Disclosure of Invention
The invention provides a touch display device, a display panel, an array substrate and a manufacturing method thereof, which can further reduce the overall thickness of the touch display panel.
Based on the above object, the present invention provides an array substrate comprising: a light emitting device driving circuit layer integrated with a light emitting function layer of an OLED device and a plurality of electromagnetic coils and driving the OLED device to emit light; wherein,,
the first electrode of the metal of the OLED device and the electromagnetic coil are arranged on the same metal layer;
the second electrode of the OLED device has a plurality of openings, and each electromagnetic coil has at least one section of metal wire opposite to the openings.
Wherein the electromagnetic coil is single turn; and
and the input end and the output end of the electromagnetic coil are led out from the metal layer and connected to the IC chip.
Alternatively, the electromagnetic coil is multi-turn; and
one end of the electromagnetic coil is led out from the metal layer and connected to an IC chip;
the other end of the electromagnetic coil is connected to a metal wire in the light-emitting device driving circuit layer through a metallized via hole; wherein the metal wire is connected to the IC chip.
Wherein, the thin film transistor is integrated in the light-emitting device driving circuit layer; and
the metal wire is specifically a metal wire in the same layer as the grid electrode of the thin film transistor or a metal wire in the same layer as the source/drain electrode of the thin film transistor.
The invention also provides a touch display panel, comprising: an array substrate as described above.
The invention also provides a touch display device, which comprises: the touch display panel as described above.
The invention also provides a manufacturing method of the array substrate, which comprises the following steps:
when the first electrode of the metal of the OLED device of the array substrate is manufactured, a plurality of electromagnetic coils are also formed in the same metal layer;
forming a second electrode of the OLED device with a plurality of openings in a patterned manner while manufacturing the second electrode of the OLED device;
wherein each electromagnetic coil has at least one section of wire opposite to the opening.
Wherein the electromagnetic coil is multi-turn; and one end of the electromagnetic coil is led out of the metal layer and connected to an IC chip; and
before the manufacturing of the first electrode of the metal of the OLED device of the array substrate, the method further includes:
forming a metallized via hole connecting the metal layer and a metal wire in a light emitting device driving circuit layer of the array substrate, so that the other end of the electromagnetic coil is connected to the metal wire in the light emitting device driving circuit layer through the metallized via hole; wherein the metal wire is connected to the IC chip.
Wherein, the light-emitting device driving circuit layer is integrated with a thin film transistor; and
before the manufacturing of the first electrode of the metal of the OLED device of the array substrate, the method further includes:
the metal line is formed when forming the gate electrode of the thin film transistor.
Alternatively, before the manufacturing of the first electrode of the metal of the OLED device of the array substrate, the method further includes:
and forming the metal line when forming the source/drain electrode of the thin film transistor.
In the technical scheme of the invention, an electromagnetic touch sensing layer in the array substrate is removed, and an electromagnetic coil is integrated in a luminous functional layer of the array substrate; the electromagnetic coil and the first electrode of the metal of the OLED device integrated in the light-emitting functional layer are arranged in the same metal layer, so that the thickness of the light-emitting functional layer is not increased, and meanwhile, the electromagnetic touch sensing layer is removed, so that the aim of further thinning the whole thickness of the touch display panel is fulfilled; the second electrode of the OLED device integrated in the luminous functional layer is provided with a plurality of openings, so that each electromagnetic coil is provided with at least one section of metal wire corresponding to the opening; therefore, when in touch control, the fingers and the coil can form a capacitor which cannot be shielded by the electrode of the OLED device, when in touch control, the capacitor between the hands and the coil is changed, so that a touch control signal is changed to further detect the position where touch control occurs, or an induction electric field is generated by action between the touch control pen and the electromagnetic coil, so that the electromagnetic coil generates induction current to realize a touch control function; when the touch feedback is carried out, the control unit can realize the touch feedback function by acting the electromagnetic field generated by the electromagnetic coil on the magnet at the top end of the touch pen after the operation such as forward electrifying, reverse electrifying and the like of the electromagnetic coil at the corresponding position.
Detailed Description
The present invention will be further described in detail below with reference to specific embodiments and with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the present invention more apparent.
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless expressly stated otherwise, as understood by those skilled in the art. It will be further understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. The term "and/or" as used herein includes all or any element and all combination of one or more of the associated listed items.
It should be noted that, in the embodiments of the present invention, all the expressions "first" and "second" are used to distinguish two entities with the same name but different entities or different parameters, and it is noted that the "first" and "second" are only used for convenience of expression, and should not be construed as limiting the embodiments of the present invention, and the following embodiments are not described one by one.
In the technical scheme of the invention, an electromagnetic touch sensing layer in the array substrate is removed, and an electromagnetic coil is integrated in a luminous functional layer of the array substrate; the electromagnetic coil and the first electrode (such as an anode) of the metal of the OLED device integrated in the light-emitting functional layer are arranged in the same metal layer, so that the thickness of the light-emitting functional layer cannot be increased, and meanwhile, the electromagnetic touch sensing layer is removed, so that the aim of further thinning the whole thickness of the touch display panel is fulfilled; and a second electrode (such as a cathode) of the OLED device integrated in the light-emitting functional layer has a plurality of openings, such that each electromagnetic coil has at least one section of metal wire opposite to the openings; therefore, when in touch control, the fingers and the coil can form a capacitor which cannot be shielded by the electrode of the OLED device, when in touch control, the capacitor between the hands and the coil is changed, so that a touch control signal is changed to further detect the position where touch control occurs, or an induction electric field is generated by action between the touch control pen and the electromagnetic coil, so that the electromagnetic coil generates induction current to realize a touch control function; when the touch feedback is carried out, the control unit can realize the touch feedback function by acting the electromagnetic field generated by the electromagnetic coil on the magnet at the top end of the touch pen after the operation such as forward electrifying, reverse electrifying and the like of the electromagnetic coil at the corresponding position.
The following describes the technical scheme of the embodiment of the present invention in detail with reference to the accompanying drawings.
The structure of the array substrate provided by the embodiment of the invention, which can be arranged in the touch display panel, is shown in fig. 3, and the array substrate comprises: a substrate 301, a light emitting function layer 303, and a light emitting device driving circuit layer 302 between the substrate 301 and the light emitting function layer 303.
Wherein, the light emitting function layer 303 is integrated with an OLED device and a plurality of electromagnetic coils 320;
a thin film transistor is integrated in the light emitting device driving circuit layer 302;
the light emitting device driving circuit layer 302 is used to drive the OLED devices in the light emitting functional layer 303 to emit light.
Specifically, the OLED device in the light emitting functional layer 303 generally includes: a first electrode (such as an Anode) 311, a second electrode (such as a Cathode) 312 of the OLED device, and an EML (emission Layer) 313 between the first electrode 311 and the second electrode 312; further, the OLED device may further include: HTL (Hole Transport Layer, hole-transporting layer) or HIL (Hole Inject Layer, hole-injecting layer) between the first electrode 311 and the EML313, and ETL (Electron Transport Layer, electron-transporting layer) or EIL (Electron Inject Layer, electron-injecting layer) between the EML313 and the second electrode 312.
Wherein the first electrode 311 of the OLED device is metallic, and the second electrode 312 of the OLED device is transparent, and may be made of a magnesium-silver layer material.
The electromagnetic coil 320 is disposed on the same metal layer as the first electrode 311 of the metal of the OLED device. That is, when the first electrode 311 of the metal of the OLED device is formed in one patterning process or printing process, the electromagnetic coil 320 is also formed in the same metal layer. The electromagnetic coil 320 is spaced apart from and electrically isolated from the first electrode of the OLED device. The electromagnetic coils 320 are also spaced apart from each other and are electrically isolated. The width of the area enclosed by the electromagnetic coil 320 may be 1-5 mm.
Since the electromagnetic coil 320 is in the same metal layer as the first electrode of the OLED device, the thickness of the metal layer may be the same as the thickness of the metal layer of the first electrode of the OLED device when no electromagnetic coil is disposed in the light emitting functional layer. Therefore, compared with the existing array substrate structure integrated with the electromagnetic touch sensing layer, the technical scheme of the invention removes the electromagnetic touch sensing layer without increasing the thickness of the layer where the electromagnetic coil is located, such as the luminous functional layer, thereby achieving the purpose of further reducing the overall thickness of the touch display panel.
The electromagnetic coil 320 may be single turn, that is, a single electromagnetic coil 320 is wound from only one turn of wire; a top view of a single turn electromagnetic coil 320 integrated in the light emitting functional layer 303 is shown in fig. 4 a. Both the input end and the output end of the single-turn electromagnetic coil 320 (i.e., the two ends of the electromagnetic coil 320) can be led out from the metal layer where the first electrode 311 of the OLED device is located (i.e., the metal layer where the electromagnetic coil 320 and the first electrode 311 of the OLED device are co-located) and connected to the IC chip.
The thin film transistor in the light emitting device driving circuit layer 302 may specifically include: a gate 331, a source 332, a drain 333, and an IGZO (indium gallium zinc oxide) semiconductor channel 334 between the source 332 and the drain 333.
Wherein the gate 331, source 332, and drain 333 are all metallic; generally, the gate electrode 331 is formed on one metal layer in the light emitting device driving circuit layer 302, and the source electrode 332 and the drain electrode 333 are formed on the other metal layer in the light emitting device driving circuit layer 302.
In fact, the gate electrode 331 of the thin film transistor needs to be connected to the control chip through a trace, and receives the control signal, so that the same metal layer is formed as the data line of the gate electrode 331 when the gate electrode 331 is formed. That is, the data line of the gate electrode 331 is also provided in the same layer as the gate electrode 331.
In addition, the source 332 or the drain 333 of the thin film transistor also needs to be connected to other devices or power sources through wirings; therefore, when forming the source 332 and the drain 333, the wirings of the source 332/drain 333 are also formed on the same metal layer; that is, the wirings connected to the source 332 or the drain 333 are also provided in the same layer as the source 332 or the drain 333.
The electromagnetic coil 320 may also be multi-turn, that is, a single electromagnetic coil 320 may be wound from multiple turns of wire, thereby enhancing the electromagnetic induction capability of the electromagnetic coil 320; a top view of the multi-turn electromagnetic coil 320 integrated in the light emitting functional layer 303 is shown in fig. 4 b:
for the multi-turn electromagnetic coil 320, one end of the electromagnetic coil 320 (for example, an input end or an output end of the electromagnetic coil 320) may be led out from a metal layer where the first electrode 311 of the OLED device is located (i.e., a metal layer where the electromagnetic coil 320 and the first electrode 311 of the OLED device are located) and connected to the IC chip; the other end of the electromagnetic coil 320 (e.g., the output or input of the electromagnetic coil 320) is connected to a metal line in the light emitting device driving circuit layer 302, which is connected to the IC chip, from the metal layer where the first electrode 311 of the OLED device is located through a metallized via. The metal line may in particular be a metal line of the same layer as the gate 331 of the thin film transistor, that is to say also of the same layer as the gate 331, connected between the metallized via and the IC chip.
Alternatively, the metal line connected between the metallized via hole and the IC chip may be a metal line having the same layer as the source 332/drain 333 of the thin film transistor. That is, also the metal lines connected between the metallized vias and the IC chip are co-layered with the source 332/drain 333.
The second electrode 312 of the OLED device is patterned with a plurality of openings such that each electromagnetic coil 320 has at least one length of metal wire opposite the opening; therefore, when in touch control, the fingers and the coil can form a capacitor which cannot be shielded by the electrode of the OLED device, when in touch control, the capacitor between the hands and the coil is changed, so that a touch control signal is changed to further detect the position where touch control occurs, or an induction electric field is generated by action between the touch control pen and the electromagnetic coil, so that the electromagnetic coil generates induction current to realize a touch control function; when the touch feedback is carried out, the control unit can realize the touch feedback function by acting the electromagnetic field generated by the electromagnetic coil on the magnet at the top end of the touch pen after the operation such as forward electrifying, reverse electrifying and the like of the electromagnetic coil at the corresponding position.
Specifically, the touch function is as shown in fig. 5 a: when a hand or a stylus touches, the capacitance of the electromagnetic coil increases, so that a signal at a receiving end is delayed, and the position where touch occurs can be detected through the IC.
The haptic feedback function is shown in fig. 5 b: the principle that the electromagnetic coil flows through the current to generate a magnetic field is utilized for detection, and attraction, repulsion and force-free switching are realized through forward application, reverse application and withdrawal of the current.
When the electromagnetic coil is not applying a current signal: the touch pen can uniformly scratch through the panel, and triangular patterns cannot be felt;
when the solenoid applies a reverse current signal and the stylus achieves repulsion: when the touch stroke passes through the triangle, obvious outward protruding force is generated, so that the triangle can be clearly perceived as protruding.
When the electromagnetic coil applies a forward current signal and the stylus realizes attraction: when the touch stroke passes through the triangle, obvious inward concave force is generated, so that the triangle is perceived as concave.
The embodiment of the invention also provides a touch display device comprising the touch display panel.
In the method for manufacturing the array substrate provided by the embodiment of the invention, when the first electrode (such as the anode) of the metal of the OLED device of the array substrate is manufactured, a plurality of electromagnetic coils are also formed in the same metal layer; forming a second electrode (such as a cathode) of the OLED device with a plurality of openings in a patterned manner when manufacturing the second electrode; wherein each electromagnetic coil has at least one section of wire opposite to the opening.
Specifically, for the case that the electromagnetic coil 320 has a single turn, the flow of the manufacturing method of the array substrate provided in the embodiment of the invention is shown in fig. 6, and the method includes the following steps:
step S601: a light emitting device driving circuit layer 302 is formed on the substrate base 301.
Specifically, the light emitting device driving circuit layer 302 may be formed on the substrate 301 by using a conventional method, which is not described herein.
Step S602: a light emitting function layer 303 is formed on the light emitting device driving circuit layer 302.
Step S603: an encapsulation layer is formed on the light emitting function layer 303.
Specifically, the flow of the method for forming the light emitting functional layer 303 in the step S602 may be as shown in fig. 7, and includes the following steps:
step S701: the first electrode 311 and the plurality of electromagnetic coils 320 of the OLED device in the light emitting function layer 303 are formed in the same metal layer on the light emitting device driving circuit layer 302.
In this step, when the first electrode (such as anode) of the metal of the OLED device of the array substrate is manufactured, a plurality of electromagnetic coils are also formed in the same metal layer.
Specifically, a metal layer is deposited on the light emitting device driving circuit layer 302, and then masking, exposing and etching are performed, so that the first electrode 311 and the plurality of electromagnetic coils 320 of each OLED device in the light emitting function layer 303 are formed in the same metal layer, as shown in fig. 8;
alternatively, the first electrode 311 and the plurality of electromagnetic coils 320 of each OLED device in the light emitting function layer 303 are printed on the light emitting device driving circuit layer 302 in a printing process; and the height of the electromagnetic coil 320 is the same as the height of the first electrode 311 of the OLED device, and is located in the same metal layer.
Step S702: an EML313 of the OLED device is formed on the first electrode 311 of the OLED device.
Specifically, as shown in fig. 9, the EML313 of the OLED device may be formed on the first electrode 311 of the OLED device by using a conventional method, which is not described herein.
Preferably, in this step, the HTL of the OLED device is formed on the first electrode 311 of the OLED device before the EML is formed by the conventional method, then the EML313 of the OLED device is formed on the HTL of the OLED device, and further the ETL is formed on the EML313 of the OLED device, which is not described in detail herein.
Step S703: a patterned second electrode 312 of the OLED device is formed over the EML313 of the OLED device.
In this step, as shown in fig. 10, in fabricating the second electrode (e.g., cathode) of the OLED device, the second electrode of the OLED device having a plurality of openings is formed in a patterned manner, such that each electromagnetic coil 320 has at least one section of metal line opposite to the opening.
Specifically, depositing a layer of ITO film on the ETL of the OLED device, and then masking and etching to obtain a second electrode 312 of the patterned ITO OLED device; the patterned second electrode 312 has a plurality of openings that are respectively opposite to the metal lines of the respective electromagnetic coils 320.
Specifically, for the case that the electromagnetic coil 320 has multiple turns, the flow of the manufacturing method of the array substrate provided in the embodiment of the invention is shown in fig. 11, and the method includes the following steps:
step S1101: a light emitting device driving circuit layer 302 is formed on the substrate base 301.
Specifically, a specific method for forming the light emitting device driving circuit layer 302 integrated with the thin film transistor on the substrate 301, as shown in fig. 12, may include at least the following sub-steps:
sub-step S1201: the gate electrode of the thin film transistor and the metal line described above, which is the same layer as the gate electrode, are formed on the substrate 301.
Specifically, in this substep, after a metal layer is deposited on the substrate 301, masking, exposing, and etching are performed to form a gate of the thin film transistor, a data line of the gate, and the metal line of the same layer as the gate; the metal lines are connected to the IC chip described above.
Substep S1202: and forming an insulating layer (GI layer) covering the grid electrode, the data line of the grid electrode and the metal line which is in the same layer with the grid electrode.
Substep S1203: a semiconductor channel of the thin film transistor is formed on the insulating layer at a position corresponding to the gate electrode.
Sub-step S1204: and etching the insulating layer by using a patterning process of exposure and dry etching to form an insulating layer pattern.
Sub-step S1205: wirings connected to the source and drain electrodes of the thin film transistor and the source/drain electrodes 332 and 333 are formed at both ends of the semiconductor channel.
Alternatively, another specific method for forming the light emitting device driving circuit layer 302 integrated with the thin film transistor on the substrate base 301, as shown in fig. 13, may include at least the following sub-steps:
substep S1301: a gate electrode of a thin film transistor and a data line of the gate electrode are formed on the substrate 301.
Substep S1302: and forming an insulating layer covering the grid electrode and the data line of the grid electrode.
Substep S1303: a semiconductor channel of the thin film transistor is formed on the insulating layer at a position corresponding to the gate electrode.
Sub-step S1304: and etching the insulating layer by using a patterning process of exposure and dry etching to form an insulating layer pattern.
Sub-step S1305: and forming a source electrode, a drain electrode and a metal wire which are connected with the source electrode and the drain electrode of the thin film transistor at two ends of the semiconductor channel and are in the same layer with the source electrode and the drain electrode.
Specifically, in this substep, a metal layer is deposited first, and then masking, exposing and etching are performed to form source and drain electrodes of the thin film transistor connected to two ends of the semiconductor channel, wirings of the source 332/drain 333, and the metal lines on the same layer as the source/drain electrodes; the metal lines are connected to the IC chip described above.
Step S1102: a light emitting function layer 303 is formed on the light emitting device driving circuit layer 302.
Specifically, the method for forming the light emitting functional layer 303 may include the following sub-steps as shown in fig. 14:
substep S1401: the first electrode 311 and the plurality of electromagnetic coils 320 of the OLED device in the light emitting function layer 303 are formed in the same metal layer on the light emitting device driving circuit layer 302, and metallized vias are formed.
In this substep, when a first electrode (such as an anode) of a metal of the OLED device of the array substrate is manufactured, an electromagnetic coil 320 of the same metal layer is formed, wherein one end of the electromagnetic coil 320 is led out from the metal layer to be connected to an IC chip, and in addition, a metallized via hole connecting the metal layer and a metal wire in a light emitting device driving circuit layer of the array substrate is also manufactured, so that the other end of the electromagnetic coil is connected from the metal layer to the metal wire in the light emitting device driving circuit layer through the metallized via hole; wherein the metal wire is connected to the IC chip.
Specifically, a metal layer is deposited after drilling a hole on the light emitting device driving circuit layer 302, so as to obtain a metallized via hole, and then masking, exposing and etching are performed to form a first electrode 311 and a plurality of electromagnetic coils 320 of each OLED device in the light emitting function layer 303, as shown in fig. 4 b.
Substep S1402: an EML313 of the OLED device is formed on the first electrode 311 of the OLED device.
Specifically, the EML313 of the OLED device may be formed on the first electrode 311 of the OLED device by using an existing method, which is not described herein.
Preferably, in this substep, prior methods may be adopted to form the HTL of the OLED device on the first electrode 311 of the OLED device before forming the EML, and then form the EML313 of the OLED device on the HTL of the OLED device, and further form the ETL on the EML313 of the OLED device, which is not described herein in detail.
Sub-step S1403: a patterned second electrode 312 of the OLED device is formed over the EML313 of the OLED device.
In this substep, a second electrode (e.g., a cathode) of the OLED device is patterned to form a plurality of openings therein such that each electromagnetic coil 320 has at least one length of wire opposite the opening.
Specifically, depositing a layer of ITO film on the ETL of the OLED device, and then masking and etching to obtain a second electrode 312 of the patterned ITO OLED device; the openings of the patterned second electrode 31 are opposite to the metal lines of the respective electromagnetic coils 320, respectively.
Step S1103: an encapsulation layer is formed on the light emitting function layer 303.
In the technical scheme of the invention, an electromagnetic touch sensing layer in the array substrate is removed, and an electromagnetic coil is integrated in a luminous functional layer of the array substrate; the electromagnetic coil and the first electrode of the metal of the OLED device integrated in the light-emitting functional layer are arranged in the same metal layer, so that the thickness of the light-emitting functional layer is not increased, and meanwhile, the electromagnetic touch sensing layer is removed, so that the aim of further reducing the overall thickness of the touch display panel is fulfilled; the second electrode of the OLED device integrated in the luminous functional layer is provided with a plurality of openings, so that each electromagnetic coil is provided with at least one section of metal wire corresponding to the opening; therefore, when in touch control, the fingers and the coil can form a capacitor which cannot be shielded by the electrode of the OLED device, when in touch control, the capacitor between the hands and the coil is changed, so that a touch control signal is changed to further detect the position where touch control occurs, or an induction electric field is generated by action between the touch control pen and the electromagnetic coil, so that the electromagnetic coil generates induction current to realize a touch control function; when the touch feedback is carried out, the control unit can realize the touch feedback function by acting the electromagnetic field generated by the electromagnetic coil on the magnet at the top end of the touch pen after the operation such as forward electrifying, reverse electrifying and the like of the electromagnetic coil at the corresponding position.
Those of skill in the art will appreciate that the various operations, methods, steps in the flow, acts, schemes, and alternatives discussed in the present invention may be alternated, altered, combined, or eliminated. Further, other steps, means, or steps in a process having various operations, methods, or procedures discussed herein may be alternated, altered, rearranged, disassembled, combined, or eliminated. Further, steps, measures, schemes in the prior art with various operations, methods, flows disclosed in the present invention may also be alternated, altered, rearranged, decomposed, combined, or deleted.
Those of ordinary skill in the art will appreciate that: the discussion of any of the embodiments above is merely exemplary and is not intended to suggest that the scope of the disclosure, including the claims, is limited to these examples; the technical features of the above embodiments or in the different embodiments may also be combined within the idea of the invention, the steps may be implemented in any order and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omission, modification, equivalent replacement, improvement, etc. of the present invention should be included in the scope of the present invention.