Disclosure of Invention
The invention aims to solve the technical problems that: the existing manual operation of wafer blue film switching in the crystal taking and fixing is low in efficiency, and the invention provides a continuous crystal taking and fixing mechanism for solving the problems.
The technical scheme adopted for solving the technical problems is as follows: the utility model provides a solid brilliant mechanism of continuous get wafer, includes the tray of placing the wafer blue membrane and the material placing platform of placing the tablet be provided with between tray and the material placing platform get the crystal grain on the wafer blue membrane put to get on the tablet get the arm, still include unloader on the blue membrane, unloader includes the blue membrane feed bin and gets the claw on the blue membrane, place the wafer blue membrane of waiting to get the wafer operation in the blue membrane feed bin, get the claw and be in the blue membrane feed bin with remove and can get between the tray and put the wafer blue membrane.
Further: the horizontal guide rail is arranged between the tray and the blue film bin, a horizontal sliding block capable of moving along the horizontal guide rail is arranged on the horizontal guide rail, the material taking claw is arranged on the horizontal sliding block, and a suction nozzle capable of sucking the blue film of the wafer is arranged on the material taking claw.
Further: the continuous crystal taking and fixing mechanism further comprises a vertical screw rod, a vertical sliding block and a vertical driving motor, wherein the vertical sliding block is installed on the vertical screw rod, the vertical screw rod is driven by the vertical driving motor to rotate and can drive the vertical sliding block to move along the vertical direction, and the blue film storage bin is fixedly arranged on the vertical sliding block.
Further: the clamping tool comprises a cylinder, a fixed semi-ring and a movable semi-ring, wherein the cylinder body of the cylinder is fixedly arranged on the tray, the movable semi-ring is fixedly arranged on a piston rod of the cylinder, and the piston rod of the cylinder extends outwards to push the movable semi-ring to the direction of the fixed semi-ring and clamp the periphery of the wafer blue film.
Further: the tray rotates and sets up on the support, be provided with first motor on the support, be provided with the drive wheel in the pivot of first motor, the drive wheel can drive the tray rotates.
Further: the swing arm is arranged on the driving shaft of the second motor.
The continuous crystal taking and fixing mechanism has the advantages that the material taking claw capable of automatically switching the blue film of the wafer is arranged, so that the whole crystal taking and fixing process can be continuously carried out, an operator only needs to be responsible for supplementing materials in the blue film storage bin, the blue film of the wafer is switched to be carried out by the material taking claw, the labor intensity of the operator is reduced, and the crystal taking and fixing efficiency is improved.
Drawings
The invention will be further described with reference to the drawings and examples.
Fig. 1 and fig. 2 are schematic structural diagrams of a continuous crystal taking and fixing mechanism of the invention;
Fig. 3 is a schematic structural view of the clamping fixture mounted on a tray.
In the figure, 1, a tray, 2, a material placing table, 3, a swing arm, 4, a blue film bin, 5, a material taking claw, 6, a horizontal guide rail, 7, a horizontal sliding block, 8, an air cylinder, 9, a fixed semi-ring, 10, a movable semi-ring, 11, a first motor, 12, a driving wheel, 13, a second motor, 14, a driving motor, 15, a vertical sliding block, 16 and a support.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention. On the contrary, the embodiments of the invention include all alternatives, modifications and equivalents as may be included within the spirit and scope of the appended claims.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art. Furthermore, in the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and further implementations are included within the scope of the preferred embodiment of the present invention in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present invention.
As shown in fig. 1 and 2, the invention provides a continuous wafer taking and fixing mechanism, which comprises a tray 1 for placing a wafer blue film, a material placing table 2 for placing a material sheet, a swing arm 3 for taking and placing crystal grains on the wafer blue film on the material sheet, and a blue film feeding and discharging device, wherein the blue film feeding and discharging device comprises a blue film storage bin 4 and a material taking claw 5, the wafer blue film to be subjected to wafer taking operation is placed in the blue film storage bin 4, and the material taking claw 5 moves between the blue film storage bin 4 and the tray 1 and can take and place the wafer blue film.
When the crystal taking and fixing operation is performed, the swing arm 3 swings back and forth between the tray 1 and the material placing table 2, crystal grains on the crystal blue film are taken and placed on the material sheet of the material placing table 2, along with the crystal taking and fixing operation, after the crystal grains on the crystal blue film are gradually taken and placed, the material taking claw 5 moves to the upper side of the tray 1, the crystal blue film which has completed the crystal taking is taken away, then moves to the upper side of the blue film storage bin 4, the crystal blue film to be subjected to the crystal taking operation in the blue film storage bin 4 is taken and placed in the tray 1, and the swing arm 3 can continue to work to complete the crystal taking and fixing operation.
The mode avoids long-time process pause caused by manual replacement of the wafer blue film, meanwhile, operators do not need to watch the progress of taking and fixing the wafer by the single wafer blue film at the side of the equipment, and the operators can realize continuous wafer taking and fixing work by only preparing sufficient wafer blue film in the blue film storage bin 4 at the beginning of operation, so that the working intensity of the operators is reduced, abnormal process pause is avoided, and the working efficiency is improved.
A horizontal guide rail 6 is arranged between the tray 1 and the blue film storage bin 4, a horizontal sliding block 7 capable of moving along the horizontal guide rail 6 is arranged on the horizontal guide rail 6, the material taking claw 5 is arranged on the horizontal sliding block 7, and a suction nozzle capable of sucking the blue film of the wafer is arranged on the material taking claw 5.
The continuous crystal taking and fixing mechanism further comprises a vertical screw rod, a vertical sliding block 15 and a vertical driving motor 14, wherein the vertical sliding block 15 is installed on the vertical screw rod, the vertical screw rod is driven by the vertical driving motor 14 to rotate and can drive the vertical sliding block 15 to move along the vertical direction, and the blue film storage bin 4 is fixedly arranged on the vertical sliding block 15.
The first horizontal sliding block 7 moves on the first horizontal guide rail 6, so that the material taking claw 5 can move along the horizontal direction, the material taking claw 5 has the degree of freedom of the horizontal direction, the transfer action between the tray 1 and the blue film storage bin 4 is completed, the vertical sliding block 15 can drive the blue film storage bin 4 to move along the vertical direction, so that the wafer blue film can be close to or far away from the material taking claw 5, the material taking claw 5 can conveniently take and put the wafer blue film, the material taking claw 5 can rapidly and accurately take and put the wafer blue film, and the suction nozzle can ensure that the wafer blue film is stably absorbed and the phenomena such as scratch cannot occur.
As shown in fig. 3, a clamping tool is arranged on the tray 1, the clamping tool comprises an air cylinder 8, a fixed half ring 9 and a movable half ring 10, the cylinder body of the air cylinder 8 is fixedly arranged on the tray 1, the movable half ring 10 is fixedly arranged on a piston rod of the air cylinder 8, and the piston rod of the air cylinder 8 extends outwards to push the movable half ring 10 towards the fixed half ring 9 and can clamp the periphery of the wafer blue film.
The action of clamping and releasing of clamping tool can be realized in the flexible action of piston cylinder of cylinder 8, and the piston cylinder of cylinder 8 stretches out can make clamping tool fixed clamp wafer blue membrane, and the piston rod of cylinder 8 contracts back and can realize clamping tool release the wafer blue membrane that clamps, and this kind of mode can realize the reliable clamp to wafer blue membrane, releases simple rapidly simultaneously.
The tray 1 is rotatably arranged on a support 16, a first motor 11 is arranged on the support 16, a driving wheel 12 is arranged on a rotating shaft of the first motor 11, and the driving wheel 12 can drive the tray 1 to rotate. The first motor 11 drives the driving wheel 12 to rotate and can drive the tray 1 to rotate, when the wafer blue film is placed on the tray 1, the position of the wafer blue film in the rotating direction is random and is not accurately and reliably positioned, and the wafer blue film can be adjusted to a preset position in the rotating direction by driving the tray 1 to rotate through the first motor 11, so that the wafer blue film is convenient to take out the wafer and fix the wafer by the swing arm 3.
The swing arm 3 is arranged on the driving shaft of the second motor 13, the driving shaft of the second motor 13 directly drives the swing arm 3 to swing back and forth, the crystal taking and fixing operation is finished, and the driving mode can improve the action speed of the swing arm 3 and improve the crystal taking and fixing efficiency.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
With the above-described preferred embodiments according to the present invention as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.