技术领域technical field
本发明涉及一种广泛应用于现代卫星通信、移动通信、雷达，以及各种工业装备中输出功率大于200W的微波固态功率放大器，尤其是输出频率为2010-2130MHz，连续波输出1dB压缩点为200W的固态功率放大器插箱。The invention relates to a microwave solid-state power amplifier widely used in modern satellite communication, mobile communication, radar, and various industrial equipments, with an output power greater than 200W, especially the output frequency is 2010-2130MHz, and the continuous wave output 1dB compression point is 200W Solid State Power Amplifier Subrack.
背景技术Background technique
微波功率放大器作为发射机单元中至关重要的部件在许多微波电子设备和系统中广泛应用，如现代无线通信、卫星收发设备、雷达、遥测遥控系统等。微波固态功率放大器具有体积小、工作电压低、稳定性高、良好的可重复性等优点在许多领域倍受青睐，如遥测遥控发射机系统中的功率放大器单元。遥测发射机系统自身的特点对功率放大器提出了严格的技术指标要求：(1)高可靠性。在宽温度范围内、高振动、冲击、离心、低气压等恶劣条件下能安全、可靠地工作。(2)高效率。发射机系统中，功率放大单元是主要的耗电设备之一。连续波固态功率放大器一般是指利用A类或AB类硅金属氧化物场效应管或砷化镓金属半导体场效应管经合成达到一定功率的功率放大设备。目前千瓦以下固态功率放大器已经逐步取代相同级别的真空管放大器，成为市场主流。由于场效应管放大器的单管增益和输出功率较小，所以大功率的同态功放一般都采用多管级联和多管合成的技术，即功率合成技术。功率合成受单元间相位及幅度一致性影响很大，各端口之间的匹配、隔离、插损对合成效率也有影响为避免系统间相互干扰，提高系统的电磁兼容性，功率放大器的带外抑制和谐波抑制要求苛刻。体积小，质量轻。所有这些技术指标要求均增大了遥测发射机系统中固态功率放大器的设计难度。我国航天测控任务大多都在S频段(发射2025-2120MHz，接收2200-2300MHz)开展，航天测控作用距离远，需要发射大功率进行目标探测，S频段大功率发射机一般有速调管和固态功放两种，和速调管比起来，固态功放具有工作电压低，成本低，维修性好，可靠性高，工作带宽宽等优点，近年来固态功放有取代速调管的趋势。尽管固态功率放大器发展越来越成熟，但在其研制过程中还是有一些难点，如单管输出功率不足，功放的效率较低，增益对温度敏感等问题。Microwave power amplifiers are widely used in many microwave electronic equipment and systems as a crucial part of the transmitter unit, such as modern wireless communications, satellite transceiver equipment, radar, telemetry and remote control systems, etc. Microwave solid-state power amplifiers have the advantages of small size, low operating voltage, high stability, and good repeatability, and are favored in many fields, such as power amplifier units in telemetry and remote control transmitter systems. The characteristics of the telemetry transmitter system itself put forward strict technical index requirements for the power amplifier: (1) High reliability. It can work safely and reliably in a wide temperature range, high vibration, shock, centrifugal, low air pressure and other harsh conditions. (2) High efficiency. In the transmitter system, the power amplifier unit is one of the main power consumption devices. Continuous wave solid-state power amplifiers generally refer to power amplification devices that use Class A or Class AB silicon metal oxide field effect transistors or gallium arsenide metal semiconductor field effect transistors to achieve a certain power through synthesis. At present, solid-state power amplifiers below kilowatts have gradually replaced vacuum tube amplifiers of the same level and become the mainstream of the market. Because the single-tube gain and output power of the field effect tube amplifier are small, the high-power homomorphic power amplifier generally adopts the technology of multi-tube cascading and multi-tube synthesis, that is, power synthesis technology. Power synthesis is greatly affected by the phase and amplitude consistency between units, and the matching, isolation, and insertion loss between ports also have an impact on the synthesis efficiency. In order to avoid mutual interference between systems and improve the electromagnetic compatibility of the system, the out-of-band suppression of the power amplifier and harmonic suppression are demanding. Small size and light weight. All of these specifications add to the difficulty of designing solid-state power amplifiers in telemetry transmitter systems. Most of my country's aerospace measurement and control tasks are carried out in the S-band (transmitting 2025-2120MHz, receiving 2200-2300MHz). The distance of aerospace measurement and control is long, and high power needs to be transmitted for target detection. S-band high-power transmitters generally have klystrons and solid-state power amplifiers. Two, compared with klystrons, solid-state power amplifiers have the advantages of low operating voltage, low cost, good maintainability, high reliability, and wide operating bandwidth. In recent years, solid-state power amplifiers have a tendency to replace klystrons. Although the development of solid-state power amplifiers is becoming more and more mature, there are still some difficulties in the development process, such as insufficient output power of a single tube, low efficiency of power amplifiers, and sensitivity of gain to temperature.
发明内容Contents of the invention
为解决单个功率管输出功率不足，同时解决固态功放散热难，增益对温度敏感等问题，本发明公开一种S频段输出功率高，质量轻，易于散热的200W固态功放器。In order to solve the insufficient output power of a single power tube, and at the same time solve the problems of difficult heat dissipation of solid-state power amplifiers and sensitivity of gain to temperature, the invention discloses a 200W solid-state power amplifier with high S-band output power, light weight, and easy heat dissipation.
本发明解决其技术问题所采用的技术方案是：一种S频段功率放大器，包括：安装在插箱内部的固态功放模块，连接监控单元的5V电源模块及AC/DC电源模块，监控单元，直流风机以及散热片，其特征在于：固态功放模块输入口和输出口设有隔离器，输入信号经输入口隔离器将其输入驻波降到1.3以下后送到温度补偿电路，信号经过温度补偿后送入驱动芯片放大，放大后的信号经过2次功分后分别送到并联的4个功率芯片，经功率芯片放大后的信号再经过两次功率合成后送到输出口隔离器，输出信号经微带转同轴电路输出，微带转同轴电路同时耦合正向和反向功率送入监控单元进行监测。监控单元除监测功率信息外，同时监测大功率AC/DC电源电流信息，并将监测到的信息上报到系统监控单元。The technical solution adopted by the present invention to solve the technical problems is: an S-band power amplifier, including: a solid-state power amplifier module installed inside the subrack, a 5V power supply module and an AC/DC power supply module connected to the monitoring unit, the monitoring unit, DC The fan and heat sink are characterized in that: the input port and the output port of the solid-state power amplifier module are provided with isolators, the input signal is sent to the temperature compensation circuit after the input signal is reduced to below 1.3 by the input port isolator, and the signal is temperature compensated The amplified signal is sent to the driver chip for amplification, and the amplified signal is sent to the four power chips in parallel after 2 times of power division. The signal amplified by the power chip is then sent to the output port isolator after two times of power synthesis. The microstrip-to-coaxial circuit outputs, and the microstrip-to-coaxial circuit simultaneously couples forward and reverse power and sends it to the monitoring unit for monitoring. In addition to monitoring power information, the monitoring unit also monitors high-power AC/DC power supply current information, and reports the monitored information to the system monitoring unit.
本发明相比于现有技术具有如下有益效果。Compared with the prior art, the present invention has the following beneficial effects.
输出功率高。本发明在固态功放模块的输入输出口增加隔离器，提高功率合成器端口的隔离度和端口匹配度与一致性，这样会很大程度的提高合成效率。输入输出口增加隔离器将其输入输出驻波降到1.3以下，可有效降低由于输入输出失配造成的增益降低及反射功率的增大。针对环境温度发生变化时功放增益会随之变化的现象，本发明在固态功放模块电路内部增加了温度补偿电路，使电路增益随环境温度变化而微弱变化。本发明固态功放器连续波输出1dB压缩点大于200W，增益大于20dB，增益随温度变化小于2dB。High output power. The present invention adds an isolator to the input and output ports of the solid-state power amplifier module to improve the isolation degree and port matching degree and consistency of the ports of the power combiner, thus greatly improving the combining efficiency. An isolator is added to the input and output ports to reduce the input and output standing wave to below 1.3, which can effectively reduce the gain reduction and reflection power increase caused by input and output mismatch. Aiming at the phenomenon that the power amplifier gain will change when the ambient temperature changes, the invention adds a temperature compensation circuit inside the solid-state power amplifier module circuit, so that the circuit gain changes slightly with the ambient temperature change. The 1dB compression point of the continuous wave output of the solid-state power amplifier of the invention is greater than 200W, the gain is greater than 20dB, and the change of the gain with temperature is less than 2dB.
效率高，质量轻，易于散热。本发明可以采用标准4U插箱机壳尺寸(长550mm宽485mm高180mm)的插箱，插箱机壳内每个模块均为独立模块，插箱内射频信号使用低损耗同轴电缆传输，方便了调试及更换。除了进风口和出风口外，整个插箱机壳其余全为密闭空间，固态功放模块为屏蔽结构，可以实现电磁信号的空间隔离，封闭的机壳结构使电磁屏蔽效果更好。散热系统为散热硅胶，插片式钎焊散热器采用高效散热器与模块底板焊为一体的结构形式，利于功放散热，同时在插箱机壳内设易于散热风道以及抽风式直流风机，避免了热量堆积，使功放本身的热阻大幅下降，进而在同等的散热条件下，可改善发射机本身工作时的热状态，在-40℃到60℃范围内，增益变化小于2dB，散热效率高，质量轻。在电路中增加了温度补偿电路使电路增益对温度变化不敏感。当稳定输出功率为200W时，插箱机壳内部温度低于30℃，进而解决了固态功放模块散热难的问题。High efficiency, light weight, easy to dissipate heat. The present invention can adopt standard 4U plug-in box casing size (length 550mm, width 485mm, height 180mm), and each module in the plug-in box casing is an independent module, and the radio frequency signal in the plug-in box is transmitted by a low-loss coaxial cable, which is convenient debugging and replacement. Except for the air inlet and the air outlet, the rest of the sub-box casing is a closed space. The solid-state power amplifier module is a shielding structure, which can realize the spatial isolation of electromagnetic signals. The closed casing structure makes the electromagnetic shielding effect better. The cooling system is made of heat-dissipating silica gel. The plug-in brazing radiator adopts the structure of high-efficiency radiator and module bottom plate welded together, which is conducive to the heat dissipation of the power amplifier. The thermal resistance of the power amplifier itself is greatly reduced, and under the same heat dissipation conditions, the thermal state of the transmitter itself can be improved. In the range of -40°C to 60°C, the gain change is less than 2dB, and the heat dissipation efficiency is high. ,light in mass. A temperature compensation circuit is added in the circuit to make the circuit gain insensitive to temperature changes. When the stable output power is 200W, the internal temperature of the plug-in case is lower than 30°C, thereby solving the problem of difficult heat dissipation of the solid-state power amplifier module.
本发明可用于航天测控地面站，也可用于需要大功率发射机的通信场合。适用于S频段连续波100MHz带宽的微波功率放大器，180W-500W的固态功率放大器。The invention can be used in aerospace measurement and control ground stations, and can also be used in communication occasions requiring high-power transmitters. Suitable for microwave power amplifiers with S-band continuous wave 100MHz bandwidth, 180W-500W solid-state power amplifiers.
附图说明Description of drawings
图1是本发明S频段功率放大器插箱的结构原理框图。Fig. 1 is a structural principle block diagram of the S-band power amplifier subrack of the present invention.
图2是图1固态功放模块的电路原理示意图。FIG. 2 is a schematic diagram of the circuit principle of the solid-state power amplifier module in FIG. 1 .
图3是图2固态功放模块合成分配网络相位合成关系示意图。Fig. 3 is a schematic diagram of phase composition relationship of the composition and distribution network of the solid-state power amplifier module in Fig. 2 .
图4是图1插箱散热系统结构原理示意图。FIG. 4 is a schematic diagram of the structural principle of the heat dissipation system of the subrack in FIG. 1 .
图5是本发明S频段功率放大器插箱主视图。Fig. 5 is a front view of the S-band power amplifier subrack of the present invention.
图中：1-1固态功放模块，1-2散热片，1-3监控单元，1-4 5V的电源模块，1-5AC/DC电源。3-1第一90°电桥合路器，3-2第二90°电桥合路器，3-3第三90°电桥合路器，3-A第一功率芯片3-B第二功率芯片，3-C第三功率芯片，3-D和第四个功率芯片，3-4第四90°电桥合路器，3-5第五90°电桥合路器，3-6第六90°电桥合路器接。4-1固态功放模块，4-3AC/DC大功率电源，4-4监控板，4-5散热片。5-1风机为直流风机，5-2输入射频信号端，5-3输出射频信号输出端，5-4输入220V交流电，5-5 5V直流电源模块，5-6 AC/DC大功率电源模块，5-7监控单元，5-8 200W固态功放模块，5-9安装把手。In the figure: 1-1 solid-state power amplifier module, 1-2 heat sink, 1-3 monitoring unit, 1-4 5V power module, 1-5 AC/DC power supply. 3-1 The first 90° bridge combiner, 3-2 The second 90° bridge combiner, 3-3 The third 90° bridge combiner, 3-A The first power chip 3-B The first power chip Second power chip, 3-C third power chip, 3-D and fourth power chip, 3-4 fourth 90° bridge combiner, 3-5 fifth 90° bridge combiner, 3- 6 The sixth 90° bridge combiner is connected. 4-1 solid-state power amplifier module, 4-3 AC/DC high-power power supply, 4-4 monitoring board, 4-5 heat sink. 5-1 Fan is a DC fan, 5-2 input RF signal terminal, 5-3 output RF signal output terminal, 5-4 input 220V AC, 5-5 5V DC power supply module, 5-6 AC/DC high-power power supply module , 5-7 monitoring unit, 5-8 200W solid-state power amplifier module, 5-9 installation handle.
具体实施方式Detailed ways
参阅图1。在以下描述的实施例中，一种S频段功率放大器插箱，包括：安装在插箱机壳中的固态功放模块1-1，监控单元1-3，5V的电源模块1-4和AC/DC电源1-5，散热片1-2。AC/DC电源的输出端连接固态功放模块，220V交流电输入后接5V电源模块及AC/DC电源的交流入，5V电源模块的5V输出接监控单元的供电接口。射频信号从固态功放模块输入口输入，射频输入信号通过输入口隔离器将其输入驻波降到1.3以下送入固态功放模块。固态功放模块将输入信号放大到200W以上并将自身的温度、输出功率和反射功率信息送入监控单元，放大后的信号经固态功放模块输出口微带转同轴N型头输出射频信号。为利于功放散热，固态功放模块1-1和AC/DC电源1-5紧贴插片式散热片散热器，散热器散热片分别与固态功放模块及AC/DC电源底板焊为一体，插箱机壳内设计了易于散热的风道以及抽风式直流风机1-6，直流风机连接监控单元1-3。See Figure 1. In the embodiment described below, a kind of S-band power amplifier subrack includes: a solid-state power amplifier module 1-1 installed in the subrack casing, a monitoring unit 1-3, a power supply module 1-4 of 5V and AC/ DC power supply 1-5, heat sink 1-2. The output end of the AC/DC power supply is connected to the solid-state power amplifier module, the 220V AC input is connected to the 5V power supply module and the AC/DC power supply input, and the 5V output of the 5V power supply module is connected to the power supply interface of the monitoring unit. The radio frequency signal is input from the input port of the solid-state power amplifier module, and the input standing wave of the radio frequency input signal is reduced to below 1.3 through the input port isolator and sent to the solid-state power amplifier module. The solid-state power amplifier module amplifies the input signal to more than 200W and sends its own temperature, output power and reflected power information to the monitoring unit. The amplified signal passes through the output port of the solid-state power amplifier module and converts the microstrip to the coaxial N-type head to output the radio frequency signal. In order to facilitate the heat dissipation of the power amplifier, the solid-state power amplifier module 1-1 and the AC/DC power supply 1-5 are closely attached to the plug-in heat sink radiator, and the heat sink fins are welded together with the solid-state power amplifier module and the AC/DC power supply base plate respectively, and inserted into the box An air duct for easy heat dissipation and an exhaust type DC fan 1-6 are designed in the casing, and the DC fan is connected to the monitoring unit 1-3.
本实施例插箱包含了固态功率输出模块，大功率AD/DC电源模块，5V电源模块，监控板，直流风机，散热片，所有模块安装在一个标准(4U长550mm宽485mm高180mm)机箱中，热量通过风道从后面板散出。The subrack of this embodiment includes a solid-state power output module, a high-power AD/DC power module, a 5V power module, a monitoring board, a DC fan, and a heat sink. All modules are installed in a standard (4U length 550mm width 485mm height 180mm) chassis , the heat is dissipated from the rear panel through the air duct.
参阅图2。在固态功放模块中，射频信号从固态功放模块RFin端输入，输入信号经过隔离器后送到温度补偿电路，信号经温度补偿电路串联的驱动芯片输入串联功分器，串联功分器输出信号再经过两个并联功分器一分为二，被两个并联功分器功分为4路输出信号，4路输出信号分别送给与上述两个并联功分器输出端对应的4个并联功率芯片，4个功率芯片将信号放大后通过共端相连的合路器合为1路送入输出端隔离器，输出信号经过耦合器耦合出正向和反向两路功率监测信号，功率监测信号被送入插箱监控单元中进行监控。See Figure 2. In the solid-state power amplifier module, the radio frequency signal is input from the RFin terminal of the solid-state power amplifier module, and the input signal is sent to the temperature compensation circuit after passing through the isolator. Divided into two by two parallel power dividers, and divided into 4 output signals by the two parallel power dividers, the 4 output signals are respectively sent to the 4 parallel power Chip, 4 power chips amplify the signal and combine it into one channel through the combiner connected to the common terminal and send it to the output isolator. It is sent to the subrack monitoring unit for monitoring.
本实施例采用的功率管单管输出为60W，单管功率管输出后再经过2次二合一合成200W。The power tube used in this embodiment has a single output of 60W, and after the output of the single tube power tube, it is synthesized into 200W after two times of two-in-one.
参阅图3。在固态功放模块中，射频信号输入经过第一90°电桥合路器3-1，第一90°电桥合路器3-1输出端口接第二90°电桥合路器3-2和第三90°电桥合路器3-3输入端，第二90°电桥合路器3-2的输出端分别接第一功率芯片3-A和第二功率芯片3-B，第三90°电桥合路器3-3的输出端分别接第三功率芯片3-C和第四个功率芯片3-D。第一功率芯片3-A和第二功率芯片3-B的输出端接第四90°电桥合路器3-4、第三功率芯片3-C和第四个功率芯片3-D的输出端分别接第五90°电桥合路器3-5输入端，第四90°电桥合路器3-4的-90°端和第五90°电桥合路器3-5的-180°端第六90°电桥合路器接3-6，第六90°电桥合路器接3-6的-180°输出端接射频输出，从而形成固态功放模块合成分配网络。90°电桥合路器端口驻波与隔离度都比较好，微带线比较宽，功率容量大，同时可根据输出功率的大小外接大功率负载电阻以达到较大的功率容量，除此之外，负载失配对功放的影响不大。为了保证合成效率，多次仿真调试后使其公分两端输出相位相差90°。See Figure 3. In the solid-state power amplifier module, the radio frequency signal is input through the first 90° bridge combiner 3-1, and the output port of the first 90° bridge combiner 3-1 is connected to the second 90° bridge combiner 3-2 and the input end of the third 90° bridge combiner 3-3, the output end of the second 90° bridge combiner 3-2 is respectively connected to the first power chip 3-A and the second power chip 3-B, the second The output ends of the three 90° bridge combiners 3-3 are respectively connected to the third power chip 3-C and the fourth power chip 3-D. The output terminals of the first power chip 3-A and the second power chip 3-B are connected to the output of the fourth 90° bridge combiner 3-4, the third power chip 3-C and the fourth power chip 3-D Terminals are respectively connected to the fifth 90° bridge combiner 3-5 input end, the -90° end of the fourth 90° bridge combiner 3-4 and the - of the fifth 90° bridge combiner 3-5 The sixth 90° bridge combiner at the 180° end is connected to 3-6, and the -180° output terminal of the sixth 90° bridge combiner is connected to 3-6 to connect to the radio frequency output, thereby forming a solid-state power amplifier module synthesis and distribution network. The standing wave and isolation of the 90° bridge combiner port are relatively good, the microstrip line is relatively wide, and the power capacity is large. At the same time, a high-power load resistor can be connected externally according to the output power to achieve a large power capacity. In addition In addition, load mismatch has little effect on the power amplifier. In order to ensure the synthesis efficiency, the output phase difference between the two ends of the centimeter is 90° after repeated simulation and debugging.
参阅图4。在以200W固态功放插箱机壳实施例中，插箱机壳内射频信号使用低损耗同轴电缆传输，监控线通过导线与监控板连接，固态功放模块为屏蔽结构，可以实现电磁信号的空间隔离。针对固态功放的散热问题，固态功放插箱机壳内部布局风道以及安装在固态功放模块及AC/DC大功率电源模块之间的散热片构成的插箱散热系统。固态功放模块4-1及AC/DC大功率电源4-3固定在插箱底部，固态功放模块4-1及AC/DC大功率电源4-3固定在插箱底部，散热片4-5固定在固态功放模块4-1固定在AC/DC大功率电源4-3之间，监控板4-4固定在固态功放模块4-1及AC/DC大功率电源4-3旁边，5V电源模块4-7固定在AC/DC大功率电源4-3旁边紧挨机箱侧壁。在固态功放模块和大功率电源模块和散热片之间涂抹导热硅胶，模块产生的热量会及时传到散热片。当功放输出200W时，功放的发热功率为540W，散热采用抽风方式的风机将热量抽出，假定环境温度为28℃，风机出风口的温度为40℃时空气的密度ρ为1.128Kg/m3；空气的比热Cp＝1005J/kg*℃,则系统需求的总风量为：See Figure 4. In the embodiment of a 200W solid-state power amplifier plug-in case, the radio frequency signal in the plug-in case is transmitted by a low-loss coaxial cable, the monitoring line is connected to the monitoring board through a wire, and the solid-state power amplifier module is a shielding structure, which can realize the space for electromagnetic signals isolation. Aiming at the heat dissipation problem of the solid-state power amplifier, the inside of the solid-state power amplifier sub-chassis is arranged with air ducts and a sub-box heat dissipation system composed of heat sinks installed between the solid-state power amplifier module and the AC/DC high-power power supply module. Solid-state power amplifier module 4-1 and AC/DC high-power power supply 4-3 are fixed at the bottom of the subrack, solid-state power amplifier module 4-1 and AC/DC high-power power supply 4-3 are fixed at the bottom of the subrack, and heat sink 4-5 is fixed The solid-state power amplifier module 4-1 is fixed between the AC/DC high-power power supply 4-3, the monitoring board 4-4 is fixed next to the solid-state power amplifier module 4-1 and the AC/DC high-power power supply 4-3, and the 5V power supply module 4 -7 is fixed next to the AC/DC high-power power supply 4-3 and is close to the side wall of the case. Apply heat-conducting silica gel between the solid-state power amplifier module, the high-power power supply module and the heat sink, and the heat generated by the module will be transferred to the heat sink in time. When the output of the power amplifier is 200W, the heating power of the power amplifier is 540W, and the cooling fan is used to extract the heat. Assuming that the ambient temperature is 28°C and the temperature of the air outlet of the fan is 40°C, the density ρ of the air is 1.128Kg/m3; The specific heat Cp=1005J/kg*℃, then the total air volume required by the system is:
Q＝W/(ρ*Cp*Δt)Q=W/(ρ*Cp*Δt)
＝540/(1.128*1005*(40-28))＝0.04m3/s＝142.9m3/h.＝540/(1.128*1005*(40-28))＝0.04m3/s＝142.9m3/h.
经过计算，使用1个W1G180-AB47-01型混流风机即可满足散热要求,该风机最大直径Φ200mm,最大风量925m3/h，留有很大裕量。After calculation, one W1G180-AB47-01 mixed-flow fan can meet the heat dissipation requirements. The maximum diameter of the fan is Φ200mm, and the maximum air volume is 925m3/h, leaving a large margin.
参阅图5插箱顶视图。各模块安装位置如图5所示位置，风机为直流风机5-1，固定在插箱的后部，输入射频信号端5-2为输入信号连接器，本实施例使用输入连接器的型号为SMA-KFK。输出射频信号输出端5-3为输出信号连接器，本实施例使用输出连接器的型号为N-KFK。5-4为220V～电源连接器，本实施例使用Y50DX-1204TK2。5-2，5-3，5-4均固定在插箱后部。5-5为5V直流电源模块，固定安装在插箱右后位置，5-6为AC/DC大功率电源模块，5-6紧邻5-5安装在5-5左边位置，5-7为监控单元，5-7安装在5-6前面靠前面板位置，5-8为200W固态功放模块，5-8安装在紧靠插箱左边位置，把手5-9安装插箱前面板靠近边缘位置。See Figure 5 for a top view of the subrack. The installation positions of each module are as shown in Figure 5. The fan is a DC fan 5-1, which is fixed at the rear of the subrack, and the input RF signal terminal 5-2 is an input signal connector. The model of the input connector used in this embodiment is SMA-KFK. The output terminal 5-3 of the output radio frequency signal is an output signal connector, and the model of the output connector used in this embodiment is N-KFK. 5-4 is the 220V ~ power connector, and Y50DX-1204TK2 is used in this embodiment. 5-2, 5-3, and 5-4 are all fixed at the rear of the subrack. 5-5 is a 5V DC power supply module, which is fixedly installed at the right rear position of the subrack, 5-6 is an AC/DC high-power power supply module, 5-6 is installed next to 5-5 on the left side of 5-5, and 5-7 is a monitor Units 5-7 are installed on the front panel of 5-6, 5-8 is a 200W solid-state power amplifier module, 5-8 is installed on the left side of the sub-box, and handles 5-9 are installed on the front panel of the sub-box near the edge.
最终达到的指标为：在2010MHz-2130MHz范围内，输出连续波1dB压缩点大于200W，功率增益大于20dB，在-40℃到+60℃温度范围内，增益波动小于±2dB，输出200W时幅相变化小于3°/dB。The final indicators are: in the range of 2010MHz-2130MHz, the output continuous wave 1dB compression point is greater than 200W, the power gain is greater than 20dB, and the gain fluctuation is less than ±2dB in the temperature range of -40°C to +60°C, and the amplitude and phase of the output is 200W. The change is less than 3°/dB.
以上对本发明实施例进行了详细介绍，本文中应用了具体实施方式对本发明进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法；同时，对于本领域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。The embodiments of the present invention have been described in detail above, and the present invention has been described by using specific embodiments herein. The description of the above embodiments is only used to help understand the method of the present invention; meanwhile, for those of ordinary skill in the art, according to this The idea of the invention will have changes in the specific implementation and scope of application. To sum up, the contents of this specification should not be construed as limiting the present invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810373214.1ACN108809264A (en) | 2018-04-24 | 2018-04-24 | S frequency-band solid-state power amplifiers |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810373214.1ACN108809264A (en) | 2018-04-24 | 2018-04-24 | S frequency-band solid-state power amplifiers |
| Publication Number | Publication Date |
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| CN108809264Atrue CN108809264A (en) | 2018-11-13 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810373214.1APendingCN108809264A (en) | 2018-04-24 | 2018-04-24 | S frequency-band solid-state power amplifiers |
| Country | Link |
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| CN (1) | CN108809264A (en) |
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