CN109413246B - Shell assembly and electronic equipment - Google Patents

Abstract

The embodiment of the application provides a shell assembly and electronic equipment, the shell assembly is applied to electronic equipment, the shell assembly includes the upper cover, the upper cover includes base plate portion and bulge. The base plate part is positioned in the electronic equipment and comprises an accommodating space which is used for accommodating a telephone receiver; the bulge part extends from the substrate part to the display surface of the electronic equipment, and is provided with a sound outlet; the sound outlet is communicated with the accommodating space through a sound channel, the sound channel comprises a first sub-channel and a second sub-channel which are communicated, the first sub-channel extends along a first direction, the second sub-channel extends along a second direction, and the directions of the first direction and the second direction are different. The high screen ratio can be realized, and the sound emitting effect of the telephone receiver can be ensured.

Description

Shell assembly and electronic equipment

Technical Field

The present disclosure relates to electronic devices, and particularly to a housing assembly and an electronic device.

Background

With the development of electronic equipment technology, electronic equipment with a high screen ratio is more and more popular, can display more contents, and can be better held by a user. The electronic equipment with higher screen occupation ratio has less reserved non-display area, the sound outlet holes of the telephone receivers need to be reserved in the non-display area on the front face of the electronic equipment, and the sound outlet effect of the telephone receivers is influenced.

Disclosure of Invention

The embodiment of the application provides a casing subassembly and electronic equipment, can obtain better receiver effect of making a sound in high screen accounts for than electronic equipment.

The embodiment of the application provides a casing subassembly, it is applied to electronic equipment, casing subassembly includes the upper cover, the upper cover includes:

the base plate part is positioned in the electronic equipment and comprises an accommodating space which is used for accommodating a telephone receiver;

the bulge, base plate portion orientation the electronic equipment display surface extends and forms the bulge, be equipped with the phonate hole on the bulge, the phonate hole pass through the sound passageway with accommodation space intercommunication, the sound passageway is including the first subchannel and the second subchannel of intercommunication, first subchannel extends along the first direction, the second subchannel extends along the second direction, the first direction with the direction of second direction is different.

The embodiment of the application further provides an electronic device, which comprises a shell assembly and a receiver, wherein the shell assembly is as described above, and the receiver is located in the accommodating space.

In the case assembly and the electronic device provided by the embodiment of the application, the accommodating space for accommodating the receiver is communicated with the sound outlet through the sound channel, and the sound channel comprises a first sub-channel and a second sub-channel in two directions. In order to improve the screen occupation ratio of the electronic equipment, the sound outlet of the telephone receiver is arranged at the top of the electronic equipment, the sound outlet and the telephone receiver cannot be arranged right opposite to each other, and the audio information of the telephone receiver is conducted out from the sound outlet through the sound channel, so that the high screen occupation ratio can be realized, and the sound outlet effect of the telephone receiver can be ensured.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of a housing assembly of an electronic device according to an embodiment of the present disclosure.

Fig. 4 is a sectional view of the housing assembly a-a' of fig. 3.

Fig. 5 is a partially assembled schematic view of an electronic device according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of an upper cover of an electronic device according to an embodiment of the present application.

Fig. 7 is another schematic structural diagram of an upper cover of an electronic device according to an embodiment of the present application.

Fig. 8 is another schematic structural diagram of a housing assembly of an electronic device according to an embodiment of the present disclosure.

Fig. 9 is a partially exploded schematic view of an electronic device according to an embodiment of the present application.

Fig. 10 is a partially exploded schematic view of an electronic device according to an embodiment of the present application.

Fig. 11 is a block diagram schematically illustrating a module of an electronic device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The embodiment of the application provides a shell assembly and electronic equipment. The housing assembly and the electronic device will be described in detail below. The electronic device may be a smart phone, a tablet computer, or other devices, and may also be a game device, an AR (Augmented Reality) device, an audio playing device, a video playing device, or other devices.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. In this embodiment, theelectronic device 100 includes adisplay screen 10, abezel 20, acircuit board 30, abattery 40, and a rear cover (not shown).

Thedisplay screen 10 and the rear cover are located on two opposite sides of theelectronic device 100, the electronic device further includes a middle plate, theframe 20 is disposed around the middle plate, and theframe 20 and the middle plate form a middle frame of theelectronic device 100. The middle plate and theframe 20 respectively form a receiving cavity at two sides of the middle plate, wherein one receiving cavity receives thedisplay screen 10, and the other receiving cavity receives thebattery 40 and other electronic components or functional modules of theelectronic device 100. Thedisplay screen 10 forms a display surface of theelectronic device 100, and is used for displaying information such as images and texts. TheDisplay screen 10 may be a Liquid Crystal Display (LCD) or an Organic Light-Emitting Diode (OLED) Display screen.

In some embodiments, a glass cover plate may be disposed over thedisplay screen 10. Wherein, the glass cover plate can cover thedisplay screen 10 to protect thedisplay screen 10 and prevent thedisplay screen 10 from being scratched or damaged by water.

In some embodiments, thedisplay screen 10 may include adisplay area 11 and anon-display area 12. Thedisplay area 11 performs a display function of thedisplay screen 10 for displaying information such as images and texts. Thenon-display area 12 does not display information. Thenon-display area 12 may be used to set a camera hole, a receiversound outlet hole 51, a proximity sensor hole, and the like. In some embodiments, thenon-display area 12 may include at least one area located on the peripheral side of thedisplay area 11.

Referring to fig. 2, fig. 2 is another schematic structural diagram of an electronic device according to an embodiment of the present disclosure. In this embodiment, thedisplay screen 10 may be a higher screen. Thedisplay screen 10 is provided with anon-display area 12 in the middle of the top, and asound outlet 51 of a receiver is arranged in thenon-display area 12. At this time, thedisplay screen 10 may display information almost in a full screen, so that theelectronic apparatus 100 has a large screen occupation ratio. At this time, functional modules such as a camera and a proximity sensor in theelectronic device 100 may be hidden under thedisplay screen 10, or may be disposed in thenon-display area 12 in the middle of the top of thedisplay screen 10, and the fingerprint identification module of theelectronic device 100 may be disposed on the back of theelectronic device 100.

Thecircuit board 30 is mounted in the receiving cavity. Thecircuit board 30 may be a motherboard of theelectronic device 100. Thecircuit board 30 is provided with a grounding point to realize grounding of thecircuit board 30. One or more of a motor, a microphone, a speaker, areceiver 50, an earphone interface, a universal serial bus interface (USB interface), a camera, a proximity sensor, an ambient light sensor, a gyroscope, and a processor may be integrated on thecircuit board 30. Meanwhile, thedisplay screen 10 may be electrically connected to thecircuit board 30.

The back cover is used to form the outer contour of theelectronic device 100. The rear cover may be integrally formed. In the forming process of the rear cover, structures such as a rear camera hole and a fingerprint identification module mounting hole can be formed on the rear cover. Thedisplay screen 10 and the rear cover are located on opposite sides of theelectronic device 100, and thebezel 20 is located between the rear cover and the display screen, while thebezel 20 surrounds thedisplay screen 10 and the rear cover.

Theelectronic device 100 further includes a cover plate covering thedisplay screen 10, wherein a gap is formed at a top of the cover plate, and thedisplay screen 10 does not display content corresponding to the gap, and therefore, an area corresponding to the gap is thenon-display area 12. Asound output port 51 of thereceiver 50 is provided in thenon-display area 12. One or two or more of the camera, the distance sensor and the light sensor of theelectronic device 100 are also arranged in the gapcorresponding non-display area 12.

Referring to fig. 3 and 4, fig. 3 is a schematic structural diagram of a housing assembly of an electronic device according to an embodiment of the present disclosure, and fig. 4 is a sectional view of the housing assembly in a direction of a-a' in fig. 3. The housing assembly includes anupper cover 60, and theupper cover 60 includes abase plate portion 610 and aprojection portion 620.

Thesubstrate portion 610 is located in the electronic device, and thesubstrate portion 610 includes a receivingspace 611, and the receivingspace 611 is used for receiving thereceiver 50.

Theprotrusion 620 is formed to extend from thesubstrate portion 610 toward the display surface of the electronic device, and theprotrusion 620 is provided with asound outlet 621.

Wherein thesound outlet 621 communicates with theaccommodating space 611 through thesound channel 70, thesound channel 70 includes afirst sub-channel 710 and asecond sub-channel 720 communicating with each other, thefirst sub-channel 710 extends in a first direction, thesecond sub-channel 720 extends in a second direction, and the first direction and the second direction are different.

The receivingspace 611 receiving thereceiver 50 communicates with thesound outlet 621 through thesound channel 70, and thesound channel 70 includes afirst sub-channel 710 and asecond sub-channel 720 in two directions. In order to improve the screen occupation ratio of the electronic device, thesound outlet 621 of thereceiver 50 is disposed at the top of the electronic device, thesound outlet 621 and thereceiver 50 cannot be disposed opposite to each other, and the audio information of thereceiver 50 is transmitted from thesound outlet 621 through thesound channel 70, so that not only can a high screen occupation ratio be realized, but also the sound outlet effect of thereceiver 50 can be ensured.

It should be noted that, a plurality of functional devices, such as a front camera, a light sensor, etc., may be disposed in the electronic device at positions corresponding to thesound outlet 621, and therefore, in order to avoid these functional devices, the receiver is disposed at a distance from thesound outlet 621, and therefore thesound channel 70 is required to conduct the sound of thereceiver 50.

With continued reference to fig. 2 and 3, thehousing element 210 includes atop side 211 and abottom side 212 that are oppositely disposed, and thetop side 211 and thebottom side 212 can be used as thetop side 211 and thebottom side 212 of the electronic device. Thesound outlet hole 621 is disposed adjacent to thetop edge 211 of thehousing assembly 210, and the receivingspace 611 is disposed spaced apart from thetop edge 211. Thesound outlet 621 is disposed adjacent to thetop edge 211 of thehousing assembly 210, and it is also understood that thesound outlet 621 is disposed at a top position on the front surface of the electronic device, such that a high screen ratio can be obtained. Thesound outlet 621 is disposed at the top end, and the correspondingaccommodating space 611 for accommodating thereceiver 50 cannot face thesound outlet 621 inside the electronic device due to space limitation. The receivingspace 611 is spaced apart from thetop side 211, and a camera, a light sensor, a proximity sensor, etc. may be disposed between the receivingspace 611 and thetop side 211. Thereceiver 50 in the receivingspace 611 is arranged to be offset from thesound outlet 621 in projection on the plane where thesound outlet 621 is located. At this time, it is necessary to provide at least two directions of thesound passages 70 to conduct the sound in theaccommodating space 611 to thesound outlet hole 621.

Where thehousing assembly 210 includes a middle frame, the top andbottom edges 211, 212 of thehousing assembly 210 may be understood as the top andbottom edges 211, 212 of the middle frame.

In some embodiments, thetop edge 211 extends in a first direction, thefirst sub-channel 710 is located within theprotrusion 620, and thesecond sub-channel 720 extends from the receivingspace 611 to thefirst sub-channel 710.

Thesound passage 70 is disposed in the first direction from thesound outlet hole 621 and then enters theaccommodating space 611. Specifically, thefirst sub-passage 710 is disposed within theprotrusion 620 and parallel to thetop edge 211, and thesound outlet 621 communicates with thefirst sub-passage 710. Thesecond sub-passage 720 extends from the first sub-passage 710 into the receivingspace 611. Thesecond sub-channel 720 is at an angle, such as between 60 degrees and 120 degrees, or 90 degrees, with respect to thefirst sub-channel 710. I.e., thesecond sub-channel 720 is perpendicular to thefirst sub-channel 710.

With reference to fig. 5 to 7, fig. 5 is a partial assembly schematic view of an electronic device according to an embodiment of the present disclosure, fig. 6 is a schematic structural view of an upper cover of an electronic device according to an embodiment of the present disclosure, and fig. 7 is another schematic structural view of an upper cover of an electronic device according to an embodiment of the present disclosure. Fig. 6 and 7 are diagrams of the upper cover at different angles. Thehousing assembly 210 further includes aback cover 80, theprotrusion 620 having agroove 627 facing thefirst side 625 of theback cover 80, theback cover 80 covering thegroove 627, and the first sub-passage 710 formed for theback cover 80 covering thegroove 627.

Thefirst side 625 of theprotrusion 620 facing theback cover 80 has agroove 627, thesecond side 626 of theprotrusion 620 facing the display surface of the electronic device has asound outlet 621, and thefirst side 625 and thesecond side 626 are perpendicular. Thegroove 627 of thefirst side 625 is communicated with thesound outlet hole 621 of thesecond side 626, for example, thegroove 627 of thefirst side 625 has an opening corresponding to thesound outlet hole 621, and thegroove 627 is communicated with thesound outlet hole 621 through the opening. Therear cover 80 covers thegroove 627 of theprotrusion 620, and thus, thegroove 627 and therear cover 80 covering thegroove 627 may form thefirst sub-channel 710 of thesound channel 70.

In some embodiments, theprotrusion 620 includes a groove bottom and two groove sides forming thegroove 627, and theback cover 80 is sealingly connected to the top ends of the two groove sides.

Therear cover 80 seals thegroove 627 such that theacoustic path 70 is formed, and the loss of acoustic information in theacoustic path 70 formed by thegroove 627 is prevented.

In some embodiments, therear cap 80 includes a curvedfirst side 810, thefirst side 810 overlying afirst side 625, thefirst side 625 including first and second side edges 6251, 6252 on opposite sides, each of the first and second side edges 6251, 6252 being in sealing engagement with thefirst side 810, thegroove 627 being located between the first and second side edges 6251, 6252.

Thefirst edge 810 covering therecess 627 is curved such that thesound passage 70 formed by thefirst edge 810 and the protrusion includes not only the space inside therecess 627 but also a curved space, so that a larger space of thesound passage 70 can be formed to facilitate sound transmission.

In other embodiments, a hole is formed in theprotrusion 620, and one end of the hole is connected to thesound hole 621 and the other end is connected to theaccommodating space 611.

Referring to fig. 2 and 8, fig. 8 is another schematic structural diagram of a housing assembly of an electronic device according to an embodiment of the present disclosure. Thetop edge 211 extends in a first direction, thesecond sub-passage 720 extends from theprotrusion 620 into thebase plate portion 610, and thefirst sub-passage 710 extends from the receivingspace 611 to thesecond sub-passage 720.

Thesound passage 70 is first disposed in the second direction from thesound outlet hole 621 and then enters theaccommodating space 611. Specifically, thesecond sub-channel 720 is communicated with the sound outlet, and thesecond sub-channel 720 is at an angle with thetop edge 211, such as between 60 degrees and 120 degrees, or 90 degrees. I.e.,second subchannel 720 is perpendicular totop edge 211.First sub-channel 710 is disposed withinbase plate portion 610 and is disposed parallel totop edge 211. Thefirst sub-passage 710 extends from the second sub-passage 720 into the receivingspace 611. Thesecond sub-channel 720 may be disposed in theprotrusion 620, or may be partially disposed in theprotrusion 620 and partially disposed in thebase plate 610.

Referring to fig. 9, fig. 9 is a partially exploded schematic view of an electronic device according to an embodiment of the disclosure. The electronic device specifically includes acover plate 15, adisplay screen 10, an upper cover, and areceiver 50. In some embodiments, the electronic device may further include apolarizer 16 disposed between thecover 15 and thedisplay screen 10, although thepolarizer 16 may not be disposed if desired. Wherein the upper cover includes abase plate portion 610, aprotrusion portion 620, and a soundoutlet port deco 230. Thecover plate 15 may be a special-shaped cover plate, and the top of thecover plate 15 has a notch corresponding to the sound outlet of the receiver.

Referring to fig. 10, fig. 10 is a schematic structural diagram of a housing assembly of an electronic device according to an embodiment of the present disclosure. Thesubstrate part 610 further includes afirst sidewall 631 forming a periphery of the receivingspace 611, thefirst sidewall 631 being stepped, thefirst sidewall 631 including afirst step protrusion 633, and the electronic apparatus further including afirst sealing layer 640, thefirst sealing layer 640 being disposed on thefirst step protrusion 633 and covering the receivingspace 611.

The stepped side walls of the receivingspace 611, and thefirst sealing layer 640, all provide good conduction of the acoustic signal, minimizing the loss of the acoustic signal within the receivingspace 611.

In some embodiments, thebase plate portion 610 further includes asecond sidewall 635 forming a side of thesecond sub-channel 720, thesecond sidewall 635 is stepped, thesecond sidewall 635 includes asecond step projection 637, and thefirst sealing layer 640 is further disposed on thesecond step projection 637 and covers thesecond sub-channel 720.

The stepped side walls of thesecond sub-passage 720, and thefirst sealing layer 640, all function to conduct acoustic signals well, minimizing acoustic signal loss within theacoustic passage 70.

In some embodiments, the electronic device further comprises asound hole decoration 230. Thebase plate portion 610 may be a metal member, the protrudingportion 620 may be a plastic member, and thesound hole decoration 230 may also be a plastic member.

In some embodiments, thehousing assembly 210 further includes asecond sealing layer 650, thesecond sealing layer 650 covering thefirst sealing layer 640, thesecond sealing layer 650 having a larger area than thefirst sealing layer 640.

The double-layer sealing layer can reduce the loss of sound signals to the maximum extent. Thefirst sealing layer 640 may be a soft sealing layer, such as silicon gel. Thesecond sealant 650 may employ a hard sealant such as plastic, resin, or the like. Wherein the plastic may be polyethylene terephthalate (PET). Wherein an outer surface of thefirst sealing layer 640 is substantially flush with an outer surface of themesa portion 610, and thesecond sealing layer 650 covers the outer surface of thefirst sealing layer 640 and the outer surface of themesa portion 610. The edges offirst sealant layer 640 are connected tofirst sidewall 631 andsecond sidewall 635 andsecond sealant layer 650 covers the connection offirst sealant layer 640 tofirst sidewall 631 andsecond sidewall 635.

Wherein, the bottom wall of theaccommodating space 611 may be thesubstrate portion 610, and the sidewall of theaccommodating space 611 is hermetically connected with the bottom wall. For example, agroove 627 is dug in thesubstrate portion 610, a bottom wall of thegroove 627 is a bottom wall of theaccommodation space 611, a side wall of thegroove 627 is a side wall of theaccommodation space 611, and then thegroove 627 is covered with thefirst sealing layer 640, thereby forming theaccommodation space 611.

In some embodiments, theprotrusion 620 may be provided with a second groove toward the side of the receivingspace 611, and then an end of thefirst sealing layer 640 toward theprotrusion 620 has a first protrusion covering the second groove, thereby forming a first sub-channel. Thesecond sealing layer 650 has a second protrusion corresponding to the first protrusion, and the second protrusion covers the first protrusion, thereby obtaining a better sealing effect.

Referring to fig. 11, fig. 11 is a block diagram illustrating an electronic device according to an embodiment of the present disclosure. Theelectronic device 100 may include control circuitry, which may include storage andprocessing circuitry 61. The storage andprocessing circuit 61 may be a memory, such as a hard disk drive memory, a non-volatile memory (e.g., a flash memory or other electronically programmable read-only memory used to form a solid state drive, etc.), a volatile memory (e.g., a static or dynamic random access memory, etc.), etc., and the embodiments of the present application are not limited thereto. The processing circuitry in the storage andprocessing circuitry 61 may be used to control the operation of theelectronic device 100. The processing circuitry may be implemented based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application specific integrated circuits, display driver integrated circuits, and the like.

The storage andprocessing circuitry 61 may be used to run software in theelectronic device 100, such as an Internet browsing application, a Voice Over Internet Protocol (VOIP) telephone call application, an email application, a media playing application, operating system functions, and so forth. Such software may be used to perform control operations such as, for example, camera-based image capture, ambient light measurement based on an ambient light sensor, proximity sensor measurement based on a proximity sensor, information display functionality based on status indicators such as status indicator lights of light emitting diodes, touch event detection based on a touch sensor, functionality associated with displaying information on multiple (e.g., layered) displays, operations associated with performing wireless communication functions, operations associated with collecting and generating audio signals, control operations associated with collecting and processing button press event data, and other functions in theelectronic device 100, and the like, without limitation of embodiments of the present application.

Theelectronic device 100 may also include input-output circuitry 62. The input-output circuit 62 may be used to enable theelectronic device 100 to input and output data, i.e., to allow theelectronic device 100 to receive data from external devices and also to allow theelectronic device 100 to output data from theelectronic device 100 to external devices. The input-output circuit 62 may further include asensor 63. Thesensors 63 may include ambient light sensors, optical and capacitive based proximity sensors, touch sensors (e.g., optical based touch sensors and/or capacitive touch sensors, where the touch sensors may be part of a touch display screen or may be used independently as a touch sensor structure), acceleration sensors, and other sensors, among others.

Input-output circuitry 62 may also include one or more displays, such asdisplay 64. Thedisplay 64 may include one or a combination of liquid crystal displays, organic light emitting diode displays, electronic ink displays, plasma displays, displays using other display technologies. Thedisplay 64 may include an array of touch sensors (i.e., thedisplay 64 may be a touch display screen). The touch sensor may be a capacitive touch sensor formed by a transparent touch sensor electrode (e.g., an Indium Tin Oxide (ITO) electrode) array, or may be a touch sensor formed using other touch technologies, such as acoustic wave touch, pressure sensitive touch, resistive touch, optical touch, and the like, and the embodiments of the present application are not limited thereto.

Electronic device 100 may also includeaudio component 65. Theaudio component 65 may be used to provide audio input and output functionality for theelectronic device 100.Audio components 65 inelectronic device 100 may include speakers, microphones, buzzers, tone generators, and other components for generating and detecting sound.

Thecommunication circuit 66 may be used to provide theelectronic device 100 with the ability to communicate with external devices. Thecommunication circuitry 66 may include analog and digital input-output interface circuitry, and wireless communication circuitry based on radio frequency signals and/or optical signals. The wireless communication circuitry incommunication circuitry 66 may include radio-frequency transceiver circuitry, power amplifier circuitry, low noise amplifiers, switches, filters, and antennas. For example, the wireless Communication circuitry inCommunication circuitry 66 may include circuitry to support Near Field Communication (NFC) by transmitting and receiving Near Field coupled electromagnetic signals. For example, thecommunication circuit 66 may include a near field communication antenna and a near field communication transceiver. Thecommunications circuitry 66 may also include a cellular telephone transceiver and antenna, a wireless local area network transceiver circuit and antenna, and the like.

Theelectronic device 100 may further include a battery, power management circuitry, and other input-output units 67. The input-output unit 67 may include buttons, joysticks, click wheels, scroll wheels, touch pads, keypads, keyboards, cameras, light emitting diodes and other status indicators, etc.

A user may input commands through input-output circuitry 62 to control the operation ofelectronic device 100, and may use output data of input-output circuitry 62 to enable receipt of status information and other outputs fromelectronic device 100.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

In the description of the present application, it is to be understood that the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

The housing assembly and the electronic device provided by the embodiments of the present application are described in detail above, and the principles and embodiments of the present application are explained herein by applying specific examples, and the descriptions of the above embodiments are only used to help understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (10)

1. The utility model provides a shell assembly, is applied to electronic equipment, its characterized in that, shell assembly includes back lid and upper cover, back lid set up in the upper cover deviates from apron one side, the upper cover includes:

the base plate part is positioned in the electronic equipment and comprises an accommodating space which is used for accommodating a telephone receiver;

the protruding part is used for installing the cover plate, extends from the substrate part to the display surface of the electronic equipment and is formed, a groove is formed in the protruding part towards the first side of the rear cover, the protruding part comprises a groove bottom and two groove side edges, the groove bottom and the two groove side edges form the groove, the rear cover covers the groove and is connected with the top ends of the two groove side edges in a sealing mode, the protruding part also comprises a second side towards the cover plate, the second side is perpendicular to the first side, a sound outlet is formed in the second side, and the sound outlet is communicated with the groove through an opening in the groove side edge;

the sound outlet is communicated with the accommodating space through a sound channel, the sound channel comprises a first sub-channel and a second sub-channel which are communicated, the first sub-channel extends along a first direction, the second sub-channel extends along a second direction, the directions of the first direction and the second direction are different, the first sub-channel is formed by the groove and the rear cover, and the groove side far away from the sound outlet in the two groove side faces is provided with the second sub-channel towards the accommodating space, so that a sound signal of the telephone receiver enters the second sub-channel from the accommodating space.

2. The housing assembly of claim 1 wherein said sound outlet aperture is disposed adjacent a top edge of said housing assembly, said receiving space being spaced from said top edge.

3. The housing assembly of claim 2 wherein said top edge extends in said first direction, said first sub-passage is located within said projection, and said second sub-passage extends from said receiving space to said first sub-passage.

4. The housing assembly of claim 3, wherein the first sub-channel is perpendicular to the second sub-channel.

5. The housing assembly of claim 1 wherein said back cover includes a first edge of an arc, said first edge overlying said first side, said first side including first and second sides on opposite sides, said first and second sides each sealingly connected to said first edge, said groove located between said first and second sides.

6. The housing assembly according to claim 1, wherein the base plate portion further includes a first side wall forming a periphery of the accommodation space, the first side wall being stepped, the first side wall including a first stepped protrusion, the electronic apparatus further including a first sealing layer provided on the first stepped protrusion and covering the accommodation space.

7. The housing assembly of claim 6 wherein the base plate portion further includes a second sidewall forming a side of the second sub-channel, the second sidewall being stepped, the second sidewall including a second stepped projection, the first sealing layer further disposed on the second stepped projection and covering the second sub-channel.

8. The housing assembly of claim 6 or 7, further comprising a second sealing layer overlying the first sealing layer, the second sealing layer having a larger area than the first sealing layer.

9. An electronic device comprising a housing assembly as claimed in any one of claims 1 to 8 and a receiver located in the receiving space.

10. The electronic device of claim 9, further comprising a cover plate located at the outermost layer of the electronic device, wherein the cover plate has a notch at the top, and the sound outlet of the protrusion is located in the notch.

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