Summary of the invention
In order to solve the deficiencies in the prior art, it is thinned the present invention provides a kind of thickness and stability-enhanced novelCamera module.
Present invention technical effect to be achieved is realized by following scheme: a kind of novel camera module, including lens groupPart and the photosensory assembly being fixed at below lens assembly, photosensory assembly include stiffening plate and are fixed at table on stiffening plateThe wiring board in face, the centre of wiring board are equipped with hollowed out area, in the hollowed out area of the wiring board, the upper surface of the stiffening plateIt is also fixed with sensitive chip, the top of the sensitive chip is also fixed with IR piece.
Preferably, the wiring board for being fixed as lens assembly and being fixed on photosensory assembly of the lens assembly and photosensory assemblyOn.
Preferably, the frame-type lower end surface of lens assembly and the upper surface periphery of wiring board are fixed by AA glue laminating.
Preferably, the sensitive chip has intermediate photosensitive area and peripheral non-photo-sensing area, and the IR piece and sensitive chip existThe position in non-photo-sensing area is fixedly installed by adhesive glue.
Preferably, the opposed two sides of the two of them of the lens assembly are recessed in one distance of wiring board, make wiring boardThe two sides of upper surface form a white space, and the camera module further includes electronic component, the fixed assist side of electronic componentOn white space.
Preferably, the stiffening plate is reinforcement steel disc.
Preferably, it is also formed with escape hole between the sensitive chip and the periphery and wiring board of IR piece, so that photosensitive corePiece and wiring board interval are arranged, and sensitive chip is connect with wiring board by conductor wire.
Preferably, one end of the conductor wire and sensitive chip connection is fixed by the adhesive glue between IR piece and sensitive chipCladding.
Preferably, the adhesive glue has step surface, and the IR piece, which is fixed on the step surface of adhesive glue, makes IR piece and senseThere is gap between optical chip.
Preferably, the camera module height is 4.25mm.
The invention has the following advantages that
The reliability of wiring board can be improved in the setting of stiffening plate in the present embodiment, and then improves the reliability of camera module, hollow outThe setting in region makes sensitive chip and IR piece that camera module can be accommodated among wiring board, and the height of camera module is effectively reduced.
Specific embodiment
The present invention will be described in detail with reference to the accompanying drawings and examples, and the examples of the embodiments are shown in the accompanying drawingsOut, in which the same or similar labels are throughly indicated same or similar element or members with the same or similar functionsPart.The embodiments described below with reference to the accompanying drawings are exemplary, it is intended to be used to explain the present invention, and should not be understood as to thisThe limitation of invention.
In the description of the present invention, it is to be understood that, term " length ", " width ", "upper", "lower", "front", "rear",The orientation or positional relationship of the instructions such as "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on attached drawing instituteThe orientation or positional relationship shown, is merely for convenience of description of the present invention and simplification of the description, rather than the dress of indication or suggestion meaningIt sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to limit of the inventionSystem.
In addition, term " first ", " second ", " third " are used for description purposes only, it is not understood to indicate or imply phaseTo importance or implicitly indicate the quantity of indicated technical characteristic." first ", " second ", " third " are defined as a result,Feature can explicitly or implicitly include one or more this feature.In the description of the present invention, the meaning of " plurality " isTwo or more, unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation ",Terms such as " settings " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be withIt is mechanical connection, is also possible to be electrically connected；It can be directly connected, can also can also be indirectly connected through an intermediaryThe interaction relationship of connection or two elements inside two elements.It for the ordinary skill in the art, can be withThe concrete meaning of above-mentioned term in the present invention is understood as the case may be.
As shown in Figure 1-3, the embodiment of the present invention provides a kind of novel camera module, including lens assembly 10 and fixed settingPhotosensory assembly 20 below lens assembly 10, wherein photosensory assembly 20 includes stiffening plate 21 and is fixed on stiffening plate 21The centre of the wiring board 22 on surface, wiring board 22 is equipped with hollowed out area.The reliable of wiring board 22 can be improved in the setting of stiffening plate 21Property, and then improve the reliability of camera module.The setting of hollowed out area makes that the following institutes of camera module can be accommodated among wiring board 22The sensitive chip and IR piece stated, are effectively reduced the height of camera module.
It is also fixed with sensitive chip 23 in the hollowed out area of the wiring board 22, the upper surface of the stiffening plate 21, is feltThe top of optical chip 23 is also fixed with IR piece 24.Specifically, sensitive chip 23 has intermediate photosensitive area and peripheral non-photo-sensing area,The upper surface of the sensitive chip 23 is also fixed with IR piece 24, the IR piece 24 and sensitive chip 23 in the position in non-photo-sensing areaIt is fixedly installed by adhesive glue 25, in this way, it is of less demanding to the material of adhesive glue 25, prevent glue is reflective from leading to flare problem.Preferably, the adhesive glue 25 is impermeable optical cement.Specifically, the adhesive glue 25 has step surface, and the IR piece 24 is fixed onMake that there is gap between IR piece 24 and sensitive chip 23 on the step surface of adhesive glue 25, prevents IR piece 24 from connecing with sensitive chip 23Touching, both protections are not in that scratch etc. is bad.Preferably, the adhesive glue 25 can also be formed in the circumferential lateral surface of IR piece 24 simultaneouslyParallel with the upper surface of IR piece 24, the adhesive glue 25 of the part is equivalent to the outline border of IR piece 24, play fixed supporting role；It is described viscousThe lower end surface of glue 25 is closed with the upper end face contact of sensitive chip 23 and adhesive glue 25 is not formed in the peripheral side of sensitive chip 23Face so as to the setting of following escape holes 26, and controls the use cost of adhesive glue 25.
By by the intermediate hollow out of wiring board 22, the lower surface of wiring board 22 is sticked stiffening plate 21, and photosensitive core the present embodimentThe hollowed out area of the upper surface of stiffening plate 21, wiring board 22 is arranged in piece 23 and IR piece 24, makes the height of camera module existingOn the basis of maximum can reduce 0.9mm, adapt to the development of screen end product comprehensively.In addition, wiring board 22 is set due to internal layer circuitMeter requires, and the surface of wiring board 22 has the surface smoothness of lines, protrusion etc. namely wiring board 22 poor, and the present embodiment passes throughBy the intermediate hollow out of wiring board 22, sensitive chip 23 and IR piece 24 are placed on the stiffening plate 21 of surfacing, so that sensitive chip23 and IR piece 24 also has preferable flatness, and camera module has preferable image quality.
Escape gas as a further improvement, being also formed between the sensitive chip 23 and the periphery and wiring board 22 of IR piece 24Hole 26, so that sensitive chip 23 and the interval of wiring board 22 are arranged, sensitive chip 23 is connect with wiring board 22 by conductor wire 27.It leadsElectric wire 27 can be gold thread.Preferably, one end that the conductor wire 27 is connect with sensitive chip 23 is by IR piece 24 and sensitive chipThe fixed cladding of adhesive glue 25 between 23, improves the bonding strength of conductor wire 27.
As a further improvement, the opposed two sides of two of them (direction shown in Fig. 3) of the lens assembly 10It is recessed in 22 1 distance of wiring board, the two sides of 22 upper surface of wiring board is made to form a white space A.The camera module also wrapsElectronic component 28 is included, the white space A in the fixed assist side 22 of electronic component 28 makes 28 plastic packaging of electronic component in sensitive chip23 non-photo-sensing area (MOC technique) also can reach the purpose for effectively reducing the size of mould group and lens assembly 10.Wherein electronics memberPart 28 can be the elements such as capacitor, resistance.
In the present embodiment, the stiffening plate 21 is square, and the hollowed out area of the wiring board 22 is also square, and vacancy sectionThe adjacent two edges line in domain is parallel with the adjacent two edges line of stiffening plate 21 respectively.In this way, can be easily installed rectangular photosensitiveChip 23, so that the utilization rate of hollowed out area maximizes, and rationally designs the structure of wiring board 22, wiring board 22 is notThe region of hollow out can carry lens assembly 10, electronic component 28 and have the site being electrically connected with elements such as sensitive chips 23.
The lens assembly 10 that is fixed as of lens assembly 10 described in the present embodiment and photosensory assembly 20 is fixed on photosensory assemblyOn 20 wiring board 22, the upper surface periphery of the frame-type lower end surface and wiring board 22 that specifically can be lens assembly 10 passes through AA glue29 fittings are fixed.
Stiffening plate 21 described in the present embodiment with a thickness of 0.1mm-0.2mm, stiffening plate 21 is reinforcement steel disc, steel disc materialIt is unlikely to deform, the relative position of sensitive chip 23 and camera lens is made not generate variation because of external force.The wiring board 22 is softProperty wiring board 22, with a thickness of 0.08mm-0.25mm.By the way that IR piece 24 and sensitive chip 23 are directly attached fixation, and by IR piece24 are formed together the hollowed out area of assist side 22 with sensitive chip 23, and the height of camera module can be made to reduce 0.9mm or so.ToolBody, which is 4.25mm.
For lens assembly 10 including eyeglass etc., lens assembly 10 should be located at the photosensitive of the sensitive chip 23 in the present embodimentPath, so that the light being reflected by the object can be by the mirror when the camera module is used to acquire the image of objectFurther it is suitable for carrying out photoelectric conversion by the sensitive chip 23 receiving after the processing of head assembly 10.The lens assembly 10Periphery be also provided with motor sub-assembly, the automatic focusing function of lens assembly 10 may be implemented.It should be understood that of the inventionCamera module can be used for cameras with fixed focus mould group and autozoom camera module, with no restriction.
Camera module use scope in the present embodiment includes but is not limited to mobile phone.
When the camera module assembling of the present embodiment, stiffening plate 21 is first bonded fixation with wiring board 22, wiring board 22 can lead toOveretch forms hollowed out area；Fixed sensitive chip 23 is bonded on the stiffening plate 21 of hollowed out area again, sensitive chip 23 passes throughConductor wire 27 is connect with wiring board 22；Again in the fixed glue of the non-photo-sensing region coating of sensitive chip 23, IR piece 24 is bonded solidIt is scheduled on sensitive chip 23；Finally by lens assembly 10 by the fixed assist side 22 of AA glue, complete the half of camera module atProduct assembling.
Finally, it should be noted that above embodiments be only to illustrate the technical solution of the embodiment of the present invention rather than to its intoRow limitation, although the embodiment of the present invention is described in detail referring to preferred embodiment, those skilled in the artIt should be understood that the technical solution of the embodiment of the present invention can be still modified or replaced equivalently, and these are modified or waitThe range of modified technical solution disengaging technical solution of the embodiment of the present invention cannot also be made with replacement.