Summary of the invention
In one aspect of the invention, a kind of method for making organic light emitting display substrate is proposed.In some embodimentsIn, this method comprises: providing substrate, it is provided with pixel defining layer on the substrate, the pixel defining layer limits multiple sonsPixel region；The ink containing solvent and first anode material is printed on the substrate；The ink of printing is carried outIt is dried, to be based on the pixel defining layer, forms first anode layer.
This method can be simply forming first anode layer by inkjet printing as a result, the thickness of the first anode layer andProfile pattern is easily controllable, and withering temperature is lower in this method, will not be to organic light emitting display substrateOther structures impact, and further improve the display quality and service performance of prepared organic light emitting display substrate.
In some embodiments, the first anode material includes at least one of indium tin mixture, conducting polymer.
The first anode material can preferably form solution as a result, that is, form marking ink, convenient for passing through inkjet printingMethod formed first anode layer.
In some embodiments, the drying temperature of the drying process is 140-180 DEG C.
The temperature of the drying process is lower as a result, will not damage to the other structures of organic light emitting display substrate, intoOne step improves the display performance of prepared organic light emitting display substrate.
In some embodiments, the step of first anode material includes indium tin mixture, forms the ink include:The indium tin mixture is prepared as indium tin-salt solution, is heated to 100-130 DEG C, and be passed through hydrogen peroxide gas.
Thus, it is possible to be simply forming the solution of tin indium oxide, help to form oxygen subsequently through the method for inkjet printingChange indium tin anode layer.
In some embodiments, the method further includes: the ink Jing Guo the drying process is moved backFire processing, annealing temperature are 200-300 DEG C.
The temperature of the annealing is lower as a result, will not damage to the other structures of organic light emitting display substrate, intoOne step improves the display performance of prepared organic light emitting display substrate.
In some embodiments, this method further comprises: in side shape of the first anode layer far from the substrateAt reflecting layer；Second plate layer is formed far from the side of the first anode layer in the reflecting layer.
The service performance of the organic light emitting display substrate is further improved as a result,.
In some embodiments, the second plate layer be by chemical vapour deposition technique and plasma sputtering method extremelyOne of few formation.
The service performance of the organic light emitting display substrate is further improved as a result,.
In some embodiments, the printing rate when the top of the substrate prints the ink is 6-8mm/s, describedThe concentration of ink is 1.5-1.7mol/L.
Facilitate the automatic levelling of ink of printing as a result, and facilitate the drying and forming-film of ink, that is, helps to improve shapeAt first anode layer profile pattern, improve organic light emitting display substrate display quality.
In some embodiments, the substrate has an inclination angle close to the surface of the pixel defining layer side, and described theOne anode layer is not more than 2 ° far from first inclination angle on the one side of substrate surface.
The profile pattern of the first anode layer formed as a result, is higher, further improves organic light-emitting display deviceShow quality.
In another aspect of this invention, a kind of organic light emitting display substrate is proposed, the organic light emitting display substrate isAs made by mentioned-above method.
There is the organic light emitting display substrate organic light emitting display substrate made by mentioned-above method to be had as a result,The whole features and advantage having, details are not described herein.Generally speaking, the display quality of the organic light emitting display substrate is good.
In still another aspect of the invention, a kind of organic light emitting display substrate is proposed, comprising: substrate, the substrate includePixel defining layer, the pixel defining layer include multiple subpixel areas, and the substrate is close to the pixel defining layer sideSurface has inclination angle；First anode layer, the first anode layer are located in multiple subpixel areas, the first anodeFirst inclination angle on surface of the layer far from the one side of substrate is not more than 2 °.
The organic light emission is watched from the left and right sides of the organic light emitting display substrate with identical deflection angle respectively as a result,When display base plate, the display picture difference watched is smaller, and the display quality of the organic light emitting display substrate is good.
In some embodiments, the thickness of the first anode layer above the substrate at different location is different, describedThe thickness deviation of first anode layer is not more than 2%.
The profile pattern of the first anode layer is preferable as a result, and then can improve the colour cast of organic light emitting display substrateAsymmetry problem improves the display quality of organic light emitting display substrate.
In still another aspect of the invention, a kind of organic light-emitting display device, including organic light emitting display substrate, institute are proposedStating organic light emitting display substrate is made by mentioned-above method or mentioned-above organic light emitting display substrate.
The display device has the organic light emitting display substrate of method noted earlier production or mentioned-above has as a result,Whole feature and advantage possessed by machine luminescence display substrate, details are not described herein.Generally speaking, the display of the display deviceUniformity is preferable, shows better quality.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to endSame or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attachedThe embodiment of figure description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
It was recognized by the inventor that generalling use chemical vapour deposition technique (CVD) or plasma sputtering method (sputter) at presentEtc. come the anode for preparing organic light emitting display substrate, the above method is more demanding to process conditions, and production cost is higher, andAnd in the above method, the anode material (such as tin indium oxide, ITO) of deposition or sputtering is free diffusing, thus the above methodThe thickness of the anode layer of preparation be it is identical, i.e., after a preparation process, deposit or sputter at each position of substrate surfaceThe thickness of the anode layer at place is identical.As previously mentioned, work as organic light emitting display substrate, especially flexible organic light emitting display baseWhen the substrate surface planarization of plate is poor, there are certain inclinations angle, and then after subsequent conventional preparation process, are formed inThere is certain inclination angle in anode, luminescent layer and the cathode of substrate surface, some light that luminescent layer issues passes through lower sectionAfter anode layer reflection, light direction deflects (i.e. light direction is focused to unilateral side), thus respectively from organic light emitting displayWhen organic light emitting display substrate is watched with identical deflection angle in the left and right sides of screen, total light number of left and right sides sendingAmount and light overlap mode etc. have differences, and in turn result in display picture and have differences, display quality is bad, the view of userFeel that experience is poor.
In one aspect of the invention, the invention proposes a kind of methods for making organic light emitting display substrate, at leastAbove-mentioned deficiency can partly be overcome.
In some embodiments, this method by substrate surface inkjet printing include first anode material ink, andBy subsequent drying process, first anode layer easily can be formed in substrate surface, this method can according to need simplicityGround adjusts the thickness and profile pattern of first anode layer, and then the aobvious of prepared organic light emitting display substrate can be improvedShow quality (such as colour cast asymmetry problem that organic light emitting display substrate can be alleviated or avoided), and is dried in this methodThe temperature of processing is lower, will not impact to the other structures of organic light emitting display substrate, further improves preparedThe service performance of organic light emitting display substrate, and reduce production cost.
It should be noted that " substrate of organic light emitting display substrate " mentioned herein is the lining that multilayered structure is formedBottom structure, such as may include the knot that underlay substrate and the multilayer being formed on underlay substrate constitute thin film transistor (TFT) (TFT)Structure, and the body structure surface that multilayer constitutes thin film transistor (TFT) (TFT) also has planarization layer, and " substrate surface " herein refers to liningBottom is close to the surface of pixel defining layer, such as the surface of the planarization layer in substrate；Due to the limitation of preparation process, inventor is logicalA large amount of experiment and research discoveries are crossed, the profile pattern of the planarization layer prepared in the related technology is poor, has inclination angle, thereforeCause substrate that also there is inclination angle close to the surface of pixel defining layer.
In addition, surface that " planarization " referred to herein refers to substrate or anode layer etc. and horizontal plane are (such as with substrateThe lower surface of substrate is reference) departure degree compared, the degree that horizontal plane is deviateed on the surface of substrate or anode layer etc. is bigger, puts downWhole property is poorer." inclination angle " referred to herein is the angle between the surface and horizontal plane of substrate or anode layer etc., inclination angleBigger, the profile pattern of substrate or anode layer etc. is poorer.Also, above-mentioned " horizontal plane " can be brilliant for film not formed in substrateThe plane where underlay substrate when each layer structure of body pipe, for example, when underlay substrate is the planar structure by formation such as glass,Above-mentioned " horizontal plane " is the plane where the underlay substrate.
With reference to Fig. 2 and Fig. 3, the table of the substrate 100 of organic light emitting display substrate 1000 close to 200 side of pixel defining layerSurface evenness is poor, and there are inclination angle, inclination angle a, b and c with reference to shown in Fig. 2, inventor shows the organic light emissionShow different subpixel region (the red subpixel areas 300A, green subpixel areas 300B with reference to shown in Fig. 2 of substrateAnd blue subpixel areas 300C) surface of substrate 100 of corresponding position is focused particle beam analysis (FIB), and by surveyingCalculating and obtaining the inclination angle a on the planarization layer surface of the red subpixel areas corresponding position 300A is 4 °, green subpixel areas 300BThe inclination angle b on the planarization layer surface of corresponding position is 3 °, and the planarization layer surface of the corresponding position blue subpixel areas 300C is inclinedOblique angle c is 3 °.The thickness of the anode layer 400 formed subsequently through depositing operation or sputtering technology be it is uniform, therefore, anode layerThere is also inclinations angle for 400 upper surface, similarly, equal subsequently through the luminescent layer 500 and cathode layer 600 of common process preparationThere are inclination angle, light a part that luminescent layer 500 issues can be projected directly up (with reference to shown in the dotted arrow E in Fig. 2Direction out), another part light can arrive first at following anode layer 400, then after the reflection of anode layer 400, then upwardsIt projects in (direction with reference to shown by the dotted arrow F in Fig. 2), since anode layer 400 and luminescent layer 500 are there are inclination angle,Therefore, the light projected upwards again after the reflection of anode layer 400 can deflect, and light direction focuses to unilateral side and (refers to Fig. 2Light direction shown by middle arrow F focuses to the right), therefore be emitted from the left and right sides of organic light emitting display substrate totalLight can generate difference, consequently lead to the light situation that goes out that the left and right sides is observed and show picture difference.
Specifically, having respectively from the left and right sides of organic light emitting display substrate with the viewing of identical deflection angle with reference to Fig. 3When machine luminescence display substrate, i.e., respectively from figure A point and A ' point watch the organic light emitting display substrate, wherein straight line BCFor the central axes right above organic light emitting display substrate, A point and A ' point are symmetrical along central axes BC, and A point deviates central axes BCDeflection angle (i.e. ∠ ACB) and A ' point deviate central axes BC deflection angle (i.e. ∠ A ' CB) it is equal, such as be 45 degree.From Fig. 3In as can be seen that when watching the organic light emitting display substrate from the A point in left side, light range (the i.e. observation model that can observeEnclose) it can be observed when putting the viewing organic light emitting display substrate from the A ' on right side for the range of triangle m shown in the drawingsThe light range arrived is the range of triangle n shown in the drawings.Due to anode 400, the hair in the organic light emitting display substrateThere is inclination angle in photosphere 500 and cathode 600, therefore, the light projected upwards again after the reflection of anode layer 400 can be to the rightIt deflects, therefore, the viewing range m of A point is less than the viewing range n of A ' point, therefore, from a left side for the organic light emitting display substrateWhen right two sides (i.e. A point and A ' point) are observed, quantity and light superposition situation for the light that organic light emitting display substrate issues etc.It has differences, in turn results in the display picture that the left and right sides observes and have differences, the problem of " colour cast is asymmetric ", display occurSecond-rate, user experience is bad.
According to the method for the embodiment of the present invention, first anode layer is prepared by the method for inkjet printing, it can be preferablyThe thickness and profile pattern of control first anode layer, such as substrate surface planarization are poor, there are when inclination angle, pass through ink-jetWhen printing the first anode layer formed, by concentration and the rate of inkjet printing etc. for controlling ink, it can make to be printed upon liningThe ink of bottom surface passes through the automatic levelling of gravity, thus subsequently through the surface of the first anode layer formed after drying processPlanarization is higher, thus mitigates or even avoid mentioned-above since the poor caused colour cast of the planarization of substrate surface is not rightTitle problem improves the display quality and user experience of prepared organic light emitting display substrate.
In some embodiments, with reference to Fig. 1, this method comprises:
S100: substrate is provided
It in some embodiments, as previously mentioned, substrate may include multilayered structure, such as may include the glass base of hardPlate or flexible plastic substrates, and may include the plural layers transistor (TFT) being formed on hard substrate or flexible base boardAnd the structures such as capacitor, and can also include planarization layer of the setting in the isostructural top plural layers transistor (TFT).
In some embodiments, with reference to (a) in Fig. 5, (such as the substrate of pixel defining layer 200 is provided on substrate 100The surface of planarization layer (not shown) in 100 is provided with pixel defining layer 200), pixel defining layer 200 limits multipleSubpixel area 300, the corresponding color of multiple subpixel areas 300 is different, for example, with reference to shown in Fig. 5, sub-pixel areaDomain 300 may include red subpixel areas 300A, green subpixel areas 300B and blue subpixel areas 300C.OneIn a little embodiments, planarization of the substrate 100 close to the surface of pixel defining layer 200 is not particularly limited, for example, as previously mentioned,In the related technology technique preparation substrate 100 close to the surface of pixel defining layer 200 (substrate 100 i.e. shown in the drawings"upper" surface) planarization is poor, there are inclination angle, also, red subpixel areas 300A, green subpixel areas 300B andInclination angle a, b and c of corresponding 100 upper surface of substrate blue subpixel areas 300C are not exactly the same, red sub-pixel areaThe inclination angle a on the planarization layer surface of the domain corresponding position 300A is 4 °, the planarization layer table of the corresponding position green subpixel areas 300BThe inclination angle b in face is 3 °, and the inclination angle c on the planarization layer surface of the corresponding position blue subpixel areas 300C is 3 °.
S200: ink of the printing containing solvent and first anode material
In this step, the top printing of substrate described in step contains solvent and first anode material in frontInk.In some embodiments, the concrete type of first anode material is not particularly limited, specifically, first anode material canWith include indium tin mixture (such as mass ratio 90:10,95:5 etc.), conducting polymer etc..The first anode material can as a result,To be dissolved in certain solvent, preferably formation solution forms marking ink, convenient for forming the by the method for inkjet printingOne anode layer.
In some embodiments, solvent used for example can be dimethylbenzene, cyclohexanone, chlorobenzene, dichlorotoleune, benzyl ringHexane etc..
In some embodiments, conducting polymer used for example can be the poly- (styrene sulfonic acid of Polyglycolic acid fibre-Salt) PEDOT:PSS.
According to a particular embodiment of the invention, when first anode material includes indium tin mixture, before marking ink,With reference to Fig. 4, this method further comprises:
S400: ink is formed
In this step, preparation forms the tin indium oxide ink of first anode layer.In some embodiments, ink is formedStep may include: indium tin mixture to be prepared as indium tin-salt solution, such as be prepared as indium tin Acetate Solution, be then heated to100-130 DEG C, such as 120 DEG C are heated to, and be passed through hydrogen peroxide gas, it is reacted, tin indium oxide solution can be formed, i.e.,Form marking ink.The tin indium oxide ink that this method is formed, in subsequent processing, it is only necessary under middle cryogenic conditions, i.e.,Can drying and forming-film, formed tin indium oxide first anode layer, which will not be to the other structures of the organic light emission substrate(such as the structures such as thin film transistor (TFT) in mentioned-above substrate) damage, and further improve made organic light emissionThe service performance of display base plate.
Also, as previously mentioned, in the related technology technique preparation substrate close to pixel defining layer profile pattern compared withDifference, there are inclinations angle, and the inclination angle of the corresponding substrate surface of subpixel area of different colours is different, and the embodiment of the present inventionIn by inkjet printing formed the first anode layer when, on substrate side printing above-mentioned material formed ink after, the ink of printingThe automatic levelling of gravity can be relied on, therefore, in printing without considering the corresponding substrate surface in different subpixel regionPlanarization, even if the planarization (i.e. inclination angle) of the corresponding substrate surface in different subpixel region is different, first finally preparedThe upper surface planarization of anode layer is also preferable, as long as controlling the ink volume printed in each subpixel area.As a result, shouldMethod is easy to operate, carries out special parameter tune without the substrate surface for the corresponding different inclination angle in different subpixel regionSection.
In some embodiments, the concentration of the marking ink of formation can be 1.5-1.7mol/L, for example, the ink includesWhen mentioned-above tin indium oxide solution, the concentration of ink can be 1.5-1.7mol/L, specifically, can be 1.6mol/LDeng.As a result, body within this range when, the levelability of ink is preferable, facilitate printing ink under the effect of gravity fromDynamic levelling, and the film forming homogeneity of the ink is preferable.When the concentration of ink is excessive, after ink is sprayed by nozzle, in substrateThe levelability on surface is deteriorated, and drop collection fusion is strong, is not easy and substrate dispersing contact；When the concentration of solution is too small, and will lead toThe homogeneity of film layer is deteriorated when being made annealing treatment.Therefore, the concentration of marking ink both has preferable stream in above rangeLevelling, and be conducive to form uniform film layer by being dried and making annealing treatment etc., thus, advantageously form surfacingThe preferable first anode layer of property.
In some embodiments, on substrate square marking ink when, the diameter of printing head can be smaller, and printing rate canThink 6-8mm/s, thus the printing rate facilitates the ink printed automatic levelling under the effect of gravity, that is, helps to improve shapeAt first anode layer profile pattern, improve organic light emitting display substrate display quality.Rate is too fast will lead to for printingThe film forming of ink is deteriorated, and the homogeneity of film forming reduces；Although the homogeneity of film forming can be improved relatively slowly by printing rate excessively,It will increase the process time, increase production cost, while if the print time is too long, also will affect the best film formation time of ink.Therefore, on substrate square marking ink when, print rate in above range, preferable first sun of profile pattern can be preparedPole layer, and production cost can be saved.
S300: being dried, and forms first anode layer
In this step, the ink printed in preceding step is dried, to form first anode layer.ExampleSuch as, selection does not influence the other structures (such as the structures such as thin film transistor (TFT) in mentioned-above substrate) of the organic light emission substrateIn the case where heating temperature.For example, the heating temperature can be not higher than 300 DEG C, 200 DEG C can be not higher than.It can be 140-180 DEG C, can be 150 DEG C etc..It can be 160 DEG C specifically, can be 150 DEG C, can be 170 DEG C, can be 175 DEG C etc.,Drying time can be 10-30min, facilitate solvent in the ink as a result, and all evaporate, and forming properties good theOne anode layer.
In some embodiments, when the marking ink is formed by indium tin mixture solution, with reference to Fig. 6, this method is into oneStep includes:
S500: it is made annealing treatment
In this step, the ink (i.e. the solution of tin indium oxide) Jing Guo mentioned-above drying process is carried out at annealingReason, to form first anode layer.It specifically, annealing temperature can be 200-300 DEG C, such as can be 220 DEG C, Ke Yiwei250 DEG C, can be 275 DEG C etc..Thus, on the one hand, the temperature of the annealing is lower, will not be to organic light emitting display substrateOther structures damage, and further improve the display performance of prepared organic light emitting display substrate；On the other hand, this is moved backThe electric conductivity of first anode layer can be improved in fire processing, even if guaranteeing that is contained in ink is the tin indium oxide of non-particulate form, finallyTin indium oxide (ITO) first anode layer of acquisition also can have preferable electric conductivity.
In some embodiments, as previously mentioned, when substrate has inclination angle close to the surface of pixel defining layer side, exampleWhen such as inclination angle is 3 °, 4 °, prepared first anode layer is far from one side of substrate surface according to the method for the embodiment of the present inventionThe first inclination angle can be not more than 2 °, specifically, can be not more than 1 °, can be not more than 0.5 °, can for 0 ° (i.e. first sunPole surface of the layer far from one side of substrate is parallel with horizontal plane, i.e. surface of the first anode layer far from one side of substrate is substantially flat), byThis, the profile pattern above by the first anode layer of the method formation of inkjet printing is higher, further improves organic hairThe display quality of electro-optical display device.
Also, inventor is tested by transmission electron microscope (TEM), calculates the first anode layer 410 prepared in preceding stepThickness deviation be not more than 2%, specifically, can be not more than 1%, can be not more than 0.5%, it might even be possible to be 0 etc..It needsBright, above-mentioned " thickness deviation " refers to that the first anode layer deviates the maximum distance of horizontal plane far from the surface of one side of substrate,With the percentage of the maximum thickness of the first anode layer.The thickness deviation is smaller, illustrates the first anode layer far from substrate oneThe profile pattern of side is better.As a result, above by inkjet printing method formed first anode layer profile pattern compared withHeight further improves the display quality of organic light-emitting display device.
In some embodiments, after forming first anode layer, with reference to Fig. 7, this method further comprises:
S600: reflecting layer is formed
In this step, the first anode layer forms reflecting layer, such as silver layer, tool far from the side of substrate in frontBody, reflective silver layer can be formed by coating method.With reference to (c) in Fig. 5, reflective silver layer 420 is formed in first anode layer 410Side far from substrate 100.The reflecting layer 420 can reflect the light of the sending of the luminescent layer (not shown) above it, can be withImprove the emission extraction efficiency of the organic light emitting display substrate.
S700: first anode layer is formed
In this step, second plate layer is formed far from the side of first anode layer in reflecting layer.With reference to (c) in Fig. 5,Second plate layer 430 is formed in side of the reflecting layer 420 far from first anode layer 410, further improves organic hair as a result,The service performance of light display base plate.
The preparation method of second plate layer is not particularly limited, as previously mentioned, when the upper surface planarization of substrate is poor,The planarization that the first anode layer above substrate is formed in by inkjet printing is preferable, therefore, rectangular on the first anode layerWhen at other each layer structures, the preferable film layer of planarization can be formed using existing preparation process, will not influence organic light emissionThe display quality of display device.
In some embodiments, second plate layer can be through chemical vapour deposition technique and plasma sputtering method extremelyOne of few formation.The service performance of the organic light emitting display substrate is further improved as a result,.
In summary, method of the invention crosses the method for inkjet printing to prepare first anode layer, can preferably controlThe thickness and profile pattern of first anode layer, such as substrate surface planarization are poor, there are when inclination angle, pass through inkjet printingWhen the first anode layer of formation, by concentration and the rate of inkjet printing etc. for controlling ink, it can make to be printed upon substrate tableThe ink in face passes through the automatic levelling of gravity, thus subsequently through the surfacing of the first anode layer formed after drying processProperty it is higher, thus mitigate even avoid it is mentioned-above due to the planarization of substrate surface it is poor caused by colour cast asymmetry askTopic improves the display quality and user experience of prepared organic light emitting display substrate.Also, this method can use existingInk jet printing device produced, without increasing additional new equipment, and lower production costs.
In another aspect of this invention, the invention proposes a kind of organic light emitting display substrate, the organic light emitting display basesPlate is as made by mentioned-above method.The organic light emitting display substrate has made by mentioned-above method as a result,Organic light emitting display substrate possessed by whole feature and advantage, details are not described herein.Generally speaking, the organic light emission is aobviousShow that the display quality of substrate is good.
In still another aspect of the invention, the invention proposes a kind of organic light emitting display substrate, the organic light emitting display basesPlate can be as made by mentioned-above method.The organic light emitting display substrate has mentioned-above method institute as a result,Whole feature and advantage possessed by the organic light emitting display substrate of production, details are not described herein.
In some embodiments, with reference to Fig. 8, which includes: substrate 100 and the first anodeLayer 410, substrate 100 have pixel defining layer 200, and pixel defining layer 200 limits multiple subpixel areas 300, and substrate 100 leans onThe surface of nearly 200 side of pixel defining layer has inclination angle (referring to inclination angle a, b and c shown in the drawings).First anode layer410 are arranged in multiple subpixel areas 300, and first inclination angle on surface of the first anode layer 400 far from 100 side of substrate is notGreater than 2 °, specifically, the first inclination angle can be not more than 1 °, it can be 0 ° etc..
The organic light emitting display substrate 1000, which may further include, is successively set on shining for 410 top of first anode layerLayer 500 and cathode layer 600, the luminous light of luminescent layer 500 can be uniform along the direction of dotted arrow shown in the drawings as a result,Ground projects, and it is organic from the left and right sides of the organic light emitting display substrate 1000 with identical deflection angle to watch this respectively as a result,When luminescence display substrate 1000, the display picture difference watched is smaller, and the display quality of the organic light emitting display substrate is good.
In some embodiments, the thickness of the first anode layer 410 at 100 top different location of substrate is different, therefore,There are in the case where inclination angle, the upper surface of the first anode layer 410 can be more smooth for the upper surface of substrate 100.Specifically,The thickness deviation of first anode layer 410 is not more than 2%, specifically, can be not more than 1%, can be not more than 0.5%, or even canThink 0 etc..The profile pattern of the first anode layer is preferable as a result, and then can improve the colour cast of organic light emitting display substrateAsymmetry problem improves the display quality of organic light emitting display substrate.
In still another aspect of the invention, the invention proposes a kind of organic light-emitting display devices, with reference to Fig. 9, display dressSetting 2000 includes organic light emitting display substrate (not shown), which is by mentioned-above method systemOrganic light emitting display substrate make or mentioned-above.The display device has having for method noted earlier production as a result,Whole feature and advantage possessed by machine luminescence display substrate or mentioned-above organic light emitting display substrate, herein no longerIt repeats.Generally speaking, the show uniformity of the display device is preferable, shows better quality.
In the description of the present invention, the orientation or position of the instructions such as term " on ", "lower", "top", "bottom", " left side ", " the right "Setting relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of the description present invention rather than requires the present invention mustIt must be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In the description of this specification, the description of reference term " one embodiment ", " another embodiment " etc. means to tieThe embodiment particular features, structures, materials, or characteristics described are closed to be included at least one embodiment of the present invention.At thisIn specification, the schematic representation of the above terms does not necessarily have to refer to the same embodiment or example.Moreover, the tool of descriptionBody characteristics, structure, material or feature may be combined in any suitable manner in any one or more of the embodiments or examples.ThisOutside, without conflicting with each other, those skilled in the art by different embodiments described in this specification or can showThe feature of example and different embodiments or examples is combined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is exampleProperty, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentionedEmbodiment is changed, modifies, replacement and variant.