Multi-frequency antenna deviceTechnical field
The present invention relates to a kind of multi-frequency antenna devices.
Background technique
Compared to general antenna, microstrip antenna structure can have planar structure making circular polarized antenna, can be bigThe advantages that amount produces and is conveniently incorporated into active member or circuit board ..., thus largely applied in various radio transmitting devicesOn, such as global position system GPS (Global Positioning System) or radio frequency identification (RFID).
Referring to Fig. 1, being the perspective view for having used microstrip antenna.As shown, microstrip antenna 10 includes oneInsulating body 11, one first conductive layer 13, one second conductive layer 15 and a conducting element 171, wherein the first conductive layer 13 is located atThe upper surface of insulating body 11, and the second conductive layer 15 is then located at the lower surface of insulating body 11.Conducting element 171 is through insulationMatrix 11, the first conductive layer 13 and the second conductive layer 15, and it is electrically connected the first conductive layer 13.
The first conductive layer 13 that 11 upper surface of insulating body is arranged in can be used as the width beam of microstrip antenna 10, and be arrangedSecond conductive layer 15 of 11 lower surface of insulating body is then ground plane.Connecing for radio frequency signal is being carried out through microstrip antenna 10Time receiving, radio frequency signal can be inputted by the first conductive layer 13 via conducting element 171, and in the hair for carrying out radio frequency signalWhen penetrating, signal can then be sent to the first conductive layer 13 via conducting element 171, and emit wireless news via the first conductive layer 13Number.
The frequency and the length and width phase of the first conductive layer 13 of wireless signal that microstrip antenna 10 can receive or emitIt closes, it is furthermore also related to the dielectric coefficient of insulating body 11.If the lower microstrip antenna 10 of resonant frequency to be made, just needs to increaseAdd the length or width of the first conductive layer 13, will thus will increase the volume and cost of manufacture of microstrip antenna 10.Certainly alsoIt the higher insulating body 11 of dielectric coefficient can be selected makes microstrip antenna 10, to reach the resonant frequency for reducing microstrip antenna 10Purpose equally will increase the cost of manufacture of microstrip antenna 10 although this mode can avoid increasing the volume of microstrip antenna 10.And after the size of insulating body and selected dielectric coefficient, substantially, the resonant frequency being capable of forming on the microstrip antennaJust fix, so, in production tool on an insulating body, there are two when the microstrip antenna of resonant frequency, it is not easy to while essenceReally and effectively adjust two resonant frequencies.
Summary of the invention
A kind of multi-frequency antenna device is provided the purpose of the present invention is to solve above-mentioned technical problem, mainly in insulation baseThe upper surface setting first electrode layer and the second electrode lay of body, and be arranged on the side surface and/or lower surface of insulating body toA few groove, and groove is partly or entirely overlapped with the second electrode lay.First electrode layer and the second electrode lay can distinguish shapeAt different resonant frequencies, and the changeable interlayer between the second electrode lay and third electrode layer of setting for penetrating grooveEffective dielectric coefficient will can reach adjustment the second electrode lay institute in the case where not increasing the volume of multi-frequency antenna device wherebyThe purpose of the resonant frequency of generation.
It is a further object of the present invention to provide a kind of multi-frequency antenna device, can by be arranged insulating body side surface and/Or size, position and/or the quantity of the groove of lower surface, resonant frequency caused by multi-frequency antenna device is adjusted, and should not be moreChange the design of the electrode layer on multi-frequency antenna device, multi-frequency antenna device convenience when in use will can be improved whereby and is applicable inRange.
In order to achieve the above objectives, the invention adopts the following technical scheme:
A kind of multi-frequency antenna device, comprising:
One insulating body, including an at least first through hole, a first surface, a second surface and an at least side surface,In the first surface and the second surface be across opposite two surfaces of the insulating body, and the first surface is via the side tableFace connects the second surface, and the first through hole penetrates the insulating body；
An at least first electrode layer builds the first surface in the insulating body；
The first surface of the insulating body is arranged in an at least the second electrode lay, and is located at the outer of the first electrode layerIt encloses, and the second electrode lay is not in contact with the first electrode layer；
An at least third electrode layer builds the second surface in the insulating body；
An at least conducting element across the first through hole and is electrically connected the first electrode layer, and does not contact third electricityPole layer；And
An at least groove is set to the side surface or the second surface of the insulating body, wherein the groove this firstThe projection on surface overlaps completely or partially with the second electrode lay, and wherein the first electrode layer is to generate one first resonance frequencyRate, and the second electrode lay is then to generate one second resonant frequency, and first resonant frequency is higher than second resonant frequency,Wherein the groove is to adjust effective dielectric coefficient between the second electrode lay and the third electrode layer, and via adjust thisEffective dielectric coefficient between two electrode layers and the third electrode layer adjusts second resonant frequency.
Wherein the groove is circumferentially positioned at the side surface or second surface of the insulating body.
Wherein the quantity of the groove is several, and be arranged in a symmetrical manner the insulating body the side surface or thisTwo surfaces.
The wherein one signal feed side of conducting element electrical connection.
The multi-frequency antenna device further includes a bearing substrate, which includes a third surface, one the 4th surfaceAnd an at least side surface, wherein the third surface and the 4th surface are across opposite two surfaces of the bearing substrate, thisThree surfaces connect the 4th surface via the side surface, and all or part of region on the third surface is attached to the insulating bodySecond surface, wherein the bearing substrate includes at least one second through-hole, which penetrates the bearing substrate, and being connected to shouldThe first through hole of insulating body, and the conducting element passes through the first through hole being connected and second through-hole.
Wherein the bearing substrate has at least one vacancy section.
Wherein insulating body tool is there are two first through hole, which penetrates the insulating body, the conductive elementThe quantity of part is two, is separately positioned in two first through hole, and be separately connected the first electrode layer, and do not contact thisThree electrode layers, two conducting elements are respectively to connect a signal feed side.
A kind of multi-frequency antenna device, comprising:
One insulating body, including an at least first through hole, a first surface and a second surface, wherein the first surface withThe second surface is two surfaces opposite across the insulating body, and the first through hole penetrates the insulating body；
An at least first electrode layer builds the first surface in the insulating body；
The first surface of the insulating body is arranged in an at least the second electrode lay, and is located at the outer of the first electrode layerIt encloses, and the second electrode lay is not in contact with the first electrode layer；
One bearing substrate, including at least one second through-hole, a third surface, one the 4th surface and an at least side surface,In the third surface and the 4th surface be across opposite two surfaces of the bearing substrate, and the third surface is via the side tableFace connects the 4th surface, and second through-hole penetrates the bearing substrate, and wherein all or part of region on the third surface is attachedThe insulating body second surface, and second through-hole is connected to the first through hole of the insulating body；
An at least conducting element across the first through hole and second through-hole and is electrically connected the first electrode layer；And
An at least groove, is set to the side surface or the second surface of the insulating body, or is set to the bearing substrateThe side surface or the third surface or the 4th surface, wherein the groove is complete in the projection of first surface and the second electrode layIt fully or partially overlaps, wherein the first electrode layer is to generate one first resonant frequency, and the second electrode lay is then to generateOne second resonant frequency, and first resonant frequency is higher than second resonant frequency.
The multi-frequency antenna device further includes an at least third electrode layer, builds the second surface in the insulating body,And the conducting element does not contact the third electrode layer.
Wherein the bearing substrate is as made by insulating materials.
The multi-frequency antenna device includes at least one the 4th electrode layer, is built in the 4th surface of the bearing substrate, and4th electrode layer does not contact the conducting element.
Wherein the bearing substrate is as made by metal material, and the bearing substrate does not contact the conducting element.
Wherein the conducting element is used for one signal feed side of electrical connection.
Wherein four of the first electrode layer compare biggish while adjacent with the four of the second electrode lay difference,Form four corresponding spacing, wherein the smallest spacing is the first spacing, then according to be respectively clockwise the second spacing,Third spacing and the 4th spacing, wherein first spacing is not equal to the third spacing, which is not equal to the 4th spacing.
Wherein insulating body tool is there are two first through hole, and the bearing substrate then have there are two the second through-hole, the insulationTwo first through hole of matrix are respectively corresponded with two the second through-holes of the bearing substrate and are connected to, wherein the quantity of the conducting elementIt is two, and the first through hole being connected and the conducting element is all respectively set in second through-hole, the conducting element pointThe first electrode layer and a signal feed side are not connected, and do not contact the third electrode layer.
Wherein insulating body tool is there are two first through hole, and the bearing substrate then have there are two the second through-hole, the insulationTwo first through hole of matrix are respectively corresponded with two the second through-holes of the bearing substrate and are connected to, wherein the quantity of the conducting elementIt is two, and the first through hole being connected and the conducting element is all respectively set in second through-hole, the conducting element pointThe first electrode layer and a signal feed side are not connected, and do not contact the 4th electrode layer.
Beneficial effects of the present invention: a kind of multi-frequency antenna device of the invention is mainly arranged in the upper surface of insulating bodyFirst electrode layer and the second electrode lay, and third electrode layer is set in the lower surface of insulating body, wherein the second electrode lay is located atThe periphery of first electrode layer, and do not contact with each other with first electrode layer.It can be set on the side surface and/or lower surface of insulating bodyAn at least groove is set, which partly or entirely overlaps with the second electrode lay.The first electrode layer can divide with the second electrode layDifferent resonant frequencies is not formed, and the folder between the second electrode lay and third electrode layer can be changed in the setting for penetrating grooveEffective dielectric coefficient of layer, whereby to adjust resonant frequency caused by the second electrode lay；
A kind of multi-frequency antenna device of the invention, mainly in the side surface of insulating body and/or lower surface and/or insulation baseAn at least groove is arranged in the inside of body, and makes segment electrode layer weight of the groove in the projection and insulating body of first surfaceRepeatedly.Furthermore it also can adjust groove in longitudinal depth of the projection of first surface and the overlapping area of electrode layer and/or adjustment grooveAnd/or the setting position of groove, to adjust resonant frequency caused by electrode layer.
Detailed description of the invention
Fig. 1 is the perspective view of existing microstrip antenna.
Fig. 2 is the stereoscopic schematic diagram at the top of one embodiment of multi-frequency antenna device of the present invention.
Fig. 3 is the stereoscopic schematic diagram of the bottom of one embodiment of multi-frequency antenna device of the present invention.
Fig. 4 is the top view of one embodiment of multi-frequency antenna device of the present invention.
Fig. 5 is the top view of the another embodiment of multi-frequency antenna device of the present invention.
Fig. 6 is the stereoscopic schematic diagram at the top of the another embodiment of multi-frequency antenna device of the present invention.
Fig. 7 is the stereoscopic schematic diagram of the bottom of the another embodiment of multi-frequency antenna device of the present invention.
Fig. 8 is the stereoscopic schematic diagram of the bottom of the another embodiment of multi-frequency antenna device of the present invention.
Fig. 9 is the stereoscopic schematic diagram at the top of the another embodiment of multi-frequency antenna device of the present invention.
Figure 10 is the stereoscopic schematic diagram of the bottom of the another embodiment of multi-frequency antenna device of the present invention.
Figure 11 is the stereoscopic schematic diagram of the bottom of the another embodiment of multi-frequency antenna device of the present invention.
Figure 12 is the stereoscopic schematic diagram at the top of the another embodiment of multi-frequency antenna device of the present invention.
Figure 13 is the stereoscopic schematic diagram at the top of the another embodiment of multi-frequency antenna device of the present invention.
Figure 14 is the stereoscopic schematic diagram of the bottom of the another embodiment of multi-frequency antenna device of the present invention.
Figure 15 is the stereogram exploded view at the top of the another embodiment of multi-frequency antenna device of the present invention.
Figure 16 is the stereogram exploded view of the bottom of the another embodiment of multi-frequency antenna device of the present invention.
Figure 17 is the stereogram exploded view of the bottom of the another embodiment of multi-frequency antenna device of the present invention.
Figure 18 is the stereogram exploded view at the top of the another embodiment of multi-frequency antenna device of the present invention.
Figure 19 is the stereogram exploded view of the bottom of the another embodiment of multi-frequency antenna device of the present invention.
Figure 20 is the stereogram exploded view at the top of the another embodiment of multi-frequency antenna device of the present invention.
Figure 21 is the stereogram exploded view of the bottom of the another embodiment of multi-frequency antenna device of the present invention.
Figure 22 is the stereoscopic schematic diagram at the top of the another embodiment of multi-frequency antenna device of the present invention.
Figure 23 is the stereoscopic schematic diagram at the top of the another embodiment of multi-frequency antenna device of the present invention.Primary clustering symbol is saidIt is bright:
10 microstrip antenna, 11 insulating body
13 first conductive layer, 15 second conductive layer
171 conducting elements
20 multi-frequency antenna device, 21 insulating body
211 first surface, 212 gap
213 second surface, 215 side surface
217 first through hole, 219 setting area
231 first electrode layer, 233 the second electrode lay
The 4th electrode layer of 235 third electrode layer 237
25 conducting element, 27 groove
29 ground planes
30 multi-frequency antenna device, 39 bearing substrate
The 4th surface of 391 third surface 393
395 side surface, 397 second through-hole
399 vacancy sections
40 multi-frequency antenna device, 41 insulating body
411 first surface, 413 second surface
415 side surface, 417 first through hole
431 first electrode layer, 433 the second electrode lay
The 4th electrode layer of 435 third electrode layer 437
45 conducting element, 47 bearing substrate
The 4th surface of 471 third surface 473
475 side surface, 477 second through-hole
49 grooves
50 multi-frequency antenna device, 531 first electrode layer
533 the second electrode lay, 535 third electrode layer
59 bearing substrate, 591 third surface
593 the 4th surface, 595 side surface
597 second through-holes
Specific embodiment
Please refer to figs. 2 and 3, is top and the elevated bottom perspective signal of one embodiment of multi-frequency antenna device of the present invention respectivelyFigure.As shown, multi-frequency antenna device 20 mainly includes an insulating body 21, an at least first electrode layer 231, at least one secondElectrode layer 233, at least a third electrode layer 235, at least a conducting element 25 and at least a groove 27.
Insulating body 21 includes a first surface 211, a second surface 213, an at least side surface 215 and at least one firstThrough-hole 217, wherein first surface 211 and second surface 213 are across opposite two surfaces of insulating body 21, such as the first tableFace 211 is top surface, and second surface 213 is bottom surface.Furthermore first surface 211 connects second surface via side surface 215213, such as insulating body 21 can be a polygonal cylinder or a cylindrical body.First through hole 217 penetrates insulating body 21, such asThe first surface 211 and second surface 213 of one through-hole 217 connection insulating body 21.
First electrode layer 231 and the second electrode lay 233 are set to the first surface 211 of insulating body 21, wherein the second electricityPole layer 233 is located at the periphery of first electrode layer 231, and first electrode layer 231 and the second electrode lay 233 are not in contact.
In an embodiment of the present invention, as shown in Fig. 2, the second electrode lay 233 can nestle up each side of insulating body 21Surface 215 is arranged, as shown in Figure 4.In different embodiments, as shown in Figures 2 and 6, the second electrode lay 233 can be also not positioned against absolutelyEach side surface 215 of edge matrix 21, and there are a gaps 212 between each side surface 215.
In an embodiment of the present invention, the quantity of the second electrode lay 233 is one, and wherein the second electrode lay 233, which can be, connectsContinuous ring-shaped structure, and be circumferentially positioned at around first electrode layer 231, as shown in Figure 4.Such as the second electrode lay 233 is ringColumnar structure, and a setting area 219 can be formed on the first surface 211 of insulating body 21, this setting area 219 is the second electricityThe interior zone that pole layer 233 surround out, and first electrode layer 231 is then arranged in setting area 219.It is another in the present inventionIn embodiment, the quantity of the second electrode lay 233 can be several, and first electrode layer 231 is arranged in several the second electrode lays 233Periphery, as shown in Figure 5.
In an embodiment of the present invention, as shown in figure 4, first electrode layer 231 can be not arranged in the center of setting area 219Or center, that is to say, that certain a side of deviation setting area 219 or a certain corner.Such as first electrode layer 231 can be polygonShape, and may include more than four sides, wherein the four of first electrode layer 231 compare biggish side and the second electrode layThere are four corresponding spacing for tool between 233 four adjacent sides.The smallest spacing is the first spacing L1, and according to side clockwiseTo being the second spacing L2, third spacing L3 and the 4th spacing L4 respectively, wherein the first spacing L1 is not equal to third spacing L3, and theTwo spacing L2 are not equal to the 4th spacing L4.
The partial area of 21 second surface 213 of insulating body is arranged in third electrode layer 235, as shown in figure 3, either willThe whole second surface 213 of insulating body 21 is arranged in third electrode layer 235, as shown in fig. 7, wherein third electrode layer 235 everyInsulating body and first electrode layer 231 and/or the second electrode lay 233 it is opposite.Conducting element 25 passes through on insulating body 21First through hole 217, and it is electrically connected first electrode layer 231, and do not contact third electrode layer 235.
Specifically, perforation is also arranged in first electrode layer 231 and/or third electrode layer 235, is provided in insulating bodyThe perforation of first electrode layer 231 and third electrode layer 235 on 21 and the position of the first through hole 217 on insulating body 21, structureIt overlaps at part or all of.The sectional area of conducting element 25 is less than the sectional area of the first through hole 217 of insulating body 21, so that leadingElectric device 25 can be put into the first through hole 217 of matrix 21.In an embodiment of the present invention, one end of conducting element 25 can connectFirst electrode layer 231, and the other end of conducting element 25 is then for electrically connecting to a signal feed side (not shown).
First electrode layer 231 is to generate one first resonant frequency, and the second electrode lay 233 is then total to generate one secondVibration frequency, and the first resonant frequency is higher than the second resonant frequency.
Groove 27 is set to side surface 215 and/or the second surface 213 of insulating body 21, and further groove 27 is in the first tableThe projection in face and the second electrode lay 233 overlap completely or partially.In an embodiment of the present invention, as shown in figure 3, groove 27 is to setIt sets in each side surface 215 of insulating body 21.In different embodiments, as shown in figure 8, groove 27 is then setting in insulation baseThe second surface 213 of body 21.Furthermore the groove 27 of Fig. 3 and Fig. 8 does not run through insulating body 21, in different embodiments, groove27 can also run through insulating body 21.
The one of feature of the present invention is, second surface 213 and/or an at least side surface 215 in insulating body 21Upper setting groove 27, and make groove 27 in the projection of first surface and the first surface 211 that insulating body 21 is setThe second electrode lay 233 overlaps completely or partially.By the setting of groove 27, by changeable between the second electrode lay 233 and thirdEffective dielectric coefficient of interlayer between electrode layer 235, also can change between the second electrode lay 233 and multi-frequency antenna device 20Effective dielectric coefficient between lower section ground plane 29, as shown in figure 9, wherein multi-frequency antenna device 20 is arranged in ground plane 29(such as: the ground plane on circuit board) on, and change the frequency values of the second resonant frequency caused by the second electrode lay 233,Such as: it can be reduced by the setting of groove 27 between the second electrode lay 233 and third electrode layer 235 and/or ground plane 29Between interlayer effective dielectric coefficient, and improve the second resonant frequency caused by the second electrode lay 233.
In different embodiments, the position for the groove 27 being arranged on insulating body 21 also can be changed, such as in insulating bodyOne or more grooves 27 are respectively set on 21 each side surface 215, as shown in Figure 3.It furthermore also can be only in insulating body 21Component side surface 215 on one or more grooves 27 are set, wherein each groove 27 is arranged in a symmetrical manner, such as groove27 are separately positioned on the opposite side surface 215 of insulating body 21, as shown in Figure 10.Certainly groove 27 can be also circumferentially positioned at absolutelyThe side surface 215 of edge matrix 21, as shown in figure 11.Furthermore also some or all of insulating body 21 can be arranged in groove 27Side surface 215, and groove 27 does not extend to the first surface 211 and second surface 213 of insulating body 21, as shown in figure 12.
Can be changed in practical application groove 27 projection and the second electrode lay 233 of first surface overlapping area, changeBecome groove 27 along the setting position of longitudinal depth and/or change groove 27 on side surface 215, to adjust the second electrode laySecond resonant frequency caused by 233, and the second resonant frequency is made to meet the design requirement of multi-frequency antenna device 20.
In an alternative embodiment of the invention, the quantity of the first through hole 217 on insulating body 21 also can be two, such as Figure 13And shown in 14, two of them first through hole 217 all penetrates insulating body 21, and two conducting elements 25 are arranged at two respectivelyIn first through hole 217, two conducting elements 25 are separately connected first electrode layer 231, and do not contact third electrode layer 235, and pointIt Lian Jie not signal feed side (not shown).
Figure 15 and Figure 16 is please referred to, is top and the solid point of bottom of one embodiment of multi-frequency antenna device of the present invention respectivelyXie Tu.The multi-frequency antenna device 30 of the embodiment of the present invention and the multi-frequency antenna device 20 of above-described embodiment are similar, main differenceIt is that multi-frequency antenna device 30 further includes a bearing substrate 39.Bearing substrate 39 can be as made by insulating materials, also can be by metalOr made by conductive material, and including a third surface 391, one the 4th surface 393 and an at least side surface 395.Third surface391 with the 4th surface 393 be across opposite two surfaces of bearing substrate 39, and third surface 391 is connected via side surface 3954th surface 393.
Bearing substrate 39 includes at least one second through-hole 397, wherein the second through-hole 397 penetrates bearing substrate 39.Carry baseBody 39 is attached to the second surface 213 of insulating body 21 by all or part of region on third surface 391, wherein bearing substrate39 the second through-hole 397 is connected with the first through hole 217 of insulating body 21, and conducting element 25 then passes through first through hole 217And second through-hole 397.
In an embodiment of the present invention, one the 4th electrode layer can be also set on the 4th surface 393 of bearing substrate 39237, the necessary component of certain 4th electrode layer 237 and non-present invention, the also limitation of non-present invention interest field.
In an alternative embodiment of the invention, as shown in figure 17, bearing substrate 39 also may include an at least vacancy section 399,The vacancy section 399 of middle bearing substrate 39 can overlap with 21 upper groove 27 of insulating body, partial region or all overlap, or even completelyIt does not overlap.Furthermore the sectional area of vacancy section 399 can greater than, equal to or less than groove 27 sectional area.
In an alternative embodiment of the invention, setting third electrode layer 235 and the 4th can not also be had on multi-frequency antenna device 30Electrode layer 237, specifically multi-frequency antenna device 30 only transmits first electrode layer 231 and the second electrode lay 233, also can produce twoKind or more resonant frequency.
Figure 18 and Figure 19 is please referred to, is that the top of the another embodiment of multi-frequency antenna device of the present invention and bottom are decomposed and stood respectivelyBody schematic diagram.As shown, multi-frequency antenna device 40 mainly includes an insulating body 41, an at least first electrode layer 431, at leastOne the second electrode lay 433, at least a third electrode layer 435, a bearing substrate 47, at least a conducting element 45 and an at least groove49。
Insulating body 41 includes a first surface 411, a second surface 413, an at least side surface 415 and at least one firstThrough-hole 417, wherein first surface 411 and second surface 413 are across opposite two surfaces of insulating body 41, such as the first tableFace 411 is top surface, and second surface 413 is bottom surface.Furthermore first surface 411 connects second surface via side surface 415413, so that insulating body 41 is a polygonal cylinder or a cylindrical body.First through hole 417 penetrates insulating body 41, such as firstThe first surface 411 and second surface 413 of the connection insulating body 41 of through-hole 417.
The first surface 411 of insulating body 41 is arranged in first electrode layer 431 and the second electrode lay 433, wherein the second electricityPole layer 433 is located at the periphery of first electrode layer 431, and first electrode layer 431 and the second electrode lay 433 are not in contact.
Third electrode layer 435 is arranged in the second surface 413 of insulating body 41, and with first electrode layer 431 and/or secondElectrode layer 433 is opposite.Conducting element 45 passes through the first through hole 417 on insulating body 41, and is electrically connected first electrode layer431, and third electrode layer 435 is not contacted.
Bearing substrate 47 includes a third surface 471, one the 4th surface 473 and an at least side surface 475, wherein third tableFace 471 and the 4th surface 473 are across opposite two surfaces of bearing substrate 47.Third surface 471 is connected via side surface 4754th surface 473, and the second through-hole 477 then penetrates bearing substrate 47.The all or part on the third surface 471 of bearing substrate 47Region is attached to the second surface 413 of insulating body 41, wherein the of the second through-hole 477 of bearing substrate 47 and insulating body 41One through-hole 417 is connected.
Conducting element 45 passes through first through hole 417 and the second through-hole 477, and is electrically connected first electrode layer 431, and do not connectTouch third electrode layer 435.Side surface 475 and/or third surface 471 and/or the 4th table of bearing substrate 47 is arranged in groove 49Face 473, further groove 49 overlap completely or partially in the projection of first surface and the second electrode lay 433.First electrode layer 431 is usedTo generate one first resonant frequency, and the second electrode lay 433 is then to generate one second resonant frequency, and the first resonant frequency heightIn the second resonant frequency.The quantity of groove 49 can be several, and the side surface 475 of bearing substrate 47 is arranged in a symmetrical mannerAnd/or third surface 471 and/or the 4th surface 473.
Bearing substrate 47 can be isolation material in an embodiment of the present invention, and can be on the 4th surface of bearing substrate 47At least one the 4th electrode layer 437 is set on 473, and the 4th electrode layer 437 is made not contact conducting element 45.Furthermore the 4th electrodeThe area of layer 437 is greater than the area of third electrode layer 435.In an alternative embodiment of the invention, bearing substrate 47 also can be by metalMade by material, and bearing substrate 47 is made not contact conducting element 45.Specifically when bearing substrate 47 is metal material,Just it does not need that the 4th electrode layer 437 additionally is arranged.
In an embodiment of the present invention, first electrode layer 431 is not in contact with the second electrode lay 433, and in first electrode layer 431And the spacing of distance not etc. is formed between the second electrode lay 433, top view is as shown in Figure 4.Furthermore first through hole 417 and second logicalThe quantity in hole 477 also can be two respectively, and two first through hole 417 and two the second through-holes 477 respectively correspond connection, and respectivelyTwo conducting elements 45 are separately positioned in two first through hole 417 and two the second through-holes 477, and two conducting elements 45One end be separately connected first electrode layer 431, do not contact third electrode layer 435, and the other end of conducting element 45 then connects respectivelyConnect signal feed side (not shown).
In an alternative embodiment of the invention, setting third electrode layer 435 and/or the can not also be had on multi-frequency antenna device 40Four electrode layers 437, specifically multi-frequency antenna device 40 only transmits first electrode layer 431 and the second electrode lay 433, can generateTwo or more resonant frequencies.Furthermore an at least groove 49 can be arranged in side surface or the second surface 213 of insulating body 41,The side surface or third surface 471 or the 4th surface 473 of bearing substrate 49 are either set, to reach adjustment multifrequency antenna dressSet the purpose of the resonant frequency of 40 generations.
Figure 20 and Figure 21 is please referred to, is that the top of the another embodiment of multi-frequency antenna device of the present invention and elevated bottom perspective are shown respectivelyIt is intended to.As shown, multi-frequency antenna device 50 mainly includes an insulating body 21, at least a first electrode layer 531, at least 1 theTwo electrode layers 533, at least a conducting element 25, at least a groove 27 and a bearing substrate 59.
Insulating body 21 includes a first surface 211, a second surface 213, an at least side surface 215 and at least one firstThrough-hole 217, wherein first surface 211 and second surface 213 are across opposite two surfaces of insulating body 21, such as the first tableFace 211 is top surface, and second surface 213 is bottom surface.Furthermore first surface 211 connects second surface via side surface 215213, so that insulating body 21 is a polygonal cylinder or a cylindrical body.First through hole 217 penetrates insulating body 21, such as firstThe first surface 211 and second surface 213 of the connection insulating body 21 of through-hole 217.
The first surface 211 of insulating body 21 is arranged in first electrode layer 531 and the second electrode lay 533, wherein the second electricityPole layer 533 is located at the periphery of first electrode layer 531, and first electrode layer 531 and the second electrode lay 533 are not in contact.
Groove 27 is set to side surface 215 and/or the second surface 213 of insulating body 21, and further groove 27 is in the first tableThe projection in face and the second electrode lay 533 overlap completely or partially.First electrode layer 531 to generate one first resonant frequency, andThe second electrode lay 533 is then to generate one second resonant frequency, and the first resonant frequency is higher than the second resonant frequency.
Bearing substrate 59 includes a third surface 591, one the 4th surface 593 and an at least side surface 595, wherein third tableFace 591 and the 4th surface 593 are across opposite two surfaces of bearing substrate 59, and third surface 591 connects via side surface 595The 4th surface 593 is connect, and the second through-hole 597 penetrates bearing substrate 59.
All or part of region on the third surface 591 of bearing substrate 59 is attached to the second surface 213 of insulating body 21,Wherein the second through-hole 597 of bearing substrate 59 is connected with the first through hole 217 of insulating body 21.Conducting element 25 passes through firstThrough-hole 217 and the second through-hole 597 are simultaneously electrically connected first electrode layer 531.Specifically, the embodiment of the present invention and Figure 15 and Figure 16Difference be on the second surface 213 of the insulating body 21 of the embodiment of the present invention and not set conductive layer.
In an embodiment of the present invention, bearing substrate 59 can be isolation material, and can be on the 4th surface of bearing substrate 59An at least third electrode layer 535 is set on 593, and third electrode layer 535 is made not contact conducting element 25.It is another in the present inventionIn embodiment, bearing substrate 59 also can be as made by metal material, and bearing substrate 59 is made not contact conducting element 25.SpecificallyFor when bearing substrate 59 is metal material, just do not need that third electrode layer 535 additionally is arranged.
In an alternative embodiment of the invention, in addition on insulating body 21 be arranged groove 27 other than, also can bearing substrate 39,47, groove 49 is set on 59, and wherein the groove 49 of bearing substrate 39,47,59 can be such as recessed towards the groove 27 of insulating body 21Slot 49 is set to the upper surface of bearing substrate 39,47,59, so that the groove 49 of bearing substrate 39,47,59 and insulating body 21Groove 27 is connected to, as shown in figure 22.Certain groove 49 also may be provided at the lower surface of bearing substrate 39,47,59, so that carrying baseThe groove 49 of body 39,47,59 and the groove 27 of insulating body 21 are towards the same direction, as shown in figure 23.Certainly, groove 49 can alsoTo be positioned only at the side surface of bearing substrate 39,47,59.
The above, a preferred embodiment only of the invention are not used to limit the scope of implementation of the present invention, i.e.,Equivalent changes and modifications carried out by all shapes according to the scope of claims of the present invention, construction, feature and spirit should all includeIn scope of the presently claimed invention.