a cross-sectional view showing a step of transferring to another sheet in the method of manufacturing the light-emitting device according to the embodiment.
图7B是表示在实施方式的发光装置的制造方法中对发光装置的上表面进行整理的工序的剖视图。7B is a cross-sectional view showing a step of finishing the upper surface of the light-emitting device in the method of manufacturing the light-emitting device according to the embodiment.
图7C是表示在实施方式的发光装置的制造方法中按每个装置进行切断的工序的剖视图。7C is a cross-sectional view showing a step of cutting for each device in the method of manufacturing the light-emitting device according to the embodiment.
图8A是示意性地示出其他实施方式的发光装置的结构的剖视图。8A is a cross-sectional view schematically showing the structure of a light-emitting device according to another embodiment.
图8B是示意性地示出其他实施方式的发光装置的结构的剖视图。8B is a cross-sectional view schematically showing the structure of a light-emitting device according to another embodiment.
图9A是表示在实施方式的发光装置的其他制造方法中使波长转换部件的外侧面露出的工序的剖视图。9A is a cross-sectional view showing a step of exposing the outer surface of the wavelength conversion member in another method of manufacturing the light-emitting device according to the embodiment.
图9B是表示在实施方式的发光装置的其他制造方法中由被覆部件被覆波长转换部件的外侧面的工序的剖视图。9B is a cross-sectional view showing a step of covering the outer surface of the wavelength conversion member with a covering member in another method of manufacturing the light-emitting device according to the embodiment.
图10A是表示在实施方式的发光装置的其他制造方法中使电极从反射部件露出的工序的剖视图。10A is a cross-sectional view showing a step of exposing electrodes from a reflective member in another method of manufacturing the light-emitting device according to the embodiment.
图10B是表示在实施方式的发光装置的其他制造方法中转印于其他片材的工序的剖视图。10B is a cross-sectional view showing a step of transferring to another sheet in another method of manufacturing the light-emitting device of the embodiment.
图10C是表示在实施方式的发光装置的其他制造方法中按每个装置进行切断的工序的剖视图。10C is a cross-sectional view showing a step of cutting for each device in another method of manufacturing the light-emitting device according to the embodiment.
图11是示意性地示出其他实施方式的发光装置的结构的剖视图。11 is a cross-sectional view schematically showing the structure of a light-emitting device according to another embodiment.
图12是图11的其他实施方式的发光装置的制造方法的流程图。FIG. 12 is a flowchart of a method of manufacturing the light-emitting device of another embodiment of FIG. 11 .
图13A是表示在图11的其他实施方式的发光装置的制造方法中准备被覆部件的工序的剖视图。13A is a cross-sectional view showing a step of preparing a covering member in the method of manufacturing the light-emitting device of another embodiment of FIG. 11 .
图13B是表示在图11的其他实施方式的发光装置的制造方法中在被覆部件设置贯通孔的工序的剖视图。13B is a cross-sectional view showing a step of providing a through hole in a covering member in the method of manufacturing the light-emitting device according to the other embodiment of FIG. 11 .
图13C是表示在图11的其他实施方式的发光装置的制造方法中填充波长转换部件的工序的剖视图。13C is a cross-sectional view showing a step of filling the wavelength conversion member in the method of manufacturing the light-emitting device of another embodiment of FIG. 11 .
图14A是表示在图11的其他实施方式的发光装置的制造方法中载置发光元件的工序的剖视图。14A is a cross-sectional view showing a step of placing a light-emitting element in the method of manufacturing the light-emitting device of another embodiment of FIG. 11 .
图14B是表示在图11的其他实施方式的发光装置的制造方法中由反射部件来被覆发光元件等的工序的剖视图。14B is a cross-sectional view showing a step of covering a light-emitting element and the like with a reflective member in the method of manufacturing the light-emitting device of the other embodiment of FIG. 11 .
图14C是表示在图11的其他实施方式的发光装置的制造方法中使电极从反射部件露出的工序的剖视图。14C is a cross-sectional view showing a step of exposing electrodes from a reflective member in the method of manufacturing the light-emitting device of another embodiment of FIG. 11 .
图15是示意性地示出其他实施方式的发光装置的结构的剖视图。15 is a cross-sectional view schematically showing the structure of a light-emitting device according to another embodiment.
图16是图15的其他实施方式的发光装置的制造方法的流程图。FIG. 16 is a flowchart of a method of manufacturing the light-emitting device of another embodiment of FIG. 15 .
图17A是表示在图15的其他实施方式的发光装置的制造方法中配置透光材料层叠片材的工序的剖视图。17A is a cross-sectional view showing a step of arranging a light-transmitting material laminated sheet in the method of manufacturing a light-emitting device of another embodiment of FIG. 15 .
图17B是表示在图15的其他实施方式的发光装置的制造方法中由被覆部件被覆的工序的剖视图。17B is a cross-sectional view showing a step of covering with a covering member in the method of manufacturing the light-emitting device of another embodiment of FIG. 15 .
图17C是表示在图15的其他实施方式的发光装置的制造方法中使透光层露出的工序的剖视图。17C is a cross-sectional view showing a step of exposing the light-transmitting layer in the method of manufacturing the light-emitting device according to another embodiment of FIG. 15 .
图17D是表示在图15的其他实施方式的发光装置的制造方法中载置发光元件的工序的剖视图。17D is a cross-sectional view showing a step of placing a light-emitting element in the method of manufacturing the light-emitting device of another embodiment of FIG. 15 .
图18A是表示在图15的其他实施方式的发光装置的制造方法中由反射部件被覆的工序的剖视图。18A is a cross-sectional view showing a step of covering with a reflective member in the method of manufacturing the light-emitting device according to another embodiment of FIG. 15 .
图18B是表示在图15的其他实施方式的发光装置的制造方法中使电极露出的工序的剖视图。18B is a cross-sectional view showing a step of exposing electrodes in the method of manufacturing the light-emitting device of the other embodiment of FIG. 15 .
图18C是表示在图15的其他实施方式的发光装置的制造方法中进行切断的工序的剖视图。18C is a cross-sectional view showing a step of cutting in the method of manufacturing the light-emitting device of another embodiment of FIG. 15 .
图19A是示意性地示出其他实施方式的发光装置的结构的剖视图。19A is a cross-sectional view schematically showing the structure of a light-emitting device according to another embodiment.
图19B是示意性地示出其他实施方式的发光装置的结构的剖视图。19B is a cross-sectional view schematically showing the structure of a light-emitting device according to another embodiment.
附图标记说明Description of reference numerals
1...发光元件；1a...发光元件的发光面；2...反射部件；2c...反射部件的外侧面；3...波长转换部件；3a...波长转换部件的第一面；3b...波长转换部件的第二面；3c...波长转换部件的外侧面；5...被覆部件；6...导光部件；7...透光层；11、12...电极；16...被覆部件的贯通孔；17、18...板状部件；20、21...片材；25...透光材料层叠片材；30...凹部；31...切断槽；41...反射层；42...金属层；43...电介质层；100、100A、100B、100C、100D、100E、100F...发光装置；a...特定的色彩；A...色彩的范围。1...light-emitting element; 1a...light-emitting surface of the light-emitting element; 2...reflecting member; 2c...outer side of the reflecting member; 3...wavelength converting member; 3a...the wavelength converting member the first surface; 3b...the second surface of the wavelength conversion member; 3c...the outer side of the wavelength conversion member; 5...the covering member; 6...the light guide member; 7...the light-transmitting layer; 11, 12...electrodes; 16...through holes of the covering member; 17, 18...plate-like members; 20, 21...sheets; 25...light-transmitting material laminated sheets; 30. ..recess; 31...cutting groove; 41...reflection layer; 42...metal layer; 43...dielectric layer; ;a...specific color; A...range of colors.
具体实施方式Detailed ways
<实施方式><Embodiment>
以下，参照附图对实施方式进行说明。但是，以下所示的方式例示出用于将本实施方式的技术思想具体化的发光装置以及发光装置的制造方法，不限定于以下内容。另外，实施方式所记载的结构部件的尺寸、材质、形状、其相对的配置等只要没有特定的记载，则不旨在将本发明的范围限定于此，只不过是单纯的例示。此外，各附图所表示的部件的大小、位置关系等有时为了使说明明确而进行夸张。Hereinafter, embodiments will be described with reference to the drawings. However, the modes shown below illustrate the light-emitting device and the method for manufacturing the light-emitting device for embodying the technical idea of the present embodiment, and are not limited to the following. In addition, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention, unless otherwise specified, but are merely illustrative. In addition, the size, positional relationship, etc. of the components shown in each drawing may be exaggerated in order to clarify the description.
[发光装置][Light-emitting device]
首先，对实施方式的发光装置进行说明。First, the light-emitting device of the embodiment will be described.
如图1A～图1D所示，发光装置100具备发光元件1、反射部件2、波长转换部件3以及被覆部件5。另外，发光装置100在发光元件1的侧面设置有导光部件6。As shown in FIGS. 1A to 1D , the light-emitting device 100 includes a light-emitting element 1 , a reflection member 2 , a wavelength conversion member 3 , and a covering member 5 . In addition, the light emitting device 100 is provided with the light guide member 6 on the side surface of the light emitting element 1 .
发光装置100的上表面由发光区域和非发光区域构成。此外，发光区域是在发光装置100的上表面中发光时进行发光的区域(例如，波长转换部件3)，非发光区域是发光区域以外的区域(例如，被覆部件5)。The upper surface of the light-emitting device 100 is composed of a light-emitting region and a non-light-emitting region. In addition, the light-emitting region is a region that emits light when light is emitted on the upper surface of the light-emitting device 100 (eg, the wavelength conversion member 3 ), and the non-light-emitting region is a region other than the light-emitting region (eg, the covering member 5 ).
(发光元件)(light emitting element)
发光元件1能够使用LED元件等半导体发光元件。发光元件1只要是在由各种半导体构成的元件构造设置有正负一对电极11、12的元件即可。特别优选发光元件1为能够高效地激发荧光体的氮化物半导体(InxAlyGa1-x-yN，0≤x，0≤y，x+y≤1)。此外，发光元件1也可以是硫化锌系半导体、硒化锌系半导体、碳化硅系半导体。As the light-emitting element 1, a semiconductor light-emitting element such as an LED element can be used. The light-emitting element 1 should just be an element provided with a pair of positive and negative electrodes 11 and 12 in an element structure composed of various semiconductors. In particular, it is preferable that the light-emitting element 1 is a nitride semiconductor (InxAlyGa1-xyN, 0≤x, 0≤y,x +y≤1) capable of efficiently exciting a phosphor. In addition, the light-emitting element 1 may be a zinc sulfide-based semiconductor, a zinc selenide-based semiconductor, or a silicon carbide-based semiconductor.
(反射部件)(reflecting part)
反射部件2是用于使来自发光元件1的光反射并经由波长转换部件3而将光取出的部件。反射部件2是用于使发光元件1发出并向横向或者下方行进的光向发光装置100的发光区域亦即波长转换部件3侧反射的部件。The reflection member 2 is a member for reflecting the light from the light-emitting element 1 and extracting the light through the wavelength conversion member 3 . The reflecting member 2 is a member for reflecting the light emitted from the light emitting element 1 and traveling in the lateral direction or downward toward the wavelength conversion member 3 , which is the light emitting region of the light emitting device 100 .
反射部件2设置于发光元件1的侧面以及波长转换部件3的下方。具体而言，反射部件2被覆发光元件1的下表面(电极11、12侧)。并且，对于反射部件2而言，对发光元件1的侧面中的由导光部件6被覆的区域以经由导光部件6包围的方式进行被覆，对未由导光部件6被覆的区域直接覆盖发光元件侧面。The reflection member 2 is provided on the side surface of the light emitting element 1 and below the wavelength conversion member 3 . Specifically, the reflection member 2 covers the lower surface (the electrodes 11 and 12 side) of the light-emitting element 1 . In addition, the reflection member 2 covers the area covered by the light guide member 6 on the side surface of the light emitting element 1 so as to be surrounded by the light guide member 6 , and directly covers the area not covered by the light guide member 6 to emit light. element side.
此外，反射部件2经由在发光元件1的侧面形成的导光部件6设置，但也可以不设置导光部件6，而直接设置于发光元件1的侧面。In addition, the reflection member 2 is provided via the light guide member 6 formed on the side surface of the light emitting element 1 , but the light guide member 6 may not be provided, but may be provided directly on the side surface of the light emitting element 1 .
反射部件2例如是含有反射物质的树脂层。反射部件2也可以构成为在母材或者成为粘合剂的树脂除了反射物质之外还含有填充剂。The reflective member 2 is, for example, a resin layer containing a reflective substance. The reflective member 2 may be configured to contain a filler in addition to the reflective material in the base material or the resin serving as the binder.
粘合剂是用于使上述的反射物质、填充剂作为反射部件2而与发光元件1的侧面以及下表面(电极11、12侧)粘结的树脂。作为成为粘合剂的树脂，例如可举出：聚碳酸酯树脂、环氧树脂、酚醛树脂、有机硅树脂、丙烯酸树脂、TPX树脂、聚降冰片烯树脂、聚氨酯树脂等。或者，作为成为粘合剂的树脂，例如可举出这些变性树脂、或含有一种以上这些树脂的混合树脂。其中，有机硅树脂或者其变性树脂耐热性、耐光性优异，固化后的体积收缩小，从而优选。The adhesive is a resin for bonding the above-mentioned reflective material and filler as the reflective member 2 to the side surface and the lower surface (the electrodes 11 and 12 side) of the light-emitting element 1 . As resin which becomes a binder, a polycarbonate resin, an epoxy resin, a phenol resin, a silicone resin, an acrylic resin, a TPX resin, a polynorbornene resin, a urethane resin, etc. are mentioned, for example. Alternatively, examples of resins used as binders include these modified resins and mixed resins containing one or more of these resins. Among them, silicone resins or modified resins thereof are preferable because they are excellent in heat resistance and light resistance, and have small volume shrinkage after curing.
反射物质是使发光元件1发射的光反射的物质。作为反射物质，例如，可举出：二氧化硅、氧化钛、氧化硅、氧化铝、钛酸钾、氧化锌、氮化硼等。另外，也可以使用硅胶粉末等树脂的粉末。The reflective substance is a substance that reflects the light emitted by the light-emitting element 1 . Examples of the reflective material include silica, titanium oxide, silicon oxide, aluminum oxide, potassium titanate, zinc oxide, boron nitride, and the like. Moreover, resin powder, such as a silica gel powder, can also be used.
填充剂是为了提高作为树脂层的反射部件2的强度，或者为了提高反射部件2的导热率等理由而添加的制剂。作为填充剂，例如可举出玻璃纤维、晶须、氧化铝、氧化硅、氮化硼、氧化锌、氮化铝等。The filler is a preparation added for the purpose of increasing the strength of the reflective member 2 serving as the resin layer, or for the purpose of increasing the thermal conductivity of the reflective member 2 or the like. As a filler, glass fiber, whisker, alumina, silicon oxide, boron nitride, zinc oxide, aluminum nitride, etc. are mentioned, for example.
(导光部件)(light guide part)
导光部件6是使得从发光元件1容易取出光，并将来自发光元件1的光向波长转换部件3导光的部件。导光部件6能够提高光束以及光的提取效率。The light guide member 6 is a member that facilitates extraction of light from the light emitting element 1 and guides the light from the light emitting element 1 to the wavelength conversion member 3 . The light guide member 6 can improve the extraction efficiency of light beams and light.
导光部件6由使波长转换部件3与发光元件1接合的粘合部件攀爬在发光元件1的侧面而形成(制造时以上下颠倒的状态制造)。The light guide member 6 is formed by climbing on the side surface of the light emitting element 1 by an adhesive member for joining the wavelength conversion member 3 and the light emitting element 1 (manufactured in an upside-down state during manufacture).
作为导光部件6，例如能够使用透光性的树脂材料。另外，导光部件6可举出上述的反射部件2的母材或者成为粘合剂的树脂等透光性粘合材料。另外，也可以含有二氧化硅、氧化钛、氧化硅、氧化铝、钛酸钾、氧化锌、氮化硼等扩散剂。由此，能够更均衡地使光向波长转换部件3入射，能够抑制发光装置100的颜色不均。As the light guide member 6, for example, a translucent resin material can be used. In addition, the light guide member 6 may be a base material of the above-mentioned reflection member 2 or a translucent adhesive material such as a resin used as an adhesive. In addition, diffusing agents such as silica, titanium oxide, silicon oxide, aluminum oxide, potassium titanate, zinc oxide, and boron nitride may be contained. Thereby, light can be made incident on the wavelength conversion member 3 in a more balanced manner, and color unevenness of the light-emitting device 100 can be suppressed.
如图1B所示，导光部件6以在剖面视部件宽度从发光元件1的下表面(电极11、12侧)朝向波长转换部件3变宽的方式以三角形状形成。通过成为这样的方式，从而光束以及光的提取效率进一步提高。但是，导光部件6的形状未特别规定。例如，导光部件6的形状也可以在反射部件2侧为凸形状，在发光元件1侧为凹形状。As shown in FIG. 1B , the light guide member 6 is formed in a triangular shape so that the member width in cross-sectional view becomes wider from the lower surface (the electrodes 11 and 12 side) of the light emitting element 1 toward the wavelength conversion member 3 . By adopting such an aspect, the extraction efficiency of the light beam and light is further improved. However, the shape of the light guide member 6 is not particularly defined. For example, the shape of the light guide member 6 may be a convex shape on the side of the reflection member 2 and a concave shape on the side of the light emitting element 1 .
导光部件6也可以被覆发光元件1的侧面的一部分，从提高光束以及光的提取效率的观点出发，更优选被覆发光元件1的侧面的大致全部。The light guide member 6 may cover a part of the side surface of the light emitting element 1 , and more preferably covers substantially the entire side surface of the light emitting element 1 from the viewpoint of improving the extraction efficiency of light flux and light.
另外，导光部件6也可以配置于波长转换部件3与发光元件1之间。In addition, the light guide member 6 may be arranged between the wavelength conversion member 3 and the light emitting element 1 .
(波长转换部件)(wavelength conversion part)
波长转换部件3是含有对发光元件1所发出的波长的光的一部分进行吸收，并转换为不同波长的光而发光的波长转换物质的部件。波长转换部件3所使用的波长转换物质例如是荧光体。以下，对波长转换物质为荧光体的情况进行说明。The wavelength conversion member 3 is a member containing a wavelength conversion material that absorbs a part of the light of the wavelength emitted by the light-emitting element 1, converts it into light of a different wavelength, and emits light. The wavelength conversion substance used for the wavelength conversion member 3 is, for example, a phosphor. Hereinafter, the case where the wavelength conversion material is a phosphor will be described.
波长转换部件3设置在发光元件1的发光面上以及反射部件2上。The wavelength conversion member 3 is provided on the light emitting surface of the light emitting element 1 and on the reflection member 2 .
波长转换部件3的下表面、即与发光元件1的发光面对面的面形成为比发光元件1的上表面亦即发光面大。The lower surface of the wavelength conversion member 3 , that is, the surface facing the light-emitting element 1 , which is the surface, is formed to be larger than the upper surface of the light-emitting element 1 , that is, the light-emitting surface.
波长转换部件3的母材或者粘合剂优选由透光性的树脂形成。作为这里的树脂，例如可举出：上述的反射部件2的母材或者成为粘合剂的树脂。其中，有机硅树脂或者其变性树脂耐热性、耐光性优异，固化后的体积收缩少，从而优选。另外，波长转换部件3的母材或者粘合剂也可以除了树脂之外还由玻璃形成。The base material or the binder of the wavelength conversion member 3 is preferably formed of a translucent resin. As resin here, the base material of the above-mentioned reflection member 2, or the resin used as a binder is mentioned, for example. Among them, silicone resins or modified resins thereof are preferable because they are excellent in heat resistance and light resistance, and have little volume shrinkage after curing. In addition, the base material or the binder of the wavelength conversion member 3 may be formed of glass other than resin.
作为波长转换部件3所含有的荧光体，例如，可举出以铈激活的钇铝石榴石、以铈激活的镥铝石榴石、以铈激活的铽铝石榴石、以铕和铬中的任一个或者两个激活的含氮的硅铝酸钙、以铕激活的赛隆、以铕激活的硅酸盐、以锰激活的氟硅酸钾等。Examples of the phosphor contained in the wavelength conversion member 3 include cerium-activated yttrium-aluminum garnet, cerium-activated lutetium-aluminum garnet, cerium-activated terbium-aluminum garnet, and any of europium and chromium. One or two activated nitrogen containing calcium aluminosilicate, europium activated sialon, europium activated silicate, manganese activated potassium fluorosilicate, etc.
这里，如后述那样，只要波长转换部件3的体色与被覆部件5的体色为同系色，则荧光体本身的体色也可以是任意颜色。体色是指发光装置100的非发光时的部件本身的色彩。Here, as will be described later, as long as the body color of the wavelength conversion member 3 and the body color of the covering member 5 are the same color, the body color of the phosphor itself may be any color. The body color refers to the color of the components themselves when the light-emitting device 100 is not emitting light.
例如，在荧光体本身的体色使用了白色系的荧光体的情况下，波长转换部件3的体色成为白色系。因此，如后述那样，若使波长转换部件3的体色和被覆部件5的体色成为同系色，则非发光时发光装置100的上表面整体成为白色系的色彩。For example, when a white-based phosphor is used for the body color of the phosphor itself, the body color of the wavelength conversion member 3 is white-based. Therefore, as will be described later, if the body color of the wavelength conversion member 3 and the body color of the covering member 5 are the same color, the entire upper surface of the light emitting device 100 becomes a white color when not emitting light.
在将发光装置100例如用作相机的闪光灯等照明装置的白色光的光源的情况下，优选使用发光色为蓝色系的发光元件、和发光色为黄色系且体色为黄色系的荧光体。另外，优选使用发光色为蓝色系的发光元件、和发光色为橙色系且体色为橙色系的荧光体。For example, when the light-emitting device 100 is used as a light source of white light of an illuminating device such as a flash of a camera, it is preferable to use a light-emitting element whose emission color is blue, and a phosphor whose emission color is yellow and whose body color is yellow. . In addition, it is preferable to use a light-emitting element whose emission color is blue-based, and a phosphor whose emission color is orange-based and whose body color is orange-based.
作为体色为黄色系且发光色为黄色的荧光体，例如可举出：钇铝石榴石系荧光体(YAG系荧光体)、镥铝石榴石系荧光体(LAG系荧光体)、铽铝石榴石系荧光体(TAG系荧光体)等。另外，作为体色为黄色系且发光色为红色系的荧光体，可举出KSF。这些荧光体的体色在后述的蒙塞尔色彩体系(20色相)的蒙塞尔色环中为10Y或者5Y。Examples of phosphors whose body color is yellow and whose emission color is yellow include yttrium aluminum garnet-based phosphors (YAG-based phosphors), lutetium-aluminum garnet-based phosphors (LAG-based phosphors), terbium aluminum Garnet-based phosphors (TAG-based phosphors) and the like. Moreover, KSF is mentioned as a phosphor whose body color is yellow and its emission color is red. The body color of these phosphors is 10Y or 5Y on the Munsell color circle of the Munsell color system (20 hues) described later.
作为体色为橙色系且发光色为红色系的荧光体，例如可举出SCASN、CASN等。这些荧光体的体色在后述的蒙塞尔色彩体系(20色相)的蒙塞尔色环中为10YR或者5YR。Examples of phosphors whose body color is orange and whose emission color is red include SCASN, CASN, and the like. The body color of these phosphors is 10YR or 5YR on the Munsell color circle of the Munsell color system (20 hues) described later.
另外，将发光色为黄色系荧光体且发光色为红色系荧光体混合，能够使发光色成为橙色系的荧光体。In addition, by mixing a yellow-based phosphor with a light-emitting color and a red-based phosphor with a light-emitting color, the light-emitting color can be an orange-based phosphor.
另外，作为荧光体本身的体色为黄色系的荧光体以及橙色系的荧光体的颜色，例如可举出：后述的蒙塞尔色彩体系(20色相)的蒙塞尔色环中5YR、10YR、5Y、10Y的色相。In addition, as the body color of the phosphor itself, the color of the yellow-based phosphor and the orange-based phosphor includes, for example, 5YR, 5YR in the Munsell color circle of the Munsell color system (20 hues) described later, Hue of 10YR, 5Y, 10Y.
在作为荧光体本身的颜色为黄色系的荧光体的情况下，例如为10Y、5Y。在作为荧光体本身的颜色为橙色系的荧光体的情况下，例如为10YR、5YR。将荧光体本身的体色为黄色系的荧光体，且在蒙塞尔色彩体系(20色相)的蒙塞尔色环中为5Y的情况作为例子，以下进行说明。In the case of a yellow-based phosphor as the color of the phosphor itself, it is, for example, 10Y and 5Y. In the case of an orange-based phosphor as the color of the phosphor itself, it is, for example, 10YR and 5YR. A case where the body color of the phosphor itself is a yellow-based phosphor and is 5Y on the Munsell color circle of the Munsell color system (20 hues) will be described below as an example.
在蒙塞尔色彩体系中，明度例如为7以上且9以下。In the Munsell color system, the lightness is, for example, 7 or more and 9 or less.
另外，在蒙塞尔色彩体系中，彩度例如为4以上且14以下。In addition, in the Munsell color system, the saturation is, for example, 4 or more and 14 or less.
另外，如后述那样，在被覆部件5包含波长转换物质的情况下，波长转换部件3优选包含与被覆部件5所含的波长转换物质的组成相同的波长转换物质。根据这样的结构，非发光时的发光装置100的上表面整体的色彩容易成为与波长转换部件3的色彩相同。In addition, when the covering member 5 contains a wavelength converting substance as described later, it is preferable that the wavelength converting member 3 contains a wavelength converting substance having the same composition as the wavelength converting substance contained in the covering member 5 . With such a configuration, the color of the entire upper surface of the light-emitting device 100 when not emitting light tends to be the same as the color of the wavelength conversion member 3 .
波长转换部件3也可以含有扩散剂。扩散剂是为了使发光元件1以及荧光体的发出光高效地扩散而添加。作为扩散剂，例如可举出与上述的反射部件2的反射物质相同的物质。The wavelength conversion member 3 may contain a diffusing agent. The diffusing agent is added in order to efficiently diffuse the emitted light of the light-emitting element 1 and the phosphor. As a diffusing agent, the same thing as the reflection material of the above-mentioned reflection member 2 is mentioned, for example.
波长转换部件3的上下方向的厚度能够根据荧光体的含量、发光元件1发出的光与波长转换后的光的混色后的色调等来决定，但例如能够为50μm以上且300μm以下。The thickness in the vertical direction of the wavelength conversion member 3 can be determined according to the content of the phosphor, the color tone of the light emitted from the light emitting element 1 and the wavelength-converted light after color mixing, and the like, but can be, for example, 50 μm or more and 300 μm or less.
(被覆部件)(covered parts)
被覆部件5是被覆波长转换部件3的外侧面以及反射部件2的外侧面的部件。这里，被覆部件5被覆波长转换部件3的外侧面的从上端直至下端，并且被覆反射部件2的外侧面的从上端直至下端。被覆部件5形成发光装置100的侧面的一部分。The covering member 5 is a member covering the outer surface of the wavelength conversion member 3 and the outer surface of the reflection member 2 . Here, the covering member 5 covers the outer surface of the wavelength conversion member 3 from the upper end to the lower end, and covers the outer surface of the reflection member 2 from the upper end to the lower end. The covering member 5 forms a part of the side surface of the light emitting device 100 .
被覆部件5例如为树脂层。作为用作被覆部件5的母材或者粘合剂的树脂，例如可举出：成为上述的反射部件2的母材或者粘合剂的树脂。其中，环氧树脂或者其变性树脂粘合性、气体阻隔性优异，从而优选。另外，有机硅树脂或者其变性树脂耐热性、耐光性优异，固化后的体积收缩少，从而优选。The covering member 5 is, for example, a resin layer. As the resin used as the base material or the binder of the covering member 5, for example, the resin used as the base material or the binder of the above-mentioned reflection member 2 can be mentioned. Among them, epoxy resins or modified resins thereof are preferable because they are excellent in adhesiveness and gas barrier properties. In addition, silicone resins or modified resins thereof are preferable because they are excellent in heat resistance and light resistance, and have little volume shrinkage after curing.
被覆部件5包括反射物质以及着色物质。The covering member 5 includes a reflective material and a coloring material.
作为反射物质，例如可举出能够用于反射部件2的反射物质。As a reflection material, the reflection material which can be used for the reflection member 2 is mentioned, for example.
反射物质相对于被覆部件5的含量优选相对于被覆部件5的全质量为30质量％以上且70质量％以下。若反射物质相对于被覆部件5的含量为30质量％以上，则能够使发光时的发光区域与非发光区域的对比度进一步变大。另一方面，若反射物质相对于被覆部件5的含量为70质量％以下，则经济性提高。The content of the reflective material with respect to the covering member 5 is preferably 30 mass % or more and 70 mass % or less with respect to the total mass of the covering member 5 . When the content of the reflective material with respect to the covering member 5 is 30 mass % or more, the contrast between the light-emitting region and the non-light-emitting region during light emission can be further increased. On the other hand, when the content of the reflective material with respect to the covering member 5 is 70 mass % or less, the economical efficiency is improved.
着色物质包括波长转换物质、颜料以及染料的任一个。作为波长转换物质，可举出与波长转换部件3所含有的波长转换物质相同的物质。The coloring substance includes any of wavelength conversion substances, pigments, and dyes. As the wavelength conversion substance, the same thing as the wavelength conversion substance contained in the wavelength conversion member 3 is mentioned.
作为颜料，未特别限定，例如有使用了无机系材料、有机系材料的颜料，可举出使用了以下的材料的颜料。Although it does not specifically limit as a pigment, For example, the pigment using an inorganic type material and an organic type material is mentioned, and the pigment using the following materials is mentioned.
作为无机系材料，例如可举出：红色氧化物(Fe2O3)、铅丹(Pb3O4)、钛镍锑系氧化物、钛镍钡系氧化物、钛铬锑系氧化物、钛铬铌系氧化物等。Examples of inorganic materials include red oxides (Fe2 O3 ), lead red (Pb3 O4 ), titanium-nickel-antimony-based oxides, titanium-nickel-barium-based oxides, titanium-chromium-antimony-based oxides, Titanium-chromium-niobium oxides, etc.
作为有机系材料，例如可举出：蒽醌系、偶氮系、喹吖啶酮系、二萘嵌苯系、吡咯并吡咯二酮系、单偶氮系、双偶氮系、吡唑啉酮系、苯并咪唑酮系、喹喔啉系、偶氮甲碱系、异吲哚啉酮系、异吲哚啉系等。Examples of organic materials include anthraquinone-based, azo-based, quinacridone-based, perylene-based, diketopyrrolopyrrole-based, monoazo-based, disazo-based, and pyrazoline Ketone series, benzimidazolone series, quinoxaline series, azomethine series, isoindolinone series, isoindoline series, etc.
作为染料，未特别限定，但例如可举出：蒽醌系染料、次甲基系染料、偶氮甲碱系染料、噁嗪系染料、偶氮系染料、苯乙烯系染料、香豆素系染料、卟啉系染料、二苯并呋喃酮系染料、吡咯并吡咯二酮系染料、罗丹明系染料、呫吨系染料、吡咯亚甲基系染料等。The dye is not particularly limited, and examples thereof include anthraquinone-based dyes, methine-based dyes, azomethine-based dyes, oxazine-based dyes, azo-based dyes, styrene-based dyes, and coumarin-based dyes. Dyes, porphyrin-based dyes, dibenzofuranone-based dyes, diketopyrrolopyrrole-based dyes, rhodamine-based dyes, xanthene-based dyes, pyrrolomethylene-based dyes, and the like.
此外，颜料以及染料基本上不将来自发光元件1的光转换为不同波长为佳。In addition, it is preferable that the pigments and dyes do not substantially convert the light from the light-emitting element 1 to different wavelengths.
波长转换部件3的体色与被覆部件5的体色为同系色。这里，同系色是指：在蒙塞尔色彩体系(20色相)中，色相：色相环(20值域)的3值域以内，明度：3值域以内，彩度：3值域以内。The body color of the wavelength conversion member 3 and the body color of the covering member 5 are the same color. Here, homologous colors refer to: in the Munsell color system (20 hues), hue: within the 3-value range of the hue circle (20-value range), lightness: within the 3-value range, and chroma: within the 3-value range.
即，在蒙塞尔色彩体系(20色相)的色相环中，以规定的色相为基准，所述规定的色相与配置在其两侧相邻的色相为同系色；同样地，在蒙塞尔色彩体系(20色相)的等色相面中，明度是以规定值的明度为基准，所述规定值的明度与其±1的数值的明度(即两侧相邻的明度)为同系色；在蒙塞尔色彩体系(20色相)的等色相面中，彩度是以规定值的彩度为基准，所述规定值的彩度与其±1的数值的彩度(即两侧相邻的彩度)为同系色。That is, in the hue circle of the Munsell color system (20 hues), a predetermined hue is used as a reference, and the predetermined hue is the same color as the hue arranged adjacent to both sides thereof; similarly, in Munsell In the isohue plane of the color system (20 hues), the lightness is based on the lightness of the specified value, and the lightness of the specified value and the lightness of the value of ±1 (that is, the lightness of the adjacent two sides) are the same color; In the isochromatic phase plane of the Searle color system (20 hues), the chroma is based on the chroma of a specified value, and the chroma of the specified value and the chroma of the value of ±1 (that is, the chroma adjacent to both sides). ) is the same color.
具体而言，如图2所示，例如，在Y(黄色)系的色相的等色相面(5Y)中，将特定的色彩设为色彩a的情况下，范围A为同系色。Specifically, as shown in FIG. 2 , for example, on the isohue plane (5Y) of a Y (yellow)-based hue, when a specific color is color a, the range A is the same color.
体色的测定能够使用例如分光测色计CM系列(柯尼卡美能达公司制造)、色彩色差计CR系列(柯尼卡美能达公司制造)等测定器来进行。在这样的测定器中，使用具备氙气灯的光源和硅光电二极管的受光元件，并能够由平面衍射光栅进行分光，能够进行蒙塞尔色彩体系下的输出的测定器即可。The measurement of the body color can be performed using measuring instruments such as a spectrophotometer CM series (manufactured by Konica Minolta) and a colorimeter CR series (manufactured by Konica Minolta). Such a measuring device may be a measuring device that includes a light source of a xenon lamp and a light-receiving element of a silicon photodiode, and that can split light by a plane diffraction grating and can perform output in the Munsell color system.
波长转换部件3的体色和被覆部件5的体色为同系色，从而能够使非发光时发光装置100的上表面整体成为波长转换部件3的色彩。The body color of the wavelength conversion member 3 and the body color of the covering member 5 are the same color, so that the entire upper surface of the light emitting device 100 can be made to be the color of the wavelength conversion member 3 when not emitting light.
此外，非发光时发光装置100的上表面整体成为波长转换部件3的色彩除了发光装置100的上表面整体的色彩成为与波长转换部件3的色彩相同的情况以外，还包括成为相同程度的情况。相同程度是指在例如前述的蒙塞尔色彩体系(20色相)的色相环、等色相面中，色相、明度、彩度都能够均包含到两侧相邻为止。In addition, the color of the entire upper surface of the light-emitting device 100 becomes the wavelength conversion member 3 when not emitting light, except for the case where the color of the entire upper surface of the light-emitting device 100 is the same as the color of the wavelength conversion member 3, and also includes the case where the color is approximately the same. The same degree means that, for example, in the hue circle and isohue plane of the aforementioned Munsell color system (20 hues), hue, lightness, and chroma can all be included until both sides are adjacent.
被覆部件5的宽度方向的厚度优选为20μm以上且200μm以下。若被覆部件5的宽度方向的厚度为20μm以上，则非发光时的发光装置100的上表面整体的色彩容易成为与波长转换部件3的色彩相同。另一方面，若被覆部件5的宽度方向的厚度为200μm以下，则能够实现发光装置100的小型化。The thickness in the width direction of the covering member 5 is preferably 20 μm or more and 200 μm or less. When the thickness of the covering member 5 in the width direction is 20 μm or more, the color of the entire upper surface of the light-emitting device 100 when not emitting light tends to be the same as the color of the wavelength conversion member 3 . On the other hand, when the thickness in the width direction of the covering member 5 is 200 μm or less, the light-emitting device 100 can be reduced in size.
<发光装置的动作><Operation of the light-emitting device>
接下来，对发光装置100的动作进行说明。Next, the operation of the light-emitting device 100 will be described.
若驱动发光装置100，则经由电极11、12而从外部电源向发光元件1供给电力，发光元件1发光。发光元件1发出的光的一部分由反射部件2反射，在波长转换部件3通过而向外部被取出。此时，被覆部件5包含反射物质，从而发光装置100的上表面的发光区域与非发光区域的对比度(亮度之差)变大。When the light-emitting device 100 is driven, electric power is supplied from an external power source to the light-emitting element 1 via the electrodes 11 and 12, and the light-emitting element 1 emits light. A part of the light emitted from the light-emitting element 1 is reflected by the reflection member 2 , passes through the wavelength conversion member 3 , and is taken out to the outside. At this time, since the covering member 5 contains a reflective material, the contrast (difference in luminance) between the light-emitting region and the non-light-emitting region on the upper surface of the light-emitting device 100 increases.
[发光装置的制造方法][Manufacturing method of light-emitting device]
接下来，参照图3～图7C对实施方式的发光装置100的制造方法的一个例子进行说明。此外，图4A～图7C示意性地示出同时制造多个发光装置100时的一个发光装置100。Next, an example of a method of manufacturing the light-emitting device 100 of the embodiment will be described with reference to FIGS. 3 to 7C . In addition, FIGS. 4A to 7C schematically illustrate one light-emitting device 100 when a plurality of light-emitting devices 100 are manufactured simultaneously.
如图3所示，实施方式的发光装置100的制造方法包括：在片材上形成波长转换部件的工序S101、载置发光元件的工序S102、由反射部件进行被覆的工序S103、使波长转换部件的外侧面露出的工序S104、由被覆部件进行被覆的工序S105、使电极露出的工序S106、转印于其他片材的工序S107、对发光装置的上表面进行整理的工序S108、以及进行切断的工序S109，并依次进行。As shown in FIG. 3 , the method of manufacturing the light emitting device 100 according to the embodiment includes: a step S101 of forming a wavelength conversion member on a sheet, a step S102 of placing a light emitting element, a step S103 of covering with a reflective member, and a step S103 of making the wavelength conversion member step S104 of exposing the outer surface of the light-emitting device, step S105 of covering with a covering member, step S106 of exposing the electrodes, step S107 of transferring to another sheet, step S108 of finishing the upper surface of the light-emitting device, and step S108 of cutting Step S109 is performed sequentially.
此外，针对各部件的材质、配置等，为如上述的发光装置100的说明中叙述的那样，这里适当地省略说明。In addition, the material, arrangement, etc. of each member are as described in the above-mentioned description of the light-emitting device 100 , and the description is appropriately omitted here.
(在片材上形成波长转换部件的工序)(Step of forming wavelength conversion member on sheet)
如图4A所示，在片材上形成波长转换部件的工序S101是在树脂等片材20上形成波长转换部件3的工序。As shown in FIG. 4A , the step S101 of forming the wavelength conversion member on the sheet is a step of forming the wavelength conversion member 3 on the sheet 20 such as resin.
波长转换部件3向片材20上的形成能够通过例如印刷法、压缩成形法、磷电沉积法、或者层叠板状的波长转换部件的方法等来进行。The wavelength conversion member 3 can be formed on the sheet 20 by, for example, a printing method, a compression molding method, a phosphor electrodeposition method, or a method of laminating plate-shaped wavelength conversion members.
(载置发光元件的工序)(Step of Mounting Light-Emitting Elements)
如图4B所示，载置发光元件的工序S102是使发光面1a与波长转换部件3的第一面3a对面而载置发光元件1的工序，该波长转换部件3具有第一面3a和与第一面3a相反一侧的第二面3b。As shown in FIG. 4B , the step S102 of placing the light-emitting element is a step of placing the light-emitting element 1 with the light-emitting surface 1 a facing the first surface 3 a of the wavelength conversion member 3 having the first surface 3 a and the first surface 3 a of the wavelength conversion member 3 . The second surface 3b on the opposite side of the first surface 3a.
在该工序S102中，发光元件1使发光元件1的设置有电极11、12侧的相反面、即发光面1a经由粘合部件而与波长转换部件3的第一面3a接合。此时，在配光等观点中，优选以波长转换部件3的第一面3a的中心与发光元件1的发光面1a中心一致的方式接合。In this step S102 , the light emitting element 1 is bonded to the first surface 3 a of the wavelength conversion member 3 via the adhesive member, that is, the light emitting surface 1 a which is the opposite surface of the light emitting element 1 on the side where the electrodes 11 and 12 are provided. In this case, from the viewpoint of light distribution, etc., it is preferable to join so that the center of the first surface 3 a of the wavelength conversion member 3 and the center of the light emitting surface 1 a of the light emitting element 1 are aligned.
这里，通过调整粘合部件的量，从而能够使粘合部件攀爬于发光元件1的侧面，在发光元件1的侧面形成粘合部件。由此，发光装置100成为在发光元件1的侧面设置有作为粘合部件的导光部件6的方式。Here, by adjusting the amount of the adhesive member, the adhesive member can be formed on the side surface of the light-emitting element 1 so that the adhesive member can climb on the side surface of the light-emitting element 1 . As a result, the light-emitting device 100 has a configuration in which the light guide member 6 as an adhesive member is provided on the side surface of the light-emitting element 1 .
另外，作为粘合部件的导光部件6也可以在发光元件1的发光面1a与波长转换部件3的第一面3a之间以上下方向的规定的厚度配置。由此，能够使发光元件1与波长转换部件3更稳固地粘合。此外，虽未图示，但这里在发光元件1的发光面1a与波长转换部件3的第一面3a之间，为了发光元件1与波长转换部件3的接合而以极薄的状态夹有粘合部件。In addition, the light guide member 6 serving as an adhesive member may be arranged with a predetermined thickness in the vertical direction between the light emitting surface 1 a of the light emitting element 1 and the first surface 3 a of the wavelength conversion member 3 . Thereby, the light-emitting element 1 and the wavelength conversion member 3 can be adhered more firmly. In addition, although not shown, here, between the light emitting surface 1 a of the light emitting element 1 and the first surface 3 a of the wavelength conversion member 3 , an extremely thin adhesive is sandwiched in order to bond the light emitting element 1 and the wavelength conversion member 3 . combined parts.
(由反射部件进行被覆的工序)(The step of covering with the reflective member)
如图4C所示，由反射部件进行被覆的工序S103是由反射部件2来被覆载置在波长转换部件3上的发光元件1的工序。As shown in FIG. 4C , the step S103 of covering with the reflective member is a step of covering the light-emitting element 1 placed on the wavelength conversion member 3 with the reflective member 2 .
在该工序S103中，由反射部件2被覆包含电极11、12在内的发光元件1的全部。在该工序S103中，从波长转换部件3的面直至电极11、12的上表面设置有反射部件2。In this step S103 , the entirety of the light-emitting element 1 including the electrodes 11 and 12 is covered with the reflective member 2 . In this step S103 , the reflection member 2 is provided from the surface of the wavelength conversion member 3 to the upper surfaces of the electrodes 11 and 12 .
基于反射部件2的发光元件1的被覆例如能够使用排出装置(分配器)来进行，该排出装置能够在固定的片材20的上侧相对于片材20而沿上下方向或水平方向等移动(可动)。基于反射部件2的发光元件1的被覆能够通过使用排出装置而将构成反射部件2的树脂等填充在波长转换部件3上来进行。The coating of the light-emitting element 1 by the reflective member 2 can be performed, for example, using a discharge device (distributor) that can be moved relative to the sheet 20 in the vertical direction or the horizontal direction on the upper side of the fixed sheet 20 ( movable). The coating of the light emitting element 1 by the reflection member 2 can be performed by filling the wavelength conversion member 3 with resin or the like constituting the reflection member 2 using a discharge device.
另外，也能够通过压缩成形法、传递模塑法等来被覆。In addition, it is also possible to coat by a compression molding method, a transfer molding method, or the like.
(使波长转换部件的外侧面露出的工序)(Step of exposing the outer surface of the wavelength conversion member)
如图5A、图5B所示，使波长转换部件的外侧面露出的工序S104是将发光元件1的周围的波长转换部件3的一部分除去，并使波长转换部件3的外侧面3c露出的工序。波长转换部件3的一部分的除去从波长转换部件3的成为第一面3a侧的反射部件2侧进行。As shown in FIGS. 5A and 5B , the step S104 of exposing the outer surface of the wavelength conversion member is a step of removing a part of the wavelength conversion member 3 around the light emitting element 1 and exposing the outer surface 3 c of the wavelength conversion member 3 . Part of the wavelength conversion member 3 is removed from the reflection member 2 side of the wavelength conversion member 3 which is the first surface 3a side.
在该工序S104中，贯通反射部件2、波长转换部件3，并形成凹部30直至片材20的厚度内。在该工序S104中，在对发光元件1进行了单片化时，在形成有被覆部件5的位置形成凹部30。通过该凹部30的形成，使波长转换部件3的外侧面3c露出。In this step S104 , the reflective member 2 and the wavelength conversion member 3 are penetrated to form the concave portion 30 up to the thickness of the sheet 20 . In this step S104, when the light-emitting element 1 is separated into pieces, the concave portion 30 is formed at the position where the covering member 5 is formed. The formation of the concave portion 30 exposes the outer surface 3c of the wavelength conversion member 3 .
凹部30的形成例如能够通过使用规定宽度的刀片从反射部件2的上表面朝向片材20以垂直方向或者具有倾斜地将部件除去来进行。详细而言，凹部30的形成能够通过贯通反射部件2，进一步贯通波长转换部件3而将片材20的一部分除去来进行。The formation of the concave portion 30 can be performed, for example, by removing the member from the upper surface of the reflection member 2 toward the sheet 20 in a vertical direction or with an inclination using a blade having a predetermined width. Specifically, the formation of the concave portion 30 can be performed by penetrating the reflection member 2 and further penetrating the wavelength conversion member 3 to remove a part of the sheet 20 .
此外，凹部30的形成也可以通过激光进行，也可以通过蚀刻进行。In addition, the formation of the recessed part 30 may be performed by laser light, and may be performed by etching.
另外，凹部30只要在发光元件1的周围，可以形成于任何位置。也可以是，在发光元件1的侧面配置有导光部件6的情况下，以将导光部件6的一部分除去的方式形成凹部30。如图5A、图5B所示，为了提高发光效率，优选形成于比导光部件6靠外侧。In addition, the concave portion 30 may be formed at any position as long as it is around the light-emitting element 1 . When the light guide member 6 is arranged on the side surface of the light-emitting element 1 , the recessed portion 30 may be formed so as to remove a part of the light guide member 6 . As shown in FIG. 5A and FIG. 5B , in order to improve the luminous efficiency, it is preferable to be formed on the outer side of the light guide member 6 .
(由被覆部件进行被覆的工序)(The process of covering with the covering member)
如图6A所示，由被覆部件进行被覆的工序S105是使波长转换部件3的外侧面3c含有反射物质以及着色物质，并由体色与波长转换部件3的体色同系色的被覆部件5被覆的工序。As shown in FIG. 6A , in step S105 of covering with a covering member, the outer surface 3 c of the wavelength conversion member 3 contains a reflective substance and a coloring substance, and is covered with a covering member 5 whose body color is the same color as that of the wavelength conversion member 3 . process.
在该工序S105中，经由在凹部30内填充被覆部件5而由被覆部件5对波长转换部件3的外侧面3c以及反射部件2的外侧面2c进行被覆的程序来形成被覆部件5。通过该工序S105，在凹部30内形成有被覆部件5。In this step S105 , the covering member 5 is formed by filling the covering member 5 in the recessed portion 30 to coat the outer side surface 3c of the wavelength conversion member 3 and the outer side surface 2c of the reflecting member 2 with the covering member 5 . By this step S105 , the covering member 5 is formed in the recessed portion 30 .
被覆部件5的填充能够通过例如印刷法、压缩成形法、电沉积法等来进行。另外，被覆部件5的填充能够使用上述的树脂排出装置来进行。The filling of the covering member 5 can be performed by, for example, a printing method, a compression molding method, an electrodeposition method, or the like. In addition, the filling of the covering member 5 can be performed using the above-mentioned resin discharge apparatus.
这里，以使波长转换部件3的体色与被覆部件5的体色成为同系色的方式选择材料。Here, the material is selected so that the body color of the wavelength conversion member 3 and the body color of the covering member 5 have the same color.
(使电极露出的工序)(Step of exposing electrodes)
如图6B所示，使电极露出的工序S106是将电极11、12侧的反射部件2的一部分、以及被覆部件5的一部分除去以使发光元件1的电极11、12露出的工序。As shown in FIG. 6B , the step S106 of exposing the electrodes is a step of exposing the electrodes 11 and 12 of the light-emitting element 1 by removing a part of the reflecting member 2 and a part of the covering member 5 on the electrodes 11 and 12 side.
在该工序S106中，例如，从电极11、12侧将反射部件2以及被覆部件5的表面除去直至电极11、12露出为止。作为除去反射部件2以及被覆部件5的方法，例如有磨削、研磨、喷砂等。In this step S106 , for example, the surfaces of the reflection member 2 and the covering member 5 are removed from the electrodes 11 and 12 side until the electrodes 11 and 12 are exposed. As a method of removing the reflecting member 2 and the covering member 5, for example, there are grinding, polishing, sandblasting, and the like.
(转印于其他片材的工序)(Process of transferring to another sheet)
如图7A所示，转印于其他片材的工序S107是将使电极11、12露出的构造体转印于树脂等其他片材21的工序。As shown in FIG. 7A , the step S107 of transferring to another sheet is a step of transferring the structures exposing the electrodes 11 and 12 to another sheet 21 such as resin.
在该工序S107中，以使从反射部件2露出的电极11、12粘合于片材21的方式在片材21上载置构造体。In this step S107 , the structures are placed on the sheet 21 so that the electrodes 11 and 12 exposed from the reflection member 2 are bonded to the sheet 21 .
此外，在转印于其他片材21前或者后，将用于波长转换部件3的形成的片材20除去。In addition, the sheet 20 used for the formation of the wavelength conversion member 3 is removed before or after transfer to another sheet 21 .
(对发光装置的上表面进行整理的工序)(The process of finishing the upper surface of the light-emitting device)
如图7B所示，对发光装置的上表面进行整理的工序S108是通过除去片材20而将在波长转换部件3的第二面3b侧露出的被覆部件5的一部分除去，并对发光装置的上表面进行整理的工序。As shown in FIG. 7B , in step S108 of finishing the upper surface of the light-emitting device, a part of the covering member 5 exposed on the second surface 3b side of the wavelength conversion member 3 is removed by removing the sheet 20, and the surface of the light-emitting device is removed. The process of finishing the upper surface.
在该工序S108中，例如通过将发光装置的上表面的一部分除去，从而沿着波长转换部件3的第二面3b而使发光装置的上表面变平滑。In this step S108 , the upper surface of the light-emitting device is smoothed along the second surface 3 b of the wavelength conversion member 3 by, for example, removing a part of the upper surface of the light-emitting device.
(进行切断的工序)(step of cutting)
如图7C所示，进行切断的工序S109是通过包括被覆部件5的切断线进行切断的工序。即，进行切断的工序S109是对一次形成多个的发光装置100的集合体进行单片化的工序。As shown in FIG. 7C , the step S109 of cutting is a step of cutting along the cutting line including the covering member 5 . That is, the step S109 of cutting is a step of singulating an assembly of a plurality of light-emitting devices 100 formed at one time.
在该工序S109中，预先决定用于使发光装置100的集合体单片化的切断线。该切断线预先规定为使切断槽31位于被覆部件5的中心侧而能够在切断槽31的左右配置被覆部件5。即，以如下方式预先规定切断线，即在集合体进行单片化时，被覆部件5被向切断槽31的左右分开并切断，最终在发光装置100的外周作为被覆部件5而形成。此外，图4A～图7C中仅图示出一个发光装置100，但实际上沿行列方向排列多个形成，并以使其一个单片化的方式进行切断。In this step S109, a cutting line for dividing the assembly of the light-emitting device 100 into pieces is determined in advance. The cutting line is predetermined so that the covering member 5 can be arranged on the left and right of the cutting groove 31 so that the cutting groove 31 is positioned on the center side of the covering member 5 . That is, the cutting line is predetermined so that when the aggregate is singulated, the covering member 5 is divided to the left and right of the cutting groove 31 and cut, and finally formed as the covering member 5 on the outer periphery of the light emitting device 100 . In addition, although only one light-emitting device 100 is shown in FIGS. 4A to 7C , a plurality of light-emitting devices 100 are actually formed in a row and column direction, and are cut so as to be separated into pieces.
集合体的单片化例如通过沿着切断槽31的宽度方向的中央附近进行切断直至片材21来进行。此外，切断槽31优选以达到片材21的一部分的方式进行切断。The singulation of the aggregate is performed by, for example, cutting along the vicinity of the center of the width direction of the cutting groove 31 up to the sheet 21 . In addition, the cutting groove 31 is preferably cut so as to reach a part of the sheet 21 .
集合体的单片化能够通过沿着切断槽31用刀片进行切断的切割方法等以往公知的方法来实施。The singulation of the aggregate can be carried out by a conventionally known method such as a dicing method of cutting with a blade along the cutting groove 31 .
而且，通过该集合体的单片化，获得多个发光装置100。Then, a plurality of light-emitting devices 100 are obtained by the singulation of the aggregate.
此外，在片材20、21上配置并形成多个发光元件1的情况下，切断槽31也可以形成于所有的发光元件间，也可以以多个发光元件1为单位形成。In addition, when a plurality of light-emitting elements 1 are arranged and formed on the sheets 20 and 21 , the cutting grooves 31 may be formed between all the light-emitting elements, or may be formed in units of the plurality of light-emitting elements 1 .
例如，通过以发光元件1为单位形成凹部30，以两个发光元件为单位形成切断槽31，以两个发光元件1为单位由切断槽31进行切断，从而获得图19A所示那样的发光装置100E。For example, a light-emitting device as shown in FIG. 19A can be obtained by forming the recesses 30 in units of light-emitting elements 1 , forming cutting grooves 31 in units of two light-emitting elements, and cutting the cutting grooves 31 in units of two light-emitting elements 1 . 100E.
另外，例如，通过以两个发光元件1为单位形成凹部30以及切断槽31，并由切断槽31进行切断，从而获得图19B所示那样的发光装置100F。In addition, for example, by forming the concave portion 30 and the cutting groove 31 in units of two light emitting elements 1, and cutting by the cutting groove 31, a light emitting device 100F as shown in FIG. 19B is obtained.
以上，通过用于实施发明的方式针对本实施方式的发光装置以及发光装置的制造方法具体地进行了说明。但是，本发明的主旨不限定于这些记载，应该基于权利要求书的记载而广泛地解释。另外，基于这些记载而进行了各种变更、改变等的方式也包含于本发明的主旨。In the above, the light-emitting device and the manufacturing method of the light-emitting device of the present embodiment have been specifically described by means for implementing the invention. However, the gist of the present invention is not limited to these descriptions, and should be construed broadly based on the descriptions of the claims. In addition, the aspect which performed various changes, a change, etc. based on these descriptions is also included in the summary of this invention.
以下，对其他实施方式进行说明。Hereinafter, other embodiments will be described.
如图8A所示的发光装置100A那样，被覆部件5也可以仅被覆波长转换部件3。As in the light-emitting device 100A shown in FIG. 8A , the covering member 5 may only cover the wavelength converting member 3 .
根据该结构，发光装置能够实现轻型化。另外，发光装置减少材料费。According to this configuration, the light-emitting device can be reduced in weight. In addition, the light-emitting device reduces material costs.
发光装置100A在由被覆部件进行被覆的工序S105中，能够通过进行蚀刻，或使用掩模等来制造。The light-emitting device 100A can be manufactured by etching or using a mask or the like in step S105 of being covered with a covering member.
另外，也可以不设置导光部件6。另外，导光部件6也可以如图8B所示的发光装置100B那样，不仅设置于发光元件1的侧面，还设置于发光元件1与波长转换部件3之间。在这种情况下，从使发光元件1与波长转换部件3更稳固地粘合的观点出发，而且从提高光束以及光的提取效率的观点出发，优选导光部件6的上下方向的厚度为0.5μm以上且20μm以下，更优选为0.5μm以上且10μm以下。另外，发光元件1除了一个情况的之外，也可以还设置多个。另外，发光装置也可以具备安装发光装置100的安装基板。In addition, the light guide member 6 may not be provided. In addition, the light guide member 6 may be provided not only on the side surface of the light emitting element 1 but also between the light emitting element 1 and the wavelength conversion member 3 as in the light emitting device 100B shown in FIG. 8B . In this case, from the viewpoint of more firmly adhering the light-emitting element 1 and the wavelength conversion member 3, and from the viewpoint of improving the extraction efficiency of the light beam and light, the thickness of the light guide member 6 in the vertical direction is preferably 0.5 μm or more and 20 μm or less, more preferably 0.5 μm or more and 10 μm or less. In addition, a plurality of light-emitting elements 1 may be provided in addition to one case. In addition, the light-emitting device may include a mounting substrate on which the light-emitting device 100 is mounted.
另外，波长转换部件3不仅可做成单层构造，也能做成多层构造。波长转换部件3若与被覆部件5的体色成为同系色，则也可以重叠多个含有不同波长转换物质的波长转换部件。另外，波长转换部件3也可以包含不含有波长转换物质的透光层。另外，也可以在波长转换部件3之上层叠不含有波长转换部件3的透光层、含有扩散剂的层、表面具有凹凸的层、凸透镜等透光部件。此外，图8B在波长转换部件3之上层叠透光层7。通过层叠透光层7，从而能够保护波长转换物质免受外部环境影响。In addition, the wavelength conversion member 3 may have not only a single-layer structure but also a multilayer structure. As long as the wavelength conversion member 3 and the covering member 5 have the same color, a plurality of wavelength conversion members containing different wavelength conversion substances may be superimposed. In addition, the wavelength conversion member 3 may include a light-transmitting layer that does not contain a wavelength conversion substance. Alternatively, a light-transmitting layer not containing the wavelength converting member 3, a layer containing a diffusing agent, a layer having irregularities on the surface, or a light-transmitting member such as a convex lens may be laminated on the wavelength converting member 3. Further, in FIG. 8B , the light-transmitting layer 7 is laminated on the wavelength conversion member 3 . By stacking the light-transmitting layer 7, the wavelength conversion material can be protected from the external environment.
在波长转换部件3为层叠体且包括不含有波长转换物质的透光层的情况下，如图8B那样，优选将透光层7配置在波长转换部件3的第二面3b上。此外，在这种情况下，透光层7也可以作为波长转换部件3的一部分，但作为不含有波长转换物质的层，做成为与含有波长转换物质的波长转换部件3不同的层。通过将透光层7配置在波长转换部件3的第二面3b上，从而在将片材20除去，成为发光装置100B时，透光层7成为保护层而能够保护波长转换物质免受外部环境影响。When the wavelength converting member 3 is a laminate and includes a light-transmitting layer not containing a wavelength converting substance, as shown in FIG. 8B , the light-transmitting layer 7 is preferably disposed on the second surface 3 b of the wavelength converting member 3 . In this case, the light-transmitting layer 7 may be a part of the wavelength converting member 3, but the layer that does not contain the wavelength converting substance may be a layer different from the wavelength converting member 3 containing the wavelength converting substance. By disposing the light-transmitting layer 7 on the second surface 3b of the wavelength conversion member 3, when the sheet 20 is removed to form the light-emitting device 100B, the light-transmitting layer 7 serves as a protective layer and can protect the wavelength conversion material from the external environment influences.
透光层7为透明部件，作为透光层7，可举出能够用于波长转换部件3的树脂等透光性的树脂、玻璃等。The light-transmitting layer 7 is a transparent member, and examples of the light-transmitting layer 7 include light-transmitting resins such as resins that can be used for the wavelength conversion member 3 , glass, and the like.
此外，通过在形成波长转换部件的工序中预先在波长转换部件3的第二面3b侧设置不含有波长转换物质的透光层7，从而能够在对发光装置的上表面进行整理的工序S108中容易地整理发光装置的上表面。详细而言，通过在对发光装置的上表面进行整理时，不除去波长转换部件3而将不含有波长转换物质的透光层7的一部分除去，从而能够抑制发光色的变化以及波长转换部件3的体色变化。In addition, by providing the light-transmitting layer 7 not containing the wavelength conversion material on the second surface 3b side of the wavelength conversion member 3 in advance in the step of forming the wavelength conversion member, it is possible to arrange the upper surface of the light-emitting device in the step S108 of finishing The upper surface of the light-emitting device is easily arranged. Specifically, when the upper surface of the light-emitting device is trimmed, the wavelength conversion member 3 is not removed but a part of the light-transmitting layer 7 that does not contain a wavelength conversion substance is removed, so that the change in the emission color and the wavelength conversion member 3 can be suppressed. body color changes.
上述的发光装置的制造方法在使波长转换部件的外侧面露出的工序S104中，从波长转换部件3的第一面3a侧进行波长转换部件3的一部分的除去。然而，如图9A所示，也可以从波长转换部件3的第二面3b侧进行波长转换部件3的一部分的除去。在这种情况下，能够通过使片材20为上方，从片材20的上表面朝向反射部件2以垂直方向或者具有倾斜地将部件除去而形成凹部30。凹部30的形成能够通过贯通片材20，进一步贯通波长转换部件3，而将反射部件2的一部分除去来进行。此时，反射部件2使发光元件1的电极11、12为下方，被除去直至比电极11、12的下表面靠下方的位置即可。此外，反射部件2的上下方向的厚度假定除去反射部件2的位置，适当地进行调整即可。In the above-described manufacturing method of the light-emitting device, in step S104 of exposing the outer surface of the wavelength conversion member 3 , a part of the wavelength conversion member 3 is removed from the first surface 3 a side of the wavelength conversion member 3 . However, as shown in FIG. 9A , a part of the wavelength conversion member 3 may be removed from the second surface 3 b side of the wavelength conversion member 3 . In this case, the concave portion 30 can be formed by removing the member from the upper surface of the sheet 20 toward the reflection member 2 in a vertical direction or with an inclination with the sheet 20 facing upward. The concave portion 30 can be formed by penetrating the sheet 20 and further penetrating the wavelength conversion member 3 to remove a part of the reflection member 2 . At this time, the reflection member 2 may be removed to a position below the lower surfaces of the electrodes 11 and 12 with the electrodes 11 and 12 of the light-emitting element 1 facing downward. In addition, the thickness in the vertical direction of the reflection member 2 may be adjusted appropriately assuming the position where the reflection member 2 is removed.
接下来，如图9B所示，发光装置的制造方法通过体色为与波长转换部件3的体色同系色的被覆部件5来被覆波长转换部件3的外侧面3c以及反射部件2的外侧面2c。接下来，如图10A所示，发光装置的制造方法将电极11、12侧的反射部件2的一部分以及被覆部件5的一部分除去以使发光元件1的电极11、12露出。接下来，如图10B所示，发光装置的制造方法将使电极11、12露出的构造体转印于树脂等其他片材21。转印后，将片材20、被覆部件5的一部分以及波长转换部件3的一部分除去。接下来，如图10C所示，发光装置的制造方法通过包括被覆部件5的切断线进行切断。Next, as shown in FIG. 9B , the manufacturing method of the light-emitting device coats the outer side surface 3 c of the wavelength conversion member 3 and the outer side surface 2 c of the reflection member 2 with the coating member 5 whose body color is the same color as the body color of the wavelength conversion member 3 . Next, as shown in FIG. 10A , the method of manufacturing the light-emitting device removes a part of the reflecting member 2 and a part of the covering member 5 on the electrodes 11 and 12 side to expose the electrodes 11 and 12 of the light-emitting element 1 . Next, as shown in FIG. 10B , in a method of manufacturing a light-emitting device, the structure having the exposed electrodes 11 and 12 is transferred to another sheet 21 such as resin. After the transfer, the sheet 20 , a part of the covering member 5 and a part of the wavelength conversion member 3 are removed. Next, as shown in FIG. 10C , the method of manufacturing the light-emitting device performs cutting by a cutting line including the covering member 5 .
此外，对发光装置的上表面进行整理的工序S108也可以不进行，也可以为了使发光装置的上表面更平滑而进行。In addition, the step S108 of finishing the upper surface of the light-emitting device may not be performed, but may be performed in order to make the upper surface of the light-emitting device smoother.
针对其他的事项，与上述的发光装置的制造方法相同。Other matters are the same as the above-mentioned manufacturing method of the light-emitting device.
另外，也可以是，如图11所示的发光装置100C那样，被覆部件5被覆波长转换部件3的侧面，反射部件2设置至被覆部件5的下方。In addition, as in the light-emitting device 100C shown in FIG. 11 , the covering member 5 may cover the side surface of the wavelength conversion member 3 , and the reflecting member 2 may be provided below the covering member 5 .
以下，参照图12～图14C对图11所示的发光装置100C的制造方法的一个例子进行说明。此外，图13A～图14C示意性地示出同时制造多个发光装置100C时的一个发光装置100C。Hereinafter, an example of a method of manufacturing the light-emitting device 100C shown in FIG. 11 will be described with reference to FIGS. 12 to 14C . 13A to 14C schematically illustrate one light-emitting device 100C when a plurality of light-emitting devices 100C are simultaneously manufactured.
如图12所示，发光装置100C的制造方法包括：准备板状部件的工序S20、载置发光元件的工序S205、由反射部件进行被覆的工序S206、使电极露出的工序S207、以及进行切断的工序S208，并依次进行。As shown in FIG. 12 , the method of manufacturing the light-emitting device 100C includes: a step S20 of preparing a plate-shaped member, a step S205 of placing a light-emitting element, a step S206 of covering with a reflective member, a step S207 of exposing the electrodes, and cutting Step S208 is performed sequentially.
此外，针对各部件的材质、配置等，如上述的发光装置100、100C的说明所叙述的那样，因此这里适当地省略说明。In addition, since the material, arrangement, etc. of each member are as described in the description of the above-mentioned light-emitting devices 100 and 100C, the description is appropriately omitted here.
<准备板状部件的工序〉<The process of preparing the plate-shaped member>
准备板状部件的工序S20是准备具有被覆部件5、和配置于被覆部件5的贯通孔16内的波长转换部件3的板状部件17的工序。The step S20 of preparing the plate-shaped member is a step of preparing the plate-shaped member 17 having the covering member 5 and the wavelength conversion member 3 arranged in the through hole 16 of the covering member 5 .
准备板状部件的工序包括准备被覆部件的工序S201、在被覆部件设置贯通孔的工序S202、以及填充波长转换部件的工序S21，并依次进行。The step of preparing the plate-like member includes a step S201 of preparing a covering member, a step S202 of providing a through hole in the covering member, and a step S21 of filling the wavelength conversion member, which are performed in this order.
(准备被覆部件的工序)(Process of preparing covered parts)
如图13A所示，准备被覆部件的工序S201是准备片状的被覆部件5的工序。As shown in FIG. 13A , step S201 of preparing a covering member is a step of preparing a sheet-like covering member 5 .
(在被覆部件设置贯通孔的工序)(The process of providing through holes in the covering member)
如图13B所示，在被覆部件设置贯通孔的工序S202是在片状的被覆部件5的规定部位设置贯通孔16的工序。As shown in FIG. 13B , the step S202 of providing the through-holes in the covering member is a step of providing the through-holes 16 in predetermined locations of the sheet-like covering member 5 .
在该工序S202中，在发光装置100C的形成有波长转换部件3的部位形成贯通孔16。贯通孔16的形成例如能够通过使用冲孔模具而从被覆部件5的上表面朝向被覆部件5的下表面以垂直方向或者具有倾斜地对部件进行穿孔来进行。In this step S202, the through-hole 16 is formed in the portion of the light-emitting device 100C where the wavelength conversion member 3 is formed. The formation of the through holes 16 can be performed by, for example, punching the member from the upper surface of the covering member 5 toward the lower surface of the covering member 5 in a vertical direction or with an inclination using a punching die.
贯通孔16的直径适当地选择即可。贯通孔16的直径例如能够成为200μm以上且1200μm以下。在贯通孔16的直径比发光元件1的直径大的情况下，能够提高光的提取效率。在贯通孔16的直径比发光元件1的直径小的情况下，能够缩小发光区域，并提高亮度。The diameter of the through hole 16 may be appropriately selected. The diameter of the through hole 16 can be, for example, 200 μm or more and 1200 μm or less. When the diameter of the through hole 16 is larger than the diameter of the light emitting element 1 , the extraction efficiency of light can be improved. When the diameter of the through-hole 16 is smaller than the diameter of the light-emitting element 1, the light-emitting area can be reduced and the brightness can be improved.
另外，贯通孔16的形状例如可举出在俯视时，为矩形、六边形、圆形等。另外，贯通孔16的形状在配光等观点中，优选成为与发光元件1在数学上的相似形状。In addition, the shape of the through hole 16 is, for example, a rectangle, a hexagon, a circle, or the like in plan view. In addition, it is preferable that the shape of the through-hole 16 is mathematically similar to that of the light-emitting element 1 from the viewpoint of light distribution and the like.
[填充波长转换部件的工序][The process of filling the wavelength conversion member]
如图13C所示，填充波长转换部件的工序S21是在贯通孔16内填充波长转换部件3的工序。As shown in FIG. 13C , the step S21 of filling the wavelength conversion member is a step of filling the wavelength conversion member 3 in the through hole 16 .
填充波长转换部件的工序S21包括准备波长转换部件的工序S203、和使波长转换物质偏置的工序S204，并依次进行。The step S21 of filling the wavelength conversion member includes the step S203 of preparing the wavelength conversion member and the step S204 of biasing the wavelength conversion material, which are performed in this order.
(准备波长转换部件的工序)(Process of preparing wavelength conversion member)
准备波长转换部件的工序S203是准备包含波长转换物质以及树脂的波长转换部件3的工序。The step S203 of preparing the wavelength conversion member is a step of preparing the wavelength conversion member 3 including the wavelength conversion material and the resin.
在该工序S203中，将波长转换物质和树脂混合，制成波长转换部件3。In this step S203, the wavelength conversion material and the resin are mixed to prepare the wavelength conversion member 3.
(使波长转换物质偏置的工序)(Step of Biasing the Wavelength Conversion Substance)
如图13C所示，使波长转换物质偏置的工序S204是在将波长转换部件3配置于贯通孔16内后，使波长转换物质40向波长转换部件3的第一面3a(载置有发光元件1的面)侧或者波长转换部件3的第二面3b(与载置有发光元件1的面相反一侧的面)侧偏置的工序。这里，针对使波长转换物质40向波长转换部件3的第一面3a侧偏置的情况进行图示。此外，在以后的附图中，省略波长转换物质40的图示。As shown in FIG. 13C , in step S204 of biasing the wavelength conversion member 3, after arranging the wavelength conversion member 3 in the through hole 16, the wavelength conversion member 40 is directed to the first surface 3a of the wavelength conversion member 3 (on which the light-emitting member 3 is mounted). A step of offsetting the side of the surface of the element 1 or the side of the second surface 3b (surface opposite to the surface on which the light-emitting element 1 is mounted) of the wavelength conversion member 3 . Here, the case where the wavelength conversion material 40 is biased toward the first surface 3 a of the wavelength conversion member 3 is illustrated. In addition, in the following drawings, illustration of the wavelength conversion substance 40 is abbreviate|omitted.
在该工序S204中，在将波长转换部件3配置于贯通孔16内后，通过自然沉淀或者强制沉淀，使树脂中的波长转换物质40向波长转换部件3的第一面3a侧或者波长转换部件3的第二面3b侧偏置。其后，通过加热等使树脂固化。由此，获得波长转换物质40偏置的波长转换部件3。此外，在贯通孔16内配置波长转换部件3的情况下，在贯通孔16的一方的开口侧配置有片材等。In this step S204 , after the wavelength conversion member 3 is arranged in the through hole 16 , the wavelength conversion substance 40 in the resin is caused to move toward the first surface 3 a side of the wavelength conversion member 3 or the wavelength conversion member by natural precipitation or forced precipitation. The second face 3b side of 3 is offset. After that, the resin is cured by heating or the like. Thus, the wavelength conversion member 3 in which the wavelength conversion substance 40 is biased is obtained. In addition, when the wavelength conversion member 3 is arrange|positioned in the through-hole 16, a sheet|seat etc. are arrange|positioned at one opening side of the through-hole 16.
另外，优选波长转换物质40向波长转换部件3的第一面3a侧偏置。由此，在波长转换部件3的第二面3b侧基本上不包含波长转换物质40，能够保护波长转换部件3免受外部环境影响。In addition, it is preferable that the wavelength conversion material 40 is biased toward the first surface 3 a of the wavelength conversion member 3 . Thereby, the wavelength conversion material 40 is not substantially included on the second surface 3b side of the wavelength conversion member 3, and the wavelength conversion member 3 can be protected from the external environment.
(载置发光元件的工序)(Step of Mounting Light-Emitting Elements)
如图14A所示，载置发光元件的工序S205是使发光面1a与被覆部件5所围起的波长转换部件3的第一面3a对面而载置发光元件1的工序。As shown in FIG. 14A , the step S205 of placing the light-emitting element is a step of placing the light-emitting element 1 with the light-emitting surface 1 a facing the first surface 3 a of the wavelength conversion member 3 surrounded by the covering member 5 .
该工序S205与发光装置100的制造方法中说明的载置发光元件的工序S102大致相同，因此这里省略说明。This step S205 is substantially the same as the step S102 of mounting the light-emitting element described in the method of manufacturing the light-emitting device 100 , and thus the description is omitted here.
(由反射部件进行被覆的工序)(The step of covering with the reflective member)
如图14B所示，由反射部件进行被覆的工序S206是由反射部件2来被覆载置在波长转换部件3上的发光元件1的工序。As shown in FIG. 14B , the step S206 of covering with the reflective member is a step of covering the light-emitting element 1 placed on the wavelength conversion member 3 with the reflective member 2 .
在该工序S206中，由反射部件2来被覆含有电极11、12的发光元件1的全部。在该工序S206中，从波长转换部件3的面以及被覆部件5的面直至电极11、12的上表面设置有反射部件2。In this step S206 , the whole of the light-emitting element 1 including the electrodes 11 and 12 is covered with the reflective member 2 . In this step S206 , the reflection member 2 is provided from the surface of the wavelength conversion member 3 and the surface of the covering member 5 to the upper surfaces of the electrodes 11 and 12 .
基于反射部件2的发光元件1的被覆例如能够使用排出装置(分配器)来进行，该排出装置在固定的板状部件17(具有被覆部件5和波长转换部件3的部件(参照图13C))的上侧，相对于板状部件17沿上下方向或水平方向等能够移动(可动)。基于反射部件2的发光元件1的被覆能够通过使用排出装置而将构成反射部件2的树脂等填充在板状部件17上来进行。The coating of the light-emitting element 1 by the reflective member 2 can be performed, for example, using a discharge device (distributor) which is placed on the fixed plate-shaped member 17 (the member having the coating member 5 and the wavelength conversion member 3 (see FIG. 13C )) The upper side of the plate-like member 17 is movable (movable) in the vertical direction or the horizontal direction, or the like. The coating of the light-emitting element 1 by the reflection member 2 can be performed by filling the plate-shaped member 17 with resin or the like constituting the reflection member 2 using a discharge device.
另外，也能够通过压缩成形法、传递模塑法等来进行被覆。In addition, the coating can also be performed by a compression molding method, a transfer molding method, or the like.
(使电极露出的工序)(Step of exposing electrodes)
如图14C所示，使电极露出的工序S207是将电极11、12侧的反射部件2的一部分除去以使发光元件1的电极11、12露出的工序。As shown in FIG. 14C , the step S207 of exposing the electrodes is a step of exposing the electrodes 11 and 12 of the light-emitting element 1 by removing a part of the reflection member 2 on the electrodes 11 and 12 side.
在该工序S207中，例如，从电极11、12侧将反射部件2的表面除去直至电极11、12露出为止。作为除去反射部件2的方法，例如有磨削、研磨、喷砂等。In this step S207 , for example, the surface of the reflection member 2 is removed from the electrodes 11 and 12 side until the electrodes 11 and 12 are exposed. As a method of removing the reflection member 2, for example, grinding, polishing, sandblasting, etc. are mentioned.
(进行切断的工序)(step of cutting)
进行切断的工序S208是利用切断线对多个沿行列方向排列的发光装置100C的集合体进行切断的工序。即，进行切断的工序S208是对一次形成多个的发光装置100C的集合体进行单片化的工序。The step S208 of cutting is a step of cutting the aggregate of the plurality of light-emitting devices 100C arranged in the row and column direction using a cutting line. That is, the step S208 of cutting is a step of singulating an assembly of a plurality of light-emitting devices 100C formed at one time.
在该工序S208中，预先决定用于对发光装置100C的集合体进行单片化的切断线。该切断线预先决定为使发光装置100C的大小均等。此外，图13A～图14C中仅图示出发光装置100C，但实际上沿行列方向排列多个而形成，并以使其一个单片化的方式进行切断。In this step S208, a cutting line for dividing the assembly of the light-emitting devices 100C into individual pieces is determined in advance. This cutting line is predetermined so that the size of the light-emitting device 100C is equalized. 13A to 14C only illustrate the light-emitting device 100C, but actually a plurality of light-emitting devices are formed in a row-column direction, and are cut so as to be separated into individual pieces.
集合体的单片化能够通过在切断线的部位由刀片进行切断的切割方法、在切断线的部位划线后切割集合体的断裂方法等以往公知的方法来进行。The singulation of the aggregate can be performed by a conventionally known method such as a dicing method in which a blade is cut at a part of the cutting line, or a breaking method in which the aggregate is cut after scribing a line at the part of the cutting line.
而且，通过该集合体的单片化，获得多个发光装置100C。Then, a plurality of light-emitting devices 100C are obtained by the singulation of the aggregate.
另外，如图15所示的发光装置100D那样，也可以在波长转换部件3上层叠透光层7。这里，在波长转换部件3的第二面3b上层叠透光层7。针对透光层7，为如上述的发光装置100B的方式等所叙述的那样，因此这里省略说明。In addition, as in the light-emitting device 100D shown in FIG. 15 , the light-transmitting layer 7 may be laminated on the wavelength conversion member 3 . Here, the light-transmitting layer 7 is laminated on the second surface 3 b of the wavelength conversion member 3 . The light-transmitting layer 7 is as described in the above-mentioned aspects of the light-emitting device 100B and the like, and therefore the description thereof is omitted here.
以下，参照图16～图18C对图15所示的发光装置100D的制造方法的一个例子进行说明。此外，图17A～图18C示意性地示出同时制造多个发光装置100D时的两个发光装置100D。Hereinafter, an example of a method of manufacturing the light-emitting device 100D shown in FIG. 15 will be described with reference to FIGS. 16 to 18C . In addition, FIGS. 17A to 18C schematically illustrate two light-emitting devices 100D when a plurality of light-emitting devices 100D are manufactured simultaneously.
如图16所示，发光装置100D的制造方法包括：配置透光材料层叠片材的工序S301、由被覆部件进行被覆的工序S302、使透光层露出的工序S303、载置发光元件的工序S304、由反射部件进行被覆的工序S305、使电极露出的工序S306、以及进行切断的工序S307，并依次进行。As shown in FIG. 16 , the method for manufacturing the light-emitting device 100D includes: a step S301 of arranging a light-transmitting material laminated sheet, a step S302 of covering with a covering member, a step S303 of exposing the light-transmitting layer, and a step S304 of placing a light-emitting element , the step S305 of covering with the reflective member, the step S306 of exposing the electrodes, and the step S307 of cutting, are performed in this order.
此外，针对各部件的材质、配置等，为如上述的发光装置100、100C、100D的说明所叙述的那样，因此这里适当地省略说明。In addition, the material, arrangement, and the like of each member are as described in the description of the light-emitting devices 100 , 100C, and 100D described above, and therefore, the description is appropriately omitted here.
(配置透光材料层叠片材的工序)(The process of arranging the light-transmitting material laminated sheet)
如图17A所示，配置透光材料层叠片材的工序S301是在树脂等的片材20上隔开恒定的间隔而配置层叠有波长转换部件3和透光层7而成的透光材料层叠片材(块)25的工序。As shown in FIG. 17A , the step S301 of arranging the light-transmitting material lamination sheet is to arrange the light-transmitting material lamination in which the wavelength conversion member 3 and the light-transmitting layer 7 are laminated on the sheet 20 of resin or the like at constant intervals. Process of the sheet (block) 25 .
此外，在该工序S301前，例如准备在波长转换部件3的第二面3b上层叠了透光层7的片材。另外，也可以如上述那样，使波长转换物质40向波长转换部件3的第一面3a侧偏置。In addition, before this process S301, the sheet|seat which laminated|stacked the light-transmitting layer 7 on the 2nd surface 3b of the wavelength conversion member 3, for example is prepared. In addition, as described above, the wavelength conversion material 40 may be biased toward the first surface 3 a of the wavelength conversion member 3 .
(由被覆部件进行被覆的工序)(The process of covering with the covering member)
如图17B所示，由被覆部件进行被覆的工序S302是由被覆部件5被覆载置在片材20上的透光材料层叠片材25的工序。As shown in FIG. 17B , the step S302 of covering with the covering member is a step of covering the light-transmitting material laminated sheet 25 placed on the sheet 20 with the covering member 5 .
在该工序S302中，由被覆部件5被覆透光材料层叠片材25的全部。在该工序S302中，从片材20的面直至透光层7的上表面设置有被覆部件5。In this step S302 , the entirety of the light-transmitting material laminated sheet 25 is covered with the covering member 5 . In this step S302 , the covering member 5 is provided from the surface of the sheet 20 to the upper surface of the light-transmitting layer 7 .
基于被覆部件5的透光材料层叠片材25的被覆例如能够使用排出装置(分配器)来进行，该排出装置在固定的片材20的上侧，相对于片材20沿上下方向或水平方向等能够移动(可动)。基于被覆部件5的透光材料层叠片材25的被覆能够通过使用排出装置将构成被覆部件5的树脂等填充于片材20上来进行。The coating of the light-transmitting material laminated sheet 25 by the coating member 5 can be performed, for example, using a discharge device (distributor) that is on the upper side of the fixed sheet 20 in an up-down direction or a horizontal direction with respect to the sheet 20 . etc. to be able to move (movable). The coating of the light-transmitting material-laminated sheet 25 by the coating member 5 can be performed by filling the sheet 20 with resin or the like constituting the coating member 5 using a discharge device.
另外，也能够通过压缩成形法、传递模塑法等来进行被覆。In addition, the coating can also be performed by a compression molding method, a transfer molding method, or the like.
(使透光层露出的工序)(The process of exposing the light-transmitting layer)
如图17C所示，使透光层露出的工序S303是将透光层7侧的被覆部件5的一部分除去以使透光层7露出的工序。As shown in FIG. 17C , the step S303 of exposing the light-transmitting layer is a step of removing a part of the covering member 5 on the light-transmitting layer 7 side to expose the light-transmitting layer 7 .
在该工序S303中，例如从透光层7侧将被覆部件5的表面除去直至透光层7露出。作为除去被覆部件5的方法，例如有磨削、研磨、喷砂等。另外，在该工序S303中，也可以将透光层7的一部分除去。In this step S303 , for example, the surface of the covering member 5 is removed from the light-transmitting layer 7 side until the light-transmitting layer 7 is exposed. As a method of removing the covering member 5, for example, grinding, polishing, sandblasting, etc. are mentioned. In addition, in this step S303, a part of the light-transmitting layer 7 may be removed.
此外，在使透光层7露出后，将片材20除去。但是，也可以在使透光层7露出前，将片材20除去。Moreover, after exposing the light-transmitting layer 7, the sheet|seat 20 is removed. However, the sheet 20 may be removed before exposing the light-transmitting layer 7 .
(载置发光元件的工序)(Step of Mounting Light-Emitting Elements)
如图17D所示，载置发光元件的工序S304是使发光面1a与波长转换部件3的第一面3a对面而载置发光元件1的工序。As shown in FIG. 17D , the step S304 of placing the light-emitting element is a step of placing the light-emitting element 1 with the light-emitting surface 1 a facing the first surface 3 a of the wavelength conversion member 3 .
该工序S304与发光装置100C的制造方法所说明的载置发光元件的工序S205大致相同，因此这里省略说明。This step S304 is substantially the same as the step S205 of mounting the light-emitting element described in the method for manufacturing the light-emitting device 100C, and thus the description thereof is omitted here.
(由反射部件进行被覆的工序)(The step of covering with the reflective member)
如图18A所示，由反射部件进行被覆的工序S305是由反射部件2被覆载置在波长转换部件3上的发光元件1的工序。As shown in FIG. 18A , the step S305 of covering with the reflective member is a step of covering the light-emitting element 1 placed on the wavelength conversion member 3 with the reflective member 2 .
该工序S305除了取代板状部件17(参照具有被覆部件5和波长转换部件3的部件(图13C))，而在具有被覆部件5和透光材料层叠片材25的板状部件18上设置反射部件2以外，其他与发光装置100C的制造方法所说明的由反射部件进行被覆的工序S206大致相同，因此这里省略说明。In this step S305, in place of the plate-shaped member 17 (refer to the member having the covering member 5 and the wavelength conversion member 3 ( FIG. 13C )), the reflection is provided on the plate-shaped member 18 having the covering member 5 and the light-transmitting material laminated sheet 25 Except for the member 2 , other parts are substantially the same as the step S206 of covering with the reflective member described in the manufacturing method of the light-emitting device 100C, and thus the description is omitted here.
(使电极露出的工序)(Step of exposing electrodes)
如图18B所示，使电极露出的工序S306是将电极11、12侧的反射部件2的一部分除去以使发光元件1的电极11、12露出的工序。As shown in FIG. 18B , the step S306 of exposing the electrodes is a step of exposing the electrodes 11 and 12 of the light-emitting element 1 by removing a part of the reflection member 2 on the electrodes 11 and 12 side.
该工序S306与发光装置100C的制造方法所说明的使电极露出的工序S207大致相同，因此这里省略说明。This step S306 is substantially the same as the step S207 of exposing the electrodes described in the manufacturing method of the light-emitting device 100C, and thus the description is omitted here.
(进行切断的工序)(step of cutting)
如图18C所示，进行切断的工序S307是利用切断线对多个沿行列方向排列的发光装置100D的集合体进行切断的工序。即，进行切断的工序S307是对一次形成有多个的发光装置100D的集合体进行单片化的工序。As shown in FIG. 18C , the step S307 of cutting is a step of cutting an aggregate of a plurality of light-emitting devices 100D arranged in the row and column direction using a cutting line. That is, the step S307 of cutting is a step of dividing into pieces the aggregate of the light-emitting devices 100D formed at one time.
该工序S307与在发光装置100C的制造方法中说明过的进行切断的工序S208大致相同，因此这里省略说明。此外，图17A～图18C中仅图示出两个发光装置100D，但实际上沿行列方向排列多个而形成，以使其一个单片化的方式进行切断。This step S307 is substantially the same as the step S208 of cutting described in the method of manufacturing the light-emitting device 100C, and therefore the description is omitted here. 17A to 18C , only two light-emitting devices 100D are shown, but in practice, a plurality of light-emitting devices 100D are formed in a row and column direction, and are cut so as to be separated into pieces.
而且，通过该集合体的单片化，获得多个发光装置100D。Then, a plurality of light-emitting devices 100D are obtained by the singulation of the aggregate.
另外，发光装置的制造方法也可以在不对上述各工序带来负面影响的范围内，在上述各工序之间或前后包含其他工序。例如，也可以包括将制造中途混入的异物除去的异物除去工序等。In addition, the manufacturing method of the light-emitting device may include other steps between or before and after the above-described steps within a range that does not adversely affect the above-described steps. For example, a foreign matter removal step of removing foreign matter mixed in the middle of production, etc. may be included.
工业上的可利用性industrial availability
本发明的实施方式的发光装置能够用在相机的闪光灯、一般照明等各种照明装置中。The light-emitting device according to the embodiment of the present invention can be used in various lighting devices such as a camera flash and general lighting.
| Application Number | Priority Date | Filing Date | Title |
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| JP2017-248301 | 2017-12-25 | ||
| JP2017248301 | 2017-12-25 | ||
| JP2018-123620 | 2018-06-28 | ||
| JP2018123620AJP6658808B2 (en) | 2017-12-25 | 2018-06-28 | Light emitting device and method of manufacturing light emitting device |
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| CN110010745Atrue CN110010745A (en) | 2019-07-12 |
| CN110010745B CN110010745B (en) | 2024-07-26 |
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| CN201811570316.9AActiveCN110010745B (en) | 2017-12-25 | 2018-12-21 | Light emitting device and method for manufacturing light emitting device |
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