CN109686771B - Display panel and display device - Google Patents

Abstract

The embodiment of the invention provides a display panel and a display device, relates to the technical field of display, increases the distance between an organic isolation layer and the edge of a thin film packaging layer, and improves the anti-water-oxygen performance of the display panel. The display panel includes: a display area and a non-display area; a light emitting element including an anode layer, a light emitting layer, and a cathode layer; the drive circuit is positioned in the non-display area; a negative power supply signal line between the driving circuit and the display region; the signal transmission wiring is positioned between the driving circuit and the display area and is respectively electrically connected with the negative power signal wire and the cathode layer; the organic isolating layer covers the region, which is not in contact with the cathode layer, in the signal transmission line; and the film packaging layer covers the display area and the non-display area.

Description

Display panel and display device

[ technical field ] A method for producing a semiconductor device

The invention relates to the technical field of display, in particular to a display panel and a display device.

[ background of the invention ]

In order to prevent the display device in the display panel from being corroded by water and oxygen, the display film layer can be packaged in a thin film packaging manner at present. As shown in fig. 1, fig. 1 is a schematic cross-sectional structure diagram of a display panel in the prior art, the display panel includes a display area 1 ' and a non-display area 2 ', a negative power signal line 3 ', a driving circuit 4 ' and a signal transmission line 5 ' are disposed in the non-display area 2 ', wherein the negative power signal line 3 ' is located on a side of the driving circuit 4 ' far from the display area 1 ', the signal transmission line 5 ' is located above the driving circuit 4 ', and the signal transmission line 5 ' is used for transmitting a negative power signal to a cathode layer 6 '.

Since the thin film package layer has poor adhesion to the signal transmission trace 5 ' formed of a metal material, in order to prevent the two from being separated from each other and causing package failure, an organic isolation layer 7 ' is usually coated on the signal transmission trace 5 ' in the prior art. However, since the coverage area of the signal transmission trace 5 'and the organic isolation layer 7' is large, the inorganic layer in the thin film encapsulation layer 8 'will make large-area contact with the organic isolation layer 7', which affects the water and oxygen blocking capability, thereby reducing the encapsulation effect.

[ summary of the invention ]

In view of this, embodiments of the present invention provide a display panel and a display device, which increase a distance between an organic isolation layer and an edge of a thin film encapsulation layer, and improve anti-water-oxygen performance of the display panel.

In one aspect, an embodiment of the present invention provides a display panel, including:

a display area and a non-display area;

a light emitting element including an anode layer, a light emitting layer, and a cathode layer;

the driving circuit is positioned in the non-display area;

a negative power supply signal line between the driver circuit and the display region;

the signal transmission wiring is positioned between the driving circuit and the display area and is electrically connected with the negative power signal wire and the cathode layer respectively;

the organic isolation layer covers the region, which is not contacted with the cathode layer, in the signal transmission line;

and the film packaging layer covers the display area and the non-display area.

Optionally, the thin film encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, and the organic encapsulation layer is located between the first inorganic encapsulation layer and the second inorganic encapsulation layer.

Optionally, the driving circuit is a scan driving circuit;

the negative power signal line and the signal transmission line are positioned between the scanning driving circuit and the display area.

Optionally, the minimum distance between the organic isolation layer and the edge of the thin film encapsulation layer is L1, and L1 is greater than or equal to 500 μm and less than or equal to 1100 μm;

the edge of the film packaging layer is the edge of the film layer closest to the edge of the display panel in the film packaging layer.

Optionally, the driving circuit is a light emitting driving circuit;

the negative power signal line and the signal transmission line are positioned between the light-emitting driving circuit and the display area.

Optionally, the method further includes:

a scan driving circuit between the light emitting driving circuit and the display region;

the negative power signal line and the signal transmission wiring are positioned between the light-emitting driving circuit and the scanning driving circuit.

Optionally, the minimum distance between the organic isolation layer and the edge of the thin film encapsulation layer is L2, and L2 is 380 μm or more and 750 μm or less;

the edge of the film packaging layer is the edge of the film layer closest to the edge of the display panel in the film packaging layer.

Optionally, the method further includes:

the pixel definition layer is positioned between the anode layer and the cathode layer, the pixel definition layer is used for defining the light emitting layer, and the organic isolation layer and the pixel definition layer are arranged on the same layer.

Optionally, the driving circuit includes a thin film transistor, and the thin film transistor includes a gate layer and a source drain layer;

the negative power supply signal line and the source drain layer are arranged at the same layer, and the signal transmission wiring and the anode layer are arranged at the same layer.

Optionally, the method further includes:

the pixel circuit comprises a thin film transistor and a storage capacitor, wherein the thin film transistor comprises a grid layer and a source drain layer, and the storage capacitor comprises a first electrode layer and a second electrode layer;

the driving circuit is electrically connected with the pixel circuit through a connecting wire, and the connecting wire is arranged on the same layer with the gate layer and the first electrode layer, or the connecting wire is arranged on the same layer with the second electrode layer.

In another aspect, an embodiment of the present invention provides a display device, including the display panel described above.

One of the above technical solutions has the following beneficial effects:

compared with the prior art, in the technical scheme provided by the embodiment of the invention, on one hand, the negative power signal line is arranged on one side of the driving circuit facing the display area, and the distance between the negative power signal line and the cathode layer is reduced in the direction parallel to the plane of the display panel, so that when the signal transmission routing is used for realizing the electric connection of the negative power signal line and the cathode layer, the length of the signal transmission routing can be effectively reduced, and the coverage area of the organic isolation layer arranged on the signal transmission routing is reduced. On the other hand, the signal transmission wiring is arranged on one side of the driving circuit facing the display area, the distance between the signal transmission wiring and the edge of the thin film packaging layer can be increased, and the distance between the organic isolation layer and the edge of the thin film packaging layer is increased equivalently.

Therefore, by adopting the technical scheme provided by the embodiment of the invention, based on the arrangement positions of the negative power signal wires and the signal transmission wiring, the coverage area of the organic isolation layer can be effectively reduced, and the distance between the organic isolation layer and the edge of the thin film packaging layer is increased, so that the contact area between the inorganic packaging layer and the organic isolation layer in the thin film packaging layer is reduced, the inorganic packaging layer in the thin film packaging layer is in direct contact with the inorganic passivation layer positioned on one side of the driving circuit facing the light emitting surface in a larger area, and the inorganic layer are in contact to play a better water and oxygen blocking effect, so that the water and oxygen resistance of the display panel is effectively improved.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic cross-sectional view of a prior art display panel;

fig. 2 is a schematic cross-sectional structure diagram of a display panel according to an embodiment of the invention;

fig. 3 is a schematic cross-sectional view of a display panel according to an embodiment of the invention;

fig. 4 is a schematic cross-sectional view of a display panel according to an embodiment of the invention;

fig. 5 is a schematic cross-sectional view of a display panel according to an embodiment of the invention;

fig. 6 is a schematic cross-sectional view of a display panel according to an embodiment of the invention;

fig. 7 is a schematic structural diagram of a display device according to an embodiment of the present invention.

[ detailed description ] embodiments

For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present invention are provided with reference to the accompanying drawings.

It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

It should be understood that although the terms first and second may be used to describe the inorganic encapsulation layers in the embodiments of the present invention, the inorganic encapsulation layers should not be limited to these terms. These terms are only used to distinguish inorganic encapsulation layers from each other. For example, the first inorganic encapsulation layer may also be referred to as the second inorganic encapsulation layer, and similarly, the second inorganic encapsulation layer may also be referred to as the first inorganic encapsulation layer without departing from the scope of embodiments of the present invention.

An embodiment of the present invention provides a display panel, as shown in fig. 2, fig. 2 is a schematic cross-sectional structure diagram of the display panel provided in the embodiment of the present invention, where the display panel includes: adisplay area 1 and anon-display area 2; a light emitting element 3, the light emitting element 3 including ananode layer 4, alight emitting layer 5, and acathode layer 6; adriving circuit 7, thedriving circuit 7 being located in thenon-display area 2; a negative powersupply signal line 8, the negative powersupply signal line 8 being located between thedriver circuit 7 and thedisplay region 1; the signal transmission line 9 is positioned between thedriving circuit 7 and thedisplay area 1, and the signal transmission line 9 is electrically connected with the negativepower signal line 8 and thecathode layer 6 respectively; theorganic isolating layer 10, theorganic isolating layer 10 covers the area which is not contacted with thecathode layer 6 in the signal transmission line 9; and a thinfilm encapsulation layer 11, wherein the thinfilm encapsulation layer 11 covers thedisplay area 1 and thenon-display area 2.

It should be noted that, because the inorganic material has a strong blocking capability against water and oxygen, in order to realize effective encapsulation of the display panel, the thinfilm encapsulation layer 11 includes at least one inorganic encapsulation layer, and when the thinfilm encapsulation layer 11 includes a plurality of stacked encapsulation layers, the encapsulation layer closest to the display film layer is the inorganic encapsulation layer.

Compared with the prior art, in the display panel provided in the embodiment of the invention, on one hand, the negativepower signal line 8 is disposed on the side of thedriving circuit 7 facing thedisplay area 1, and the distance between the negativepower signal line 8 and thecathode layer 6 is reduced in the direction parallel to the plane of the display panel, so that when the signal transmission trace 9 is used to electrically connect the negativepower signal line 8 and thecathode layer 6, the length of the signal transmission trace 9 can be effectively reduced, thereby reducing the coverage area of theorganic isolation layer 10 disposed on the signal transmission trace 9. On the other hand, by disposing the signal transmission traces 9 on the side of the drivingcircuit 7 facing thedisplay region 1, the distance between the signal transmission traces 9 and the edge of the thinfilm encapsulation layer 11 can be increased, which is equivalent to increasing the distance between theorganic isolation layer 10 and the edge of the thinfilm encapsulation layer 11.

It can be seen that, with the display panel provided in the embodiment of the present invention, based on the arrangement positions of the negativepower signal line 8 and the signal transmission trace 9, the coverage area of theorganic isolation layer 10 can be effectively reduced, and the distance between theorganic isolation layer 10 and the edge of the thinfilm encapsulation layer 11 is increased, so that the contact area between the inorganic encapsulation layer in the thinfilm encapsulation layer 11 and theorganic isolation layer 10 is reduced, and the inorganic encapsulation layer in the thinfilm encapsulation layer 11 and theinorganic passivation layer 12 located on the side of the drivingcircuit 7 facing the light emitting surface realize a larger area of direct contact.

Optionally, as shown in fig. 3, fig. 3 is another schematic cross-sectional structure diagram of the display panel according to the embodiment of the present invention, in which the thinfilm encapsulation layer 11 includes a firstinorganic encapsulation layer 13, anorganic encapsulation layer 14, and a secondinorganic encapsulation layer 15, and theorganic encapsulation layer 14 is located between the firstinorganic encapsulation layer 13 and the secondinorganic encapsulation layer 15. Because the stepless packaging layer has stronger water and oxygen blocking capability, two inorganic packaging layers are arranged in thefilm packaging layer 11, and the water and oxygen blocking capability of thefilm packaging layer 11 can be effectively improved. In addition, anorganic encapsulation layer 14 is arranged between the two inorganic encapsulation layers, so that the bending resistance of thefilm encapsulation layer 11 can be improved, and thefilm encapsulation layer 11 is prevented from being broken when the display panel is bent.

In addition, thenon-display region 2 may further include afirst retaining wall 16 and asecond retaining wall 17, wherein thefirst retaining wall 16 is located on one side of thesecond retaining wall 17 close to thedisplay region 1, an edge of theorganic encapsulation layer 14 extends to thefirst retaining wall 16, and edges of the firstinorganic encapsulation layer 13 and the secondinorganic encapsulation layer 15 extend to thesecond retaining wall 17. Further, thefirst retaining wall 16 and thesecond retaining wall 17 may be located on a side of the drivingcircuit 7 facing thedisplay area 1, that is, an orthographic projection of thefirst retaining wall 16 and thesecond retaining wall 17 on the plane of the display panel at least partially overlaps an orthographic projection of the drivingcircuit 7 on the plane of the display panel.

With this arrangement, on the one hand, compared to theorganic encapsulation layer 14, by making the extension distance of the firstinorganic encapsulation layer 13 and the secondinorganic encapsulation layer 15 toward the edge of the display panel longer, the firstinorganic encapsulation layer 13 and the secondinorganic encapsulation layer 15 can be in direct contact between thefirst retaining wall 16 and thesecond retaining wall 17, and since the inorganic encapsulation layer and the inorganic encapsulation layer are in direct contact, a better water oxygen blocking effect can be achieved, thereby further preventing water oxygen from invading from the side of the display panel. On the other hand, thefirst retaining wall 16 and thesecond retaining wall 17 are both arranged on one side of the drivingcircuit 7 facing thedisplay area 1, and the arrangement positions of thefirst retaining wall 16 and thesecond retaining wall 17 are at least partially overlapped with the arrangement position of the drivingcircuit 7, so that thefirst retaining wall 16 and thesecond retaining wall 17 do not need to occupy extra space in thenon-display area 2, the frame width of the display panel can be further reduced, and the narrow frame design is better realized.

Optionally, as shown in fig. 4, fig. 4 is a schematic cross-sectional view of another display panel provided in the embodiment of the present invention, and in order to drive the display panel to emit light, the display panel further includes apixel circuit 18 and ascan driving circuit 19 for providing a scan signal to thepixel circuit 18. The drivingcircuit 7 according to the embodiment of the present invention may be ascan driving circuit 19, and the negativepower signal line 8 and the signal transmission trace 9 are disposed between thescan driving circuit 19 and thedisplay region 1.

By arranging the negativepower signal line 8 and the signal transmission wiring 9 on one side of thescanning driving circuit 19 close to thedisplay area 1, the distance between theorganic isolation layer 10 and the edge of the thinfilm encapsulation layer 11 can be increased to a greater extent, so that the secondinorganic encapsulation layer 15 and theinorganic passivation layer 12 are in direct contact with each other in a larger area, and the anti-water-oxygen performance of the display panel is further improved.

Referring again to fig. 4, the minimum distance between theorganic isolation layer 10 and the edge of the thinfilm encapsulation layer 11 is L1, and by disposing the negativepower signal line 8 and the signal transmission trace 9 between thescan driving circuit 19 and thedisplay region 1, L1 can satisfy: l1 is more than or equal to 500 mu m and less than or equal to 1100 mu m, wherein the edge of thefilm packaging layer 11 is the edge of the film layer closest to the edge of the display panel in thefilm packaging layer 11; for example, when the thinfilm encapsulation layer 11 includes the firstinorganic encapsulation layer 13, theorganic encapsulation layer 14, and the secondinorganic encapsulation layer 15, the edge of the thinfilm encapsulation layer 11 is an edge defined by the firstinorganic encapsulation layer 13 and the secondinorganic encapsulation layer 15. At this time, compared with the prior art, the contact area between the secondinorganic encapsulation layer 15 and theinorganic passivation layer 12 is larger, so that the display panel has better water and oxygen barrier properties.

Optionally, as shown in fig. 5, fig. 5 is a schematic cross-sectional view of a display panel provided in an embodiment of the present invention, and in order to drive the display panel to emit light, the display panel further includes a light-emittingdriving circuit 20 for providing a light-emitting driving signal to thepixel circuit 18. The drivingcircuit 7 according to the embodiment of the present invention may be a light emitting drivingcircuit 20, and the negativepower signal line 8 and the signal transmission trace 9 are disposed between the light emitting drivingcircuit 20 and thedisplay region 1.

Compared with the prior art, by arranging the negativepower signal line 8 and the signal transmission trace 9 on the side of the light-emittingdriving circuit 20 close to thedisplay region 1, the distance between theorganic isolation layer 10 and the edge of the thinfilm encapsulation layer 11 can also be increased to some extent, so as to increase the contact area between the secondinorganic encapsulation layer 15 and theinorganic passivation layer 12.

Further, referring to fig. 5 again, when the display panel further includes ascan driving circuit 19, and thescan driving circuit 19 is located between the light emitting drivingcircuit 20 and thedisplay region 1, the negativepower signal line 8 and the signal transmission trace 9 can be located between the light emitting drivingcircuit 20 and thescan driving circuit 19.

Referring again to fig. 5, the minimum distance between theorganic isolation layer 10 and the edge of the thinfilm encapsulation layer 11 is L2, and by disposing the negativepower signal line 8 and the signal transmission trace 9 between the light emitting drivingcircuit 20 and thescan driving circuit 19, L2 can satisfy: l2 is more than or equal to 380 mu m and less than or equal to 750 mu m, wherein the edge of thefilm packaging layer 11 is the edge of the film layer closest to the edge of the display panel in thefilm packaging layer 11; for example, when the thinfilm encapsulation layer 11 includes the firstinorganic encapsulation layer 13, theorganic encapsulation layer 14, and the secondinorganic encapsulation layer 15, the edge of the thinfilm encapsulation layer 11 is an edge defined by the firstinorganic encapsulation layer 13 and the secondinorganic encapsulation layer 15. At this time, compared with the prior art, the contact area between the secondinorganic encapsulation layer 15 and theinorganic passivation layer 12 is larger, so that the display panel has better water and oxygen barrier properties.

In addition, referring to fig. 5 again, the display panel further includes a pixel defining layer 21, and the pixel defining layer 21 is located between theanode layer 4 and thecathode layer 6 and is used for defining thelight emitting layer 5. Alternatively, theorganic isolation layer 10 is disposed in the same layer as the pixel defining layer 21. It should be noted that theorganic isolation layer 10 and the pixel defining layer 21 are disposed in the same layer, which means that theorganic isolation layer 10 and the pixel defining layer 21 are formed by using the same material and the same composition process, so that theorganic isolation layer 10 does not need to be formed by using an additional composition process, and the process flow is simplified.

Optionally, as shown in fig. 6, fig. 6 is another schematic cross-sectional structure diagram of the display panel provided in the embodiment of the present invention, where the drivingcircuit 7 includes athin film transistor 22, and thethin film transistor 22 includes anactive layer 23, agate layer 24, and asource drain layer 25; the negativepower signal line 8 and the source/drain layer 25 are disposed in the same layer, and the signal transmission trace 9 and theanode layer 4 are disposed in the same layer.

With this arrangement, the negativepower signal line 8 and the source/drain layer 25 can be formed by the same patterning process, and the signal transmission trace 9 and theanode layer 4 can be formed by the same patterning process, thereby simplifying the process. Moreover, the negativepower signal line 8 and the signal transmission wiring 9 do not need to occupy extra film space, the thickness of the display panel is not increased, and the light and thin design of the display panel is facilitated.

In addition, please refer to fig. 6 again, in order to achieve the planarization of the display film layer, a planarization layer 29 is further disposed on a side of theinorganic passivation layer 12 facing the light emitting surface, because the planarization layer 29 is usually formed by an organic material, in the embodiment of the present invention, in order to prevent the inorganic encapsulation layer in the thinfilm encapsulation layer 11 from contacting the planarization layer 29 in a large area, the planarization layer 29 may only extend to the position of the negativepower signal line 8, and at this time, the side of the drivingcircuit 7 facing thedisplay area 1 is not covered by the planarization layer 29, so that the direct contact area between the inorganic encapsulation layer in the thinfilm encapsulation layer 11 and theinorganic passivation layer 12 is increased, and the water and oxygen blocking effect is further improved.

Alternatively, referring to fig. 6 again, thepixel circuit 18 includes athin film transistor 22 and astorage capacitor 26, thethin film transistor 22 includes anactive layer 23, agate layer 24 and asource drain layer 25, and thestorage capacitor 26 includes a first electrode layer 27 and a second electrode layer 28. The drivingcircuit 7 and thepixel circuit 18 are electrically connected through a connecting trace (not shown in the figure), and in order to simplify the process flow, the connecting trace can be arranged on the same layer as thegate layer 24 and the first electrode layer 27, and at this time, the connecting trace is formed by the same patterning process as thegate layer 24 and the first electrode layer 27; or, the connection trace and the second electrode layer 28 are disposed on the same layer, and at this time, the connection trace and the second electrode layer 28 are formed by using the same composition process.

It should be noted that fig. 6 illustrates the drivingcircuit 7 and thepixel circuit 18 by using onethin film transistor 22, which is only an exemplary illustration, and in practical applications, the drivingcircuit 7 and thepixel circuit 18 respectively include a plurality ofthin film transistors 22. The specific structure and operation principle of the drivingcircuit 7 and thepixel circuit 18 are the same as those of the prior art, and are not described herein again.

Fig. 7 is a schematic structural diagram of a display device according to an embodiment of the present invention, where the display device includes thedisplay panel 100 as described above. The specific structure of thedisplay panel 100 has been described in detail in the above embodiments, and is not described herein again. Of course, the display device shown in fig. 7 is only a schematic illustration, and the display device may be any electronic device with a display function, such as a mobile phone, a tablet computer, a notebook computer, an electronic book, or a television.

Because the display device provided by the embodiment of the invention comprises the display panel, the display device can effectively reduce the coverage area of theorganic isolation layer 10 and increase the distance between theorganic isolation layer 10 and the edge of the thinfilm encapsulation layer 11 based on the arrangement positions of the negativepower signal wires 8 and the signal transmission wiring lines 9 in the display panel, thereby reducing the contact area between the inorganic encapsulation layer in the thinfilm encapsulation layer 11 and theorganic isolation layer 10, enabling the inorganic encapsulation layer in the thinfilm encapsulation layer 11 to be in direct contact with theinorganic passivation layer 12 positioned on one side of the drivingcircuit 7 facing the light emitting surface in a larger area, and effectively improving the water and oxygen resistance of the display device due to the fact that the inorganic layer is in contact with the inorganic layer, the inorganic layer can play a better water and oxygen blocking effect.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A display panel, comprising:

a display area and a non-display area;

a light emitting element including an anode layer, a light emitting layer, and a cathode layer;

the driving circuit is positioned in the non-display area;

a negative power supply signal line between the driver circuit and the display region;

the signal transmission wiring is positioned between the driving circuit and the display area and is electrically connected with the negative power signal wire and the cathode layer respectively;

the organic isolation layer covers the region, which is not contacted with the cathode layer, in the signal transmission line;

the thin film packaging layer covers the display area and the non-display area, the thin film packaging layer comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer, and the organic packaging layer is located between the first inorganic packaging layer and the second inorganic packaging layer.

2. The display panel according to claim 1, wherein the driving circuit is a scan driving circuit;

the negative power signal line and the signal transmission line are positioned between the scanning driving circuit and the display area.

3. The display panel of claim 2, wherein the minimum distance between the organic isolation layer and the edge of the thin film encapsulation layer is L1, 500 μ ι η ≦ L1 ≦ 1100 μ ι η;

the edge of the film packaging layer is the edge of the film layer closest to the edge of the display panel in the film packaging layer.

4. The display panel according to claim 1, wherein the driver circuit is a light emission driver circuit;

the negative power signal line and the signal transmission line are positioned between the light-emitting driving circuit and the display area.

5. The display panel according to claim 4, further comprising:

a scan driving circuit between the light emitting driving circuit and the display region;

the negative power signal line and the signal transmission wiring are positioned between the light-emitting driving circuit and the scanning driving circuit.

6. The display panel of claim 5, wherein the minimum distance between the organic isolation layer and the edge of the thin film encapsulation layer is L2, 380 μm L2 μm 750 μm;

the edge of the film packaging layer is the edge of the film layer closest to the edge of the display panel in the film packaging layer.

7. The display panel according to claim 1, further comprising:

the pixel definition layer is positioned between the anode layer and the cathode layer, the pixel definition layer is used for defining the light emitting layer, and the organic isolation layer and the pixel definition layer are arranged on the same layer.

8. The display panel according to claim 1, wherein the driving circuit includes a thin film transistor including a gate layer and a source-drain layer;

the negative power supply signal line and the source drain layer are arranged at the same layer, and the signal transmission wiring and the anode layer are arranged at the same layer.

9. The display panel according to claim 1, further comprising:

the pixel circuit comprises a thin film transistor and a storage capacitor, wherein the thin film transistor comprises a grid layer and a source drain layer, and the storage capacitor comprises a first electrode layer and a second electrode layer;

the driving circuit is electrically connected with the pixel circuit through a connecting wire, and the connecting wire is arranged on the same layer with the gate layer and the first electrode layer, or the connecting wire is arranged on the same layer with the second electrode layer.

10. A display device comprising the display panel according to any one of claims 1 to 9.

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