Summary of the invention
The application provides a kind of display panel and electronic device, is asked with solving the biggish technology of existing display floater frameTopic.
To solve the above problems, technical solution provided by the present application is as follows:
The application provides a kind of display panel, which is characterized in that including display area and is located at the display area peripheryNeighboring area, the neighboring area includes:
A kind of display panel, which is characterized in that including display area and positioned at the peripheral region of the display area peripheryDomain, the neighboring area include:
Substrate；
Signal lead layer on the substrate, the signal lead layer include that the signal of at least two insulation sets is walkedLine；
Wherein, the signal lead layer includes that at least two metal layers, first signal lead is located at second metal layerOn, the second signal cabling includes the first part in the second metal layer and is located on the first metal layerSecond part；
Orthographic projection of the second part of the second signal cabling on the first metal layer and part first letterNumber walk line overlap.
In the display panel of the application, the neighboring area further includes being set to the first metal layer and described secondThe one one insulating layer between metal layer.
In the display panel of the application, the signal lead layer further includes the first via hole, and first via hole runs through instituteState the first insulating layer, the first part of the second signal cabling pass through first via hole and the second signal cabling theThe electrical connection of two parts.
In the display panel of the application, the neighboring area includes the non-hair in side that the display area periphery is arranged inLight region and bottom edge non-luminous region.
It is described in the side non-luminous region and the bottom edge non-luminous region in the display panel of the applicationSignal lead layer includes:
At least two first signal leads, adjacent two first signal lead side by side and insulation set.
It is described in the side non-luminous region and the bottom edge non-luminous region in the display panel of the applicationSignal lead layer further include: at least two second signal cablings, adjacent two second conducting wire side by side and insulation set.
In the display panel of the application, the signal lead layer further includes third signal lead, three signal leadFirst part including being located on the third metal layer and the second part on the first metal layer；
Wherein, orthographic projection of the second part of the third signal lead on the first metal layer and part described theThe overlapping of one signal lead；Or
Orthographic projection of the second part of the third signal lead in the second metal layer and part second letterThe second part overlapping of number cabling.
In the display panel of the application, the neighboring area further includes being set to the third metal layer and described secondSecond insulating layer between metal layer；
Wherein, the signal lead layer further includes the second via hole, and second via hole runs through first insulating layer and instituteState second insulating layer, the first part of the third signal lead pass through first via hole and the third signal lead theThe electrical connection of two parts.
In the display panel of the application, the signal lead is that VSS signal lead, VDD signal cabling or GOA signal are walkedOne of line.
According to the one aspect of the application, a kind of electronic device is additionally provided, including above-mentioned display panel.
The utility model has the advantages that the application is utilized at least two layers by the way that the signal lead in display panel periphery region to be stackedMetal layer arrangement peripheral signal cabling, reduces the spacing of display area to outer rim, realizes the design of narrow frame.
Specific embodiment
The explanation of following embodiment is referred to the additional illustration, the particular implementation that can be used to implement to illustrate the applicationExample.The direction term that the application is previously mentioned, such as [on], [under], [preceding], [rear], [left side], [right side], [interior], [outer], [side]Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand the application, rather than toLimit the application.The similar unit of structure is with being given the same reference numerals in the figure.
Referring to Fig. 3, Fig. 3 is the floor map of the application display panel.
The display panel includes display area A and the neighboring area positioned at the periphery display area A.The peripheral regionDomain includes the side non-luminous region 10 and bottom edge non-luminous region 20 that the periphery the display area A is arranged in.The side is non-Light emitting region 10 is located at the left and right sides of display area A, and bottom edge non-luminous region 20 is located at the downside of display area A.
The neighboring area includes substrate and the signal lead layer on the substrate, and the signal lead layer includesAt least signal lead of two insulation sets.
In one embodiment, the signal lead can be but be not limited to VSS signal lead, VDD signal cabling orOne of GOA signal lead.
Referring to Fig. 3, the signal lead is located at and display panel bottom when the signal lead is GOA signal leadThe side non-luminous region 10 that side non-luminous region 20 is connected.When the signal lead is VDD signal cabling, the VDDSignal wire is located at bottom edge non-luminous region 20；When the signal lead is VSS signal lead, the signal lead is located at and showsShow the side non-luminous region 10 and bottom edge non-luminous region 20 that panel bottom edge non-luminous region 20 is connected.
In one embodiment, signal lead layer includes the first signal lead and second signal cabling, first signalCabling and the second signal cabling are side by side and insulation set.
The signal lead layer includes at least two metal layers, is provided with insulating layer between two metal layers.
Referring to Fig. 4, Fig. 4 is the film layer structure figure of one display panel signal lead of the embodiment of the present application.
In the display panel of the application, the application is designed by double-level-metal cabling, i.e., will be in the signal lead layerThe signal wire be layered setting.
The signal lead layer includes the first metal layer 102 being formed on the substrate 101 and is formed in described firstSecond metal layer 103 on metal layer 102.
First signal lead 104 is located in second metal layer 103, and the second signal cabling 105 includes being located at instituteState the first part 1051 in second metal layer 103 and the second part 1052 on the first metal layer 103.It is describedThe second part 1052 that the first part 1051 of second signal cabling passes through first via hole 112 and the second signal cablingElectrical connection.
Referring to Fig. 5, Fig. 5 is the Wiring structure figure of the application display panel side non-luminous region.
The signal lead layer includes at least two first signal leads 104 and at least two second signal cablings105。
In one embodiment, the signal lead layer includes two first signal leads 104.For convenience hereafterThis two articles first signal leads 104 are named as privates 109, the 5th conducting wire 110 by narration.
The signal lead layer further includes three second signal cablings 105, hereinafter described for convenience, by this threeThe second signal cabling 105 is named as the first conducting wire 106, the second conducting wire 107, privates 108.
In one embodiment, first conducting wire 106, second conducting wire 107 and the privates 108 are arrangedIn in the second metal layer 103.The first part of the privates 109 and the first part of the 5th conducting wire 110 setIt is placed in the second metal layer 103, the second part of the second part of the privates 109 and the 5th conducting wire 110It is set on the first metal layer 102；
In one embodiment, it is additionally provided between the first metal layer 102 and the second metal layer 103 and Fig. 4In identical first insulating layer 111.First insulating layer 111 can be in silicon nitride, silica, silicon oxynitride etc.At least one inorganic matter.
Further include at least one first via hole 112 on first insulating layer 111, makes the first of the privates 109Part is electrically connected by first via hole 112 with the second part of the privates 109.Similarly, the 5th conducting wire 110First part be electrically connected with the second part of the 5th conducting wire 110 by first via hole 112.
In one embodiment, the second part of the privates 109 be set to second conducting wire 107 just underSide.Orthographic projection of the second part of the part privates 109 in the second metal layer 103 and second conducting wire107 overlappings.The second part of 5th conducting wire 110 is set to the underface of first conducting wire 106, and part the described 5th is ledOrthographic projection of the second part of line 110 in the second metal layer 103 is Chong Die with first conducting wire 106.
Referring to Fig. 1, in the prior art, the border width of side non-luminous region 10 is L1, i.e., including 5 signal linesWidth.Referring to Fig. 5, double layer design of the application by signal lead, so that only existing 3 letters in side non-luminous region 10The width of number line, i.e. the border width M1 of the side non-luminous region 10 of the application are less than L1, have reached the design of narrow frame.
Referring to Fig. 6, Fig. 6 show the cabling layout of the application display panel bottom edge non-luminous region 20.
Signal lead layer on the bottom edge non-luminous region 20 includes a plurality of signal wire.
In one embodiment, the signal lead layer include the first conducting wire 206, the second conducting wire 207, privates 208,Privates 209, the 5th conducting wire 210 and the 6th conducting wire 213.Compared with the prior art in Fig. 2, in the present embodiment describedOne conducting wire 206, second conducting wire 207 and the privates 208 are set in the second metal layer 203.DescribedThe first part of the first part of four conducting wires 209, the 5th conducting wire 210 and the 6th conducting wire 213 is set to second gold medalBelong on layer, the second part of the second part of the privates 209, the 5th conducting wire 210 and the 6th conducting wire 213 is set toOn the first metal layer on the substrate.
In one embodiment, similar with the wire laying mode of side non-luminous region 10, the first of the privates 209Part is electrically connected by first via hole 212 with the second part of the privates 209.Similarly, the 5th conducting wire 210It is similar with the privates 209 with the electric connection mode of the 6th conducting wire 213.
Referring to Fig. 4, the second part of the privates 209 is set to the underface of first conducting wire 206, partOrthographic projection of the second part of the privates 209 in the second metal layer is Chong Die with first conducting wire 206.
The second part of 5th conducting wire 210 is set to the underface of second conducting wire 207, and part the described 5th is ledOrthographic projection of the second part of line 210 in the second metal layer is Chong Die with second conducting wire 207.
The second part of 6th conducting wire 213 is set to the underface of the privates 208, and part the described 6th is ledOrthographic projection of the second part of line 213 in the second metal layer is Chong Die with the 6th conducting wire 213.
Fig. 6 and Fig. 2 are please referred to, it is the privates 209, described since signal wire is finally electrically connected with driving chip 217The second part of 5th conducting wire 210 and the 6th conducting wire 213 is set to first metal by first via hole 212On.Therefore, in the layout of signal lead, guaranteeing that the driving chip 217 is constant to the spacing between the signal wireUnder the premise of, the spacing of lower frame of the display area A to the display panel will reduce, i.e. spacing L2 in Fig. 2 is greater than Fig. 6In spacing M2.
Referring to Fig. 7, Fig. 7 is the sectional view of two display panel signal lead layer of the embodiment of the present application.
The signal lead layer further includes third signal lead 314.The third signal lead 314 includes being located at described theFirst part 3141 on three metal layers 315 and the second part 3142 on the first metal layer 302.
Wherein, first signal lead 304 is located at the third metal layer 315, and the second signal cabling 305 includesFirst part 3151 on third metal layer 315 and the second part 3052 in the second metal layer 303.
In one embodiment, the second part 3142 of the third signal lead 314 is on the third metal layer 302Orthographic projection it is Chong Die with part first signal lead 304.Alternatively, the second part 3142 of the third signal lead 314Orthographic projection in the second metal layer 303 is Chong Die with the second part 3152 of the part second signal cabling 305.
In one embodiment, the neighboring area further includes being set to the third metal layer 315 and second gold medalBelong to the second insulating layer 316 between layer 303.
The signal lead layer further includes the second via hole 318, and second via hole 318 runs through first insulating layer 311With the second insulating layer 316.The first part 3141 of the third signal lead passes through second via hole 318 and described theThe second part 3142 of three signal leads is electrically connected.
According to the one aspect of the application, a kind of electronic device is additionally provided, the electronic device includes the display surfacePlate.The electronic device includes but is not limited to mobile phone, tablet computer, computer display, game machine, television set, display screenCurtain, wearable device and other living electric apparatus or household electrical appliance having a display function etc..
Present applicant proposes a kind of display panel and electronic device, the display panel includes neighboring area, the peripheryRegion includes substrate and the signal lead layer on the substrate, and the signal lead layer includes at least two insulation setsSignal lead；Wherein, the signal lead layer includes that at least two metal layers, first signal lead is located at the first metal layerOn, the second signal cabling includes the first part on the first metal layer and is located in the second metal layerSecond part；Orthographic projection of the second part of the second signal cabling on the first metal layer and part described firstSignal lead overlapping.The application utilizes at least double layer of metal by the way that the signal lead in display panel periphery region to be stackedLayer arrangement peripheral signal cabling, reduces the spacing of display area to outer rim, realizes the design of narrow frame.
Although above preferred embodiment is not to limit in conclusion the application is disclosed above with preferred embodimentThe application processed, those skilled in the art are not departing from spirit and scope, can make various changes and profitDecorations, therefore the protection scope of the application subjects to the scope of the claims.