CN109216247B - Wafer slicing system and slicing method - Google Patents
Wafer slicing system and slicing methodDownload PDFInfo
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- CN109216247B CN109216247BCN201810972358.9ACN201810972358ACN109216247BCN 109216247 BCN109216247 BCN 109216247BCN 201810972358 ACN201810972358 ACN 201810972358ACN 109216247 BCN109216247 BCN 109216247B
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- 238000000034methodMethods0.000titleclaimsabstractdescription28
- 235000012431wafersNutrition0.000claimsabstractdescription277
- 238000012546transferMethods0.000claimsabstractdescription11
- 238000002360preparation methodMethods0.000claimsdescription6
- 239000013078crystalSubstances0.000claims5
- 238000012360testing methodMethods0.000description6
- 238000010586diagramMethods0.000description4
- 238000006748scratchingMethods0.000description2
- 230000002393scratching effectEffects0.000description2
- 230000002159abnormal effectEffects0.000description1
- 238000009825accumulationMethods0.000description1
- 230000004888barrier functionEffects0.000description1
- 238000013461designMethods0.000description1
- 238000011161developmentMethods0.000description1
- 238000004519manufacturing processMethods0.000description1
- 239000000463materialSubstances0.000description1
- 238000011160researchMethods0.000description1
- 239000004065semiconductorSubstances0.000description1
- 238000001612separation testMethods0.000description1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Technical Field
The invention relates to the field of wafer testing, in particular to a wafer slicing system and a slicing method thereof.
Background
At present, in the back end of the semiconductor industry, wafers are required to be cut and packaged, and a wafer boat is used as an industry standard, and has been widely used for many years. The standard wafer boat mainly comprises a main body with clamping grooves on two sides, a handle part and a barrier strip, wherein each side of the standard wafer boat comprises 25 clamping grooves, and each clamping groove is correspondingly provided with a wafer.
In the wafer test process, due to abnormal test or special operation requirements, the mechanical arms of part of equipment are too thick, the slot gaps of the wafer boat do not support the mechanical arm to take and place the wafers, the wafers in the same wafer boat need to be separated into two wafer boats or a plurality of wafer boats, the wafer gaps are increased to meet the test, and the process is also called the wafer separation test.
The current technology of wafer slicing is as follows: (1) the vacuum suction pen is used for sucking the back of the wafer for slicing, the technology can avoid artificial pollution, but the picking and placing process of the vacuum suction pen is artificially uncontrollable, the risk of wafer falling and wafer breaking is high, the stability of the manual operation suction pen is poor, the risk of wafer scratching is high, the picking and placing of the wafer are required to be carried out in sequence, the wafer cannot be picked and placed from the middle, the wafer position needs to be transferred for multiple times, the operation is complicated, and the quality abnormity such as scratching, wafer breaking and material mixing is easily caused. (2) The mechanical arm meeting the thickness is used for manufacturing the slicing device, although the stability is strong in the slicing process, the product is not easy to damage, the precision requirement on the mechanical arm is high, software needs to be developed, and the equipment cost is high.
Therefore, the inventors of the present application have conducted extensive empirical accumulation and research to design a wafer slicing system to overcome the above-mentioned drawbacks.
Disclosure of Invention
One objective of the present invention is to provide a wafer slicing system with simple operation, low cost and high stability.
The second objective of the present invention is to provide a wafer slicing method. The method has the advantages of simple operation, high slicing efficiency, low cost and strong stability of the slicing process, and can particularly split and transfer the wafer.
In order to achieve the above object, the present invention provides a wafer slicing system for slicing wafers in a wafer boat to be sliced, including:
the auxiliary wafer boat comprises a wafer boat body and clamping strips, wherein clamping grooves are formed in two sides of the wafer boat body, the clamping strips are correspondingly arranged in the clamping grooves, and the clamping strips can be operated to clamp or release wafers in the clamping grooves;
auxiliary platform, including burst platform and arm device, supplementary boat is fixed in burst platform, arm device install in burst platform's one end, treat to divide the boat install in arm device with between the supplementary boat on the burst platform, just supplementary boat with treat to divide the relative setting of closing together of boat opening, arm device in can carry out flexible reciprocating motion on the burst platform.
Compared with the prior art, the wafer slicing system is provided with the clamping strips correspondingly arranged on the clamping grooves on the two sides of the wafer boat body, namely, each clamping groove is provided with the corresponding clamping strip, the clamping strips can be operated to clamp or release wafers, and the clamping or release can be carried out on the appointed wafers in the wafer slicing process, so that the appointed wafers are transferred. Meanwhile, the arm device is utilized to push the wafers in the to-be-divided boat into the auxiliary boat, the to-be-divided boat is an empty boat, then the wafers are abutted to the arm device and arrive in the to-be-divided boat along with the retreat of the arm device, and the whole process is strong in stability and high in efficiency.
Preferably, the wafer boat body and the wafer boat to be divided belong to a standard wafer boat, so the application range is not limited.
Preferably, the auxiliary wafer boat further comprises a plurality of control members, and each control member is connected to the plurality of card strips to control the engagement or disengagement of the plurality of card strips with respect to the corresponding wafer.
Preferably, the arm device comprises a push plate, a cantilever part connected to the push plate, and a telescopic device connected to the cantilever part, and the telescopic device drives the cantilever part to perform telescopic reciprocating motion along the slicing platform.
Preferably, the telescopic device includes a driving portion and a telescopic portion connected to the driving portion, the telescopic portion is connected to the cantilever member, the telescopic portion is a gear plate or a slide rail, and the driving portion is a corresponding gear driving device or a corresponding slide rail driving device.
Preferably, the wafer separating platform is provided with a positioning column and a baffle, and the positioning column and the baffle are used for fixing the auxiliary wafer boat and the wafer boat to be separated.
Correspondingly, the invention also provides a method for slicing the wafer by adopting the wafer slicing system, which comprises the following steps:
(1) preparing an auxiliary wafer boat: providing a standard wafer boat, and correspondingly arranging a clamping strip in each clamping groove of the standard wafer boat to obtain an auxiliary wafer boat, wherein the clamping strips can be operated to clamp or release wafers in the corresponding clamping grooves;
(2) preparing an auxiliary platform: providing a slicing platform, arranging an arm device at one end of the slicing platform, wherein the arm device can perform telescopic reciprocating movement on the slicing platform;
(3) preparing a wafer slicing system: fixing the auxiliary wafer boat on the wafer separating platform, and mounting the wafer boat to be separated on the wafer separating platform between the arm device and the auxiliary wafer boat, wherein the auxiliary wafer boat and the opening of the wafer boat to be separated are oppositely arranged in a closed manner;
(4) controlling the clamping strip to be in a lock releasing state, moving the arm device towards the auxiliary wafer boat direction, pushing the wafers in the wafer boat to be separated to the auxiliary wafer boat, and controlling the clamping strip to be in a clamping state;
(5) the wafer separating platform is inclined by a certain angle, the auxiliary wafer boat is positioned above the to-be-separated wafer boat, wafers to be separated are controlled to be in a lock releasing state corresponding to the clamping strips in the clamping grooves, the arm device contracts towards the to-be-separated wafer boat, and the wafers abut against the arm device and reach the to-be-separated wafer boat along with the arm device, so that the wafers are transferred.
Compared with the prior art, the wafer separating method can realize the transfer of the designated wafers, meanwhile, the auxiliary wafer boat and the opening of the wafer boat to be separated are relatively folded, the artificial influence is avoided, the influence from the outside is avoided, and the stability is strong. The whole slicing process is only carried out on the slicing platform, and the operation is simple.
Preferably, the wafer slicing method further includes the step (6): and (3) moving away the boat to be divided, installing an empty standard boat at the boat to be divided, moving the arm device to a corresponding position towards the direction of the auxiliary boat, controlling and appointing the card strip in the clamping groove to be in a lock release state, retracting the arm device towards the boat to be divided, abutting the arm device corresponding to the wafer in the clamping groove and reaching the boat to be divided along with the arm device, realizing the transfer of the wafer, and circularly performing the step (6) until the wafer is divided.
Preferably, in the step (5), the angle is less than or equal to 40 degrees.
Drawings
Fig. 1 is a schematic perspective view of a wafer slicing system according to the present application.
FIG. 2 is a front view of the boat to be separated, showing the position of the slots.
FIG. 3 is a front view of the auxiliary boat of the present invention, showing the position relationship between the card slots and the card strips.
Fig. 4 is a schematic diagram of a wafer slicing system according to the present invention, in which the auxiliary boat and the boat to be sliced are hidden, showing the state that the wafer is pushed to the auxiliary boat.
Fig. 5 is a schematic view of the wafer slicing system shown in fig. 4 tilted at a certain angle.
FIG. 6 is a schematic structural diagram illustrating a state where wafers are sliced into a boat to be sliced.
Fig. 7 is a top view of the wafer slicing system according to the present invention, showing a structural diagram of a state in which a wafer boat to be sliced includes wafers.
Fig. 8 is a structural diagram showing the state of the wafer in the auxiliary wafer boat, showing the clamping strip in the clamping state.
FIG. 9 is a schematic view of the wafer in the auxiliary boat, showing the card strip in the unlocked state.
FIG. 10 is a schematic view of a robot apparatus in a wafer slicing system according to the present invention.
Description of the reference symbols:
100 wafer slicing system, 10 auxiliary wafer boat, 11 wafer boat body, 111 clamping groove, 13 clamping strips, 20 to-be-sliced wafer boat, 21 hollow part, 30 auxiliary platform, 31 slicing platform, 33 arm device, 331 push plate, 333 cantilever part, 335 telescoping device, 3351 driving part, 3353 telescoping part, 35 positioning column, 37 baffle plate and 40 wafer.
Detailed Description
The preferred embodiments of the present invention will now be described with reference to the accompanying drawings, which are given by way of illustration.
Referring to fig. 1, thewafer slicing system 100 of the present invention includes anauxiliary boat 10 and anauxiliary platform 30 for slicing thewafers 40 in theboat 20 to be sliced. Thewafer boat 20 to be diced is a standard wafer boat and containswafers 40, and is to be diced. Theauxiliary wafer boat 10 and theauxiliary platform 30 can be used to transfer thewafers 40 in thewafer boat 20 to be separated and separate the designatedwafers 40. It should be noted that the embodiments of the present application all use a standard boat for illustration, but do not exclude a boat configured for a specific model.
Specifically, referring to fig. 2-3, fig. 2 is a front view of aboat 20 to be divided (i.e., a standard boat), and fig. 3 is a front view of anauxiliary boat 10 according to the present invention. As shown in fig. 3, theauxiliary wafer boat 10 includes a wafer boat body 11 (i.e., a standard wafer boat) andcard strips 13, wherein thewafer boat body 11 is provided withcard slots 111 at two sides thereof, thecard strips 13 are correspondingly disposed in thecard slots 111, and thecard strips 13 are operable to engage or disengage thewafers 40. As shown in fig. 3, from top to bottom, the twoupper strips 13 are in the state of engaging thewafer 40, and thethird strip 13 is in the state of releasing thewafer 40. Similarly, as shown in fig. 8, theclamping bar 13 is in a clamping state, and thewafer 40 cannot slide out; as shown in fig. 9, thelocking bar 13 is in the unlocked state, and thewafer 40 can slide out normally. Thewafer boat body 11 and the wafer boat to be divided 20 both adopt standard wafer boats, so that the wafer boat to be divided 20 is conveniently butted with theauxiliary wafer boat 10, and the development of the industry is more met.
Referring to fig. 1 and fig. 4-5, theauxiliary platform 30 includes a wafer separatingplatform 31 and anarm device 33, theauxiliary wafer boat 10 is fixed on thewafer separating platform 31, thearm device 33 is installed at one end of the wafer separatingplatform 31, thewafer boat 20 to be separated can be installed on the wafer separatingplatform 31 between thearm device 33 and theauxiliary wafer boat 10, the openings of theauxiliary wafer boat 10 and thewafer boat 20 to be separated are relatively closed (as shown in fig. 7-9), and thearm device 33 can reciprocate from thewafer boat 20 to be separated toward theauxiliary wafer boat 10. That is, thearm device 33 may extend along thehollow portion 21 of theboat 20 to push thewafers 40 in theboat 20 to be separated into the auxiliary boat 10 (as shown in fig. 4 or fig. 8-9), or may be retracted from theauxiliary boat 10 toward theboat 20 to be separated to the initial position (as shown in fig. 6).
With continued reference to fig. 4, the wafer-separatingplatform 31 is provided withpositioning columns 35 and abaffle 37, and thepositioning columns 35 and thebaffle 37 are used for engaging theauxiliary wafer boat 10 and thewafer boat 20 to be separated, so that theauxiliary wafer boat 10 and thewafer boat 20 to be separated are stably mounted on the wafer-separatingplatform 31. The specific positions of thepositioning posts 35 and thebaffle 37 on the wafer-separatingplatform 31 are set according to the length and width of a standard wafer boat, and are not described in detail here.
With continued reference to fig. 4-10, thearm device 33 includes a pushingplate 331, acantilever member 333 connected to the pushingplate 331, and atelescopic device 335 connected to thecantilever member 333, wherein thetelescopic device 335 drives thecantilever member 333 to perform telescopic motion along theslicing platform 31. Further, as shown in fig. 10, thetelescopic device 335 includes adriving portion 3351 and atelescopic portion 3353 connected to thedriving portion 3351, thetelescopic portion 3353 is connected to thecantilever 333, thetelescopic portion 3353 is a gear plate or a slide rail, and thedriving portion 3351 is a corresponding gear driving device and a corresponding slide rail driving device. The gear drive and the sled drive may be conventional in the art and will not be described herein. In this embodiment, theretractable portion 3353 is a gear plate, and the drivingportion 3351 is a gear driving device, and thecantilever 333 is driven by the gear to perform a reciprocating motion along thewafer separating platform 31, i.e. thecantilever 333 can move from the to-be-separated boat 20 toward theauxiliary boat 10 and also can retract from theauxiliary boat 10 toward the to-be-separated boat 20. Of course, the slide rail and the slide rail driving device may be used to cooperate to achieve the telescopic motion, and no specific limitation is made herein.
Further, thewafer boat body 11 belongs to a standard wafer boat, and 25card slots 111 are formed in two sides of the wafer boat body, so that 25 card strips 13 are correspondingly arranged in thecard slots 111, that is, eachcard strip 13 needs to be arranged in eachcard slot 111. Theauxiliary boat 10 further includes a plurality of control members (not shown), each of which is connected to the plurality of card bars 13 to control the engagement and disengagement of the plurality of card bars 13 with respect to the correspondingwafer 40. For example, theauxiliary boat 10 includes two control elements, one of which is connected to thesingle card bar 13 to control the engagement or disengagement of thesingle card bar 13 with or from thewafer 40; the other control element is connected with the double-number card strip 13 and can control the clamping or unlocking of the double-number card strip 13 to thewafer 40. Because most tests are divided into single and double tests, the control element is used for controlling the slicing of the single-number wafer 40 and the double-number wafer 40, and the slicing efficiency is greatly improved. Certainly, a switch (not shown) may be further provided, and the switch may control thecard strip 13 at thecard slot 111 corresponding to thewafer 40 to be sliced according to actual needs, so as to meet various slicing requirements. But not limited thereto, the control member may be connected to thecorresponding card bar 13 as required to realize the transfer of the correspondingwafer 40.
The invention also provides a method for slicing thewafer 40 by adopting thewafer slicing system 100, which comprises the following steps:
(1) preparation of the auxiliary boat 10: providing a standard wafer boat, and correspondingly arranging acard strip 13 in eachcard slot 111 of the standard wafer boat to obtain anauxiliary wafer boat 10, wherein thecard strip 13 can be operated to clamp or release thewafer 40 in thecorresponding card slot 111;
(2) preparation of the auxiliary platform 30: providing aslicing platform 31, arranging anarm device 33 at one end of theslicing platform 31, wherein thearm device 33 can reciprocate along the direction of theslicing platform 31;
(3) preparation of the wafer dicing system 100: theauxiliary wafer boat 10 is fixed on thewafer separating platform 31, thewafer boat 20 to be separated is arranged on thewafer separating platform 31 between thearm device 33 and theauxiliary wafer boat 10, and the openings of theauxiliary wafer boat 10 and thewafer boat 20 to be separated are relatively folded;
(4) controlling thecard strip 13 to be in a lock release state, moving thearm device 33 toward theauxiliary wafer boat 10, pushing thewafer 40 in thewafer boat 20 to be separated to theauxiliary wafer boat 10, and controlling thecard strip 13 to be in a clamping state; since theboat 20 to be divided has thehollow portion 21, thearm device 33 can extend into thehollow portion 21 to push thewafers 40 in theboat 20 to be divided into theauxiliary boat 10.
(5) Thewafer dividing platform 31 is inclined by a certain angle, theauxiliary wafer boat 10 is positioned above thewafer boat 20 to be divided, the corresponding card strips 13 in the designatedcard slots 111 are controlled to be in a lock release state, thearm device 33 retreats towards the direction of thewafer boat 20 to be divided, and thewafers 40 in the correspondingcard slots 111 abut against thearm device 33 so as to reach thewafer boat 20 to be divided along with thearm device 33, so that the designatedwafers 40 are transferred. Wherein the inclination angle is less than or equal to 40 degrees, such as 10 degrees, 20 degrees, 30 degrees and 40 degrees. If the tilt angle exceeds 40 degrees, thewafer 40 is unstable during the wafer transfer.
Further, the method for dividing thewafer 40 further includes the step (6): and (3) moving away the to-be-divided boat 20, installing an empty standard boat at the to-be-divided boat 20, moving thearm device 33 to the position where thearm device 33 abuts against thewafer 40 in the direction of theauxiliary boat 10, controlling the card strips 13 correspondingly arranged in the specified clampinggrooves 111 to be in a unlocking state, retracting thearm device 33 in the direction of the to-be-divided boat 20, abutting thewafer 40 in the corresponding clampinggrooves 111 against thearm device 33 so as to reach the to-be-divided boat 20 along with thearm device 33, realizing the transfer of the specifiedwafer 40, and circularly performing the step (6) until thewafer 40 is divided.
The method of dicing thewafer 40 using thewafer dicing system 100 of the present invention is described in detail below.
Mounting thewafer boat 20 to be divided on thewafer dividing platform 31 between thearm device 33 and theauxiliary wafer boat 10, closing the openings of theauxiliary wafer boat 10 and thewafer boat 20 to be divided relatively, controlling 25 card strips 13 of theauxiliary wafer boat 10 to be unlocked, extending thearm device 33 from thehollow part 21 of thewafer boat 20 to be divided, pushing thewhole wafer 40 in thewafer boat 20 to be divided into theauxiliary wafer boat 10, controlling 25 card strips 13 of theauxiliary wafer boat 10 to be in a clamping state, and clamping thewafer 40 in the auxiliary wafer boat 10 (as shown in fig. 4 and 8);
thewafer dividing platform 31 is inclined by a certain angle, theauxiliary wafer boat 10 is positioned above thewafer boat 20 to be divided, the corresponding card strips 13 arranged in the designatedcard slot 111 are controlled to be in a lock releasing state (as shown in fig. 5 and 9), that is, thewafers 40 which are not required to be divided are clamped by the card strips 13, thearm device 33 is driven to retreat towards the direction of thewafer boat 20 to be divided, thewafers 40 in the lock releasing state abut against thearm device 33 so as to reach thewafer boat 20 to be divided along with thearm device 33, and thearm device 33 returns to an initial position, so that the designatedwafers 40 are transferred (as shown in fig. 6);
and (4) restoring the platform to be in the horizontal position, removing thewafer boat 20 to be diced, installing an empty standard wafer boat at the position, repeating the steps, and repeating the steps to complete the dicing work of thewafer 40.
Compared with the prior art, the clamping strips 13 are correspondingly arranged on the clampinggrooves 111 on the two sides of thewafer boat body 11, namely, each clampinggroove 111 is provided with thecorresponding clamping strip 13, the clamping strips 13 can be operated to clamp or release thewafer 40, and the clamping or release can be performed on the appointedwafer 40 in thewafer 40 slicing process, so that the appointedwafer 40 is transferred. Meanwhile, thearm device 33 is used for pushing thewafers 40 in the to-be-separated boat 20 into theauxiliary boat 10, the to-be-separated boat 20 is an empty boat, then thewafers 40 abut against thearm device 33 and reach the to-be-separated boat 20 along with the retreat of thearm device 33, and the whole process is strong in stability and high in efficiency. Further, theboat body 11 and the boat to be divided 20 belong to a standard boat, and thus, the application range is not limited.
It should be noted that the above-mentioned embodiments illustrate rather than limit the scope of the invention, and that those skilled in the art will be able to modify the invention in its various equivalent forms after reading the present invention and to fall within the scope of the invention as defined in the appended claims.
Claims (6)
Translated fromChinesePriority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810972358.9ACN109216247B (en) | 2018-08-23 | 2018-08-23 | Wafer slicing system and slicing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810972358.9ACN109216247B (en) | 2018-08-23 | 2018-08-23 | Wafer slicing system and slicing method |
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| CN109216247A CN109216247A (en) | 2019-01-15 |
| CN109216247Btrue CN109216247B (en) | 2021-01-05 |
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| CN201810972358.9AActiveCN109216247B (en) | 2018-08-23 | 2018-08-23 | Wafer slicing system and slicing method |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111627853B (en)* | 2020-07-30 | 2020-11-03 | 清华大学 | Wafer centering device |
| CN114496865B (en)* | 2021-12-24 | 2025-01-07 | 宁波芯健半导体有限公司 | Wafer flipping device |
| CN114927448B (en)* | 2022-03-25 | 2025-04-01 | 南京伟测半导体科技有限公司 | Wafer separation equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101944670A (en)* | 2010-08-27 | 2011-01-12 | 华为终端有限公司 | Intelligent card socket, mobile terminal and working method for mobile terminal |
| CN204289420U (en)* | 2015-01-07 | 2015-04-22 | 中芯国际集成电路制造(北京)有限公司 | Wafer slice getting device |
| CN204577411U (en)* | 2014-12-30 | 2015-08-19 | 苏州日月新半导体有限公司 | Wafer transfer instrument |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI430929B (en)* | 2011-04-19 | 2014-03-21 | Gudeng Prec Ind Co Ltd | Transmission box |
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- 2018-08-23CNCN201810972358.9Apatent/CN109216247B/enactiveActive
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101944670A (en)* | 2010-08-27 | 2011-01-12 | 华为终端有限公司 | Intelligent card socket, mobile terminal and working method for mobile terminal |
| CN204577411U (en)* | 2014-12-30 | 2015-08-19 | 苏州日月新半导体有限公司 | Wafer transfer instrument |
| CN204289420U (en)* | 2015-01-07 | 2015-04-22 | 中芯国际集成电路制造(北京)有限公司 | Wafer slice getting device |
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