CN109038958B - Heat dissipation device and heat dissipation method for motor rotor in vacuum environment - Google Patents

Abstract

Translated fromChinese

本发明涉及一种实现热电转换和辐射散热的方法和装置，属于真空散热技术领域。其通过能量转换的方式将转子的热量传递到定子侧，进而降低转子的温升。其包括固定于转子前、后两端面的两传热端面；一传热端面设置于转子前端面，另一传热端面设置于转子后端面；每个传热端面均与一热电转换装置相接触，且热电转换装置与其各自的电磁波发射装置电连接；定子内侧电镀有黑镀铬镀层，用于增加对转子侧辐射的吸收。

The invention relates to a method and a device for realizing thermoelectric conversion and radiation heat dissipation, and belongs to the technical field of vacuum heat dissipation. It transfers the heat of the rotor to the stator side through energy conversion, thereby reducing the temperature rise of the rotor. It includes two heat transfer end surfaces fixed on the front and rear end surfaces of the rotor; one heat transfer end surface is arranged on the front end surface of the rotor, and the other heat transfer end surface is arranged on the rear end surface of the rotor; each heat transfer end surface is in contact with a thermoelectric conversion device , and the thermoelectric conversion device is electrically connected with its respective electromagnetic wave emitting device; the inner side of the stator is electroplated with a black chrome plating layer, which is used to increase the absorption of radiation on the rotor side.

Description

Heat dissipation device and heat dissipation method for motor rotor in vacuum environment

Technical Field

The invention relates to a method and a device for realizing thermoelectric conversion and radiation heat dissipation, belonging to the technical field of vacuum heat dissipation.

Background

With the continuous improvement of the scientific and technical level of China, more and more industries need vacuum environment for production operation, and the demand of vacuum pumps is larger and larger. The conventional vacuum pump adopts an asynchronous motor, and the temperature of a rotor is increased due to the aluminum consumption of the rotor as known from the operating characteristics of the asynchronous motor. Because the high vacuum state is in the shielding sleeve, the heat dissipation condition of heat convection is lost, the rotor can only dissipate heat through heat conduction and heat radiation, the temperature of the rotor is higher and higher, and the heat is transferred to the bearing through the heat conduction, so that the temperature of the inner ring of the bearing is increased. Because the heat dissipation conditions of the inner ring and the outer ring of the bearing are different, the temperature of the inner ring of the bearing is far higher than that of the outer ring, the inner ring and the outer ring expand in different degrees, the effective clearance of the bearing is reduced, the bearing runs for a long time and undergoes a long dynamic transition process, a lubricating oil film in a bearing raceway is difficult to establish, a rolling ball body is extruded, and finally the bearing is possibly glued and locked due to overlarge friction force of the rolling ball body, so that the result is unreasonable.

The invention patent application with publication number CN202424409U discloses a novel rotor heat dissipation structure (application number CN 201120571832.0), wherein a rotor is arranged on a rotating shaft, the rotating shaft is supported on a bearing, the novel rotor heat dissipation structure also comprises a plurality of heat dissipation fins, the heat dissipation fins are arranged between the rotor and the bearing and are embedded on the rotating shaft, a gap is arranged between every two adjacent heat dissipation fins, the novel rotor heat dissipation structure is simple in structure, the temperature of the rotating shaft of a motor is reduced, the temperature of the bearing of the motor is further reduced, the heat dissipation effect is good, the service life of the motor is prolonged, and the normal work of the motor is ensured. Is a novel rotor heat radiation structure.

However, this method and apparatus can be implemented only on the premise that a heat-conducting medium exists around the rotor, and the vacuum environment does not contain a heat-conducting medium such as gas, and heat cannot be transferred by convection and heat conduction of air, so that the method and apparatus are not suitable for heat dissipation of the rotor in the vacuum environment.

Disclosure of Invention

The invention aims at the defects in the prior art and provides a heat dissipation device and a heat dissipation method for a motor rotor in a vacuum environment, which aim at the problem that the motor rotor in the vacuum environment is difficult to dissipate heat, realize thermoelectric energy conversion and radiation heat dissipation, overcome the problem that the temperature of the rotor is higher and higher due to the fact that the motor rotor for the conventional vacuum pump can only dissipate heat through heat conduction and heat radiation, and transfer the heat of the rotor to the side of a stator in an energy conversion mode so as to further reduce the temperature rise of the rotor.

In order to achieve the purpose, the invention adopts the following technical scheme that the heat exchanger comprises two heat transfer end surfaces which are fixed on the front end surface and the rear end surface of a rotor; one heat transfer end face is arranged on the front end face of the rotor, and the other heat transfer end face is arranged on the rear end face of the rotor.

Each heat transfer end surface is in contact with a thermoelectric conversion device, and the thermoelectric conversion devices are electrically connected with the respective electromagnetic wave emitting devices.

The inner side of the stator is electroplated with a black chromium plating layer for increasing the absorption of radiation on the rotor side.

As a preferred aspect of the present invention, the outer surface of the rotor is provided with a double coating: a thermal radiation type barrier coating, a thermal reflection type barrier coating, for reducing absorption of radiation on the stator side.

As another preferable scheme of the invention, the heat transfer end face is connected with the rotor end face in a welding mode; and the heat transfer end face is provided with a hole for the motor rotating shaft to pass through.

As another preferred scheme of the invention, the heat transfer end face is fixed at the end face of the rotor core in a welding mode, and the heat transfer end face is made of a material which is neither magnetically conductive nor electrically conductive and only exchanges heat with the end face of the rotor; the thermoelectric conversion device is fixed on the outer surface of the heat transfer end face in a bonding or welding mode.

As another preferable scheme of the present invention, the heat transfer end surface is a disk structure, the disk structure is composed of a plurality of concentric rings, and two adjacent rings are made of two materials with different specific heat capacities and heat conductivities.

In another preferred embodiment of the present invention, two adjacent rings on the heat transfer end surface are bonded or welded, wherein one ring is made of heat-resistant glass and the other ring is made of stainless steel.

In another preferred embodiment of the present invention, the thermoelectric conversion device is composed of a plurality of concentric ring-shaped semiconductor thermoelectric devices, each of the semiconductor thermoelectric devices includes two different semiconductors of P-type and N-type, the two semiconductors are connected by conductive sheets, a heat conductive substrate is attached to the outer sides of the conductive sheets, and the positive and negative electrodes are led out by wires.

As another preferable scheme of the invention, a layer of ceramic substrate is arranged on the outer surface of the annular inner end surface and the outer surface of the annular outer end surface of the semiconductor thermoelectric device; the ceramic substrate of the inner end surface of each ring is bonded on one ring of the heat conduction end surface, the ceramic substrate of the outer end surface of each ring is bonded on the other ring of the heat conduction end surface, and the two rings are adjacent.

The semiconductor thermoelectric device comprises a P-type semiconductor material and an N-type semiconductor material which are arranged between two ceramic substrates, wherein the P-type semiconductor material and the N-type semiconductor material are arranged at intervals and are divided into a group in pairs, and the group is divided into: a first group S1, a plurality of middle groups (S2-Sp-1) and a tail group Sp.

The end part of the P-type semiconductor material on one side of the first group and the end part of the N-type semiconductor material are both connected with the same copper flow deflector and nickel barrier layer, the end part of the P-type semiconductor material on the other side of the first group is connected with a lead and is led out to be used as a negative electrode, and the end part of the N-type semiconductor material on the other side of the first group and the end part of the P-type semiconductor material on the same side of the adjacent middle group are connected through the copper flow deflector; forming a pi-type structure.

The end part of the P-type semiconductor material and the end part of the N-type semiconductor material on one side of each middle group are connected with the copper guide plate and the nickel barrier layer where the P-type semiconductor material and the N-type semiconductor material are located, and the end part of the P-type semiconductor material on the other side of each middle group is connected with the end part of the N-type semiconductor material of the other group which is adjacent to the same side and on the same side through the same copper guide plate and the same nickel barrier layer, so.

The end part of the P-type semiconductor material and the end part of the N-type semiconductor material on one side of the tail group are both connected with the same copper guide vane and nickel barrier layer, and the end part of the N-type semiconductor material on the other side of the tail group is connected with the end part of the P-type semiconductor material on the same side of the adjacent middle group through the same copper guide vane and nickel barrier layer; the end part of the P-type semiconductor material on the other side of the tail group is connected with a wire and is led out to be used as an anode, so that a pi-shaped structure is formed.

A molybdenum-manganese metallization layer is electroplated between the copper flow deflector and the ceramic substrate and between the nickel barrier layer and the ceramic substrate; the leads of the respective ring-shaped semiconductor thermoelectric devices are connected in series.

As another preferred scheme of the present invention, the electromagnetic wave emitting device includes a plurality of (patch type) light emitting diodes connected in parallel and welded on a circular PCB, the outer diameter of the PCB is not greater than the outer diameter of the motor rotor, and a hole is left in the middle of the PCB for facilitating the passage of the rotating shaft, and the frequency of the electromagnetic wave emitted by the (patch type) light emitting diodes is an infrared ray or other heat ray band which is favorable for radiation absorption; the positive and negative electrodes of the thermoelectric conversion device are used as power sources of the electromagnetic wave emitting device and are connected with the electromagnetic wave emitting device.

As another preferable aspect of the present invention, the other portion of the thermoelectric conversion device than the ceramic substrate is not in contact with the heat-transfer end face.

A heat dissipation method of a motor rotor in a vacuum environment utilizes a closed loop composed of two different metals or semiconductors according to different temperatures of different positions on the end surface of the rotor, when the temperatures of two contact positions are different, a potential is generated in the loop, so that heat energy is converted into electric energy; the electric energy is converted into electromagnetic waves with certain frequency by utilizing the light-emitting diodes, the frequency of the electromagnetic waves is easy to absorb by the stator side, and after the electromagnetic waves are absorbed by the stator side, the energy is transferred from the rotor side to the stator side, so that the temperature rise of the rotor is reduced, and the heat dissipation effect is realized.

Compared with the prior art, the invention has the beneficial effects.

The heat dissipation method and the heat dissipation device are suitable for a vacuum environment, the problem that the temperature of the rotor is higher and higher due to the fact that the rotor can only dissipate heat through heat conduction and heat radiation in the vacuum environment is solved, the heat of the rotor is transferred to the stator side through an energy conversion mode, the temperature rise of the rotor is further reduced, the performance of a motor is improved beneficially, and the operation stability and the reliability are improved.

Drawings

The invention is further described with reference to the following figures and detailed description. The scope of the invention is not limited to the following expressions.

Fig. 1 is a schematic view of the structure of a rotor heat conversion device of the present invention.

Fig. 2 is a schematic structural view of a heat transfer end face of the present invention.

Fig. 3 is a schematic view of the structure of the thermoelectric conversion device of the present invention.

Fig. 4 is a partial configuration diagram of a thermoelectric conversion device of the present invention.

Fig. 5 is a sectional view showing the assembled position of the thermoelectric conversion device of the present invention and a tailored heat-transfer end face.

Fig. 6 is a structural view of an electromagnetic wave emitting device of the present invention.

In the figure, 1 is an electromagnetic wave emitting device, 2 is a thermoelectric conversion device, 3 is a heat transfer end face, 4 is a rotor core, 5 is a motor rotating shaft, 6 is a hole through which the motor rotating shaft passes, 7 is heat-resistant glass, 8 is stainless steel, 9 is a semiconductor thermoelectric device, 10 is a molybdenum-manganese metallization layer, 11 is a ceramic substrate, 12 is a copper guide vane and a nickel barrier layer, 13 is a semiconductor material, 14 is a PCB circuit board, and 15 is a light emitting diode.

Detailed Description

The invention is described in more detail below with reference to the figures and examples of the specification.

As shown in fig. 1-6, the canned motor rotor for a vacuum pump is a specific embodiment, and the present invention includes two heattransfer end faces 3 fixed on the front and rear end faces of the rotor; one heattransfer end face 3 is arranged on the front end face of the rotor, and the other heattransfer end face 3 is arranged on the rear end face of the rotor; each heattransfer end face 3 is in contact with athermoelectric conversion device 2, and thethermoelectric conversion devices 2 are electrically connected with the respective electromagneticwave emitting devices 1; the inner side of the stator (comprising the inner surface of the stator shielding sleeve and the inner surface of the end cover) is electroplated with a black chromium plating layer for increasing the absorption of radiation on the rotor side; a nickel protective layer is arranged between the plating layer and the plated piece to prevent the plating layer from cracking due to thermal expansion.

Preferably, the outer surface of the rotor is provided with a thermal radiation type barrier coating, a thermal reflection type barrier coating, for reducing absorption of radiation on the stator side.

Preferably, the heattransfer end face 3 is connected with the rotor end face through a welding mode; and the heattransfer end face 3 is provided with ahole 6 for the motor rotating shaft to pass through.

Preferably, the heattransfer end face 3 is fixed at the end face of therotor core 4 by welding, and the heattransfer end face 3 is made of a material which is neither magnetically conductive nor electrically conductive; thethermoelectric conversion device 2 is fixed on the outer surface of the heattransfer end face 3 by bonding or welding.

Preferably, the heattransfer end surface 3 is a disc structure, the disc structure is composed of a plurality of concentric rings, and two adjacent rings are made of materials with different specific heat capacities and heat conductivities. The specific heat capacity and the thermal conductivity of the two materials are greatly different, and an obvious thermal gradient can be formed in the process of absorbing heat.

Preferably, two adjacent circular rings of the heattransfer end surface 3 are bonded or welded, wherein one circular ring is made of heat-resistant glass 7, and the other circular ring is made ofstainless steel 8. The axial thickness of the disc is 5mm, and the annular width of each ring is 5-10 mm. And the maximum diameter of the disc does not exceed the diameter of therotor core 4.

Preferably, thethermoelectric conversion device 2 is composed of a plurality of concentric ring-shaped semiconductor thermoelectric devices 9, each semiconductor thermoelectric device 9 comprises two different semiconductors of P type and N type, the two semiconductors are connected through conducting strips, a heat conducting substrate is attached to the outer sides of the conducting strips, and the positive electrode and the negative electrode are led out through conducting wires.

Specifically, a layer ofceramic substrate 11 is arranged on the outer surface of the annular inner end surface and the outer surface of the annular outer end surface of the semiconductor thermoelectric device 9; theceramic substrate 11 on the inner end surface of each ring is bonded to one ring of the heat-conducting end surface, theceramic substrate 11 on the outer end surface of the ring is bonded to the other ring of the heat-conducting end surface, and the two rings are adjacent.

More specifically, the semiconductor thermoelectric device 9 includes a P-type semiconductor material 13 and an N-type semiconductor material 13 disposed between twoceramic substrates 11, the two are disposed at intervals, and two of the two are in a group, and are divided into: a first group S1, a plurality of middle groups (S2-Sp-1) and a tail group Sp.

The end part of the P-type semiconductor material 13 at one side of the first group and the end part of the N-type semiconductor material 13 are both connected with the same copper flow deflector and the samenickel barrier layer 12, the end part of the P-type semiconductor material 13 at the other side of the first group is connected with a lead and is led out to be used as a cathode, and the end part of the N-type semiconductor material 13 at the other side of the first group is connected with the end part of the P-type semiconductor material 13 at the same side of the adjacent middle group through the copper flow deflector; forming a pi-type structure.

The end part of the P-type semiconductor material 13 and the end part of the N-type semiconductor material 13 on one side of each middle group are both connected with the copper flow deflector and thenickel barrier layer 12 on which the P-type semiconductor material 13 and the N-type semiconductor material 13 are arranged, and the end part of the P-type semiconductor material 13 on the other side of each middle group is connected with the end part of the N-type semiconductor material 13 of the other group which is adjacent to the same side and on the same side through the same copper flow deflector and the same nickel barrier.

The end part of the P-type semiconductor material 13 at one side of the tail group and the end part of the N-type semiconductor material 13 are both connected with the same copper flow deflector and the samenickel barrier layer 12, and the end part of the P-type semiconductor material 13 at the other side of the tail group and the end part of the P-type semiconductor material 13 at the same side of the adjacent middle group are connected by the same copper flow deflector and the samenickel barrier layer 12; the end of the P-type semiconductor material 13 on the other side of the tail group is connected with a wire and is led out to be used as an anode, and a pi-type structure is formed.

A molybdenum-manganese metallization layer 10 is electroplated between the copper flow deflector andnickel barrier layer 12 and theceramic substrate 11; the leads of the respective ring-shaped semiconductor thermoelectric devices 9 are connected in series. The anode leads are mutually connected in series and led out, and the cathode leads are mutually connected in series and led out.

Preferably, the electromagneticwave emitting device 1, includes a plurality of patch typelight emitting diodes 15 welded on a circularPCB circuit board 14 in parallel, the outer diameter of thePCB circuit board 14 is not larger than the outer diameter of the motor rotor, and a hole is left in the middle, so as to facilitate the passing of the rotating shaft, and the frequency of the electromagnetic wave emitted by the (patch type)light emitting diodes 15 is the infrared ray or other heat ray wave bands beneficial to radiation absorption; the positive and negative electrodes of thethermoelectric conversion device 2 serve as a power source of the electromagneticwave emitting device 1 and are connected to the electromagneticwave emitting device 1. Namely, the positive and negative leads of thethermoelectric conversion device 2 are connected with the electromagneticwave emitting device 1 through the holes at the U + and U-positions. The electric energy of the thermoelectric conversion device is output through a lead and is connected in series with the input port of the electromagnetic wave emitting device.

Preferably, the other portions of thethermoelectric conversion device 2 than theceramic substrate 11 are not in contact with the heat-transfer end face 3.

Based on different temperatures of different positions on the end face of the rotor, in a closed loop formed by two different metals (or semiconductors), when the temperatures of two contact positions are different, a potential is generated in the loop, so that heat energy is converted into electric energy, the electric energy is converted into electromagnetic waves with certain frequency by using devices such as a light-emittingdiode 15 and the like, the frequency of the electromagnetic waves is easy to absorb by the stator side, and after the electromagnetic waves are absorbed by the stator side, the transmission of the energy from the rotor side to the stator side is completed, so that the temperature rise of the rotor is reduced, and the heat dissipation effect is achieved.

As shown in fig. 5, in the present embodiment, each ring of thethermoelectric conversion device 2 is arranged in order of the diameter size, the outer circle (outer end surface) and the inner circle (inner end surface) of the ring areceramic substrates 11, and theceramic substrates 11 on the inner circle and the outer circle are respectively bonded to two adjacent rings of different materials of the heattransfer end surface 3. Two kinds of the materials of the circular ring are heat-resistant glass 7 andstainless steel 8, and other parts of the thermoelectric conversion device except the ceramic substrate 11: the molybdenum-manganese metallization layer 10, the copper flow deflector and thenickel barrier layer 12, and the P-type and N-type semiconductor materials 13 are not in contact with the heattransfer end face 3.

In the above embodiments, in order to increase the heat transfer between the stator and the rotor, the inner layer of the stator and the surface of the rotor may be specially treated: in order to increase the efficiency of the radiation heat exchange of the rotor, special coatings can be added on the outer surface of the device and the surface of the rotor, and the coatings are required to have high emissivity and reflectivity and low absorptivity, and a composite coating of a heat radiation type isolation coating and a heat reflection type isolation coating is adopted in the embodiment; the addition of a coating on the inside of the stator to absorb the heat rays emitted by the rotor side with maximum efficiency requires that the coating have low emissivity and reflectivity, as well as high absorptivity. In the embodiment, the black chromium coating is electroplated on the inner side of the stator, and a nickel protective layer is added between the coating and a plated part to prevent the coating from cracking due to thermal expansion.

By the rotor heat conversion method and the rotor heat conversion device, partial heat energy of the rotor can be converted into radiation energy which can be absorbed by the stator side, so that the energy transfer from the rotor side to the stator side is increased, and the temperature rise of the rotor is reduced. The above embodiments are methods and devices for heat dissipation of a motor rotor for a vacuum pump, but are also applicable to heat dissipation of other motors and in vacuum environments.

It should be understood that the detailed description of the present invention is only for illustrating the present invention and is not limited by the technical solutions described in the embodiments of the present invention, and those skilled in the art should understand that the present invention can be modified or substituted equally to achieve the same technical effects; as long as the use requirements are met, the method is within the protection scope of the invention.

Claims (10)

Translated fromChinese

1.一种真空环境中电机转子的散热装置，其特征在于，包括固定于转子前、后两端面的两传热端面；一传热端面设置于转子前端面，另一传热端面设置于转子后端面；1. a heat dissipation device of a motor rotor in a vacuum environment, characterized in that it comprises two heat transfer end faces fixed on the front and rear end faces of the rotor; one heat transfer end face is arranged on the front end face of the rotor, and another heat transfer end face is arranged on the rotor rear face;每个传热端面均与一热电转换装置相接触，且热电转换装置与其各自的电磁波发射装置电连接；Each heat transfer end face is in contact with a thermoelectric conversion device, and the thermoelectric conversion device is electrically connected to its respective electromagnetic wave emitting device;定子内侧电镀有黑镀铬镀层，用于增加对转子侧辐射的吸收。The inside of the stator is plated with black chrome plating to increase the absorption of radiation on the rotor side.2.根据权利要求1所述的一种真空环境中电机转子的散热装置，其特征在于：转子外表面设置有双涂层：热辐射型隔离涂层、热反射型隔离涂层，用以减少对定子侧辐射的吸收。2. The heat dissipation device of a motor rotor in a vacuum environment according to claim 1, wherein the outer surface of the rotor is provided with a double coating: a heat radiation type isolation coating and a heat reflection type isolation coating, in order to reduce the Absorption of radiation on the stator side.3.根据权利要求1所述的一种真空环境中电机转子的散热装置，其特征在于：所述传热端面通过焊接方式与转子端面相连；所述传热端面上开设有用于电机转轴穿过的孔洞。3. The heat dissipation device of a motor rotor in a vacuum environment according to claim 1, wherein the heat transfer end face is connected to the rotor end face by welding; of holes.4.根据权利要求1所述的一种真空环境中电机转子的散热装置，其特征在于：所述传热端面通过焊接方式固定于转子铁心端面处，该传热端面选用既不导磁也不导电的材质，与转子端面只发生热量交换；所述热电转换装置通过粘结或焊接的方式固定于传热端面外表面。4. The heat dissipation device of a motor rotor in a vacuum environment according to claim 1, wherein the heat transfer end face is fixed at the end face of the rotor core by welding, and the heat transfer end face is selected to be neither magnetically conductive nor The conductive material only exchanges heat with the end face of the rotor; the thermoelectric conversion device is fixed on the outer surface of the heat transfer end face by means of bonding or welding.5.根据权利要求1所述的一种真空环境中电机转子的散热装置，其特征在于：所述传热端面为一圆盘结构，该圆盘结构由多个同心圆环构成，且相邻两圆环采用两种比热容、热导率均不同的材质。5 . The heat dissipation device of a motor rotor in a vacuum environment according to claim 1 , wherein the heat transfer end surface is a disc structure, and the disc structure is composed of a plurality of concentric rings, and adjacent to each other. 6 . The two rings are made of two materials with different specific heat capacity and thermal conductivity.6.根据权利要求5所述的一种真空环境中电机转子的散热装置，其特征在于：传热端面相邻的两圆环粘结连接或焊接连接；其中，一圆环材质为耐热玻璃，另一圆环的材质为不锈钢。6 . The heat dissipation device of a motor rotor in a vacuum environment according to claim 5 , wherein two rings adjacent to the heat transfer end face are connected by bonding or welding; wherein, one ring is made of heat-resistant glass. 7 . , and the other ring is made of stainless steel.7.根据权利要求6所述的一种真空环境中电机转子的散热装置，其特征在于：所述热电转换装置由多个同心的环形半导体热电器件构成，每个半导体热电器件包括P型和N型两种不同的半导体，将两种半导体通过导电片连接起来，导电片外侧贴有导热基底，正负极通过导线引出。7 . The heat dissipation device for a motor rotor in a vacuum environment according to claim 6 , wherein the thermoelectric conversion device is composed of a plurality of concentric annular semiconductor thermoelectric devices, and each semiconductor thermoelectric device includes P-type and N-type semiconductor thermoelectric devices. 8 . Type two different semiconductors, the two semiconductors are connected through a conductive sheet, the outer side of the conductive sheet is pasted with a thermally conductive base, and the positive and negative electrodes are drawn out through wires.8.根据权利要求7所述的一种真空环境中电机转子的散热装置，其特征在于：所述半导体热电器件环形的内端面外表面及外端面外表面均设置有一层陶瓷基底；每一环形的内端面的陶瓷基底粘结于导热端面的一圆环上，该环形的外端面的陶瓷基底粘结于导热端面的另一圆环上，且两圆环位置相邻；8 . The heat dissipation device of a motor rotor in a vacuum environment according to claim 7 , wherein the outer surface of the inner end surface and the outer surface of the outer end surface of the semiconductor thermoelectric device are provided with a layer of ceramic substrates; The ceramic base of the inner end face is bonded to a ring of the heat-conducting end face, and the ceramic base of the outer end face of the ring is bonded to another ring of the heat-conducting end face, and the two rings are adjacent in position;所述半导体热电器件包括设置于两陶瓷基底间的P型半导体材料、N型半导体材料，两者间隔设置、两两为一组，按顺序分为：首组S1、多个中间组S2～Sp-1、尾组Sp；The semiconductor thermoelectric device includes a P-type semiconductor material and an N-type semiconductor material arranged between two ceramic substrates, the two are arranged at intervals, and each pair is a group, and is divided into a first group S1 and a plurality of intermediate groups S2 to Sp in order. -1, tail group Sp;首组一侧的P型半导体材料端部、N型半导体材料端部均与同一铜导流片及镍阻挡层连接，首组另一侧的P型半导体材料端部与导线连接并引出作为负极，首组另一侧的N型半导体材料与相邻中间组同侧的P型半导体材料端部以一铜导流片及镍阻挡层连接；形成π型结构；The end of the P-type semiconductor material and the end of the N-type semiconductor material on one side of the first group are connected to the same copper guide plate and nickel barrier layer, and the end of the P-type semiconductor material on the other side of the first group is connected to the wire and drawn out as a negative electrode , the N-type semiconductor material on the other side of the first group is connected with the end of the P-type semiconductor material on the same side of the adjacent middle group by a copper guide plate and a nickel barrier layer; a π-type structure is formed;每个中间组一侧的P型半导体材料端部、N型半导体材料端部均与其所在的铜导流片及镍阻挡层连接，中间组另一侧的P型半导体材料端部与同侧的、位置毗邻的其它组的N型半导体材料端部以同一铜导流片及镍阻挡层连接，形成π型结构；The end of the P-type semiconductor material and the end of the N-type semiconductor material on one side of each middle group are connected to the copper guide plate and the nickel barrier layer where they are located, and the end of the P-type semiconductor material on the other side of the middle group is connected to the same side. , The ends of other groups of N-type semiconductor materials adjacent to each other are connected with the same copper guide plate and nickel barrier layer to form a π-type structure;尾组一侧的P型半导体材料端部、N型半导体材料端部均与同一铜导流片及镍阻挡层连接，尾组另一侧的N型半导体材料与相邻中间组同侧的P型半导体材料端部以同一铜导流片及镍阻挡层连接；尾组另一侧的P型半导体材料端部与导线连接并引出作为正极，形成π型结构；The end of the P-type semiconductor material and the end of the N-type semiconductor material on one side of the tail group are connected to the same copper guide plate and nickel barrier layer, and the N-type semiconductor material on the other side of the tail group is connected to the P-type semiconductor material on the same side of the adjacent middle group. The end of the P-type semiconductor material is connected with the same copper guide plate and the nickel barrier layer; the end of the P-type semiconductor material on the other side of the tail group is connected with the wire and drawn out as a positive electrode, forming a π-type structure;铜导流片及镍阻挡层与陶瓷基底之间电镀有一层钼锰金属化层；各个环形半导体热电器件的引线采取串联的方式连接；除陶瓷基底外，热电转换装置的其他部分不与传热端面接触。A molybdenum-manganese metallization layer is electroplated between the copper guide plate, the nickel barrier layer and the ceramic substrate; the leads of each annular semiconductor thermoelectric device are connected in series; except for the ceramic substrate, other parts of the thermoelectric conversion device are not connected to the heat transfer device. face contact.9.根据权利要求8所述的一种真空环境中电机转子的散热装置，其特征在于：所述电磁波发射装置，包括相互并联连接、焊接在圆形的PCB电路板上的多个发光二极管，PCB电路板的外径不大于电机转子外径，并且中间留有孔洞，便于转轴的通过，发光二极管发出的电磁波频率为有利于辐射吸收的红外线或者其他热射线波段；热电转换装置的正、负极作为电磁波发射装置的电源，与电磁波发射装置相连。9 . The heat dissipation device of a motor rotor in a vacuum environment according to claim 8 , wherein the electromagnetic wave emission device comprises a plurality of light emitting diodes connected in parallel with each other and welded on a circular PCB circuit board, 10 . The outer diameter of the PCB circuit board is not larger than the outer diameter of the motor rotor, and there are holes in the middle to facilitate the passage of the rotating shaft. The frequency of the electromagnetic waves emitted by the light-emitting diodes is infrared or other heat ray bands that are conducive to radiation absorption; the positive and negative electrodes of the thermoelectric conversion device As the power source of the electromagnetic wave transmitting device, it is connected with the electromagnetic wave transmitting device.10.根据权利要求1所述的一种真空环境中电机转子的散热装置的散热方法，其特征在于：根据转子端面上不同位置的温度不同，利用两种不同的金属或半导体组成的闭合回路中，当两接触处的温度不同时，回路中会产生一个电势，从而将热能转化为电能；利用发光二极管，将该电能转换成一定频率的电磁波，其频率易于定子侧对电磁波的吸收，定子侧吸收掉该电磁波后，完成能量从转子侧到定子侧的传递，进而降低转子温升，起到散热的作用。10. The heat dissipation method of the heat dissipation device of the motor rotor in a vacuum environment according to claim 1, characterized in that: according to the different temperatures at different positions on the end face of the rotor, a closed loop composed of two different metals or semiconductors is used. , when the temperature of the two contacts is different, an electric potential will be generated in the loop, thereby converting thermal energy into electrical energy; using light-emitting diodes, the electrical energy is converted into electromagnetic waves of a certain frequency, the frequency of which is easy for the stator side to absorb electromagnetic waves, and the stator side After absorbing the electromagnetic wave, the transfer of energy from the rotor side to the stator side is completed, thereby reducing the temperature rise of the rotor and playing the role of heat dissipation.

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