技术领域technical field
本发明涉及显示技术领域，尤其涉及显示面板及其制作方法、显示装置、掩膜版组件。The invention relates to the field of display technology, in particular to a display panel, a manufacturing method thereof, a display device, and a mask assembly.
背景技术Background technique
有机发光二极管(Organic Light Emitting Diode，OLED)作为一种电流型发光器件，因其所具有的自发光、快速响应、宽视角和可制作在柔性衬底上等特点而越来越多地被应用于高性能显示领域当中。OLED按驱动方式可分为PMOLED(Passive Matrix DrivingOLED，无源矩阵驱动有机发光二极管)和AMOLED(Active Matrix Driving OLED，有源矩阵驱动有机发光二极管)两种，由于AMOLED显示器具有低制造成本、高应答速度、省电、可用于便携式设备的直流驱动、工作温度范围大等等优点而可望成为取代LCD(liquid crystaldisplay,液晶显示器)的下一代新型平面显示器。Organic Light Emitting Diode (OLED), as a current-mode light-emitting device, is increasingly being used because of its characteristics such as self-luminescence, fast response, wide viewing angle and the ability to be fabricated on flexible substrates. In the field of high-performance display. OLED can be divided into PMOLED (Passive Matrix Driving OLED, passive matrix driving organic light emitting diode) and AMOLED (Active Matrix Driving OLED, active matrix driving organic light emitting diode) according to the driving method. Because AMOLED display has low manufacturing cost and high response Due to the advantages of speed, power saving, DC drive available for portable devices, and wide operating temperature range, it is expected to become the next generation of new flat-panel displays replacing LCD (liquid crystal display, liquid crystal display).
为了在OLED显示装置中集成触控功能，可以采用In-Cell(内嵌)技术。该In-Cell技术分别为复合内嵌式(Hybrid In-Cell，HIC)和全内嵌式(Full In-Cell，FIC)。相对于HIC结构而言，FIC结构更加简单。现有技术中，FIC结构具有多个同层设置的触控电极，与所述触控电极相连接的触控走线和所述触控电极同层设置。在此情况下，当显示装置的尺寸较大，且触控精度较高时，触控电极和触控走线的数量也会增加，这样一来，多个触控走线所在的位置占用的显示空间较大，从而产生触控盲区。In order to integrate a touch function in an OLED display device, an In-Cell (embedded) technology may be used. The In-Cell technologies are respectively hybrid in-cell (Hybrid In-Cell, HIC) and full in-cell (Full In-Cell, FIC). Compared with the HIC structure, the FIC structure is simpler. In the prior art, the FIC structure has a plurality of touch electrodes arranged on the same layer, and the touch traces connected to the touch electrodes are arranged on the same layer as the touch electrodes. In this case, when the size of the display device is large and the touch precision is high, the number of touch electrodes and touch traces will also increase. The display space is large, resulting in a touch blind area.
发明内容Contents of the invention
本发明的实施例提供显示面板及其制作方法、显示装置、掩膜版组件，用于解决触控走线占用较大的显示空间，导致产生触控盲区的问题。Embodiments of the present invention provide a display panel, a manufacturing method thereof, a display device, and a mask assembly, which are used to solve the problem that touch traces occupy a large display space and cause touch blind areas.
为达到上述目的，本发明的实施例采用如下技术方案：In order to achieve the above object, embodiments of the present invention adopt the following technical solutions:
本申请实施例的一方面，提供一种显示面板，包括TFT背板以及位于所述TFT背板上的触控走线和有机功能层；所述有机功能层具有多个过孔，每个所述过孔露出所述触控走线的一部分；所述显示面板还包括覆盖所述有机功能层的第一电极层；所述第一电极层包括多个相互绝缘的自电容电极；每个所述自电容电极与一个所述过孔露出的所述触控走线相接触。In one aspect of the embodiments of the present application, a display panel is provided, including a TFT backplane, touch wiring and an organic functional layer located on the TFT backplane; the organic functional layer has a plurality of via holes, each of which The via hole exposes a part of the touch trace; the display panel also includes a first electrode layer covering the organic functional layer; the first electrode layer includes a plurality of self-capacitance electrodes insulated from each other; each of the The self-capacitance electrode is in contact with the touch trace exposed by one of the via holes.
在本申请的一些实施例中，所述过孔的孔壁与所述触控走线之间具有绝缘层。In some embodiments of the present application, there is an insulating layer between the hole wall of the via hole and the touch trace.
在本申请的一些实施例中，所述显示面板还包括位于所述TFT背板上的绝缘隔离柱；所述绝缘隔离柱设置于相邻两个自电容电极之间，所述绝缘隔离柱用于对所述相邻的两个自电容电极进行绝缘。In some embodiments of the present application, the display panel further includes an insulating isolation column on the TFT backplane; the insulating isolation column is arranged between two adjacent self-capacitance electrodes, and the insulating isolation column is used for Insulating the two adjacent self-capacitance electrodes.
在本申请的一些实施例中，所述绝缘隔离柱包括层叠设置的第一子隔离柱和第二子隔离柱；所述第一子隔离柱靠近所述TFT背板，所述第一子隔离柱垂直截面的形状为梯形；所述第二子隔离柱远离所述TFT背板，所述第二子隔离柱垂直截面的形状为倒梯形；所述垂直界面与所述TFT背板垂直。In some embodiments of the present application, the insulating isolation column includes a first sub-isolation column and a second sub-isolation column stacked; the first sub-isolation column is close to the TFT backplane, and the first sub-isolation column The vertical section of the column is trapezoidal; the second sub-isolating column is far away from the TFT backplane, and the vertical section of the second sub-isolating column is an inverted trapezoid; the vertical interface is perpendicular to the TFT backplane.
在本申请的一些实施例中，所述TFT背板包括衬底基板、位于所述衬底基板上的驱动电路结构以及覆盖所述驱动电路结构的像素界定层；所述触控走线位于所述像素界定层背离所述衬底基板的一侧表面。In some embodiments of the present application, the TFT backplane includes a base substrate, a driving circuit structure on the base substrate, and a pixel defining layer covering the driving circuit structure; The pixel defining layer is away from the side surface of the base substrate.
在本申请的一些实施例中，所述显示面板包括绝缘隔离柱；所述绝缘隔离柱以及所述触控走线，位于所述像素界定层背离所述衬底基板的一侧表面。In some embodiments of the present application, the display panel includes insulating isolation columns; the insulating isolation columns and the touch traces are located on the side surface of the pixel defining layer away from the base substrate.
在本申请的一些实施例中，所述显示面板还包括位于所述有机功能层靠近所述衬底基板一侧的第二电极；所述像素界定层包括横纵交叉的像素分隔物以及由所述像素分隔物围设的开口；所述第二电极位于所述开口内；所述有机功能层包括有机发光层，所述有机发光层位于所述开口内。In some embodiments of the present application, the display panel further includes a second electrode located on the side of the organic functional layer close to the base substrate; The opening surrounded by the pixel separator; the second electrode is located in the opening; the organic functional layer includes an organic light emitting layer, and the organic light emitting layer is located in the opening.
本申请实施例的另一方面，提供一种对上述任意一种显示面板的制作方法，所述方法包括制作TFT背板的方法；所述方法还包括：在所述TFT背板上制作触控走线；在制作有所述触控走线的所述TFT背板上形成有机功能层；形成所述有机功能层中的一层有机薄膜层的方法包括：采用第一掩膜版，在制作有所述触控走线的所述TFT背板上蒸镀有机材料；采用第二掩膜版，在蒸镀有所述有机材料的所述TFT背板上，再次蒸镀所述有机材料；其中，所述第一掩膜版和所述第二掩膜版叠加后，所述第一掩膜版的第一遮挡部和所述第二掩膜版的第二遮挡部具有重叠区；所述TFT背板上与所述重叠区对应的位置未蒸镀所述有机材料，形成位于所述有机功能层上形成过孔；所述过孔露出所述触控走线的一部分；在制作有所述有机功能层和所述触控走线的所述TFT背板上，形成多个相互绝缘的自电容电极，每个所述自电容电极与一个所述过孔露出的所述触控走线相接触。Another aspect of the embodiment of the present application provides a method for manufacturing any one of the above-mentioned display panels, the method includes a method for manufacturing a TFT backplane; the method further includes: making a touch panel on the TFT backplane wiring; forming an organic functional layer on the TFT backplane with the touch wiring; the method for forming an organic thin film layer in the organic functional layer includes: using a first mask plate, Evaporating an organic material on the TFT backplane with the touch traces; using a second mask to evaporate the organic material again on the TFT backplane on which the organic material is evaporated; Wherein, after the first mask and the second mask are superimposed, the first shielding portion of the first mask and the second shielding portion of the second mask have an overlapping area; The position corresponding to the overlapping area on the TFT backplane is not vapor-deposited with the organic material, forming a via hole on the organic functional layer; the via hole exposes a part of the touch wiring; A plurality of self-capacitance electrodes insulated from each other are formed on the TFT backplane of the organic functional layer and the touch trace, and each self-capacitance electrode is connected to the touch trace exposed by one of the via holes. The lines are in contact.
本申请实施例的另一方面，提供一种如上所述的显示面板的制作方法中采用的掩膜版组件，所述掩膜版组件包括第一掩膜版和第二掩膜版；所述第一掩膜版具有多个第一遮挡部和第一透过部，所述第一遮挡部与所述第一透过部交替设置；所述第一遮挡部包括主遮挡部和位于所述主遮挡部上的多个凸起的子遮挡部；所述第二掩膜版具有多个第二遮挡部和第二透过部，所述第二遮挡部与所述第二透过部交替设置；所述第一掩膜版和所述第二掩膜版叠加后，所述第一遮挡部中的主遮挡部与所述第二透过部的位置相对应；所述第一遮挡部中的子遮挡部与所述第二遮挡部具有重叠区。Another aspect of the embodiments of the present application provides a mask assembly used in the method for manufacturing a display panel as described above, the mask assembly includes a first mask and a second mask; The first mask plate has a plurality of first shielding parts and first transmission parts, and the first shielding parts and the first transmission parts are arranged alternately; the first shielding part includes a main shielding part and a a plurality of raised sub-shielding parts on the main shielding part; the second reticle has a plurality of second shielding parts and second transparent parts, and the second shielding parts alternate with the second transparent parts Setting; after the first mask and the second mask are superimposed, the main shielding part in the first shielding part corresponds to the position of the second transmission part; the first shielding part The sub-shielding portion in the middle has an overlapping area with the second shielding portion.
本申请实施例的另一方面，提供一种显示装置，包括如上所述的任意一种显示面板。Another aspect of the embodiments of the present application provides a display device, including any one of the above-mentioned display panels.
综上所述，本申请实施例提供的显示面板中，实现触控功能的一个自电容电极与有机功能层上的一个过孔露出的触控走线相接触，因此触控走线可以位于自电容电极的下方，即位于自电容电极靠近衬底基板的一侧，使得触控走线和与该触控走线电连接的自电容电极异层设置。这样一来，可以避免触控走线与自电容电极同层设置时，触控走线占据较大的显示空间，导致出现触控盲区的问题。To sum up, in the display panel provided by the embodiment of the present application, a self-capacitance electrode that realizes the touch function is in contact with a touch trace exposed through a via hole on the organic functional layer, so the touch trace can be located in the self-capacitance Below the capacitive electrodes, that is, on the side of the self-capacitive electrodes close to the base substrate, the touch traces and the self-capacitance electrodes electrically connected to the touch traces are arranged in different layers. In this way, when the touch traces and the self-capacitance electrodes are arranged on the same layer, the touch traces occupy a larger display space, resulting in the problem of touch blind areas.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.
图1为本申请的一些实施例提供一种显示面板的结构示意图；FIG. 1 is a schematic structural diagram of a display panel provided by some embodiments of the present application;
图2为本申请的一些实施例提供另一种显示面板的结构示意图；FIG. 2 is a schematic structural diagram of another display panel provided by some embodiments of the present application;
图3为图2中像素界定层的具体结构示意图；FIG. 3 is a schematic diagram of a specific structure of a pixel defining layer in FIG. 2;
图4为图2中有机功能层的结构示意图；Fig. 4 is the structural representation of the organic functional layer in Fig. 2;
图5为本申请的一些实施例提供的一种触控电极的结构示意图；FIG. 5 is a schematic structural diagram of a touch electrode provided by some embodiments of the present application;
图6为本申请的一些实施例提供的一种触控电极与触控引线的连接示意图；FIG. 6 is a schematic diagram of a connection between a touch electrode and a touch lead provided in some embodiments of the present application;
图7为本申请的一些实施例提供的另一种触控电极与触控引线的连接示意图；FIG. 7 is a schematic diagram of another connection between touch electrodes and touch leads provided in some embodiments of the present application;
图8为本申请的一些实施例提供另一种显示面板的结构示意图；FIG. 8 is a schematic structural diagram of another display panel provided by some embodiments of the present application;
图9为本申请的一些实施例提供的一种绝缘隔离柱的结构示意图；FIG. 9 is a schematic structural diagram of an insulating isolation column provided by some embodiments of the present application;
图10为本申请的一些实施例提供的一种显示面板的结构示意图；FIG. 10 is a schematic structural diagram of a display panel provided by some embodiments of the present application;
图11为本申请的一些实施例提供的一种显示面板的结构示意图；Fig. 11 is a schematic structural diagram of a display panel provided by some embodiments of the present application;
图12为本申请实施例提供的一种显示面板的制作方法流程图；FIG. 12 is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;
图13a、图13b、图13c以及图13d为图12中制作方法中部分步骤对应的结构示意图；Fig. 13a, Fig. 13b, Fig. 13c and Fig. 13d are structural schematic diagrams corresponding to some steps in the manufacturing method in Fig. 12;
图14a为本申请的一些实施例提供的一种掩膜版的结构示意图；Fig. 14a is a schematic structural diagram of a mask provided by some embodiments of the present application;
图14b为本申请的一些实施例提供的一种掩膜版的结构示意图；Fig. 14b is a schematic structural diagram of a mask provided by some embodiments of the present application;
图14c为图14a和图14b所示的掩膜版叠加后形成的重叠区的示意图；Fig. 14c is a schematic diagram of the overlapping area formed after the masks shown in Fig. 14a and Fig. 14b are superimposed;
图14d为图14a和图14b所示的掩膜版叠加示意图；Fig. 14d is a schematic diagram of superposition of the masks shown in Fig. 14a and Fig. 14b;
图15为本申请的一些实施例提供另一种显示面板的结构示意图。FIG. 15 is a schematic structural diagram of another display panel according to some embodiments of the present application.
附图标记：Reference signs:
01-显示面板；10-TFT背板；100-衬底基板；101-驱动电路结构；102-像素界定层；1021-开口；1022-像素分隔物；110-第一电极层；111-第二电极第一电极层；20-触控走线；30-有机功能层；301-空穴注入层；302-空穴传输层；303-有机发光层；304-电子传输层；310-过孔；40-自电容电极；50-绝缘层；60-绝缘隔离柱；601-第一子隔离柱；602-第二子隔离柱；70-第一掩膜版；701-第一遮挡部；7011-主遮挡部；7012-子遮挡部；702-第一透过部；71-第二掩膜版；711-第二遮挡部；712-第二透过部；72-重叠区；80-封装部；801-无机薄膜层；802-有机薄膜层。01-display panel; 10-TFT backplane; 100-substrate substrate; 101-drive circuit structure; 102-pixel definition layer; 1021-opening; 1022-pixel separator; 110-first electrode layer; 111-second Electrode first electrode layer; 20-touch trace; 30-organic functional layer; 301-hole injection layer; 302-hole transport layer; 303-organic light-emitting layer; 304-electron transport layer; 310-via hole; 40-Self-capacitance electrode; 50-Insulation layer; 60-Insulation isolation column; 601-First sub-isolation column; 602-Second sub-isolation column; 70-First mask plate; 701-First shielding part; 7011- Main shielding part; 7012-sub-shielding part; 702-first transmission part; 71-second mask; 711-second shielding part; 712-second transmission part; 72-overlapping area; 80-encapsulation part ; 801-inorganic thin film layer; 802-organic thin film layer.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
本申请的一些实施例公开一种显示面板01，如图1所示，该显示面板01包括TFT背板10以及位于上述TFT背板10上的触控走线20和有机功能层30。Some embodiments of the present application disclose a display panel 01 . As shown in FIG. 1 , the display panel 01 includes a TFT backplane 10 , and a touch trace 20 and an organic functional layer 30 located on the TFT backplane 10 .
如图2所示，上述TFT背板10包括衬底基板100、位于衬底基板100上的驱动电路结构101。该驱动电路结构101包括阵列排布的TFT驱动电路以及覆盖驱动电路结构101的像素界定层102。As shown in FIG. 2 , the TFT backplane 10 includes a base substrate 100 and a driving circuit structure 101 located on the base substrate 100 . The driving circuit structure 101 includes TFT driving circuits arranged in an array and a pixel defining layer 102 covering the driving circuit structure 101 .
显示面板具有多个阵列排布的亚像素，每个亚像素中设置有一个上述TFT驱动电路。该TFT驱动电路包括多个TFT以及电容。每个TFT驱动电路连接有一个发光器件，以构成像素电路。上述发光器件可以为OLED、LED或者微型LED。以下为了方便说明，上述发光器件是以OLED为例进行的说明。The display panel has a plurality of sub-pixels arranged in an array, and each sub-pixel is provided with one of the above-mentioned TFT driving circuits. The TFT driving circuit includes a plurality of TFTs and capacitors. Each TFT driving circuit is connected with a light emitting device to form a pixel circuit. The above-mentioned light-emitting device can be OLED, LED or micro-LED. In the following, for the convenience of description, the above-mentioned light emitting device is described by taking OLED as an example.
该OLED包括第一电极，多个OLED的第一电极相连接构成如图2所示的第一电极层110。此外，OLED还包括与第一电极层110相对设置的第二电极111。The OLED includes a first electrode, and the first electrodes of a plurality of OLEDs are connected to form a first electrode layer 110 as shown in FIG. 2 . In addition, the OLED further includes a second electrode 111 disposed opposite to the first electrode layer 110 .
需要说明的是，上述第一电极可以为阳极，第二电极111可以为阴极；或者第一电极为阴极，第二电极111为阳极。为了方便说明，以下均是以第一电极为阴极，第二电极111为阳极为例进行的说明。It should be noted that the above-mentioned first electrode may be an anode, and the second electrode 111 may be a cathode; or the first electrode may be a cathode, and the second electrode 111 may be an anode. For the convenience of description, the following descriptions are made by taking the first electrode as a cathode and the second electrode 111 as an anode as an example.
基于此，如图3所示，上述像素界定层102包括横纵交叉的像素分隔物1022以及由像素分隔物1022围设的开口1021。在此情况下，上述第二电极111位于像素界定层102中的开口1021内，并与驱动电路结构101中一个TFT驱动电路中的至少一个薄膜晶体管(ThinFilm Transistor，TFT)的源极或漏极电连接。Based on this, as shown in FIG. 3 , the above-mentioned pixel defining layer 102 includes horizontally and vertically intersecting pixel dividers 1022 and openings 1021 surrounded by the pixel dividers 1022 . In this case, the above-mentioned second electrode 111 is located in the opening 1021 in the pixel defining layer 102, and is connected to the source or drain of at least one thin film transistor (ThinFilm Transistor, TFT) in a TFT driving circuit in the driving circuit structure 101. electrical connection.
此外，上述有机功能层30设置于第一电极层110与第二电极111之间。该有机功能层30如图4所示，包括：空穴注入层301、空穴传输层302、有机发光层303以及电子传输层304等。其中，空穴注入层301、空穴传输层302、以及电子传输层304可以覆盖所有的亚像素，而发光颜色不同的亚像素，具有不同的有机发光层303，即如图2所示，不同亚像素的有机发光层303位于不同的开口1021内。In addition, the organic functional layer 30 is disposed between the first electrode layer 110 and the second electrode 111 . As shown in FIG. 4 , the organic functional layer 30 includes: a hole injection layer 301 , a hole transport layer 302 , an organic light emitting layer 303 , and an electron transport layer 304 . Wherein, the hole injection layer 301, the hole transport layer 302, and the electron transport layer 304 can cover all the sub-pixels, and the sub-pixels with different emission colors have different organic light-emitting layers 303, that is, as shown in FIG. 2 , different The organic light emitting layers 303 of the sub-pixels are located in different openings 1021 .
此外，如图2所示，上述触控走线20位于像素界定层102的像素分隔物1022背离衬底基板100的一侧表面。In addition, as shown in FIG. 2 , the above-mentioned touch wires 20 are located on the side surface of the pixel divider 1022 of the pixel defining layer 102 away from the base substrate 100 .
在此基础上，如图1所示，上述有机功能层30具有多个过孔310，每个过孔露出触控走线20的一部分。On this basis, as shown in FIG. 1 , the organic functional layer 30 has a plurality of via holes 310 , and each via hole exposes a part of the touch trace 20 .
此外，显示面板01还包括覆盖该有机功能层30的第一电极层110。如图5所示，该第一电极层110包括多个相互绝缘的自电容电极40。如图1所示，每个自电容电极40与一个过孔310露出的触控走线20相接触。In addition, the display panel 01 further includes a first electrode layer 110 covering the organic functional layer 30 . As shown in FIG. 5 , the first electrode layer 110 includes a plurality of mutually insulated self-capacitance electrodes 40 . As shown in FIG. 1 , each self-capacitance electrode 40 is in contact with a touch trace 20 exposed by a via hole 310 .
需要说明的是，上述一个自电容电极40的尺寸为毫米量级。It should be noted that the size of the aforementioned self-capacitance electrode 40 is on the order of millimeters.
综上所述，本申请实施例提供的显示面板01中，实现触控功能的一个自电容电极40与有机功能层30上的一个过孔310露出的触控走线20相接触，因此如图6所示，触控走线20可以位于自电容电极40的下方，即位于自电容电极40靠近衬底基板100的一侧，使得触控走线20和与该触控走线20电连接的自电容电极40异层设置。这样一来，可以避免触控走线20与自电容电极40同层设置(如图7所示)时，触控走线20占据较大的显示空间，导致出现触控盲区的问题。To sum up, in the display panel 01 provided by the embodiment of the present application, a self-capacitance electrode 40 realizing the touch function is in contact with the touch trace 20 exposed by a via hole 310 on the organic functional layer 30, so as shown in FIG. 6, the touch trace 20 may be located under the self-capacitance electrode 40, that is, on the side of the self-capacitance electrode 40 close to the base substrate 100, so that the touch trace 20 and the touch trace 20 are electrically connected The self-capacitance electrodes 40 are arranged in different layers. In this way, when the touch wiring 20 and the self-capacitance electrode 40 are arranged on the same layer (as shown in FIG. 7 ), the touch wiring 20 occupies a large display space, resulting in a touch blind area.
由上述可知，第一电极层110包括多个相互绝缘的自电容电极40。该第一电极层110可以作为OLED的阴极使用，而自电容电极40又可以作为触控电极使用。在此情况下，显示面板01在显示阶段，可以向上述多个自电容电极40提供相同的电压，以作为OLED的阴极使用，驱动OLED发光。在触控阶段，多个自电容电极40复用为触控电极，在用户触摸显示面板01时，自电容电极40与接地端构成的自电容中的电容值发生改变，上述电容值作为触控信号，通过与该自电容电极40相连接的触控走线20传输至处理器。It can be seen from the above that the first electrode layer 110 includes a plurality of mutually insulated self-capacitance electrodes 40 . The first electrode layer 110 can be used as a cathode of the OLED, and the self-capacitance electrode 40 can be used as a touch electrode. In this case, the display panel 01 can provide the same voltage to the plurality of self-capacitance electrodes 40 during the display stage to serve as the cathode of the OLED to drive the OLED to emit light. In the touch stage, a plurality of self-capacitance electrodes 40 are multiplexed as touch electrodes. When the user touches the display panel 01, the capacitance value in the self-capacitance formed by the self-capacitance electrodes 40 and the ground terminal changes, and the above-mentioned capacitance value is used as a touch control electrode. The signal is transmitted to the processor through the touch wire 20 connected to the self-capacitance electrode 40 .
需要说明的是，上述显示阶段和触控阶段为两个独立的阶段，互不干扰。例如，可以将一图像帧作为一个显示阶段，在相邻两个图像帧之间插入一触控阶段。这样一来，本申请实施例提供的显示面板01通过将作为阴极的第一电极层11复用为触控电极，从而无需在显示面板中额外制作触控传感器(Touch Sensor)，进而能够达到简化制作工艺的目的。It should be noted that the above-mentioned display stage and touch stage are two independent stages, which do not interfere with each other. For example, one image frame may be used as a display stage, and a touch stage may be inserted between two adjacent image frames. In this way, the display panel 01 provided in the embodiment of the present application reuses the first electrode layer 11 as the cathode as a touch electrode, so that no additional touch sensor (Touch Sensor) needs to be fabricated in the display panel, thereby achieving simplified The purpose of the craft.
此外，为了改善触控走线20在上述过孔310裸露的部分与有机功能层30直接接触，而发生侧漏电，在本申请的一些实施例中，如图8所示，上述过孔310的孔壁与触控走线20之间具有绝缘层50。In addition, in order to improve the direct contact between the exposed part of the touch trace 20 and the organic functional layer 30 in the above-mentioned via hole 310 , and side leakage occurs, in some embodiments of the present application, as shown in FIG. 8 , the above-mentioned via hole 310 There is an insulating layer 50 between the hole wall and the touch trace 20 .
在本申请的一些实施例中，为了形成上述多个相互绝缘的自电容电极40，可以在采用Open Mask蒸镀第一电极层110的材料时，采用如图9所示的多个绝缘隔离柱60，对第一电极层110进行分割。相邻的多个绝缘隔离柱60围城一闭合的框状结构。该框状结构内限定出切割后的自电容电极40的大小。In some embodiments of the present application, in order to form the above-mentioned multiple mutually insulated self-capacitance electrodes 40, when using Open Mask to evaporate the material of the first electrode layer 110, multiple insulating isolation columns as shown in FIG. 9 can be used. 60. Divide the first electrode layer 110. A closed frame-like structure is surrounded by a plurality of adjacent insulation spacers 60 . The frame structure defines the size of the cut self-capacitance electrode 40 .
在显示面板01具有像素界定层102的情况下，上述绝缘隔离柱60位于像素界定层102中像素分隔物1022背离衬底基板100的一侧表面。In the case that the display panel 01 has the pixel defining layer 102 , the insulating isolation posts 60 are located on the side surface of the pixel divider 1022 facing away from the base substrate 100 in the pixel defining layer 102 .
在此情况下，上述绝缘隔离柱60如图10所示，设置于相邻两个自电容电极40之间，该绝缘隔离柱60采用绝缘材料构成，用于对上述相邻的两个自电容电极40进行绝缘。In this case, as shown in FIG. 10, the above-mentioned insulating spacer column 60 is arranged between two adjacent self-capacitance electrodes 40. The insulating spacer column 60 is made of insulating material, and is used for the above-mentioned two adjacent self-capacitance electrodes 40. The electrodes 40 are insulated.
在本申请的一些实施例中，如图10所述，上述绝缘隔离柱60垂直截面的形状可以为倒梯形。在此情况下，当采用Open Mask蒸镀第一电极层110的材料时，形成的薄膜层无法在绝缘隔离柱60的上表面与侧面的交界位置附着，从而能够将第一电极层110分割成多个绝缘的自电容电极40。In some embodiments of the present application, as shown in FIG. 10 , the shape of the vertical cross-section of the insulating spacer 60 may be an inverted trapezoid. In this case, when using Open Mask to vapor-deposit the material of the first electrode layer 110, the formed thin film layer cannot be attached at the junction between the upper surface and the side surface of the insulating spacer 60, so that the first electrode layer 110 can be divided into A plurality of insulated self-capacitance electrodes 40 .
上述垂直截面与TFT背板10垂直。The above-mentioned vertical section is perpendicular to the TFT backplane 10 .
在本申请的另一些实施例中，如图11所示，上述绝缘隔离柱60包括层叠设置的第一子隔离柱601和第二子隔离柱602。In some other embodiments of the present application, as shown in FIG. 11 , the insulating isolation column 60 includes a first sub-isolation column 601 and a second sub-isolation column 602 arranged in layers.
第一子隔离柱601靠近TFT背板10，该第一子隔离柱601垂直截面的形状为梯形。The first sub-isolation column 601 is close to the TFT backplane 10 , and the vertical section of the first sub-isolation column 601 is trapezoidal.
第二子隔离柱602远离TFT背板10，第二子隔离柱602垂直截面的形状为倒梯形。The second sub-isolation column 602 is away from the TFT backplane 10 , and the shape of the vertical section of the second sub-isolation column 602 is an inverted trapezoid.
在此情况下，一方面，相对于构成第二子隔离柱602的材料而言，构成上述第一子隔离柱601的材料的可以选择绝缘性更好的材料。这样一来，第一子隔离柱601的作用主要用于将相邻两个自电容电极40进行绝缘。In this case, on the one hand, compared with the material constituting the second sub-isolation column 602 , the material constituting the first sub-isolation column 601 can be selected to have better insulation properties. In this way, the function of the first sub-isolation column 601 is mainly to insulate two adjacent self-capacitance electrodes 40 .
另一方面，第二子隔离柱602的垂直截面采用倒梯形，这样一来，当采用Open Mask蒸镀第一电极层110的材料时，形成的薄膜层无法在第二子隔离柱602的上表面与侧面的交界位置附着，从而能够将第一电极层110分割成多个绝缘的自电容电极40。On the other hand, the vertical section of the second sub-isolating column 602 adopts an inverted trapezoidal shape, so that when the material of the first electrode layer 110 is evaporated using Open Mask, the formed film layer cannot be formed on the second sub-isolating column 602. The interface between the surface and the side is attached, so that the first electrode layer 110 can be divided into a plurality of insulated self-capacitance electrodes 40 .
本申请的一些实施例提供一种对如上所述的任意一种显示面板的制作方法。Some embodiments of the present application provide a method for manufacturing any one of the above-mentioned display panels.
上述方法，如图12所示，包括:Above-mentioned method, as shown in Figure 12, comprises:
S101、制作如图13a所示的，TFT背板10。S101. Fabricate a TFT backplane 10 as shown in FIG. 13a.
上述S101可以包括：首先，在一衬底基板100上，通过构图工艺制作阵列排布的TFT驱动电路。多个上述TFT驱动电路构成驱动电路结构101。The above S101 may include: firstly, on a base substrate 100 , fabricating TFT driving circuits arranged in an array through a patterning process. A plurality of the above-mentioned TFT driving circuits constitute the driving circuit structure 101 .
其中，本申请对上述衬底基板100的材料不做限定，可以为透明玻璃基板，或者在上述显示面板为柔性显示面板时，上述衬底基板100可以采用透明树脂材料构成，例如，聚酰亚胺(PI)。Wherein, the present application does not limit the material of the above-mentioned base substrate 100, it may be a transparent glass substrate, or when the above-mentioned display panel is a flexible display panel, the above-mentioned base substrate 100 may be made of a transparent resin material, for example, polyimide Amine (PI).
接下来，采用构图工艺在形成有驱动电路结构101的衬底基板100上，制作覆盖驱动电路结构101的像素界定层102。该像素界定层102具有如图3所示的像素分隔物1022和开口1021。Next, a pixel defining layer 102 covering the driving circuit structure 101 is fabricated on the base substrate 100 on which the driving circuit structure 101 is formed by using a patterning process. The pixel defining layer 102 has pixel dividers 1022 and openings 1021 as shown in FIG. 3 .
需要说明的是，本申请实施例中，上述构图工艺可以为喷墨打印工艺、光刻工艺等。该光刻工艺包括：掩膜、曝光、刻蚀等。It should be noted that, in the embodiment of the present application, the above-mentioned patterning process may be an inkjet printing process, a photolithography process, or the like. The photolithography process includes: masking, exposure, etching and the like.
S102、制作如图13b所示的第二电极111.S102, making the second electrode 111 as shown in FIG. 13b.
示例性的，采用构图工艺在上述像素界定层102的开口1021内形成上述第二电极111。Exemplarily, the second electrode 111 is formed in the opening 1021 of the pixel defining layer 102 by using a patterning process.
S103、在上述TFT背板10上制作，如图13c所示的触控走线20。S103 , fabricate the touch traces 20 on the TFT backplane 10 as shown in FIG. 13 c .
具体的，在像素界定层102像素分隔物1022背离衬底基板100的一侧表面，通过上述构图工艺形成上述触控走线20。Specifically, on the surface of the pixel spacer 1022 of the pixel defining layer 102 facing away from the base substrate 100 , the above-mentioned touch wiring 20 is formed through the above-mentioned patterning process.
此外，为了改善触控走线20在上述有机功能层30的过孔310裸露的部分与有机功能层30直接接触，而发生侧漏电，还可以在形成有触控走线20的TFT背板10上形成一层绝缘材料层，然后将覆盖触控走线20背离衬底基板100一侧表面上的绝缘材料去除，以形成位于触控走线20侧面的绝缘层50，避免触控走线20与过孔310的孔壁直接接触。In addition, in order to improve the direct contact between the exposed part of the touch wire 20 in the via hole 310 of the organic function layer 30 and the organic function layer 30 , and the occurrence of side leakage, the touch wire 20 can also be formed on the TFT backplane 10 Form a layer of insulating material on it, and then remove the insulating material covering the surface of the touch wiring 20 facing away from the base substrate 100 to form an insulating layer 50 on the side of the touch wiring 20 to prevent the touch wiring 20 from In direct contact with the hole wall of the via hole 310 .
S104、在上述TFT背板10上制作，如图13c所示的绝缘隔离柱60。S104 , fabricate the insulating spacers 60 on the TFT backplane 10 as shown in FIG. 13 c .
制作上述绝缘隔离柱60的材料可以包括绝缘的无机材料，例如氮化硅、碳化硅、氧化硅中的至少一种；或者有机聚合物材料，例如聚酰亚胺、聚四氟乙烯中的至少一种，或者，光刻胶。The material for making the insulating spacer 60 may include an insulating inorganic material, such as at least one of silicon nitride, silicon carbide, and silicon oxide; or an organic polymer material, such as at least one of polyimide and polytetrafluoroethylene. A, or, photoresist.
当上述绝缘隔离柱60，如图11所示，包括层叠设置的第一子隔离柱601和第二子隔离柱602时，上述绝缘隔离柱60的制作方法可以为：When the insulating spacer 60, as shown in FIG. 11 , includes a first sub-separation column 601 and a second sub-separation column 602 arranged in layers, the manufacturing method of the above-mentioned insulating spacer 60 may be as follows:
首先，在TFT背板10上旋涂第一层光敏型有机绝缘材料，例如，光敏型PI。膜厚为0.5～5um。对该膜层前烘后曝光，形成条状或网状的结构。显影后形成第一子隔离柱601，该第一子隔离柱601的线宽为10um～50um，然后进行后烘。First, a first layer of photosensitive organic insulating material, such as photosensitive PI, is spin-coated on the TFT backplane 10 . The film thickness is 0.5-5um. The film layer is pre-baked and then exposed to form a strip or network structure. After developing, the first sub-isolation column 601 is formed, and the line width of the first sub-isolation column 601 is 10um-50um, and then post-baked.
接下来，再形成有上述结构的TFT背板上，旋涂第二层光敏绝缘有机材料，膜厚为0.5um～5um。对该膜层前烘后曝光，形成条状或网状的结构，显影后形成第二子隔离柱602，该第二子隔离柱602的宽度为5um～45um。为了使得第二子隔离柱602的垂直截面形状为倒梯形，构成第二子隔离柱602的材料可以为负性胶。Next, spin-coat the second layer of photosensitive insulating organic material on the TFT back plate with the above-mentioned structure, and the film thickness is 0.5um-5um. The film layer is pre-baked and then exposed to form a stripe or mesh structure. After development, a second sub-isolation column 602 is formed, and the width of the second sub-isolation column 602 is 5 um-45 um. In order to make the vertical cross-section of the second sub-isolating column 602 an inverted trapezoid, the material constituting the second sub-isolating column 602 can be negative glue.
S105、在制作有触控走线20的TFT背板10上形成，形成如图13d所示的有机功能层30。S105 , forming on the TFT backplane 10 with the touch traces 20 , forming an organic functional layer 30 as shown in FIG. 13 d .
其中，上述有机功能层30上需要设置多个过孔310，以使得自电容电极40能够通过过孔310与该过孔310漏出的触控走线20相接触。Wherein, a plurality of via holes 310 need to be provided on the organic functional layer 30 , so that the self-capacitance electrode 40 can contact with the touch trace 20 leaked from the via holes 310 through the via holes 310 .
在本申请的一些实施例中，可以采用光刻工艺在制作好的有机功能层30上成上述过孔310。然而，构成有机功能层30的材料不耐水氧，容易导致水汽或氧气进入到显示面板内部，影响显示面板的质量。In some embodiments of the present application, the aforementioned via hole 310 may be formed on the fabricated organic functional layer 30 by using a photolithography process. However, the material constituting the organic functional layer 30 is not resistant to water and oxygen, which may easily cause water vapor or oxygen to enter the display panel and affect the quality of the display panel.
为了解决上述问题，在本申请的一些实施例中，形成上述有机功能层30中的一层有机薄膜层的方法包括：In order to solve the above problems, in some embodiments of the present application, the method for forming an organic thin film layer in the organic functional layer 30 includes:
首先，采用如图14a所示的第一掩膜版70，在制作有触控走线20的TFT背板10上蒸镀有机材料。Firstly, using the first mask plate 70 as shown in FIG. 14 a , the organic material is vapor-deposited on the TFT backplane 10 on which the touch traces 20 are fabricated.
接下来，采用如图14b所示的第二掩膜版71，在蒸镀有有机材料的TFT背板10上，再次蒸镀有机材料。Next, using the second mask 71 as shown in FIG. 14 b , the organic material is vapor-deposited again on the TFT backplane 10 on which the organic material is vapor-deposited.
其中，第一掩膜版70和第二掩膜版71叠加后，该第一掩膜版70的第一遮挡部701和第二掩膜版的第二遮挡部711具有如图14c所示的重叠区72。Wherein, after the first mask 70 and the second mask 71 are stacked, the first shielding portion 701 of the first mask 70 and the second shielding portion 711 of the second mask have a shape as shown in FIG. 14c Overlapping area 72.
在此情况下，上述TFT背板10上与重叠区72对应的位置未蒸镀上述有机材料，从而形成位于有机功能层30上形成过孔310，通过上述过孔310露出触控走线20的一部分。In this case, the above-mentioned organic material is not vapor-deposited on the position corresponding to the overlapping region 72 on the above-mentioned TFT backplane 10, so that a via hole 310 is formed on the organic functional layer 30, through which the touch wiring 20 is exposed. part.
基于此，为了制作上述有机功能层30，本申请一些实施例提供一种掩膜版组件。该掩膜版组件包括如图14a所示的第一掩膜版70和如图14b所示的第二掩膜版71。Based on this, in order to fabricate the above-mentioned organic functional layer 30 , some embodiments of the present application provide a mask assembly. The mask assembly includes a first mask 70 as shown in FIG. 14a and a second mask 71 as shown in FIG. 14b.
如图14a所示，上述第一掩膜版70具有多个第一遮挡部701和第一透过部702。第一遮挡部701与第一透过部702交替设置。此外，上述第一遮挡部701包括主遮挡部7011和位于主遮挡部7011上的多个凸起的子遮挡部7012。As shown in FIG. 14 a , the above-mentioned first mask 70 has a plurality of first shielding portions 701 and first transmission portions 702 . The first shielding portions 701 and the first transmitting portions 702 are arranged alternately. In addition, the above-mentioned first shielding portion 701 includes a main shielding portion 7011 and a plurality of protruding sub-shading portions 7012 located on the main shielding portion 7011 .
如图14b所示，第二掩膜版71具有多个第二遮挡部711和第二透过部712。该第二遮挡部711与第二透过部712交替设置。As shown in FIG. 14 b , the second mask 71 has a plurality of second shielding portions 711 and second transmission portions 712 . The second shielding portions 711 and the second transmission portions 712 are arranged alternately.
在此情况下，在第一掩膜版70和第二掩膜版71叠加后，如图14d第一遮挡部70中的主遮挡部7011与第二透过部712的位置相对应。第一遮挡部70中的子遮挡部7012与第二遮挡部711具有如图14c所示的重叠区72。In this case, after the first mask 70 and the second mask 71 are stacked, as shown in FIG. 14d , the main shielding portion 7011 in the first shielding portion 70 corresponds to the position of the second transparent portion 712 . The sub-shading portion 7012 in the first shielding portion 70 and the second shielding portion 711 have an overlapping area 72 as shown in FIG. 14c.
此外，上述制作方法还包括：In addition, the above-mentioned production method also includes:
S106、在制作有有机功能层30和触控走线20的TFT背板10上，形成多个如图15所示的相互绝缘的自电容电极40，每个自电容电极40与一个过孔310露出的触控走线20相接触。S106. On the TFT backplane 10 with the organic functional layer 30 and the touch trace 20, form a plurality of mutually insulated self-capacitance electrodes 40 as shown in FIG. The exposed touch traces 20 are in contact with each other.
具体的，在制作有有机功能层30和触控走线20的TFT背板10上，采用Open Mask蒸镀第一电极层110的材料时，形成的薄膜层无法在绝缘隔离柱60的上表面与侧面的交界位置附着，从而能够将第一电极层110分割成多个绝缘的自电容电极40。上述方法在制备自电容电极40的过程中无需使用金属掩膜版，通过绝缘隔离柱60作为障壁对第一电极层110进行分割。Specifically, on the TFT backplane 10 with the organic functional layer 30 and the touch wiring 20, when the material of the first electrode layer 110 is evaporated using Open Mask, the formed film layer cannot be formed on the upper surface of the insulating spacer 60. The first electrode layer 110 can be divided into a plurality of insulated self-capacitance electrodes 40 by adhering at the boundary position with the side surface. The above method does not need to use a metal mask in the process of preparing the self-capacitance electrode 40 , and the first electrode layer 110 is divided by using the insulating spacer 60 as a barrier.
S107、制作如图15所示的封装部80。S107 , making the encapsulation part 80 as shown in FIG. 15 .
上述封装部80可以采用薄膜封装(Thin-Film Encapsulation，TFE)技术，在此情况下，上述封装部80包括两层无机薄膜层801，以及位于上述两层无机薄膜层801之间的有机薄膜层802构成。The encapsulation unit 80 may adopt Thin-Film Encapsulation (TFE) technology. In this case, the encapsulation unit 80 includes two inorganic thin film layers 801, and an organic thin film layer between the two inorganic thin film layers 801. 802 constitute.
上述无机薄膜层801可以采用氮化硅(SiNx)构成。有机薄膜层可以采用喷墨打印((Ink Jet Printing，IJP)技术制备。The above-mentioned inorganic thin film layer 801 can be made of silicon nitride (SiNx). The organic thin film layer can be prepared by ink jet printing (Ink Jet Printing, IJP) technology.
上述显示面板的制作方法，具有与前述实施例提供的显示面板相同的技术效果，此处不再赘述。The method for manufacturing the above display panel has the same technical effect as that of the display panel provided by the foregoing embodiments, and will not be repeated here.
本申请的一些实施例，提供一种显示装置，该显示装置包括如上所述的任意一种显示面板。Some embodiments of the present application provide a display device, where the display device includes any one of the above-mentioned display panels.
需要说明的是，上述显示装置可以为显示器、电视、手机、平板电脑等具有显示功能的任意一种装置。该显示面板具有如前述实施例提供的显示面板相同的技术效果，此处不再赘述。It should be noted that the above display device may be any device having a display function, such as a monitor, a TV, a mobile phone, a tablet computer, and the like. The display panel has the same technical effect as that of the display panel provided by the foregoing embodiments, which will not be repeated here.
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810835903.XACN109037285B (en) | 2018-07-26 | 2018-07-26 | Display panel and manufacturing method thereof, display device, and mask assembly |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810835903.XACN109037285B (en) | 2018-07-26 | 2018-07-26 | Display panel and manufacturing method thereof, display device, and mask assembly |
| Publication Number | Publication Date |
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| CN109037285Atrue CN109037285A (en) | 2018-12-18 |
| CN109037285B CN109037285B (en) | 2020-11-27 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810835903.XAExpired - Fee RelatedCN109037285B (en) | 2018-07-26 | 2018-07-26 | Display panel and manufacturing method thereof, display device, and mask assembly |
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| CN (1) | CN109037285B (en) |
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