Summary of the invention
The purpose of the present invention is to provide a kind of electronic components with two-sided heat conduction and heat radiation structure, to solve existing skillThe problem of the heat dissipation effect difference of semiconductor devices present in art.
To achieve the above object, the technical solution adopted by the present invention is that: provide a kind of with two-sided heat conduction and heat radiation structureElectronic component, including substrate, the chip on the substrate, with the chip be electrically connected pin, curing molding inOn the substrate and seal the rubber base of the fixed chip and the pin and the heat conducting and heat radiating fin set on the rubber base top surface, instituteIt states rubber base and offers through-hole corresponding to the position of the chip, the heat conducting and heat radiating fin corresponds to the position of the through-hole and directionThe direction of the chip is convexly equipped with protrusion, and the protrusion passes through the through-hole and is bonded with the chip.
Further, the substrate includes substrate and the connecting plate for being respectively arranged on the substrate both ends, and the chip is set toOn the substrate.
Further, each connecting plate is included in that the corresponding end of the substrate is bent towards the direction of the chipOne section, each first segment are respectively perpendicular to the substrate, and each first segment is fixed on the rubber base.
Further, each connecting plate further includes being directed away from the direction of the chip in the free end of the first segmentSecond section of bending, second section are fixed on the rubber base perpendicular to the first segment, each second section.
Further, each connecting plate further includes in the free end of second section towards the direction close to the substrateThe third section of bending, the third section are fixed on the rubber base perpendicular to second section, each third section.
Further, the substrate includes the connection strap for being respectively arranged on the substrate both ends, each connection strap include byThe substrate is parallel to described towards the first segment of the direction of heat conducting and heat radiating fin extension and by the free end of the first segmentThe second segment that chip and the direction for being directed away from the chip extend.
Further, the rubber base is stretched out in the free end of each second segment.
Further, the height of each second segment is higher than the height of the pin.
Further, the pin includes that first section to be electrical connected with the chip, Yu Suoshu first are cut far from describedBend towards the direction of the substrate second section of one end of chip and in second section of the free end towards far from the chipThe third of direction bending cut, described first section perpendicular to described second section, described second section is cut perpendicular to the third, describedFirst section is parallel to the third and cuts.
Further, the quantity of the pin is multiple, and multiple pins are divided into two groups, the difference of pin described in two groupsSet on the two sides of the substrate, described first section of each pin respectively it is fixed on the rubber base, the institute of each pinIt states third and cuts and stretch out the rubber base respectively.
The beneficial effect of electronic component provided by the invention with two-sided heat conduction and heat radiation structure is: with the prior artIt comparing, the present invention is fixed substrate, chip and pin curing molding by rubber base by the way that chip to be arranged on substrate,The protrusion offered on rubber base for heat conducting and heat radiating fin passes through through-hole to be bonded with chip, due to be located at the substrate of chip-side withChip fitting, a part of heat of chip can be transferred to substrate and be diffused, and the heat conducting and heat radiating fin positioned at the chip other side passes throughProtrusion is bonded with chip, and a part of heat of chip can be transferred to heat conducting and heat radiating fin and be diffused.Therefore electronics of the invention memberDevice can be in the two sides of rubber base by the heat diffusion of chip, so that the good heat dissipation effect of electronic component, improves electronic componentUsing effect and prolong its service life.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior artNeeded in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention someEmbodiment for those of ordinary skill in the art without any creative labor, can also be according to theseAttached drawing obtains other attached drawings.
Fig. 1 is that the Facad structure for the electronic component with two-sided heat conduction and heat radiation structure that the embodiment of the present invention one provides showsIt is intended to；
Fig. 2 is that the backside structure for the electronic component with two-sided heat conduction and heat radiation structure that the embodiment of the present invention one provides is shownIt is intended to；
Fig. 3 is the main view for the electronic component with two-sided heat conduction and heat radiation structure that the embodiment of the present invention one provides；
Fig. 4 is the explosion signal for the electronic component with two-sided heat conduction and heat radiation structure that the embodiment of the present invention one providesFigure；
Fig. 5 is the cross-sectional view in the direction A-A in Fig. 3；
Fig. 6 is the structural schematic diagram that the chip that the embodiment of the present invention one provides is connect with substrate；
Fig. 7 is the structural schematic diagram for the pin that the embodiment of the present invention one provides；
Fig. 8 is the structural schematic diagram one for the rubber base that the embodiment of the present invention one provides；
Fig. 9 is the structural schematic diagram two for the rubber base that the embodiment of the present invention one provides；
Figure 10 is the Facad structure of the electronic component provided by Embodiment 2 of the present invention with two-sided heat conduction and heat radiation structureSchematic diagram；
Figure 11 is the backside structure of the electronic component provided by Embodiment 2 of the present invention with two-sided heat conduction and heat radiation structureSchematic diagram；
Figure 12 is the Facad structure for the electronic component with two-sided heat conduction and heat radiation structure that the embodiment of the present invention three providesSchematic diagram；
Figure 13 is the backside structure for the electronic component with two-sided heat conduction and heat radiation structure that the embodiment of the present invention three providesSchematic diagram.
Wherein, each attached drawing main mark in figure:
1- chip；
2- substrate；21- substrate；211- slot position；22- connecting plate；221- first segment；The second section of 222-；223- third section；23- connection strap；231- first segment；232- second segment；
3- pin；31- first is cut；32- second is cut；33- third is cut；The extension end 34-；
4- rubber base；41- through-hole；42- groove；43- aperture；44- locating slot；45- accommodation groove；46- notch；47- supporting block；
5- heat conducting and heat radiating fin；The protrusion 51-；
6- conductor.
Embodiment one:
Also referring to Fig. 1 to Fig. 9, now to the electronics with two-sided heat conduction and heat radiation structure of the offer of the embodiment of the present invention oneComponent is illustrated.The electronic component includes substrate 2, the chip being arranged on substrate 21, draws with what chip 1 was electrical connectedFoot 3, curing molding are on substrate 2 and sealing the rubber base 4 of fixed chip 1 Yu pin 3.Substrate 2 may be provided on pcb board, pin 3It is fixed on rubber base 4.The medium position of rubber base 4 offers through-hole 41 corresponding with chip 1.Optionally, the through-hole 41 is transversalFace is consistent with the cross section of chip 1, increases conduction heating surface, does not limit uniquely herein.The electronic component further includes settingHeat conducting and heat radiating fin 5 in 4 surface of rubber base, the position which corresponds to through-hole 41 are provided with convex towards the direction of chip 1Protrusion 51 out, the protrusion 51 may pass through through-hole 41 and fit with the surface of chip 1.Heat conducting and heat radiating fin 5, rubber base 4, chip 1It is from top to bottom set gradually with substrate 2.Therefore, heat a part of chip 1 is transferred to substrate 2 and spreads, and another part can lead toIt crosses protrusion 51 to be transferred to heat conducting and heat radiating fin 5 and spread, which can realize that two sides radiate to chip 1, Jin ErkeImprove the heat-sinking capability of chip 1.
Above-mentioned heat conducting and heat radiating fin 5 is chosen as the conductive sheet made of copper product.This structure, the conductive sheet made of copper productWith excellent thermally conductive and electric conductivity.Heat conducting and heat radiating fin 5 is adhered on rubber base 4, convenient and fast connection.In other embodimentsIn, heat conducting and heat radiating fin 5 can also be made of other materials；Heat conducting and heat radiating fin 5 can also be set on rubber base 4 otherwise,It does not limit uniquely herein.
Above-mentioned rubber base 4 is chosen as epoxide resin material curing molding, can also be made of other insulating materials, not make hereinIt is unique to limit.
The cross sectional dimensions of heat conducting and heat radiating fin 5 in the horizontal plane is consistent with the cross sectional dimensions of rubber base 4 in the horizontal plane.This structure, on the one hand, the area of heat conducting and heat radiating fin 5 is accomplished into maximum as far as possible, can effective increasing heat radiation area, and then improve pairThe heat dissipation effect of chip 1；On the other hand, make the configuration design of electronic component more beautiful, structure Founder, convenient for encapsulating atType；The top surface of heat conducting and heat radiating fin 5 may be integral planar.In other embodiments, the cross section of heat conducting and heat radiating fin 5 and rubber base4 cross section may be other configurations, not limit uniquely herein.
The model TDP0408-8 of above-mentioned electronic component, wherein (Thermal Design Power, heat dissipation are set TDPMeter power consumption) refer to encapsulation title；0408 refers to package dimension, and specially wide by 4 long 8, unit value can be adjusted according to actual production, such asMm, cm, dm etc.；- 8 guide 3 quantity of foot, and 3 quantity of pin for referring specifically to this electronic component is 8.In other embodiments, electricThe size of sub- component and the quantity of pin 3 can be adjusted according to actual production, not limit uniquely herein.
The step of assembling mode one of the electronic component are as follows:
1, substrate 2 is placed in type chamber, chip 1 is set on substrate 2；
2, pin 3 is set to the corresponding position of type chamber, and pin 3 and chip 1 are electrically connected；
3, injecting glue sealing and curing forms rubber base 4 in type chamber, supports sealing to fix substrate 2, chip 1 and pin 3；
4, through-hole 41 is offered in the position that rubber base 4 corresponds to chip 1；
5, by be equipped with protrusion 51 heat conducting and heat radiating fin 5 be adhered on rubber base 4, make protrusion 51 pass through through-hole 41 and with chip 1Fitting.
Alternatively, the step of assembling mode two of the electronic component are as follows:
1, substrate 2 is placed in type chamber, chip 1 is set on substrate 2；
2, pin 3 is set to the corresponding position of type chamber, and pin 3 and chip 1 are electrically connected；
3, heat conducting and heat radiating fin 5 is set to the corresponding position of type chamber, is bonded the protrusion 51 of heat conducting and heat radiating fin 5 with chip 1；
4, injecting glue sealing and curing forms rubber base 4 in type chamber, and substrate 2, chip 1, pin 3 and heat conducting and heat radiating fin 5 are supportedSealing is fixed.
The serial number size of each step of the packaging technology of above-mentioned electronic component is not meant that the order of the execution order, each mistakeThe execution sequence of journey should be determined by its function and internal logic, and can be adjusted according to actual production, without coping with the present inventionThe implementation process of embodiment constitutes any restriction.
For the electronic component due to that can radiate from two sides, which can realize that tow sides use,It does not limit uniquely herein.
Electronic component provided by the invention with two-sided heat conduction and heat radiation structure, compared with prior art, the present invention are logicalIt crosses for chip 1 to be arranged and fixes substrate 2, chip 1 and 3 mucilage binding of pin on substrate 2, and through rubber base 4, opened up on rubber base 4There is the protrusion 51 for heat conducting and heat radiating fin 5 to pass through the through-hole 41 to be bonded with chip 1, due to being located at the substrate 2 and core of 1 side of chipPiece 1 is bonded, and a part of heat of chip 1 can be transferred to substrate 2 and be diffused, and is located at the heat conducting and heat radiating fin 5 of 1 other side of chipIt is bonded by protrusion 51 with chip 1, another part heat of chip 1 can be transferred to heat conducting and heat radiating fin 5 and be diffused.Therefore this hairBright electronic component can be in the two sides of rubber base 4 by the heat diffusion of chip 1, so that the good heat dissipation effect of electronic component, mentionsIt the using effect of high electronic component and prolongs its service life.
The present invention can reduce electrical internal resistance simultaneously, increase through electric current, improve electric energy efficiency and power；It reduces element and producesThe temperature of product.
Semiconductor element of the invention reduces raw materials for production compared to traditional devices encapsulation, production technology is simplified, to reduceIts device cost；The advantages that improving production efficiency.
Semiconductor element of the invention is encapsulated in production PCBA (Printed CircuitBoard compared to traditional devicesWhen Assembly), without cumbersome artificial process, 100% production of machinery work；Improve production efficiency；Reduce production cost.
Further, referring to Figure 4 together and Fig. 6, there is two-sided heat conduction and heat radiation as what the embodiment of the present invention one providedA kind of specific embodiment of the electronic component of structure, substrate 2 include substrate 21 and the connection for being respectively arranged on 21 both ends of substratePlate 22, chip 1 are set on substrate 21.Connecting plate 22 is respectively set by two corresponding ends in substrate 21 in this structure, chip 1After heat transfer to substrate 21, heat can be transferred to respectively each connecting plate 22 again and is diffused by substrate 21, it is possible to increase heatTransmission area, and then the heat dissipation effect of chip 1 can be improved.
Substrate 21 and connecting plate 22 can be made of copper product, and substrate 21 and connecting plate 22 can be integrally formed, so that liningThe processing and fabricating at bottom 2 is high-efficient, and thermally conductive and electric conductivity is excellent.Optionally, which can be used hollow structure.WhenSo, in other embodiments, which can also use solid construction, not limit uniquely herein.
Further, referring to Figure 6 together, as the embodiment of the present invention one provide with two-sided heat conduction and heat radiation structureA kind of specific embodiment of electronic component, the direction that each connecting plate 22 is included in corresponding end towards the chip 1 of substrate 21 are curvedThe first segment 221 of folding, each first segment 221 are respectively perpendicular to substrate 21.This structure, first segment 221 are fixed on the periphery of rubber base 4,The heat of substrate 21 can also be conducted to first segment 221, so that electronic component can not only realize the heat dissipation of two sides, moreover it is possible to pass through weekThe first segment 221 on side realizes heat dissipation, and then the radiating efficiency to chip 1 can be improved.
Further, referring to Figure 6 together, as the embodiment of the present invention one provide with two-sided heat conduction and heat radiation structureA kind of specific embodiment of electronic component, each connecting plate 22 further include being directed away from chip 1 in the free end of first segment 221Direction bending the second section 222, the second section 222 is perpendicular to first segment 221.This structure, the second section 222 are fixed on rubber base 4On top surface, on the one hand, the conducting path that can extend heat increases the conduction surface of heat, improves heat dissipation effect；On the other hand,Substrate 21 can be supported effectively and be fixed by the cooperation of first segment 221, the second section 222 and rubber base 4, so that substrate 21 and chip 1 are consolidatedIt is fixed secured.
Further, referring to Figure 6 together, as the embodiment of the present invention one provide with two-sided heat conduction and heat radiation structureA kind of specific embodiment of electronic component, each connecting plate 22 further include in the free end of the second section 222 towards close to substrateThe third section 223 of 21 direction bending, third section 223 is perpendicular to the second section 222.Specifically, each connecting plate 22 is inverted u-shaped setsIt sets.This structure, by the way that connecting plate 22 is bent into first segment 221, the second section 222 and third section 223, on the one hand, convenient for liningThe support at bottom 2 is fixed；On the other hand, the transmission path that can extend heat improves the diffuser efficiency of heat.
There is the notch 46 for being used to support each connecting plate 22, the both ends difference of each notch 46 on rubber base 4 after curing moldingEquipped with being used to support the supporting block 47 for being correspondingly connected with the second section 222 of plate 22.This structure, two supporting blocks 47 in each notch 46It can will be correspondingly connected with the both ends support of the second section 222 of plate 22, two supporting blocks 47 are set with the inner sidewall interval of notch 46 respectivelyIt sets, the first segment 221 convenient for each connecting plate 22 passes through.
Further, referring to Figure 4 together and Fig. 6, there is two-sided heat conduction and heat radiation as what the embodiment of the present invention one providedA kind of specific embodiment of the electronic component of structure, substrate 2 include the connection strap 23 for being respectively arranged on 21 both ends of substrate, are respectively connectedNarrow bars 23 include the first segment 231 by substrate 21 towards the extension of the direction of heat conducting and heat radiating fin 5 and freely holding level with both hands by first segment 231Row in chip 1 and be directed away from chip 1 direction extend second segment 232.Specifically, two connection straps 23 are separately positioned on baseThe middle position of 21 left and right ends of plate has the aperture 43 passed through for connection strap 23 on the rubber base 4 after curing molding.Connection strap23 are preferably made of copper product.This structure, on the one hand, each connection strap 23 passes through corresponding aperture 43 and is arranged, can be effectively by substrate 2It is supported with chip 1；On the other hand, the heat on substrate 2 can also be transferred to connection strap 23 and be diffused, and then improve heat dissipation effectFruit.
Further, referring to Figure 2 together and Fig. 8, there is two-sided heat conduction and heat radiation as what the embodiment of the present invention one providedRubber base 4 is stretched out in the free end of a kind of specific embodiment of the electronic component of structure, the second segment 232 of each connection strap 23.ThisStructure, on the one hand, by the cooperation with connecting plate 22, the surrounding of substrate 2 can be supported fixation, so that substrate 2 and chip 1Fixation；On the other hand, it is in first segment 231 and second segment 232 by each 23 bending of connection strap, heat dissipation area can be effectively increased,Improve the radiating efficiency to chip 1.
Further, referring to Figure 7 together, as the embodiment of the present invention one provide with two-sided heat conduction and heat radiation structureA kind of specific embodiment of electronic component, pin 3 includes first section 31 to be electrical connected with chip 1, remote in first section 31One end of off-chip piece 1 towards substrate 2 direction bend second section 32 and in second section 32 free end towards far from chip 1 sideCut 33 to the third of bending, first section 31 perpendicular to second section 32, second section 32 is cut 33 perpendicular to third, and first section 31 is parallel toThird cuts 33.Specifically, it is electrically connected by conductor 6 and chip 1 for first section 31, first section 31 one end is extended with extension end34, it is fixed convenient for the support to the first wiring pin；Third cuts 33 corresponding ends for stretching out rubber base 4, for being connected with external devices.ThisStructure, by the way that pin 3 is bent into first section 31, second section 32 and third section 33, and then the direction and angle of adjustable pin 3Degree, convenient for the quick connection with external devices.
Above-mentioned conductor 6 is chosen as conducting wire or conductive sheet made of copper product, has excellent conduction and heating conduction.In other embodiments, conductor 6 or the electric conductor made of other materials, do not limit uniquely herein.
Further, referring to Figure 4 together, as the embodiment of the present invention one provide with two-sided heat conduction and heat radiation structureA kind of specific embodiment of electronic component, the quantity of pin 3 be it is multiple, multiple pins 3 are divided into two groups, two groups of pins 3The two sides of substrate 2 are respectively arranged on, first section 31 of each pin 3 is fixed on rubber base 4 respectively, and the third of each pin 3 cuts 33 differenceStretch out rubber base 4.Specifically, one end of the substrate 21 equipped with a connection strap 23, the connection strap 23 is arranged in one group of pin 3 at equal intervalsSet on the middle position of this group of pin 3；The another of the substrate 21 equipped with another connection strap 23 is arranged in another group of pin 3 at equal intervalsOne end, the connection strap 23 are set to the middle position of this group of pin 3.The electronic component can design for symmetrical structure.This structure,By the way that multiple pins 3 are respectively set at the both ends of substrate 2, on the one hand, the electrical property that can increase electronic component and external devices connectsLogical quantity, improves the service efficiency of electronic component；On the other hand, the partial heat of chip 1 can be transferred to pair by conductor 6It answers pin 3 and spreads, the heat dissipation effect of chip 1 can be effectively improved.
There is the locating slot 44 for being used to support chip 1 also referring to Fig. 8 and Fig. 9, on the rubber base 4 after curing molding and useIn the accommodation groove 45 of supporting substrate 21, locating slot 44 is connected to accommodation groove 45.This structure, the cross section of locating slot 44 and chip 1Shape is consistent, and substrate 21 is consistent with the cross-sectional shape of accommodation groove 45, convenient for the accurate dismounting and dimension to chip 1 and substrate 21Shield.
Also referring to Fig. 8 and Fig. 9, there is the groove 42 for being used to support pin 3, pin 3 on the rubber base 4 after curing moldingIn groove 42, one end and the chip 1 of pin 3 are electrical connected, and the other end of pin 3 stretches out the corresponding end of rubber base 4.This knotStructure fixes pin 3 by the way that groove 42 is sustainable, so that the fixation of pin 3, while being convenient for the surface structure of electronic componentDesign is upright, and overall appearance effect is good, forms convenient for encapsulating.
Slot position 211 is arranged in periphery on substrate 21 and positioned at chip 1, can be damp proof, and anti-gas-leak increases contact area, is convenient forThe sealing and fixation of electronic component.