Display panel, manufacturing method thereof and flexible display deviceTechnical Field
The invention relates to a display panel, a manufacturing method thereof and a flexible display device, and belongs to the technical field of organic light emitting display.
Background
Organic Light-Emitting diodes (OLEDs) have excellent properties such as low power consumption, high color saturation, wide viewing angle, thin thickness, and flexibility, and are therefore widely used in flexible display devices such as terminal devices and wearable devices.
An existing flexible display device generally includes an array substrate, an anode Layer, a light emitting Layer, a cathode Layer, a light extraction Layer (CPL), and an encapsulation Layer, which are sequentially stacked. The packaging layer of the flexible display device adopts an alternate structure of organic layers and inorganic layers to ensure the water and oxygen resistance of the flexible display device.
However, when the flexible display device is bent for multiple times, peeling and separation between the inorganic layer and the organic layer in the encapsulation layer are likely to occur, and even the inorganic layer is broken, so that the protective effect of the encapsulation layer on the light emitting layer is reduced, and the service life of the flexible display device is shortened.
Disclosure of Invention
The invention provides a display panel, a manufacturing method thereof and a flexible display device, which are used for solving the problem of weakening functions of an encapsulation layer and prolonging the service lives of the display panel and the flexible display device.
The invention provides a display panel, which comprises a plurality of light-emitting units arranged on an array substrate and an encapsulation layer arranged on the light-emitting units, wherein the encapsulation layer comprises a first organic layer and an inorganic layer which are periodically stacked, and the inorganic layer comprises a plurality of inorganic blocks which are arranged at intervals;
the plurality of inorganic blocks are embedded in the first organic layer and are arranged in one-to-one correspondence with the plurality of light emitting units, and the orthographic projection of each inorganic block on the array substrate covers the orthographic projection of each light emitting unit on the array substrate.
The display panel as described above, optionally, the display panel further comprises a pixel defining layer for isolating a plurality of the light emitting units;
the orthographic projection of each inorganic block on the array substrate at least partially covers the orthographic projection of the pixel defining layer on the array substrate.
The display panel as described above, optionally, the inorganic block has a central portion disposed corresponding to the light emitting unit and end portions at both ends of the central portion;
the end portions have a small end surface facing the central portion and a large end surface remote from the central portion.
In the display panel as described above, optionally, an orthographic projection of the central portion on the array substrate covers an orthographic projection of the light emitting unit on the array substrate, or the orthographic projection of the central portion on the array substrate coincides with the orthographic projection of the light emitting unit on the array substrate.
The display panel as described above, optionally, the height of the small end face is not less than the height of the central portion, and the height of the large end face is 1.5 to 10 times the height of the central portion.
In the display panel as described above, optionally, a plurality of the inorganic blocks are embedded in an array inside the first organic layer.
The display panel as described above, optionally, the encapsulation layer further includes a second organic layer, the second organic layer covers the first organic layer, and the second organic layer and the first organic layer jointly wrap the plurality of inorganic blocks.
The display panel as described above, optionally, the display panel further comprises a first electrode layer and a protective layer, the first electrode layer and the protective layer being disposed between the light emitting unit and the encapsulation layer;
the first electrode layer comprises a plurality of first electrode blocks, each first electrode block is correspondingly arranged on one light-emitting unit, and the orthographic projection of each first electrode block on the array substrate covers the orthographic projection of each light-emitting unit on the array substrate;
the protective layer covers a plurality of the first electrode blocks and is filled between each first electrode block.
The invention also provides a flexible display device comprising any one of the display panels.
The invention also provides a manufacturing method of the display panel, which comprises the following steps:
providing a process substrate;
forming a first organic layer on the process substrate;
patterning the first organic layer to form a plurality of recesses in the first organic layer;
forming an inorganic layer on the first organic layer;
patterning the inorganic layer to form a plurality of inorganic blocks embedded in the concave parts one by one;
providing an OLED display panel, wherein the OLED display panel comprises a plurality of light-emitting units arranged on an array substrate;
and stripping the process substrate to bond the first organic layer and the light-emitting unit.
In the display panel, the manufacturing method thereof and the flexible display device, provided by the invention, the inorganic blocks arranged at intervals are used as the inorganic layers of the packaging layer, so that the stress generated by the inorganic layers when the packaging layer is bent can be reduced, the stress degree of the packaging layer when the packaging layer is bent is effectively improved, the possible breakage phenomenon of the inorganic layers when the packaging layer is bent is avoided, and the service lives of the display panel and the flexible display device are prolonged; in addition, a plurality of inorganic pieces are coated by the first organic layer, so that the organic layer and the inorganic layer can be effectively prevented from falling off when the flexible display device is bent, the organic layer can be enabled to absorb stress generated by the inorganic layer when the flexible display device is bent more quickly and effectively, the breakage phenomenon possibly generated by the inorganic layer in the bending process is further avoided, and the service lives of the display panel and the flexible display device are further prolonged. Meanwhile, the plurality of inorganic blocks and the plurality of light-emitting units are arranged in a one-to-one correspondence manner, and the orthographic projection of each inorganic block on the array substrate covers the orthographic projection of each light-emitting unit on the array substrate, so that the protection of the packaging layer on the light-emitting units can be more embodied, and the protection strength of the packaging layer on the light-emitting units is enhanced to further prolong the service life of the display panel and the flexible display device.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention. Moreover, the drawings and the description are not intended to limit the scope of the inventive concept in any way, but rather to illustrate it by those skilled in the art with reference to specific embodiments.
FIG. 1 is a schematic structural diagram of an embodiment of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of one embodiment of an encapsulation layer in an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a further embodiment of an encapsulation layer in an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a display panel according to still another embodiment of the present disclosure;
fig. 5 is a flowchart illustrating a manufacturing process of a display panel according to an embodiment of the invention.
Description of reference numerals:
100-a display panel;
110-an array substrate;
120-a light emitting unit;
130-an encapsulation layer;
131-a first organic layer;
132-an inorganic layer;
132 a-inorganic block;
133-a second organic layer;
140-a pixel defining layer;
150-a first electrode layer;
150 a-a first electrode block;
160-a protective layer;
170-second electrode layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Example one
Fig. 1 is a schematic structural diagram of an implementation manner of a display panel in an embodiment of the present disclosure. As shown in fig. 1, the present embodiment provides adisplay panel 100, including a plurality oflight emitting units 120 disposed on anarray substrate 110, and anencapsulation layer 130 disposed on the plurality oflight emitting units 120, theencapsulation layer 130 including a firstorganic layer 131 and aninorganic layer 132 periodically stacked, theinorganic layer 132 including a plurality ofinorganic blocks 132a disposed at intervals; the plurality ofinorganic blocks 132a are embedded in the firstorganic layer 131, the plurality ofinorganic blocks 132a are disposed in one-to-one correspondence with the plurality oflight emitting units 120, and an orthogonal projection of eachinorganic block 132a on thearray substrate 110 covers an orthogonal projection of eachlight emitting unit 120 on thearray substrate 110.
One type of encapsulation layer that is more commonly used in the art typically includes a plurality of repeating stacked encapsulation units, each encapsulation unit including an inorganic layer and an organic layer in a stacked arrangement. The inorganic layer is generally made of transparent oxide, fluoride or silicon nitride, and the organic layer is generally made of acrylate, polyacrylate or polystyrene and is formed by ink-jet printing and other methods. However, since the elastic modulus of the inorganic layer is generally smaller than that of the organic layer, the inorganic layer is easily broken and separated or peeled from the organic layer after the flexible display device is bent for multiple times, which affects the service life of the flexible display device.
In view of the above problem, the present embodiment improves the structure of the encapsulation layer, where theencapsulation layer 130 includes a firstorganic layer 131 and aninorganic layer 132, theinorganic layer 132 is specifically a plurality ofinorganic blocks 132a disposed at intervals, and the plurality ofinorganic blocks 132a are embedded inside the firstorganic layer 131.
In the embodiment of the present invention, theinorganic layer 132 is a plurality ofinorganic blocks 132a disposed at intervals, and when theflexible display panel 100 is bent, in a direction perpendicular to the firstorganic layer 131, a stress area of theinorganic layer 132 is reduced, so that stress generated by theinorganic layer 132 is also small, and a phenomenon that theinorganic layer 132 is broken due to an excessive stress during bending can be avoided. Moreover, when theinorganic layer 132 is a plurality ofinorganic blocks 132a, eachinorganic block 132a does not affect each other, and even if one of theinorganic blocks 132a is damaged, the otherinorganic blocks 132a are not affected, so that the damage degree of the display panel is reduced, and the service life of thedisplay panel 100 is prolonged.
In addition, since theinorganic layer 132 is embedded in the firstorganic layer 131, a contact area between theinorganic layer 132 and the firstorganic layer 131 is increased, so that not only is a connection strength between theinorganic layer 132 and the firstorganic layer 131 enhanced, but also theinorganic layer 132 and the firstorganic layer 131 are not easily separated from each other, and even if the display panel is bent, stress generated by theinorganic layer 132 is absorbed and released by the firstorganic layer 131 having a large elastic modulus, thereby further preventing theinorganic layer 132 from being broken due to excessive stress.
In fig. 1, theinorganic block 132a is embedded inside the firstorganic layer 131, specifically, the upper surface of theinorganic block 132a is exposed outside the first organic layer 131 (i.e., the upper surface of theinorganic block 132a is flush with the plane of the first organic layer 131), and the rest of theinorganic block 132a is disposed inside the firstorganic layer 131.
In addition, the present embodiment does not limit the specific number of the firstorganic layers 131 and theinorganic layers 132, and theencapsulation layer 130 may be a stack of a plurality of firstorganic layers 131 in sequence, and a plurality ofinorganic blocks 132a disposed at intervals are embedded inside each firstorganic layer 131 as theinorganic layer 132.
It is noted that, since theencapsulation layer 130 is disposed on the plurality of light emittingcells 120 in thedisplay panel 100, water vapor and oxygen from the outside are blocked, thereby preventing the water vapor and the oxygen from entering the flexible panel. Therefore, in order to further ensure the protection effect of theencapsulation layer 130 of the present invention on thelight emitting units 120, the plurality ofinorganic blocks 132a of the present invention correspond to the plurality of light emittingunits 120 one to one, and the orthographic projection of eachinorganic block 132a on thearray substrate 110 covers the orthographic projection of eachlight emitting unit 120 corresponding to theinorganic block 132a on thearray substrate 110, that is, in the direction perpendicular to thearray substrate 110, eachlight emitting unit 120 can be completely protected by theinorganic block 132a above it, so as to avoid the reduction of the service life of thedisplay panel 100 due to the damage of thelight emitting unit 120 caused by the external moisture. Specifically, when thelight emitting unit 120 is disposed, the size of theinorganic block 132a may be larger than that of theinorganic block 132a, so as to ensure that the orthographic projection of eachinorganic block 132a on thearray substrate 110 covers the orthographic projection of eachlight emitting unit 120 corresponding to theinorganic block 132a on thearray substrate 110.
In thedisplay panel 100 provided by this embodiment, theinorganic layer 132 in theencapsulation layer 130 is the plurality ofinorganic blocks 132a arranged at intervals, so that the stress generated when theinorganic layer 132 is bent in thedisplay panel 100 is reduced, a fracture phenomenon of theinorganic layer 132 due to an excessive stress can be avoided, and the service life of the display panel is prolonged; in addition, theinorganic layer 132 is embedded in the firstorganic layer 131, so that the contact area between theinorganic layer 132 and the firstorganic layer 131 is increased, the connection strength between theinorganic layer 132 and the firstorganic layer 131 is further enhanced, and theinorganic layer 132 and the firstorganic layer 131 are prevented from being separated due to bending of thedisplay panel 100. Moreover, because theinorganic layer 132 and the firstorganic layer 131 have a large contact area, the firstorganic layer 131 with a large elastic modulus can rapidly and effectively absorb the stress generated by theinorganic layer 132 when thedisplay panel 100 is bent, which is helpful for releasing the stress of theinorganic layer 132, thereby further avoiding the shortening of the service life of thedisplay panel 100 caused by the fracture of theinorganic layer 132 due to the excessive stress, and prolonging the service life of thedisplay panel 100. In addition, the present invention further arranges the plurality ofinorganic blocks 132a above the plurality of light emittingunits 120 in a one-to-one correspondence, and controls the orthographic projection of theinorganic blocks 132a on thearray substrate 110 to cover the orthographic projection of eachlight emitting unit 120 on thearray substrate 110, so as to ensure that eachlight emitting unit 120 is protected to the maximum extent by theencapsulation layer 130, thereby further prolonging the service life of thedisplay panel 100.
On the basis of the above embodiment, thedisplay panel 100 may further include apixel defining layer 140 for isolating the plurality of light emittingunits 120; an orthogonal projection of eachinorganic block 132a on thearray substrate 110 at least partially covers an orthogonal projection of thepixel defining layer 140 on thearray substrate 110.
In specific implementation, thepixel defining layer 140 may be formed on thearray substrate 110 by evaporation, deposition, inkjet printing, or other processes, and completely fills between every two adjacentlight emitting units 120, and since the orthographic projection of eachinorganic block 132a on thearray substrate 110 at least partially covers the orthographic projection of thepixel defining layer 140 on thearray substrate 110, the protection strength of theinorganic block 132a on thelight emitting units 120 can be further ensured. It can be understood that the orthographic projection of eachinorganic block 132a on thearray substrate 110 at least partially covers the orthographic projection of thepixel defining layer 140 on thearray substrate 110 means that eachinorganic block 132a has a sufficient size such that the orthographic projection of theinorganic block 132a on thearray substrate 110 can cover not only the orthographic projection of thelight emitting unit 120 on thearray substrate 110 but also the orthographic projection of theinorganic block 132a on thearray substrate 110 can cover the orthographic projection of the adjacent area of thelight emitting unit 120 on thearray substrate 110.
As a preferred embodiment, in addition to the above embodiment, theinorganic block 132a has a central portion disposed corresponding to thelight emitting unit 120 and end portions at both ends of the central portion; the end portions have a small end surface facing the central portion and a large end surface remote from the central portion.
Specifically, theinorganic block 132a is composed of three parts of a first end portion, a central portion and a second end portion which are connected, and an end surface of an end of the first end portion and the second end portion which are respectively connected to the central portion is smaller than an end surface of an end far from the central portion, wherein the central portion is directly above the correspondinglight emitting unit 120.
In order to secure the strength of theinorganic block 132a itself, the height of the small end face may be made not less than the height of the central portion, and the height of the large end face may be 1.5 to 10 times the height of the central portion. Here, the height refers to the size of the first end portion, the central portion, and the second end portion in the direction perpendicular to thearray substrate 110.
Illustratively, theinorganic block 132a may be a dumbbell-shapedinorganic block 132a, the dumbbell-shapedinorganic block 132a including two dumbbell heads (i.e., a first end portion and a second end portion) and a connecting rod (i.e., a center portion) connecting the two dumbbell heads.
Fig. 2 is a schematic structural diagram of an embodiment of an encapsulation layer in an embodiment of the present invention, and as shown in fig. 2, theinorganic layer 132 in this embodiment includes a plurality of dumbbell-shapedinorganic blocks 132a, wherein the dumbbell head is a trapezoid, the connecting rod is a straight quadrangular prism, and the end surface of the straight quadrangular prism has a shape matching the shape of the top surface of the trapezoid (i.e., the height of the small end surface is equal to the height of the central portion), so that the dumbbell-shapedinorganic blocks 132a are formed by connecting the end surface of the straight quadrangular prism and the top surface of the trapezoid. It can be understood that, when theinorganic block 132a is in the dumbbell shape, the irregular shape of the dumbbell head can enhance the connection strength between the dumbbell-shapedinorganic block 132a and the firstorganic layer 131, and prevent theinorganic layer 132 and the firstorganic layer 131 from being separated when the display panel is bent, thereby prolonging the service life of the display panel.
In addition, when theinorganic block 132a is the dumbbell-shapedinorganic block 132a, the service life of thedisplay panel 100 may be further extended by defining the dimensional relationship between theinorganic block 132a and the firstorganic layer 131. Specifically, the height of the end portion of theinorganic block 132a may be 300-1000nm, the height of the central portion may be 100-800nm, and the length of the central portion may account for one-third to two-thirds of the length of the entireinorganic block 132a, and the thickness of the firstorganic layer 131 is 800-1500 nm. The size can effectively balance the stress generated when thedisplay panel 100 is bent, and can further enable the stress of theinorganic block 132a to be effectively absorbed by the firstorganic layer 131, so that the stress is distributed most reasonably between theinorganic block 132a and the firstorganic layer 131, and theinorganic block 132a is prevented from being broken due to overlarge stress, and therefore the service life of thedisplay panel 100 is prolonged.
It is to be understood that theinorganic block 132a of the present invention is not limited to the above-mentioned shape, and may be theinorganic block 132a having both ends of a sphere, or theinorganic block 132a having both ends of a tetragonal body, or even theinorganic block 132a having both ends of a shape different from the same shape.
Further, in order to make the orthographic projection of eachinorganic block 132a on thearray substrate 110 cover the orthographic projection of eachlight emitting unit 120 on thearray substrate 110, specifically, the orthographic projection of the central portion of theinorganic block 132a on thearray substrate 110 covers the orthographic projection of thelight emitting unit 120 on thearray substrate 110, or the orthographic projection of the central portion on thearray substrate 110 is overlapped with the orthographic projection of thelight emitting unit 120 on thearray substrate 110.
In detail, when the size of the center portion of theinorganic block 132a is larger than the size of thelight emitting unit 120, the orthographic projection of the center portion of theinorganic block 132a on thearray substrate 110 covers the orthographic projection of thelight emitting unit 120 on thearray substrate 110; when the size of the center portion of theinorganic block 132a is equal to the size of thelight emitting unit 120, the orthographic projection of the center portion of theinorganic block 132a on thearray substrate 110 coincides with the orthographic projection of thelight emitting unit 120 on thearray substrate 110.
Since the center of theinorganic block 132a corresponds to thelight emitting unit 120, when the orthographic projection of the center of theinorganic block 132a on thearray substrate 110 covers the orthographic projection of thelight emitting unit 120 on thearray substrate 110, or the orthographic projection of the center on thearray substrate 110 coincides with the orthographic projection of thelight emitting unit 120 on thearray substrate 110, the protection of theencapsulating layer 130 on thelight emitting unit 120 can be effectively ensured, the influence of external moisture on the quality of thelight emitting unit 120 is avoided, and the service life of thedisplay panel 100 is prolonged.
In addition, in order to prolong the service life of thedisplay panel 100, a plurality ofinorganic blocks 132a may be embedded in an array inside the firstorganic layer 131. The array-shaped embedding can ensure the distribution uniformity of theinorganic blocks 132a in the firstorganic layer 131, so as to ensure the uniformity of the connection relationship between the firstorganic layer 131 and the plurality ofinorganic blocks 132a in the direction perpendicular to the plane of the firstorganic layer 131, improve the uniformity of stress distribution when thedisplay panel 100 is bent, avoid the fracture caused by the stress concentration phenomenon of theinorganic layers 132, and further prolong the service life of thedisplay panel 100.
Fig. 3 is a schematic structural diagram of another embodiment of an encapsulation layer in an embodiment of the invention. As shown in fig. 3, on the basis of the above embodiment, theencapsulation layer 130 further includes a secondorganic layer 133, the secondorganic layer 133 covers the firstorganic layer 131, and the secondorganic layer 133 and the firstorganic layer 131 jointly wrap the plurality ofinorganic blocks 132 a.
In this embodiment, since theinorganic layer 132 is completely wrapped by the firstorganic layer 131 and the secondorganic layer 133, the entire surface area of theinorganic layer 132 can be in contact with the firstorganic layer 131 and the secondorganic layer 133, which not only enhances the connection strength between theinorganic layer 132 and the organic layers (the firstorganic layer 131 and the second organic layer 133) and prevents theinorganic layer 132 and the organic layers (the firstorganic layer 131 and the second organic layer 133) from being separated from each other, but also when thedisplay panel 100 is bent, the stress generated by theinorganic layer 132 is absorbed and released by the firstorganic layer 131 and the secondorganic layer 133 at the same time, thereby further preventing theinorganic layer 132 from being broken due to excessive stress.
Alternatively, on the basis of the above embodiment, theencapsulation layer 130 may further include a third organic layer. When thedisplay panel 100 is bent, the firstorganic layer 131 and the secondorganic layer 133 absorb the stress generated by theinorganic layer 132, and in order to avoid damage caused by the excessive stress absorption of the firstorganic layer 131 and the secondorganic layer 133, a third organic layer may be disposed above the secondorganic layer 133, and the third organic layer may dilute the stress in the secondorganic layer 133 by contacting the third organic layer with the secondorganic layer 133. In addition, the elastic modulus of the third organic layer may be greater than that of the secondorganic layer 133 through the material arrangement, so that the diluting capability of the third organic layer to the stress in the secondorganic layer 133 can be significantly improved, and the shortening of the lifetime of thedisplay panel 100 due to the damage of the firstorganic layer 131 and/or the secondorganic layer 133 can be further avoided.
Further, the thickness of the third organic layer is less than the thickness of the combined layer of the firstorganic layer 131 and the secondorganic layer 133. For example, when the combined layer of the firstorganic layer 131 and the secondorganic layer 133 has a thickness of 800-1500nm, the thickness of the third organic layer may be 500-100 nm. Since the thickness of the third organic layer is less than the thickness of the combined layer of the firstorganic layer 131 and the secondorganic layer 133, when thedisplay panel 100 is bent, the radius of curvature of the combined layer of the firstorganic layer 131 and the secondorganic layer 133 is greater than the radius of curvature of the third organic layer, so that the third organic layer may gather greater stress compared with the combined layer of the firstorganic layer 131 and the secondorganic layer 133, thereby protecting theinorganic layer 132 inside the firstorganic layer 131 and the secondorganic layer 133, reducing the possibility of fracture of theinorganic layer 132 when thedisplay panel 100 is bent, and prolonging the service life of thedisplay panel 100.
Fig. 4 is a schematic structural diagram of a display panel according to still another embodiment of the present disclosure.
In the actual development process, the inventor of the present invention found that the inorganic layer in the general encapsulation layer is above and in contact with the first electrode layer of the display panel, and covers the side surfaces of the film layers between the substrate and the first electrode layer of the display panel, so as to block the external water vapor and oxygen. When the display panel is bent, the inorganic layer is damaged due to overlarge stress, and the first electrode layer in contact with the inorganic layer is also influenced to damage the first electrode layer, and the first electrode layer is also broken due to overlarge stress during bending. Wherein the first electrode layer may be a cathode layer or an anode layer.
Based on the above findings, as shown in fig. 4, the display panel of the present invention further includes afirst electrode layer 150 and aprotective layer 160, thefirst electrode layer 150 and theprotective layer 160 being disposed between thelight emitting unit 120 and theencapsulation layer 130; thefirst electrode layer 150 includes a plurality offirst electrode blocks 150a, eachfirst electrode block 150a is correspondingly disposed on onelight emitting unit 120, and an orthographic projection of eachfirst electrode block 150a on thearray substrate 110 covers an orthographic projection of eachlight emitting unit 120 on thearray substrate 110; theprotective layer 160 covers the plurality of first motor blocks and fills between each of the first motor blocks.
Because thefirst electrode layer 150 is a plurality offirst electrode blocks 150a arranged at intervals, compared with the commonfirst electrode layer 150, when thedisplay panel 100 is bent, the stressed area of thefirst electrode layer 150 is reduced in the direction perpendicular to the plane of thearray substrate 110, and the stress generated by bending thefirst electrode layer 150 is also small, so that the phenomenon that thefirst electrode layer 150 is broken due to overlarge stress during bending can be avoided. Meanwhile, since theinorganic layer 132 of theencapsulation layer 130 is embedded in the firstorganic layer 131, theinorganic layer 132 is prevented from directly contacting thefirst electrode layer 150, so that the deformation of theinorganic layer 132 does not affect thefirst electrode layer 150, and the elastic modulus of the firstorganic layer 131 is large, so that thefirst electrode layer 150 is not damaged by the contact between the firstorganic layer 131 and thefirst electrode layer 150.
In addition, eachfirst electrode block 150a is correspondingly disposed on onelight emitting unit 120, and an orthogonal projection of eachfirst electrode block 150a on thearray substrate 110 covers an orthogonal projection of eachlight emitting unit 120 on thearray substrate 110. That is, thefirst electrode blocks 150a correspond to thelight emitting cells 120 one to one, and the size of thefirst electrode blocks 150a is larger than that of the light emittingcells 120.
Specifically, when thefirst electrode layer 150 is a cathode layer, since electrons released from the first electrode layer 150 (cathode layer) need to be recombined with holes from the second electrode layer 170 (anode layer) at the light emittingcells 120 to emit light, each of the first electrode blocks 150a (cathode blocks) is disposed on a corresponding one of the light emittingcells 120, respectively. When the size of thefirst electrode block 150a is larger than the size of thelight emitting unit 120, thefirst electrode block 150a can be ensured to fully cover thelight emitting unit 120, so that electrons released by thefirst electrode block 150a can be effectively collected in thelight emitting unit 120 to facilitate the light emission of the display panel; when thefirst electrode layer 150 is an anode layer, since holes released from the first electrode layer 150 (anode layer) need to be recombined with electrons from the second electrode layer 170 (cathode layer) at the light emittingcells 120 to emit light, each of the first electrode blocks 150a (anode blocks) is disposed on a corresponding one of the light emittingcells 120, respectively. When the size of thefirst electrode block 150a is larger than the size of thelight emitting unit 120, thefirst electrode block 150a can ensure thelight emitting unit 120 to be fully covered, so that the holes released by thefirst electrode block 150a can be effectively collected in thelight emitting unit 120, which is favorable for the light emission of thedisplay panel 100.
Further, in order to minimize the influence of theencapsulation layer 130 on thefirst electrode layer 150 when thedisplay panel 100 is bent, aprotection layer 160 may be disposed between thefirst electrode layer 150 and the firstorganic layer 131, and theprotection layer 160 covers the plurality offirst electrode blocks 150a and is filled between eachfirst electrode block 150 a. Specifically, theprotective layer 160 not only covers the upper side of eachfirst electrode block 150a, but also wraps eachfirst electrode block 150 a.
Thisprotective layer 160 not only can separatefirst electrode layer 150 andpackaging layer 130, avoidspackaging layer 130 to cause the influence tofirst electrode layer 150, can also wrap upfirst electrode layer 150 to the stress thatfirst electrode layer 150 produced when effectively releasing display panel buckles avoidsfirst electrode layer 150's the too big emergence of stress fracture, has effectively prolonged display panel's life.
In thedisplay panel 100 of this embodiment, not only theinorganic blocks 132a are embedded inside the firstorganic layer 131, so as to prevent theinorganic layer 132 from being separated from the firstorganic layer 131 when thedisplay panel 100 is bent, and prevent theinorganic layer 132 from being broken, thereby effectively prolonging the service life of thedisplay panel 100, but also preventing theinorganic layer 132 from damaging thefirst electrode layer 150 due to the direct contact between theinorganic layer 132 and thefirst electrode layer 150, and further reducing the stress generated by thefirst electrode layer 150 when thedisplay panel 100 is bent by setting thefirst electrode layer 150 as the first electrode blocks 150 a. Moreover, theprotective layer 160 can prevent thefirst electrode layer 150 from being affected by theencapsulation layer 130, and can also wrap thefirst electrode layer 150, so that the stress generated by thefirst electrode layer 150 when thedisplay panel 100 is bent can be effectively released, and therefore, the service life of thedisplay panel 100 in this embodiment can be greatly prolonged.
Example two
The embodiment provides a flexible display device, which can be an OLED display device, and any product or component with a display function, such as a television, a digital camera, a mobile phone, a tablet computer, a smart watch, an electronic book, a navigator and the like, including the OLED display device.
The flexible display device includes: the display panel in the first embodiment. The structure, function and implementation of the display panel may be the same as those of the first embodiment, and are not described herein again.
The flexible display device comprises a display panel, wherein the inorganic layer of the packaging layer of the display panel is a plurality of inorganic blocks arranged at intervals, so that the stress generated when the display panel is bent is reduced, the breakage phenomenon of the inorganic layer due to overlarge stress can be avoided, and the service life of the flexible display device is prolonged; in addition, the inorganic layer is embedded in the first organic layer, so that the contact area between the inorganic layer and the first organic layer is increased, the connection strength between the inorganic layer and the first organic layer is further enhanced, and the separation of the inorganic layer and the first organic layer caused by bending of the flexible display device is avoided. Moreover, the inorganic layer and the first organic layer have larger contact area, so that the stress generated by the inorganic layer can be quickly and effectively absorbed by the first organic layer with larger elastic modulus when the flexible display device is bent, the release of the stress of the inorganic layer is facilitated, the phenomenon that the service life of the flexible display device is shortened due to the fact that the inorganic layer is broken due to overlarge stress is further avoided, and the service life of the flexible display device is prolonged. In addition, the plurality of inorganic blocks are correspondingly arranged above the plurality of light-emitting units one by one, and the orthographic projection of each light-emitting unit on the array substrate is covered by controlling the orthographic projection of the inorganic blocks on the array substrate, so that each light-emitting unit is protected to the maximum extent by the packaging layer, and the service life of the flexible display device is further prolonged.
EXAMPLE III
Fig. 5 is a flowchart illustrating a manufacturing method of a display panel according to an embodiment of the present invention, as shown in fig. 5, the manufacturing method includes the following steps:
s101: a process substrate is provided.
S102: a first organic layer is formed on the process substrate.
The first organic layer is formed on the process substrate, for example, by printing or evaporation.
S103: the first organic layer is patterned to form a plurality of recesses in the first organic layer.
The first organic layer is patterned by etching or the like to obtain a plurality of spaced recesses, which are understood to receive the inorganic blocks.
S104: an inorganic layer is formed on the first organic layer.
The inorganic layer is formed on the first organic layer, for example, by printing or vapor deposition, and it is understood that the inorganic layer is a combination of an inorganic material contained in the recess and an inorganic material attached to the plane of the first organic layer.
S105: and patterning the inorganic layer to form a plurality of inorganic blocks embedded in the concave parts one by one.
And patterning the inorganic layer by etching and other processes, removing the inorganic material attached to the plane of the first organic layer, and retaining the inorganic material in the recessed portions to form a plurality of inorganic blocks embedded in the recessed portions one by one.
S106: an OLED display panel is provided, which includes a plurality of light emitting units disposed on an array substrate.
Wherein the size of each light emitting unit is smaller than that of the inorganic block, and the distribution of the light emitting units on the array substrate corresponds to that of the inorganic blocks in the second organic layer.
S107: and stripping the process substrate to bond the first organic layer and the light-emitting unit.
After the process substrate is peeled off from the first organic layer, and the first organic layer is bonded to the light emitting unit, the display panel of the present embodiment is obtained.
In the bonding process, an inorganic block corresponding to each light-emitting unit is ensured above each light-emitting unit.
In the manufacturing method of the embodiment, the inorganic layer of the encapsulation layer of the display panel is formed by the plurality of inorganic blocks arranged at intervals, so that the stress generated when the display panel is bent by the inorganic layer is reduced, the inorganic layer can be prevented from being broken due to overlarge stress, and the service life of the display panel is prolonged; in addition, the inorganic layer is embedded in the first organic layer, so that the contact area between the inorganic layer and the first organic layer is increased, the connection strength between the inorganic layer and the first organic layer is further enhanced, and the separation of the inorganic layer and the first organic layer caused by bending of the display panel is avoided. Moreover, the inorganic layer and the first organic layer have larger contact area, so that the stress generated by the inorganic layer can be quickly and effectively absorbed by the first organic layer with larger elastic modulus when the display panel is bent, the release of the stress of the inorganic layer is facilitated, the shortening of the service life of the display panel caused by the fracture of the inorganic layer due to overlarge stress is further avoided, and the service life of the display panel is prolonged. In addition, the plurality of inorganic blocks are correspondingly arranged above the plurality of light-emitting units one by one, and the orthographic projection of the inorganic blocks on the array substrate is covered on the orthographic projection of each light-emitting unit on the array substrate by enabling the size of each light-emitting unit to be smaller than that of the inorganic blocks, so that each light-emitting unit is protected to the maximum extent by the packaging layer, and the service life of the display panel is further prolonged.
In addition, in the present invention, unless otherwise expressly specified or limited, the terms "connected," "stacked," and the like are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.