Specific embodiment
Presently filed embodiment is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginningSame or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginsengThe embodiment for examining attached drawing description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
In the description of the present application, it is to be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width "," thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up timeThe orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience ofIt describes the application and simplifies description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spyFixed orientation construction and operation, therefore should not be understood as the limitation to the application.In addition, term " first ", " second " are only used forPurpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic." first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.?In the description of the present application, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phaseEven ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It canTo be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediaryIt connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this fieldFor personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
Following disclosure provides many different embodiments or example is used to realize the different structure of the application.In order toSimplify disclosure herein, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, andAnd purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter,This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or settingRelationship.In addition, this application provides various specific techniques and material example, but those of ordinary skill in the art can be withRecognize the application of other techniques and/or the use of other materials.
Individual camera gyroscope will be usually arranged, for detecting in existing optical anti-vibration method in imaging modulesThe shake of camera, meanwhile, it include the PCB circuit board of setting driving chip in imaging modules, in this way, causing with optical anti-vibrationThe sizes of imaging modules be greater than common imaging modules, and can not reduce.
Fig. 1 and Fig. 2 is please referred to, the electronic device 1000 of the application embodiment includes ontology 110 and sliding block 200.Sliding block 200 is used to slide in the first position being contained in ontology 110 and between the second position that ontology 110 exposes,CCD camera assembly 100 and gyroscope 120 are provided in sliding block 200, CCD camera assembly 100 and gyroscope 120 are separately positioned.Electronic device 1000 can be used for controlling the work of CCD camera assembly 100 according to the feedback data of gyroscope 120 to realize optical anti-vibrationShooting.
In above-mentioned electronic device, CCD camera assembly 100 and gyroscope 120 are separately positioned, reduce in CCD camera assembly 100Device, so as to reduce the volume of CCD camera assembly 100.In addition, CCD camera assembly 100 and gyroscope 120 are arranged atIn sliding block 200, so that gyroscope 120, relatively close to CCD camera assembly 100, gyroscope 120 can accurately detect camera shootingThe jitter conditions of head assembly 100 improve the anti-shake effect of CCD camera assembly 100.
Illustratively, electronic device 1000 can be various types of calculating that are mobile or portable and executing wireless communicationAny one of machine system equipment (only illustratively shows a kind of form) in Fig. 1.Specifically, electronic device 1000 can be withFor mobile phone or smart phone (for example, being based on iPhone TM, the phone based on Android TM), portable gaming device(such as Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), kneeLaptop, PDA, portable Internet appliance, music player and data storage device, other handheld devices and such asWrist-watch, In-Ear Headphones, pendant, headphone etc., electronic device 100 can also be other wearable devices (for example, allAs electronic glasses, electronics clothes, electronics bracelet, electronics necklace, electronics are tatooed, the headset equipment of electronic equipment or smartwatch(HMD))。
Electronic device 1000 can also be that any one of multiple electronic equipments, multiple electronic equipments include but is not limited toCellular phone, smart phone, other wireless telecom equipments, personal digital assistant, audio player, other media players, soundHappy logger, video recorder, camera, other medium recorders, radio, Medical Devices, vehicle transport instrument, calculator, canProgram remote controler, pager, laptop computer, desktop computer, printer, netbook computer, personal digital assistant(PDA), portable media player (PMP), Motion Picture Experts Group's (MPEG-1 or MPEG-2) audio layer 3 (MP3) playDevice, portable medical device and digital camera and combinations thereof.
In some cases, electronic device 1000 can execute multiple functions and (for example, playing music, show video, storagePicture and send and receive call).If desired, electronic device 1000 can be such as cellular phone, media playThe portable device of device, other handheld devices, watch equipment, pendant equipment, receiver device or other compact portable equipment.
Gyroscope 120 is used as a kind of typical sensor, can be used for the axial line movement of detection electronic installation 1000, energyMeasurement is made to the movement of rotation and deflection.For example, gyroscope 120 can detecte electronic device 1000 be vertically arranged or the shape of traverseState, and then display picture rotation can be controlled according to the detection data of acquisition by the central processing unit of electronic device 1000.
In the present embodiment, in imaging, CCD camera assembly is detected using the gyroscope 120 of electronic device 1000100 fine jitters generated, the shake data that gyroscope 120 will test, such as caused by CCD camera assembly 100 is shakenTilt angle, the offset generated by inclination are sent to the processing chip of electronic device 1000, and processing chip is for example, described belowDriving chip.Handle chip according to the feedback data of the gyroscope 120 received control imaging modules in component relative toThe component that CCD camera assembly 100 generates makes a relative move to realize stabilization.
It is appreciated that the gyroscope 120 of electronic device 1000 is arranged at the other positions other than CCD camera assembly 100,To save the space of setting independent gyroscope and driving chip in CCD camera assembly 100.In this way, CCD camera assembly 100Size is close with common camera component, and realizes optical anti-vibration using the gyroscope of electronic device 1,000 120, anti-retainingThe size of CCD camera assembly 100 is effectively reduced while trembling function.
Specifically, Fig. 1 and Fig. 2 is please referred to, ontology 110 further includes top end face 1002 and is disposed opposite to each other with top end face 1002Bottom face 1003.In general, top end face 1002 and bottom face 1003 can extend along the width direction of ontology 110.Namely top end face1002 and bottom face 1003 be electronic device 1000 short side.Bottom face 1003 be used for arrange electronic device 1000 connector,Microphone, loudspeaker etc..
Holding tank 1004 is offered on the top of ontology 110, holding tank 1004 is from the top of ontology 110 into ontology 110Portion's recess.Holding tank 1004 can run through the side of ontology 110.Sliding block 200 slides in holding tank 1004 with ontology 110Connection.In other words, sliding block 200 is slidably connected ontology 110, to stretch out or retract holding tank 1004.
Sliding block 200 includes top surface 2003, and when sliding block 200 is located at first position, top surface and top end face 1002 are bigIt causes concordant.Sliding block 200 can be connect with screw body, screw body sliding block 200 can be driven in first position andIt is slided between the second position.
It is appreciated that CCD camera assembly 100 exposes outside ontology 110 when sliding block 200 stretches out holding tank 1004, thisWhen, CCD camera assembly 100 can be with normal photographing.
Incorporated by reference to Fig. 3, CCD camera assembly 100 includes the first imaging modules 20, the second imaging modules 30, third imaging modules40.First imaging modules 20 include bracket 50.
First imaging modules 20, the second imaging modules 30 and third imaging modules 40 are arranged in bracket 50 and and bracket50 are fixedly connected.Bracket 50 can reduce what the first imaging modules 20, the second imaging modules 30 and third imaging modules 40 were subject toImpact improves the first imaging modules 20,40 service life of the second imaging modules 30 and third imaging modules.
In present embodiment, bracket 50 is in frame-type, and bracket 50 is around the first imaging modules 20, the second imaging modules 30 and theThree imaging modules 40.
In present embodiment, the field angle FOV3 of third imaging modules 40 is greater than the field angle FOV1 of the first imaging modules 20And less than the field angle FOV2 of the second imaging modules 30, in other words, FOV1 < FOV3 < FOV2.In this way, different field anglesThree imaging modules make CCD camera assembly 100 can satisfy the shooting demand under different scenes.
In one example, the field angle FOV1 of the first imaging modules 20 is 10-30 degree, the visual field of the second imaging modules 30Angle FOV2 is 110-130 degree, and the field angle FOV3 of third imaging modules 40 is 80-110 degree.
For example, 20 field angle FOV1 of the first imaging modules be 10 degree, 12 degree, 15 degree, 20 degree, 26 degree or 30 degree angularly.Second imaging modules, 30 field angle FOV2 be 110 degree, 112 degree, 118 degree, 120 degree, 125 degree or 130 degree angularly.Third imaging40 field angle FOV3 of mould group be 80 degree, 85 degree, 90 degree, 100 degree, 105 degree or 110 degree angularly.
Since the field angle FOV1 of the first imaging modules 20 is smaller, it will be understood that the focal length of the first imaging modules 20 is larger,Therefore, the first imaging modules 20 can be used for shooting shooting distant view, to obtain distant view clearly image.Second imaging modules 30Field angle FOV2 it is larger, it will be understood that the focal length of the second imaging modules 30 is shorter, and therefore, the second imaging modules 30 can be usedIn shooting close shot, to obtain the close up fragmentary image of object.Third imaging modules 40 can be used for normal photographing object.
In this way, passing through the combination of the first imaging modules 20, the second imaging modules 30 and third imaging modules 40, can obtainThe image effects such as background blurring, picture part sharpening.
40 laid out in parallel of first imaging modules 20, the second imaging modules 30 and third imaging modules.In present embodiment, theOne imaging modules 20, the second imaging modules 30 and third imaging modules 40 are arranged in "-" type.Further, the second imaging modules30 between the first imaging modules 20 and third imaging modules 40.
Due to the field angle factor of the first imaging modules 20 and third imaging modules 40, in order to enable the first imaging modules 20The preferable image of quality is obtained with third imaging modules 40, the first imaging modules 20 and third imaging modules 40 can be configured with lightLearn anti-shake apparatus, and optical anti-vibration device is typically arranged with more magnetic element, therefore, the first imaging modules 20 and third atAs mould group 40 can produce magnetic field.
In present embodiment, by the second imaging modules 30 between the first imaging modules 20 and third imaging modules 40,So that the first imaging modules 20 and third imaging modules 40 may be located remotely from, the magnetic field for preventing the first imaging modules 20 from being formed and thirdThe magnetic field that imaging modules 40 are formed interferes with each other and influences the normal use of the first imaging modules 20 and third imaging modules 40.
In other embodiments, the first imaging modules 20, the second imaging modules 30 and third imaging modules 40 can arrangeColumn l-shaped.
First imaging modules 20, the second imaging modules 30 and third imaging modules 40 can be spaced setting, and adjacent twoImaging modules can also be abutted against each other together.
In the first imaging modules 20, the second imaging modules 30 and third imaging modules 30, any one imaging modules canThink black and white camera, RGB camera or infrared camera.
The processing chip of electronic device 1000 is used for according to the feedback data of the gyroscope 120 control first imagingThe work of mould group 20 is to realize that optical anti-vibration is shot.
Please refer to Fig. 4-7, in present embodiment, the first imaging modules 20 include shell 21, reflecting element 22, mounting base23, the first Lens assembly 24, motor element 25, the first imaging sensor 26 and driving mechanism 27.
Reflecting element 22, mounting base 23, the first Lens assembly 24, motor element 25 are arranged in shell 21.Reflective memberPart 22 is arranged in mounting base 23, and the first Lens assembly 24 is fixed on motor element 25.Motor element 25 is arranged in the first figureAs 26 side of sensor.Further, motor element 25 is located between reflecting element 22 and the first imaging sensor 26.
Driving mechanism 27 connects motor element 25 and shell 21.After incident light enters shell 21, by 22 turns of reflecting elementTo then through the first Lens assembly 24 the first imaging sensor 26 of arrival, so that the first imaging sensor 26 obtains outsideBoundary's image.Driving mechanism 27 is for driving motor element 25 to move along the optical axis of the first Lens assembly 24.
Shell 21 is generally square shaped, and shell 21 has light inlet 211, and incident light enters the first imaging from light inlet 211In mould group 20.That is, after reflecting element 22 is used to turn to from the incident incident light of light inlet 211 and through the first lens setThe first imaging sensor 26 is reached after part 24 so that the first imaging sensor 26 senses the incident light outside the first imaging modules 20.
It will therefore be appreciated that the first imaging modules 20 are periscope type lens mould group, compared to vertical lens module, periscopicThe height of lens module is smaller, so as to reduce the integral thickness of electronic device 1000.Vertical lens module refers to camera lensThe optical axis of mould group is straight line, and in other words, incident light is conducted along the direction of a straight optical axis to the photoreceptor of lens moduleOn part.
It is appreciated that light inlet 211 by through-hole 11 expose so that ambient after through-hole 11 from light inlet 211 intoEnter in the first imaging modules 20.
Specifically, Fig. 6 please be join, shell 21 includes roof 213 and opposite two side walls 214.Two side walls 214 respectively fromTwo sides 2131 of roof 213 extend to form.
It is, therefore, to be understood that roof 213 includes two opposite sides 2131, the quantity of side wall 214 is two, each214 self-corresponding sides 2131 of side wall extend, and in other words, side wall 214 is separately connected the opposite two sides of roof 213.Entering lightMouth 211 is formed in roof 213.
Reflecting element 22 is prism or plane mirror.In one example, when reflecting element 22 is prism, prism can beTriangular prism, the section of prism are right angled triangle, wherein light is incident from one of right-angle side in right angled triangle,To which another right-angle side is emitted after the reflection of bevel edge.It is appreciated that certainly, incident light can go out after refraction by prismIt penetrates, and without reflection.Prism can be made of relatively good materials of translucency such as glass, plastics.In an embodimentIn, it can be in reflectorized materials such as one of surface silver coatings of prism to reflect incident light.
It is appreciated that the reflection of generation incident light is realized that incident light is turned to by plane mirror when reflecting element 22 is plane mirror.
More, Fig. 7 and Figure 10 are please referred to, reflecting element 22 has incidence surface 222, shady face 224,226 and of reflective surfaceLight-emitting surface 228.Incidence surface 222 close to and towards light inlet 211.Shady face 224 far from light inlet 211 and with 222 phase of incidence surfaceBack.Reflective surface 226 connects incidence surface 222 and shady face 224.Light-emitting surface 228 connects incidence surface 222 and shady face 224.Reflective surface226 are obliquely installed relative to incidence surface 222.Light-emitting surface 228 is disposed opposite to each other with reflective surface 226.
Specifically, light passes through light inlet 211 and enters reflecting element 22 by incidence surface 222 in the conversion process of lightIn, then via the reflection of reflective surface 226, reflecting element 22 finally is reflected from light-emitting surface 228, the process of light conversion is completed, andShady face 224 and mounting base 23 are fixedly installed, so that reflecting element 22 is keeping stablizing.
As shown in figure 11, in the related art, due to the needs of reflection incident ray, the reflective surface of reflecting element 22a226a is tilted relative to horizontal direction, and reflecting element 22a is unsymmetric structure, thus reflective member on the reflection direction of lightThe lower section of part 22a is smaller with respect to the practical optical area above reflecting element 22a, it can be understood as, the part far from light inletReflective surface 226a is less or can not reflection light.
Therefore, Figure 12 please be join, the reflecting element 22 of the application embodiment is relative to reflecting element 22a in the related technologyThe corner angle far from light inlet have been cut off, have not only been also reduced anti-without the effect of the reflection light of influence reflecting element 22 in this wayThe integral thickness of optical element 22.
Referring to Fig. 7, in some embodiments, reflective surface 226 is tilted relative to the angle [alpha] of incidence surface 222 in 45 degree.
In this way, incident light is made preferably to reflect and convert, has preferable light conversion effect.
Reflecting element 22 can be made of relatively good materials of translucency such as glass, plastics.In one embodiment,It can be in reflectorized materials such as one of surface silver coatings of reflecting element 22 to reflect incident light.
In some embodiments, incidence surface 222 is arranged in parallel with shady face 224.
In this way, 22 held stationary of reflecting element, incidence surface 222 can be made when shady face 224 and mounting base 23 are fixedly installedAlso it is rendered as plane, incident light imitates the conversion of light in the optical path of the conversion process also formation rule of reflecting element 22Rate is preferable.Specifically, the section of reflecting element 22 is substantially trapezoidal along the light direction that enters of light inlet 211, and in other words, reflective memberThe substantially trapezoidal body of part 22.
In some embodiments, incidence surface 222 and shady face 224 are each perpendicular to light-emitting surface 228.
In this way, more regular reflecting element 22 can be formed, keep the optical path of incident ray more straight, improves turning for lightChange efficiency.
In some embodiments, the distance range of incidence surface 222 and shady face 224 is 4.8-5.0mm.
Specifically, the distance between incidence surface 222 and shady face 224 can be 4.85mm, 4.9mm, 4.95mm etc..OrIt says, the distance range of incidence surface 222 and shady face 224 is it is to be understood that the height of reflecting element 22 is 4.8-5.0mm.More thanIt is moderate that the incidence surface 222 of distance range and shady face 224 are formed by 22 volume of reflecting element, can preferably suit into the first one-tenthThe first imaging modules 20, CCD camera assembly 100 and electronic device 1000 as in mould group 20, forming more compact property and miniaturization,Meet the more demands of consumer.
In some embodiments, incidence surface 222, shady face 224, reflective surface 226 and the equal cure process shape of light-emitting surface 228At there is hardened layer.
When reflecting element 22 is made of materials such as glass, the material of reflecting element 22 itself is more crisp, in order to improve reflective memberThe intensity of part 22 can be done at hardening in incidence surface 222, shady face 224, reflective surface 226 and the light-emitting surface 228 to reflecting element 22Reason, more, can do cure process to all surface of reflecting element, to further increase the intensity of reflecting element.At hardeningReason such as penetrate into lithium ion, do not influence reflecting element 22 convert light under the premise of to above each film on surface.
In one example, the angle turned to from the incident incident light of light inlet 211 is 90 degree by reflecting element 22.ExampleSuch as, incidence angle of the incident light on the surface of emission of reflecting element 22 is 45 degree, and angle of reflection is also 45 degree.Certainly, reflecting element 22By incident light turn to angle can also be other angles, for example, 80 degree, 100 degree etc., as long as being reached after incident light capable of being turned toFirst imaging sensor 26.
In present embodiment, the quantity of reflecting element 22 is one, at this point, incident light reaches first after once turning toImaging sensor 26.In other embodiments, the quantity of reflecting element 22 is multiple, at this point, incident light is by least twiceThe first imaging sensor 26 is reached after steering.
Mounting base 23 is for installing reflecting element 22, and in other words, mounting base 23 is the carrier of reflecting element 22, reflecting element22 are fixed in mounting base 23.Make the position of reflecting element 22 in this way it was determined that being conducive to the reflection of reflecting element 22 or foldingPenetrate incident light.Reflecting element 22 can use viscose glue to be adhesively fixed in mounting base 23 to realize and be fixedly connected with mounting base 23.
It please join referring again to Fig. 7, in one example, mounting base 23 is movable to be arranged in shell 21,23 energy of mounting baseIt is enough to rotate relative to shell 21 to adjust the direction that reflecting element 22 turns to incident light.
Mounting base 23 can drive reflecting element 22 to rotate together towards the opposite direction of the shake of the first imaging modules 20, fromAnd the incident deviation of the incident light of light inlet 211 is compensated, realize the effect of optical anti-vibration.
First Lens assembly 24 is contained in motor element 25, and further, the first Lens assembly 24 is arranged in reflective memberBetween part 22 and the first imaging sensor 26.First Lens assembly 24 is used for image incoming light in the first imaging sensor 26On.The first imaging sensor 26 is allowed to obtain the preferable image of quality in this way.
First Lens assembly 24 can be imaged when moving integrally along its optical axis on the first imaging sensor 26, thus realExisting first imaging modules 20 focusing.First Lens assembly 24 includes multiple eyeglasses 241, when at least one eyeglass 241 is mobile, theThe whole focal length of one Lens assembly 24 changes, so that the function of 20 zoom of the first imaging modules is realized, more, by driving mechanism27 driving motor elements 25 move in shell 21 to reach zoom purpose.
In the example in figure 7, in some embodiments, motor element 25 is cylindrical in shape, more in the first Lens assembly 24A eyeglass 241 is fixed in motor element 25 along the axially spaced-apart of motor element 25.As Fig. 9 example in, motor element 25 wrapTwo intermediate plates 252 are included, eyeglass 241 is folded between two intermediate plates 252 by two intermediate plates 252.
It is appreciated that since motor element 25 is for being fixedly installed multiple eyeglasses 241, the length ruler of required motor element 25Very little larger, motor element 25 can have the shape of more certain cavity for cylindrical shape, square tube shape etc., and such motor element 25 is in cylinderMultiple eyeglasses 241 can be preferably arranged in dress, and can preferably protect eyeglass 241 in cavity, making eyeglass 241 be not susceptible to shakeIt is dynamic.
In addition, in the example of figure 9, multiple eyeglasses 241 are held between two intermediate plates 252 by motor element 25, both hadStandby certain stability, can also reduce the weight of motor element 25, can reduce driving mechanism 27 and drive needed for motor element 25Power, and the design difficulty of motor element 25 is relatively low, and eyeglass 241 is also easier to be set on motor element 25.
Certainly, motor element 25 is not limited to tubular and two intermediate plates 252 mentioned above, in other implementations,Motor element 25 such as may include that three pieces, four more intermediate plates 252 form more firm structure or a piece of intermediate plate 252 in this wayMore simple structure；Or has cavity for cuboid, round etc. to accommodate the various regular or irregular of eyeglass 241Shape.Under the premise of guaranteeing 10 normal imaging of imaging modules and operation, specific choice.
First imaging sensor 26 can use complementary metal oxide semiconductor (CMOS, Complementary MetalOxide Semiconductor) photosensitive element or charge coupled cell (CCD, Charge-coupled Device) photosensitive memberPart.
In some embodiments, driving mechanism 27 is electromagnetic drive mechanism, drive mechanism or memorial alloy drivingMechanism.
It specifically, include magnetic field and conductor in electromagnetic drive mechanism, if magnetic field in the conductor can relative to conductor motionInduced current is generated, induced current makes effect of the conductor by Ampere force, and Ampere force makes conductor motion, and conductor herein isThe part for driving motor element 25 mobile in electromagnetic drive mechanism；Drive mechanism, the inverse piezoelectricity based on piezoceramic materialEffect: if applying voltage to piezoelectric material, mechanical stress is generated, i.e., is changed between electric energy and mechanical energy, control is passed throughMake its mechanically deform generate rotation or linear motion, have the advantages that structure simply, low speed.
Characteristic of the driving of memorial alloy driving mechanism based on marmem: marmem is a kind of specialAlloy, once it is made to have remembered any shape, even if being deformed, but when being heated to a certain proper temperature, it can restoreShape before to deformation achievees the purpose that driving with this, has the characteristics that displacement is rapid, direction is free.
Referring to Fig. 7, further, the first imaging modules 20 further include driving device 28, and driving device 28 is used forMounting base 23 of the driving with reflecting element 22 is rotated around pivot center 29.Driving device 28 is for drive installation seat 23 along rotationThe axial movement of axis 29.Pivot center 29 perpendicular to the optical axis of light inlet 211 and the photosensitive direction of the first imaging sensor 26,So that the first imaging modules 20 realize the optical anti-vibration in the optical axis of light inlet 211 and the axial direction of pivot center 29.
In this way, 28 drive installation seat 23 of driving device is two sides since the volume of reflecting element 22 is smaller compared with lens barrelIt moves upwards, the first imaging modules 20 not only may be implemented in the optical anti-vibration effect of both direction, it is also possible that the first one-tenthAs the small volume of mould group 20.
It please join Fig. 6-Fig. 7, for the convenience of description, the width direction of the first imaging modules 20 is defined as X to short transverseIt is defined as Y-direction, length direction is defined as Z-direction.As a result, the optical axis of light inlet 211 be Y-direction, the first imaging sensor 26 it is photosensitiveDirection is Z-direction, the axial direction of pivot center 29 be X to.
The rotation of 28 drive installation seat 23 of driving device so that reflecting element 22 around X to rotation so that the first imaging mouldGroup 20 realizes the effect of Y-direction optical anti-vibration.In addition, axial movement of 28 drive installation seat 23 of driving device along pivot center 29,So that the first imaging modules 20 realize effect of the X to optical anti-vibration.In addition, the first Lens assembly 24 can along Z-direction withRealize that the first Lens assembly 24 is focused on the first imaging sensor 26.
Specifically, around X to when rotation, the light that reflecting element 22 reflects moves reflecting element 22 in Y-direction, so thatFirst imaging sensor 26 forms different images in Y-direction to realize the anti-shake effect of Y-direction.Reflecting element 22 is along X to shiftingWhen dynamic, the light that reflecting element 22 reflects is moved up in X, so that the first imaging sensor 26 is upwardly formed difference in XImage with realize X to anti-shake effect.
In some embodiments, driving device 28 is formed with arc-shaped guide rail 281, and driving device 28 is used for drive installation seat23 along arc-shaped guide rail 281 around arc-shaped guide rail 281 central axis 282 rotation and along central axis 282 axial movement, inMandrel line 2282 is overlapped with pivot center 29.
It is appreciated that driving device 28 is used for drive installation seat 23 along arc-shaped guide rail 281 around the center of arc-shaped guide rail 281The rotation of axis 282 and the axial movement along central axis 282.
In this way, since driving device 28 drives the mounting base 23 with reflecting element 22 by the way of arc-shaped guide rail 281It rotates together, so that friction is small between driving device 28 and mounting base 23, is conducive to 23 stability of rotation of mounting base, improveThe optical anti-vibration effects of first imaging modules 20.
Specifically, Figure 13 please be join, in the related art, mounting base (not shown) and shaft 23a are rotatablely connected, mounting base aroundShaft 23a rotation to drive reflecting element 22a to rotate together.It is assumed that frictional force is f1, shaft 23a radius is R1, and thrust isF1, radius of gyration R1.So friction-torque and thrust torque ratio K1 are K1=f1R1/F1A1.Due to reflecting element 22aFine rotation is only needed, therefore F1 cannot be excessive；And imaging modules itself need light and short to cause reflecting element 22a size cannotToo big, the space that becomes larger of A is also limited, can not further eliminate so as to cause the influence of frictional force.
It please join Figure 14, and in the application, mounting base 23 is rotated along arc-shaped guide rail 281, and the radius of arc-shaped guide rail 281 isR2.At this point, the ratio K2 of friction-torque and rotational torque is K2=f2R2/F2A, do not significantlyd change in f2, R2, F2In the case where, due to being rotated using the swing mode of rail mounted, corresponding thrust torque becomes R2, and R2 can not be by anti-The limitation of 22 size of optical element, or even accomplish the several times of R1 or more.Therefore in this case, frictional force rotates reflecting element 22Influence the size of K2 (reduce) can be greatly reduced, so as to improve the rotation precision of reflecting element 22, so that the first imagingThe optical anti-vibration effect of mould group 20 is preferable.
It please join Fig. 7, in some embodiments, mounting base 23 includes arcwall face 231, arcwall face 231 and arc-shaped guide rail 281It is arranged concentrically and cooperates with arc-shaped guide rail 281.In other words, the center of arcwall face 231 is overlapped with the center of arc-shaped guide rail 281.ThisIt is more compact that sample cooperates mounting base 23 with driving device 28.
In some embodiments, central axis 282 is located at outside the first imaging modules 20.In this way, the half of arc-shaped guide rail 281Diameter R2 is larger, can reduce the adverse effect that frictional force rotates mounting base 23 in this way.
In some embodiments, driving device 28 is located at the bottom of shell 21.In other words, driving device 28 and shell 21It is structure as a whole.In this way, the structure of the first imaging modules 20 is more compact.
In some embodiments, the drive installation seat 23 by way of electromagnetism of driving device 28 rotates.In an exampleIn, driving device 28 is provided with coil, is fixed with electromagnetic plate in mounting base 23, and after coil energization, coil can produce magnetic fieldTo drive electromagnetic plate to move, so that mounting base 23 and reflecting element be driven to rotate together.
Certainly, in other embodiments, driving device 28 can by way of Piezoelectric Driving or memorial alloy drivingMode drive installation seat 23 move.The mode of Piezoelectric Driving and memory alloy driven mode please join foregoing description, herein notIt repeats again.
Referring to Fig. 4-Fig. 6 and Fig. 8, the first imaging modules 20 further include driving chip 202 and mould-group circuit-board210, driving chip 202 is arranged in the lateral surface of driving mechanism 27 and is electrically connected driving mechanism 27, and mould-group circuit-board 210 is electricallyConnect the first imaging sensor 26, mould-group circuit-board 210 and driving chip 202 two sides that be located at shell 21 opposite.
In this way, the side of driving mechanism 27, and mould-group circuit-board 210 and driving chip 202 is arranged in driving chip 202It is located at the opposite two sides of shell 21, so that the structure of the first imaging modules 20 is more compact, advantageously reduces firstThe volume of imaging modules 20.
Specifically, driving chip 202 drives motor element 25 along the first Lens assembly 24 for controlling driving mechanism 27Optical axis is mobile, the imaging so that the first Lens assembly 24 is focused on the first imaging sensor 26.Driving chip 202 is used for according to topMounting base 23 of the feedback data control driving of driving device 28 with reflecting element 22 of spiral shell instrument 120 is rotated around pivot center 29.Driving chip 202 is also used to control 28 drive installation seat 23 of driving device along pivot center according to the feedback data of gyroscope 12029 axial movement.
Driving chip 202 is also used to control 28 drive installation seat of driving device, 23 edge according to the feedback data of gyroscope 120Arc-shaped guide rail 281 around arc-shaped guide rail 281 central axis 282 rotation and along central axis 282 axial movement.
Mould-group circuit-board 210 with outer member for connecting, for example, mould-group circuit-board 210 connects electronic device 1000The battery of mainboard, electronic device 1000 provides electric energy to the first imaging modules 20 by mainboard.First imaging sensor 26 can be withSensed data is reached to the processor of electronic device 1000 by mould-group circuit-board 210, so that after processor parsing sensed dataObtain external image data.
As Fig. 4 and Fig. 5 embodiment in, driving chip 202 is located at the front side of shell 21, and mould-group circuit-board 210 is located atThe rear side of shell 21.In the embodiment of fig. 6, mould-group circuit-board 210 is located at the front side of shell 21, and driving chip 202 is located atThe rear side of shell 21.
Fig. 4 and Fig. 7 is please referred to, in some embodiments, shell 21 is formed with avoid holes 215, and driving chip 202 is at leastPart is located in avoid holes 215, to be exposed to shell 21.In this way, there are Chong Die portions between driving chip 202 and shell 21Point, so that the structure between driving chip 202 and shell 21 is more compact, can further decrease the first imaging modules 20Volume.
It is appreciated that when the thickness between the lateral surface and shell 21 of driving mechanism 27 with gap or driving chip 202When degree is greater than the thickness of shell 21, on the thickness direction of driving chip 202,202 part of driving chip is located at avoid holes 215In.When the thickness that the lateral surface of driving mechanism 27 contacts with shell 21 fitting and driving chip 202 is less than the thickness of shell 21,Driving chip 202 is entirely located in avoid holes 215.
Preferably, the shape of avoid holes 215, size respectively with the shape of driving chip 202, dimensional fits.For example, evacuationThe size in hole 215 is slightly larger than the size of driving chip 202, and the shape of avoid holes 215 is identical as the shape of driving chip 202.
In present embodiment, avoid holes 215 are formed in one of side wall 214 of shell 21,210 part of mould-group circuit-boardIt is sticked in another side wall 214 of shell 21.It is appreciated that avoid holes 215 run through the interior outside of side wall 214.
In one example, mould-group circuit-board 210 can be fixed on side wall 214 by modes such as viscose glue, welding.It needs, it is noted that a part of mould-group circuit-board 210 is fixedly connected with side wall 214, mould-group circuit-board 210 far from side wall 214 oneEnd with outer member for connecting.
Fig. 6 and Fig. 7 is please referred to, in some embodiments, the first imaging modules 20 further include chip circuit plate 201, corePiece circuit board 201 is fixed on the lateral surface of driving mechanism 27, and driving chip 202 is fixed on chip circuit plate 201 away from driving machineThe one side of the lateral surface of structure 27, driving chip 202 are electrically connected driving mechanism 27, chip circuit plate by chip circuit plate 201201 are located at the inside of side wall 214.
In this way, chip circuit plate 201 makes driving chip 202 be easy to be electrically connected with driving mechanism.Chip circuit plate 201In the inside of side wall 214, it will be understood that chip circuit plate 201 is located in shell 21.
In one embodiment, the first imaging modules 20 further include shielding case 204, and shielding case 204 is fixed on chip electricityRoad plate 201 and it is provide with driving chip 202.In this way, shielding case 204 can protect driving chip 202, prevent driving chip 202 byTo physical impact.In addition, shielding case 204 can also reduce the electromagnetic effect that driving chip 202 is subject to.
Shielding case 204 can be made of metal material.For example, the material of shielding case 204 is stainless steel.
In present embodiment, the first imaging modules 20 include sensor circuit board 203, and the first imaging sensor 26 is fixed onSensor circuit board 203, chip circuit plate 201 include mounting portion 2011 and interconnecting piece 2022, and mounting portion 2011 is fixed on drivingThe side of mechanism 27, driving chip 202 are fixed on mounting portion 2011, and interconnecting piece 2022 connects mounting portion 2011 and sensor circuitPlate 203.Chip circuit plate 201 is fixed on mounting portion 2011.Mould-group circuit-board 210 connects sensor circuit board 203.
In this way, driving chip 202 can be electrically connected by sensor circuit board 203 and the first imaging sensor 26.ToolBody, interconnecting piece 2022 can be fixedly connected with sensor circuit board 203 by welding.
In one example, when assembling the first imaging modules 20, driving chip 202 first can be fixed on chip circuitOn plate 201, then the chip circuit plate 201 with driving chip 202 is connected by welding with sensor circuit board 203It connects, the chip circuit plate 201 with driving chip 202 is finally fixed on to the lateral surface of driving mechanism 27.
Chip circuit plate 201 can be fixedly connected by the modes such as welding, being bonded with driving mechanism 27.
It should be pointed out that the lateral surface that chip circuit plate 201 is fixed on driving mechanism 27 can refer to chip circuit plate 201It is fixed with the outside face contact of driving mechanism 27, can also refer to that chip circuit plate 201 passes through other elements and driving mechanism 27Lateral surface is fixedly connected.
In one embodiment, mould-group circuit-board 210 is structure as a whole with sensor circuit board 203.For example, sensorCircuit board 203 is rigid circuit board, and mould-group circuit-board 210 is flexible circuit board, mould-group circuit-board 210 and sensor circuit board203 Rigid Flexs being connected to form one.
In present embodiment, mounting portion 2011 is rigid circuit board, and interconnecting piece 2022 is flexible circuit board, mounting portion 2011It is fitted in the lateral surface of driving mechanism 27.
In this way, mounting portion 2011 is that rigid circuit board makes mounting portion 2011 have preferable rigidity, it is unlikely to deform, favorablyIt is fixedly connected in mounting portion 2011 with the lateral surface of driving mechanism 27.Mounting portion 2011 can be fitted in drive by way of bondingThe lateral surface of motivation structure 27.In addition, interconnecting piece 2022 is that flexible circuit board is easily deformed chip circuit plate 201, so that corePiece circuit board 201 is easily mounted on the side of driving mechanism 27.
Certainly, in other embodiments, mounting portion 2011 or flexible circuit board.In present embodiment, preferablyGround, mounting portion 2011 be preferably rigid circuit board or be flexible circuit board in conjunction with stiffening plate plate.In this way, mounting portion2011 are easily installed driving chip 202 and shielding case 204.
Fig. 3 and Figure 15 is please referred to, in some embodiments, shielding case 204 protrudes from shell 21, and bracket 50 surrounds shell21.Bracket 50 is formed with the holding tank 51 of evacuation shielding case 204, and shielding case 204 is located in holding tank 51.
In this way, holding tank 51 protrudes into shielding case 204 in bracket 50, the knot of the first imaging modules 20 can be made in this wayStructure is more compact, is conducive to the volume for further decreasing the first imaging modules 20.
Specifically, holding tank 51 can be square, the shapes such as circle.Preferably, holding tank 51 is in bracket 50 towards shell21 side is through bracket 50 backwards to the side of shell 21.
Please refer to Figure 16, in present embodiment, the second imaging modules 30 are vertical lens module, certainly, in other implementationsIn mode, the second imaging modules 30 can also be with periscope type lens mould group.
Second imaging modules 30 include the second Lens assembly 31 and the second imaging sensor 32, and the second Lens assembly 31 is used forLight is imaged on the second imaging sensor 32, the optical axis of the incident light axis of the second imaging modules 30 and the second Lens assembly 31It is overlapped.
In present embodiment, the second imaging modules 30 can be tight shot mould group, therefore, the mirror of the second Lens assembly 31Piece 241 is less, so that 30 height of the second imaging modules is lower, is conducive to the thickness for reducing electronic device 1000.
The type of second imaging sensor 32 can be as the type of the first imaging sensor 26, and details are not described herein.
The structure of third imaging modules 40 is similar with the structure of the second imaging modules 30, for example, third imaging modules 40For vertical lens module.Therefore, the feature of third imaging modules 40 please refers to the feature of the second imaging modules 40, herein not superfluousIt states.
To sum up, the first imaging modules 20 include shell 21, reflecting element 22, the first Lens assembly 24, the first image sensingDevice 26 and driving mechanism 27.Reflecting element 22, the first Lens assembly 24, motor element 25, the first imaging sensor 26 and drivingMechanism 27 is arranged in shell 21.First Lens assembly 24 is located between reflecting element 22 and the first imaging sensor 26.
Shell 21 has light inlet 211.After reflecting element 22 is used to turn to from the incident incident light of light inlet 211 and pass throughThe first imaging sensor 26 is reached after first Lens assembly 24 so that the first imaging sensor 26 senses outside the first imaging modules 20The incident light in portion.
Driving mechanism 27 is for driving Lens assembly 24 to move along the optical axis of Lens assembly 24 so that Lens assembly 24 is theIt focuses and is imaged on one imaging sensor 26；
First imaging modules 20 further include driving chip 202 and mould-group circuit-board 210, and the setting of driving chip 202 is drivingThe lateral surface and electric connection driving mechanism 27, mould-group circuit-board 210 of mechanism 27 are electrically connected the first imaging sensor 26, mould groupCircuit board 210 and driving chip 202 two sides that be located at shell 21 opposite.
In the first imaging modules 20 of the application, the side of driving mechanism 27, and mould group electricity is arranged in driving chip 202Road plate 210 and driving chip 202 two sides that be located at shell 21 opposite, so that the structure of the first imaging modules 20 is moreIt is compact, advantageously reduce the volume of the first imaging modules 20.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementationWhat the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or exampleParticular features, structures, materials, or characteristics are contained at least one embodiment or example of the application.In this specificationIn, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of descriptionSign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While there has been shown and described that presently filed embodiment, it will be understood by those skilled in the art that:These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principle and objective of the application and becomeType, scope of the present application are defined by the claims and their equivalents.