Liquid cooling plate integrated with heat conduction and heat insulation layersTechnical Field
The invention relates to the technical field of battery heat dissipation, in particular to a liquid cooling plate integrated with a heat conduction and heat insulation layer.
Background
Electric vehicles belong to one of new energy vehicles, and are now receiving more and more attention. In an electric vehicle, a power battery is a core element thereof, and the charge and discharge efficiency of the power battery is directly related to the performance of the electric vehicle, and is affected by temperature because the power battery is generally a mutual conversion of chemical energy and electric energy.
The power battery can generate a large amount of heat in the working process, if the heat cannot be rapidly and effectively dissipated, the temperature of the power battery can be increased, if the increased temperature exceeds a reasonable temperature range (for example, 25-45 ℃), the efficiency and the service life of the power battery can be reduced, and thermal runaway can be caused when the temperature is serious, so that safety accidents such as battery ignition and even explosion and the like are caused. Therefore, the electric vehicle is required to pay close attention to the cooling process of the power battery in use. Because of the characteristics of the battery, the low-temperature charging of the vehicle and the low-temperature starting are limited, the heat preservation performance of the battery directly determines the performance of the vehicle at low temperature. The liquid cooling plate is widely used as a high-efficiency heat exchange device for controlling the temperature of a battery pack, including heat dissipation and heating.
The ordinary liquid cooling board is mostly sheet metal construction, because panel beating itself inherent characteristics, the roughness of liquid cooling board surface just hardly guarantees, and some jumbo size's cold board flatness reaches a few millimeters even, and the clearance that forms because of the level on board surface can cause very big thermal resistance and then greatly reduced cold board's radiating efficiency and ability, in order to guarantee that electric core calorific capacity can effectually be conducted to the liquid cooling board and exchange away, must fill the clearance. At present, a conventional method is to place a heat conducting gasket between a battery module and a liquid cooling plate, on one hand, the heat conducting gasket is used as a sheet material, the heat conducting gasket cannot be completely attached to the liquid cooling plate, the heat dissipation efficiency and the heat dissipation capacity are reduced during the interval, and on the other hand, the heat conducting gasket needs to be fixed to the surface of the liquid cooling plate in an adhesive mode, so that the process is complex and is not beneficial to automation.
Disclosure of Invention
The invention aims at the defects in the prior art and provides a liquid cooling plate integrated with a heat conduction and insulation layer.
In order to achieve the above purpose, the invention provides the following technical scheme:
the utility model provides a liquid cooling board of integrated heat conduction and insulating layer, includes the liquid cooling board main part, the up end of liquid cooling board main part is equipped with the heat-conducting layer, the heat-conducting layer is the gluing agent, and the gluing agent bonds the solidification with the up end of liquid cooling board main part and is connected, the lower terminal surface of liquid cooling board main part is equipped with the insulating layer, the lower terminal surface at liquid cooling board main part (2) is fixed in insulating layer (3), the one end of liquid cooling board main part is equipped with the drain bar, be equipped with the drain pipe on the drain bar, the other end of liquid cooling board main part is equipped with the feed liquor board, be equipped with the feed liquor pipe on the feed liquor board.
Preferably, the heat insulation layer (3) is fixed on the lower end surface of the liquid cooling plate main body (2) through an in-situ foaming process or an adhesion mode.
Preferably, the thickness of the heat conducting layer is 0.1-10mm.
Preferably, the thickness of the heat conducting layer is 1-5mm.
Preferably, the heat insulation layer is of a porous structure, and is made of one of polyurethane foam, silicon foam, aerogel, foaming rubber, foaming polyethylene, foaming case-breaking polypropylene, foaming polystyrene and foaming ethylene-vinyl acetate copolymer; the heat conducting layer is made of one of heat conducting silica gel, heat conducting polyurethane gel, heat conducting acrylic ester gel, heat conducting epoxy gel or other adhesives with high heat conductivity coefficient.
Preferably, the thickness of the heat insulation layer is 0.5-15mm.
Preferably, the thickness of the heat insulation layer is 3-10mm.
Preferably, the middle part both sides of liquid cooling board body are equipped with the mounting groove, the middle part of heat conduction layer is equipped with the last mating groove with the mounting groove complex, the middle part of insulating layer is equipped with the lower mating groove with the mounting groove complex.
Preferably, one end of the liquid cooling plate body is a liquid inlet distribution area, the other end of the liquid cooling plate body is a liquid outlet collection area, the liquid inlet distribution area is communicated with the liquid inlet plate, the liquid outlet collection area is communicated with the liquid outlet plate, a plurality of parallel channel separation plates are arranged between the liquid inlet distribution area and the liquid outlet collection area, and a main channel is arranged between the channel separation plates.
Preferably, a flow equalizing plate is arranged in the liquid inlet flow dividing region, an auxiliary flow passage is arranged below the main flow passage, a liquid inlet is arranged in the liquid inlet flow dividing region, a liquid outlet is arranged in the liquid outlet collecting region, and the liquid inlet and the liquid outlet are both communicated with the auxiliary flow passage.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the liquid cooling plate integrated with the heat conducting layer, the heat conducting layer is directly solidified and formed on the surface of the liquid cooling plate main body, so that the gap between the heat conducting gasket and the surface of the liquid cooling plate is eliminated, the heat radiating efficiency and the heat radiating capability of the liquid cooling plate are improved, the working procedures of an assembly plant are reduced, and the efficiency is improved.
2. The heat insulation layer is directly foamed, solidified and formed on the surface of the liquid cooling plate, so that the heat loss of the non-working surface of the liquid cooling plate is reduced, the heat dissipation efficiency and the heat dissipation capacity are improved, the working procedures of an assembly plant are reduced, the efficiency is improved, and the cost is reduced.
3. The surface structures of the heat conduction layer and the heat insulation layer are the same as those of the liquid cooling plate body, so that the installation and the use of the liquid cooling plate are not affected, and the use is convenient.
4. According to the invention, the flow equalizing plate is added in the liquid inlet flow dividing region, so that the internal refrigeration liquid can be subjected to flow equalizing distribution, the heat dissipation effect of the liquid cooling plate body is more uniform and reliable, and the cooling effect and cooling efficiency of the battery are improved.
5. The auxiliary flow channel is arranged below the main flow channel, so that on one hand, the flow speed and the flow quantity can be increased, the heat dissipation speed and the heat dissipation efficiency can be improved, on the other hand, the heat dissipation area can be increased, the heat exchange quantity of liquid in unit area can be improved, and the heat dissipation effect can be improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is an exploded view of the present invention;
FIG. 3 is a top view of the internal structure of the liquid cooling plate;
FIG. 4 is a schematic diagram of a vertical cross-section of a liquid cooling plate;
fig. 5 is an enlarged view at a of fig. 4.
In the figure: 1-a heat conducting layer; 101-upper mating groove; 2-a liquid cooling plate body; 201-a liquid outlet pipe; 202-a liquid outlet plate; 203-a liquid inlet pipe; 204-a liquid inlet plate; 205-a liquid collection area; 206, a liquid outlet; 207-lane-dividing plate; 208-a primary flowpath; 209-mounting groove; 210-a liquid inlet; 211-a liquid inlet split area; 212-a flow equalization plate; 213-auxiliary flow channels; 3-a heat insulation layer; 301-lower mating groove.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1-5, a liquid cooling plate integrated with heat conduction and heat insulation layers comprises a liquid cooling plate main body 2, wherein a heat conduction layer 1 is arranged on the upper end face of the liquid cooling plate main body 2, the thickness of the heat conduction layer 1 is 0.1-10mm, the optimal thickness is 1-5mm, the heat conduction layer 1 is an adhesive, the heat conduction layer 1 is made of one of heat conduction silica gel, heat conduction polyurethane gel, heat conduction acrylic ester gel, heat conduction epoxy gel or other adhesives with high heat conduction coefficients, the adhesive is bonded and solidified with the upper end face of the liquid cooling plate main body 2, the lower end face of the liquid cooling plate main body 2 is provided with a heat insulation layer 3, the heat insulation layer 3 is fixed at the lower end of the liquid cooling plate main body 2 through an in-situ foaming process, the heat insulation layer 3 is of a porous structure, the thickness of the heat insulation layer 3 is 0.5-15mm, the optimal thickness of the heat insulation layer 3-10mm, and the heat insulation layer 3 is of a porous structure, and the heat insulation layer is made of one of polyurethane foam, silicon foam, aerogel, foaming rubber, foaming polyethylene, foaming pattern polypropylene, foaming vinyl acetate and foaming vinyl acetate copolymer. One end of the liquid cooling plate main body 2 is provided with a liquid outlet plate 202, the liquid outlet plate 202 is provided with a liquid outlet pipe 201, the other end of the liquid cooling plate main body 2 is provided with a liquid inlet plate 204, and the liquid inlet plate 204 is provided with a liquid inlet pipe 203.
The middle part both sides of liquid cooling board body 2 are equipped with mounting groove 209, the middle part of heat conduction layer 1 be equipped with mounting groove 209 complex go up the cooperation groove 101, the middle part of insulating layer 3 be equipped with mounting groove 209 complex lower cooperation groove 301.
The inside one end of liquid cooling board body 2 is feed liquor reposition of redundant personnel district 211, and the other end is the liquid and gathers district 205, feed liquor reposition of redundant personnel district 211 and feed liquor board 204 intercommunication, liquid gathers district 205 and goes out liquid board 202 intercommunication, be equipped with a plurality of parallel lane boards 207 between feed liquor reposition of redundant personnel district 211 and the liquid and gather district 205, be sprue 208 between the lane boards 207, be equipped with flow equalizing plate 212 in the feed liquor reposition of redundant personnel district 211, the below of sprue 208 is equipped with auxiliary flow channel 213, be equipped with inlet 210 in the feed liquor reposition of redundant personnel district 211, be equipped with liquid outlet 206 in the liquid gathers district 205, inlet 210 and liquid outlet 206 all communicate with auxiliary flow channel 213.
When in use, the cooling medium enters the liquid inlet plate 204 from the liquid inlet pipe 203, flows into the liquid inlet diversion area 211, uniformly flows into the main runner 208 under the action of the flow equalizing plate 212, and simultaneously, part of the cooling medium flows into the auxiliary runner 213 from the liquid inlet 201, is collected in the liquid outlet collection area 205, and finally flows out from the liquid outlet pipe 201. The heat conducting layer is directly solidified and formed on the surface of the water cooling plate, so that the gap between the heat conducting gasket and the surface of the liquid cooling plate is eliminated, the heat radiating efficiency and the heat radiating capacity of the liquid cooling plate are improved, meanwhile, the procedures of an assembly plant are reduced, and the efficiency is improved; the heat insulation layer is directly solidified and formed on the surface of the liquid cooling plate, so that the heat loss of the non-working surface of the liquid cooling plate is reduced, the heat dissipation efficiency and the heat dissipation capacity are improved, meanwhile, the working procedures of an assembly plant are reduced, the efficiency is improved, and the cost is reduced; the surface structures of the heat conduction layer and the heat insulation layer are the same as those of the liquid cooling plate body, so that the installation and the use of the liquid cooling plate are not affected, and the use is convenient; the flow equalizing plate is added in the liquid inlet flow dividing region, so that the internal refrigeration liquid can be subjected to flow equalizing distribution, the heat dissipation effect of the liquid cooling plate body is more uniform and reliable, and the cooling effect and the cooling efficiency of the battery are improved; the auxiliary flow channel is arranged below the main flow channel, so that on one hand, the flow speed and the flow quantity can be increased, the heat dissipation speed and the heat dissipation efficiency can be improved, on the other hand, the heat dissipation area can be increased, the heat exchange quantity of liquid in unit area can be increased, and the heat dissipation effect can be improved.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.