CN109387767B - Be applied to positioning jig of PCB board - Google Patents
Be applied to positioning jig of PCB boardDownload PDFInfo
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- CN109387767B CN109387767BCN201710687614.5ACN201710687614ACN109387767BCN 109387767 BCN109387767 BCN 109387767BCN 201710687614 ACN201710687614 ACN 201710687614ACN 109387767 BCN109387767 BCN 109387767B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Technical Field
The invention relates to the technical field of PCB electrical measurement equipment, in particular to a positioning jig applied to a PCB.
Background
In the traditional PCB (printed circuit board) testing method, a PCB needing to be electrically tested is grabbed and placed on a testing jig through a mechanical handle of an electrical testing product, and a guide pin corresponding to a hole on the PCB is arranged on the testing jig, so that after the testing jig is pressed with the PCB, probes of the jig correspond to PCB-Pad (bonding pads) one by one, and the high PASS rate of the PASS power amplifier board in the electrical testing process is ensured.
In the application process of the jig, the positioning in the jig, the matching of the guide pin and the PCB positioning hole are the root in the whole process, and the efficiency of inaccurate positioning and testing is low.
In the process of implementing the invention, the inventor finds that at least the following problems exist in the prior art: for some electronic products on the market, such as high-resolution LED (light emitting diode) boards, there are no through holes in the middle of the board, and some customers require that the PCB board be formed at one time, and for these PCB boards without positioning holes, the development of the electrical measurement process is very difficult.
Disclosure of Invention
In order to overcome the defects of related products in the prior art, the invention provides a positioning jig applied to a PCB (printed circuit board), and solves the problem that the conventional PCB without positioning holes is difficult to perform an electrical measurement process.
The invention provides a positioning jig applied to a PCB (printed circuit board), which comprises: the top layer, the top second layer, the top third layer, the middle layer and the base layer are sequentially stacked from top to bottom, and the two angle-shaped positioning blocks and the four guide pin columns are arranged; through holes are formed in the areas corresponding to the top layer and the top two layer, and the two angle-shaped positioning blocks and the four guide pin columns penetrate through the through holes in the top layer and the top two layer and are fixed on the top three layer; the angle-shaped positioning blocks are L-shaped, the two angle-shaped positioning blocks are symmetrically distributed on a diagonal line of the top layer, the four aligning pin columns are symmetrically distributed in two pairs in four directions of the top layer respectively, the PCB is placed on the top layer, two corners of the diagonal position of the PCB are limited by the two angle-shaped positioning blocks, and four sides of the PCB are limited by the four aligning pin columns respectively.
As a further improvement of the invention, two surfaces of the inner side of the L-shaped angle-shaped positioning block are positioning surfaces, the joint of the two positioning surfaces is an arc angle, two side surfaces of one angle of the PCB are respectively close to the two positioning surfaces, and the angle is positioned in the arc angle.
As a further improvement of the present invention, one or more positioning pins are disposed on the angle-shaped positioning block, and the angle-shaped positioning block is riveted to the top three layers through the positioning pins.
As a further improvement of the invention, the height of the positioning pin column is lower than that of the angle-shaped positioning block or is flush with the angle-shaped positioning block, and the height of the angle-shaped positioning block is lower than that of the top surface of the PCB.
As a further improvement of the present invention, inclined planes are respectively disposed above the two positioning surfaces on the angular positioning block, and a guide angle for guiding the PCB when the PCB is angularly positioned is formed between the inclined planes and the PCB.
As a further improvement of the invention, the size of the through hole for installing the angle-shaped positioning block is larger than that of the angle-shaped positioning block.
As a further improvement of the invention, the upper end of the guide pin column is a conical tip used for positioning and guiding the PCB, a spring is sleeved inside the lower end of the guide pin column, and the height of the guide pin column is higher than the top surface of the PCB.
As a further improvement of the invention, the size of the through hole for installing the pilot pin is larger than that of the pilot pin.
As a further improvement of the invention, the top three layers, the middle layer and the middle layer of the base layer are provided with clapboards at intervals and are fixed by studs, and the top three layers are used for fixing the angle-shaped positioning blocks and the guide pin columns; the top layer and the top two layers are respectively fixed on the top three layers through screws, and the positions of the top layer and the top two layers are finely adjusted by adjusting the fixing positions of the screws.
As a further improvement of the invention, the overall thickness of the positioning jig is fixed, the intermediate layer comprises N layers of plates, N is a positive integer, and the intermediate layer is subjected to layer reduction or layer addition according to the slope of the probe outlet needle.
Compared with the prior art, the invention has the following advantages:
the positioning jig applied to the PCB in the embodiment of the invention carries out coarse guiding by placing the PCB in the limiting range of the four guide pin columns, carries out fine positioning on the PCB through the two angle-shaped positioning blocks, and simultaneously can correspondingly fine-adjust the position of the top layer to enable the needle heads of the probes to correspond to pads on the tested PCB one by one, thereby implementing an electrical measurement process.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a side view of a positioning fixture for PCB according to the present invention;
FIG. 2 is a top view of the positioning fixture for PCB according to the present invention;
FIG. 3 is a schematic view of the angular positioning block of the present invention;
fig. 4 and 5 are cross-sectional views of the PCB board on the positioning fixture in two different directions, respectively.
Description of reference numerals: 1-a top layer; 2-top two layers; 3-three layers; 4-an intermediate layer; 5-a base layer; 6-angle-shaped positioning blocks; 7-aligning pin columns; 8-positioning pin columns; 9-a PCB board; 61-a positioning surface; 62-arc angle; 63-inclined plane.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely illustrative of some, but not all, of the embodiments of the invention, and that the preferred embodiments of the invention are shown in the drawings. This invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present disclosure is set forth in order to provide a more thorough understanding thereof. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The terms "including" and "having," and any variations thereof, in the description and claims of this invention and the above-described drawings are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1 and 2, a side view and a top view of the positioning fixture applied to the PCB of the present invention are respectively shown, the positioning fixture applied to the PCB comprises atop layer 1, a top two-layer 2, a top three-layer 3, amiddle layer 4 and abase layer 5, which are sequentially stacked from top to bottom, two angle-shaped positioning blocks 6 and fourguide pin columns 7, wherein through holes are formed in regions corresponding to thetop layer 1 and the top two-layer 2, and the two angle-shaped positioning blocks 6 and the fourguide pin columns 7 penetrate through the through holes in thetop layer 1 and the top two-layer 2 and are fixed on the top three-layer 3; the angle-shaped positioning blocks 6 are L-shaped, the two angle-shaped positioning blocks 6 are symmetrically distributed on a diagonal line of thetop layer 1, the fourguide pin columns 7 are symmetrically distributed in pairs in four directions of thetop layer 1, thePCB 9 is placed on thetop layer 1, two corners of the diagonal position of thePCB 9 are limited by the two angle-shaped positioning blocks 6, and four sides of thePCB 9 are limited by the fourguide pin columns 7.
In the embodiment of the invention, thebase layer 5 is contacted with a test dial (spring needle bed) of an electrical measurement product, the positioning holes are arranged on thebase layer 5 and are used for bearing and matching through the positioning holes and the positioning columns on the spring needle bed, so that the probes of a jig are ensured to be in one-to-one correspondence with the array points of the spring needles on the needle bed, and the thickness of thebase layer 5 is more than 3 mm; the top threelayers 3 are fixed through studs, the angle-shaped positioning blocks 6 and theguide pin columns 7 are fixed by the top threelayers 3; thetop layer 1 and the topsecond layer 2 are respectively fixed on the topthird layer 3 through screws, and the positions of thetop layer 1 and the topsecond layer 2 can be finely adjusted by adjusting the fixing positions of the screws; the thickness of the top twolayers 2 is small, and the top two layers are mainly used for isolating probes and avoiding short circuit among the probes; thetop layer 1 is the uppermost layer of the positioning jig and is used for placing and fixing thePCB 9 and ensuring that the needle heads of the probes correspond to pads on thePCB 9 to be tested one by one so as to implement an electrical measurement process; the whole thickness of the positioning jig is fixed, themiddle layer 4 comprises N layers of plates, N is a positive integer, and themiddle layer 4 is subjected to layer reduction or layer addition according to the slope of the probe outlet needle, so that short circuit among the probes is avoided.
Referring to fig. 3, two inner sides of the L-shapedangle positioning block 6 are positioningsurfaces 61, a joint of the twopositioning surfaces 61 is anarc angle 62, two side surfaces of one angle of thePCB 9 are respectively adjacent to the twopositioning surfaces 61, and the angle is located in thearc angle 62, so that the corner of thePCB 9 is prevented from being damaged by theangle positioning block 6 while thePCB 9 is angularly positioned.
Referring to fig. 4, one ormore positioning pins 8 are disposed on the angle-shaped positioning block 6, and the angle-shaped positioning block 6 is riveted to the top threelayer 3 through thepositioning pins 8; the height of thepositioning pin column 8 is lower than that of the angle-shaped positioning block or is flush with the angle-shaped positioning block 6, and the height of the angle-shaped positioning block 6 is lower than that of the top surface of thePCB 9; inclined planes are respectively arranged above the twopositioning surfaces 61 on theangular positioning block 6, a lead-in angle θ is formed between each inclined plane and thePCB 9, the lead-in angle is set to play a role in guiding when thePCB 9 is angularly positioned, and in the embodiment of the present invention, the lead-in angle θ is an acute angle, such as 30 °, 45 °, or 60 °.
In the embodiment of the present invention, the size of the through hole for installing the angle-shaped positioning block 6 is larger than that of the angle-shaped positioning block 6, so that the fine adjustment of thetop layer 1 and the top two-layer 2 does not affect the position of the angle-shaped positioning block 6.
Referring to fig. 5, the height of theguide pin 7 is higher than the top surface of thePCB 9, the upper end of theguide pin 7 is a conical tip for positioning and guiding thePCB 9, a spring is sleeved inside the lower end of theguide pin 7, and the size of a through hole for installing theguide pin 7 is larger than that of theguide pin 7, so that thePCB 9 is placed in the limit range of the fourguide pins 7 and cannot be clamped; in the embodiment of the present invention, the number of thealignment pins 7 is not limited to four, and may be six, eight, etc., and only needs to be uniformly distributed in four directions, and an appropriate number of thealignment pins 7 may be selected according to the size of thePCB 9, which is not limited in the present invention.
The positioning jig applied to the PCB in the embodiment of the invention carries out coarse guiding by placing thePCB 9 in the limiting range of the fourguide pin columns 7, carries out fine positioning on thePCB 9 through the two angle-shaped positioning blocks 6, and simultaneously can finely adjust the position of thetop layer 1 correspondingly to enable the needle heads of the probes to correspond to pads on thePCB 9 to be tested one by one, thereby implementing an electrical measurement process, having simple structure and lower cost, being capable of accurately positioning and implementing the electrical measurement process for thePCB 9 without positioning holes, and improving the applicability of the positioning jig and the test efficiency of the electrical measurement process for thePCB 9.
In the above embodiments provided by the present invention, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the modules is merely a logical division, and other divisions may be realized in practice, for example, a plurality of modules or components may be combined or integrated into another system, or some features may be omitted, or not executed.
The modules described as separate parts may or may not be physically separate, and parts displayed as modules may or may not be physical modules, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing detailed description, or equivalent changes may be made in some of the features of the embodiments. All equivalent structures made by using the contents of the specification and the attached drawings of the invention can be directly or indirectly applied to other related technical fields, and are also within the protection scope of the patent of the invention.
Claims (10)
1. The utility model provides a be applied to positioning jig of PCB board which characterized in that includes: the device comprises a top layer, a top second layer, a top third layer, a middle layer, a base layer, two angle-shaped positioning blocks and four guide pin columns, wherein the top layer, the top second layer, the top third layer, the middle layer and the base layer are sequentially stacked from top to bottom;
through holes are formed in the areas corresponding to the top layer and the top two layers, and the top two layers are used for isolating the probes; the two angle-shaped positioning blocks and the four guide pin columns penetrate through the through holes in the top layer and the top two layer and are fixed on the top three layer; the number of the intermediate layers is set according to the needle-out slope of the probe; the PCB board positioning device comprises a top layer, a plurality of angle-shaped positioning blocks, four guiding pin columns, a plurality of conical pointed ends and a PCB board, wherein the angle-shaped positioning blocks are L-shaped, the two angle-shaped positioning blocks are symmetrically distributed on a diagonal line of the top layer, the four guiding pin columns are symmetrically distributed in two pairs in four directions of the top layer respectively, the upper ends of the guiding pin columns are conical pointed ends and are used for positioning and guiding the PCB board, the PCB board is placed on the top layer, two corners of the diagonal position of the PCB board are limited by the two angle-shaped positioning blocks, and four sides of the PCB board are limited by the four guiding pin columns respectively.
2. The positioning jig applied to the PCB board as claimed in claim 1, wherein: two surfaces of the inner side of the L-shaped angle-shaped positioning block are positioning surfaces, the joint of the two positioning surfaces is an arc angle, two side surfaces of one angle of the PCB are respectively close to the two positioning surfaces, and the angle is positioned in the arc angle.
3. The positioning jig applied to the PCB board as claimed in claim 1, wherein: one or more positioning pin columns are arranged on the angle-shaped positioning block, and the angle-shaped positioning block is riveted on the top three layers through the positioning pin columns.
4. The positioning jig applied to the PCB board as claimed in claim 3, wherein: the height of the positioning pin column is lower than that of the angle-shaped positioning block or is flush with the angle-shaped positioning block, and the height of the angle-shaped positioning block is lower than that of the top surface of the PCB.
5. The positioning jig applied to the PCB board as claimed in claim 2, wherein: inclined planes are respectively arranged above the two positioning surfaces on the angle-shaped positioning block, and a guide-in angle which plays a role in guiding when the PCB is positioned in an angle mode is arranged between each inclined plane and the PCB.
6. The positioning jig applied to the PCB board as claimed in claim 1, wherein: the size of the through hole for installing the angle-shaped positioning block is larger than that of the angle-shaped positioning block.
7. The positioning jig applied to the PCB board as claimed in claim 1, wherein: the spring is sleeved inside the lower end of the guide pin column, and the height of the guide pin column is higher than the top surface of the PCB.
8. The positioning jig applied to the PCB board as claimed in claim 7, wherein: the size of the through hole for installing the pilot pin is larger than that of the pilot pin.
9. The positioning jig applied to the PCB board as claimed in claim 1, wherein: the top three layers, the middle layer and the middle of the base layer are provided with clapboards at intervals and are fixed through studs, and the top three layers are used for fixing the angle-shaped positioning blocks and the guide pin columns; the top layer and the top two layers are respectively fixed on the top three layers through screws, and the positions of the top layer and the top two layers are finely adjusted by adjusting the fixing positions of the screws.
10. The positioning jig applied to the PCB board as claimed in claim 1, wherein: the whole thickness of the positioning jig is fixed, the middle layer comprises N layers of plates, and N is a positive integer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710687614.5ACN109387767B (en) | 2017-08-11 | 2017-08-11 | Be applied to positioning jig of PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710687614.5ACN109387767B (en) | 2017-08-11 | 2017-08-11 | Be applied to positioning jig of PCB board |
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| Publication Number | Publication Date |
|---|---|
| CN109387767A CN109387767A (en) | 2019-02-26 |
| CN109387767Btrue CN109387767B (en) | 2021-08-06 |
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| CN201710687614.5AActiveCN109387767B (en) | 2017-08-11 | 2017-08-11 | Be applied to positioning jig of PCB board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112376924B (en)* | 2020-11-19 | 2022-01-25 | 中冶建工集团有限公司 | Installation method for accurately positioning prefabricated staircase |
| CN115835506B (en)* | 2023-02-21 | 2023-05-19 | 遂宁睿杰兴科技有限公司 | Forming method of printed circuit board without positioning pin holes |
| CN117007834B (en)* | 2023-03-23 | 2024-10-01 | 东莞市海轮电子科技有限公司 | Elevator type conveying detection device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1661382A (en)* | 2004-02-23 | 2005-08-31 | 华硕电脑股份有限公司 | test equipment |
| CN202614797U (en)* | 2012-05-02 | 2012-12-19 | 苏州创瑞机电科技有限公司 | Floating plate mechanism of chip module test socket |
| CN202738264U (en)* | 2012-08-24 | 2013-02-13 | 恩斯迈电子(深圳)有限公司 | Chip positioning fixture and electronic system thereof |
| CN202870253U (en)* | 2012-09-14 | 2013-04-10 | 深圳麦逊电子有限公司 | Clamping and positioning device for PCB (Printed Circuit Board) to be detected |
| CN203894266U (en)* | 2014-05-09 | 2014-10-22 | 深圳麦逊电子有限公司 | Clamp of short needle, straight needle and lengthening needle |
| CN204631068U (en)* | 2015-04-02 | 2015-09-09 | 大族激光科技产业集团股份有限公司 | A kind of tool support |
| CN204498476U (en)* | 2015-04-16 | 2015-07-22 | 广上科技(广州)有限公司 | A kind of PCB localization tool |
| CN205029975U (en)* | 2015-10-21 | 2016-02-10 | 歌尔声学股份有限公司 | Utensil is assisted to location frock of PCB board |
- 2017
- 2017-08-11CNCN201710687614.5Apatent/CN109387767B/enactiveActive
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| CN109387767A (en) | 2019-02-26 |
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| TA01 | Transfer of patent application right | Effective date of registration:20200629 Address after:518000 zone a, floor 2, floor 3, floor 5, zone a, plant 3, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Applicant after:SHENZHEN MASON ELECTRONICS Co.,Ltd. Address before:518000, No. 9 West West Road, Nanshan District hi tech park, Shenzhen, Guangdong Applicant before:HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. Applicant before:SHENZHEN MASON ELECTRONICS Co.,Ltd. | |
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